CN203760471U - Component of LED - Google Patents
Component of LED Download PDFInfo
- Publication number
- CN203760471U CN203760471U CN201420154241.7U CN201420154241U CN203760471U CN 203760471 U CN203760471 U CN 203760471U CN 201420154241 U CN201420154241 U CN 201420154241U CN 203760471 U CN203760471 U CN 203760471U
- Authority
- CN
- China
- Prior art keywords
- led
- paper tinsel
- chip
- bonding wire
- assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model relates to the technical field of LED encapsulation, LED light lamps and LED backlight sources, discloses a component of an LED and solves the problem that circuit boards of conventional LED lighting lamps and LED backlight sources are without radiating structures and poor in radiating performance and need LED supports. The component comprises LED single bodies and a circuit component, the circuit component comprises a wiring layer and an insulating layer connected with the wiring layer in a bonded manner, each LED single body comprises a bonding metal wire and an LED chip, the wiring layer comprises a control layer containing multiple electroconductive metal foils, and a radiating metal foil, a chip placement position used for placement of the LED chips is arranged on the upper surface of the radiating metal foil, a welding wire position is arranged on the upper surface of each electroconductive metal foil, and two ends of the bonding metal wires are fixedly connected with the welding wire position and the LED chips respectively. By the component, each of an LED lighting lamp and an LED backlight source does not need an LED support, so that cost is lowered. The component is good in radiating performance and stable in performance.
Description
Technical field
The utility model relates to the technical field in LED encapsulation, LED illuminating lamp and LED-backlit source, and LED encapsulation belongs to semiconductor technology.
Background technology
LED is that LED chip encapsulates the light-emitting diode forming, and LED illuminating lamp is to adopt LED by the luminous illuminating lamp of LED.Existing LED illuminating lamp and LED-backlit source, be provided with multiple LED at the upper surface of PCB wiring board, and PCB wiring board does not have radiator structure, and the thermal diffusivity of PCB wiring board is very poor, so existing LED illuminating lamp and LED-backlit source heat-dissipating are poor, and poor quality, poor stability; In the LED production process in existing LED illuminating lamp and LED-backlit source, need LED support, LED support includes straight cutting LED support and paster LED bracket, LED support cost is high, LED support cuts unnecessary part (being cutting technique) after the sealing of die bond bonding wire, LED production cost is high, LED cost is high, and LED illuminating lamp and LED-backlit source cost are high.
Summary of the invention
The wiring board in existing LED illuminating lamp and LED-backlit source does not have the problem of radiator structure and weak heat-dissipating, and there is the problem that needs straight cutting LED support or paster LED bracket in the LED in existing LED illuminating lamp and LED-backlit source, the utility model is in order to solve the problem of above-mentioned existence, the assembly that proposes a kind of LED, the technical solution adopted in the utility model is:
An assembly of LED, includes luminescence component; Described luminescence component includes LED member and horizontally disposed circuit pack; Described circuit pack includes the insulating barrier of wiring layer and insulating material, the upper surface bonding connection of the lower surface of wiring layer and insulating barrier; Described LED member includes multiple LED monomers; Described LED monomer includes bonding wire and 1 above LED chip; Described wiring layer includes the heat radiating metal paper tinsel of key-course and metal material; Described key-course includes many conductive metal foils of metal material; The upper surface of described heat radiating metal paper tinsel is provided with chip and places position; The upper surface of described conductive metal foil is provided with bonding wire position; Described LED chip is fixed on described chip by glue and places on position; Two of bonding wire is fixedly connected with LED chip with described bonding wire position respectively; Described LED chip is electrically connected by bonding wire and described conductive metal foil.
Described LED monomer also includes packaging plastic, described bonding wire and the LED chip of packaging plastic parcel.
Described key-course is positioned at a side of heat radiating metal paper tinsel.
Described luminescence component also includes the side metal forming extending to form from the front end of heat radiating metal paper tinsel downwards; Described luminescence component also includes the substrate paper tinsel that extends back from the lower end of side metal forming and form; The upper surface of described substrate paper tinsel and the lower surface bonding connection of insulating barrier.
Described luminescence component also includes the tin layer in the leading flank of the upper surface of heat radiating metal paper tinsel, side metal forming and the setting of the lower surface of substrate paper tinsel.
Described chip is placed position and bonding wire position is provided with silver coating.
Described multiple LED monomers are connected in series by described conductive metal foil.
Described key-course is positioned at heat radiating metal paper tinsel week inner side.
Described heat radiating metal paper tinsel includes front heat radiation paper tinsel and rear heat radiation paper tinsel, and described key-course is between front heat radiation paper tinsel and rear heat radiation paper tinsel.
The beneficial effects of the utility model are: luminescence component comprises the LED member and the circuit pack that contain LED monomer, circuit pack includes wiring layer and the insulating barrier with wiring layer bonding connection, LED monomer includes bonding wire and 1 above LED chip, wiring layer includes the key-course that contains many conductive metal foils and the heat radiating metal paper tinsel of metal material, the upper surface of heat radiating metal paper tinsel is provided with chip and places position, the upper surface of conductive metal foil is provided with bonding wire position, LED chip is fixed on described chip by glue and places on position, two of bonding wire is fixedly connected with LED chip with bonding wire position respectively, so can not need LED support, significantly reduce LED packaging cost, significantly reduce LED cost, significantly reduce LED illuminating lamp and LED-backlit source cost, described LED chip is fixed on described chip by glue and places on position, LED chip is by heat radiating metal paper tinsel, side metal forming and the heat radiation of substrate paper tinsel of metal material, between LED monomer, there is certain spacing simultaneously, LED monomer can be too unconcentrated, the heat that heat radiating metal paper tinsel unit are need to be conducted is less, so LED illuminating lamp and LED-backlit source heat-dissipating performance are good, quality better, stable performance.
Brief description of the drawings
Fig. 1 is that the circuit pack of the utility model embodiment is the plan structure schematic diagram of square luminescence component;
Fig. 2 is the plan structure schematic diagram of the circuit pack of the utility model embodiment luminescence component that is circular arc;
Fig. 3 is that the circuit pack of the utility model embodiment is the plan structure schematic diagram of circular luminescence component;
Fig. 4 is the A-A ' generalized section in Fig. 1 structure.
Embodiment
The present embodiment be the utility model preferred embodiment, other every its principle is identical with the present embodiment or approximate with basic structure, all within the utility model protection range.
Shown in Fig. 1, Fig. 2, Fig. 3 and Fig. 4, the assembly of a kind of LED, includes luminescence component; Described luminescence component includes LED member and horizontally disposed circuit pack; Described circuit pack includes the insulating barrier 2 of wiring layer and insulating material, the upper surface bonding connection of the lower surface of wiring layer and insulating barrier 2; Described LED member includes multiple LED monomers; Described LED monomer includes bonding wire 6,4 and 1 LED chip 5 of packaging plastic; Described wiring layer includes the heat radiating metal paper tinsel 11 of key-course 1 and metal material; Described key-course 1 includes many conductive metal foils 8 of metal material; The upper surface of described heat radiating metal paper tinsel 11 is provided with chip and places position; The upper surface of described conductive metal foil 8 is provided with bonding wire position; Described LED chip 5 is fixed on described chip by glue and places position above, i.e. die bond; ; Two of bonding wire 6 is fixedly connected with LED chip 5 with described bonding wire position respectively, i.e. bonding wire; Described LED chip 5 is electrically connected by bonding wire 6 and described conductive metal foil 8.LED chip 5 by die bond and bonding wire after, then put after glue and form LED monomer through baking, the glue of putting can contain fluorescent material, the glue of putting is packaging plastic 4 after baking, described bonding wire 6 and the LED chip 5 of packaging plastic 4 parcel.Circuit pack is obtained by main line plate technique, and packaging plastic 4 can be formed by mould top machine injecting glue.Multiple LED monomers can more than 1 row arrange or 1 circular arc is arranged above, or above arrangement of multiple LED monomer 1 circle.
In Fig. 1, include front heat radiation paper tinsel and rear heat radiation paper tinsel with heat radiating metal paper tinsel 11 described in Fig. 2, described key-course 1 is between front heat radiation paper tinsel and rear heat radiation paper tinsel.
Key-course 1 described in Fig. 3 is positioned at 11 weeks inner sides of heat radiating metal paper tinsel.
Described luminescence component also includes the side metal forming extending to form from the front end of heat radiating metal paper tinsel 11 downwards; Described luminescence component also includes the substrate paper tinsel 12 that extends back from the lower end of side metal forming and form; The upper surface of described substrate paper tinsel 12 and the lower surface bonding connection of insulating barrier 2.Described heat radiating metal paper tinsel 11 is connected with side metal forming one; Described side metal forming is connected with substrate paper tinsel 12 one.
Described luminescence component also includes the tin layer in the leading flank of the upper surface of heat radiating metal paper tinsel 11, side metal forming and the setting of the lower surface of substrate paper tinsel 12.
Described chip is placed position and bonding wire position is provided with silver coating.
Described multiple LED monomers are connected in series by described conductive metal foil 8.
The monomer series-connected formation of multiple LED LED section.When circuit pack is while being square, circuit pack lengthens at left and right directions, and is provided with multiple LED sections, can be used for fluorescent lamp; In the time that circuit pack is circle, can be used for bulb lamp; In the time that circuit pack is circular arc, can be used for inhaling lamp lamp.
Be installed on circuit pack for the ease of being positioned at the electronic component of circuit pack below by (this electronic component power supply is provided for LED monomer), on described circuit pack, offer via hole, electronic component pin 9 is positioned at the via hole place of circuit pack, and electronic component pin 9 is fixedly connected with the upper surface of circuit pack by scolding tin.
Described luminescence component can also include shell, and shell is connected by glue bond with described circuit pack, or the through hole 10 of offering through circuit pack surrounding with screw makes circuit pack be fixedly connected with shell
Because described luminescence component comprises the LED member and the circuit pack that contain LED monomer, circuit pack includes wiring layer and the insulating barrier 2 with wiring layer bonding connection, LED monomer includes 6 and 1 above LED chip 5 of bonding wire, wiring layer includes the key-course 1 that contains many conductive metal foils 8 and the heat radiating metal paper tinsel 11 of metal material, the upper surface of heat radiating metal paper tinsel 11 is provided with chip and places position, the upper surface of conductive metal foil 8 is provided with bonding wire position, LED chip 5 is fixed on described chip by glue and places on position, two of bonding wire 6 is fixedly connected with LED chip 5 with bonding wire position respectively, so can not need LED support, significantly reduce LED packaging cost, significantly reduce LED cost, significantly reduce LED illuminating lamp and LED-backlit source cost, described LED chip 5 is fixed on described chip by glue and places on position, LED chip 5 dispels the heat by heat radiating metal paper tinsel 11, side metal forming and the substrate paper tinsel 12 of metal material, between LED monomer, there is certain spacing simultaneously, LED monomer can be too unconcentrated, the heat that heat radiating metal paper tinsel 11 unit ares need to be conducted is less, so LED illuminating lamp and LED-backlit source heat-dissipating performance are good, quality better, stable performance.
Claims (9)
1. an assembly of LED, includes luminescence component; It is characterized in that: described luminescence component includes LED member and horizontally disposed circuit pack; Described circuit pack includes the insulating barrier of wiring layer and insulating material, the upper surface bonding connection of the lower surface of wiring layer and insulating barrier; Described LED member includes multiple LED monomers; Described LED monomer includes bonding wire and 1 above LED chip; Described wiring layer includes the heat radiating metal paper tinsel of key-course and metal material; Described key-course includes many conductive metal foils of metal material; The upper surface of described heat radiating metal paper tinsel is provided with chip and places position; The upper surface of described conductive metal foil is provided with bonding wire position; Described LED chip is fixed on described chip by glue and places on position; Two of described bonding wire is fixedly connected with LED chip with described bonding wire position respectively; Described LED chip is electrically connected by bonding wire and described conductive metal foil.
2. the assembly of a kind of LED according to claim 1, is characterized in that: described LED monomer also includes packaging plastic, described bonding wire and the LED chip of packaging plastic parcel.
3. the assembly of a kind of LED according to claim 1, is characterized in that: described key-course is positioned at a side of heat radiating metal paper tinsel.
4. the assembly of a kind of LED according to claim 1, is characterized in that: described luminescence component also includes the side metal forming extending to form from the front end of heat radiating metal paper tinsel downwards; Described luminescence component also includes the substrate paper tinsel that extends back from the lower end of side metal forming and form; The upper surface of described substrate paper tinsel and the lower surface bonding connection of insulating barrier.
5. the assembly of a kind of LED according to claim 4, is characterized in that: described luminescence component also includes the tin layer in the leading flank of the upper surface of heat radiating metal paper tinsel, side metal forming and the setting of the lower surface of substrate paper tinsel.
6. the assembly of a kind of LED according to claim 1, is characterized in that: described chip is placed position and bonding wire position is provided with silver coating.
7. the assembly of a kind of LED according to claim 1, is characterized in that: described multiple LED monomers are connected in series by described conductive metal foil.
8. the assembly of a kind of LED according to claim 1, is characterized in that: described key-course is positioned at heat radiating metal paper tinsel week inner side.
9. the assembly of a kind of LED according to claim 1, is characterized in that: described heat radiating metal paper tinsel includes front heat radiation paper tinsel and rear heat radiation paper tinsel, and described key-course is between front heat radiation paper tinsel and rear heat radiation paper tinsel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420154241.7U CN203760471U (en) | 2014-04-01 | 2014-04-01 | Component of LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420154241.7U CN203760471U (en) | 2014-04-01 | 2014-04-01 | Component of LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203760471U true CN203760471U (en) | 2014-08-06 |
Family
ID=51255714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420154241.7U Expired - Fee Related CN203760471U (en) | 2014-04-01 | 2014-04-01 | Component of LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203760471U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109301049A (en) * | 2017-07-25 | 2019-02-01 | 厦门福相传媒有限公司 | The edge sealing structure of fluorescent glass |
-
2014
- 2014-04-01 CN CN201420154241.7U patent/CN203760471U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109301049A (en) * | 2017-07-25 | 2019-02-01 | 厦门福相传媒有限公司 | The edge sealing structure of fluorescent glass |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201149869Y (en) | LED encapsulation structure | |
| CN203553611U (en) | Surface mount packaging of laser diode | |
| CN103474551A (en) | High-power light-emitting diode (LED) substrate and packaging method thereof | |
| CN203760471U (en) | Component of LED | |
| CN103822143A (en) | LED (light emitting diode) street lamp light source module with silicon substrates | |
| CN201601146U (en) | Light-emitting diode (LED) | |
| CN104051603A (en) | Manufacturing technology of LED lamp strip capable of emitting light from two sides | |
| CN204130528U (en) | A kind of lead frame posture high-power LED light source module | |
| CN105757467A (en) | LED light-emitting lamp bar as well as LED filament bulb lamp and LED lamp tube using same | |
| CN202855802U (en) | Heat radiating structure of COB type LED packaging unit | |
| CN202674951U (en) | Efficient heat-radiating light-emitting diode (LED) fluorescent tube | |
| CN105047787A (en) | Packaging support for LED lamp | |
| CN104235663B (en) | A kind of production technology of flexible LED lamp bar | |
| CN203760469U (en) | LED component | |
| CN102082220A (en) | LED and manufacturing process thereof | |
| CN202678310U (en) | A large-power LED integrated array lighting source based on COB technology | |
| CN206419687U (en) | A kind of Novel LED light | |
| CN201096282Y (en) | Large power LED illumination module group | |
| CN205335256U (en) | Integrate LED packaging structure | |
| CN105845804A (en) | Light emitting diode device and light emitting device using same | |
| CN203760514U (en) | LED illuminating lamp | |
| CN204834676U (en) | LED light source module based on mirror aluminum substrate | |
| CN202423286U (en) | Integrated LED point light source | |
| CN102997074A (en) | Three-dimensional heat-dissipating light-emitting diode (LED) lighting device | |
| CN203774325U (en) | LED lamp assembly |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140806 Termination date: 20170401 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |