CN105047787A - Packaging support for LED lamp - Google Patents
Packaging support for LED lamp Download PDFInfo
- Publication number
- CN105047787A CN105047787A CN201510320870.1A CN201510320870A CN105047787A CN 105047787 A CN105047787 A CN 105047787A CN 201510320870 A CN201510320870 A CN 201510320870A CN 105047787 A CN105047787 A CN 105047787A
- Authority
- CN
- China
- Prior art keywords
- wire
- led
- led lamp
- package support
- led package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 239000000463 material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000004411 aluminium Substances 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 238000003466 welding Methods 0.000 abstract description 2
- 238000001816 cooling Methods 0.000 abstract 1
- 230000004888 barrier function Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 4
- 239000003292 glue Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 239000013078 crystal Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910052684 Cerium Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 241001025261 Neoraja caerulea Species 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000005030 aluminium foil Substances 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- GWXLDORMOJMVQZ-UHFFFAOYSA-N cerium Chemical compound [Ce] GWXLDORMOJMVQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005215 recombination Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000010257 thawing Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V19/00—Fastening of light sources or lamp holders
- F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
- F21V19/0015—Fastening arrangements intended to retain light sources
- F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The present invention puts forward a packaging support for an LED lamp, comprising a plurality of substrate strips arranged in parallel; wherein each substrate strip comprises a first wire, a second wire and a hot wire which are arranged in parallel, light-emitting regions and heat-dissipating regions are arranged at intervals in the longitudinal direction of the substrate strip, the first wire is in the shape formed by two symmetrical inverse L shapes within the light-emitting region, the hot wire has an arc shape projecting downwards within the heat-dissipating region; the light-emitting regions are provided with LED lamp holders, the upper parts of the LED lamp holders are provided with LED lamp cups, the first wire, the second wire and the hot wire pass through the LED lamp holders and are arranged at the bottoms of the LED lamp cups. According to the packaging support of the present invention, the LED lamp holders are directly connected without insulated wires, in addition, the hot wire is added, and the arc shape projecting downwards of the hot wire within the heat-dissipating region can be connected to a cooling fin in the manner of welding and so on, so that the heat-dissipating performance of each substrate strip of the packaging support can be better.
Description
Technical field
The present invention relates to a kind of mounting bracket of LED, especially relate to a kind of LED package support.
Background technology
LED (LightEmittingDiode), light-emitting diode, be a kind of solid-state semiconductor device, it directly can be converted into light electricity.The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a support, and one end is negative pole, and the other end connects the positive pole of power supply, makes whole wafer by epoxy encapsulation.Semiconductor wafer is made up of two parts, and a part is P type semiconductor, and inside it, occupy an leading position in hole, and the other end is N type semiconductor, at this side mainly electronics.But time these two kinds of semiconductors couple together, between them, just form one " P-N junction ".When electric current acts on this wafer by wire time, electronics will be pushed to P district, and in P district, electronics is with hole-recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is.And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.
Practical and the commercialization of high performance lED, makes lighting technology face a new revolution.The pixel lamp be made up of red, blue, the green three-color LED of multiple super brightness not only can send the continuously adjustable various coloured light of wavelength, but also the white light that brightness can reach tens to one hundred candle light can be sent become lighting source, for incandescent lamp and the LED solid lighting lamp of identical luminosity, the power consumption of the latter only accounts for the former 10%-20%.
The white light LEDs major part of current production is made by covering the faint yellow fluorescent coating of one deck on blue-ray LED, and this yellow phosphor is normally made by being blended in a kind of dense adhesive after the yag crystal mixing cerium is clayed into power.When LED chip sends blue light, some blue light just can be converted to the wider light being mainly yellow of a spectrum by this crystal very efficiently, because gold-tinted can stimulate ruddiness in naked eyes and green glow acceptor, then mix the blue light of LED itself, make it seem just as white light.
Existing LED is generally be directly installed on mounting panel, mounting panel is generally laminated structure, comprise three layers: the line layer being used for connecting up under the heat dissipating layer being used for dispelling the heat, the insulating barrier being used under heat dissipating layer insulating, insulating barrier, wherein heat dissipating layer is generally aluminium foil or aluminum alloy sheet; Line layer is generally Copper Foil and makes, and is used for doing configuration.LED is arranged on heat dissipating layer, welds with line layer.The mounting panel heat dispersion of the LED of this type depends on the thermal conductance index of insulating barrier to a great extent, and the thermal conductance index of insulating barrier is often not high, causes the heat dispersion of whole LED installation strip not good.
Optimal situation is exactly that whole LED mounting panel only has one deck, and that is exactly heat dissipating layer, and LED is welded direct on LED mounting panel, could dispel the heat better like this.Owing to eliminating insulating barrier and line layer, the energising of LED can only be connected by electric wire.If but electric wire distribution on a mounting board, because LED can produce a large amount of heat in luminescence process, the insulating barrier of electric wire appearance will be heated thawing, thus causes open circuit, even can lead to a disaster.
Summary of the invention
In order to overcome the deficiencies in the prior art, the present invention proposes a kind of LED package support and comprises:
The many substrate bands be arranged in parallel;
Every bar substrate band comprises the first wire, the second wire and thermal wire, wherein said first wire, the second wire and thermal wire be arranged in parallel, substrate band longitudinal direction compartment of terrain is provided with luminous zone and radiating area, in luminous zone, the first wire is symmetrically arranged inverted "L" shaped, and the thermal wire of radiating area has the arc protruded downwards;
Described luminous zone is provided with LED seat, and LED seat top is provided with LED lamp cup, and described first wire, the second wire and thermal conductive wire through described LED seat, and are positioned at the bottom of described Lamp cup.
Further, be circular, and upwards arc-shaped expands gradually bottom described Lamp cup, its top opening is circular, and edge of opening has projection upwards.
Further, described thermal wire has through hole in the part of luminous zone.
Further, described thermal wire is in the part of radiating area, and its arc protruded is the trapezoidal of protrusion.
Further, described thermal wire is in the part of radiating area, and described protrusion arc comprises recessed slope and recessed base plate.
Further, described its material of LED package support is copper or aluminium.
LED package support of the present invention, has many substrate bands, and substrate band is used for mounted LED lamp, does not re-use insulated conductor and connects, but directly connect between each LED; Add thermal wire, the arc to lower convexity of thermal wire in its radiating area can be connected by soldering or the like on fin, makes the heat dispersion of substrate band better; Lamp cup on LED seat directly can inject fluorescent material and mould top glue mixture forms LED lens, and substrate band forms LED string with LED seat together with LED lens.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiments of the invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only one embodiment of the present of invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is LED package support of the present invention specific embodiment structural representation;
Fig. 2 is the hardware bracket structural representation of LED package support of the present invention;
Fig. 3 is the hardware bracket partial enlarged drawing of a LED package support of the present invention specific embodiment;
Fig. 4 is LED seat enlarged drawing in Fig. 1;
In figure: 1-first wire; 2-second wire; 3-thermal conductive wire; 4-luminous zone; 5-radiating area; The recessed slope of 6-; The recessed base plate of 7-; 8-LED lamp socket; 9-Lamp cup.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.Wherein, accompanying drawing only for exemplary illustration, expression be only schematic diagram, but not pictorial diagram, can not be interpreted as the restriction to this patent; In order to better embodiments of the invention are described, some parts of accompanying drawing have omission, zoom in or out, and do not represent the size of actual product; For a person skilled in the art, in accompanying drawing, some known features and explanation thereof may be omitted is understandable.
Refer to Fig. 1,2 and Fig. 4, a kind of LED package support of the present invention comprises the many substrate bands be arranged in parallel; Every bar substrate band comprises the first wire 1, second wire 2 and thermal wire 3, wherein said first wire 1, second wire 2 and thermal wire 3 be arranged in parallel, substrate band longitudinal direction compartment of terrain is provided with luminous zone 4 and radiating area 5, in luminous zone 4, the first wire 1 is symmetrically arranged inverted "L" shaped, and the thermal wire 3 in radiating area 5 has the arc protruded downwards; Described luminous 4th district are provided with LED seat 8, and LED seat 8 top is provided with LED lamp cup 9, and described first wire 1, second wire 2 and thermal conductive wire 3 through described LED seat 8, and are positioned at the bottom of described Lamp cup 9.
Described Lamp cup 9 is for injecting fluorescent material and mould top glue mixture is shaped to LED lens.
A kind of LED package support of the present invention difference according to actual needs, the package support be at every turn processed into can comprise many substrate bands, and the length of substrate band can adjust as required.
The present invention is injection molded on the basis of hardware bracket, and the structure of hardware bracket as shown in Figure 2.
In one embodiment of the invention, described thermal wire 3 has through hole in the part of luminous zone 4.Luminous zone 4 will be provided with LED lamp bead, and the through hole of thermal wire 3 can make heat be delivered to radiating area better to go.
In another embodiment of the present invention, the part of described thermal wire 3 in radiating area 5, its arc protruded is the trapezoidal of protrusion.Trapezoidal for welding or bonding to other heat carrier or conducting strip, make its heat dispersion stronger, preferably, can be welded direct in metal installation strip.
Refer to Fig. 3, in a specific embodiment of the present invention, the part of thermal wire 3 in radiating area 5 of hardware bracket, described protrusion arc comprises recessed slope and recessed base plate.Recessed slope makes projection extend obliquely, and recessed base plate, then for being welded to or bonding to other heat carrier or conducting strip, makes its heat dispersion stronger, preferably, can be welded direct in metal installation strip.
Be copper or aluminium in its material of LED package support of the present invention.The good heat conductivity of copper or aluminium, and low price.
In the present invention's preferred embodiment, the first wire 1 is disconnect in the part of the LED base of luminous zone, and breaking part is spaced when injection molding.Apply in the LED string that substrate band of the present invention makes, by connection or the disconnection of the first wire below some lamp pearl, parallel connection or the series connection of LED on whole lamp string can be realized.Bottom adjustment Lamp cup 9 and the size of opening and the shape at opening part edge thereof, the fluorescent material that injects and the shaping LED lens of mould top glue mixture can be made under capillary effect to become hemisphere.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (6)
1. a LED package support, is characterized in that, comprising:
The many substrate bands be arranged in parallel;
Every bar substrate band comprises the first wire, the second wire and thermal wire, wherein said first wire, the second wire and thermal wire be arranged in parallel, substrate band longitudinal direction compartment of terrain is provided with luminous zone and radiating area, in luminous zone, the first wire is symmetrically arranged inverted "L" shaped, and the thermal wire of radiating area has the arc protruded downwards;
Described luminous zone is provided with LED seat, and LED seat top is provided with LED lamp cup, and described first wire, the second wire and thermal conductive wire through described LED seat, and are positioned at the bottom of described Lamp cup.
2. LED package support according to claim 1, is characterized in that, be circular, and upwards arc-shaped expands gradually bottom described Lamp cup, and its top opening is circular, and edge of opening has projection upwards.
3. LED package support according to claim 1, is characterized in that, described thermal wire has through hole in the part of luminous zone.
4. LED package support according to claim 1, is characterized in that, described thermal wire is in the part of radiating area, and its arc protruded is the trapezoidal of protrusion.
5. LED package support according to claim 1, is characterized in that, described thermal wire is in the part of radiating area, and it protrudes arc and comprises recessed slope and recessed base plate.
6. LED package support according to claim 1, is characterized in that, described its material of LED package support is copper or aluminium.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510320870.1A CN105047787A (en) | 2015-06-11 | 2015-06-11 | Packaging support for LED lamp |
| PCT/CN2016/085369 WO2016197961A1 (en) | 2015-06-11 | 2016-06-08 | Led light packaging frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510320870.1A CN105047787A (en) | 2015-06-11 | 2015-06-11 | Packaging support for LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105047787A true CN105047787A (en) | 2015-11-11 |
Family
ID=54454170
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510320870.1A Pending CN105047787A (en) | 2015-06-11 | 2015-06-11 | Packaging support for LED lamp |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN105047787A (en) |
| WO (1) | WO2016197961A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016197957A1 (en) * | 2015-06-11 | 2016-12-15 | 吴少健 | Led light metal frame |
| WO2016197961A1 (en) * | 2015-06-11 | 2016-12-15 | 吴少健 | Led light packaging frame |
| CN107830430A (en) * | 2017-11-21 | 2018-03-23 | 浙江阳光美加照明有限公司 | The substrate and LED light bar of a kind of LED light bar |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201594551U (en) * | 2009-11-05 | 2010-09-29 | 深圳市瑞丰光电子股份有限公司 | LED packaging unit and luminous device |
| CN102200235A (en) * | 2010-03-26 | 2011-09-28 | 上海东熠光电有限公司 | Light-emitting diode (LED) light-emitting bar |
| CN104332451A (en) * | 2014-11-24 | 2015-02-04 | 深圳市富美达五金有限公司 | Optocoupler packaging support |
| CN204760382U (en) * | 2015-06-11 | 2015-11-11 | 吴少健 | LED lamp encapsulation support |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100628987B1 (en) * | 2005-07-28 | 2006-09-27 | 금산전자 주식회사 | Package structure of light emitting diode and method of manufacturing thereof |
| DE102010045596A1 (en) * | 2010-09-16 | 2012-03-22 | Osram Opto Semiconductors Gmbh | Surface-mountable optoelectronic semiconductor component and lead frame composite |
| CN102364713A (en) * | 2011-11-08 | 2012-02-29 | 吕能兵 | Light emitting diode (LED) bracket and crystallizing method |
| CN203812910U (en) * | 2014-03-28 | 2014-09-03 | 木林森股份有限公司 | High-utilization-rate and high-luminous-efficiency LED array support |
| CN103994359B (en) * | 2014-06-10 | 2016-04-27 | 吴锦星 | A kind of processing method of Modular LED lamp bar |
| CN205014297U (en) * | 2015-06-11 | 2016-02-03 | 吴少健 | LED lamp five metals support |
| CN104930476A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | Metallic LED (light emitting diode) lamp support |
| CN105047787A (en) * | 2015-06-11 | 2015-11-11 | 吴少健 | Packaging support for LED lamp |
-
2015
- 2015-06-11 CN CN201510320870.1A patent/CN105047787A/en active Pending
-
2016
- 2016-06-08 WO PCT/CN2016/085369 patent/WO2016197961A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201594551U (en) * | 2009-11-05 | 2010-09-29 | 深圳市瑞丰光电子股份有限公司 | LED packaging unit and luminous device |
| CN102200235A (en) * | 2010-03-26 | 2011-09-28 | 上海东熠光电有限公司 | Light-emitting diode (LED) light-emitting bar |
| CN104332451A (en) * | 2014-11-24 | 2015-02-04 | 深圳市富美达五金有限公司 | Optocoupler packaging support |
| CN204760382U (en) * | 2015-06-11 | 2015-11-11 | 吴少健 | LED lamp encapsulation support |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2016197957A1 (en) * | 2015-06-11 | 2016-12-15 | 吴少健 | Led light metal frame |
| WO2016197961A1 (en) * | 2015-06-11 | 2016-12-15 | 吴少健 | Led light packaging frame |
| CN107830430A (en) * | 2017-11-21 | 2018-03-23 | 浙江阳光美加照明有限公司 | The substrate and LED light bar of a kind of LED light bar |
| CN107830430B (en) * | 2017-11-21 | 2023-10-03 | 浙江阳光美加照明有限公司 | Substrate of LED lamp strip and LED lamp strip |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2016197961A1 (en) | 2016-12-15 |
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| Date | Code | Title | Description |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20161014 Address after: 311300, Zhejiang Province, Hangzhou City, Ling'an Qingshan Lake Street Chuen mouth village Applicant after: Linan New Sanlian Lighting Electric Co., Ltd. Address before: 528421, No. thirteen, Lane 5, dragon First Street, Cao two town, Guzhen Town, Guangdong, Zhongshan Applicant before: Wu Shaojian |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151111 |
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| WD01 | Invention patent application deemed withdrawn after publication |