CN105047787A - Packaging support for LED lamp - Google Patents

Abstract

The present invention proposes an LED lamp packaging bracket, which includes a plurality of substrate strips arranged in parallel; each substrate strip includes a first wire, a second wire and a heating wire, wherein the first wire, the second wire and the heating wire are arranged in parallel , the substrate strip is provided with a light-emitting area and a heat-dissipating area at intervals in the longitudinal direction. In the light-emitting area, the first conductive wire is symmetrically arranged in an inverted "L" shape, and the thermal wire in the heat-dissipating area has a downwardly protruding arc; the light-emitting area An LED lamp holder is provided, and an LED lamp cup is arranged on the upper part of the LED lamp holder. The first wire, the second wire and the heat conduction wire pass through the LED lamp holder and are located at the bottom of the lamp cup. The LED lamp holders of the present invention are no longer connected by insulated wires, but are directly connected; a thermal wire is added, and the downwardly protruding arc of the thermal wire in its heat dissipation area can be connected to the heat sink by welding or other means, so that The thermal performance of each substrate strip of the package holder is better.

Description

An LED lamp packaging bracket

technical field

The invention relates to a mounting bracket for an LED lamp, in particular to a packaging bracket for an LED lamp.

Background technique

LED (Light Emitting Diode), light emitting diode, is a solid-state semiconductor device that can directly convert electricity into light. The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a bracket, and one end is negative pole, and the other end connects the positive pole of power supply, and whole wafer is encapsulated by epoxy resin. Semiconductor wafer is made up of two parts, and a part is P-type semiconductor, and hole occupies an leading position in it, and the other end is N-type semiconductor, and here mainly is electron. But time these two kinds of semiconductors couple together, between them, just form a "P-N junction". When electric current acts on this chip by wire time, electron will be pushed to P district, and in P district, electron is with hole recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is. And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.

The practicality and commercialization of high-performance LEDs have brought about a new revolution in lighting technology. The pixel light composed of multiple ultra-high-brightness red, blue, and green LEDs can not only emit various colors of light with continuously adjustable wavelengths, but also emit white light with a brightness of tens to one hundred candlepower as a lighting source. For incandescent lamps and LED solid-state lighting lamps with the same luminance, the power consumption of the latter only accounts for 10%-20% of the former.

Most of the white LEDs currently produced are made by coating blue LEDs with a yellowish phosphor coating, which is usually made by grinding cerium-doped yttrium aluminum garnet crystals into powder and mixing them in made from a dense adhesive. When the LED chip emits blue light, part of the blue light will be efficiently converted into a broad-spectrum mainly yellow light by the crystal, because the yellow light will stimulate the red and green light receptors in the naked eye, and then mix the blue light of the LED itself , making it look like white light.

Existing LED lamps are generally installed directly on the mounting board, and the mounting board is generally a sheet structure, including three layers: a heat dissipation layer for heat dissipation, an insulating layer for insulation under the heat dissipation layer, and an insulating layer under the insulating layer. The circuit layer for wiring, in which the heat dissipation layer is generally aluminum foil or aluminum alloy sheet; the circuit layer is generally made of copper foil for circuit layout. The LED lamp is installed on the heat dissipation layer and welded with the circuit layer. The heat dissipation performance of this type of LED mounting board largely depends on the thermal conductivity index of the insulating layer, and the thermal conductivity index of the insulating layer is often not high, resulting in poor heat dissipation performance of the entire LED lamp mounting board strip.

The most ideal situation is that the entire LED lamp mounting board has only one layer, that is, the heat dissipation layer, and the LED strip is directly welded to the LED lamp mounting board, so as to better dissipate heat. Due to the cancellation of the insulating layer and the wiring layer, the power supply of the LED light strip can only be connected by wires. However, if the wires are distributed on the mounting board, because the LED lights will generate a lot of heat during the light-emitting process, the insulation layer on the surface of the wires will be heated and melted, resulting in an open circuit or even an accident.

Contents of the invention

In order to overcome the deficiencies of the prior art, the present invention proposes an LED lamp packaging bracket comprising:

a plurality of substrate strips arranged in parallel;

Each substrate strip includes a first wire, a second wire and a thermal wire, wherein the first wire, the second wire and the thermal wire are arranged in parallel, and the substrate strip is provided with a light-emitting area and a heat dissipation area at intervals in the longitudinal direction, and in the light-emitting area The first wire is symmetrically arranged in an inverted "L" shape, and the heat wire in the heat dissipation area has a downwardly protruding arc;

The light-emitting area is provided with an LED lamp holder, and an LED lamp cup is arranged on the upper part of the LED lamp holder. The first wire, the second wire and the heat conduction wire pass through the LED lamp holder and are located at the bottom of the lamp cup.

Further, the bottom of the lamp cup is circular, and gradually expands upward in an arc shape, the uppermost opening of the lamp cup is circular, and the edge of the opening has an upward protrusion.

Further, the part of the thermal wire in the light emitting area has a through hole.

Further, the protruding arc of the part of the thermal wire in the heat dissipation area is a protruding trapezoid.

Further, in the part of the thermal wire in the heat dissipation area, the convex arc shape includes a concave slope and a concave bottom plate.

Further, the material of the package bracket of the LED lamp is copper or aluminum.

The LED lamp packaging bracket described in the present invention has a plurality of substrate strips, and the substrate strips are used to install LED lamps. The LED lamps are no longer connected by insulated wires, but are directly connected; heat wires are added, and the heat wires are connected between them. The downward convex arc of the heat dissipation area can be connected to the heat sink by welding, etc., so that the heat dissipation performance of the substrate strip is better; the lamp cup on the LED lamp holder can be directly injected into the mixture of phosphor powder and mold top glue to form an LED lens. The substrate strip forms the LED light string together with the LED lamp socket and the LED lens.

Description of drawings

In order to illustrate the embodiments of the present invention more clearly, the accompanying drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings in the following description are only an embodiment of the present invention. Ordinary technicians can also obtain other drawings based on these drawings without paying creative labor.

Fig. 1 is a structural schematic diagram of a specific embodiment of the LED lamp packaging bracket of the present invention;

Fig. 2 is a schematic structural view of the metal bracket of the LED lamp packaging bracket of the present invention;

Fig. 3 is a partial enlarged view of the hardware bracket of a specific embodiment of the LED lamp packaging bracket of the present invention;

Fig. 4 is an enlarged view of the LED lamp holder in Fig. 1;

In the figure: 1-first wire; 2-second wire; 3-heat conduction wire; 4-luminous area; 5-heat dissipation area; 6-recessed slope; 7-recessed bottom plate; light Cup.

Detailed ways

The present invention will be further described below in combination with specific embodiments. Wherein, the accompanying drawings are only for illustrative purposes, showing only schematic diagrams, rather than physical drawings, and should not be construed as limitations on this patent; in order to better illustrate the embodiments of the present invention, some parts of the accompanying drawings will be omitted, Enlargement or reduction does not represent the size of the actual product; for those skilled in the art, it is understandable that certain known structures and their descriptions in the drawings may be omitted.

Please refer to Fig. 1, 2 and Fig. 4, an LED lamp packaging bracket of the present invention includes a plurality of substrate strips arranged in parallel; each substrate strip includes a first wire 1, a second wire 2 and a thermal wire 3, wherein the first A conductive wire 1, a second conductive wire 2, and a thermal wire 3 are arranged in parallel, and the substrate strip is provided with a light-emitting area 4 and a heat-dissipating area 5 at intervals in the longitudinal direction. In the light-emitting area 4, the first conductive wire 1 is symmetrically arranged in an inverted "L" shape, The thermal wire 3 in the heat dissipation area 5 has a downward protruding arc; the LED lamp holder 8 is provided in the luminous area 4, and the LED lamp cup 9 is provided on the upper part of the LED lamp holder 8. The first wire 1, the second wire The wire 2 and the heat conducting wire 3 pass through the LED lamp holder 8 and are located at the bottom of the lamp cup 9 .

The lamp cup 9 is used to inject the mixture of fluorescent powder and mold top glue to form an LED lens.

According to the different actual needs of the LED lamp package bracket of the present invention, the package bracket processed each time can include a plurality of substrate strips, and the length of the substrate strips can be adjusted according to needs.

The present invention is formed by injection molding on the basis of the hardware bracket, and the structure of the hardware bracket is shown in FIG. 2 .

In one embodiment of the present invention, the thermal wire 3 has a through hole in the light emitting region 4 . The light-emitting area 4 will be provided with LED lamp beads, and the through-holes of the thermal wire 3 can make the heat transfer to the heat-dissipating area better.

In another embodiment of the present invention, the part of the thermal wire 3 in the heat dissipation area 5 has a protruding arc shape of a protruding trapezoid. The trapezoid is used for welding or bonding to other heat conductors or heat conducting sheets, so that its heat dissipation performance is stronger. Preferably, it can be directly welded to a metal mounting strip.

Please refer to FIG. 3 , in a specific embodiment of the present invention, where the thermal wire 3 of the hardware bracket is in the heat dissipation area 5 , the convex arc shape includes a concave slope and a concave bottom plate. The concave slope allows the protruding part to extend obliquely downward, and the concave bottom plate is used for welding or bonding to other heat conductors or heat conducting sheets, so that its heat dissipation performance is stronger. Preferably, it can be directly welded to metal Attach the mounting plate.

In the present invention, the LED lamp packaging bracket is made of copper or aluminum. Copper or aluminum conduct heat well and are inexpensive.

In a preferred embodiment of the present invention, the first wire 1 is disconnected at the part of the LED base in the light-emitting area, and the disconnected part is separated during injection molding. In the LED lamp string made by using the substrate strip of the present invention, by connecting or disconnecting the first wires under some lamp beads, the LED lamps on the entire lamp string can be connected in parallel or in series. Adjusting the size of the bottom and the opening of the lamp cup 9 and the shape of the edge of the opening can make the LED lens formed by the mixture of injected phosphor powder and mold top glue become hemispherical under the action of surface tension.

The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included in the scope of the present invention. within the scope of protection.

Claims (6)

1. An LED lamp packaging bracket, characterized in that, comprising: a plurality of substrate strips arranged in parallel; Each substrate strip includes a first wire, a second wire and a thermal wire, wherein the first wire, the second wire and the thermal wire are arranged in parallel, and the substrate strip is provided with a light-emitting area and a heat dissipation area at intervals in the longitudinal direction, and in the light-emitting area The first wire is symmetrically arranged in an inverted "L" shape, and the heat wire in the heat dissipation area has a downwardly protruding arc; The light-emitting area is provided with an LED lamp holder, and an LED lamp cup is arranged on the upper part of the LED lamp holder. The first wire, the second wire and the heat conduction wire pass through the LED lamp holder and are located at the bottom of the lamp cup. 2. The LED lamp packaging bracket according to claim 1, wherein the bottom of the lamp cup is circular and gradually expands in an arc shape upwards, the opening at the uppermost end is circular, and the edge of the opening has an upward convex rise. 3 . The LED lamp package holder according to claim 1 , wherein the part of the thermal wire in the light-emitting area has a through hole. 4 . 4 . The LED lamp package holder according to claim 1 , wherein the protruding arc of the part of the thermal wire in the heat dissipation area is a protruding trapezoid. 5 . The LED lamp package holder according to claim 1 , wherein the protruding arc shape of the part of the thermal wire in the heat dissipation area includes a concave slope and a concave bottom plate. 6 . 6 . The LED lamp packaging bracket according to claim 1 , wherein the material of the LED lamp packaging bracket is copper or aluminum.