CN105047787A - Packaging support for LED lamp - Google Patents

Packaging support for LED lamp Download PDF

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Publication number
CN105047787A
CN105047787A CN201510320870.1A CN201510320870A CN105047787A CN 105047787 A CN105047787 A CN 105047787A CN 201510320870 A CN201510320870 A CN 201510320870A CN 105047787 A CN105047787 A CN 105047787A
Authority
CN
China
Prior art keywords
wire
led
led lamp
package support
led package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510320870.1A
Other languages
Chinese (zh)
Inventor
吴少健
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Linan New Sanlian Lighting Electric Co., Ltd.
Original Assignee
吴少健
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 吴少健 filed Critical 吴少健
Priority to CN201510320870.1A priority Critical patent/CN105047787A/en
Publication of CN105047787A publication Critical patent/CN105047787A/en
Priority to PCT/CN2016/085369 priority patent/WO2016197961A1/en
Pending legal-status Critical Current

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015Fastening arrangements intended to retain light sources
    • F21V19/002Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/647Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body

Abstract

The present invention puts forward a packaging support for an LED lamp, comprising a plurality of substrate strips arranged in parallel; wherein each substrate strip comprises a first wire, a second wire and a hot wire which are arranged in parallel, light-emitting regions and heat-dissipating regions are arranged at intervals in the longitudinal direction of the substrate strip, the first wire is in the shape formed by two symmetrical inverse L shapes within the light-emitting region, the hot wire has an arc shape projecting downwards within the heat-dissipating region; the light-emitting regions are provided with LED lamp holders, the upper parts of the LED lamp holders are provided with LED lamp cups, the first wire, the second wire and the hot wire pass through the LED lamp holders and are arranged at the bottoms of the LED lamp cups. According to the packaging support of the present invention, the LED lamp holders are directly connected without insulated wires, in addition, the hot wire is added, and the arc shape projecting downwards of the hot wire within the heat-dissipating region can be connected to a cooling fin in the manner of welding and so on, so that the heat-dissipating performance of each substrate strip of the packaging support can be better.

Description

A kind of LED package support
Technical field
The present invention relates to a kind of mounting bracket of LED, especially relate to a kind of LED package support.
Background technology
LED (LightEmittingDiode), light-emitting diode, be a kind of solid-state semiconductor device, it directly can be converted into light electricity.The heart of LED is the wafer of a semiconductor, and one end of wafer is attached on a support, and one end is negative pole, and the other end connects the positive pole of power supply, makes whole wafer by epoxy encapsulation.Semiconductor wafer is made up of two parts, and a part is P type semiconductor, and inside it, occupy an leading position in hole, and the other end is N type semiconductor, at this side mainly electronics.But time these two kinds of semiconductors couple together, between them, just form one " P-N junction ".When electric current acts on this wafer by wire time, electronics will be pushed to P district, and in P district, electronics is with hole-recombination, then will send energy with the form of photon, the principle of LED luminescence that Here it is.And the wavelength of light i.e. the color of light, be determined by the material forming P-N junction.
Practical and the commercialization of high performance lED, makes lighting technology face a new revolution.The pixel lamp be made up of red, blue, the green three-color LED of multiple super brightness not only can send the continuously adjustable various coloured light of wavelength, but also the white light that brightness can reach tens to one hundred candle light can be sent become lighting source, for incandescent lamp and the LED solid lighting lamp of identical luminosity, the power consumption of the latter only accounts for the former 10%-20%.
The white light LEDs major part of current production is made by covering the faint yellow fluorescent coating of one deck on blue-ray LED, and this yellow phosphor is normally made by being blended in a kind of dense adhesive after the yag crystal mixing cerium is clayed into power.When LED chip sends blue light, some blue light just can be converted to the wider light being mainly yellow of a spectrum by this crystal very efficiently, because gold-tinted can stimulate ruddiness in naked eyes and green glow acceptor, then mix the blue light of LED itself, make it seem just as white light.
Existing LED is generally be directly installed on mounting panel, mounting panel is generally laminated structure, comprise three layers: the line layer being used for connecting up under the heat dissipating layer being used for dispelling the heat, the insulating barrier being used under heat dissipating layer insulating, insulating barrier, wherein heat dissipating layer is generally aluminium foil or aluminum alloy sheet; Line layer is generally Copper Foil and makes, and is used for doing configuration.LED is arranged on heat dissipating layer, welds with line layer.The mounting panel heat dispersion of the LED of this type depends on the thermal conductance index of insulating barrier to a great extent, and the thermal conductance index of insulating barrier is often not high, causes the heat dispersion of whole LED installation strip not good.
Optimal situation is exactly that whole LED mounting panel only has one deck, and that is exactly heat dissipating layer, and LED is welded direct on LED mounting panel, could dispel the heat better like this.Owing to eliminating insulating barrier and line layer, the energising of LED can only be connected by electric wire.If but electric wire distribution on a mounting board, because LED can produce a large amount of heat in luminescence process, the insulating barrier of electric wire appearance will be heated thawing, thus causes open circuit, even can lead to a disaster.
Summary of the invention
In order to overcome the deficiencies in the prior art, the present invention proposes a kind of LED package support and comprises:
The many substrate bands be arranged in parallel;
Every bar substrate band comprises the first wire, the second wire and thermal wire, wherein said first wire, the second wire and thermal wire be arranged in parallel, substrate band longitudinal direction compartment of terrain is provided with luminous zone and radiating area, in luminous zone, the first wire is symmetrically arranged inverted "L" shaped, and the thermal wire of radiating area has the arc protruded downwards;
Described luminous zone is provided with LED seat, and LED seat top is provided with LED lamp cup, and described first wire, the second wire and thermal conductive wire through described LED seat, and are positioned at the bottom of described Lamp cup.
Further, be circular, and upwards arc-shaped expands gradually bottom described Lamp cup, its top opening is circular, and edge of opening has projection upwards.
Further, described thermal wire has through hole in the part of luminous zone.
Further, described thermal wire is in the part of radiating area, and its arc protruded is the trapezoidal of protrusion.
Further, described thermal wire is in the part of radiating area, and described protrusion arc comprises recessed slope and recessed base plate.
Further, described its material of LED package support is copper or aluminium.
LED package support of the present invention, has many substrate bands, and substrate band is used for mounted LED lamp, does not re-use insulated conductor and connects, but directly connect between each LED; Add thermal wire, the arc to lower convexity of thermal wire in its radiating area can be connected by soldering or the like on fin, makes the heat dispersion of substrate band better; Lamp cup on LED seat directly can inject fluorescent material and mould top glue mixture forms LED lens, and substrate band forms LED string with LED seat together with LED lens.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiments of the invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only one embodiment of the present of invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is LED package support of the present invention specific embodiment structural representation;
Fig. 2 is the hardware bracket structural representation of LED package support of the present invention;
Fig. 3 is the hardware bracket partial enlarged drawing of a LED package support of the present invention specific embodiment;
Fig. 4 is LED seat enlarged drawing in Fig. 1;
In figure: 1-first wire; 2-second wire; 3-thermal conductive wire; 4-luminous zone; 5-radiating area; The recessed slope of 6-; The recessed base plate of 7-; 8-LED lamp socket; 9-Lamp cup.
Embodiment
Below in conjunction with embodiment, the present invention is further illustrated.Wherein, accompanying drawing only for exemplary illustration, expression be only schematic diagram, but not pictorial diagram, can not be interpreted as the restriction to this patent; In order to better embodiments of the invention are described, some parts of accompanying drawing have omission, zoom in or out, and do not represent the size of actual product; For a person skilled in the art, in accompanying drawing, some known features and explanation thereof may be omitted is understandable.
Refer to Fig. 1,2 and Fig. 4, a kind of LED package support of the present invention comprises the many substrate bands be arranged in parallel; Every bar substrate band comprises the first wire 1, second wire 2 and thermal wire 3, wherein said first wire 1, second wire 2 and thermal wire 3 be arranged in parallel, substrate band longitudinal direction compartment of terrain is provided with luminous zone 4 and radiating area 5, in luminous zone 4, the first wire 1 is symmetrically arranged inverted "L" shaped, and the thermal wire 3 in radiating area 5 has the arc protruded downwards; Described luminous 4th district are provided with LED seat 8, and LED seat 8 top is provided with LED lamp cup 9, and described first wire 1, second wire 2 and thermal conductive wire 3 through described LED seat 8, and are positioned at the bottom of described Lamp cup 9.
Described Lamp cup 9 is for injecting fluorescent material and mould top glue mixture is shaped to LED lens.
A kind of LED package support of the present invention difference according to actual needs, the package support be at every turn processed into can comprise many substrate bands, and the length of substrate band can adjust as required.
The present invention is injection molded on the basis of hardware bracket, and the structure of hardware bracket as shown in Figure 2.
In one embodiment of the invention, described thermal wire 3 has through hole in the part of luminous zone 4.Luminous zone 4 will be provided with LED lamp bead, and the through hole of thermal wire 3 can make heat be delivered to radiating area better to go.
In another embodiment of the present invention, the part of described thermal wire 3 in radiating area 5, its arc protruded is the trapezoidal of protrusion.Trapezoidal for welding or bonding to other heat carrier or conducting strip, make its heat dispersion stronger, preferably, can be welded direct in metal installation strip.
Refer to Fig. 3, in a specific embodiment of the present invention, the part of thermal wire 3 in radiating area 5 of hardware bracket, described protrusion arc comprises recessed slope and recessed base plate.Recessed slope makes projection extend obliquely, and recessed base plate, then for being welded to or bonding to other heat carrier or conducting strip, makes its heat dispersion stronger, preferably, can be welded direct in metal installation strip.
Be copper or aluminium in its material of LED package support of the present invention.The good heat conductivity of copper or aluminium, and low price.
In the present invention's preferred embodiment, the first wire 1 is disconnect in the part of the LED base of luminous zone, and breaking part is spaced when injection molding.Apply in the LED string that substrate band of the present invention makes, by connection or the disconnection of the first wire below some lamp pearl, parallel connection or the series connection of LED on whole lamp string can be realized.Bottom adjustment Lamp cup 9 and the size of opening and the shape at opening part edge thereof, the fluorescent material that injects and the shaping LED lens of mould top glue mixture can be made under capillary effect to become hemisphere.
The foregoing is only preferred embodiment of the present invention, not in order to limit the present invention, within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.

Claims (6)

1. a LED package support, is characterized in that, comprising:
The many substrate bands be arranged in parallel;
Every bar substrate band comprises the first wire, the second wire and thermal wire, wherein said first wire, the second wire and thermal wire be arranged in parallel, substrate band longitudinal direction compartment of terrain is provided with luminous zone and radiating area, in luminous zone, the first wire is symmetrically arranged inverted "L" shaped, and the thermal wire of radiating area has the arc protruded downwards;
Described luminous zone is provided with LED seat, and LED seat top is provided with LED lamp cup, and described first wire, the second wire and thermal conductive wire through described LED seat, and are positioned at the bottom of described Lamp cup.
2. LED package support according to claim 1, is characterized in that, be circular, and upwards arc-shaped expands gradually bottom described Lamp cup, and its top opening is circular, and edge of opening has projection upwards.
3. LED package support according to claim 1, is characterized in that, described thermal wire has through hole in the part of luminous zone.
4. LED package support according to claim 1, is characterized in that, described thermal wire is in the part of radiating area, and its arc protruded is the trapezoidal of protrusion.
5. LED package support according to claim 1, is characterized in that, described thermal wire is in the part of radiating area, and it protrudes arc and comprises recessed slope and recessed base plate.
6. LED package support according to claim 1, is characterized in that, described its material of LED package support is copper or aluminium.
CN201510320870.1A 2015-06-11 2015-06-11 Packaging support for LED lamp Pending CN105047787A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN201510320870.1A CN105047787A (en) 2015-06-11 2015-06-11 Packaging support for LED lamp
PCT/CN2016/085369 WO2016197961A1 (en) 2015-06-11 2016-06-08 Led light packaging frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510320870.1A CN105047787A (en) 2015-06-11 2015-06-11 Packaging support for LED lamp

Publications (1)

Publication Number Publication Date
CN105047787A true CN105047787A (en) 2015-11-11

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ID=54454170

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201510320870.1A Pending CN105047787A (en) 2015-06-11 2015-06-11 Packaging support for LED lamp

Country Status (2)

Country Link
CN (1) CN105047787A (en)
WO (1) WO2016197961A1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016197961A1 (en) * 2015-06-11 2016-12-15 吴少健 Led light packaging frame
WO2016197957A1 (en) * 2015-06-11 2016-12-15 吴少健 Led light metal frame

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201594551U (en) * 2009-11-05 2010-09-29 深圳市瑞丰光电子股份有限公司 LED packaging unit and luminous device
CN102200235A (en) * 2010-03-26 2011-09-28 上海东熠光电有限公司 Light-emitting diode (LED) light-emitting bar
CN104332451A (en) * 2014-11-24 2015-02-04 深圳市富美达五金有限公司 Optocoupler packaging support
CN204760382U (en) * 2015-06-11 2015-11-11 吴少健 LED lamp encapsulation support

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Publication number Priority date Publication date Assignee Title
KR100628987B1 (en) * 2005-07-28 2006-09-27 금산전자 주식회사 Package structure of light emitting diode and method of manufacturing thereof
DE102010045596A1 (en) * 2010-09-16 2012-03-22 Osram Opto Semiconductors Gmbh Surface-mountable optoelectronic semiconductor component and lead frame composite
CN102364713A (en) * 2011-11-08 2012-02-29 吕能兵 Light emitting diode (LED) bracket and crystallizing method
CN203812910U (en) * 2014-03-28 2014-09-03 木林森股份有限公司 High-utilization-rate and high-luminous-efficiency LED array support
CN103994359B (en) * 2014-06-10 2016-04-27 吴锦星 A kind of processing method of Modular LED lamp bar
CN105047787A (en) * 2015-06-11 2015-11-11 吴少健 Packaging support for LED lamp
CN104930476A (en) * 2015-06-11 2015-09-23 吴少健 Metallic LED (light emitting diode) lamp support
CN205014297U (en) * 2015-06-11 2016-02-03 吴少健 LED lamp five metals support

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201594551U (en) * 2009-11-05 2010-09-29 深圳市瑞丰光电子股份有限公司 LED packaging unit and luminous device
CN102200235A (en) * 2010-03-26 2011-09-28 上海东熠光电有限公司 Light-emitting diode (LED) light-emitting bar
CN104332451A (en) * 2014-11-24 2015-02-04 深圳市富美达五金有限公司 Optocoupler packaging support
CN204760382U (en) * 2015-06-11 2015-11-11 吴少健 LED lamp encapsulation support

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016197961A1 (en) * 2015-06-11 2016-12-15 吴少健 Led light packaging frame
WO2016197957A1 (en) * 2015-06-11 2016-12-15 吴少健 Led light metal frame

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Legal Events

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C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20161014

Address after: 311300, Zhejiang Province, Hangzhou City, Ling'an Qingshan Lake Street Chuen mouth village

Applicant after: Linan New Sanlian Lighting Electric Co., Ltd.

Address before: 528421, No. thirteen, Lane 5, dragon First Street, Cao two town, Guzhen Town, Guangdong, Zhongshan

Applicant before: Wu Shaojian

WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20151111

WD01 Invention patent application deemed withdrawn after publication