CN107830430B - Substrate of LED lamp strip and LED lamp strip - Google Patents
Substrate of LED lamp strip and LED lamp strip Download PDFInfo
- Publication number
- CN107830430B CN107830430B CN201711163611.8A CN201711163611A CN107830430B CN 107830430 B CN107830430 B CN 107830430B CN 201711163611 A CN201711163611 A CN 201711163611A CN 107830430 B CN107830430 B CN 107830430B
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- Prior art keywords
- heat dissipation
- led
- substrate
- dissipation plate
- led light
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/06—Arrangement of electric circuit elements in or on lighting devices the elements being coupling devices, e.g. connectors
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
- F21V29/89—Metals
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to an LED lamp strip, wherein a substrate comprises a metal substrate which is punched, and a plurality of repeated units are arranged on the metal substrate; each repeating unit comprises a heat dissipation plate positioned in the middle, an upper DC wire section positioned at the upper part of the heat dissipation plate, a lower DC wire section positioned at the lower part of the heat dissipation plate, an AC wire positioned at the upper part of the upper DC wire section and a DC wire positioned at the lower part of the lower DC wire section; the AC conductive wire, the upper DC conductive wire section, the heat dissipation plate, the lower DC conductive wire section and the DC conductive wire are not connected with each other in the middle, the two ends of each are longitudinally connected with each other by a connecting bridge integrally connected with the metal substrate from top to bottom, and the adjacent arranged repeating units are connected by the connecting bridge. The LED lamp strip structure has good heat dissipation, the connection relation among the LED luminous bodies can be flexibly distributed, the length of the LED lamp strip can be cut freely, and compared with the LED lamp strip structure in the prior art, the LED lamp strip structure has wider applicability range and can meet the distribution of various requirement schemes.
Description
Technical Field
The invention relates to a substrate of an LED lamp strip and the LED lamp strip, and belongs to the technical field of LED illumination.
Background
The LED light-emitting lamp strip is widely used in LED lamp tubes, filament lamps and plane-emitting LED lamps, and the existing LED lamp strip structure is mainly divided into two types: a circuit board is adopted as a substrate, and a plurality of LED lamp beads are welded on the circuit board in a serial or parallel or serial and parallel mode; the LED light bar with the structure has poor heat dissipation effect, but the length is easy to be prolonged. The other is that a strip-shaped substrate with good heat dissipation performance and fixed length is adopted, a plurality of LED chips are fixed on the strip-shaped substrate in a serial or parallel or serial and parallel mode, and then fluorescent glue is coated on the surfaces of the LED chips; the LED light bar with the structure has better heat dissipation performance, but if the length of the light bar needs to be prolonged, the heat dissipation performance is more troublesome.
Disclosure of Invention
Based on the defects in the prior art, the invention discloses a substrate of an LED light bar, which adopts a metal radiating fin as the substrate, can realize good radiating effect, is formed by repeatedly arranging a plurality of unit substrates, realizes interconnection of circuits through a plurality of integrally connected connecting bridges between adjacent unit substrates, realizes serial-parallel connection relationship among the plurality of unit substrates by punching the connecting bridges at different positions, and cuts the whole substrate according to the required length.
In order to achieve the above purpose, the technical scheme adopted by the invention is as follows:
the substrate of the LED light bar comprises a die-cut metal substrate, wherein a plurality of repeated units are arranged on the metal substrate; each repeating unit comprises a heat dissipation plate positioned in the middle, an upper DC wire section positioned at the upper part of the heat dissipation plate, a lower DC wire section positioned at the lower part of the heat dissipation plate, an AC wire positioned at the upper part of the upper DC wire section and a DC wire positioned at the lower part of the lower DC wire section; the AC conductive wire, the upper DC conductive wire section, the heat dissipation plate, the lower DC conductive wire section and the DC conductive wire are not connected with each other in the middle, the two ends of each are longitudinally connected with each other by a connecting bridge integrally connected with the metal substrate from top to bottom, and the adjacent arranged repeating units are connected by the connecting bridge.
The heat dissipation plate is dumbbell-shaped with wide ends and narrow middle.
The middle part of the upper DC wire section and the middle part of the lower DC wire section are respectively provided with a convex part towards the direction of the heat dissipation plate, and the positions of the convex parts correspond to the middle narrow area of the heat dissipation plate.
The material of the heat dissipation plate adopts iron nickel plating, aluminum nickel plating or copper nickel plating.
The invention also provides an LED lamp strip manufactured based on the substrate, which adopts the following technical scheme:
the LED light bar comprises the substrate with the structure and the LED luminous body, wherein the LED luminous body is fixed on the radiating plate, and two electrodes of the LED luminous body are respectively and electrically connected with the upper DC wire section and the lower DC wire section; the AC conductive wires in the adjacent repeating units are interconnected, the connection bridge between the AC conductive wires and the upper DC conductive wire section in each repeating unit is disconnected, the heat dissipation plates in the adjacent repeating units are not interconnected, and the upper DC conductive wire section and the lower DC conductive wire section are not interconnected; the outside of the substrate of the LED light bar is covered and insulated by a plastic package body.
The LED luminous body is fixed in the middle narrow area of the heat dissipation plate, and the wires connecting the two electrodes of the LED luminous body are respectively and electrically connected with the protruding part of the upper DC wire section and the protruding part of the lower DC wire section.
The front face of the LED luminous body and the front and back faces of the two ends of the radiating plate are exposed out of the plastic package body, and the front face of the LED luminous body is covered by fluorescent glue.
The LED luminous bodies in each repeating unit inside the LED light bar are connected in parallel.
And a series-parallel connection relationship is realized among a plurality of repeated units in the LED light bar through the on-off of a connecting bridge.
And a cavity is formed at the position of the cut connecting bridge.
According to the invention, the pre-designed metal frame is used as the substrate for installing the LED luminous bodies, so that the heat dissipation is facilitated, the series-parallel connection relation among the LED luminous bodies can be flexibly arranged, the length of the LED lamp strip can be freely cut according to actual needs, and compared with the LED lamp strip structure in the prior art, the LED lamp strip structure has wider applicability range and can meet the arrangement of various requirement schemes.
The invention is further illustrated by the following figures and detailed description.
Description of the drawings:
FIG. 1 is a schematic illustration of a stamped metal substrate structure;
FIG. 2 is a schematic diagram of the partial connecting bridge of FIG. 1;
FIG. 3 is a schematic diagram of a structure of a light emitter soldered on a substrate;
FIG. 4 is a schematic diagram of the front structure of the substrate after injection molding the insulating layer in FIG. 3;
FIG. 5 is a schematic view of the back structure of FIG. 4;
FIG. 6 is a schematic diagram of the finished product of FIG. 4 after the injection molding is completed and after the secondary punching;
fig. 7 is a schematic view of the internal structure of fig. 6.
The specific embodiment is as follows:
the invention discloses an LED lamp strip, wherein a substrate punched by a strip-shaped metal frame is used as a substrate of the LED lamp strip, an LED luminous body is fixed on the metal substrate, a good heat dissipation effect can be formed, and the substrate can be made of iron nickel plating materials or aluminum nickel plating or copper nickel plating materials. The structure of the base plate after punching and molding is shown in fig. 1 and 2. A plurality of repeated units 8 are transversely distributed on the substrate, and the length of the LED light bar is adjusted through the distribution number of the repeated units 8. The length of the substrate which is punched and molded in advance can be designed longer, and particularly, the length of the substrate can be cut freely according to the design length of the light bar when the LED light bar is produced, so that the form is free and flexible, and the applicability range of the substrate is wider.
The specific structure of the device is expanded and detailed by a repeating unit 8, the repeating unit 8 sequentially comprises an AC conductive wire 1, an upper DC conductive wire section 3, a heat dissipation plate 5, a lower DC conductive wire section 4 and a DC conductive wire 2 from top to bottom, the components are transversely distributed in a strip shape, the middle parts of the components are isolated from each other and are not connected with each other, and the end parts of the components are longitudinally connected with each other by a connecting bridge 9 only at the two ends of the components so as to avoid scattering. The connecting bridge 9 not only acts as a connecting rib on the punched substrate, but also mainly realizes the electric connection relationship between the adjacent connected repeating units 8, and the connection between the adjacent two repeating units 8 also depends on the connecting bridge 9 to realize interconnection. The connecting bridges 9 at different positions need to be subjected to secondary punching in a targeted manner in the manufacturing process according to the serial-parallel connection relation among all luminous bodies in the LED light bar.
The heat dissipation plate 5 has a dumbbell-shaped structure with wider ends and narrower middle part, the wider areas at the two ends form a heat dissipation area 12, and the narrower areas at the middle part form a luminous body installation area 6. For the electric connection of the two electrodes of the luminous body, the middle parts of the upper DC lead section 3 and the lower DC lead section 4 can be respectively provided with a convex part 7 towards the direction of the heat dissipation plate 5, so that the convex part 7 just corresponds to the luminous body installation area 6 in the middle part of the heat dissipation plate 5. The LED luminous body 10 is stuck to the luminous body mounting area 6 (as shown in fig. 3), the LED luminous body 10 can adopt an LED chip or an LED lamp bead, and the luminous color of the luminous body can be white or colored. In the drawings of the embodiment, taking an LED chip as an example, after the LED chip is pasted, two electrodes of the LED chip are respectively connected with the convex parts 7 on the upper DC lead section 3 and the lower DC lead section 4 by using metal wires 11. The number of the LED emitters 10 mounted on the heat dissipation plate 5 in each repeating unit 8 may be only one, or may be a plurality of parallel connection, if a plurality of parallel connection is adopted, the lengths of the corresponding upper DC conductor segment 3 and lower DC conductor segment 4 are moderately increased, so as to ensure that the capacity design requirement of the current can be met.
After the LED emitter 10 is mounted on the substrate having the above structure, the outside of the substrate is covered with a plastic package for insulation and connection protection between the electrodes, only the front surface of the LED emitter 10, the heat dissipation area 12 on the front and back surfaces of the heat dissipation plate 5, and the connection parts between the two ends of the substrate are exposed, and the exposed parts on the front surface of the LED emitter 10 are covered with a fluorescent glue (as shown in fig. 4 and 5, the connection parts of the ends are omitted).
Because the connecting bridges 9 on the substrate are all in a communication state before plastic packaging, the whole LED light bar cannot realize an electric connection relation temporarily, and the internal connecting bridges 9 are subjected to targeted secondary punching after plastic packaging is finished, so that the connection relation of a circuit is realized. Whether the connection between the adjacently connected repeating units 8 is series or parallel, first, the AC conductor lines 1 between the repeating units 8 are connected laterally, whereas the connection bridge 9 between the AC conductor lines 1 in each repeating unit 8 and the respective upper DC conductor segment 3 must be punched out, the AC conductor lines 1 being used for connecting the incoming ends of the alternating current. Next, the heat dissipation plates 5 of the repeating units 8 cannot be interconnected, and the connection bridges 9 which can establish an electrical connection between the heat dissipation plates 5 are all punched and cut. Again, all of the upper DC conductor segments 3 and the lower DC conductor segments 4 are not interconnected, and all of the bridges 9 that are required to establish an electrical connection between the upper DC conductor segments 3 and the lower DC conductor segments 4 are broken. The connecting bridge 9 between the lower DC lead section 4 and the DC conductive wire 2 still remains, and the upper DC lead section 3 exposed outside the plastic package body and the lower DC lead section 4 and the DC conductive wire 2 are respectively connected with a driving power supply. The connection bridge 9 at other positions needs to be punched according to specific circuit connection relation.
The secondary punching of the connecting bridge 9 can be performed after plastic packaging, the structure after punching is shown in fig. 6, a cavity is formed at the cut connecting bridge 9, and a light reflecting material can be coated at the part exposed to the plastic packaging body to realize light reflection of the LED luminous body. Fig. 7 shows a schematic illustration of the internal connection of one embodiment formed between the repeating units 8, from which the cut-off of the connecting bridges 9 can be clearly seen. From the substrate connection relation finally formed, the repeating units F and E are in parallel connection, the repeating units D and C are in parallel connection, the repeating units B and a are in parallel connection, and the two adjacent and parallel-connected repeating units can be regarded as one circulating unit, and each circulating unit is connected in series. Fig. 7 is only for illustrating the meaning of the connection bridge 9 for realizing the circuit connection relationship, and other embodiments are omitted.
The LED lamp strip provided by the invention has the advantages that the circuit connection relation is formed in the second punching process after plastic packaging, so that different circuit designers can conveniently connect different circuits by means of the substrate, and the universality of the substrate provided by the invention is further improved.
The above embodiments are only for illustrating the technical solution of the present invention, but not for limiting, and other modifications and equivalents thereof by those skilled in the art should be included in the scope of the claims of the present invention without departing from the spirit and scope of the technical solution of the present invention.
Claims (10)
1. The utility model provides a base plate of LED lamp strip which characterized in that: comprises a punched metal substrate, wherein a plurality of repeated units are arranged on the metal substrate; each repeating unit comprises a heat dissipation plate positioned in the middle, an upper DC wire section positioned at the upper part of the heat dissipation plate, a lower DC wire section positioned at the lower part of the heat dissipation plate, an AC wire positioned at the upper part of the upper DC wire section and a DC wire positioned at the lower part of the lower DC wire section; the AC conductive wires, the upper DC conductive wire sections, the heat dissipation plates, the lower DC conductive wire sections and the DC conductive wires are not connected with each other in the middle, the two ends of each AC conductive wire, the upper DC conductive wire sections, the heat dissipation plates, the lower DC conductive wire sections and the DC conductive wires are longitudinally connected with each other by connecting bridges integrally connected with the metal substrate from top to bottom, the adjacent arranged repeating units are connected by the connecting bridges, the AC conductive wires in the adjacent repeating units are connected with each other, the connecting bridges between the AC conductive wires and the upper DC conductive wire sections in each repeating unit are disconnected, the heat dissipation plates in the adjacent repeating units are not connected with each other, and the upper DC conductive wire sections and the lower DC conductive wire sections are not connected with each other.
2. The substrate for an LED light strip of claim 1, wherein: the heat dissipation plate is dumbbell-shaped with wide ends and narrow middle.
3. The substrate for an LED light strip of claim 2, wherein: the middle part of the upper DC wire section and the middle part of the lower DC wire section are respectively provided with a convex part towards the direction of the heat dissipation plate, and the positions of the convex parts correspond to the middle narrow area of the heat dissipation plate.
4. The substrate for an LED light strip of claim 1, wherein: the material of the heat dissipation plate adopts iron nickel plating, aluminum nickel plating or copper nickel plating.
5. The utility model provides a LED lamp strip which characterized in that: a substrate as claimed in any one of claims 1 to 4 and an LED luminary, said LED luminary being fixed to a heat sink, two electrodes of the LED luminary being electrically connected to the upper and lower DC lead sections, respectively; the outside of the substrate of the LED light bar is covered and insulated by a plastic package body.
6. The LED light bar of claim 5, wherein: the LED luminous body is fixed in the middle narrow area of the heat dissipation plate, and the wires connecting the two electrodes of the LED luminous body are respectively and electrically connected with the protruding part of the upper DC wire section and the protruding part of the lower DC wire section.
7. The LED light bar of claim 5, wherein: the front face of the LED luminous body and the front and back faces of the two ends of the radiating plate are exposed out of the plastic package body, and the front face of the LED luminous body is covered by fluorescent glue.
8. The LED light bar of claim 5, wherein: the LED luminous bodies in each repeating unit inside the LED light bar are connected in parallel.
9. The LED light bar of claim 5, wherein: and a series-parallel connection relationship is realized among a plurality of repeated units in the LED light bar through the on-off of a connecting bridge.
10. The LED light bar of claim 9, wherein: the cut-off bridge forms a void at the location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711163611.8A CN107830430B (en) | 2017-11-21 | 2017-11-21 | Substrate of LED lamp strip and LED lamp strip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711163611.8A CN107830430B (en) | 2017-11-21 | 2017-11-21 | Substrate of LED lamp strip and LED lamp strip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107830430A CN107830430A (en) | 2018-03-23 |
| CN107830430B true CN107830430B (en) | 2023-10-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711163611.8A Active CN107830430B (en) | 2017-11-21 | 2017-11-21 | Substrate of LED lamp strip and LED lamp strip |
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| CN (1) | CN107830430B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109888080A (en) * | 2019-02-01 | 2019-06-14 | 中山市凹凸灯饰配件有限公司 | A kind of lamp bar mould group production technology |
| TWI746002B (en) * | 2020-06-10 | 2021-11-11 | 宏齊科技股份有限公司 | Led light source module which can be cut into various shapes |
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| CN104930389A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light emitting diode) substrate stripe |
| CN104930388A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light emitting diode) substrate stripe |
| CN104930470A (en) * | 2015-06-12 | 2015-09-23 | 吴少健 | LED (light emitting diode) lamp panel structure |
| CN105047787A (en) * | 2015-06-11 | 2015-11-11 | 吴少健 | Packaging support for LED lamp |
| CN205050875U (en) * | 2015-09-25 | 2016-02-24 | 吴少健 | LED circuit board |
| CN105757467A (en) * | 2016-04-12 | 2016-07-13 | 浙江阳光美加照明有限公司 | LED light-emitting lamp bar as well as LED filament bulb lamp and LED lamp tube using same |
| CN205690163U (en) * | 2016-06-12 | 2016-11-16 | 段鸿 | A kind of Novel LED light bar being easy to cutting |
| CN207716128U (en) * | 2017-11-21 | 2018-08-10 | 浙江阳光美加照明有限公司 | A kind of substrate and LED light bar of LED light bar |
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2017
- 2017-11-21 CN CN201711163611.8A patent/CN107830430B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008156020A1 (en) * | 2007-06-19 | 2008-12-24 | Sharp Kabushiki Kaisha | Substrate and illuminating apparatus |
| CN203364085U (en) * | 2013-08-02 | 2013-12-25 | 深圳Tcl新技术有限公司 | Radiator structure of light-emitting diode (LED) backlight module, LED light bar and heating panel |
| CN104930389A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light emitting diode) substrate stripe |
| CN104930388A (en) * | 2015-06-11 | 2015-09-23 | 吴少健 | LED (light emitting diode) substrate stripe |
| CN105047787A (en) * | 2015-06-11 | 2015-11-11 | 吴少健 | Packaging support for LED lamp |
| CN104930470A (en) * | 2015-06-12 | 2015-09-23 | 吴少健 | LED (light emitting diode) lamp panel structure |
| CN205050875U (en) * | 2015-09-25 | 2016-02-24 | 吴少健 | LED circuit board |
| CN105757467A (en) * | 2016-04-12 | 2016-07-13 | 浙江阳光美加照明有限公司 | LED light-emitting lamp bar as well as LED filament bulb lamp and LED lamp tube using same |
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| CN207716128U (en) * | 2017-11-21 | 2018-08-10 | 浙江阳光美加照明有限公司 | A kind of substrate and LED light bar of LED light bar |
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| CN107830430A (en) | 2018-03-23 |
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