WO2008156020A1 - Substrate and illuminating apparatus - Google Patents

Substrate and illuminating apparatus Download PDF

Info

Publication number
WO2008156020A1
WO2008156020A1 PCT/JP2008/060681 JP2008060681W WO2008156020A1 WO 2008156020 A1 WO2008156020 A1 WO 2008156020A1 JP 2008060681 W JP2008060681 W JP 2008060681W WO 2008156020 A1 WO2008156020 A1 WO 2008156020A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
area
mounting region
heat conductive
chip leds
Prior art date
Application number
PCT/JP2008/060681
Other languages
French (fr)
Japanese (ja)
Inventor
Shinya Sakaida
Kiyoaki Tanaka
Original Assignee
Sharp Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2007161814A external-priority patent/JP4969332B2/en
Priority claimed from JP2007174629A external-priority patent/JP4996998B2/en
Application filed by Sharp Kabushiki Kaisha filed Critical Sharp Kabushiki Kaisha
Publication of WO2008156020A1 publication Critical patent/WO2008156020A1/en

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89Metals
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0209External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2113/00Combination of light sources
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01Dielectrics
    • H05K2201/0104Properties and characteristics in general
    • H05K2201/0108Transparent
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09209Shape and layout details of conductors
    • H05K2201/09654Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)

Abstract

Provided is a substrate by which heat generated by a semiconductor light emitting element can be dissipated and temperature increase can be suppressed. An illuminating apparatus is also provided. On the front surface of a substrate (1), many chip LEDs can be surface-mounted, and mounting regions for the chip LEDs are arranged at intervals of a prescribed size. The area of the mounting region is equivalent to an area to be occupied by the chip LED on the substrate (1). On the rear surface of the substrate (1), a plurality of heat conductive films (3 and so on) are arranged at the intervals of the prescribed size, for dissipating heat generated by the chip LEDs to the external of the substrate (1). The area of the heat conductive film (3) is larger than that of the mounting region, and is arranged to include the range of the mounting region. The heat conductive films (3 and so on) can be formed, for instance, by patterning a copper foil formed on the entire rear surface of the substrate (1).
PCT/JP2008/060681 2007-06-19 2008-06-11 Substrate and illuminating apparatus WO2008156020A1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007161814A JP4969332B2 (en) 2007-06-19 2007-06-19 Substrate and lighting device
JP2007-161814 2007-06-19
JP2007-174629 2007-07-02
JP2007174629A JP4996998B2 (en) 2007-07-02 2007-07-02 Lighting device

Publications (1)

Publication Number Publication Date
WO2008156020A1 true WO2008156020A1 (en) 2008-12-24

Family

ID=40156177

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/060681 WO2008156020A1 (en) 2007-06-19 2008-06-11 Substrate and illuminating apparatus

Country Status (1)

Country Link
WO (1) WO2008156020A1 (en)

Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010161026A (en) * 2009-01-09 2010-07-22 Toshiba Lighting & Technology Corp Illumination device
WO2011067989A1 (en) * 2009-12-02 2011-06-09 シャープ株式会社 Illumination device, and display device
JP2012022977A (en) * 2010-07-16 2012-02-02 Opt Design:Kk Lighting device
JP2012517115A (en) * 2009-02-05 2012-07-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Improved implementation of LED combinations
JP2013058467A (en) * 2011-09-08 2013-03-28 In-Kyu Ahn Led type lighting module
US8408724B2 (en) 2008-12-26 2013-04-02 Toshiba Lighting & Technology Corporation Light source module and lighting apparatus
WO2013058377A1 (en) * 2011-10-21 2013-04-25 サンケン電気株式会社 Light fitting
WO2013076910A1 (en) * 2011-11-21 2013-05-30 パナソニック株式会社 Light emitting apparatus and illuminating apparatus
EP2750212A1 (en) * 2012-12-29 2014-07-02 Nichia Corporation Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
JP2014157800A (en) * 2013-02-18 2014-08-28 Toshiba Lighting & Technology Corp Lighting fixture
US8820950B2 (en) 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus
US9281460B2 (en) 2012-10-31 2016-03-08 Nichia Corporation Light emitting device package and light emitting device having lead-frames
US9406856B2 (en) 2013-06-28 2016-08-02 Nichia Corporation Package for light emitting apparatus and light emitting apparatus including the same
JP2016170988A (en) * 2015-03-12 2016-09-23 パナソニックIpマネジメント株式会社 Luminaire
JPWO2014115443A1 (en) * 2013-01-24 2017-01-26 シャープ株式会社 Light emitting device and manufacturing method thereof
CN107830430A (en) * 2017-11-21 2018-03-23 浙江阳光美加照明有限公司 The substrate and LED light bar of a kind of LED light bar
EP3346320A4 (en) * 2015-09-01 2018-10-24 Panasonic Intellectual Property Management Co., Ltd. Image display device
US10490143B2 (en) 2015-09-01 2019-11-26 Panasonic Intellectual Property Management Co., Ltd. Video display device
US10643556B2 (en) 2015-09-01 2020-05-05 Panasonic Intellectual Property Management Co., Ltd. Video display device
US10642097B2 (en) 2015-09-01 2020-05-05 Panasonic Intellectual Property Management Co., Ltd. Image display device including multiple light source substrates
US10809569B2 (en) 2015-09-01 2020-10-20 Panasonic Intellectual Property Management Co., Ltd. Video display device
US10976601B2 (en) 2015-09-01 2021-04-13 Panasonic Intellectual Property Management Co., Ltd. Video display device
CN116772131A (en) * 2023-06-26 2023-09-19 惠科股份有限公司 Lamp panel, manufacturing method of lamp panel and display device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148082A (en) * 1974-05-20 1975-11-27
JP2003092011A (en) * 2001-09-18 2003-03-28 Matsushita Electric Ind Co Ltd Lighting device
JP2005109228A (en) * 2003-09-30 2005-04-21 Toshiba Lighting & Technology Corp Led device and led illumination apparatus
JP2006310874A (en) * 2005-04-29 2006-11-09 Philips Lumileds Lightng Co Llc Rgb thermally insulated substrate
JP2007059894A (en) * 2005-07-27 2007-03-08 Showa Denko Kk Light source mounted with light emitting diode element

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50148082A (en) * 1974-05-20 1975-11-27
JP2003092011A (en) * 2001-09-18 2003-03-28 Matsushita Electric Ind Co Ltd Lighting device
JP2005109228A (en) * 2003-09-30 2005-04-21 Toshiba Lighting & Technology Corp Led device and led illumination apparatus
JP2006310874A (en) * 2005-04-29 2006-11-09 Philips Lumileds Lightng Co Llc Rgb thermally insulated substrate
JP2007059894A (en) * 2005-07-27 2007-03-08 Showa Denko Kk Light source mounted with light emitting diode element

Cited By (38)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8408724B2 (en) 2008-12-26 2013-04-02 Toshiba Lighting & Technology Corporation Light source module and lighting apparatus
JP2010161026A (en) * 2009-01-09 2010-07-22 Toshiba Lighting & Technology Corp Illumination device
JP2012517115A (en) * 2009-02-05 2012-07-26 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ Improved implementation of LED combinations
JP5276722B2 (en) * 2009-12-02 2013-08-28 シャープ株式会社 Illumination device and display device
WO2011067989A1 (en) * 2009-12-02 2011-06-09 シャープ株式会社 Illumination device, and display device
CN102639926A (en) * 2009-12-02 2012-08-15 夏普株式会社 Illumination device, and display device
US8820950B2 (en) 2010-03-12 2014-09-02 Toshiba Lighting & Technology Corporation Light emitting device and illumination apparatus
JP2012022977A (en) * 2010-07-16 2012-02-02 Opt Design:Kk Lighting device
JP2013058467A (en) * 2011-09-08 2013-03-28 In-Kyu Ahn Led type lighting module
WO2013058377A1 (en) * 2011-10-21 2013-04-25 サンケン電気株式会社 Light fitting
JP2013089557A (en) * 2011-10-21 2013-05-13 Sanken Electric Co Ltd Lamp fitting
US8950897B2 (en) 2011-11-21 2015-02-10 Panasonic Corporation Light-emitting device and lighting apparatus
EP2634480A4 (en) * 2011-11-21 2014-08-13 Panasonic Corp Light emitting apparatus and illuminating apparatus
JP5250162B1 (en) * 2011-11-21 2013-07-31 パナソニック株式会社 Light emitting device and lighting device
WO2013076910A1 (en) * 2011-11-21 2013-05-30 パナソニック株式会社 Light emitting apparatus and illuminating apparatus
EP2634480A1 (en) * 2011-11-21 2013-09-04 Panasonic Corporation Light emitting apparatus and illuminating apparatus
US9281460B2 (en) 2012-10-31 2016-03-08 Nichia Corporation Light emitting device package and light emitting device having lead-frames
EP2750212A1 (en) * 2012-12-29 2014-07-02 Nichia Corporation Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
CN103915542A (en) * 2012-12-29 2014-07-09 日亚化学工业株式会社 Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
US9257417B2 (en) 2012-12-29 2016-02-09 Nichia Corporation Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
USRE47504E1 (en) 2012-12-29 2019-07-09 Nichia Corporation Light emitting device package, light emitting device using that package, and illumination device using the light emitting devices
JPWO2014115443A1 (en) * 2013-01-24 2017-01-26 シャープ株式会社 Light emitting device and manufacturing method thereof
JP2014157800A (en) * 2013-02-18 2014-08-28 Toshiba Lighting & Technology Corp Lighting fixture
US9647190B2 (en) 2013-06-28 2017-05-09 Nichia Corporation Package for light emitting apparatus and light emitting apparatus including the same
US10305011B2 (en) 2013-06-28 2019-05-28 Nichia Corporation Light emitting apparatus
US9991432B2 (en) 2013-06-28 2018-06-05 Nichia Corporation Light emitting apparatus
US9406856B2 (en) 2013-06-28 2016-08-02 Nichia Corporation Package for light emitting apparatus and light emitting apparatus including the same
JP2016170988A (en) * 2015-03-12 2016-09-23 パナソニックIpマネジメント株式会社 Luminaire
US10490143B2 (en) 2015-09-01 2019-11-26 Panasonic Intellectual Property Management Co., Ltd. Video display device
EP3346320A4 (en) * 2015-09-01 2018-10-24 Panasonic Intellectual Property Management Co., Ltd. Image display device
US10643556B2 (en) 2015-09-01 2020-05-05 Panasonic Intellectual Property Management Co., Ltd. Video display device
US10642097B2 (en) 2015-09-01 2020-05-05 Panasonic Intellectual Property Management Co., Ltd. Image display device including multiple light source substrates
US10663793B2 (en) 2015-09-01 2020-05-26 Panasonic Intellectual Property Management Co., Ltd. Image display device
US10809569B2 (en) 2015-09-01 2020-10-20 Panasonic Intellectual Property Management Co., Ltd. Video display device
US10976601B2 (en) 2015-09-01 2021-04-13 Panasonic Intellectual Property Management Co., Ltd. Video display device
CN107830430A (en) * 2017-11-21 2018-03-23 浙江阳光美加照明有限公司 The substrate and LED light bar of a kind of LED light bar
CN107830430B (en) * 2017-11-21 2023-10-03 浙江阳光美加照明有限公司 Substrate of LED lamp strip and LED lamp strip
CN116772131A (en) * 2023-06-26 2023-09-19 惠科股份有限公司 Lamp panel, manufacturing method of lamp panel and display device

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