JP4969332B2 - Substrate and lighting device - Google Patents

Description

  The present invention relates to a substrate on which an electronic component such as a light emitting diode (hereinafter referred to as LED) is mounted, and a lighting device in which the LED is mounted on the substrate.

  Conventionally, a fluorescent lamp or an incandescent lamp is used as a light source for a lighting fixture or a display device. On the other hand, technical development for using a light-emitting diode having features of longer life and lower power consumption as a light source for illumination or display than a conventional light source has been performed.

For example, a card-type LED illumination light source in which a large number of LED chips are arranged on a substrate is disclosed (see Patent Document 1).
JP 2003-124528 A

  However, when a large number of LED chips (semiconductor light-emitting elements) are mounted on a substrate as in the apparatus of Patent Document 1, the amount of heat generated by the semiconductor light-emitting elements increases as a whole. Especially when used as a light source for illumination or display, in order to keep the brightness uniform, it is necessary to arrange the semiconductor light emitting elements relatively densely, and how to dissipate the heat generated in the semiconductor light emitting elements. Is a problem.

  The present invention has been made in view of such circumstances, and a substrate capable of dissipating heat generated by electronic components such as LEDs to be mounted to suppress a temperature rise, and a plurality of semiconductor light emitting elements are mounted on the substrate. An object is to provide a lighting device.

Substrate according to the present invention, Ri Na by mounting a plurality of electronic components such as an LED on one side, the substrate that is mounted on a plate-shaped radiator plate, the other surface of the substrate, for each of the electronic component and / or the electronic component was heat-transfer the heat from the electronic component for each group consisting in a plurality of groups on the heat dissipation plate, supporting the entire substrate with the heat dissipation plate, the thermal expansion coefficient between the substrate And a plurality of heat conducting portions for preventing the bending of the substrate caused by the difference in the expansion amount due to the difference between the two .

In the present invention, heat generated in a plurality of electronic components such as LEDs mounted on one surface of the substrate is conducted from the front surface of the substrate through the inside of the substrate to the other surface of the substrate and provided on the back surface. Heat is radiated to the outside through the heat conductor. It is equipped with a heat conduction part for transferring heat from the electronic component for each electronic component and / or for each group obtained by dividing the electronic part into a plurality of groups. Increases, and the temperature rise of the substrate can be suppressed.
In addition, it is possible to suppress the bending of the substrate caused by the difference in the expansion amount due to the difference between the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the heat conducting portion .
Moreover, the whole board | substrate can be supported by a heat sink, and the bending of a board | substrate etc. can be prevented .

Substrate according to the present invention, unlike the power consumption of the plurality of electronic components, in accordance with the magnitude of the power consumption, characterized in that are changing the size of the heat-conducting portion.

In the present invention, when electronic components with different power consumption are mounted on the substrate, the size of the heat conduction part is changed according to the power consumption, thereby responding to the difference in the amount of heat generated by each electronic component. The heat radiation efficiency can be improved as a whole device .

  The substrate according to the present invention is characterized in that an area of the region where the heat conducting unit is provided is equal to or larger than an area of the region where the electronic component is mounted.

  In the present invention, the area of the heat conducting portion relative to the entire substrate is increased by providing a heat conducting portion having an area equal to or larger than the area of the range so as to face the range including the mounting region of the plurality of electronic components. This can further improve the heat dissipation effect. As a result, the heat generated in the electronic component can be dissipated to the outside from the heat conducting portion provided opposite to the mounting area of the electronic component across the substrate, and each electronic component mounted on the substrate surface can be dissipated. The temperature rise can be further suppressed. For example, a heat conduction part having an area larger than the area of the mounting region can be provided so as to face the mounting region of one electronic component.

  The substrate according to the present invention is characterized in that the heat conducting portion is a metal film.

  In the present invention, it is possible to effectively radiate heat by using a metal having good thermal conductivity for radiating heat.

  The substrate according to the present invention is characterized in that the heat conducting portion is insulated from the voltage application portion of the electronic component.

  In the present invention, for example, a metal heat radiating plate can be mounted in close contact with the heat conducting film, and there is no need to provide an insulating plate between the substrate and the heat radiating plate, and the structure is simplified. Furthermore, the heat dissipation effect can be improved.

  The lighting device according to the present invention is characterized in that at least a plurality of semiconductor light emitting elements are mounted on the substrate according to any one of the above-described inventions.

  In this invention, the illuminating device excellent in the heat dissipation effect can be provided.

  In the present invention, the heat generated in the semiconductor light emitting element can be dissipated to suppress the temperature rise, and the substrate can be prevented from being bent due to the heat generated by the semiconductor light emitting element.

  In the present invention, the area of the heat conductive film with respect to the entire substrate can be increased, and the heat dissipation effect can be further improved while preventing the substrate from being bent due to heat generation.

  Moreover, in this invention, a metal heat sink can be attached in close contact with the heat conductive film, the structure is simplified, and the heat dissipation effect can be further improved.

  Moreover, in this invention, the illuminating device excellent in the heat dissipation effect can be provided.

  Hereinafter, the present invention will be described with reference to the drawings illustrating embodiments thereof. FIG. 1 is a plan view of a substrate according to the present invention, and FIG. 2 is a bottom view of the substrate according to the present invention. 1 and 2, reference numeral 1 denotes a substrate. FIG. 1 shows the surface of the substrate 1 on which the chip LEDs are surface-mounted, and FIG. 2 shows the back surface of the substrate 1.

  The board | substrate 1 is rectangular shape, for example, Comprising: The length dimension of a suitable length and a width dimension are provided. The thickness of the board | substrate 1 is thin compared with a normal board | substrate, for example, is about 1 mm. As will be described later, by reducing the thickness of the substrate 1, it is possible to easily conduct heat generated in chip LEDs (for example, white LEDs) mounted (mounted) on the surface to the back surface of the substrate 1. In addition, the shape of the board | substrate 1 is an example, Comprising: It is not limited to this, It can set suitably according to uses, such as circular shape and polygonal shape.

  The material of the substrate 1 is, for example, a glass composite substrate in which an epoxy resin is impregnated into a mat-like material obtained by cutting glass fibers. In addition, the material of the board | substrate 1 is not limited to this, A glass epoxy board | substrate, a glass polyimide board | substrate, a paper epoxy board | substrate, a paper phenol board | substrate etc. can be used according to a use, use conditions, etc.

  As shown in FIG. 1, a large number of chip LEDs (not shown) can be surface-mounted on the surface of the substrate 1, and the mounting regions 2 of the chip LEDs are arranged with a required separation dimension. The mounting region 2 corresponds to a region where the chip LED and the substrate 1 abut when the chip LED is mounted on the surface of the substrate 1. For example, when the LED chip has a rectangular shape, the area of the mounting region 2 corresponds to the area determined by the integration of the vertical and horizontal dimensions of the surface in contact with the substrate among the shape dimensions of the chip LED. . That is, the mounting area 2 is an area where the chip LED is mounted and occupied. In addition, arrangement | positioning of the mounting area | region 2, ... of chip LED is an example, Comprising: It is not limited to this.

  As shown in FIG. 2, the back surface of the substrate 1 has a required separation dimension with a metal heat conductive film 3,... As a heat conducting portion for radiating heat generated by the chip LED to the outside of the substrate 1. There are several. The heat conductive films 3 can be formed, for example, by patterning a copper foil formed on the entire back surface of the substrate 1. Alternatively, a heat conductive film may be formed by forming a copper pattern on the back surface of the substrate 1. The heat conductive film 3 is not limited to copper, and may be another metal film such as aluminum as long as it has excellent heat conduction characteristics. The thermal expansion coefficient of the substrate 1 and the thermal conductive film are increased by the temperature rise caused by the heat generated in the chip LED by providing the thermal conductive film 3 uniformly on the entire back surface of the substrate 1 instead of being provided with a required separation dimension. It is possible to suppress warping or bending of the substrate 1 caused by a difference in expansion amount due to a difference in thermal expansion coefficient of 3 (for example, copper).

  Further, the heat conductive films 3 are electrically insulated from the voltage supplied to the chip LED. For example, it is electrically insulated from a conductive pattern for soldering the chip LED or a lead wire for supplying voltage. Thus, even when a heat sink, which will be described later, is attached to the back surface of the substrate 1, there is no need to provide an insulating plate between the substrate 1 and the heat sink, the structure is simplified, and heat conduction is achieved. The heat conducted to the film 3 can be further dissipated to the outside by the heat dissipation plate, and the heat dissipation effect can be further improved.

  At the four corners of the substrate 1, mounting holes 5 for mounting the heat sink are provided. In addition, conductive patterns 6 for electrical connection such as lead wires or connectors for supplying a required voltage to the chip LED are formed at both ends of the substrate 1. Further, a fixing hole 7 for fixing the substrate 1 to a chassis or a housing is provided at the center of the substrate 1.

  FIG. 3 is an explanatory diagram showing an example of the positional relationship between the mounting region 2 and the heat conductive film 3. As shown in FIG. 3, each heat conductive film 3 is arrange | positioned corresponding to the position of each mounting area | region 2 of chip | tip LED. More specifically, the area of the region where the heat conductive film 3 is provided is larger than the area of the mounting region 2 and is disposed so as to include the mounting region 2. As a result, heat generated in each chip LED is easily conducted from the mounting area 2 of the chip LED to the heat conduction film 3 directly below the substrate 1, and the heat dissipation effect is increased to increase the temperature of each chip LED. Can be suppressed.

  Moreover, since the area of the heat conductive film 3 is larger than the area of the mounting region 2, the efficiency of heat dissipation can be improved, and the heat generated in each chip LED can be dissipated from the heat conductive film 3 to the outside. Thus, the temperature rise of each individual chip LED can be further suppressed.

  FIG. 4 is an external perspective view of the light emitting device according to the present invention with a heat sink attached. The light emitting device of the present invention is obtained by surface mounting a large number of chip LEDs on the substrate 1 described above. In FIG. 4, the chip LED mounted on the surface of the substrate 1 is omitted. Moreover, the illuminating device according to the present invention can be configured by attaching a heat radiating plate to a light emitting device in which a large number of chip LEDs are surface-mounted on the substrate 1 and mounting the heat radiating plate on the chassis or incorporating it into the housing. In this case, one or a plurality of substrates 1 can be incorporated depending on the size, shape, etc. of the lighting device.

  In FIG. 4, 4 is a heat sink. The heat radiating plate 4 is a thin plate made of aluminum, for example, and the shape thereof can be appropriately set according to the shape of the substrate 1. In addition, the material of the heat sink 4 is not limited to aluminum, The other metal with good heat conduction efficiency can also be used. In the example of FIG. 4, one substrate 1 is mounted on the heat radiating plate 4, but a configuration in which a plurality of substrates 1 are mounted may be used. Further, grease may be applied to improve the heat dissipation by improving the adhesion between the substrate 1 and the heat sink 4.

  In the light emitting device of the present invention, since the heat conductive film 3 is electrically insulated, the back surface of the substrate 1 and the heat radiating plate 4 can be brought into close contact with each other over the entire surface, and the heat generated in the chip LED is heated. It can be diffused into the air through the conductive film 3,. Moreover, since the board | substrate 1 is the structure closely_contact | adhered with the heat sink 4 on the whole surface, the board | substrate 1 whole can be supported by the heat sink 4, and the bending | flexion etc. of the board | substrate 1 can be prevented. Thereby, the thickness of the board | substrate 1 can be about 1 mm or 1 mm or less, and also heat dissipation efficiency can be improved.

  On the surface of the substrate 1, not only chip LEDs but also electronic components such as surface-mounted resistance elements can be mounted. A white resist film can be formed on the surface of the substrate 1 excluding the chip LED and the vicinity thereof on the surface of the substrate 1 on which the chip LED is mounted. Thereby, the light emitted from the chip LED is reflected by the resist film, and white light emission can be made uniform as a whole when viewed from the surface of the substrate 1.

  The pattern composed of the heat conductive films 3 is not limited to the above example. That is, in FIG. 3, one heat conductive film 3 is arranged corresponding to one mounting region 2, but one heat conductive film 3 is arranged corresponding to a plurality of mounting regions 2. It is also possible.

  FIG. 5 is an explanatory diagram showing another example of the positional relationship between the mounting region 2 and the heat conductive film 3. In the example of FIG. 5, one heat conductive film 3 is arranged corresponding to four mounting regions 2,... Adjacent to the substrate 1 in the length direction and width direction. The area of the heat conductive film 3 is larger than the area of the mounting region 2... And includes the range of the mounting region 2. As a result, the heat generated in each chip LED is easily conducted from the mounting area 2 of the chip LED to the thermal conductive film 3 directly below the inside of the substrate 1, and the heat dissipation effect is increased to increase the individual chip LED's. Temperature rise can be suppressed. In addition, the area of the heat conductive film 3 can be increased as compared with the case where one heat conductive film 3 is disposed corresponding to one mounting region 2, and the heat dissipation efficiency can be further improved.

  FIG. 6 is an explanatory view showing another example of the positional relationship between the mounting region 2 and the heat conductive film 3. In the example of FIG. 6, one heat conductive film 3 is arranged corresponding to four mounting regions 2 adjacent to the width direction of the substrate 1. Also in this case, similarly to the example of FIG. 5, the area of the heat conductive film 3 can be increased, and the heat dissipation efficiency can be further improved.

  FIG. 7 is an explanatory diagram showing another example of the positional relationship between the mounting region 2 and the heat conductive film 3. In the example of FIG. 7, one heat conductive film 3 is arranged corresponding to four mounting regions 2,... Adjacent in the length direction of the substrate 1. Also in this case, similarly to the example of FIG. 5, the area of the heat conductive film 3 can be increased, and the heat dissipation efficiency can be further improved.

  FIG. 8 is an explanatory diagram showing another example of the positional relationship between the mounting region 2 and the heat conductive film 3. In the example of FIG. 8, for example, a case where a chip LED with different power consumption is mounted on the substrate 1 depending on the application, use conditions, and the like is shown. In FIG. 8, a chip LED with low power consumption is mounted in the mounting area 2, and a chip LED with high power consumption is mounted in the mounting area 2a. In this case, by changing the size of the heat conductive films 3 and 3a according to the power consumption, heat can be radiated according to the difference in the amount of heat generated by each chip LED, improving the heat radiation efficiency of the entire device. Can be made.

  Further, a plurality of heat conducting portions 3 may be provided for each individual chip LED as shown in FIG. 3 so as to dissipate heat from the chip LED (electronic component). As shown in FIG. 4 to FIG. A plurality of heat conducting portions 3 may be provided for each group of chip LEDs divided into groups to radiate heat from the chip LEDs (electronic components). It becomes possible to efficiently dissipate heat from the individual chip LEDs or the chip LEDs of each group. In addition, it becomes possible to prevent the curvature or bending of a board | substrate by the thermal conduction part 3 being spaced apart independently. The grouping method of the chip LEDs (electronic components) is not limited to the above embodiment, and can be appropriately changed depending on the shape of the substrate, the arrangement of the LEDs, and the like.

  As described above, in the present invention, heat generated in the chip LED can be radiated to suppress a temperature rise, and warpage or bending of the substrate due to heat generated by the chip LED can be prevented.

  In the above-described embodiment, the shape of the heat conductive film is rectangular. However, the shape is not limited to this, and various shapes such as a U-shape, an L-shape, a circular shape, a curved shape, and a bent shape are available. Can take the form of Further, the area of the heat conductive film may be equal to the area of the mounting area of the chip LED.

  Further, the region where the heat conductive film is provided may not include the entire region (mounting region) where the chip LEDs facing each other across the substrate are mounted, and heat dissipation is performed as long as at least a part of the mounting region is included. The effect is obtained. Furthermore, even if the heat conductive film is not separated along the mounting area, if the heat conductive film is separated into a plurality of parts, warpage or bending of the substrate caused by the difference in the thermal expansion coefficient between the substrate and the heat conducting part can be prevented. can do.

  The conductive pattern for electrically connecting the chip LED mounted on the surface of the substrate and the heat conductive film provided on the back surface of the substrate may be connected to each other by providing a through hole in the substrate. In this case, the heat generated in the chip LED is transmitted not only to the inside of the substrate but also to the heat conductive film through the through hole. However, since the heat conduction film has the same potential as the voltage applied to the chip LED (for example, a negative voltage or a ground level voltage), when the heat radiation plate is mounted in direct contact with the heat conduction film, the heat radiation plate Also, the same voltage is applied to the chassis or the case, and the chassis or the casing is in a live state. In order to avoid this, it is necessary to provide an insulating plate between the back surface of the substrate and the heat sink.

It is a top view of the board | substrate concerning this invention. It is a bottom view of the board | substrate which concerns on this invention. It is explanatory drawing which shows an example of the positional relationship of a mounting area | region and a heat conductive film. It is an external appearance perspective view of the state which attached the heat sink to the light-emitting device which concerns on this invention. It is explanatory drawing which shows the other example of the positional relationship of a mounting area | region and a heat conductive film. It is explanatory drawing which shows the other example of the positional relationship of a mounting area | region and a heat conductive film. It is explanatory drawing which shows the other example of the positional relationship of a mounting area | region and a heat conductive film. It is explanatory drawing which shows the other example of the positional relationship of a mounting area | region and a heat conductive film.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Board | substrate 2, 2a Mounting area 3, 3a Thermal conductive film 4 Heat sink 5 Mounting hole 6 Conductive pattern 7 Fixing hole

Claims (6)

Ri Na plurality of electronic components mounted on one surface, such as LED, the substrate that is mounted on a plate-shaped radiator plate,
On the other surface of the substrate, the electronic component by the and / or by heat transfer the heat from the electronic component for each group formed by dividing the electronic component into a plurality of groups on the heat radiating plate, the said entire substrate A substrate comprising a plurality of heat conducting portions which are supported by a heat sink and which prevent bending of the substrate caused by a difference in expansion amount due to a difference in thermal expansion coefficient from the substrate. The power consumption of the plurality of electronic components is different,
The substrate according to claim 1 , wherein the size of the heat conducting portion is changed according to the power consumption . The area of the region where the heat conducting portion is provided is
The substrate according to claim 1 or 2, wherein the substrate is equal to or larger than an area of a region where the electronic component is mounted.   The substrate according to any one of claims 1 to 3, wherein the heat conducting portion is a metal film. The heat conducting part is
The substrate according to any one of claims 1 to 4, wherein the substrate is insulated from a voltage application unit of the electronic component.   An illumination device, wherein at least a plurality of semiconductor light emitting elements are mounted on the substrate according to any one of claims 1 to 5.

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