JP4969332B2 - Substrate and lighting device - Google Patents

Substrate and lighting device Download PDF

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JP4969332B2
JP4969332B2 JP2007161814A JP2007161814A JP4969332B2 JP 4969332 B2 JP4969332 B2 JP 4969332B2 JP 2007161814 A JP2007161814 A JP 2007161814A JP 2007161814 A JP2007161814 A JP 2007161814A JP 4969332 B2 JP4969332 B2 JP 4969332B2
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substrate
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conductive film
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electronic component
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JP2009004129A (en
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信也 境田
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シャープ株式会社
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本発明は、発光ダイオード(以下、LEDと記す)等の電子部品を装着するための基板及び該基板に前記電子部品としてLEDを実装した照明装置に関する。   The present invention relates to a substrate on which an electronic component such as a light emitting diode (hereinafter referred to as LED) is mounted, and a lighting device in which the LED is mounted on the substrate.
従来、照明器具又は表示装置等の光源として蛍光灯又は白熱灯などが使用されている。一方で、従来の光源に比べて、寿命が長く、かつ消費電力も少ないという特徴を備えた発光ダイオードを照明用又は表示用の光源として使用するための技術開発が行われている。   Conventionally, a fluorescent lamp or an incandescent lamp is used as a light source for a lighting fixture or a display device. On the other hand, technical development for using a light-emitting diode having features of longer life and lower power consumption as a light source for illumination or display than a conventional light source has been performed.
例えば、基板上に多数のLEDチップを配置したカード型LED照明光源が開示されている(特許文献1参照)。
特開2003−124528号公報
For example, a card-type LED illumination light source in which a large number of LED chips are arranged on a substrate is disclosed (see Patent Document 1).
JP 2003-124528 A
しかしながら、特許文献1の装置のように、基板上に多数のLEDチップ(半導体発光素子)を実装した場合、半導体発光素子で生じる発熱量が全体として大きくなる。特に照明用又は表示用の光源として用いる場合には、明るさを均一に保つために、それぞれの半導体発光素子を比較的密に配置する必要があり、半導体発光素子で生じる熱をいかに放熱するかが問題となる。   However, when a large number of LED chips (semiconductor light-emitting elements) are mounted on a substrate as in the apparatus of Patent Document 1, the amount of heat generated by the semiconductor light-emitting elements increases as a whole. Especially when used as a light source for illumination or display, in order to keep the brightness uniform, it is necessary to arrange the semiconductor light emitting elements relatively densely, and how to dissipate the heat generated in the semiconductor light emitting elements. Is a problem.
本発明は斯かる事情に鑑みてなされたものであり、装着されるLED等の電子部品で生じる熱を放熱して温度上昇を抑制することができる基板及び該基板に半導体発光素子を複数装着した照明装置を提供することを目的とする。   The present invention has been made in view of such circumstances, and a substrate capable of dissipating heat generated by electronic components such as LEDs to be mounted to suppress a temperature rise, and a plurality of semiconductor light emitting elements are mounted on the substrate. An object is to provide a lighting device.
本発明に係る基板は、LED等の複数の電子部品を一方の面に装着してなり、板状の放熱板に取り付けられる基板において、該基板の他方の面に、前記電子部品ごとに及び/若しくは前記電子部品を複数のグループに分けてなるグループごとに前記電子部品からの熱を前記放熱板に伝熱し、前記基板全体を前記放熱板で支持し、該基板との熱膨張率の違いによる膨張量の差で生じる該基板の曲がりを防止する複数の熱伝導部を独立して備えることを特徴とする。 Substrate according to the present invention, Ri Na by mounting a plurality of electronic components such as an LED on one side, the substrate that is mounted on a plate-shaped radiator plate, the other surface of the substrate, for each of the electronic component and / or the electronic component was heat-transfer the heat from the electronic component for each group consisting in a plurality of groups on the heat dissipation plate, supporting the entire substrate with the heat dissipation plate, the thermal expansion coefficient between the substrate And a plurality of heat conducting portions for preventing the bending of the substrate caused by the difference in the expansion amount due to the difference between the two .
本発明にあっては、基板の一方の面に実装されたLED等の複数の電子部品で生じた熱は、基板の表面から基板内部を通じて基板の他方の面に伝導し、裏面に設けられた熱伝導体を通じて基板外部へ放熱される。電子部品ごとに及び/若しくは電子部品を複数のグループに分けてなるグループごとに電子部品からの熱を伝熱するための熱伝導部を備えており、熱伝導部に伝導し易くなり、放熱効果が増大して基板の温度上昇を抑制することができる。
また、基板の熱膨張率と熱伝導部の熱膨張率の違いによる膨張量の差で生ずる基板の曲がりを抑えることが可能となる
また、基板全体を放熱板で支持することができ、基板の曲がりなどを防止できる
In the present invention, heat generated in a plurality of electronic components such as LEDs mounted on one surface of the substrate is conducted from the front surface of the substrate through the inside of the substrate to the other surface of the substrate and provided on the back surface. Heat is radiated to the outside through the heat conductor. It is equipped with a heat conduction part for transferring heat from the electronic component for each electronic component and / or for each group obtained by dividing the electronic part into a plurality of groups. Increases, and the temperature rise of the substrate can be suppressed.
In addition, it is possible to suppress the bending of the substrate caused by the difference in the expansion amount due to the difference between the thermal expansion coefficient of the substrate and the thermal expansion coefficient of the heat conducting portion .
Moreover, the whole board | substrate can be supported by a heat sink, and the bending of a board | substrate etc. can be prevented .
本発明に係る基板は、前記複数の電子部品の消費電力は異なり、消費電力の大小に応じて、前記熱伝導部の大きさを変えてあることを特徴とする。 Substrate according to the present invention, unlike the power consumption of the plurality of electronic components, in accordance with the magnitude of the power consumption, characterized in that are changing the size of the heat-conducting portion.
本発明にあっては、異なる消費電力の電子部品が基板に実装される場合、消費電力の大小に応じて、熱伝導部の大きさを変えることにより、電子部品個々の発熱量の違いに応じた放熱を行うことができ、装置全体として放熱効率を向上させることができるIn the present invention, when electronic components with different power consumption are mounted on the substrate, the size of the heat conduction part is changed according to the power consumption, thereby responding to the difference in the amount of heat generated by each electronic component. The heat radiation efficiency can be improved as a whole device .
本発明に係る基板は、前記熱伝導部が設けられる領域の面積は、前記電子部品が装着される領域の面積と同等以上であることを特徴とする。   The substrate according to the present invention is characterized in that an area of the region where the heat conducting unit is provided is equal to or larger than an area of the region where the electronic component is mounted.
本発明にあっては、複数の電子部品の実装領域を含む範囲に対峙するように、その範囲の面積以上の面積を有する熱伝導部を設けることで、基板全体に対する熱伝導部の面積を大きくすることができ、放熱効果をさらに向上させることができる。これにより、電子部品で生じた熱を、その電子部品の実装領域に基板を挟んで対向して設けられた熱伝導部から外部へ放熱することができ、基板表面に実装される電子部品それぞれの温度上昇をさらに抑制することができる。例えば、1つの電子部品の実装領域に対向するように実装領域の面積以上の面積を有する熱伝導部を設けることができる。   In the present invention, the area of the heat conducting portion relative to the entire substrate is increased by providing a heat conducting portion having an area equal to or larger than the area of the range so as to face the range including the mounting region of the plurality of electronic components. This can further improve the heat dissipation effect. As a result, the heat generated in the electronic component can be dissipated to the outside from the heat conducting portion provided opposite to the mounting area of the electronic component across the substrate, and each electronic component mounted on the substrate surface can be dissipated. The temperature rise can be further suppressed. For example, a heat conduction part having an area larger than the area of the mounting region can be provided so as to face the mounting region of one electronic component.
本発明に係る基板は、前記熱伝導部は、金属膜であることを特徴とする。   The substrate according to the present invention is characterized in that the heat conducting portion is a metal film.
本発明にあっては、熱伝導率のよい金属を放熱に用いることにより、効果的に放熱が可能となる。   In the present invention, it is possible to effectively radiate heat by using a metal having good thermal conductivity for radiating heat.
本発明に係る基板は、前記熱伝導部は、前記電子部品の電圧印加部に対して絶縁してあることを特徴とする。   The substrate according to the present invention is characterized in that the heat conducting portion is insulated from the voltage application portion of the electronic component.
本発明にあっては、例えば、金属製の放熱板を熱伝導膜に密接させて装着することができ、基板と放熱板との間に絶縁板を設ける必要がなく、構造が簡単になるとともに、さらに放熱効果を向上させることができる。   In the present invention, for example, a metal heat radiating plate can be mounted in close contact with the heat conducting film, and there is no need to provide an insulating plate between the substrate and the heat radiating plate, and the structure is simplified. Furthermore, the heat dissipation effect can be improved.
本発明に係る照明装置は、前述のいずれか1つの発明に係る基板に少なくとも半導体発光素子を複数実装してあることを特徴とする。   The lighting device according to the present invention is characterized in that at least a plurality of semiconductor light emitting elements are mounted on the substrate according to any one of the above-described inventions.
本発明にあっては、放熱効果に優れた照明装置を提供することができる。   In this invention, the illuminating device excellent in the heat dissipation effect can be provided.
本発明にあっては、半導体発光素子で生じる熱を放熱して温度上昇を抑制することができるとともに、半導体発光素子の発熱による基板の撓みを防止することができる。   In the present invention, the heat generated in the semiconductor light emitting element can be dissipated to suppress the temperature rise, and the substrate can be prevented from being bent due to the heat generated by the semiconductor light emitting element.
また、本発明にあっては、基板全体に対する熱伝導膜の面積を大きくすることができ、発熱による基板の撓みを防止しつつ、放熱効果をさらに向上させることができる。   In the present invention, the area of the heat conductive film with respect to the entire substrate can be increased, and the heat dissipation effect can be further improved while preventing the substrate from being bent due to heat generation.
また、本発明にあっては、金属製の放熱板を熱伝導膜に密接させて装着することができ、構造が簡単になり、かつ放熱効果を一層向上させることができる。   Moreover, in this invention, a metal heat sink can be attached in close contact with the heat conductive film, the structure is simplified, and the heat dissipation effect can be further improved.
また、本発明にあっては、放熱効果に優れた照明装置を提供することができる。   Moreover, in this invention, the illuminating device excellent in the heat dissipation effect can be provided.
以下、本発明をその実施の形態を示す図面に基づいて説明する。図1は本発明に係る基板の平面図であり、図2は本発明に係る基板の底面図である。図1及び図2において、1は基板である。図1はチップLEDが表面実装される基板1の表面を示し、図2は基板1の裏面を示す。   Hereinafter, the present invention will be described with reference to the drawings illustrating embodiments thereof. FIG. 1 is a plan view of a substrate according to the present invention, and FIG. 2 is a bottom view of the substrate according to the present invention. 1 and 2, reference numeral 1 denotes a substrate. FIG. 1 shows the surface of the substrate 1 on which the chip LEDs are surface-mounted, and FIG. 2 shows the back surface of the substrate 1.
基板1は、例えば、矩形状であって、適長の長さ寸法、幅寸法を有している。基板1の厚みは、通常の基板に比較して薄く、例えば、1mm程度である。後述するように、基板1の厚みを薄くすることで、表面に多数実装(装着)されるチップLED(例えば、白色LED)で生じる熱を基板1の裏面に伝導し易くすることができる。なお、基板1の形状は、一例であって、これに限定されるものではなく、円形状、多角形状など用途に応じて適宜設定することができる。   The board | substrate 1 is rectangular shape, for example, Comprising: The length dimension of a suitable length and a width dimension are provided. The thickness of the board | substrate 1 is thin compared with a normal board | substrate, for example, is about 1 mm. As will be described later, by reducing the thickness of the substrate 1, it is possible to easily conduct heat generated in chip LEDs (for example, white LEDs) mounted (mounted) on the surface to the back surface of the substrate 1. In addition, the shape of the board | substrate 1 is an example, Comprising: It is not limited to this, It can set suitably according to uses, such as circular shape and polygonal shape.
基板1の材質は、例えば、ガラス繊維を切りそろえたマット状のものに、エポキシ樹脂を滲みこませたガラスコンポジット基板である。なお、基板1の材質は、これに限定されるものではなく、ガラスエポキシ基板、ガラスポリイミド基板、紙エポキシ基板、紙フェノール基板などを用途、使用条件等に合わせて用いることができる。   The material of the substrate 1 is, for example, a glass composite substrate in which an epoxy resin is impregnated into a mat-like material obtained by cutting glass fibers. In addition, the material of the board | substrate 1 is not limited to this, A glass epoxy board | substrate, a glass polyimide board | substrate, a paper epoxy board | substrate, a paper phenol board | substrate etc. can be used according to a use, use conditions, etc.
図1に示すように、基板1の表面には、多数のチップLED(不図示)を表面実装することができ、各チップLEDの実装領域2、…が所要の離隔寸法で配置されている。実装領域2は、基板1表面にチップLEDを実装した場合、チップLEDと基板1とが当接する領域に相当するものである。例えば、LEDチップが長方体の形状の場合には、実装領域2の面積は、チップLEDの形状寸法のうち、基板に接する面の縦及び横寸法の積算で決まる面積に相当するものである。すなわち、実装領域2は、チップLEDが装着され占有される領域である。なお、チップLEDの実装領域2、…の配置は一例であって、これに限定されるものではない。   As shown in FIG. 1, a large number of chip LEDs (not shown) can be surface-mounted on the surface of the substrate 1, and the mounting regions 2 of the chip LEDs are arranged with a required separation dimension. The mounting region 2 corresponds to a region where the chip LED and the substrate 1 abut when the chip LED is mounted on the surface of the substrate 1. For example, when the LED chip has a rectangular shape, the area of the mounting region 2 corresponds to the area determined by the integration of the vertical and horizontal dimensions of the surface in contact with the substrate among the shape dimensions of the chip LED. . That is, the mounting area 2 is an area where the chip LED is mounted and occupied. In addition, arrangement | positioning of the mounting area | region 2, ... of chip LED is an example, Comprising: It is not limited to this.
図2に示すように、基板1の裏面は、チップLEDで生じる熱を基板1の外部へ逃がすための放熱用の熱伝導部として金属の熱伝導膜3、…を所要の離隔寸法を有して複数設けている。熱伝導膜3、…は、例えば、基板1の裏面の全面に形成された銅箔をパターンニングすることにより形成することができる。また、基板1の裏面に銅のパターンを成膜することで熱伝導膜を形成してもよい。なお、熱伝導膜3は、銅に限定されるものではなく、熱伝導特性に優れたものであれば、アルミニウムなどの他の金属膜でもよい。熱伝導膜3を基板1の裏面全体に均一に設けるのではなく、所要の離隔寸法で離隔して設けることにより、チップLEDで生じる熱による温度上昇で、基板1の熱膨張率と熱伝導膜3(例えば、銅)の熱膨張率の違いによる膨張量の差で生ずる基板1の反り又は撓みなどを抑えることが可能となる。   As shown in FIG. 2, the back surface of the substrate 1 has a required separation dimension with a metal heat conductive film 3,... As a heat conducting portion for radiating heat generated by the chip LED to the outside of the substrate 1. There are several. The heat conductive films 3 can be formed, for example, by patterning a copper foil formed on the entire back surface of the substrate 1. Alternatively, a heat conductive film may be formed by forming a copper pattern on the back surface of the substrate 1. The heat conductive film 3 is not limited to copper, and may be another metal film such as aluminum as long as it has excellent heat conduction characteristics. The thermal expansion coefficient of the substrate 1 and the thermal conductive film are increased by the temperature rise caused by the heat generated in the chip LED by providing the thermal conductive film 3 uniformly on the entire back surface of the substrate 1 instead of being provided with a required separation dimension. It is possible to suppress warping or bending of the substrate 1 caused by a difference in expansion amount due to a difference in thermal expansion coefficient of 3 (for example, copper).
また、熱伝導膜3、…は、チップLEDに供給される電圧とは電気的に絶縁されている。例えば、チップLEDを半田付けする導電パターン、あるいは電圧供給用のリード線などから電気的に絶縁してある。これにより、基板1の裏面に後述する放熱板を密着させて装着した場合であっても、基板1と放熱板との間に絶縁板を設ける必要がなく、構造が簡単になるとともに、熱伝導膜3に伝導した熱をさらに放熱板で外部へ放散させることができ、放熱効果を一層向上させることができる。   Further, the heat conductive films 3 are electrically insulated from the voltage supplied to the chip LED. For example, it is electrically insulated from a conductive pattern for soldering the chip LED or a lead wire for supplying voltage. Thus, even when a heat sink, which will be described later, is attached to the back surface of the substrate 1, there is no need to provide an insulating plate between the substrate 1 and the heat sink, the structure is simplified, and heat conduction is achieved. The heat conducted to the film 3 can be further dissipated to the outside by the heat dissipation plate, and the heat dissipation effect can be further improved.
基板1の四隅には、放熱板を取り付けるための取り付け穴5を設けてある。また、基板1の両端部には、チップLEDに所要の電圧を供給するためのリード線又はコネクタ等の電気接続用の導電性パターン6を形成してある。また、基板1の中央部には、基板1をシャーシ又は筐体などに固定するための固定穴7を設けてある。   At the four corners of the substrate 1, mounting holes 5 for mounting the heat sink are provided. In addition, conductive patterns 6 for electrical connection such as lead wires or connectors for supplying a required voltage to the chip LED are formed at both ends of the substrate 1. Further, a fixing hole 7 for fixing the substrate 1 to a chassis or a housing is provided at the center of the substrate 1.
図3は実装領域2と熱伝導膜3の位置関係の一例を示す説明図である。図3に示すように、各熱伝導膜3は、チップLEDの各実装領域2の位置に対応して配置してある。より具体的には、熱伝導膜3が設けられる領域の面積は、実装領域2の面積より大きく、かつ実装領域2を包含するように配置している。これにより、それぞれのチップLEDで生じた熱は、そのチップLEDの実装領域2から基板1内部を通じて直下の熱伝導膜3に伝導し易くなり、放熱効果が増大して個々のチップLEDの温度上昇を抑制することができる。   FIG. 3 is an explanatory diagram showing an example of the positional relationship between the mounting region 2 and the heat conductive film 3. As shown in FIG. 3, each heat conductive film 3 is arrange | positioned corresponding to the position of each mounting area | region 2 of chip | tip LED. More specifically, the area of the region where the heat conductive film 3 is provided is larger than the area of the mounting region 2 and is disposed so as to include the mounting region 2. As a result, heat generated in each chip LED is easily conducted from the mounting area 2 of the chip LED to the heat conduction film 3 directly below the substrate 1, and the heat dissipation effect is increased to increase the temperature of each chip LED. Can be suppressed.
また、熱伝導膜3の面積を実装領域2の面積より大きくしているため、放熱の効率を向上させることができ、それぞれのチップLEDで生じた熱を熱伝導膜3から外部へ放熱することができ、個々のチップLEDそれぞれの温度上昇をさらに抑制することができる。   Moreover, since the area of the heat conductive film 3 is larger than the area of the mounting region 2, the efficiency of heat dissipation can be improved, and the heat generated in each chip LED can be dissipated from the heat conductive film 3 to the outside. Thus, the temperature rise of each individual chip LED can be further suppressed.
図4は本発明に係る発光装置に放熱板を取り付けた状態の外観斜視図である。本発明の発光装置は、上述の基板1に多数のチップLEDを表面実装したものである。なお、図4では、基板1の表面に実装したチップLEDは省略している。また、基板1に多数のチップLEDを表面実装した発光装置に放熱板を取り付け、それをシャーシに装着、あるいは筐体に組み込むことにより本発明に係る照明装置を構成することができる。この場合、照明装置の大きさ、形状等に応じて、1又は複数の基板1を内蔵することができる。   FIG. 4 is an external perspective view of the light emitting device according to the present invention with a heat sink attached. The light emitting device of the present invention is obtained by surface mounting a large number of chip LEDs on the substrate 1 described above. In FIG. 4, the chip LED mounted on the surface of the substrate 1 is omitted. Moreover, the illuminating device according to the present invention can be configured by attaching a heat radiating plate to a light emitting device in which a large number of chip LEDs are surface-mounted on the substrate 1 and mounting the heat radiating plate on the chassis or incorporating it into the housing. In this case, one or a plurality of substrates 1 can be incorporated depending on the size, shape, etc. of the lighting device.
図4において、4は放熱板である。放熱板4は、例えば、アルミニウム製の薄板であり、その形状は基板1の形状に応じて適宜設定することができる。なお、放熱板4の材質は、アルミニウムに限定されるものではなく、他の熱伝導効率の良い金属を用いることもできる。また、図4の例では、放熱板4に1枚の基板1を装着しているが、複数枚の基板1を装着する構成であってもよい。また、基板1と放熱板4との間の密着性を高めて放熱性を向上させるためにグリスを塗布してもよい。   In FIG. 4, 4 is a heat sink. The heat radiating plate 4 is a thin plate made of aluminum, for example, and the shape thereof can be appropriately set according to the shape of the substrate 1. In addition, the material of the heat sink 4 is not limited to aluminum, The other metal with good heat conduction efficiency can also be used. In the example of FIG. 4, one substrate 1 is mounted on the heat radiating plate 4, but a configuration in which a plurality of substrates 1 are mounted may be used. Further, grease may be applied to improve the heat dissipation by improving the adhesion between the substrate 1 and the heat sink 4.
本発明の発光装置は、熱伝導膜3が電気的に絶縁されているため、基板1の裏面と放熱板4とをその全面においてお互いに密着させることができ、チップLEDで生じた熱を熱伝導膜3、…、放熱板4を通じて空中に放散することができる。また、基板1は放熱板4と全面で密着する構成であるため、基板1全体を放熱板4で支持することができ、基板1の曲がりなどを防止できる。これにより、基板1の厚みを1mm程度若しくは1mm以下にすることができ、さらに放熱効率を向上させることができる。   In the light emitting device of the present invention, since the heat conductive film 3 is electrically insulated, the back surface of the substrate 1 and the heat radiating plate 4 can be brought into close contact with each other over the entire surface, and the heat generated in the chip LED is heated. It can be diffused into the air through the conductive film 3,. Moreover, since the board | substrate 1 is the structure closely_contact | adhered with the heat sink 4 on the whole surface, the board | substrate 1 whole can be supported by the heat sink 4, and the bending | flexion etc. of the board | substrate 1 can be prevented. Thereby, the thickness of the board | substrate 1 can be about 1 mm or 1 mm or less, and also heat dissipation efficiency can be improved.
基板1の表面には、チップLEDだけでなく、表面実装型の抵抗素子等の電子部品を実装することもできる。また、チップLEDが実装された基板1の表面には、チップLEDとその近傍を除く基板1の表面に白色のレジスト膜を形成することができる。これにより、チップLEDから放出される光がレジスト膜で反射され、基板1表面から見た場合に白色の発光を全体として均一にすることができる。   On the surface of the substrate 1, not only chip LEDs but also electronic components such as surface-mounted resistance elements can be mounted. A white resist film can be formed on the surface of the substrate 1 excluding the chip LED and the vicinity thereof on the surface of the substrate 1 on which the chip LED is mounted. Thereby, the light emitted from the chip LED is reflected by the resist film, and white light emission can be made uniform as a whole when viewed from the surface of the substrate 1.
熱伝導膜3、…で構成されるパターンは、上述の例に限定されるものではない。すなわち、図3では、1つの実装領域2に対応して1つの熱伝導膜3を配置する構成であったが、複数の実装領域2、…に対応して1つの熱伝導膜3を配置することも可能である。   The pattern composed of the heat conductive films 3 is not limited to the above example. That is, in FIG. 3, one heat conductive film 3 is arranged corresponding to one mounting region 2, but one heat conductive film 3 is arranged corresponding to a plurality of mounting regions 2. It is also possible.
図5は実装領域2と熱伝導膜3の位置関係の他の例を示す説明図である。図5の例では、基板1の長さ方向及び幅方向に隣接する4つの実装領域2、…に対応して1つの熱伝導膜3を配置している。熱伝導膜3の面積は、実装領域2、…の面積より大きく、かつ実装領域2、…の範囲を包含するように配置している。これにより、それぞれのチップLEDで生じた熱は、そのチップLEDの実装領域2、…から基板1内部を通じて直下の熱伝導膜3に伝導し易くなり、放熱効果が増大して個々のチップLEDの温度上昇を抑制することができる。また、1つの実装領域2に対応して1つの熱伝導膜3を配置する場合に比べて、熱伝導膜3の面積を大きくすることができ、放熱効率をさらに向上させることができる。   FIG. 5 is an explanatory diagram showing another example of the positional relationship between the mounting region 2 and the heat conductive film 3. In the example of FIG. 5, one heat conductive film 3 is arranged corresponding to four mounting regions 2,... Adjacent to the substrate 1 in the length direction and width direction. The area of the heat conductive film 3 is larger than the area of the mounting region 2... And includes the range of the mounting region 2. As a result, the heat generated in each chip LED is easily conducted from the mounting area 2 of the chip LED to the thermal conductive film 3 directly below the inside of the substrate 1, and the heat dissipation effect is increased to increase the individual chip LED's. Temperature rise can be suppressed. In addition, the area of the heat conductive film 3 can be increased as compared with the case where one heat conductive film 3 is disposed corresponding to one mounting region 2, and the heat dissipation efficiency can be further improved.
図6は実装領域2と熱伝導膜3の位置関係の他の例を示す説明図である。図6の例では、基板1の幅方向に隣接する4つの実装領域2、…に対応して1つの熱伝導膜3を配置している。この場合も、図5の例と同様に、熱伝導膜3の面積を大きくすることができ、放熱効率をさらに向上させることができる。   FIG. 6 is an explanatory view showing another example of the positional relationship between the mounting region 2 and the heat conductive film 3. In the example of FIG. 6, one heat conductive film 3 is arranged corresponding to four mounting regions 2 adjacent to the width direction of the substrate 1. Also in this case, similarly to the example of FIG. 5, the area of the heat conductive film 3 can be increased, and the heat dissipation efficiency can be further improved.
図7は実装領域2と熱伝導膜3の位置関係の他の例を示す説明図である。図7の例では、基板1の長さ方向に隣接する4つの実装領域2、…に対応して1つの熱伝導膜3を配置している。この場合も、図5の例と同様に、熱伝導膜3の面積を大きくすることができ、放熱効率をさらに向上させることができる。   FIG. 7 is an explanatory diagram showing another example of the positional relationship between the mounting region 2 and the heat conductive film 3. In the example of FIG. 7, one heat conductive film 3 is arranged corresponding to four mounting regions 2,... Adjacent in the length direction of the substrate 1. Also in this case, similarly to the example of FIG. 5, the area of the heat conductive film 3 can be increased, and the heat dissipation efficiency can be further improved.
図8は実装領域2と熱伝導膜3の位置関係の他の例を示す説明図である。図8の例では、例えば、用途、使用条件等により異なる消費電力のチップLEDが基板1に実装されるような場合を示す。図8では、実装領域2には消費電力が小さいチップLEDを実装し、実装領域2aには消費電力が大きいチップLEDを実装する。この場合、消費電力の大小に応じて、熱伝導膜3、3aの大きさを変えることにより、チップLED個々の発熱量の違いに応じた放熱を行うことができ、装置全体として放熱効率を向上させることができる。   FIG. 8 is an explanatory diagram showing another example of the positional relationship between the mounting region 2 and the heat conductive film 3. In the example of FIG. 8, for example, a case where a chip LED with different power consumption is mounted on the substrate 1 depending on the application, use conditions, and the like is shown. In FIG. 8, a chip LED with low power consumption is mounted in the mounting area 2, and a chip LED with high power consumption is mounted in the mounting area 2a. In this case, by changing the size of the heat conductive films 3 and 3a according to the power consumption, heat can be radiated according to the difference in the amount of heat generated by each chip LED, improving the heat radiation efficiency of the entire device. Can be made.
また、図3のように個々のチップLEDごとに複数の熱伝導部3を設けて、チップLED(電子部品)からの熱を放熱するようにしてもよく、図4から図7のようにグループに分けられたチップLEDをグループごとに複数の熱伝導部3を設けて、チップLED(電子部品)からの熱を放熱するようにしてもよい。個々のチップLED又はグループごとのチップLEDからの熱を効率的に放熱することが可能となる。なお、熱伝導部3は、独立して離隔していることにより、基板の反り又は撓みを防止することが可能となる。また、チップLED(電子部品)のグループの分け方は、上記実施の形態に限定されることなく、基板の形状やLEDの配置等により、適宜変更することが可能である。   Further, a plurality of heat conducting portions 3 may be provided for each individual chip LED as shown in FIG. 3 so as to dissipate heat from the chip LED (electronic component). As shown in FIG. 4 to FIG. A plurality of heat conducting portions 3 may be provided for each group of chip LEDs divided into groups to radiate heat from the chip LEDs (electronic components). It becomes possible to efficiently dissipate heat from the individual chip LEDs or the chip LEDs of each group. In addition, it becomes possible to prevent the curvature or bending of a board | substrate by the thermal conduction part 3 being spaced apart independently. The grouping method of the chip LEDs (electronic components) is not limited to the above embodiment, and can be appropriately changed depending on the shape of the substrate, the arrangement of the LEDs, and the like.
以上説明したように、本発明にあっては、チップLEDで生じる熱を放熱して温度上昇を抑制することができるとともに、チップLEDの発熱による基板の反り又は撓みを防止することができる。   As described above, in the present invention, heat generated in the chip LED can be radiated to suppress a temperature rise, and warpage or bending of the substrate due to heat generated by the chip LED can be prevented.
上述の実施の形態では、熱伝導膜の形状は矩形状であったが、形状はこれに限定されるものではなく、コの字状、L字状、円形状、湾曲状、屈曲状など種々の形状を取り得る。また、熱伝導膜の面積は、チップLEDの実装領域の面積と同等であってもよい。   In the above-described embodiment, the shape of the heat conductive film is rectangular. However, the shape is not limited to this, and various shapes such as a U-shape, an L-shape, a circular shape, a curved shape, and a bent shape are available. Can take the form of Further, the area of the heat conductive film may be equal to the area of the mounting area of the chip LED.
また、熱伝導膜が設けられる領域は、基板を挟んで対向するチップLEDが装着される領域(実装領域)を全て包含していなくてもよく、少なくとも一部の実装領域を含んでいれば放熱効果は得られる。さらに、実装領域に沿って熱伝導膜が離隔されていなくても、熱伝導膜が複数に離隔されていれば、基板と熱伝導部の熱膨張率の違いにより生じる基板の反り又は撓みを防止することができる。   Further, the region where the heat conductive film is provided may not include the entire region (mounting region) where the chip LEDs facing each other across the substrate are mounted, and heat dissipation is performed as long as at least a part of the mounting region is included. The effect is obtained. Furthermore, even if the heat conductive film is not separated along the mounting area, if the heat conductive film is separated into a plurality of parts, warpage or bending of the substrate caused by the difference in the thermal expansion coefficient between the substrate and the heat conducting part can be prevented. can do.
基板の表面に実装したチップLEDを電気的に接続する導電性パターンと基板の裏面に設けた熱伝導膜とを基板にスルーホールを設けて相互に接続してもよい。この場合には、チップLEDで生じた熱が基板内部だけでなく、スルーホールを通じて熱伝導膜に伝わることになる。しかし、熱伝導膜にはチップLEDに印加される電圧(例えば、負の電圧又は接地レベルの電圧)と同電位になるため、熱伝導膜に直接接触して放熱板を装着した場合、放熱板にも同じ電圧が印加されることになり、シャーシ又は筐体が活電状態となる。これを避けるためには、基板裏面と放熱板との間に絶縁板を設ける必要がある。   The conductive pattern for electrically connecting the chip LED mounted on the surface of the substrate and the heat conductive film provided on the back surface of the substrate may be connected to each other by providing a through hole in the substrate. In this case, the heat generated in the chip LED is transmitted not only to the inside of the substrate but also to the heat conductive film through the through hole. However, since the heat conduction film has the same potential as the voltage applied to the chip LED (for example, a negative voltage or a ground level voltage), when the heat radiation plate is mounted in direct contact with the heat conduction film, the heat radiation plate Also, the same voltage is applied to the chassis or the case, and the chassis or the casing is in a live state. In order to avoid this, it is necessary to provide an insulating plate between the back surface of the substrate and the heat sink.
本発明に係る基板の平面図である。It is a top view of the board | substrate concerning this invention. 本発明に係る基板の底面図である。It is a bottom view of the board | substrate which concerns on this invention. 実装領域と熱伝導膜の位置関係の一例を示す説明図である。It is explanatory drawing which shows an example of the positional relationship of a mounting area | region and a heat conductive film. 本発明に係る発光装置に放熱板を取り付けた状態の外観斜視図である。It is an external appearance perspective view of the state which attached the heat sink to the light-emitting device which concerns on this invention. 実装領域と熱伝導膜の位置関係の他の例を示す説明図である。It is explanatory drawing which shows the other example of the positional relationship of a mounting area | region and a heat conductive film. 実装領域と熱伝導膜の位置関係の他の例を示す説明図である。It is explanatory drawing which shows the other example of the positional relationship of a mounting area | region and a heat conductive film. 実装領域と熱伝導膜の位置関係の他の例を示す説明図である。It is explanatory drawing which shows the other example of the positional relationship of a mounting area | region and a heat conductive film. 実装領域と熱伝導膜の位置関係の他の例を示す説明図である。It is explanatory drawing which shows the other example of the positional relationship of a mounting area | region and a heat conductive film.
符号の説明Explanation of symbols
1 基板
2、2a 実装領域
3、3a 熱伝導膜
4 放熱板
5 取り付け穴
6 導電性パターン
7 固定穴
DESCRIPTION OF SYMBOLS 1 Board | substrate 2, 2a Mounting area 3, 3a Thermal conductive film 4 Heat sink 5 Mounting hole 6 Conductive pattern 7 Fixing hole

Claims (6)

  1. LED等の複数の電子部品を一方の面に装着してなり、板状の放熱板に取り付けられる基板において、
    該基板の他方の面に、前記電子部品ごとに及び/若しくは前記電子部品を複数のグループに分けてなるグループごとに前記電子部品からの熱を前記放熱板に伝熱し、前記基板全体を前記放熱板で支持し、該基板との熱膨張率の違いによる膨張量の差で生じる該基板の曲がりを防止する複数の熱伝導部を独立して備えることを特徴とする基板。
    Ri Na plurality of electronic components mounted on one surface, such as LED, the substrate that is mounted on a plate-shaped radiator plate,
    On the other surface of the substrate, the electronic component by the and / or by heat transfer the heat from the electronic component for each group formed by dividing the electronic component into a plurality of groups on the heat radiating plate, the said entire substrate A substrate comprising a plurality of heat conducting portions which are supported by a heat sink and which prevent bending of the substrate caused by a difference in expansion amount due to a difference in thermal expansion coefficient from the substrate.
  2. 前記複数の電子部品の消費電力は異なり、
    消費電力の大小に応じて、前記熱伝導部の大きさを変えてあることを特徴とする請求項1に記載の基板。
    The power consumption of the plurality of electronic components is different,
    The substrate according to claim 1 , wherein the size of the heat conducting portion is changed according to the power consumption .
  3. 前記熱伝導部が設けられる領域の面積は、
    前記電子部品が装着される領域の面積と同等以上であることを特徴とする請求項1又は請求項2に記載の基板。
    The area of the region where the heat conducting portion is provided is
    The substrate according to claim 1 or 2, wherein the substrate is equal to or larger than an area of a region where the electronic component is mounted.
  4. 前記熱伝導部は、金属膜であることを特徴とする請求項1から請求項3のいずれか一つに記載の基板。   The substrate according to any one of claims 1 to 3, wherein the heat conducting portion is a metal film.
  5. 前記熱伝導部は、
    前記電子部品の電圧印加部に対して絶縁してあることを特徴とする請求項1から請求項4のいずれか1つに記載の基板。
    The heat conducting part is
    The substrate according to any one of claims 1 to 4, wherein the substrate is insulated from a voltage application unit of the electronic component.
  6. 請求項1から請求項5までのいずれか1つに記載の基板に少なくとも半導体発光素子を複数実装してあることを特徴とする照明装置。   An illumination device, wherein at least a plurality of semiconductor light emitting elements are mounted on the substrate according to any one of claims 1 to 5.
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