WO2014030313A1

WO2014030313A1 - Light-emitting device, light source for lighting use, and lighting device

Info

Publication number: WO2014030313A1
Application number: PCT/JP2013/004781
Authority: WO
Inventors: 浩規北川; 真樹木部; 堀内　誠
Original assignee: パナソニック株式会社
Priority date: 2012-08-23
Filing date: 2013-08-07
Publication date: 2014-02-27
Also published as: JP5688553B2; JPWO2014030313A1; JP5793678B2; JP2014170947A; CN203932097U

Abstract

A light-emitting device (an LED module (10)) is equipped with: a long substrate (11); an LED element (12) that is mounted on a first main surface of the substrate (11); a first metal pattern (a wiring line (13)) that is patterned on the first main surface of the substrate (11) and is electrically connected to the LED element (12); and a second metal pattern (a metal pattern (14)) that is patterned on a second main surface, which is a surface opposed to the first main surface, of the substrate (11) and is not wired.

Description

Light emitting device, illumination light source and illumination device

The present invention relates to a light emitting device, a light source for illumination, and a lighting device, for example, a light emitting device using a light emitting diode (LED: Light Emitting Diode) and a straight tube type LED lamp using the same.

LED is expected to be a new light source in various lamps such as fluorescent lamps and incandescent lamps known from the viewpoint of high efficiency and long life, and research and development of lamps using LEDs (LED lamps) is promoted ing.

As an LED lamp, a straight tube type LED lamp (straight tube type LED lamp) replacing a straight tube fluorescent lamp having an electrode coil at both ends, or a bulb shape LED replacing a bulb fluorescent lamp or an incandescent lamp There is a lamp (bulb-shaped LED lamp) etc. For example, Patent Document 1 discloses a conventional straight tube LED lamp.

JP, 2009-043447, A

The straight tube type LED lamp is constituted of, for example, an elongated case, a pair of caps provided at both ends of the case, and an LED module housed in the case. The LED module includes a substrate (mounting substrate) and a plurality of LED elements mounted on the substrate.

In recent years, along with the lengthening of LED modules, it has been studied to use a long substrate as a substrate for mounting LED elements. However, when a long substrate is used, the substrate is warped, and there is a problem that a desired light distribution characteristic can not be obtained. In particular, it has been found that when a double-sided substrate in which metal is formed on both sides of a resin substrate is used as the substrate, the substrate is largely warped.

The present invention has been made to solve such a problem, and has a first object to provide a light emitting device, a light source for illumination, and a lighting device capable of suppressing the warp of a substrate.

In addition, although the plurality of LED elements in the LED module are manufactured to have the same characteristics, there are variations in the characteristics among the LED elements due to manufacturing variations and the like. For example, Vf (forward voltage) characteristics may be different in each LED element. In this case, if the plurality of LED elements are mounted on one substrate without being sorted out, luminance variations occur between the LED elements.

The present invention has been made to solve such a problem, and it is a second object of the present invention to provide a light emitting device, an illumination light source, and an illumination device capable of suppressing variation in luminance among a plurality of light emitting elements. To aim.

In order to achieve the first object described above, one aspect of the first light emitting device according to the present invention is a long substrate, a light emitting element mounted on a first main surface of the substrate, and the first light emitting device. A first metal pattern, which is a pattern formed on the main surface of 1 and electrically connected to the light emitting element, and a pattern on the second main surface opposite to the first main surface of the substrate And a second metal pattern which is formed and not wired.

In one aspect of the first light emitting device according to the present invention, the second metal pattern may be formed in a mesh shape.

In one aspect of the first light emitting device according to the present invention, a ratio of an area of the second metal pattern to an area of the second main surface is 60% or less, and the first main surface The ratio of the area of the first metal pattern to the area may be equal to or less than the ratio of the area of the second metal pattern to the area of the second major surface.

In one aspect of the first light emitting device according to the present invention, a ratio of an area of the second metal pattern to an area of the second main surface, and the first to the area of the first main surface. The proportion of the area of the metal pattern may be approximately the same.

In one aspect of the first light emitting device according to the present invention, the first metal pattern and the second metal pattern may be made of the same metal material.

In the first aspect of the light emitting device according to the present invention, the metal material may be copper.

Further, in one aspect of the first light emitting device according to the present invention, when the substrate is viewed in plan, the second metal pattern is at least at least the light emitting element mounted on an end of the substrate in the longitudinal direction. It may be formed so as not to overlap with a part.

Further, in one aspect of the first light emitting device according to the present invention, the second light emitting device further includes an electrode terminal that receives power for making the light emitting element emit light from the outside, and the substrate is viewed in plan. The metal pattern may be formed so as not to overlap with the electrode terminal.

In one aspect of the first light emitting device according to the present invention, further, a first resist formed on the first main surface so as to cover the first metal pattern, and the first resist And a groove formed in the second resist may not be formed on the first metal pattern.

Further, in one aspect of the first light emitting device according to the present invention, assuming that the length in the longitudinal direction of the substrate is L1 and the length in the lateral direction of the substrate is L2, L1 / L2 ≧ 38.6. It may be

Further, in one aspect of the first light emitting device according to the present invention, the substrate may be a resin substrate made of a resin.

In one embodiment of the first light emitting device according to the present invention, the light emitting device further comprises a resist formed on the first main surface so as to cover the first metal pattern, and a plurality of the light emitting elements are provided. The resist may be mounted, and the resist may be a discolored resist.

Further, in one aspect of the first light emitting device according to the present invention, the resist may be discolored from white to yellow.

Further, in one aspect of the first light emitting device according to the present invention, the resist may be discolored by heating.

In one aspect of the first light emitting device according to the present invention, the reflectance of the resist before the color change may be 90% or less. In this case, the reflectance of the resist before the color change may be 85% or more.

Further, one aspect of the first illumination light source according to the present invention is characterized by comprising any one of the above-described first light emitting devices and an elongated casing for housing the first light emitting device. Do.

Further, in one aspect of the first illumination light source according to the present invention, an elongated base housed in the housing is further provided, and the first light emitting device is disposed on the base. May be

Further, in one aspect of the first illumination light source according to the present invention, the housing is composed of an elongated translucent cover and an elongated base which constitutes a part of an envelope. The first light emitting device may be disposed on the base.

Further, one aspect of the first lighting device according to the present invention is characterized by including any one of the above-described first illumination light sources.

In order to achieve the above second object, one aspect of a second light emitting device according to the present invention comprises a substrate, a plurality of light emitting elements mounted on a first main surface of the substrate, and the first light emitting device. It has a wiring pattern formed on the main surface and electrically connected to the plurality of light emitting elements, and a resist formed on the first main surface to cover the wiring and discolored. Do.

Further, in one aspect of the second light emitting device according to the present invention, the resist may be discolored from white to yellow.

In one aspect of the second light emitting device according to the present invention, the resist may be discolored by heating.

In one aspect of the second light emitting device according to the present invention, the reflectance of the resist before the color change may be 90% or less. Furthermore, the reflectance of the resist before color change may be 85% or more.

Further, in one aspect of the second light emitting device according to the present invention, the resist is formed on the first resist formed on the first main surface so as to cover the wiring, and on the first resist. And a groove formed in the second resist may not be formed on the wiring.

Further, one aspect of the second illumination light source according to the present invention is characterized by comprising any one of the above-described second light emitting devices and a housing for housing the second light emitting devices.

Further, in one aspect of the second illumination light source according to the present invention, the case is elongated, and the plurality of light emitting elements are arranged along the longitudinal direction of the case. It is also good. Furthermore, a long base may be accommodated in the housing, and the second light emitting device may be disposed on the base.

Further, in one aspect of the second illumination light source according to the present invention, the casing is composed of an elongated translucent cover and an elongated base which constitutes a part of the envelope. The second light emitting device may be disposed on the base.

Further, one aspect of the second lighting device according to the present invention is characterized by including any one of the above-described second illumination light sources.

According to the first light emitting device, the first illumination light source, and the second illumination device according to the present invention, it is possible to suppress the warpage of the substrate on which the light emitting element is mounted.

Further, according to the second light emitting device, the first illumination light source, and the second illumination device according to the present invention, it is possible to suppress the luminance variation among the plurality of light emitting elements.

FIG. 1 is a schematic perspective view of a straight tube type LED lamp according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the straight tube type LED lamp according to the embodiment of the present invention. (A) of FIG. 3 is a plan view (front view) of the surface side of the LED module according to the embodiment of the present invention, and (b) of FIG. 3 is a plan view of the back side of the LED module (rear view) 3 (c) is a cross-sectional view of the LED module taken along line AA 'of FIG. 3 (a). (A) of FIG. 4 is a partially enlarged cross-sectional view (a cross-sectional view when cut by a plane passing through the tube axis) of the straight tube type LED lamp according to the embodiment of the present invention, and (b) of FIG. 4 is a cross-sectional view of the straight tube type LED lamp taken along line AA 'of FIG. 4 (a), and FIG. 4 (c) is a straight line taken along line BB' of FIG. 4 (a). It is a sectional view of a tube type LED lamp. FIG. 5A is a partially enlarged view of the LED module according to the first embodiment of the present invention as viewed from the second main surface side. FIG. 5B is a partially enlarged view of the LED module according to the second embodiment of the present invention as viewed from the second main surface side. FIG. 6A is a diagram for explaining the luminance variation in the case of using a conventional LED module (high reflectance resist). FIG. 6B is a view for explaining the luminance variation when the LED module (low reflectance resist) according to the embodiment of the present invention is used. (A) of FIG. 7 is a partially enlarged cross-sectional view of an LED module according to a modification of the embodiment of the present invention, and (b) of FIG. 7 is an AA 'line of (a) of FIG. It is sectional drawing of the same LED module in. FIG. 8 is a perspective view showing the configuration of the illumination device according to the embodiment of the present invention. FIG. 9 is a whole perspective view and a partially enlarged view of a straight tube type LED lamp according to a modification of the embodiment of the present invention. FIG. 10A is a view showing a first modified example of the metal pattern of the second main surface in the LED module according to the embodiment of the present invention. FIG. 10B is a view showing a second modified example of the metal pattern of the second main surface in the LED module according to the embodiment of the present invention. FIG. 11 is a view showing a third modification of the metal pattern of the second main surface in the LED module according to the embodiment of the present invention. FIG. 12 is a view showing a modification of the metal pattern of the first main surface in the LED module according to the embodiment of the present invention. FIG. 13 is a view showing an example of a substrate (before dicing) of the LED module according to the embodiment of the present invention.

Embodiment
Hereinafter, a light emitting device, an illumination light source, and an illuminating device according to an embodiment of the present invention will be described with reference to the drawings. Each of the embodiments described below shows a preferable specific example of the present invention. Therefore, numerical values, shapes, materials, components, arrangement positions and connection forms of the components, steps, order of steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the components in the following embodiments, components that are not described in the independent claims indicating the highest concept of the present invention are described as optional components.

Each drawing is a schematic view and is not necessarily strictly illustrated. Moreover, in each figure, the same code | symbol is attached | subjected about the same structural member.

In the following embodiment, a straight tube type LED lamp will be described as an example of a light source for illumination.

[Whole composition of the lamp]
First, the configuration of the straight tube LED lamp 1 according to the embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a schematic perspective view of a straight tube type LED lamp according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the straight tube type LED lamp according to the embodiment of the present invention. In addition, in FIG.1 and FIG.2, it does not show about the one part structure (the wiring 13 and the electrode terminal 15) of the LED module 10. FIG.

The straight tube type LED lamp 1 according to the present embodiment is a straight tube type LED lamp replacing the conventional straight tube type fluorescent lamp, and is, for example, a 40-type straight tube type LED lamp having a brightness of 2400 lm. is there.

As shown in FIG. 1, the straight tube type LED lamp 1 includes an LED module 10, a long case 20 housing the LED module 10, and one end of the case 20 in the longitudinal direction (tube axis direction). Power supply base (power supply side base) 30, which is a first base provided in the portion, and a non-power supply base, which is a second base provided at the other end of the casing 20 in the longitudinal direction And 40).

As shown in FIG. 2, the straight tube LED lamp 1 further includes a first base 50 and a second base 55 on which the LED module 10 is disposed, the LED module 10 and other electronic components (the LED module 10, A connector 60 for electrically connecting the lighting circuit 90), a reflecting member 70 for reflecting light emitted by the LED module 10 in a predetermined direction, and a mounting member 80 for mounting the first base 50 on the housing 20 , And a lighting circuit 90.

In the present embodiment, a single-sided feeding method in which feeding is performed from one side of only the feeding cap 30 is employed.

Hereinafter, each component of the straight tube LED lamp 1 will be described in detail with reference to FIG.

[LED module (light emitting device)]
As shown in FIG. 2, a plurality of elongated LED modules 10 are arranged along the tube axis direction of the housing 20. The plurality of LED modules 10 are arranged such that the longitudinal direction of each substrate 11 is along the longitudinal direction of the housing 20. In the present embodiment, two LED modules 10 are used.

Here, the detailed configuration of each LED module 10 will be described using FIG. 3 with reference to FIG. FIG. 3 shows the configuration of the LED module according to the embodiment of the present invention, wherein (a) is a plan view (front view) of the surface side of the LED module and (b) is the LED A plan view (rear view) of the rear side of the module (c) is a cross-sectional view of the LED module taken along line AA 'of (a).

As shown in FIG. 3, the LED module 10 is a surface mount device (SMD: Surface Mount Device) type light emitting device (light emitting module), and the substrate 11 and a first main surface which is one surface of the substrate 11 A plurality of LED elements 12 mounted on the front surface 11a, a wiring 13 formed on the first main surface 11a, and a second main surface (rear surface) 11b which is the other surface of the substrate 11 And a metal pattern 14 formed on the substrate. Furthermore, the LED module 10 includes an electrode terminal 15 and resists 16 and 17.

The substrate 11 is a mounting substrate for mounting the LED element 12. In the present embodiment, a rectangular substrate elongated in the tube axis direction of the housing 20 is used as the substrate 11. In the substrate 11, the surface on which the LED element 12 is mounted is the first main surface 11a, and the surface opposite to the first main surface 11a is the second main surface 11b. The LED element 12 is mounted only on the first main surface 11a of the substrate 11, and the LED element is not mounted on the second main surface 11b. As described later, the LED module 10 is mounted on the second base 55 such that the second main surface 11 b side of the substrate 11 faces the mounting surface of the second base 55.

As the substrate 11, a resin substrate based on a resin, a metal base substrate based on a metal, a glass substrate made of glass, or the like can be used. The resin substrate may be, for example, a glass epoxy substrate (CEM-3, FR-4 etc.) made of glass fiber and epoxy resin, a substrate (FR-1 etc.) made of paper phenol or paper epoxy, or polyimide etc. A flexible substrate having flexibility can be used. As a metal base substrate, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate, etc. can be used, for example. In the present embodiment, a double-sided CEM-3 substrate is used as the substrate 11.

Further, assuming that the length in the longitudinal direction (length of the long side) of the substrate 11 is L1 (mm) and the length in the width direction of the substrate 11 (length of the short side) is L2 (mm), the present embodiment is implemented. The long-sized substrate 11 in the above form is a substrate having an aspect ratio (L1 / L2) of 7.5 or more. Specifically, the substrate 11 is L1 = 300 mm to 600 mm, L2 = 10 mm to 40 mm, and in this embodiment, the substrate 11 is L1 = 580 mm, L2 = 15 mm (aspect ratio 38.67), and has a thickness of 1.0 mm. Is used. The substrate 11 having a thickness of 1.6 mm may be used.

The LED element 12 is an example of a light emitting element, and is mounted on the first major surface 11 a on the substrate 11. In the present embodiment, as shown in (a) of FIG. 3, the plurality of LED elements 12 are arranged in a line in a line along the longitudinal direction of the substrate 11.

Each LED element 12 is a so-called SMD type light emitting element in which an LED chip and a phosphor are packaged. Each LED element 12 includes a package (container) 12a, an LED chip 12b accommodated in the package 12a, and a sealing member 12c for sealing the LED chip 12b, as shown in FIG. 3C. The LED element 12 in the present embodiment is a white LED element that emits white light.

The package 12a is molded of a white resin or the like, and has a recess (cavity) in the shape of an inverted truncated cone. The inner side surface of the recess is an inclined surface, and is configured to reflect the light from the LED chip 12 b upward.

The LED chip 12b is mounted on the bottom of the recess of the package 12a. The LED chip 12 b is a bare chip that emits monochromatic visible light, and is die-bonded and mounted on the bottom of the recess of the package 12 a by a die attach material (die bonding material). For example, a blue LED chip that emits blue light when energized can be used as the LED chip 12 b.

The sealing member 12c is made of a translucent material such as silicone resin, and is disposed in the package 12a so as to cover the LED chip 12b. The sealing member 12 c seals the LED chip 12 b to protect the LED chip 12 b. The sealing member 12c in the present embodiment further includes a phosphor as a light wavelength conversion material, and performs wavelength conversion (color conversion) of the light from the LED chip 12b to a predetermined wavelength. The sealing member 12c is filled in the recess of the package 12a, and is sealed up to the opening surface of the recess.

As the sealing member 12c, for example, when the LED chip 12b is a blue LED chip, phosphor-containing yellow phosphor particles of YAG (yttrium aluminum garnet) type dispersed in silicone resin to obtain white light Resin can be used. As a result, the yellow phosphor particles are excited by the blue light of the blue LED chip to emit yellow light. Therefore, from the sealing member 12c, white light is generated as a composite light of the excited yellow light and the blue light of the blue LED chip. Light is emitted. The sealing member 12c may contain a light diffusing material such as silica.

Thus, the LED element 12 is configured. Although not shown, the LED element 12 has two external connection terminals of positive and negative electrodes, and the external connection terminals and the wiring 13 are electrically connected. In the present embodiment, the LED elements 12 are mounted in a line in a line, but the present invention is not limited to this. Moreover, although the several LED element 12 on the board | substrate 11 is the connection which combined the serial connection and the parallel connection by the wiring 13, even if it is comprised so that all the LED elements 12 may be connected in series. Good. In (a) of FIG. 3, although 30 LED elements 12 are used in one LED module 10 and arranged in 10 straight three, two 40 LED modules with a 40 m straight tube type LED lamp of 2400 lm are used. Thus, it is configured to be 21 straight 6 parallel (a total of 126 LED elements).

The wiring 13 is a metal wiring (first metal pattern) patterned in a predetermined shape on the first major surface 11 a of the substrate 11. The wiring 13 is electrically connected to the LED element 12. Specifically, the wiring 13 is intermittently patterned in the longitudinal direction of the substrate 11 in order to electrically connect the adjacent LED elements 12 to each other. The wiring 13 is also patterned to connect the LED element 12 mounted on the short side of the substrate 11 and the electrode terminal 15. Furthermore, the wires 13 extend along the longitudinal direction of the substrate 11 on both sides of the element row of the LED elements 12 in order to connect the LED elements 12 in parallel and to supply power to the LED elements 12 from the electrode terminals 15. It is also patterned to do. Thus, power is supplied from the electrode terminal 15 to the respective LED elements 12 through the wiring 13.

The metal pattern 14 (second metal pattern) is patterned in a predetermined shape on the second major surface 11 b of the substrate 11 using a metal. The metal pattern 14 in the present embodiment is pattern-formed in a mesh shape (mesh shape) as shown in (c) of FIG. 3. More specifically, the metal patterns 14 are formed in a lattice shape.

As shown in (b) of FIG. 3, the metal pattern 14 is formed on substantially the entire surface of the second major surface 11 b of the substrate 11 except for a part thereof. In the present embodiment, the metal pattern 14 is formed in an elongated shape as a whole along the longitudinal direction of the substrate 11 in the same manner as the wiring 13. That is, the metal pattern 14 and the wiring 13 are formed to face each other with the substrate 11 interposed therebetween.

The metal pattern 14 functions as a heat radiating member (heat sink) for radiating heat generated by the LED element 12. The metal pattern 14 is not electrically connected to the electronic component, and no operating current flows in the metal pattern 14 while the LED module 10 emits light. That is, the metal pattern 14 is a non-wiring of a structure which does not electrically connect electronic parts (LED element etc.) unlike the wiring 13 through which an operation current flows during light emission of the LED module 10. That is, the metal pattern 14 is in an electrically floating state, and no current flows in the metal pattern 14 to make the LED element 12 emit light.

As described above, the wiring 13 and the metal pattern 14 having a predetermined shape are formed on both surfaces of the substrate 11 by patterning the metal film. For example, using a substrate 11 having a metal film (such as copper foil) crimped onto the entire surface of both surfaces, the metal film on one surface is etched and patterned to form a wiring 13 of a predetermined shape, and then The metal film on the other surface is etched and patterned to form a metal pattern 14 of a predetermined shape. Thereby, the board | substrate 11 with which the metal pattern of the predetermined shape was formed in the both surfaces of the board | substrate 11 can be obtained. Although the wiring 13 and the metal pattern 14 are portions left when the metal film is etched, a pattern having a predetermined shape may be formed by printing or the like without etching.

As a metal material of the wiring 13 and the metal pattern 14, for example, copper (coefficient of linear expansion: 16.8 × 10 ⁻⁶ / ° C.) or silver (coefficient of linear expansion: 18.9 × 10 ⁻⁶ / ° C.) is used. be able to. The wiring 13 and the metal pattern 14 may be formed using the same metal material, or may be formed using different metal materials. In the present embodiment, the wiring 13 and the metal pattern 14 are made of the same metal material, and both of them use copper. Further, as described above, in the present embodiment, a resin substrate of CEM-3 (linear expansion coefficient: 27 × 10 ⁻⁶ / ° C.) is used as the substrate 11. That is, in the present embodiment, the linear expansion coefficient (thermal expansion coefficient) of the wiring 13 and the metal pattern 14 is smaller than the linear expansion coefficient (thermal expansion coefficient) of the substrate 11. In the present embodiment, the thickness of each of the wiring 13 and the metal pattern 14 is 35 μm, but may be 18 μm, 70 μm, 105 μm or the like.

The electrode terminal 15 is an external connection terminal (connector) that receives DC power for causing the LED element 12 to emit light from the outside of the LED module 10. The electrode terminal 15 in the present embodiment is configured in a socket type, and has a socket made of resin and a conductive pin for receiving DC power. The conductive pins are electrically connected to the wiring 13 formed on the substrate 11. By mounting the mounting portion 61 of the connector 60 (see FIG. 2) to the electrode terminal 15 (socket), the electrode terminal 15 receives power supply from the connector 60. In addition, as the electrode terminal 15, not a resin socket but a metal electrode patterned in a rectangular shape may be used.

The resist 16 is an insulating film made of a resin material having an insulating property. The resist 16 is formed so as to cover the entire surface of the first major surface 11 a of the substrate 11 except for the wiring 13 in the connection portion with the LED element 12 and the electrode terminal 15. By covering the wiring 13 with the resist 16, the insulation (withstand voltage) of the substrate 11 can be improved. Further, the formation of the resist 16 can also suppress the oxidation of the wiring 13.

Here, as a resist formed on the first major surface 11 a of the substrate 11, generally, a white resin material (white resist) having a high reflectance of about 98% is used. The high reflectance resist shows no change in reflectance with time, and the reflectance does not decrease even if it is heated. That is, the high reflectance white resist remains as a white resist without color change.

On the other hand, in the present embodiment, a low reflectance white resist (quasi-white resist) having a reflectance of 90% or less is intentionally used as the resist 16. Thus, the resist can be discolored by using the resist of low reflectance. In this embodiment, since a white resist with low reflectance is used as the resist 16, it is possible to change the color from white to yellow. Specifically, after forming the low-reflectance resist 16 on the substrate 11, the resist 16 is discolored to have a yellowish appearance by performing a heat treatment before the LED module 10 is incorporated into the housing 20. . Thus, the reflectance of the resist 16 is reduced by causing the resist 16 to change color. For example, the reflectance of the resist 16 is reduced by about 2 to 5% due to the color change.

Note that, as the resist 16 before the color change, a low reflectance resist having a reflectance of 80% to 90% can be used. The thickness of the resist 16 can be, for example, 5 to 25 μm.

Further, in the present embodiment, when the resist 16 is formed, the resist with low reflectance is formed on the substrate 11 and then heat treated to discolor the resist, but the resist with low reflectance is heat treated to discolor. It is also possible to form on the substrate 11 a resist that has been discolored after being allowed to

Similarly to the resist 16, the resist 17 is also an insulating film made of a resin material having an insulating property. The resist 17 is formed on the entire surface of the second major surface 11 b of the substrate 11 so as to cover the metal pattern 14. In the present embodiment, the resist 17 is made of the same material as the resist 16, and the entire metal pattern 14 is covered with the resist 17. The thickness of the resist 17 can also be, for example, 5 to 25 μm, similarly to the resist 16. Further, the formation of the resist 17 can prevent the metal pattern 14 from being oxidized.

The LED module 10 is configured as described above. The resist 16 may be a white resist having a high reflectance of over 90% (eg, about 98%) instead of a white resist having a low reflectance. Thereby, when the light emitted from the LED element 12 is returned to the substrate 11 (for example, when it is reflected and returned from the inner surface of the housing 20), the light can be reflected by the resist 16; Light extraction efficiency can be improved. Further, although the resists 16 and 17 are provided in the present embodiment, the resists 16 and 17 may not be provided.

[Case]
The housing 20 is a translucent straight tube (tube), and as shown in FIG. 2, is a long cylindrical outer shell member (outer tube) having openings at both ends. The housing 20 accommodates the LED module 10, the first base 50, the second base 55, the lighting circuit 90, and the like. In the present embodiment, the casing 20 uses a cylindrical shape, but the casing 20 does not necessarily have to be a cylindrical shape, and a square tubular shape may be used.

The housing 20 can be made of a translucent material, and a glass tube (glass bulb) made of glass, a plastic tube, or the like can be used. For example, as the housing 20, a straight pipe (glass pipe) made of soda lime glass of 70 to 72% silica (SiO ₂ ), or a resin material such as acrylic (PMMA) or polycarbonate (PC) Straight pipe (plastic pipe) can be used. In this embodiment, the same glass tube (having a total length of about 1167 mm) as that used for the 40-type straight tube fluorescent lamp is used.

Further, the housing 20 may be provided with a light diffusion portion having a light diffusion function for diffusing the light from the LED module 10. Thereby, the light emitted from the LED module can be diffused when passing through the housing 20. Examples of the light diffusion portion include a light diffusion sheet or a light diffusion film formed on the inner surface or the outer surface of the housing 20. Specifically, a milky white light diffusion film can be formed by adhering a resin or a white pigment containing a light diffusion material (fine particles) such as silica or calcium carbonate to the inner surface or the outer surface of the housing 20. As another light diffusion portion, there are a lens structure provided inside or outside of the housing 20, or a concave portion or a convex portion formed in the housing 20. For example, by printing a dot pattern on the inner surface or the outer surface of the housing 20 or processing a part of the housing 20, the housing 20 can also have a light diffusion function (light diffusion portion). Alternatively, the housing 20 can be provided with a light diffusing function (light diffusing portion) by molding the housing 20 itself using a resin material or the like in which a light diffusing material is dispersed.

[Cap for feed]
The feeding cap (first cap) 30 is a cap for supplying power to the LED module 10. Further, the power supply base 30 is a power reception base that receives power for lighting the LED element 12 of the LED module 10 from the outside of the lamp (such as a commercial power source). The power supply cap 30 is formed in a substantially bottomed cylindrical shape, and is provided to cover one of the housing 20 in the longitudinal direction. As shown in FIG. 2, the power supply base 30 in the present embodiment includes a resin-made power supply base body 31 made of a synthetic resin such as polybutylene terephthalate (PBT) and a pair of power supplies made of a metal material such as brass. It consists of pins 32.

The power supply base 30 is configured to be divisible into a plurality of parts along the axial direction of the power supply base 30. The feed base body 31 in the present embodiment is configured to be disassembled in upper and lower halves with the plane passing through the tube axis of the housing 20 as a divided surface, and the first feed base body portion 31a and the second feed base are configured. It is comprised by the main-body part 31b. The feed cap 30 electrically connects the feed pin 32 to the socket of the lighting circuit 90 through a lead wire, and then the feed pin is formed by the first feed cap body 31a and the second feed cap body 31b. By sandwiching the first power supply base body 31a and the second power supply base body 31b in a state in which the second base 55 and the end portion of the housing 20 and the second base 55 are sandwiched, the housing 20 is Attached to the end.

The pair of feed pins 32 are conductive pins for supplying power to the LED module 10. In addition, the power supply pin 32 is a power receiving pin that receives power for lighting the LED element 12 of the LED module 10 from an external device such as a lighting fixture. The pair of feed pins 32 is configured to protrude outward from the bottom of the feed cap body 31. For example, by mounting the power supply cap 30 in the socket of the lighting apparatus, the pair of power supply pins 32 receive DC power from a power supply device (power supply circuit) incorporated in the lighting apparatus. The pair of feed pins 32 is connected to the lighting circuit 90 in the housing 20 by lead wires, and the DC power received by the pair of feed pins 32 is supplied to the lighting circuit 90.

In addition, you may comprise a power supply device so that the straight tube | pipe type LED lamp 1 may be built in instead of the lighting fixtures outside a lamp | ramp. In this case, the pair of power supply pins 32 receive AC power from, for example, a commercial 100 V AC power supply, and supply the AC power to the power supply apparatus.

[Cap for non-feeding]
The non-feed cap 40 is locked to the socket of the lighting fixture at the other end of the lamp to support the lamp body. The non-power-supplying cap 40 is formed in a substantially bottomed cylindrical shape, and is provided to cover the other end in the longitudinal direction of the housing 20. As shown in FIG. 2, the non-feed cap 40 in the present embodiment includes a non-feed cap body 41 made of a synthetic resin such as PBT and a single non-feed pin 42 made of a metallic material such as brass. Become.

The non-feed cap 40 is configured to be split into a plurality of parts along the axial direction of the non-feed cap 40 in the same manner as the feed cap 30. That is, the non-power supply cap body 41 is configured to be disassembled in upper and lower halves with the plane passing through the tube axis of the housing 20 as a divided surface, and the first non-power supply cap body portion 41a and the second non-power supply cap It consists of the main part 41b. Further, the non-feed pin 42 is configured to protrude outward from the bottom of the non-feed cap body 41.

The non-feed cap 40 configured in this manner is configured such that after the non-feed pin 42 is attached to the first base 50 by the connection member 43, the first non-feed cap body 41a and the second non-feed cap body In a state where the non-feed pin 42, the end of the housing 20, and the second base 55 are sandwiched by 41b, the first non-feed cap body portion 41a and the second non-feed cap body portion 41b are screwed. Are attached to the end of the housing 20.

Note that the non-feed cap 40 may be provided with a grounding function, and the non-feed cap 40 may be used as a grounding cap. In this case, the non-power supply pin 42 functions as a ground pin and is grounded via the luminaire.

[Base]
The first base 50 and the second base 55 are both made of metal and function as a heat sink for dissipating heat generated by the LED module 10 and as a base for mounting and fixing the LED module 10 Function.

The first base 50 is a member which constitutes the outer shell of the heat sink, and as shown in FIG. The first base 50 can be formed, for example, by bending a metal plate such as a galvanized steel plate.

The first base 50 has a long bottom (bottom plate) and a first wall 51 and a second wall 52. The first wall 51 and the second wall 52 are formed at both ends of the bottom of the first base 50 in the width direction of the first base 50 (in the width direction of the substrate 11), and the width direction of the first base 50 In this case, both sides of the substrate 11 of the LED module 10 are sandwiched. That is, the first wall 51 faces one side of the substrate 11, and the second wall 52 faces the other side of the substrate 11. The first wall 51 and the second wall 52 are formed in a screen shape by bending a metal plate constituting the first base 50. Thus, the substrate 11 of the LED module 10 is sandwiched by the first wall 51 and the second wall 52, and the LED module 10 is formed of the substrate 11 by the first wall 51 and the second wall 52. It is arrange | positioned at the 1st base 50 in the state by which the movement of the transversal direction was controlled.

Further, the first wall 51 is formed with a plurality of first protrusions 51 a that project from the first wall 51 toward the second wall 52. Similarly, the second wall 52 is formed with a plurality of second protrusions 52 a that project from the second wall 52 toward the first wall 51.

Here, the positional relationship of the LED module 10, the first base 50, the second base 55, the reflecting member 70, and the like when stored in the housing 20 will be described in detail with reference to FIG. (A) of FIG. 4 is a partially enlarged cross-sectional view (a cross-sectional view when cut by a plane passing through the tube axis) of the straight tube type LED lamp according to the embodiment of the present invention, and (b) of FIG. Is a cross-sectional view of the straight tube LED lamp taken along line AA 'of (a), and (c) of FIG. 4 is a cross section of the straight tube LED lamp taken along line BB' of (a) FIG. In FIG. 4, a part of the configuration of the LED module 10 (the wiring 13, the metal pattern 14, the resists 16 and 17) is omitted.

As shown in (c) of FIG. 4, the first protrusion 51 a and the second protrusion 52 a are configured to be in contact with the side of the first main surface 11 a of the substrate 11 in the LED module 10. Specifically, the first protrusion 51 a and the second protrusion 52 a are formed as locking claws that lock on the side of the first main surface 11 a of the substrate 11. Thereby, the movement of the substrate 11 in the LED module 10 in the direction perpendicular to the first major surface 11 a of the substrate 11 is restricted. That is, the LED module 10 is fixed to the first base 50 by the first protrusion 51 a and the second protrusion 52 a so as not to jump upward.

By this configuration, even after the straight tube LED lamp 1 is attached to the lighting fixture, that is, the LED module 10 is positioned on the ground side relative to the first base 50. Even if the LED module 10 does not fall off the first base 50 due to the first protrusion 51 a and the second protrusion 52 a. As described above, since the substrate 11 is held by the first protrusion 51 a and the second protrusion 52 a, the LED module 10 can be easily fixed to the first base 50 without using a screw, an adhesive, or the like. it can.

The first protrusion 51 a and the second protrusion 52 a are formed by processing a part of the metal plate constituting the first base 50, and for example, the first wall 51 and the second wall made of a metal plate By embossing the wall 52, a part of the metal plate can be made to project. Thereby, LED module 10 can be fixed to the 1st base 50 by easy composition, without using another member.

Furthermore, in the first projecting portion 51a and the second projecting portion 52a, the substrate 11 in the first projecting portion 51a or the second projecting portion 52a is provided so that the substrate 11 is not easily detached from the first base 50 by vibration, impact or the like. The shape on the side of the first major surface 11 a is substantially flat so as to face the first major surface 11 a. On the other hand, the shape of the first protrusion 51a or the second protrusion 52a on the opposite side to the first main surface 11a side inserts the substrate 11 in contact with the first protrusion 51a or the second protrusion 52a. In this case, in order to make it easy to push the substrate 11 into the first protrusion 51a or the second protrusion 52a, the substrate 11 has a substantially tapered shape.

Moreover, as shown to (b) and (c) of FIG. 4, the level | step-difference part for mounting the 2nd base 55 and the reflecting member 70 in the 1st base 50 is formed. A space area is formed between the bottom of the first base 50 and the reflecting member 70 (the second base 55) by this stepped portion, and an urging portion 53 described later is provided using this space area. It is done.

Furthermore, as shown to (a) and (c) of FIG. 4, the 1st base 50 is the some 1st notch part 51b formed in the vicinity of the 1st protrusion part 51a, and the 2nd protrusion part 52a. And a plurality of second notched portions 52b formed in the vicinity of. In the present embodiment, each of the first cutaway portions 51b is cut out so as to straddle the first wall portion 51 and the step portion, and is formed in a slit shape along the longitudinal direction of the first base 50. It is done. Similarly, each of the second notches 52b is notched so as to straddle the second wall 52 and the step, and is formed in a slit shape along the longitudinal direction of the first base 50. .

Thus, when the substrate 11 is fixed to the first base 50 by providing the first notch 51b and the second notch 52b in the vicinity of the first protrusion 51a and the second protrusion 52a, The peripheral portions of the first protrusion 51a and the second protrusion 52a can be easily elastically deformed. Thus, the substrate 11 can be easily fitted into the first protrusion 51 a and the second protrusion 52 a of the first base 50, and the substrate 11 can be easily fixed to the first base 50.

Further, as shown in (a) of FIG. 4, a biasing portion 53 is formed at the bottom of the first base 50. The biasing portion 53 is a first member toward the second major surface 11b of the substrate 11 in the LED module 10 (that is, in the direction from the second major surface 11b of the substrate 11 to the first major surface 11a), The pedestal 50, the second pedestal 55, and the reflecting member 70 are configured to be biased.

The biasing portion 53 is formed by processing a part of the metal plate constituting the first base 50, and as shown in FIG. 4A, the plate-like bottom plate of the first base 50 It is configured as a leaf spring formed by cutting and raising a part. The biasing portion 53 configured in this manner is configured to abut on the reflecting member 70, and applies a pressure to the reflecting member 70 (second base 55) by biasing by the elastic force of the plate spring. doing.

As described above, the substrate 11 of the LED module 10 is biased by the biasing unit 53, and the pressing force is applied by the elastic force of the biasing unit 53. Thus, the substrate 11 is held by the first and

second protrusions

51 a and 52 a and the biasing portion 53 in a state of receiving a pressing force. That is, since the substrate 11 is pressed from the surfaces on both sides of the first main surface 11a and the second main surface 11b, the substrate 11 can be firmly held by the first base 50. Further, since the urging portion 53 is formed by processing a part of the first base 50, the holding performance of the substrate 11 can be improved by a simple configuration.

In addition, as shown to (a) of FIG. 4, the opening 54 is formed in the bottom part of the 1st base 50, and the attachment member 80 is attached to the said opening 54. As shown in FIG.

Further, as shown in (a) to (c) of FIG. 4, a second base 55 is disposed between the LED module 10 and the first base 50. The second base 55 is an elongated substantially rectangular substrate, and is a middle-plate heat sink disposed between the first base 50 and the substrate 11 of the LED module 10. The LED module 10 (substrate 11) is placed on the second base 55. That is, the LED module 10 is disposed on the second base 55 in a state where the second base 55 and the second main surface 11 b side of the substrate 11 are in contact with each other. Thereby, the heat generated by the LED element 12 is transferred to the metal pattern 14 through the substrate 11 and transferred from the metal pattern 14 to the second base 55. In addition to the LED module 10, the lighting circuit 90 is also mounted on the second base 55.

The second base 55 is preferably made of a high thermal conductivity material such as metal, and in the present embodiment is an aluminum plate. In the present embodiment, the plate thickness of the second base 55 is configured to be thicker than the plate thickness of the first base 50. In addition, the second base 55 is configured to be longer than the length of the first base 50, and each of the both end portions of the second base 55 is provided by the power supply base 30 or the non-power supply base 40. It is covered and attached to the power supply base 30 or the non-power supply base 40.

Further, the second base 55 is sandwiched between the LED module 10 and the first base 50, and by fixing the LED module 10 to the first base 50, the second base 55 is also It can be fixed to the base 50. As described above, in the present embodiment, since the first base 50 made of a thin plate-like steel plate that can be easily processed is used as the heat sink and the second base 55 made of aluminum having a high thermal conductivity, While being able to fix LED module 10 easily, a heat sink excellent in heat dissipation can be realized.

The second base 55 is mounted on the step portion of the first base 50 via the reflecting member 70, and the surface (rear surface) of the second base 55 on the first base 50 side is the above-described. As described above, the elastic force of the biasing portion 53 of the first base 50 is biased via the reflecting member 70.

[connector]
As shown in FIG. 2, the connector 60 is a conductive wire electrically connecting adjacent LED modules 10 to each other, and a mounting portion (connector portion) 61 mounted to the electrode terminals 15 of the LED module 10, and the electrode terminals And a power supply line 62 for passing the power supplied to the LED module 10 through 15.

The mounting portion 61 is provided at both ends of the power supply line 62, and a substantially rectangular resin molded portion configured to be fitted to the electrode terminal (socket) 15 of the LED module 10, and the resin molded portion And a conductive portion provided on the Also, the power supply line 62 can be configured by a lead wire called a harness. In the present embodiment, the connector 60 is configured to pass DC power, and the power supply line 62 includes a high voltage side supply line and a low voltage side supply line.

In the present embodiment, two long LED modules 10 are disposed in the housing 20. The LED module 10 disposed on the side of the power supply cap 30 and the lighting circuit 90 are electrically connected by the connector 60, and DC power is supplied from the lighting circuit 90 to the LED module 10 through the connector 60. . Further, as shown in FIG. 1, adjacent LED modules 10 are also electrically connected by the connector 60, and power is supplied from one LED module 10 to the other LED module through the connector 60.

[Reflecting member]
As shown in FIG. 2, the reflecting member 70 is configured to reflect light emitted by the LED module 10 in a certain direction in order to improve the light extraction efficiency of the lamp. The reflective member 70 is made of a material having electrical insulation and light reflectivity, and can be formed, for example, by processing an insulating reflective sheet made of a biaxially stretched polyester (PET) film or the like.

In the present embodiment, the reflecting member 70 is processed to have a U-shaped cross section, and the first reflecting surface portion in surface contact with the inner surface of the first wall portion 51 in the first base 50, and the second wall portion 52. And a second reflective surface portion in surface contact with the inner surface of Thereby, the light from the LED module 10 is reflected by the first reflective surface portion and the second reflective surface portion of the reflective member 70. In addition, the location corresponding to the 1st projection part 51a of the 1st base 50 and the 2nd projection part 52a in reflective member 70 is notched, and when reflective member 70 is arranged inside the 1st base 50. The first protrusion 51 a and the second protrusion 52 a are configured to protrude from the first reflection surface portion and the second reflection portion of the reflection member 70.

Also, the reflecting member 70 is disposed between the first base 50 and the second base 55. Specifically, the reflecting member 70 is mounted on the step portion of the first base 50, and the surface of the reflecting member 70 on the side of the first base 50 is the elastic force of the biasing portion 53 of the first base 50. It is energized by

[Mounting member]
As shown in (a) of FIG. 4, a mounting member 80 is attached to an opening formed in the bottom of the first base 50. The attachment member 80 is attached to the first base 50 in a state in which the first base 50 is movable in the longitudinal direction of the first base 50.

The mounting member 80 has a hooking piece 81 engaged with the opening 54 formed in the bottom of the first base 50 and a recess 82 formed on the inner surface side of the housing 20.

The hooking piece 81 is formed with a gap from the edge of the opening 54 at the bottom of the first base 50 in the longitudinal direction of the first base 50, and is engaged with the edge of the opening 54. Is configured. Specifically, the hooking piece 81 is formed in a hook shape so as to be hooked on the surface of the bottom of the first base 50 on the housing 20 side. Further, an adhesive such as silicone resin is filled in the recess 82 of the mounting member 80, and the mounting member 80 and the housing 20 are adhesively fixed by this adhesive.

As described above, although the attachment member 80 is adhesively fixed to the housing 20, the attachment member 80 is movable with respect to the first base 50, and the attachment member 80 slides with respect to the first base 50. It is configured to In the present embodiment, the hooking piece 81 of the mounting member 80 and the first base 50 are configured to slide. The attachment members 80 are attached to a part of the first base 50, and in the present embodiment, two attachment members 80 are attached to the first base 50.

Note that the mounting portion is configured by deforming a part of the bottom portion of the first base 50 outward without providing the mounting member 80, and the first base 50 has the same function as the mounting member 80. You may In this case, the first base 50 and the housing 20 can be fixed by applying an adhesive to the mounting portion of the first base 50. The mounting portion of the first base 50 configured in this way does not have a sliding action like the mounting member 80, but it is not necessary to use the mounting member 80, so the number of parts can be reduced.

[Lighting circuit]
The lighting circuit 90 is an LED lighting circuit for controlling the lighting state of the LED element 12 in the LED module 10 and is a DC voltage of a desired voltage for energizing the LED element 12 by rectifying the input DC power and the like. A circuit for converting into power and outputting is provided. As shown in FIG. 2, in the present embodiment, the lighting circuit 90 includes a circuit board 90 a and a circuit element group 90 b composed of a plurality of circuit elements mounted on the circuit board 90 a.

The circuit board 90a is a printed board on which a predetermined wiring pattern (not shown) for electrically connecting the mounted electronic components to each other is formed, and for example, a glass epoxy board or the like can be used.

The circuit element group 90 b includes a plurality of circuit elements for lighting the LED elements 12 of the LED module 10. The circuit element group 90b is configured of, for example, a diode bridge circuit (rectifier circuit) that performs full-wave rectification of input DC power, a fuse element, and the like. As the circuit element group 90b, if necessary, a resistor, a capacitor, a coil, a diode, a transistor or the like may be used.

The lighting circuit 90 also includes an input socket 90c (input unit) for receiving DC power from a pair of power supply pins 32 provided on the power supply cap 30, and an output socket 90d for outputting DC power to the LED module 10 And an output unit). An input connector terminal electrically connected to the pair of feed pins 32 via a lead wire is inserted into the input socket 90c. Further, an output connector terminal electrically connected to the LED module 10 through a lead wire is inserted into the output socket 90d. The input socket 90c and the output socket 90d are electrically connected to the circuit elements of the circuit element group 90b by a wiring pattern formed on the circuit board 90a.

The lighting circuit 90 configured in this manner is placed on the second base 55 and covered by the lighting circuit cover 91. The lighting circuit cover 91 is made of an insulating resin and protects the lighting circuit 90.

Alternatively, the circuit element group 90 b may be directly mounted on the substrate 11 of the LED module 10 without using the lighting circuit 90. In this case, an input socket may be provided on the substrate 11, the feed pin 32 and the input socket may be connected by lead wires, and a wiring pattern may be formed on the substrate 11 to connect the input socket and the circuit element group 90 b. Further, the output from the circuit element group 90 b (DC power after rectification) can be supplied to the LED element 12 by forming a wiring pattern on the substrate 11.

In the straight tube type LED lamp 1 configured as described above, the LED module 10, the first base 50, the second base 55, the connector 60, the reflection member 70, the mounting member 80, the lighting circuit 90, the lighting circuit cover 91 The feed pin 32 and the non-feed pin 42 are integrated as a long light source module. That is, the light source module in which each component is integrated is in a state in which the electrical and physical connection between the components is completed. Then, after the light source module is inserted into the casing 20, the feed pipe main body 31 and the non-feed cap body 41 are attached to both ends of the housing 20, thereby completing the straight tube LED lamp 1. .

[Function effect]
Next, the first characteristic configuration of the LED module 10 according to the present embodiment and the function and effect thereof will be described including the background of the present invention.

In recent years, the lengthening of the LED module used for the light source for illumination etc. progresses, and using a long thing with a large aspect ratio as a board | substrate which mounts an LED element is examined. However, it was found that warpage occurs in the substrate when a long substrate is used.

In particular, it was found that when a non-ceramic substrate was used as the substrate, the substrate was largely warped. For example, when a metal film on one main surface is patterned to form a wiring by using a double-sided substrate in which a metal film such as copper foil is formed on both sides of a resin substrate as a substrate, both ends of the substrate 11 in the longitudinal direction Has warped upward greatly. It has also been found that when a long substrate having an aspect ratio of 38.6 or more is used, both ends of the substrate are significantly warped. As described above, when the substrate is warped, the position of the LED element is changed, which makes it impossible to obtain desired light distribution characteristics.

According to the experiments of the inventors of the present invention, using a substrate in which copper foils are formed on both surfaces of a resin substrate (L1 = 580 mm, L2 = 15 mm, thickness 1.0 mm) of CEM-3, only one main surface is used. When the copper foil was patterned to form a wiring, the amount of warpage of the substrate (heights of both short sides of the substrate with respect to the reference surface) was 7.35 mm. In addition, in this experiment, the residual copper ratio of the copper foil of one main surface of the board | substrate which performed patterning was 26.4%. Moreover, since patterning is not performed with respect to the copper foil of the other main surface of a board | substrate, the remaining copper ratio is 100%. Here, the residual copper ratio is the area of the copper foil after patterning (the copper area after patterning / the copper area before patterning) with respect to the area of the copper foil before patterning. Further, in the present embodiment, since the copper foil is formed on the entire surface of the main surface of the substrate, the residual copper ratio is the area of the copper foil after patterning with respect to the area of the main surface of the substrate (copper area after patterning It can also be expressed as the area of the main surface of the substrate). In addition, the area of copper foil is an area when planarly viewing a board | substrate, ie, a contact area with a board | substrate.

In addition, the inventors of the present application conducted a similar experiment using a ceramic substrate instead of the resin substrate. As a result, in the case of the ceramic substrate, although there is a warp of the substrate, the warp of the substrate is slight regardless of the residual copper ratio of the copper thin film formed on the other main surface (even when the residual copper ratio is 100%) Met.

The present invention has been made based on such new findings, and in a double-sided substrate in which a metal film is formed on both sides of the substrate, it is not necessary to pattern only the metal film on one main surface, The metal film on the main surface of the substrate is patterned for wiring, and although not used as a wiring, it is found that the warpage of the substrate can be suppressed by intentionally patterning the metal film on the other main surface. The

In the present embodiment, as shown in FIG. 3A, the wiring 13 (first metal pattern) is formed in a pattern on the first major surface 11a of the substrate 11 and is shown in FIG. 3B. As described above, on the second major surface 11 b of the substrate 11, the metal pattern 14 (second metal pattern), which is a non-wiring, is formed in a mesh pattern. By configuring in this manner, the amount of warpage of the substrate 11 can be significantly suppressed.

According to the experiments of the present inventors, one main surface is formed using a substrate 11 in which copper foil is formed on both surfaces of a resin substrate (L1 = 580 mm, L2 = 15 mm, thickness 1.0 mm) of CEM-3. While patterning the copper foil of (the first main surface 11a) to form the wiring 13, and patterning the copper foil of the other main surface (the second main surface 11b) to form the metal pattern 14, the substrate The amount of warpage of 11 was 1.91 mm. That is, the warpage amount could be suppressed by 5.44 mm as compared with the case where only one main surface was patterned (the other main surface was not patterned). In this experiment, the residual copper ratio of one main surface of the substrate 11 on which the wiring 13 is patterned is 26.4%, and the residual copper ratio of the other main surface of the substrate 11 on which the metal pattern 14 is formed is It was 50%.

Based on this result, the inventors of the present application conducted further experiments on the warpage amount of the substrate with respect to the residual copper ratio. The experimental results will be described in detail with reference to FIGS. 5A and 5B. FIG. 5A is a partially enlarged view of the LED module according to the first embodiment of the present invention when viewed from the second main surface 11b side, and the residual copper ratio of the second main surface 11b of the substrate 11 is 52% Metal pattern 14 in the case of FIG. FIG. 5B is a partially enlarged view of the LED module according to the second embodiment of the present invention when viewed from the second main surface 11b side, and the remaining copper ratio of the second main surface 11b of the substrate 11 is 25%. Metal pattern 14 in the case of FIG.

In FIG. 5A, a mesh-like metal pattern 14 is formed by removing a square having a side of 1 mm in a matrix from the copper foil formed on the entire surface of the second major surface 11b of the substrate 11. Further, in FIG. 5B, the mesh-like metal pattern 14 is formed by removing a square of 3.5 mm on a side in a matrix from the copper foil formed on the entire surface of the second main surface 11b of the substrate 11. did. In FIGS. 5A and 5B, the line width of the metal pattern 14 is 5 mm. The residual copper ratio of the first major surface 11 a of the substrate 11 is 26.4% in all cases.

When ten samples were prepared for FIG. 5A and the amount of warpage was measured, the amount of warpage was 1.0 mm to 2.0 mm. In addition, the average amount of warpage was 1.48 mm.

Further, when ten samples were produced also in FIG. 5B and the amount of warpage was measured, the amount of warpage was 0.04 to 0.2 mm. In addition, the average amount of warpage was 0.07 mm.

From this experimental result, it was found that the maximum warpage can be significantly suppressed from 2.0 mm to 0.2 mm by changing the residual copper ratio from 52% to 25%. Moreover, it turned out that it can suppress significantly also from 1.48 to 0.07 mm also about average curvature amount. Thus, it has been found that the warpage can be further improved by changing the residual copper ratio from 52% to 25%.

That is, since the residual copper ratio of the first main surface 11a of the substrate 11 is 26.4%, the residual copper ratio of the second main surface 11b in the substrate 11 is the residual copper ratio of the first main surface 11a. It was found that the warpage of the substrate 11 can be minimized by making it approximately the same. In other words, the ratio of the area of the metal pattern 14 to the area of the second major surface 11 b of the substrate 11 and the ratio of the area of the wiring 13 to the area of the first major surface 11 a of the substrate 11 are substantially the same. Warpage of the substrate 11 can be minimized.

Moreover, in this experiment, although the difference between the residual copper ratio of the first main surface 11a and the residual copper ratio of the second main surface 11b is 1.4%, the residual copper ratio of the first main surface 11a is If the difference from the residual copper ratio of the second major surface 11 b is 5% or less, warpage of the substrate 11 can be effectively suppressed. That is, in the substrate 11, the difference between the area (copper area) of the wiring 13 in the first major surface 11 a and the area (copper area) of the metal pattern 14 in the second major surface 11 b is the difference between the wiring 13 and the metal pattern 14. Regardless of the shape, it should be within 5%.

In addition, the heat dissipation of LED element 12 becomes good, so that the residual copper rate of 2nd main surface 11b is high. From this viewpoint, the residual copper ratio of the second major surface 11b is preferably 25% or more, and more preferably 50% or more.

As described above, according to the LED module 10 according to the present embodiment, the wiring 13 (first metal pattern) is pattern-formed on the first main surface 11 a of the substrate 11, and the second main surface 11 b of the substrate 11 is formed. A metal pattern 14 (second metal pattern) which is a non-wiring is formed. Thereby, since the curvature amount of the board | substrate 11 can be suppressed significantly, the LED module and lamp which have a desired light distribution characteristic are realizable.

Here, the extent to which the metal film formed on the second major surface 11b of the substrate 11 is etched can be determined according to the aspect ratio of the substrate and the materials of the wiring 13 and the metal pattern 14, but By patterning the metal film of the main surface 11b of 2 (that is, by making the residual copper ratio less than 100%), at least the substrate with the residual copper ratio of 100% of the second main surface 11b The amount of warpage of 11 can be reduced.

The present inventors further examined this residual copper rate. As a result, the residual copper ratio of at least the second main surface 11b of the substrate 11 is 60% or less, and the residual copper ratio of the second main surface 11b of the substrate 11 is the residual copper ratio of the first main surface 11a. It was found that the amount of warpage of the substrate 11 can be largely suppressed in the following cases (60% or less). That is, since the residual copper ratio can also be expressed as the copper area after pattern formation with respect to the area of the main surface of the substrate, the metal pattern 14 (second metal pattern) with respect to the area of the second main surface 11b of the substrate 11 The area ratio is 60% or less, and the area ratio of the wiring 13 (first metal pattern) to the area of the first main surface 11 a of the substrate 11 is the metal to the area of the second main surface 11 b of the substrate 11 It was found that the amount of warpage of the substrate 11 can be significantly suppressed by setting the area ratio of the pattern 14 or less.

Next, the second characteristic configuration of the LED module 10 according to the present embodiment and the function and effect thereof will be described including the background of the present invention.

In the LED module, a plurality of LED elements mounted on one substrate are manufactured to have the same characteristics. However, due to manufacturing variations or the like, characteristic variations occur among the LED elements. For example, Vf characteristics may be different between the respective LED elements.

In this case, it is conceivable to sort the LED elements in advance by measuring the characteristics of each LED element or the like, and mounting the LED elements having similar Vf characteristics on one substrate. However, such a method is costly.

On the other hand, when a plurality of LED elements having different Vf characteristics are mounted on a single substrate, the same current flows in each of the plurality of LED elements, so that luminance variation occurs between the LED elements.

Therefore, in one LED module having a plurality of LED elements, there is a problem that luminance variation occurs between the LED elements. In addition, even in the case of an LED lamp provided with such an LED module, there is a problem that the luminance variation occurs.

With respect to this problem, as a result of intensive studies by the present inventors, even if there is variation in Vf characteristics between LED elements, suppressing variation in luminance by using a resist formed on the substrate. I found that I could do it. The details will be described below.

As described above, generally, as the resist 16 for covering the first major surface 11 a of the substrate 11, a high reflectance resist with a reflectance of about 98% is used to improve light extraction (light flux). Be

On the other hand, in the present embodiment, a low reflectance resist whose reflectance is 90% or less is intentionally used as the resist 16. That is, the inventor of the present application has found that it is possible to change the color of the resist by using a resist of reflectance, and thereby it is possible to obtain a resist of lower reflectance.

As a method of changing the color of the resist, for example, there is a method of heating the resist. The resist can be discolored by heating the low reflectance resist. For example, in the case of using a low-reflectance white resist as the resist 16, when the resist 16 is heated, the resist 16 is discolored to look yellowish. Thereby, the reflectance of the resist can be reduced as compared to that before heating.

The method for heating the resist 16 is not particularly limited, and a step of heating the resist 16 may be separately provided during the manufacturing process, or the resist 16 may be heated using an existing heating step. I don't care.

When using the existing heating process, it is possible to use reflow solder (reflow furnace), for example. In this case, when the LED element 12 is mounted on the substrate 11 on which the resist 16 is formed, the reflow soldering can be used to heat the resist 16 without adding a separate heating process. When lead solder is used, for example, preheating at 120 to 150 ° C. for 120 seconds and main heating at a peak temperature of 240 ° C. for 10 seconds are performed. In the case of lead-free solder, preheating at 120 to 200 ° C. for 120 seconds and main heating at a peak temperature of 260 ° C. for 10 seconds are performed.

When a glass tube is used as the housing 20, the housing 20 and the first base 50 apply a silicone adhesive to the mounting member 80 provided on the first base 50 to thermally cure (silicone curing furnace) The resist 16 can be heated without using a separate heating step by using the heating step (about 130 ° C., 1 hour) at the time of heat curing.

And the brightness variation between LED elements can be suppressed by using the resist 16 that has been discolored by heating. Hereinafter, this point will be described with reference to FIGS. 6A and 6B. FIG. 6A is a diagram for explaining the luminance variation in the case of using a conventional LED module. FIG. 6B is a view for explaining the luminance variation when the LED module according to the embodiment of the present invention is used.

6A and 6B, only the configuration of the resist is different. In FIG. 6A, a white resist with high reflectance (reflectance of 98%) is used as the resist 16A, and as the resist 16 in FIG. 6B. A white resist with low reflectance (a reflectance of 90% or less) is heated and discolored (color-changing resist). That is, the reflectance of the resist 16 in the LED module of the present embodiment shown in FIG. 6B is low.

Moreover, in FIG. 6A and FIG. 6B, four LED elements 12 are illustrated, and the case where the thing with a moderate brightness, a high brightness, a medium brightness, and a low brightness is located in a line from the left is assumed. As shown in FIGS. 6A and 6B, temporarily, the brightness of the high brightness LED element is 100, the brightness of the low brightness LED element is 50, and the brightness of the medium brightness LED element is 75. In addition, it is assumed that the luminance is improved by 20% when the white resist of high reflectance is used, and the luminance is improved by 10% when the color-change resist is used. Note that these numerical values are tentatively set so that the effects can be easily understood.

In this case, as shown in FIG. 6A, in the luminance distribution in the conventional LED module (white resist with high reflectance), the luminance of the high luminance LED element is 120, and the luminance of the low luminance LED element is 60. . Therefore, in the case of FIG. 6A, the maximum luminance difference between the LED elements is 60.

Similarly, as shown in FIG. 6B, in the luminance distribution in the LED module (discoloring resist) in the present embodiment, the luminance of the high luminance LED element is 110, and the luminance of the low luminance LED element is 55. Therefore, in the case of FIG. 6B, the maximum luminance difference between the LED elements is 55.

As described above, as in the LED module 10 according to the present embodiment, the maximum luminance difference can be reduced by changing the color using the resist 16 having a low reflectance. Therefore, the brightness variation between the LED elements can be suppressed.

Moreover, by using a low-reflectance resist as the resist 16, costs can be reduced as compared to the case of using a high-reflectance resist.

Moreover, in the straight tube type LED lamp, the bright spots of the respective LED elements 12 are conspicuous, and the grain of light is felt. In particular, in the straight tube type LED lamp using the SMD type LED element 12 as in the present embodiment, since the light is not emitted between the LED elements 12, the graininess of light can be further felt.

Therefore, in the straight tube type LED lamp, by using the LED module 10 according to the present embodiment, it is possible to effectively suppress the luminance variation between the LED elements, so the above graininess of the straight tube type LED lamp is alleviated. can do.

Although a low reflectance resist is used as the resist 16 in the present embodiment, it is also confirmed that the luminous flux does not significantly decrease. The following experiment was conducted on this point below.

In this experiment, in a straight tube type LED lamp as shown in FIG. 1, when an LED module using a high reflectance resist (reflectance 98%) is used as the resist 16 and a black resist (reflectance is used as the resist 16 The luminous flux was measured in the case of using the LED module using near zero).

As a result, when the luminous flux when using a high reflectance resist was 100%, the luminous flux when using a black resist was 97%. That is, it was found that the luminous flux does not decrease so much even when a black resist is used. Therefore, it can be estimated that the luminous flux does not decrease so much even when a low reflectance resist having a reflectance of 90% or less is used. That is, even if the resist 16 is used that has a low reflectance and is discolored, the influence on the light extraction efficiency is limited.

As described above, according to the LED module 10 and the straight tube type LED lamp 1 in the present embodiment, it is possible to suppress the luminance variation at low cost without reducing the luminous flux.

[Other effects]
Further, in the present embodiment, as shown in FIG. 3B, when the substrate 11 is viewed in plan, the metal pattern 14 is at least the LED element 12 mounted on the end of the substrate 11 in the longitudinal direction. It is preferable that it is formed so as not to overlap with a part. That is, of the plurality of LED elements 12 mounted on the first major surface 11 a of the substrate 11, the second major surface 11 b facing the LED element 12 positioned at the end portion When the metal film (copper foil) is patterned without forming the metal pattern 14 on the facing second main surface 11b), it is preferable to etch and remove this portion as well.

Although the metal pattern 14 is formed on the second main surface 11 b opposite to the first main surface 11 a on which the LED element 12 is mounted, the LED elements mounted on both ends of the substrate 11 12 (that is, the LED element 12 closer to the second main surface) will be located near the metal pattern 14. Therefore, in order to improve the insulation between the conductive portion (LED element 12) and the metal pattern 14, in the present embodiment, as described above, the LED pattern 12 is positioned at both ends of the substrate 11. And so as not to overlap. Specifically, the end of the metal pattern 14 is present at a position receded from the end (short side) of the substrate 11 in the longitudinal direction. Thereby, since the insulation distance of the conductive part (LED element 12) and the metal pattern 14 in the both ends of the board | substrate 11 can be lengthened, the proof pressure of the board | substrate 11 can be improved.

In the present embodiment, the metal pattern 14 is formed so as to overlap with a part of the LED element 12. However, when it is desired to further increase the withstand voltage of the substrate 11, the metal pattern 14 is the entire LED element 12. It is better to form so as not to overlap with.

Further, in the present embodiment, as shown in FIG. 3B, the metal pattern 14 is preferably formed so as not to overlap the electrode terminal 15 when the substrate 11 is viewed in plan. That is, a metal pattern is formed on the second main surface 11 b (the second main surface 11 b facing the electrode terminal 15 with the substrate 11 interposed therebetween) facing the electrode terminal 15 provided on the first main surface 11 a of the substrate 11 When patterning a metal film (copper foil) without forming 14, it is preferable to etch away this portion as well.

Thereby, since the insulation distance between the conductive portion (electrode terminal 15) and the metal pattern 14 can be increased, the withstand voltage of the substrate 11 can be improved.

Further, in order to improve the reflectance of the resist 16, the resist 16 may have a two-layer structure. For example, a substantially high reflectance resist 16 can be obtained by laminating two low reflectance white resist layers. When the resist 16 having a two-layer structure was actually formed, it was confirmed that at least the wiring 13 had high reflectance. That is, the wiring 13 is difficult to see as compared with the case where one layer of low-reflectance white resist is formed.

Furthermore, there is a case where it is desired to mark information such as characters in the LED module in the resist 16. In such a case, a thin, convex character (a portion where the third layer resist is left) is formed by further applying or printing the resist on the two-layered resist 16 and etching the third layer resist. Can be formed. However, in this case, since it is necessary to form three layers of resist, the cost is increased.

Therefore, it is conceivable to mark a character by providing a groove in the second layer resist in the two-layer resist 16 (double resist). That is, the portion from which the resist is removed can be recognized as characters. In this case, it is preferable that the groove formed in the resist is not formed in the vicinity of the wiring 13. Hereinafter, this point will be described with reference to FIG. (A) of FIG. 7 is a partially enlarged cross-sectional view of the LED module according to a modification of the embodiment of the present invention, and (b) of FIG. 7 is the same LED at line AA 'of (a) It is sectional drawing of a module.

For example, as shown in (a) of FIG. 7, it may be desirable to number the LED elements near the LED elements 12 as characters 18 so that the positions (orders) of the LED elements 12 can be known. In this case, as shown in (b) of FIG. 7, the resist 16 is a two-layer consisting of the lower resist 16a (first resist) and the upper resist 16b (second resist) stacked on the lower resist 16a. The character 18 can be marked by forming the groove 18 a in the upper resist 16 b according to the structure and the shape of the character 18. That is, the character 18 is visually made visible by removing a part of the upper resist 16b. Specifically, after the lower resist 16a is formed, the upper resist 16b is formed to be laminated on the lower resist 16a, and thereafter, the upper resist 16b is matched with the character 18 of a predetermined shape by performing etching or the like. Selectively remove

At this time, when the characters 18 (grooves 18 a) exist in the vicinity of the wiring 13, the resist 16 in the portion of the characters 18 (grooves 18 a) is only one layer of the lower resist 16 a. In this case, since the vicinity of the wiring 13 is only one layer of the lower resist 16a, the breakdown voltage is lowered as compared with the other part which is two layers. In particular, since the resist 16 (lower resist 16a) is formed by coating or the like, the film thickness of the resist 16 (lower resist 16a) is thin at the upper corner of the wiring 13 as shown in FIG. 7B. Become. For this reason, if the characters 18 (grooves 18a) overlap the upper corner of the wiring 13, the withstand voltage is significantly reduced. In fact, when the characters 18 (grooves 18 a) and the wiring 13 were formed in an overlapping manner, a discharge phenomenon occurred.

Therefore, in the case where a groove is provided in the resist on the upper side in the resist 16 having a two-layer structure (multiple layer structure), it is preferable not to form the groove in the vicinity of the wiring 13. In particular, it is preferable that the groove formed in the upper resist is not formed on the wiring 13. Conversely, it is preferable to form the groove such that two layers of resist exist on the wiring 13. Thereby, the breakdown voltage of the substrate 11 can be suppressed from decreasing.

[Lighting device]
Next, the illumination device 2 according to the embodiment of the present invention will be described with reference to FIG. FIG. 8 is a schematic perspective view of a lighting device according to an embodiment of the present invention.

As shown in FIG. 8, a lighting device 2 according to an embodiment of the present invention is a base light, and includes a straight tube LED lamp 1 and a lighting fixture 100.

As the straight tube LED lamp 1 shown in FIG. 8, the straight tube LED lamp 1 in the above embodiment is used as a light source for illumination. In the present embodiment, as shown in FIG. 8, two straight tube type LED lamps 1 are used.

The lighting fixture 100 includes a pair of sockets 110 electrically connected to the straight tube LED lamp 1 and holding the straight tube LED lamp 1 and a fixture body 120 to which the socket 110 is attached. The tool body 120 can be formed, for example, by pressing an aluminum steel plate. Further, the inner surface of the tool body 120 is a reflective surface that reflects the light emitted from the straight tube LED lamp 1 in a predetermined direction (for example, the lower side).

The lighting fixture 100 configured in this way is mounted on, for example, a ceiling via a fixture. The lighting apparatus 100 incorporates a power supply circuit or the like for controlling lighting of the straight tube LED lamp 1. In addition, a translucent cover member may be provided to cover the straight tube LED lamp 1.

As mentioned above, the straight tube | pipe type LED lamp 1 which concerns on embodiment of this invention is realizable as an illuminating device etc. FIG.

(Modification)
Next, the modification of the straight tube | pipe type LED lamp which concerns on the said embodiment is demonstrated using drawing.

In the above embodiment, the casing 20 is a non-divided cylindrical one, but may be a split type. Hereinafter, the case where the LED module 10 shown in FIG. 3 is applied to a split-type straight tube type LED lamp will be described using FIG. FIG. 9 is a whole perspective view and a partially enlarged view of a straight tube type LED lamp according to a modification of the embodiment of the present invention.

As shown in FIG. 9, a straight tube type LED lamp 1A according to this modification is an example of a light source for illumination which substitutes for a conventional straight tube fluorescent lamp, and has a length covering the LED module 10 and the LED module 10 A light-transmissive cover 20A in the form of a strip, a long base 50A on which the LED module 10 is mounted, the LED module 10 and the base 50A, a cap 30A for feeding, and a cap 40A for non-feeding .

In this modification, a long cylindrical case (outer envelope) is configured by the translucent cover 20A and the base 50A. That is, by connecting the translucent cover 20A and the base 50A, a cylindrical casing having an opening at both ends is formed. Further, when the translucent cover 20A and the base 50A are combined, the outline of the cross section perpendicular to the longitudinal direction is circular.

The translucent cover 20A is a translucent member having a substantially semi-cylindrical translucent member, and a cross-sectional shape in a plane (YZ plane) perpendicular to the X axis is substantially a semicircular arc. The translucent cover 20A is fixed to the metal base by engaging the edge portions on both sides in the circumferential direction with the step portion of the base 50A. In addition, translucent cover 20A can be formed using resin materials, such as an acryl and a polycarbonate, for example.

The base 50A is a long member and is covered by a translucent cover 20A. In the present modification, the base 50A is a metal base made of metal. For example, an extruded material made of aluminum can be used as the base 50A. The base 50A functions as a heat sink for radiating heat generated by the LED module 10, and also functions as a mounting table for mounting and fixing the LED module 10. In order to radiate heat directly from the base 50A to the outside of the lamp, a part of the base 50A is configured to be exposed to the outside of the lamp. A resin base made of resin may be used as the base 50A.

The inner portion of the base 50A on the translucent cover 20A side is a plate-like placement portion 51A having a placement surface on which the LED module 10 is placed. Further, a plurality of heat radiation fins 52A are provided as a heat radiation portion on an outer side portion which is a back surface of the mounting surface of the base 50A. The heat dissipating fins 52A are exposed to the outside of the lamp and provided so as to project outward from the mounting portion 51A. A plurality of heat radiation fins 52A are formed along the longitudinal direction (X-axis direction) of the base 50A. A plurality of heat dissipating fins 52A may be formed along the lateral direction (Y-axis direction) of the base 50A.

Furthermore, the step part with which the edge of the both sides of the circumferential direction of translucent cover 20A is engaged is provided in the both ends of the width direction of base 50A. The translucent cover 20A and the base 50A are engaged by sliding the translucent cover 20A in the longitudinal direction onto the base 50A or by fitting the translucent cover 20A from above the base 50A. Can. The translucent cover 20A and the base 50A may be bonded by an adhesive. Also, without using an adhesive, a rail groove is provided in the longitudinal direction of the base 50A, and in this rail groove, along the end of the translucent cover 20A in the lateral direction or the longitudinal direction of the translucent cover 20A. The translucent cover 20A and the base 50A may be engaged by inserting the provided protrusion.

The power supply cap 30A includes a power supply cap body 31A and a pair of power supply pins 32. The base body 31A for feeding is an undivided structure, and is configured in a cap shape so as to cover one end in the longitudinal direction of a long casing composed of the translucent cover 20A and the base 50A. It is done.

The non-feed cap 40A includes a non-feed cap body 41A and a pair of non-feed pins. The non-feed mouthpiece main body 41A has an undivided structure, and is cap-shaped to cover the other end of the elongated casing formed by the translucent cover 20A and the base 50A in the longitudinal direction. It is configured. In addition, you may give a grounding function to the nozzle | cap | die 40A for non electric power feeding similarly to said embodiment.

(Others)
As mentioned above, although the illuminating device, the light source for illumination, and the illuminating device which concern on this invention were demonstrated based on embodiment and a modification, this invention is not limited to said embodiment and modification.

For example, in the above embodiment and modification, the shape of the metal pattern 14 is meshed, but the present invention is not limited to this. The metal pattern 14 may have a shape other than mesh as long as it has a predetermined residual copper ratio. For example, the metal pattern 14 may be in the form of a plurality or a single line, or may be in the form of a plurality or a single ring.

Further, the pattern shape of the metal pattern 14 is not limited to the rectangular shape. For example, the pattern shape of the metal pattern 14 may be a honeycomb shape. In this case, for example, as shown in FIG. 10A, the metal pattern 14 (hatched portion in the figure) may be formed so that the portion in which copper is left in a line shape becomes a honeycomb shape, or as shown in FIG. The remaining shape obtained by removing copper in a honeycomb shape may be the metal pattern 14 (hatched portion in the figure). The physical strength of the substrate 11 can be improved by forming the metal pattern 14 into a honeycomb shape as described above. Further, as shown in FIG. 11, the pattern shape of the metal pattern 14 (hatched portion in the figure) may be triangular.

In the above-described embodiment and modification, the wiring 13 is formed from one end of the substrate 11 in the longitudinal direction to the other end, but the invention is not limited thereto. For example, the wiring 13 may be formed in a part of the substrate 11 in the longitudinal direction. In this case, a dummy pattern (discarded pattern) 13D may be formed in a region of the first main surface 11a of the substrate 11 where the wiring 13 is not formed. For example, as shown in FIG. 12, when the wiring 13 (hatched portion) is formed concentrated in the central portion of the substrate 11, dummy patterns 13D (hatched portion in the figure) are formed on each of both ends of the substrate 11. Form Thereby, since the metal part in the 1st principal surface 11a of substrate 11 can be equalized in the whole 1st principal surface 11a, the curvature of substrate 11 can be controlled effectively. The dummy pattern 13D is a non-wiring like the metal pattern 14 on the second major surface 11b, and is in a floating state electrically. The dummy pattern 13D can be formed simultaneously with the wiring 13, for example.

Further, in the above-described embodiment and modification, in the substrate 11, the wiring 13 formed on the first major surface 11 a and the metal pattern 14 formed on the second major surface 11 b are different patterns. And the metal pattern 14 may have the same shape. In other words, the metal portions on both sides of the substrate 11 may have the same pattern. For example, the metal pattern 14 can have the same shape as the wiring 13.

Moreover, in said embodiment and modification, although length L 1 of the longitudinal direction of the board | substrate 11 was 300 mm or more, it does not restrict to this. For example, the length L1 of the substrate 11 may be less than 300 mm. By setting the length L1 of the substrate 11 to less than 300 mm as described above, the amount of warpage of the substrate 11 can be further reduced.

Further, the substrate 11 is obtained, for example, by dividing one mother substrate into a plurality of pieces by dicing. However, as shown in FIG. 13, the substrate 11 and the disused substrate 11D discarded after dicing the mother substrate 11M are also obtained. Similarly, a mesh-like metal pattern may be formed. Thereby, the warp of the mother substrate M can be suppressed.

In the above-described embodiment and modification, although the single-sided feeding method in which feeding is performed from one side of only the power supply caps 30, 30A, a double-sided feeding method in which feeding is performed from both sides may be used. In this case, the power supply caps 30, 30A may be provided instead of the non-power supply caps 40, 40A.

Further, in the above-described embodiment and the modification, although the power supply pins 30, 30A are L-shaped bases in which the feed pins 32 are a pair of L-shaped pins, they may be G13 bases. Similarly, the non-power-supplying

caps

40 and 40A may also be G13 caps. As described above, a one-pin two-pin base structure in which one of the two bases is one pin (one pin) and the other is two pins (two pins) may be used, or both bases may be two. A two-pin / two-pin base structure with two pins (two pins) may be used.

Moreover, in said embodiment and modification, although packaged LED element 12 was used as LED module 10, it does not restrict to this. For example, it may be a COB (Chip On Board) type LED module in which a plurality of LED chips are directly mounted on the substrate 11. In this case, the plurality of LED chips may be collectively sealed or individually sealed by a sealing member such as a phosphor-containing resin.

Moreover, in said embodiment and modification, although LED module 10 (LED element 12) was comprised so that white light might be emitted with blue LED chip and yellow fluorescent substance, it does not restrict to this. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used to emit white light by combining this with a blue LED. Also, an LED chip that emits a color other than blue may be used.

Further, in the above embodiment and modifications, an LED is illustrated as a light emitting element, but a semiconductor light emitting element such as a semiconductor laser, or an EL element such as organic EL (Electro Luminescence) or inorganic EL, or other solid light emitting element May be used.

In addition, the present invention can be realized by arbitrarily combining components and functions in each embodiment without departing from the scope of the present invention or embodiments obtained by applying various modifications that those skilled in the art may think to each embodiment. The form is also included in the present invention.

The present invention can be widely used in a light emitting device using a light emitting element such as an LED, for example, a light emitting device having a long substrate. In addition, the light emitting device can be widely used in an illumination light source, an illumination device, and the like.

DESCRIPTION OF

SYMBOLS

1 and 1A Straight tube type LED lamp 2 Lighting device 10 LED module 11 Substrate 11a 1st main surface 11b 2nd main surface 11M Mother substrate 11D Discarding substrate 12 LED element 12a package

12b LED chip

12c Sealing member 13 Wiring 13D dummy Pattern 14 Metal pattern 15

Electrode terminal

16, 16A, 17 Resist 16a Lower resist 16b Upper resist 18 Character 18a Groove 20

Case

30, 30A

Power supply cap

31, 31A Power supply cap body 31a First power supply cap body 31b 2 Charge base body 32

Feeding pin

40, 40A base for

non power supply

41, 41A base for non power supply 41a first base for non power supply 41b second base for power non body 42 non power feed pin 50 first group Pedestal 50A base 51 first wall 51a first projection 51 1st notch 51A placing portion 52 2nd wall 52A heat radiation fin 52a 2nd projection 52b 2nd notch 53 biasing portion 54 opening 55 second base 60 connector 61 mounting portion 62 power supply line 70 reflection Member 80 Mounting member 81 Hooking piece 82 Recess 90 Lighting circuit 90a Circuit board 90b Circuit element group

90c Input socket

90d Output socket 91 Lighting circuit cover 100 Lighting fixture 110 Socket 120 Fixture body

Claims

With a long substrate,
A light emitting element mounted on the first main surface of the substrate;
A first metal pattern which is a wiring pattern formed on the first main surface and electrically connected to the light emitting element;
A second metal pattern which is patterned on a second main surface opposite to the first main surface of the substrate and which is not a wire;
The light emitting device according to claim 1, wherein the second metal pattern is formed in a mesh shape.
The ratio of the area of the second metal pattern to the area of the second main surface is 60% or less.
The ratio of the area of the first metal pattern to the area of the first main surface is equal to or less than the ratio of the area of the second metal pattern to the area of the second main surface. Light emitting device.
The ratio of the area of the second metal pattern to the area of the second main surface and the ratio of the area of the first metal pattern to the area of the first main surface are substantially the same. The light emitting device according to any one of to 3.
The light emitting device according to any one of claims 1 to 4, wherein the first metal pattern and the second metal pattern are made of the same metal material.
The light emitting device according to claim 5, wherein the metal material is copper.
When the substrate is viewed in plan, the second metal pattern is formed so as not to overlap with at least a part of the light emitting element mounted on an end portion in the longitudinal direction of the substrate. The light-emitting device according to any one of the above.
Furthermore, it has an electrode terminal for receiving power for making the light emitting element emit light from the outside,
The light emitting device according to any one of claims 1 to 7, wherein the second metal pattern is formed so as not to overlap the electrode terminal when the substrate is viewed in plan.
further,
A first resist formed on the first main surface to cover the first metal pattern;
And a second resist laminated on the first resist,
The light emitting device according to any one of claims 1 to 8, wherein a groove formed in the second resist is not formed on the first metal pattern.
Assuming that the length in the longitudinal direction of the substrate is L1, and the length in the lateral direction of the substrate is L2.
The light emitting device according to any one of claims 1 to 9, wherein L1 / L2 ≧ 38.6.
The light emitting device according to any one of claims 1 to 10, wherein the substrate is a resin substrate made of a resin.
And a resist formed on the first main surface to cover the first metal pattern,
A plurality of light emitting elements are mounted,
The light emitting device according to claim 1, wherein the resist is a discolored resist.
The light emitting device according to claim 12, wherein the resist is discolored from white to yellow.
The light emitting device according to claim 12, wherein the resist is discolored by heating.
The light emitting device according to any one of claims 12 to 14, wherein the reflectance of the resist before color change is 90% or less.
The light emitting device according to claim 15, wherein the reflectance of the resist before the color change is 85% or more.
A light emitting device according to any one of claims 1 to 16;
And a long case for housing the light emitting device.
And a long base housed in the housing.
The illumination light source according to claim 17, wherein the light emitting device is disposed on the base.
The housing comprises an elongated translucent cover and an elongated base forming a part of the envelope.
The illumination light source according to claim 17, wherein the light emitting device is disposed on the base.
An illumination device comprising the illumination light source according to any one of claims 17 to 19.