KR100791594B1 - Illuminator having radiating unit - Google Patents

Illuminator having radiating unit Download PDF

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Publication number
KR100791594B1
KR100791594B1 KR1020060083568A KR20060083568A KR100791594B1 KR 100791594 B1 KR100791594 B1 KR 100791594B1 KR 1020060083568 A KR1020060083568 A KR 1020060083568A KR 20060083568 A KR20060083568 A KR 20060083568A KR 100791594 B1 KR100791594 B1 KR 100791594B1
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led
circuit
heat dissipation
heat
present
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KR1020060083568A
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Korean (ko)
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이승민
최기승
양종경
박노준
박대희
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원광대학교산학협력단
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/87—Organic material, e.g. filled polymer composites; Thermo-conductive additives or coatings therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

An illuminator having a radiating unit is provided to improve performance of an LED by emitting heat generated from the LED to the outside through a heat emitting part between a circuit board and the LED. An illuminator having a radiating unit includes a base part(1), a circuit part(3), a heat emitting part(5), and an LED(7). The circuit part for conducting electricity is installed in the base part. The LED is placed on the top of the heat emitting part and is electrically connected to the circuit part. The heat emitting part is placed at a regular distance from the top of the circuit part so as not to be interfered with the top of the circuit part. The heat emitting part is separated from the circuit part by one of a coating material(9) and a prop.

Description

방열부를 갖는 조명장치 {ILLUMINATOR HAVING RADIATING UNIT} Lighting device with heat dissipation unit {ILLUMINATOR HAVING RADIATING UNIT}

도 1은 본 발명의 일 실시예에 따른 조명장치의 측면도. 1 is a side view of a lighting apparatus according to an embodiment of the present invention.

도 2는 도 1의 사시도. 2 is a perspective view of FIG.

도 3은 본 발명의 다른 실시예에 따른 조명장치의 측면도. 3 is a side view of a lighting apparatus according to another embodiment of the present invention.

< 도면의 주요부분에 대한 부호의 설명 > <Description of Symbols for Major Parts of Drawings>

1 : 베이스부 2 : 회로부1: Base 2: Circuit

5 : 방열부 7 : LED5: radiator 7: LED

본 발명은 방열부를 갖는 조명장치에 관한 것이다. 더욱 상세하게는 회로기판과 LED의 사이에 구비되는 방열부에 의해 LED에서 발생되는 열이 외부로 방출되어 LED의 성능이 향상되는 방열부를 갖는 조명장치에 관한 것이다.The present invention relates to a lighting device having a heat dissipation unit. More particularly, the present invention relates to a lighting device having a heat dissipation unit in which heat generated from the LED is radiated to the outside by a heat dissipation unit provided between the circuit board and the LED to improve the performance of the LED.

일반적으로, 조명장치로는 형광등, 백열전구, 3파장램프 등을 사용하였다. In general, a fluorescent lamp, an incandescent lamp, a three-wavelength lamp or the like is used as the lighting device.

그러나, 이러한 조명장치들은 램프의 수명이 길지 못하여 램프를 자주 교체하여야 하는 불편함이 있고, 그 크기가 커서 사용상 불편한 문제점이 있었다.However, these lighting devices are inconvenient to replace the lamp frequently because the life of the lamp is not long, there is a problem in that the size is large and inconvenient to use.

이와 같은 문제점을 개선하기 위해 근래에는 LED를 이용한 LED조명장치를 많이 사용하고 있다. In order to improve such a problem, the LED lighting apparatus using LED is used a lot recently.

그러나, 이와 같은 종래의 LED조명장치는 LED에서 발생되는 열을 방출하기 위한 방열부가 구비되어 있지 않아, LED의 성능이 저하되는 문제점이 있다.However, such a conventional LED lighting device is not provided with a heat radiating portion for dissipating heat generated from the LED, there is a problem that the performance of the LED is reduced.

또한, LED에서 측면이나 후면으로 발산되는 빛의 손실에 의해 LED의 휘도가 떨어지는 구조적인 문제점이 있다.In addition, there is a structural problem that the brightness of the LED is lowered by the loss of light emitted from the side or back of the LED.

이와 같이, 본 발명과 관련되는 선행기술로 대한민국 특허공개공보 10- 2006-0033677호(공개일 : 2006.04.19.) "발열 구조를 구비한 LED 램프"에 의하면, 순동으로 이루어진 넓은 면적의 리드프레임을 구성하고 이를 에폭시 수지로 이루어진 방열블록으로 둘러싸 리드프레임의 넓은 면적과 이를 통한 에폭시 수지와의 직접 접촉으로 인하여 방열하고, 또한 리드프레임의 저면에 방열체를 융착하여 방열면적을 증대시킴으로써 LED 램프로부터 발생되는 열을 방열시켜, 대용량의 전류가 인가되는 경우에도 발생되는 열로 인한 LED 소자의 손상을 최소화시킬 수 있는 LED 램프를 제공하고 있다.Thus, according to the prior art related to the present invention Korean Patent Publication No. 10-2006-0033677 (published: 2006.04.19.) According to the "LED lamp having a heat generating structure", a lead frame of a large area made of pure copper It is surrounded by a heat-dissipating block made of epoxy resin and radiated due to the large area of the lead frame and direct contact with the epoxy resin through it, and also the heat dissipation is bonded to the bottom of the lead frame to increase the heat dissipation area from the LED lamp. The heat dissipation of the generated heat, even when a large amount of current is applied to provide an LED lamp that can minimize the damage of the LED element due to the generated heat.

그러나, 종래의 LED 램프는 넓은 면적의 리드프레임과, 리드프레임의 저면에 융착된 방열체와, 수지로 이루어진 방열블록을 구성하여야 하므로, 제조시간 및 제조비용이 증가하는 문제점이 있다. However, the conventional LED lamp has a problem that the lead frame of a large area, the heat sink fused to the bottom surface of the lead frame, and a heat dissipation block made of a resin, thereby increasing the manufacturing time and manufacturing cost.

또한, 리드프레임의 면적을 넓히는데 한계가 있기 때문에 방열효과가 극대화되기 어려운 문제점이 있다. In addition, since there is a limit to widening the area of the lead frame, there is a problem that the heat dissipation effect is difficult to maximize.

본 발명은 상기와 같은 문제점을 해결하기 위하여 안출된 것으로, 본 발명의 목적은 LED에서 발생되는 열을 방열할 수 있는 방열부를 갖는 조명장치를 제공하는 데 있다. The present invention has been made to solve the above problems, an object of the present invention to provide a lighting device having a heat dissipation unit that can dissipate heat generated from the LED.

본 발명의 다른 목적은 LED에서 발산되는 빛을 반사할 수 있는 방열부를 갖는 조명장치를 제공하는 데 있다. Another object of the present invention to provide a lighting device having a heat dissipation unit that can reflect the light emitted from the LED.

본 발명의 목적을 구현하기 위한 본 발명은 베이스부와; 상기 베이스부에 설치되어 전기가 도통되는 회로부과; 상기 회로부의 상부에 구비되는 방열부와; 상기 방열부의 상부에 배치되면서 상기 회로부와 전기적으로 연결되는 LED를 포함하여 구성하며, 상기 방열부는 상기 회로부의 상부와 간섭되지 않게 소정간격 이격되게 배치되는 것을 특징으로 한다.The present invention for realizing the object of the present invention; A circuit part installed at the base part to conduct electricity; A heat dissipation unit provided at an upper portion of the circuit unit; It is configured to include an LED that is disposed on the upper portion of the heat dissipation and electrically connected to the circuit portion, characterized in that the heat dissipation portion is arranged to be spaced apart a predetermined interval so as not to interfere with the upper portion of the circuit portion.

상기 방열부(5)는 코팅재(9) 또는 받침부(10) 중 어느 하나에 의해 회로부(3)와 소정간격 이격되는 것을 특징으로 한다.The heat dissipation part 5 is characterized by being spaced apart from the circuit part 3 by any one of the coating material 9 or the support part 10.

상기 방열부는 Aluminum, Gold, Chromium, Copper, Nickel, Solder 중 어느 하나인 것을 특징으로 한다. The heat dissipation unit is characterized in that any one of Aluminum, Gold, Chromium, Copper, Nickel, Solder.

여기서, 본 발명에 사용되는 LED는 through hole type을 사용한다. Here, the LED used in the present invention uses a through hole type.

이하, 본 발명의 실시예를 도면을 근거로 상세히 설명하면 다음과 같다.Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

도 1은 본 발명의 일 실시예에 따른 조명장치의 측면도이고, 도 2는 도 1의 사시도이며, 도 3은 본 발명의 다른 실시예에 따른 조명장치의 측면도이다. 1 is a side view of a lighting apparatus according to an embodiment of the present invention, Figure 2 is a perspective view of Figure 1, Figure 3 is a side view of a lighting apparatus according to another embodiment of the present invention.

도 1 내지 도 3에 도시된 바와 같이, 본 발명은 베이스부(1)가 구비된다. 이 베이스부(1)의 상부에는 실장부품(미도시)과 전기적으로 연결되는 회로부(3)이 설치되고, 회로부(3)의 상부에는 방열부(5)가 구비된다. 그리고, LED(7)가 회로부(3)과 전기적으로 연결되도록 방열부(5)의 상부에 배치된다. As shown in Figures 1 to 3, the present invention is provided with a base (1). The upper part of this base part 1 is provided with the circuit part 3 electrically connected with a mounting component (not shown), and the heat dissipation part 5 is provided in the upper part of the circuit part 3. In addition, the LED 7 is disposed above the heat dissipation part 5 so as to be electrically connected to the circuit part 3.

이와 같이 구성되는 베이스부(1), 회로부(3), 방열부(5)를 총칭하여 PCB라 한다. The base part 1, the circuit part 3, and the heat dissipation part 5 comprised in this way are called generically PCB.

여기서, 방열부(5)는 Aluminum, Gold, Chromium, Copper, Nickel, Solder 중 어느 하나를 선택하여 사용할 수 있다. 즉, 방열부(5)는 액체상태의 Aluminum, Gold, Chromium, Copper, Nickel, Solder 중 어느 하나를 회로부(3)의 상부에 소정의 두께로 도포하거나 또는 테이핑하여 사용할 수 있다. Here, the heat dissipation unit 5 may be used to select any one of Aluminum, Gold, Chromium, Copper, Nickel, Solder. That is, the heat dissipation unit 5 may be used by applying or taping any one of liquid aluminum, gold, chromium, copper, nickel, and solder to the upper portion of the circuit unit 3 to a predetermined thickness.

이때, 회로부(3)의 상부 전면 또는 LED(7)의 하부에만 선택적으로 도포하거나 테이핑할 수 있다. At this time, it may be selectively applied or taped only to the upper front of the circuit portion 3 or the lower portion of the LED (7).

또한, 방열부(5)는 Aluminum, Gold, Chromium, Copper, Nickel, Solder 중 어느 하나를 이용하여 소정의 두께를 갖는 패드형상으로 제조하여 회로부(3)의 상부에 부착하여 사용할 수 있다. In addition, the heat dissipation unit 5 may be manufactured in a pad shape having a predetermined thickness by using any one of aluminum, gold, chromium, copper, nickel, and solder and attached to the upper portion of the circuit unit 3.

이때, 방열부(5)는 회로부(3)의 상부와 간섭되지 않게 소정간격 이격되게 배치되는 것이 좋다. 즉, 방열부(5)는 금속이므로 회로부(3)와 소정간격 이격되어 서로 간섭되지 않는 것이 바람직하다. At this time, the heat dissipation unit 5 may be disposed to be spaced apart by a predetermined interval so as not to interfere with the upper portion of the circuit unit (3). That is, since the heat radiating portion 5 is a metal, it is preferable that the heat radiating portion 5 is spaced apart from the circuit portion 3 by a predetermined interval so as not to interfere with each other.

다시 말하면, 방열부(5)를 회로부(3)의 상부에 도포하거나 테이핑할 때 회로부(3)의 상부면을 소정두께의 합성수지인 코팅재(9)로 먼저 코팅하면 도포되거나 테이핑되는 방열부(5)는 회로부(3)로부터 소정간격 이격되게 배치된다. In other words, when the heat dissipating part 5 is applied or taped on the upper part of the circuit part 3, the heat dissipating part 5 applied or taped when the upper surface of the circuit part 3 is first coated with the coating material 9, which is a synthetic resin having a predetermined thickness, is applied. ) Is spaced apart from the circuit portion 3 by a predetermined interval.

또한, 두께의 패드형상으로 된 방열부(5)는 회로부(3)의 상부에 코팅된 코팅재(9)에 의해 이격될 수도 있고, 회로부(3)의 상부 소정부위에 다수개의 받침부(10)를 구비하여 방열부(5)의 하부를 지지할 수도 있다.In addition, the heat dissipation part 5 having a pad shape having a thickness may be spaced apart by the coating material 9 coated on the circuit part 3, and the plurality of supporting parts 10 may be disposed at a predetermined upper part of the circuit part 3. It may be provided to support the lower portion of the heat dissipation unit (5).

여기서 받침부(10)는 돌기, 지지턱 등으로 선택적으로 형성되어 사용될 수 있다. Here, the supporting part 10 may be selectively formed and used as protrusions, support jaws, and the like.

이와 같이 구성되는 본 발명은 LED(7)에서 발생되는 열이 방열부(5)에 의해 외부로 방출되므로, LED(7)의 성능이 저하되지 않아 장기간 사용할 수 있다. In the present invention configured as described above, since the heat generated from the LED 7 is released to the outside by the heat dissipation unit 5, the performance of the LED 7 does not decrease and can be used for a long time.

그리고, LED(7)에서 측면이나 후면으로 발산되는 빛이 방열부(5)에 의해 전면으로 반사되므로, LED(7)의 휘도가 높아져 더욱 밝은 빛이 발산된다.And, since the light emitted from the LED 7 to the side or the back is reflected to the front by the heat dissipation unit 5, the brightness of the LED 7 is increased to emit more bright light.

이상 본 발명의 바람직한 실시예에 대해 상세히 기술하였지만, 본 발명이 속하는 기술분야에 있어서 통상의 지식을 가진 사람이라면, 청구범위에 기재된 범위를 벗어나지 않으면서 본 발명을 여러 가지로 변형 또는 설계변경하여 실시하는 경우에는 본 발명의 범주로 간주한다. Although the preferred embodiments of the present invention have been described in detail above, those of ordinary skill in the art to which the present invention pertains may implement the present invention by various modifications or design changes without departing from the scope of the claims. In case it is regarded as the scope of the present invention.

본 발명은 LED의 하부에 구비되는 방열부에 의해 LED에서 발생되는 열이 외부로 방출되어 LED의 성능이 향상되는 이점이 있다.The present invention has the advantage that the heat generated from the LED is radiated to the outside by the heat radiating portion provided in the lower portion of the LED to improve the performance of the LED.

또한, 본 발명은 방열부에 의해 LED에서 발생되는 빛을 반사하여 휘도가 향상되는 이점이 있다.In addition, the present invention has the advantage that the brightness is improved by reflecting the light generated from the LED by the radiator.

Claims (3)

베이스부(1)와; A base part 1; 상기 베이스부(1)에 설치되어 전기가 도통되는 회로부(3)과; A circuit section 3 installed on the base section 1 for conducting electricity; 상기 회로부(3)의 상부에 구비되는 방열부(5)와; A heat dissipation unit 5 provided above the circuit unit 3; 상기 방열부(5)의 상부에 배치되면서 상기 회로부(3)와 전기적으로 연결되는 LED(7)를 포함하여 구성되며, It is configured to include an LED (7) which is disposed on the upper portion of the heat dissipation portion 5 and electrically connected to the circuit portion (3), 상기 방열부(5)는 상기 회로부(3)의 상부와 간섭되지 않게 소정간격 이격되게 배치되는 것을 특징으로 하는 방열부를 갖는 조명장치. The heat dissipating unit (5) is a lighting device having a heat dissipating unit, characterized in that arranged at a predetermined interval so as not to interfere with the upper portion of the circuit (3). 제 1항에 있어서, 상기 방열부(5)는 코팅재(9) 또는 받침부(10) 중 어느 하나에 의해 회로부(3)와 소정간격 이격되는 것을 특징으로 하는 방열부를 갖는 조명장치. 2. The lighting apparatus according to claim 1, wherein the heat dissipation part is spaced apart from the circuit part by a predetermined distance by either the coating material or the support part. 제 1항에 있어서, 상기 방열부(5)는 Aluminum, Gold, Chromium, Copper, Nickel, Solder 및 이들의 혼합물 중 어느 하나인 것을 특징으로 하는 방열부를 갖는 조명장치. The lighting device according to claim 1, wherein the heat dissipation part (5) is any one of aluminum, gold, chromium, copper, nickel, solder, and a mixture thereof.
KR1020060083568A 2006-08-31 2006-08-31 Illuminator having radiating unit KR100791594B1 (en)

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100859419B1 (en) 2007-12-31 2008-09-22 이수규 Scatter radiant heat system of street lamp that do led by light source
KR100892224B1 (en) * 2008-01-30 2009-04-06 (주)썬웨이브 Radiant heat structre for pin type power led
KR100933020B1 (en) 2009-05-15 2009-12-23 주식회사 선에너지엘이디 The led street lamp to improve heat discharge and luminous intensity function
KR101152885B1 (en) 2009-04-08 2012-06-07 김선미 Both faces board assembly having radiate heat means and manufacturing method thereof
KR101425588B1 (en) 2012-05-31 2014-07-31 리엔리하이테크(주) Method of manufacturing led

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KR20020035819A (en) 2002-04-25 2002-05-15 주식회사 포스기술 Water-proof and dust-free LED matrix module having a reflector plane capable of playing a role of a radiator plate and forming process thereof
KR20050090918A (en) 2004-03-10 2005-09-14 (주)나노팩 Light emitting device and package structure and method of manufacturing thereof
KR20050122365A (en) 2004-06-24 2005-12-29 주식회사에스엘디 A circuit board having heat sink plate
KR20060083984A (en) 2003-09-30 2006-07-21 가부시끼가이샤 도시바 Light emitting device

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Publication number Priority date Publication date Assignee Title
KR20020035819A (en) 2002-04-25 2002-05-15 주식회사 포스기술 Water-proof and dust-free LED matrix module having a reflector plane capable of playing a role of a radiator plate and forming process thereof
KR20060083984A (en) 2003-09-30 2006-07-21 가부시끼가이샤 도시바 Light emitting device
KR20050090918A (en) 2004-03-10 2005-09-14 (주)나노팩 Light emitting device and package structure and method of manufacturing thereof
KR20050122365A (en) 2004-06-24 2005-12-29 주식회사에스엘디 A circuit board having heat sink plate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100859419B1 (en) 2007-12-31 2008-09-22 이수규 Scatter radiant heat system of street lamp that do led by light source
KR100892224B1 (en) * 2008-01-30 2009-04-06 (주)썬웨이브 Radiant heat structre for pin type power led
WO2009096742A2 (en) * 2008-01-30 2009-08-06 Sun-Wave Co., Ltd Radiant heat structure for pin type power led
WO2009096742A3 (en) * 2008-01-30 2009-11-05 (주)썬웨이브 Radiant heat structure for pin type power led
KR101152885B1 (en) 2009-04-08 2012-06-07 김선미 Both faces board assembly having radiate heat means and manufacturing method thereof
KR100933020B1 (en) 2009-05-15 2009-12-23 주식회사 선에너지엘이디 The led street lamp to improve heat discharge and luminous intensity function
KR101425588B1 (en) 2012-05-31 2014-07-31 리엔리하이테크(주) Method of manufacturing led

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