KR101152885B1 - Both faces board assembly having radiate heat means and manufacturing method thereof - Google Patents

Abstract

A double-sided board assembly having heat dissipation means according to an embodiment of the present invention, the first and second electrodes formed on at least one light emitting body; First and second installation holes formed on the double-sided substrate to insert the first and second electrodes; And a heat dissipation part which is formed between the first and second electrodes and the first and second installation holes and extends to the rear surface of the double-sided substrate to absorb heat generated from the light emitting portion of the light emitting body and discharge the heat to the rear surface.

When using the double-sided board assembly having a heat dissipation means according to the present invention, when the solder leg is inserted into the mounting hole of the large-diameter double-sided board, such as the LED or laser diode, and soldered, the body member is inserted deeply into the installation hole and It is formed of a heat dissipation unit having a cover member exposed to the outside to increase the heat dissipation efficiency.

In addition, since the diameter of the mounting hole of the double-sided substrate on which the electrode of the light emitting body is installed is larger than the diameter of the electrode, the light emitting body can be fixed by moving the first and second electrodes of the light emitting body at a diagonal midpoint. Precise placement is possible, making it possible to realize an excellent design.

LED, both sides, solder, heat dissipation part, body member, cover member

Description

Double-sided board assembly having heat dissipation means and manufacturing method thereof {BOTH FACES BOARD ASSEMBLY HAVING RADIATE HEAT MEANS AND MANUFACTURING METHOD THEREOF}

The present invention relates to a double-sided board, and more particularly, when the electrode of the light emitting body is inserted into the mounting hole of the double-sided board and soldered, the body member is inserted into the mounting hole deeply and the cover member exposed to the outside is formed The present invention relates to a double-sided substrate assembly having a heat dissipation means for increasing efficiency and capable of fine movement in a diagonal direction, and a method of manufacturing the same.

In general, a light emitting body such as an LED or a laser diode is widely used for advertisements or rooms, interior and exterior decoration and lighting.

Among these light emitters, an LED (light-emitting diode) refers to a light emitting diode element (hereinafter referred to as an LED), and utilizes a phenomenon in which light is generated when a current flows through a PN junction of a compound semiconductor such as GaP or GaAs. As an element, an LED that generates light having a constant wavelength may be manufactured by adjusting a component ratio of a semiconductor compound in manufacturing an LED.

Such LEDs are used not only for medical use using a certain wavelength but also for promoting plant growth. In particular, LEDs have relatively low power consumption and are very bright. Therefore, LEDs have recently been used as traffic lights and vehicle rear lamps. As is also widely applied, the scope of application is not limited.

As described above, in the lighting apparatus using the LED or the laser diode light emitting body, the light emitting body is mainly installed so that the light is irradiated to the front surface, the substrate having the light emitting body is protected by a structure and fixedly installed in indoor and outdoor buildings, and then the light emitting body. Since power is supplied to the user, colorful or beautiful light is used to display a character or an image to be displayed to the user.

By the way, the conventional LED lighting device is only irradiated with the front light, so that the character or the image to be seen is shown only in a plane, the feeling that people feel very monotonous has a disadvantage that the decorative effect and advertising effect is significantly reduced.

To this end, light emitters were installed on both sides of the double-sided board, so that light was radiated to the front and rear sides, so that pedestrians and drivers could see from all sides and look three-dimensionally.

By the way. When a light emitting body such as an LED or a laser diode is installed on the double-sided board and used for a long time, overheating occurs due to the densely installed light-emitting body, which causes a disadvantage that the circuit pattern of the light-emitting body and the double-sided board is damaged.

In addition, since the diameter of the electrode of the light emitting body inserted into the mounting hole of the double-sided board is almost the same as the diameter of the mounting hole, when the light emitting body is installed at the middle point in the diagonal direction, the light emitting body may not be arranged or installed at an inclined angle, and thus the precise design may not be maintained. It does not have the disadvantage.

Thus, there is a need for improvement.

According to the present invention, when inserting and soldering a light-emitting electrode such as an LED or a laser diode into an installation hole of a double-sided board, a heat radiation part including a body member into which the solder is inserted deeply into the installation hole and a cover member exposed to the outside is formed to improve heat radiation efficiency. The purpose is to increase.

In addition, since the diameter of the mounting hole of the double-sided substrate on which the electrode of the light emitting body is installed is larger than the diameter of the electrode, the light emitting body can be fixed by moving the first and second electrodes of the light emitting body at a diagonal midpoint. The purpose is to realize precise design by enabling precise placement.

In addition, since the insertion member is formed between the installation hole of the double-sided board and the body member of the heat dissipation portion to be soldered therein, it is an object to facilitate the inflow of solder and improve the conductivity.

In addition, since one end of the insertion member is provided with a movement preventing portion, the purpose of preventing the solder flowing down to the outside forming the cover member of the heat dissipation portion during soldering.

In order to achieve the above object, a double-sided board assembly having a heat radiating means according to an embodiment of the present invention, the first and second electrodes formed on the light emitting body; First and second installation holes formed on a double-sided substrate to insert the first and second electrodes; And a heat dissipation part formed to extend in the lateral direction of the double-sided board while solder is introduced between the first and second electrodes and the first and second installation holes to absorb and discharge heat generated from the light emitting part of the light emitting body. do.

In addition, the diameters of the first and second installation holes are 1.5 times or more than the diameters of the first and second electrodes, respectively, and the first and second electrodes are arranged diagonally to the first and second installation holes. It is characterized in that for adjusting the distance (B2) between the center of the two light emitting portion.

In addition, the light emitting body is formed of a plurality, it is installed in the opposite direction in the opposite direction from the neighboring position, it is installed in the horizontal or vertical direction continuously, characterized in that alternately installed in the front portion and the back portion alternately.

The heat dissipation unit may include a pillar-shaped body member in which solder is introduced between the first and second electrodes and the first and second installation holes of the double-sided board to absorb heat generated from the light emitting unit; And a cover member extending from the body member to a side surface of the double-sided substrate and discharging heat absorbed in a direction opposite to the light emitting part.

In addition, the length of the body member is characterized in that more than half of the thickness of the double-sided substrate.

In addition, the area of the cover member is characterized in that it is formed 1.5 times or more with respect to each of the end area of the first installation hole and the end area of the second installation hole.

In addition, between the first and second installation hole and the body member of the heat dissipation unit is characterized in that it further comprises an insertion member having a hollow to improve the conductivity.

In addition, the insertion member is press-fitted into the first and second installation holes, respectively, and the inner surface of the insertion member, the uneven portion for facilitating the movement of the solder flowing into the hollow to form the body member It is characterized in that it is further provided.

In addition, at one end of the insertion member, a movement preventing portion for forming a seating groove in which a cover member extending from the body member of the heat dissipating portion is formed on the surface of the double-sided board is seated, and restricting the movement of the solder for forming the cover member. It is characterized in that it is further provided.

Method for manufacturing a double-sided substrate assembly having a heat dissipation means according to an embodiment of the present invention, supplying at least one light emitting body having a first, a second electrode; Supplying a double-sided substrate having first and second installation holes having a diameter larger than that of the first and second electrodes; Inserting the first and second electrodes into the first and second installation holes so as to cross the front and rear surfaces of the double-sided substrate; Forming a body member of a heat dissipation unit by introducing solder from a rear surface of the light emitting body to the first and second electrodes and the first and second installation holes; And forming a cover member that extends and exposes solder to the rear surface of the body member to dissipate heat absorbed from the body member into the atmosphere.

According to one or more exemplary embodiments, a method of manufacturing a double-sided board assembly having heat dissipation means may include: supplying at least one light emitter having first and second electrodes; Supplying a double-sided substrate having first and second installation holes having a diameter larger than that of the first and second electrodes; Installing an insertion member having a hollow and good conductivity in the first and second installation holes; Inserting the first and second electrodes into the hollow of the insertion member so as to cross the front and rear surfaces of the double-sided substrate; Forming a body member of a heat dissipation unit by introducing solder from a rear surface of the light emitting body to the first and second electrodes and the hollow; Solder is extended to the rear surface of the body member to form a cover member for radiating heat absorbed by the body member to the atmosphere.

In addition, the diameter of the first and second mounting holes is formed to be 1.5 times or more than the diameters of the first and second electrodes, and the area of the cover member is the end area of the first mounting hole and the first It is characterized in that it is formed by more than 1.5 times for each of the end area of the two installation holes.

As described above, when using the double-sided board assembly having a heat dissipation means according to the present invention and a method of manufacturing the same, when soldering by inserting the light emitting legs, such as LED or laser diode into the installation hole of a large diameter double-sided board, The heat dissipation efficiency is increased by forming a heat dissipation unit having a body member deeply inserted into the installation hole and a cover member exposed to the outside.

In addition, since the diameter of the mounting hole of the double-sided substrate on which the electrode of the light emitting body is installed is larger than the diameter of the electrode, the light emitting body can be fixed by moving the first and second electrodes of the light emitting body at a diagonal midpoint. Precise placement is possible, making it possible to realize an excellent design.

In addition, since the insertion member is formed between the installation hole of the double-sided board and the body member of the heat dissipation portion soldered therein, it facilitates the introduction of solder and improves the conductivity.

In addition, since the movement preventing portion is provided at one end of the insertion member, the solder, which forms the cover member of the heat dissipation portion, has an effect of preventing the solder from flowing out.

Hereinafter, a double-sided light emitting lighting device according to an embodiment of the present invention will be described with reference to the accompanying drawings.

In this process, the thickness of the lines or the size of the components shown in the drawings may be exaggerated for clarity and convenience of description. In addition, the terms described below are defined in consideration of the functions of the present invention, which may vary depending on the intention or custom of the user, the operator. Therefore, definitions of these terms should be made based on the contents throughout the specification.

1 is a state diagram in which a double-sided board assembly having a heat dissipation means according to an embodiment of the present invention is applied to an advertisement, and FIG. 2 is a perspective view showing a part of a double-sided board assembly having a heat dissipation means according to an embodiment of the present invention. 3 is a cross-sectional view taken along line AA of FIG. 2, and FIG. 4 is an exploded perspective view of a double-sided board assembly having a heat dissipation means according to another embodiment of the present invention, and FIG. 6 is a perspective view of a state in which an uneven portion is formed on an inner surface of the insertion member according to another embodiment of the present invention, and FIG. 7 is a perspective view of a state in which an anti-moving portion is formed at one end of the insertion member according to another embodiment of the present invention. 8 is a cross-sectional view illustrating an assembled state of the double-sided board to which the inserting member of FIG. 6 is applied, and FIG.

As shown in FIG. 1, the double-sided board assembly having heat dissipation means according to the preferred embodiment of the present invention may be applied in various fields, but is installed on the wall or ceiling of the building 10 to be advertised to pedestrians or drivers. It may be configured to recognize water 20.

Advertisement 20 is fixed to the building 10 by the support means, is configured to irradiate light to the front or rear by the lighting unit 30, the lighting unit 30 is a case for maintaining the form, and the case The light emitting body 100 installed inside the light emitting body 100 to emit light to both sides is formed of a double-sided board assembly formed on both sides of the double-sided board 200.

The rear of the lighting unit 30 may be provided with a light collecting member 40 for collecting light irradiated in the opposite direction.

The double-sided board assembly claimed in the present invention is not limited only to the case shown in FIG. 1 and may be applied in various fields.

2 and 3, the double-sided substrate assembly having a heat dissipation means according to an embodiment of the present invention, the first and second electrodes 120, 130 formed on the light emitting body 100; First and second installation holes 210 and 220 formed on the double-sided substrate 200 to insert the first and second electrodes 120 and 130; And a solder is introduced between the first and second electrodes 120 and 130 and the first and second installation holes 210 and 220 to extend in the lateral direction of the double-sided substrate 200 to emit light. And a heat radiating part 300 which absorbs heat generated by the light emitting part 110 of the 100 and discharges it to the atmosphere.

As shown in FIG. 2, the diameters D2 of the first and second installation holes 210 and 220 are 1.5 times larger than the diameters D1 of the first and second electrodes 120 and 130, respectively. It is preferable that it is above. Of course, the present invention is not limited thereto, and solder may flow between the first and second electrodes 120 and 130 of the light emitter 100 and the first and second installation holes 210 and 220 of the double-sided substrate 200. It is enough to have enough space.

Solder can use both soft solders and hard solders, and metal materials can use a variety of popular solder materials such as lead, tin, and zinc-based alloys.

Although a plurality of light emitting bodies 100 are formed, it is preferable that the light emitting units 100 are installed in the opposite direction in opposite directions to each other. However, the light emitting unit 100 is not limited thereto, and the arrangement method may be variously modified and applied as necessary.

That is, as shown in Figure 9, in the double-sided board 200, a pair of anode (+) and cathode (-) line is installed in a continuous line, the light-emitting body 100 installation line is installed horizontally or It is composed of a plurality of lines in the longitudinal direction, even lines may be installed in the front portion, neighboring odd lines may be installed in the rear portion. Of course, on the contrary, even lines may be installed at the rear part and even lines may be installed at the front part.

In this case, when the light emitter 100 is installed on the front surface of the double-sided substrate 200, the first and second electrodes 120 and 130 of the light emitter 100 are first and second installation holes 210 and 220. When it is inserted horizontally and fixed by soldering on the back, it is represented by the interval (B1) between the central portion of the two light emitting portion (110).

By the way, when the distance between the light emitters 100 is to be smoothly processed, the first and second electrodes 120 and 130 of the light emitter 100 are first and second installation holes. It is possible to adjust the distance (B2) between the center of the two light emitting unit 110 by installing in the diagonal direction (210, 220).

That is, the first electrode 120 of the light emitter 100 may be inserted into the third first installation hole 210 from the upper side, and the second electrode 130 may be inserted into the second second installation hole 220 from the upper side. In this case, the diameter D1 of the first and second installation holes 210 and 220 is larger than the diameter D2 of the first and second electrodes 120 and 130 so that the gap is easily adjusted. It is possible to install with.

In addition, the cross-sections of the first and second electrodes 120 and 130 may be formed in a circle, polygon, rectangle, or the like.

The heat dissipation unit 300 has solder introduced between the first and second electrodes 120 and 130 and the first and second installation holes 210 and 220 of the double-sided substrate 200 to emit light 100. A pillar-shaped body member 310 that absorbs heat generated from the light emitting unit 110 of FIG. And a cover member 320 extending from the body member 310 to the side of the double-sided substrate 200 and discharging most of the heat absorbed in the direction opposite to the light emitting unit 110 of the light emitter 100 to the atmosphere.

As shown in FIG. 3, the length T2 of the body member 310 is preferably formed at least half of the thickness T1 of the double-sided board 200.

The area A2 of the cover member 320 may be formed to be 1.5 times or more with respect to each of the end area A1 of the first installation hole 210 and the end area A1 of the second installation hole 220. Can be.

On the other hand, as shown in Figure 4 to 8, looks at the double-sided board assembly having a heat dissipation means according to another embodiment of the present invention.

In the case of another embodiment of the present invention, the only difference is that the insertion member is further provided in the configuration of the embodiment of the present invention. That is, an insertion member 400 having a hollow 410 is further provided between the first and second installation holes 210 and 220 and the body member 310 of the heat dissipation part 300 to improve conductivity.

The insertion member 400 is preferably press-fitted into the first and second installation holes 210 and 220, respectively, and the inner surface of the hollow 410 of the insertion member 400 is preferably formed smoothly.

As shown in FIG. 6, an inner side surface of the insertion member 400 may further include an uneven portion 420 to facilitate the movement of the solder flowing into the hollow 410 to form the body member 310. have.

7 and 8, at one end of the insertion member 400, a seating groove 400 in which the cover member 320 of the heat radiating part 300 is mounted is formed, and the cover member 320 is formed. The movement preventing part 430 for limiting the movement of the solder to form a may be further provided.

The movement preventing part 430 serves as a locking jaw and flows to the side when the cover member 320 is formed while the solder extending while forming the body member 310 is formed on the surface of the double-sided board 200. It will prevent falling.

It looks at the manufacturing method of the double-sided board assembly having a heat dissipation means according to an embodiment of the present invention.

10 is a flow chart showing a manufacturing method of a double-sided board assembly having a heat dissipation means of the present invention.

First, one or more light emitters 100 having the first and second electrodes 120 and 130 are supplied.

In addition, the double-sided substrate 200 having the first and second installation holes 210 and 220 having a diameter larger than the diameter of the first and second electrodes 120 and 130 is supplied (S20).

Meanwhile, the diameter D2 of the first and second installation holes 210 and 220 is 1.5 times or more than the diameter D1 of the first and second electrodes 120 and 130 to be melted. It is preferable that the solder be configured to flow in well.

At this time, as shown in Figures 4 to 8, having a hollow 410 in the first and second installation holes (210, 220) of the double-sided board 200, the conductive member 400 having a good conductivity is further added. You can also install. (S25)

In addition, the first and second electrodes 120 and 130 may be disposed to cross the front and rear surfaces of the double-sided board 200, and the first and second installation holes 210 and 220 or the insertion member of the double-sided board 200. Insert into the hollow 410 of (400). (S30)

Heat dissipation part 300 by introducing a solder between the first and second electrodes 120 and 130 and the first and second installation holes 210 and 220 or the hollow 410 from the rear surface of the light emitter 100. The body portion of the material 310 is formed. (S40)

Subsequently, the solder is extended and exposed to the rear surface of the body member 310 to form a cover member 320 for dissipating heat absorbed by the body member 310 into the atmosphere (S50).

7 and 8, when the movement preventing portion 430 is formed on one side of the insertion member 400, the solder extending to the rear surface of the body member 310 is exposed to the movement preventing portion 430. It can be formed while being restricted to the movement in the seating groove 440 while being caught in the jaw portion of.

Meanwhile, the area A2 of the cover member 320 is 1.5 times or more with respect to each of the end area A1 of the first installation hole 210 and the end area A1 of the second installation hole 220. It may be formed so that the heat transferred from the body member 310 can be easily discharged to the outside.

In other words, as shown in FIG. 9, when the distance between the light emitters 100 is to be smoothly processed to process the round part of a letter or a pattern, the first and second electrodes 120 of the light emitter 100 ( 130 is installed in the first and second installation holes 210 and 220 in a diagonal direction to adjust the distance B2 between the centers of the two light emitting units 110.

That is, the first electrode 120 of the light emitter 100 is inserted into the third first installation hole 210 from the upper side, and the second electrode 130 is inserted into the second second installation hole 220 from the upper side. Subsequently, the solder is inserted into the first and second installation holes 210 and 220 to form a heat dissipation part 300 having the body member 310 and the cover member 320.

Therefore, in the related art, since the size of the installation hole into which the LED electrode as the light emitting device is inserted is small, the LEDs may not be installed diagonally, and thus, curved surfaces of letters and patterns displayed by the LEDs may not be smoothly processed. The diameter D1 of the first and second installation holes 210 and 220 is larger than the diameter D2 of the first and second electrodes 120 and 130, so that the gaps between the LEDs can be easily adjusted, Since it is possible to install diagonally, it is possible to smooth the curved parts of letters and patterns.

Although the present invention has been described with reference to the embodiments illustrated in the drawings, it is merely exemplary, and various modifications and equivalent other embodiments are possible to those skilled in the art. Will understand.

Therefore, the true technical protection scope of the present invention will be defined by the claims below.

1 is a state in which a double-sided board assembly having a heat dissipation means according to an embodiment of the present invention applied to the advertisement.

Figure 2 is a perspective view showing a part of the double-sided substrate assembly having a heat dissipation means according to an embodiment of the present invention.

A-A sectional drawing of FIG. 2 of FIG.

Figure 4 is an exploded perspective view of a double-sided board assembly having a heat dissipation means according to another embodiment of the present invention.

5 is a cross-sectional view of a heat dissipation unit is formed in the assembled state of FIG.

Figure 6 is a perspective view of the irregularities formed on the inner surface in the insertion member according to another embodiment of the present invention.

Figure 7 is a perspective view of the movement prevention portion is formed at one end in the insertion member according to another embodiment of the present invention.

8 is an assembled state cross-sectional view of the double-sided substrate to which the insertion member of FIG. 6 is applied.

9 is a state in which the light emitting body is installed in a diagonal direction in the double-sided board assembly of the present invention.

10 is a flow chart showing a manufacturing method of a double-sided board assembly having a heat dissipation means according to a preferred embodiment of the present invention.

Explanation of symbols on the main parts of the drawings

100 light emitting unit 110 light emitting unit

120: first electrode 130: second electrode

200: double-sided board 210: first installation hole

220: second installation hole 300: heat dissipation unit

310: body member 320: cover member

400: insertion member 410: hollow

420: uneven portion 430: movement preventing portion

Claims (12)

First and second electrodes formed on the light emitter; First and second installation holes formed on a double-sided substrate to insert the first and second electrodes; And And a heat dissipation part formed to extend in the lateral direction of the double-sided board while solder is introduced between the first and second electrodes and the first and second installation holes to absorb and discharge heat generated from the light emitting part of the light emitting body. Double-sided board assembly having a heat dissipation means, characterized in that. The method of claim 1, The diameters of the first and second installation holes are 1.5 times or more than the diameters of the first and second electrodes, respectively, and the first and second electrodes are installed in the first and second installation holes diagonally. Double-sided board assembly having a heat dissipation means, characterized in that for adjusting the distance (B2) between the center of the two light emitting portion. The method of claim 1, The light-emitting body is formed of a plurality, having a heat dissipation means characterized in that alternately installed in the opposite direction from the neighboring position, or installed continuously in the horizontal or vertical direction, alternately installed in the front and rear parts Double sided board assembly. The method of claim 1, The heat dissipation unit may include a pillar-shaped body member in which solder is introduced between the first and second electrodes and the first and second installation holes of the double-sided board to absorb heat generated from the light emitting unit; And And a cover member extending from the body member to a surface of the double-sided board and dissipating heat absorbed in a direction opposite to the light emitting unit. The method of claim 4, wherein The length of the body member, the double-sided board assembly having a heat dissipation means, characterized in that more than half of the thickness of the double-sided board. The method of claim 4, wherein The area of the cover member, the double-sided board assembly having a heat dissipation means, characterized in that formed in the end area of the first installation hole and the end area of the second installation hole 1.5 times or more. 7. The method according to any one of claims 1 to 6, And between the first and second installation holes and the body member of the heat dissipation unit, further comprising an insertion member having a hollow to improve conductivity. The method of claim 7, wherein The insertion member is pressed into the first and second installation holes, respectively, The inner side surface of the insertion member, the double-sided board assembly having a heat dissipation means, characterized in that the concave-convex portion further facilitates the movement of the solder flowing into the hollow to form the body member. The method of claim 7, wherein One end of the insertion member is formed with a seating groove in which a cover member extending from the body member of the heat dissipating unit is formed on the surface of the double-sided board. Double-sided board assembly having a heat dissipation means, characterized in that the movement preventing portion for further limiting the movement of the solder for forming the cover member. Supplying at least one light emitter having first and second electrodes; Supplying a double-sided substrate having first and second installation holes having a diameter larger than that of the first and second electrodes; Inserting the first and second electrodes into the first and second installation holes so as to cross the front and rear surfaces of the double-sided substrate; Forming a body member of a heat dissipation unit by introducing solder from a rear surface of the light emitting body to the first and second electrodes and the first and second installation holes; And Solder is extended to the rear of the body member exposed to the manufacturing method of the double-sided board assembly having a heat dissipation means comprising the step of forming a cover member for radiating heat absorbed by the body member to the atmosphere. Supplying at least one light emitter having first and second electrodes; Supplying a double-sided substrate having first and second installation holes having a diameter larger than that of the first and second electrodes; Installing an insertion member having a hollow and good conductivity in the first and second installation holes; Inserting first and second electrodes into the hollow of the insert member so as to cross the front and rear surfaces of the double-sided substrate; Forming a body member of a heat dissipation unit by introducing solder from a rear surface of the light emitting body to the first and second electrodes and the hollow; Solder is extended to the rear of the body member exposed to the manufacturing method of the double-sided board assembly having a heat dissipation means comprising the step of forming a cover member for radiating heat absorbed by the body member to the atmosphere. The method of claim 10 or 11, The diameter of the first and second mounting holes is formed to be 1.5 times or more than the diameter of the first and second electrodes, The area of the cover member, the manufacturing method of the double-sided board assembly having a heat dissipation means, characterized in that formed at least 1.5 times of each of the end area of the first installation hole and the end area of the second installation hole.

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