KR101002915B1 - LED Backlight Unit - Google Patents

LED Backlight Unit Download PDF

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KR101002915B1
KR101002915B1 KR1020080076808A KR20080076808A KR101002915B1 KR 101002915 B1 KR101002915 B1 KR 101002915B1 KR 1020080076808 A KR1020080076808 A KR 1020080076808A KR 20080076808 A KR20080076808 A KR 20080076808A KR 101002915 B1 KR101002915 B1 KR 101002915B1
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led package
led
circuit board
printed circuit
backlight unit
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KR1020080076808A
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KR20100018164A (en
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임성환
윤병욱
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태산엘시디 주식회사
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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/133308—Support structures for LCD panels, e.g. frames or bezels
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133615—Edge-illuminating devices, i.e. illuminating from the side
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133628—Illuminating devices with cooling means
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F2202/00—Materials and properties
    • G02F2202/28—Adhesive materials or arrangements

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • Mathematical Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Planar Illumination Modules (AREA)
  • Led Device Packages (AREA)

Abstract

본 발명은 LED 백라이트 유닛에 관한 것으로, LED 패키지; 상기 LED 패키지가 삽입되도록 적어도 하나 이상의 관통공이 형성되고, 상기 관통공 주변에 LED 패키지가 전기적으로 연결되도록 하는 패턴회로가 형성된 인쇄회로기판; 상기 인쇄회로기판의 관통공으로 관통된 LED 패키지의 저면이 써멀테이프에 의해 부착되는 금속 새시를 포함한다.The present invention relates to an LED backlight unit, comprising: an LED package; A printed circuit board having at least one through hole formed to insert the LED package, and having a pattern circuit configured to electrically connect the LED package around the through hole; The bottom surface of the LED package penetrated by the through-holes of the printed circuit board includes a metal chassis attached by a thermal tape.

본 발명의 LED 백라이트 유닛에 의하면, 인쇄회로기판 하부에 방열판을 부착하고 그 방열판의 열을 금속 새시를 통해 직접 외부로 배출할 수 있도록 함으로써 방열 기능을 최대화할 수 있는 동시에 제조비용을 절감시킬 수 있다.According to the LED backlight unit of the present invention, by attaching a heat sink to the lower portion of the printed circuit board and allowing the heat of the heat sink to be directly discharged to the outside through the metal chassis, it is possible to maximize the heat dissipation function and at the same time reduce the manufacturing cost. .

LED, 백라이트 유닛, 인쇄회로기판 LED, backlight unit, printed circuit board

Description

ＬＥＤ 백라이트 유닛{LED Backlight Unit}LED backlight unit {LED Backlight Unit}

본 발명은 액정표시장치에 관한 것으로, 특히 LED 소자를 이용한 백라이트유닛에 관한 것이다.The present invention relates to a liquid crystal display device, and more particularly to a backlight unit using an LED element.

전자기기 산업이 발전함에 따라 소형이며 에너지 소비율이 적은 각종 표시장치들이 개발되고 있으며 이를 이용한 영상기기, 컴퓨터, 이동통신 단말기 등이 개발되고 있는 추세이다. 이러한 추세를 반영하여 등장한 LCD(액정표시장치, Liquid Crystal Display)는 현재 모니터와 이동통신 단말기 등의 표시장치로 각광받고 있다.As the electronics industry develops, various display devices having small size and low energy consumption are being developed, and imaging devices, computers, and mobile communication terminals using the same are being developed. LCD (Liquid Crystal Display), which has appeared in response to this trend, is currently in the spotlight as a display device such as a monitor and a mobile communication terminal.

LCD는 그 자체가 발광하여 화상을 형성하지 못하고 외부로부터 빛을 받아 화상을 형성하는 수광형 소자이므로, 별도의 광원 예컨대 백라이트 유닛을 설치하고 백라이트 유닛에서 나오는 가시광선을 조절하여 화상을 구현하도록 구성되어 있다.Since the LCD itself is a light-receiving element that does not form an image by emitting light, but receives light from the outside, the LCD is configured to implement an image by installing a separate light source such as a backlight unit and adjusting visible light emitted from the backlight unit. have.

이때, 상기 백라이트는 백색의 빛을 발생시킴으로써 LCD 패널에 의해 구현되는 영상의 색이 실제 색에 가깝게 재현될 수 있게 하며, 이러한 LCD용 백라이트 유 닛은 광원의 설치 위치에 따라 직하형(direct type)과 에지(edge)형으로 구분된다.In this case, the backlight generates white light so that the color of the image implemented by the LCD panel can be reproduced close to the actual color, and the LCD backlight unit is a direct type according to the installation position of the light source. And the edge (edge) type.

상술한 바와 같이 LCD의 백라이트 유닛은 종래에 CCFL(냉음극형광램프, Cold Cathode Fluorescent Lamp)이나 EEFL(외부전극형광램프, External Electrode Fluorescent Lamp) 등을 광원으로 사용하였다.As described above, the backlight unit of the LCD has conventionally used CCFL (Cold Cathode Fluorescent Lamp) or EEFL (External Electrode Fluorescent Lamp) as a light source.

즉, 종래의 CCFL을 이용한 LCD 백라이트 모듈은 도광판의 일측면에 CCFL을 이용한 광원수단을 배치하여 CCFL로부터 발생하는 빛을 도광판, 확산판, 프리즘을 통해 LCD 패널(미도시)의 소정 영역으로 공급하도록 구성된다. 이때, CCFL과 같은 종래의 백라이트 광원들은 대부분 플라즈마 원리를 이용한 광원이며, 백색을 구현한다.That is, the conventional LCD backlight module using a CCFL is to arrange the light source means using the CCFL on one side of the light guide plate to supply the light generated from the CCFL to a predetermined area of the LCD panel (not shown) through the light guide plate, diffuser plate, prism. It is composed. In this case, the conventional backlight light sources such as CCFL are mostly light sources using the plasma principle, and implements a white color.

그러나, 상술한 종래의 광원들은 다음과 같은 문제점이 있었다. 즉, 플라즈마의 가스 압력이 변화함에 따라 수명이 짧아지고, 플라즈마 방전에 필요한 수 백 볼트에 이르는 높은 동작전압을 얻기 위한 인버터가 필요하였다.However, the above-described conventional light sources have the following problems. That is, as the plasma gas pressure changes, the lifetime is shortened, and an inverter for obtaining a high operating voltage of several hundred volts required for plasma discharge is required.

또한, 휴대용 제품에 적용되는 경우 백라이트에 의해 대부분의 전력이 소모되는데, 이때 종래의 CCFL이나 EEFL과 같은 광원은 전력소비효율이 좋지 못하여 과다한 전력소모가 된다는 문제점이 있었다.In addition, when applied to a portable product, most of the power is consumed by the backlight, in which the conventional light source such as CCFL or EEFL has a problem that the power consumption efficiency is not good, resulting in excessive power consumption.

이러한 문제점을 해소하기 위해 최근에는 LED(Light Emitting Diode)를 이용한 백라이트 모듈이 제안되었다. LED는 반도체에 전압을 가할 때 생기는 발광현상(전기장발광이라고도 함.)을 이용하여 빛을 발생시키는 발광소자이다.In order to solve this problem, a backlight module using a light emitting diode (LED) has recently been proposed. An LED is a light emitting device that generates light by using a light emission phenomenon (also called electric field light emission) generated when a voltage is applied to a semiconductor.

따라서, LED는 종래의 광원(光源)에 비해 소형이고, 수명이 길며, 전기에너지가 빛에너지로 직접 변환하기 때문에 에너지 효율이 높음과 동시에 낮은 동작전 압을 갖는다는 장점이 있다.Accordingly, LEDs have advantages in that they are smaller in size, longer in lifespan, and have higher energy efficiency and lower operating voltages compared to conventional light sources.

이와 같이 LED는 수명이 길고 소비전력이 적다는 이점이 있어 전기, 전자분야뿐만 아니라 광고분야에서도 많이 사용되고 있다. 최근 LED를, 예컨대 액정표시장치의 백라이트 유닛으로 이용하려는 시도가 활발히 진행되고 있으며, 향후 옥내외 조명으로 일상 생활에서도 널리 사용될 것이다. 이와 같이 LED의 적용범위가 확대됨에 따라 소형이면서도 열 방출이 용이한 LED 패키지에 대한 관심이 높아지고 있다.As such, the LED has a long life and low power consumption, and thus is widely used in the electric and electronic fields as well as in the advertising field. Attempts have recently been made to use LEDs, for example, as backlight units of liquid crystal displays, and will be widely used in daily life as indoor and outdoor lighting in the future. As the LED's application range expands, interest in LED packages that are small and easy to dissipate heat is increasing.

LED를 액정표시장치의 백라이트 유닛이나 조명용으로 사용하기 위해서는 높은 파워(High Power)가 요구된다. 그러나 LED의 성능은 온도 상승에 따라 지수 함수적으로 급격히 감소하기 때문에, LED 패키지의 방열은 매우 중요하게 다루어져야 한다. 따라서, 본 발명의 과제는, 다수의 LED가 배열된 어레이 모듈화에 있어서, 발광효율과 방열성능이 우수한 LED 백라이트 유닛을 제공하는 것이다.High power is required in order to use the LED for a backlight unit or an illumination of a liquid crystal display device. However, the heat dissipation of the LED package must be taken very seriously because the LED's performance decreases exponentially with temperature rise. Accordingly, an object of the present invention is to provide an LED backlight unit having excellent luminous efficiency and heat dissipation performance in an array module in which a plurality of LEDs are arranged.

상술한 과제를 달성하기 위하여, LED 패키지; 상기 LED 패키지가 삽입되도록 적어도 하나 이상의 관통공이 형성되고, 상기 관통공 주변에 LED 패키지가 전기적으로 연결되도록 하는 패턴회로가 형성된 인쇄회로기판; 상기 인쇄회로기판의 관통공으로 관통된 LED 패키지의 저면이 써멀테이프에 의해 부착되는 금속 새시를 포함하는 LED 백라이트 유닛이 제공된다.In order to achieve the above object, LED package; A printed circuit board having at least one through hole formed to insert the LED package, and having a pattern circuit configured to electrically connect the LED package around the through hole; An LED backlight unit including a metal chassis to which a bottom surface of an LED package penetrated by a through hole of the printed circuit board is attached by a thermal tape is provided.

본 발명의 LED 백라이트 유닛에 의하면, 인쇄회로기판 하부에 방열판을 부착하고 그 방열판의 열을 금속 새시를 통해 직접 외부로 배출할 수 있도록 함으로써 방열 기능을 최대화할 수 있는 동시에 제조비용을 절감시킬 수 있다. 또한, 조명 기구의 형태 및 크기에 따라 인쇄회로기판 모듈을 변경한 후 LED 패키지를 장착할 수 있으므로 대면적 조명에 유리하다.According to the LED backlight unit of the present invention, by attaching a heat sink to the lower portion of the printed circuit board and allowing the heat of the heat sink to be directly discharged to the outside through the metal chassis, it is possible to maximize the heat dissipation function and at the same time reduce the manufacturing cost. . In addition, the LED package can be mounted after changing the printed circuit board module according to the shape and size of the lighting fixture, which is advantageous for large area lighting.

이하에서는, 본 발명에 의한 백라이트용 LED 모듈의 바람직한 실시예를 첨부 도면을 참고하여 설명한다.Hereinafter, a preferred embodiment of the LED module for backlight according to the present invention will be described with reference to the accompanying drawings.

본 발명의 LED 백라이트 유닛(1)은 도 1 내지 4에 도시한 바와 같이, 액정디스플레이장치에 광을 제공할 수 있도록 LED 패키지(10), 인쇄회로기판(20), 금속 새시(40)를 포함하여 구성된다.As shown in FIGS. 1 to 4, the LED backlight unit 1 of the present invention includes an LED package 10, a printed circuit board 20, and a metal chassis 40 to provide light to the liquid crystal display device. It is configured by.

LED 패키지(10)는 발광칩(11), 방열판(12), 단자(13) 및 몰드부(14)를 포함하며, 발광칩(11)은 전원인가시 빛을 발생시킴과 동시에 열을 발생시키는 반도체 소자인 발광다이오드(LED)이다. 이때, LED 패키지(10)는 상기 인쇄회로기판(20)에 단열(單列) 또는 복열(複列)로 장착되어 외부의 전원과 전기적으로 연결되도록 구성된다.The LED package 10 includes a light emitting chip 11, a heat sink 12, a terminal 13, and a mold part 14. The light emitting chip 11 generates light and generates heat when power is applied. A light emitting diode (LED) that is a semiconductor device. In this case, the LED package 10 is mounted on the printed circuit board 20 by heat insulation or reheating, and is configured to be electrically connected to an external power source.

방열판(12)은 발광칩(11)을 상부면에 안착하여 발광칩(11)의 발광시 발생한 열을 외부로 전달할 수 있도록 열전도성이 우수한 금속소재로 이루어지는 방열수단이며, 이는 히트싱크(heat sink)라고 불리워지기도 한다. 보다 구체적으로는 구리, 은, 알루미늄, 철, 니켈 및 텅스텐 중 어느 하나의 금속재 또는 이들을 적어도 하나 이상 포함하는 합금재로 구성될 수 있으며, 그 외부면은 니켈, 은, 금중 어느 하나의 금속재 또는 이들을 적어도 하나이상 포함하는 합금재로 도금처리될 수도 있다.The heat dissipation plate 12 is a heat dissipation means made of a metal material having excellent thermal conductivity to seat the light emitting chip 11 on the upper surface to transfer heat generated when the light emitting chip 11 emits light to the outside, which is a heat sink. It is also called). More specifically, it may be composed of a metal material of any one of copper, silver, aluminum, iron, nickel and tungsten or an alloy material containing at least one thereof, the outer surface of the metal material of any one of nickel, silver, gold or these It may be plated with an alloy material containing at least one or more.

이러한 방열판(12)의 하부면은 발광칩(11)에서 발생한 열을 금속 새시(40)를 통하여 외부로 방출하는 열방출 경로를 형성할 수 있도록 상기 금속 새시(40)의 바닥면에 써멀테이프(30)를 매개로 접착된다.The lower surface of the heat sink 12 has a thermal tape on the bottom surface of the metal chassis 40 to form a heat dissipation path for dissipating heat generated from the light emitting chip 11 to the outside through the metal chassis 40. 30) is bonded through the medium.

이때, 방열판(12)의 하부면은 몰드부(14)의 성형시 상기 금속 새시(40)의 바닥면과 대응하는 몰드부(14)의 하부면으로부터 외부 노출되거나 돌출되도록 구비한다.At this time, the lower surface of the heat sink 12 is provided to be exposed or protruded from the lower surface of the mold portion 14 corresponding to the bottom surface of the metal chassis 40 during the molding of the mold portion 14.

단자(13)는 발광칩(11)이 전기적으로 연결되도록 몰드부(14)에 고정되는 전도체이다. 단자(13)는 LED 패키지(10)를 인쇄회로기판(20)에 탑재할 수 있도록 발광칩(11)과 일단이 접속되고, 인쇄회로기판(20)의 패턴회로에 타단이 접속되도록 일정 길이 상향 절곡되도록 구성된다.The terminal 13 is a conductor fixed to the mold 14 so that the light emitting chip 11 is electrically connected. The terminal 13 has a predetermined length upward such that one end of the LED chip 10 is connected to the LED chip 10 so that the LED package 10 can be mounted on the printed circuit board 20, and the other end of the terminal 13 is connected to the pattern circuit of the PCB 20. It is configured to be bent.

이때, 단자(13)(13')(13'')는 도 2a와 같이 몰드부(14)의 일측 상부에 (+)단자(13a)가 수평으로 연장되고 타측 하부에 (-)단자(13b)가 수평으로 연장되어 구성될 수도 있고, 도 2b와 같이 몰드부(14)의 상부 양측에 (+)단자(13a')가 수평으로 연장 형성되고 하부 양측에 (-)단자(13b')가 수평으로 연장 형성되거나, 또는 도 2c와 같이 몰드부(14)의 상부 양측에 각각 (+)단자(13a'')와 (-)단자(13b'')가 대향되게 연장 형성될 수도 있다.At this time, the terminals 13, 13 ', and 13' 'have a (+) terminal 13a extending horizontally on one side of the mold 14 and a (-) terminal 13b on the other lower side as shown in FIG. 2A. ) May be horizontally extended, and as shown in FIG. 2B, (+) terminal 13a 'is horizontally formed on both sides of the upper part of the mold part 14, and (-) terminal 13b' is formed on both sides of the lower part. It may be formed to extend horizontally, or (+) terminal 13a ″ and (−) terminal 13b ″ may be formed to extend on opposite sides of the upper portion of the mold 14 as shown in FIG. 2C.

몰드부(14)는 방열판(12)과 단자(13)를 일체화하면서 방열판(12)과 단자(13)를 외부로 노출시킬 수 있도록 수지물로서 성형되는 성형구조물이다. 이때, 몰드부(14)의 상부에는 발광칩(11)에서 출사되는 광의 입사각을 보다 넓히거나 집중할 수 있도록 설계된 렌즈를 구비할 수도 있다.The mold portion 14 is a molded structure that is molded as a resin material to expose the heat sink 12 and the terminal 13 to the outside while integrating the heat sink 12 and the terminal 13. In this case, the upper portion of the mold 14 may be provided with a lens designed to widen or concentrate the incident angle of the light emitted from the light emitting chip 11 more.

인쇄회로기판(20)은 LED 패키지(10)의 몰드부(14)가 끼워져 장착되도록 일정 크기로 관통 형성되는 다수의 관통공(21)이 소정 간격으로 이격 형성되고, 그 표면에는 LED 패키지(10)를 전기적으로 연결하기 위한 패턴회로가 형성되어 있으며, 상기 관통공(21) 주변에는 LED 패키지와 패턴회로를 연결하기 위한 접점이 형성되어 있다. 여기서, 관통공(21)에 삽입되는 몰드부(14)의 상단 외주테두리에는 관통공(21)의 내주면에 끼움 결합될 수 있도록 단턱이 구비될 수도 있다.The printed circuit board 20 has a plurality of through-holes 21 formed to be penetrated to a predetermined size so that the mold 14 of the LED package 10 is fitted into and mounted at predetermined intervals, and the LED package 10 is formed on the surface thereof. ) Has a pattern circuit for electrically connecting, and a contact for connecting the LED package and the pattern circuit is formed around the through hole (21). Here, the upper circumferential edge of the mold portion 14 inserted into the through hole 21 may be provided with a stepped portion to be fitted to the inner circumferential surface of the through hole 21.

이때, LED 패키지는 일반 인쇄회로기판(Printed Circuit Board ; PCB)보다 방열효과가 좋은 메탈 PCB에 실장하여 구성될 수도 있으며, 메탈 PCB는 열전도도가 높은 금속 성분의 방열판 상부에 폴리아미드로 구성된 연성 PCB(flexible PCB)를 접착제를 이용하여 부착시켜 방열 성능을 향상시킨 인쇄회로기판이다.In this case, the LED package may be mounted on a metal PCB having better heat dissipation effect than a general printed circuit board (PCB), and the metal PCB is a flexible PCB composed of polyamide on top of a heat sink having a high thermal conductivity. It is a printed circuit board that improves heat dissipation performance by attaching (flexible PCB) with adhesive.

또한, 인쇄회로기판(20)은 열전도도가 낮은 수지 계열의 재질로 이루어질 수 있으며, 조명기구의 형태에 따라 외형이 달라질 수 있다. 인쇄회로기판(10)은 저가의 에폭시 또는 페놀수지 계열의 재질로 제작될 경우 LED 패키지용 인쇄회로기판의 제조비용을 획기적으로 절감할 수 있다.In addition, the printed circuit board 20 may be made of a resin-based material having low thermal conductivity, and the appearance thereof may vary depending on the shape of the lighting fixture. When the printed circuit board 10 is made of a low-cost epoxy or phenol resin-based material, the manufacturing cost of the printed circuit board for the LED package can be drastically reduced.

금속 새시(40)는 LED 패키지(10)가 조립된 인쇄회로기판(20)을 내부수용할 수 있도록 일정크기의 내부공간을 갖는 수용체이다.The metal chassis 40 is a container having an internal space of a predetermined size to accommodate the printed circuit board 20 in which the LED package 10 is assembled.

금속 새시(40)의 바닥면에는 LED 패키지(10)의 몰드부(14)로부터 외부노출되는 방열판(12)의 하부면이 써멀테이프(30)를 매개로 하여 탑재된다. 써멀테이프는 열전도성 기재의 양면에 열전도성 접착제가 도포된 형태로서, 열을 발생시키는 LED 패키지로부터 신속히 열을 방출하기 위해 부착하는 히트싱크를 나사나 클립 없이 접착 타입으로 쉽게 부착할 수 있도록 한 것이다. 이때, 보다 견고한 고정을 위해서는 스크류 등을 이용할 수 있음은 물론이다.The bottom surface of the metal chassis 40 is mounted on the bottom surface of the heat sink 12 exposed outside from the mold portion 14 of the LED package 10 via the thermal tape 30. Thermal tape is a form of thermal conductive adhesive coated on both sides of a thermally conductive substrate, which allows for easy attachment of heat sinks that are attached to heat dissipation from a heat generating LED package without screws or clips. . At this time, of course, you can use a screw, etc. for a more secure fixing.

이에 따라, LED 패키지(10)에서 발생된 열은 방열판(12)과 금속 새시(40)를 통하여 외부로 대부분 방출되는 것이다.Accordingly, heat generated in the LED package 10 is mostly emitted to the outside through the heat sink 12 and the metal chassis 40.

한편, LED 패키지(10)의 상부에는 도시하지 않았으나 확산시트 및 LCD 패널을 추가하여 구비하며, 확산시트와 LCD 패널 사이에는 광휘도 특성을 향상시킬 수 있도록 BEF(Brightness Enhancement Film)와 DBEF(Dual Brightness Enhancement Film)를 적층할 수도 있다.On the other hand, although not shown in the upper portion of the LED package 10 is provided by adding a diffusion sheet and LCD panel, between the diffusion sheet and the LCD panel to improve the brightness characteristics of the Brightness Enhancement Film (BEF) and Dual Brightness (DBEF) Enhancement Film) may be laminated.

또한, 백라이트 유닛을 사이드 에미팅 방식(Side Emitting Type)으로 구성하는 경우, LED 패키지(10)와 확산시트 사이에는 LED 패키지(10)로부터 입사되는 광을 면광원으로 굴절시킬 수 있도록 도광판을 별도로 구비해야만 한다.In addition, when the backlight unit is configured as a side emitting type, a light guide plate is separately provided between the LED package 10 and the diffusion sheet so that the light incident from the LED package 10 can be refracted by the surface light source. must do it.

도 1은 본 발명에 의한 LED 백라이트 유닛의 일 실시예를 도시한 사시도.1 is a perspective view showing an embodiment of an LED backlight unit according to the present invention.

도 2a 내지 도 2c는 각각 본 발명에 적용되는 LED 패키지의 변형예를 도시한 사시도.2A to 2C are perspective views each showing a modified example of the LED package applied to the present invention.

도 3a 및 도 3b는 각각 본 발명에 적용되는 인쇄회로기판의 평면도 및 저면도.3A and 3B are plan and bottom views, respectively, of a printed circuit board applied to the present invention.

도 4는 본 발명에 의한 LED 백라이트 유닛의 단면도.4 is a cross-sectional view of the LED backlight unit according to the present invention.

< 도면의 주요 부분에 대한 부호의 설명 ><Description of Symbols for Main Parts of Drawings>

10 ; LED 패키지 11 ; 발광칩10; LED package 11; Light emitting chip

12 ; 방열판 13 ; 단자12; Heat sink 13; Terminals

14 ; 몰드부14; Mold part

20 ; 인쇄회로기판 21 ; 관통공20; Printed circuit board 21; Through hole

30 ; 써멀테이프30; Thermal tape

40 ; 금속 새시40; Metal chassis

Claims (4)

LED 패키지;LED package; 상기 LED 패키지가 삽입되도록 적어도 하나 이상의 관통공이 형성되고, 상기 관통공 주변에 LED 패키지가 전기적으로 연결되도록 하는 패턴회로가 형성된 인쇄회로기판;A printed circuit board having at least one through hole formed to insert the LED package, and having a pattern circuit configured to electrically connect the LED package around the through hole; 상기 인쇄회로기판의 관통공으로 관통된 LED 패키지의 저면이 써멀테이프에 의해 부착되는 금속 새시;를 포함하여 구비되며,A bottom surface of the LED package penetrated by the through hole of the printed circuit board is attached to the metal chassis by a thermal tape; 상기 LED 패키지는,The LED package, 외주테두리에 단턱이 구비되어 상기 관통공의 내주면에 끼움결합되도록 이루어지는 몰드부;A mold part provided with a stepped portion at an outer circumference thereof to be fitted to the inner circumferential surface of the through hole; 상기 몰드부 상면에 안착되며, 전원인가시 광을 발생시키는 발광칩;A light emitting chip seated on an upper surface of the mold part and generating light when power is applied; 상기 몰드부 하면으로부터 돌출되어 구비되는 방열판; 및A heat dissipation plate protruding from a lower surface of the mold part; And 일단은 상기 발광칩과 접속되고, 타단은 상기 인쇄회로기판의 패턴회로에 접속되도록 절곡되어 구비되는 단자;를 포함하여 이루어지는 것을 특징으로 하는 LED 백라이트 유닛.And one end of which is connected to the light emitting chip and the other end of which is bent to be connected to the pattern circuit of the printed circuit board. 삭제delete 청구항 1에 있어서,The method according to claim 1, 상기 LED 패키지는 상측에 (+)단자가 형성되고, (-)단자는 하측에 형성되는 것을 특징으로 하는 LED 백라이트 유닛.The LED package is a LED backlight unit, characterized in that the (+) terminal is formed on the upper side, and the (-) terminal is formed on the lower side. 청구항 1 또는 청구항 3에 있어서,The method according to claim 1 or 3, 상기 써멀테이프는 열전도성 기재의 양면에 열전도성 접착제가 부착되어 이루어진 것을 특징으로 하는 LED 백라이트 유닛.The thermal tape is a LED backlight unit, characterized in that the thermal conductive adhesive is attached to both sides of the thermal conductive substrate.
KR1020080076808A 2008-08-06 2008-08-06 LED Backlight Unit KR101002915B1 (en)

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US9354383B2 (en) 2013-05-31 2016-05-31 Samsung Display Co., Ltd. Display device including an adhesive member

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KR101522606B1 (en) * 2014-02-11 2015-05-26 주식회사 엘티엘 Reflection and radiant heat panel for led module
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KR20160000500A (en) 2014-06-24 2016-01-05 삼성디스플레이 주식회사 Back-light assembly and display device having the same
KR102627114B1 (en) * 2016-12-30 2024-01-19 엘지디스플레이 주식회사 Liquid crystal display device

Cited By (1)

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Publication number Priority date Publication date Assignee Title
US9354383B2 (en) 2013-05-31 2016-05-31 Samsung Display Co., Ltd. Display device including an adhesive member

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