KR101134671B1 - LED lamp module with the cooling structure - Google Patents

LED lamp module with the cooling structure Download PDF

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Publication number
KR101134671B1
KR101134671B1 KR1020100066502A KR20100066502A KR101134671B1 KR 101134671 B1 KR101134671 B1 KR 101134671B1 KR 1020100066502 A KR1020100066502 A KR 1020100066502A KR 20100066502 A KR20100066502 A KR 20100066502A KR 101134671 B1 KR101134671 B1 KR 101134671B1
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KR
South Korea
Prior art keywords
heat
heat dissipation
printed circuit
circuit board
led chip
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KR1020100066502A
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Korean (ko)
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KR20120005827A (en
Inventor
김은성
이재훈
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엘이디라이텍(주)
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Priority to KR1020100066502A priority Critical patent/KR101134671B1/en
Publication of KR20120005827A publication Critical patent/KR20120005827A/en
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Publication of KR101134671B1 publication Critical patent/KR101134671B1/en

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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00Fastening of light sources or lamp holders
    • F21V19/001Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/003Fastening of light source holders, e.g. of circuit boards or substrates holding light sources
    • F21V19/005Fastening of light source holders, e.g. of circuit boards or substrates holding light sources by permanent fixing means, e.g. gluing, riveting or embedding in a potting compound

Abstract

The present invention relates to a heat dissipation structure of the LED lamp module, a printed circuit board in which a plurality of surface-mounting LED chip is installed, a heat dissipation plate installed on the bottom of the printed circuit board, and heat transfer to transfer heat generated from the LED chip to the heat dissipation plate. The heat transfer means includes a heat dissipation fin inserted into the through hole formed through the top and bottom surfaces of the printed circuit board to be in contact with the bottom surface of the LED chip and the top surface of the heat sink.
According to the heat dissipation structure of the LED lamp module according to the present invention, the LED chip is mounted on the upper part of the through hole formed in the printed circuit board and the heat dissipation fin inserted into the through hole is formed in the structure of direct contact with the LED chip and the heat sink, LED chip The heat generated from the heat transfer to the heat sink quickly to prevent damage to the LED chip and has the advantage of increasing the efficiency.
In addition, the heat dissipation fin and the heat conduction member can be easily installed on the printed circuit board, thereby providing a heat dissipation structure of a low-cost LED lamp module having a high heat dissipation efficiency even without complicated steps.

Description

LED lamp module with the cooling structure

The present invention relates to a heat dissipation structure of the LED lamp module, and more particularly to a heat dissipation structure of the LED lamp module that can quickly release the heat generated from the LED chip mounted on the printed circuit board to increase the lifetime and luminous efficiency of the LED lamp. .

Light emitting diodes (LEDs) are used in home appliances, electronic displays, and the like, depending on the intensity of light output from a P-N junction where electrons and holes meet and emit light.

In particular, LEDs are becoming smaller and slimmer in information and communication devices, and peripheral devices, such as resistors, capacitors, and noise filters, are becoming smaller. Therefore, in order to directly mount on a printed circuit board (PCB), a surface mount device (Surface Mount Device) type is made, and accordingly, an LED lamp used as a display element is also developed as a surface mount element type.

Such a surface mount device can replace a conventional simple lighting lamp, which is used as a lighting indicator, a character display, and an image display that produce various colors.

As the use area of the LED is widened as described above, the required luminance such as electric lamps used for living, electric lamps for rescue signals, etc. is also getting higher and higher power LEDs are widely used in recent years. Such high-power LEDs generate a lot of heat, and thus require a separate device for effectively dissipating heat. On the other hand, an LED package having improved heat dissipation has been developed by using a metal PCB in which an insulating layer and a metal pattern layer are sequentially formed on an aluminum base.

Such a conventional LED package, for example, forming a hole cup exposing a part of the aluminum base to the upper part through groove processing such as cutting, and then attaching the LED chip to the hole cup, and then conductive the LED chip and the metal pattern layer. It is manufactured by connecting with a wire.

However, the LED package according to the related art does not include a lead structure for electrically connecting the external electrode and the LED chip, and thus it is difficult to be mounted on a conventionally used printed circuit board. Since the hole cup is formed by the grooving process, the surface on which the LED chip is mounted by the grooving becomes irregular, which makes it difficult to stably mount the LED chip.

In another example, Korean Patent No. 10-0943520 discloses a heat sink coated with a high heat-radiating radiation ceramic inorganic material, a method of manufacturing the same, and a PCB having the same.

The heat sink coated with the high-radiation-radiating ceramic inorganic material, a method for manufacturing the same, and a PCB having the same are provided on a heat source and include a metal member for reducing the temperature of the heat source. The processed plated steel sheet, one side of a metal member made of aluminum or copper, and a ceramic coating including one or more of boron nitride, aluminum nitride or silver nano powders are applied to a predetermined thickness on a part or the whole of both sides.

According to the heat sink coated with a high heat-radiating ceramic ceramic material and a manufacturing method thereof and a PCB having the same, there is an effect of reducing the temperature of the heat source to about 4 ° C. than the conventional heat sink.

However, the heat sink coated with the high heat-radiating radiant ceramic inorganic material has to be processed to a thickness of 0.5 to 50 mm or sandblasted surface treatment step, depending on the application of the plated steel sheet or one of the metal member of aluminum or copper. The manufacturing method is difficult and the manufacturing cost is high.

The present invention is to solve the above problems, to facilitate the mounting of the LED chip on the printed circuit board, to quickly dissipate the heat generated from the LED chip, to have a high heat dissipation efficiency and low cost The purpose is to provide a heat dissipation structure of the LED lamp module.

The heat dissipation structure of the LED lamp module according to the present invention for achieving the above object is a printed circuit board in which a plurality of surface-mounting LED chip is installed, the heat dissipation plate is installed on the bottom surface of the printed circuit board, and generated in the LED chip A heat transfer means for transferring heat to the heat sink, wherein the heat transfer means is inserted into a through hole formed through the top and bottom surfaces of the printed circuit board to contact the bottom surface of the LED chip and the top surface of the heat sink, respectively. It is provided.

The heat transfer means further includes a heat conduction member extending in a direction away from the through hole so as to occupy a portion of an upper surface and a bottom surface of the printed circuit board from an inner side surface of the through hole, and the heat dissipation fin is inserted into and in contact with the heat conduction member. do.

The thermally conductive member extends over the entire bottom surface except for the through hole formed in the bottom surface of the printed circuit board.

The heat transfer means is further provided to be in contact with the upper surface of the heat dissipation fin and the bottom of the LED chip, respectively, and further comprises a heat conducting member is installed to be in contact with the bottom surface of the heat dissipation fin and the top surface of the heat sink.

According to the heat dissipation structure of the LED lamp module according to the present invention, the LED chip is mounted on the upper part of the through hole formed in the printed circuit board and the heat dissipation fin inserted into the through hole is formed in the structure of direct contact with the LED chip and the heat sink, LED chip The heat generated from the heat transfer to the heat sink quickly to prevent damage to the LED chip and has the advantage of increasing the efficiency.

In addition, since the heat radiation fin and the heat conduction member can be easily installed on the printed circuit board, there is an advantage that can provide a low-cost LED lamp module having a high heat dissipation efficiency even without a complicated process step.

1 is a perspective view showing a first embodiment of an LED lamp module according to the present invention,
2 is a side cross-sectional view of the LED lamp module of FIG.
Figure 3 is a side cross-sectional view showing a second embodiment of the LED lamp module according to the present invention,
Figure 4 is a side cross-sectional view showing a third embodiment of the LED lamp module according to the present invention,
Figure 5 is a side cross-sectional view showing a fourth embodiment of the LED lamp module according to the present invention.

Hereinafter, the heat dissipation structure of the LED lamp module according to a preferred embodiment of the present invention with reference to the accompanying drawings will be described in more detail.

1 to 2, the heat dissipation structure 1 of the LED lamp module includes a printed circuit board 10, a heat dissipation plate 20, and heat transfer means.

The printed circuit board is provided with an electrode layer having a plurality of electrode pads 11 formed thereon and corresponding to a pattern of a plurality of connection terminals 41 formed on the surface-mount LED chip 40. The circuit pattern 12 is connected to the power supply to the LED chip 40 mounted on the printed circuit board 10 is formed.

The connection terminals 41 of the LED chip 40 are bonded to the electrode pads 11 formed on the printed circuit board 10 by solder and electrically connected to each other.

The heat sink 20 is installed on the bottom surface of the printed circuit board 10 in order to discharge heat generated from the LED chip 40 mounted on the printed circuit board 10 to the outside.

As shown in FIG. 2, the heat sink 20 and the printed circuit board 10 have a strong adhesive force so that the heat sink 20 and the printed circuit board 10 may be bonded to each other, and heat transferred from the printed circuit board 10. It may be bonded using an adhesive member 30a having a high thermal conductivity so as to be transferred to the heat sink 20.

As an example of the adhesive member 30a, a liquid thermal grease, a thermal compound, a thermal tape, or the like may be used.

On the other hand, although not shown in the drawings, the heat sink 20 and the printed circuit board 10 may be mutually screwed together via a screw.

The heat sink 20 is preferably made of a metal material having high thermal conductivity, and may be made of aluminum, aluminum alloy, copper, or copper alloy.

The heat dissipation plate 20 is formed in a structure in which a plurality of heat dissipation wings are spaced apart from each other at predetermined intervals along the longitudinal direction so that heat generated from the LED chip 40 can be quickly released into the air.

On the other hand, unlike the one shown in Figure 1 to 2, the heat sink is a through-hole through the plurality of heat dissipation blades 21 may be formed in a direction perpendicular to the longitudinal direction of the heat sink, the through hole is a heat sink and By facilitating the circulation of the air to be contacted can increase the heat radiation efficiency of the heat sink.

In addition, a plurality of printed circuit boards 10 having a predetermined size on which the LED chip 40 is mounted may be spaced apart from each other by a predetermined distance on the heat sink 20.

In this case, it is possible to prevent the trouble of having to separate the entire printed circuit board 10 from the heat sink 20 due to the malfunction of the LED chip 40.

The heat transfer means transmits heat generated from the LED chip 40 mounted on the printed circuit board 10 to the heat sink, and is formed to penetrate up and down in an area of the printed circuit board 10 on which the LED chip 40 is mounted. The heat dissipation fin 31 is inserted into the through hole 10a.

Here, the shape and size of the through-hole 10a formed in the printed circuit board 10 is formed in a shape corresponding to the shape of the LED chip 40 mounted on the printed circuit board 10, the size of the LED chip 40 It is preferable to form smaller than.

The heat dissipation fin 31 is inserted into the through hole 10a and contacts the bottom surface of the LED chip 40 and the top surface of the heat dissipation plate 20 to transmit heat generated from the LED chip 40 to the heat dissipation plate 20.

The heat dissipation fin 31 is made of a metal material having high thermal conductivity and is formed in a cylindrical shape.

Unlike this, the heat dissipation fin 31 may be formed in various shapes to correspond to the shape of the through hole 10a in addition to the cylindrical shape.

Meanwhile, FIG. 3 shows a second embodiment of the heat dissipation structure of the LED lamp module according to the present invention.

Components having the same function as in the above-described drawings are denoted by the same reference numerals.

Referring to FIG. 3, the heat dissipation structure 2 of the LED lamp module includes a printed circuit board 10, a heat dissipation plate 20, and heat transfer means.

Here, the printed circuit board 10 and the heat sink 20 are the same as those described in detail in the detailed description of the first embodiment of the heat dissipation structure 1 of the LED lamp module described above, and will not be repeated.

The heat transfer means includes a heat conduction member formed on the inner surface of the through hole 10a formed through the top and bottom of the printed circuit board 10, and the heat dissipation fin 31.

The thermally conductive member has a high conductivity in the form of a thin plate, and is formed of a metal such as copper, copper, or aluminum.

The thermally conductive member extends upward from the body 35b formed on the inner surface of the through hole 10a, and extends away from the through hole 10a so as to mount the LED chip 40 thereon. A second extension portion 35a formed to occupy and a second extension portion extending downward from the body 35b and extending away from the through hole 10a to partially occupy an area where the heat sink 20 is installed; 35c is provided.

The first extension part 35a is in contact with part or all of the bottom surface of the LED chip 40, and the second extension part 35c is in contact with part of the top surface of the heat sink 20.

Preferably, the first extension part 35a and the second extension part 35c are made of a metal material having high thermal conductivity.

The heat dissipation fin 31 is installed to be in contact with the bottom surface of the heat conduction member, the LED chip 40 and the top surface of the heat dissipation plate 20, and the outer circumferential surface of the heat dissipation fin 31 is inserted into contact with the body portion 35b of the heat conduction member. .

Meanwhile, FIG. 4 illustrates a third embodiment of the heat dissipation structure 3 of the LED lamp module including the heat conducting member in which the second extension part 35c of FIG. 3 is deformed.

Referring to FIG. 4, the body 135b and the first extension part 135a of the thermal conductive member are formed in the same shape as that of FIG. 3, but the second extension part 135c is a printed circuit except for a portion where the through hole 10a is formed. It is formed in the structure extended over the whole between the board | substrate 10 and the heat sink 20. FIG.

The second extension part 135c increases the contact area of the part in contact with the heat dissipation plate 20 so as to effectively transfer heat transferred through the first extension part 135a and the body 135b and at the same time, 20) there is an effect that can increase the binding force of the portion in contact with.

On the other hand, Figure 4 shows a fourth embodiment of the heat dissipation structure of the LED lamp module according to the present invention.

Referring to FIG. 5, the heat dissipation structure 4 of the LED lamp module includes a printed circuit board 10, a heat dissipation plate 20, and upper and lower portions of the heat dissipation fin 31, respectively, of the first heat conduction member 235a and the second heat conduction member. A heat conduction member provided with 235b is further provided.

The first heat conductive member 235a is installed in contact with the top of the heat dissipation fin 31 and in contact with the bottom surface of the LED chip 40. The second heat conductive member 235b is in contact with the bottom of the heat dissipation fin 31 and the heat sink 20 It is installed in contact with the upper surface of).

The first heat conducting member 235a and the second heat conducting member 235b are installed in contact with upper and lower portions of the heat dissipation fin 31 in a state where the heat dissipation fin 31 is inserted into the through hole 10a. There is this.

In addition, when the first thermally conductive member 235a and the second thermally conductive member 235b are formed of a material having high insulation and high thermal conductivity, there is an advantage of insulating the LED chip 40 and the heat sink 20.

Although described with reference to an embodiment shown in the heat dissipation structure diagram of the LED lamp module according to the present invention as described above, which is merely exemplary, and those skilled in the art to various modifications and equivalents therefrom It will be appreciated that other embodiments are possible.

Accordingly, the true scope of the present invention should be determined by the technical idea of the appended claims.

1: LED lamp module 10: printed circuit board
10a: adhesive member 11: electrode pad
20: heat sink 30a: adhesive member
31: heat sink fin 40: LED chip
41: electrode terminal

Claims (4)

  1. delete
  2. A printed circuit board on which a plurality of surface mount LED chips are installed;
    A heat sink installed on a bottom surface of the printed circuit board;
    And heat transfer means for transferring heat generated from the LED chip to the heat sink.
    The heat transfer means includes a heat dissipation fin inserted into a through hole formed through the top and bottom surfaces of the printed circuit board so as to contact the bottom surface of the LED chip and the top surface of the heat sink, respectively;
    A heat conductive member extending in a direction away from the through hole to occupy a portion of the upper surface and the bottom surface of the printed circuit board from an inner side surface of the through hole,
    The heat dissipation fin is a heat dissipation structure of the LED lamp module, characterized in that the insertion is installed to contact the heat conducting member.
  3. The method of claim 2,
    The heat conducting member is a heat dissipation structure of the LED lamp module, characterized in that extending over the entire bottom surface of the printed circuit board except the through hole formed in the bottom of the printed circuit board.
  4. delete
KR1020100066502A 2010-07-09 2010-07-09 LED lamp module with the cooling structure KR101134671B1 (en)

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Application Number Priority Date Filing Date Title
KR1020100066502A KR101134671B1 (en) 2010-07-09 2010-07-09 LED lamp module with the cooling structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020100066502A KR101134671B1 (en) 2010-07-09 2010-07-09 LED lamp module with the cooling structure

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KR20120005827A KR20120005827A (en) 2012-01-17
KR101134671B1 true KR101134671B1 (en) 2012-04-09

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101501464B1 (en) * 2014-11-12 2015-03-18 주식회사 테크엔 Manufacturing methode of the led lamp having heater pipe type radiator
KR101508958B1 (en) * 2014-11-12 2015-04-08 영남엘이디 주식회사 The led lamp having heater pipe type radiator
WO2016144090A1 (en) * 2015-03-09 2016-09-15 엘이디라이텍(주) Flexible circuit board assembly for led lamp

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101921127B1 (en) * 2012-02-29 2018-11-22 엘지이노텍 주식회사 Lighting device
KR101190281B1 (en) * 2012-03-07 2012-10-12 가부시키가이샤 타카이코포레이션 Led lamp module with the cooling structure and process of the same
KR101440357B1 (en) * 2014-06-11 2014-09-17 주식회사 테크엔 The led lamp having case integral with heat radiator made resin coating
KR101440358B1 (en) * 2014-06-11 2014-09-22 영남엘이디 주식회사 Manufacturing method of the led lamp having case integral with heat radiator made resin coating
KR101673767B1 (en) * 2015-05-11 2016-11-08 현대자동차주식회사 Wireless charging device
CN106195654B (en) * 2016-07-06 2019-06-28 青岛华高墨烯科技股份有限公司 A kind of heat dissipation device of LED lamp
KR101963738B1 (en) * 2017-11-16 2019-03-29 (주)제이엔텍 Led lighting apparatus

Citations (3)

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Publication number Priority date Publication date Assignee Title
KR20060105225A (en) * 2005-04-01 2006-10-11 박병재 Light emitting diode structure
KR20080007961A (en) * 2006-07-19 2008-01-23 알티전자 주식회사 Cooling device of led module and manufacturing method thereof
KR100889512B1 (en) 2007-05-28 2009-03-19 한국광기술원 Light emitting diode package for Thermal Via and its method

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20060105225A (en) * 2005-04-01 2006-10-11 박병재 Light emitting diode structure
KR20080007961A (en) * 2006-07-19 2008-01-23 알티전자 주식회사 Cooling device of led module and manufacturing method thereof
KR100889512B1 (en) 2007-05-28 2009-03-19 한국광기술원 Light emitting diode package for Thermal Via and its method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101501464B1 (en) * 2014-11-12 2015-03-18 주식회사 테크엔 Manufacturing methode of the led lamp having heater pipe type radiator
KR101508958B1 (en) * 2014-11-12 2015-04-08 영남엘이디 주식회사 The led lamp having heater pipe type radiator
WO2016144090A1 (en) * 2015-03-09 2016-09-15 엘이디라이텍(주) Flexible circuit board assembly for led lamp
US10477670B2 (en) 2015-03-09 2019-11-12 Ledlitek Co., Ltd Flexible circuit board assembly for LED lamp

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