TWM498387U - Light emitting diode module package structure having thermal-electric separated function and electrical connection module - Google Patents

Description

Thermoelectrically separated LED package module and electrical connection module

The present invention relates to a light-emitted diode module, and more particularly to a thermoelectrically separable light emitting diode package module.

In recent years, with the gradual prevalence of environmental protection, energy conservation and carbon reduction, the light-emitting diode has become one of the important options to replace the general light source because of its high luminous efficiency.

Most of the existing chip-on-board (COB) package structures use a metal substrate or a ceramic substrate for light-emitting diode packaging. The metal substrate needs to be insulated with an insulating circuit and a heat-dissipating substrate to cause thermal resistance change. Large, the ceramic substrate itself is an insulating material, and the insulating layer is not required to be electrically separated, so there is no problem that the thermal resistance becomes large, but the ceramic COB is liable to cause breakage when the screw is locked.

A conventional technology such as the illuminating device of the Republic of China Public Publication No. 201126777 (application date is May 20, 2010, application number 099116190), which is a chip-on-board (COB) package structure having a laminated structure and comprising three layers: a thermally conductive substrate, a circuit layer, a cavity cover and an array of lenses; the thermally conductive substrate conducts heat to the underside of the substrate, generally the substrate may comprise a metal or may comprise a copper alloy, Aluminum, anodized aluminum, An alloy of aluminum, a magnesium alloy or possibly a thermally conductive ceramic; the circuit layer forming a pattern of electrical conductors thereon. Each of the light-emitting diode wafers is mounted and electrically connected to a respective electrical conductor by virtue of soldering thereof, for example, with gold and tin eutectic solder, using a solder paste (eg, tin or silver solder paste). Or use a metal-loaded epoxy resin (such as a silver-loaded epoxy resin).

However, in the conventional metal substrate COB product, since the heat conduction substrate needs to be provided with an electrical insulation layer insulation circuit and a heat dissipation substrate, the above method can achieve heat dissipation requirements, but the thermal resistance becomes large, because the brightness of the light emitting diode varies with the driving current. The increase and increase of the light-emitting diode of higher brightness, the metal substrate has a limited heat dissipation effect, and can no longer meet the heat dissipation requirement.

However, the circuit layer is configured such that the light emitting diode chips are electrically interconnected in a parallel series between the positive (+) electrical connection pads and the negative (-) electrical connection pads. The electrical connection pads are also located on the upper surface of the PCB, since the positive (+) electrical connection pads and the negative (-) electrical connection pads need to be electrically connected to the positive power terminals of the external power supply by means of soldering, respectively, by means of soldering. And the negative terminal, the process is complicated.

Therefore, there is a need to develop a new type of metal substrate and a high efficiency heat emitting diode package module, and to develop an electrical connection module for electrically connecting the light emitting diodes to the positive (+) electrical connection pads of the electrical conductors. The negative (-) electrical connection pad directly passes through the electrical connection cable of the electrical connection module to the positive and negative terminals of the external power supply, so as to solve the problem that the heat dissipation is difficult and the process is complicated.

The purpose of the present invention is to provide a thermoelectrically separated LED package module comprising a metal substrate, an electrical connector, a light emitting diode ceramic package component, and an electrical connection plate; the metal substrate has a relative a surface and a second surface are made of a heat-dissipating metal material; the electrical connector is attached to the first surface of the metal substrate, the electrical connector has a plurality of electrical terminals at one end, and the electrical connector Opening a boring hole; the illuminating diode ceramic seal The component is disposed in the pupil of the electrical connector and is attached to the first surface of the metal substrate, the LED package component comprises a ceramic substrate, a circuit layer, and at least one LED chip and The light-transmitting package body and the like are formed; a plurality of conductive portions are formed on the surface of the electrical connection plate, and one end is used for attaching the plurality of electrode portions of the light-emitting diode ceramic package component, and is electrically connected to the electrode portions, and the other end is electrically connected The plurality of power receiving portions of the electrical connector are attached, and the power receiving portions are electrically connected.

Another object of the present invention is to provide a thermoelectrically separated LED package module that includes at least one fin, is perforated in the electrical connector and the metal substrate, and is electrically connected by a fixing component (such as a screw). The connector and the metal substrate and the fins are locked to each other to achieve the function of reducing the thermal resistance and enhancing the strength of the module.

A further object of the present invention is to provide a thermoelectrically separated LED package module that further includes a plurality of vent holes, and a plurality of recesses are formed around the openings of the electrical connectors, and the ceramic package components are disposed on the electrical connectors. The vent hole is formed in the first hole of the metal substrate and is attached to the first surface of the metal substrate.

Another object of the present invention is to provide an electrical connection module for a light-emitting diode package component of a light-emitting diode package module for thermoelectric separation, comprising an electrical connector and an electrical connection plate, connected to the outside The positive and negative terminals of the power supply.

The effect of the creation gain (1) is that the provided thermoelectrically separated LED package module separates the heat dissipation path from the circuit by combining a light emitting diode ceramic package component and a metal substrate, and the heat conduction path is illuminated by two The polar ceramic package component emits the diode chip to the ceramic substrate, and then transfers the solder paste to the metal substrate to reduce the thermal resistance and enhance the strength of the module.

The effect of the creation gain (2) is that the provided thermoelectrically separated LED package module has a plurality of second perforations corresponding to the position of the first perforation and the electrical connector on the metal substrate to fix the component (including Not limited to the screw) through each of the opposite first and second perforations, and at least one fin on the other side of the metal substrate is locked, without causing the LED package component to be broken, and the heat conduction path is caused by the light-emitting diode The body ceramic package component emits the diode chip to the ceramic substrate, and then uses the solder paste to conduct heat to the metal substrate, and then conducts heat on the fin to achieve the effect of multiple heat dissipation and the strength of the module.

The effect of the creation gain (3) is that the provided thermoelectrically separated LED package module is formed by forming a plurality of recesses around the pupil of the electrical connector to form a vent hole, and coating the metal substrate on the high temperature process in the process. The paste paste is combined with the electrical connector and the ceramic package component to generate bubbles to be discharged into the vent holes, thereby reducing the adverse effect of the bubbles on the heat conduction and improving the heat conduction effect.

The effect of the creation gain (four) is that the electrical connection module of the light-emitting diode package component for the thermoelectric separation of the light-emitting diode package module is connected to an external power source, through an electrical connector and electricity The connecting plate, the plurality of electrodes of the light-emitting diode package component of the entire thermoelectrically separated LED package module are electrically connected to the external power source, and do not need to be electrically connected by using multiple bonding wires to simplify the thermoelectric separation. The process steps of the LED package module and improve the efficiency and convenience of subsequent assembly and maintenance.

The technical means adopted by the present invention (1) is to provide a thermoelectrically separated LED package module comprising a metal substrate, a light emitting diode ceramic package component, an electrical connector and an electrical connection board; a metal substrate (aluminum substrate or a copper substrate) having heat dissipation characteristics and composed of a metal material; the electrical connector being attached to the first surface of the metal substrate, the electricity The electrical connector has a plurality of electrical connection portions, and the electrical connector has a pupil; the LED package component is disposed in the pupil of the electrical connector and is attached to the metal substrate The LED package component mainly includes a ceramic substrate, a circuit layer, at least one LED chip, and a light transmissive package. The ceramic substrate has a circuit layer, and the LED array is disposed. The circuit layer is electrically coupled to the circuit layer, and the circuit layer is further provided with a plurality of electrode portions at one end thereof, and may have at least one positive electrode connection pad and at least one negative electrode connection pad, and different light patterns are controlled by different lines. And the electrical connecting plate, a plurality of conductive portions are formed on the surface, and the solder paste is applied to the surface, one end is used for bonding the plurality of electrode portions of the light emitting diode ceramic package component, and the other end is used for bonding the electrical property. The plurality of electrical connectors of the connector are electrically connected to each other.

The technical means adopted by the present invention (2) is to provide a thermoelectric separation LED package module, comprising a metal substrate, a light-emitting diode ceramic package component, an electrical connector and an electrical connection board; The metal substrate has a heat dissipation characteristic and is made of a metal material; the electrical connector is attached to the first surface of the metal substrate, the electrical connector has a plurality of electrical connection portions at one end, and the electrical connector has a a plurality of recesses are formed around the pupil; the LED package component is disposed in the pupil of the electrical connector and is attached to the metal substrate to form a vent hole. The diode ceramic package component mainly comprises a ceramic substrate, a circuit layer, at least one light emitting diode chip and a light transmissive package, the ceramic substrate has a circuit layer, and the light emitting diode chip is disposed on the circuit layer The electrical layer is respectively coupled to the circuit layer, and the circuit layer is further provided with a plurality of electrode portions at one end thereof, and has at least one positive electrode connection pad and at least one negative electrode connection pad; and the electrical connection plate, the surface Forming a plurality of conductive portions, one end of which is applied to the surface solder paste, one end for bonding the plurality of electrode portions of the light-emitting diode package component, and the other end for bonding the plurality of power-on portions of the electrical connector, and electrically connecting each other Sexual connection.

The technical means adopted by the creation (3) is to provide a thermoelectrically separated LED package module, comprising a metal substrate, a light-emitting diode ceramic package component, an electrical connector, an electrical connection plate, a fin and The metal substrate has a heat dissipation characteristic and is made of a metal material; the electrical connector is attached to the first surface of the metal substrate, and the electrical connector has a plurality of power receiving portions at one end, and the electrical connector The electrical connector has a boring hole; the illuminating diode package component is disposed in the boring of the electrical connector and is attached to the metal substrate, and the illuminating diode package component mainly comprises a a ceramic substrate, a circuit layer, at least one light emitting diode chip, and a light transmissive package; the plurality of electrical connectors of the electrical connector are electrically connected to the plurality of conductive portions of the electrical connection plate, and the metal substrate has The plurality of first through holes and the electrical connector have a plurality of second through holes correspondingly overlapping to form a channel, wherein the fixing component penetrates the channel and is attached to at least one of the fins attached to the second surface of the metal substrate Set, wherein such second perforation diameter equal to or greater than those of the first aperture of the hole, the fixing element is embedded in or attached to the surface of the electrical connector.

The technical means adopted by the present invention (4) is to provide a thermoelectric separation LED package module, comprising a metal substrate, a light-emitting diode ceramic package component, an electrical connector and an electrical connection board; The other surface of the metal substrate extends at least one fin integrally formed with heat dissipation characteristics and is made of a metal material; the electrical connector is attached to the first surface of the metal substrate, and the electrical connector has a plurality of ends The electrical connector has a boring hole; the illuminating diode ceramic package component is disposed in the boring of the electrical connector, including but not limited to the solder paste for reflow bonding to the metal On the substrate, the LED package component mainly includes a ceramic substrate, a circuit layer, at least one LED chip, and a light transmissive package; the electrical connector is electrically connected to the plurality of electrical components. The plurality of conductive portions of the board are electrically connected.

The technical means adopted by the present invention (5) is to provide an electrical connection module for a light-emitting diode package component of a light-emitting diode package module for thermoelectric separation, comprising an electrical connector and an electrical connection plate; The electrical connector has a plurality of electrical connecting portions at one end thereof, and is electrically connected to the positive electrical terminal and the negative electrical terminal of the external power source; the electrical connecting plate has a plurality of conductive portions formed on the surface thereof, and the one end is attached with the thermoelectrically separated light emitting diode The plurality of electrode portions of the LED package component of the polar package module are electrically connected, and the other end is used for electrically connecting the plurality of electrical connectors of the electrical connector.

For the sake of your review, you can make a further understanding and understanding of the purpose, technical features and efficacy of this creation. The examples are shown in the following diagram:

10,10a,10b,10c‧‧‧Thermal separation LED module

20‧‧‧Electrical connection module

100‧‧‧Fins

110‧‧‧fourth perforation

200‧‧‧Metal substrate

210‧‧‧ first surface

220‧‧‧ second surface

230‧‧‧First perforation

300‧‧‧Electrical connector

310,320‧‧‧Power Department

330‧‧‧镂空

340‧‧‧Second perforation

350‧‧‧ recess

360‧‧‧ positioning slot

370‧‧‧ third perforation

400‧‧‧Light Emitting Diode Ceramic Packaging Components

410‧‧‧ceramic substrate

420‧‧‧Line layer

421,422‧‧‧Electrode

423‧‧‧ protective elements

430‧‧‧Light Emitter Wafer

440‧‧‧Light permeable package

441‧‧‧Package colloid

442‧‧‧Fluorite

443‧‧‧ lens

500‧‧‧Electrical connecting plate

510,520‧‧‧Electrical Department

600‧‧‧Fixed components

700‧‧‧External power supply

1 is a perspective view of a light-emitting diode package module of the preferred embodiment of the present invention.

FIG. 2 is a partially exploded perspective view of the thermoelectrically separated LED package of the preferred embodiment of the present invention.

3 is a partial cross-sectional view of a light-emitting diode package component of the thermoelectrically separated LED package of the preferred embodiment of the present invention.

4A is a perspective view of a thermoelectrically separated LED package of the second embodiment of the present invention.

4B is another perspective view of the thermoelectrically separated LED package of the second embodiment of the present invention.

FIG. 5 is a perspective view of a light-emitting diode package module of the third embodiment of the present invention. Figure.

FIG. 6 is a partially exploded perspective view of the thermoelectrically separated LED package of the third embodiment of the present invention.

FIG. 7 is a schematic perspective view of a thermoelectrically separated LED package module according to a fourth embodiment of the present invention.

FIG. 8 is a partially exploded perspective view of the thermoelectrically separated LED package of the fourth embodiment of the present invention.

FIG. 9 is an exploded perspective view showing the electrical connection module of the light-emitting diode package component of the light-emitting diode package module of the fifth embodiment of the present invention.

In order to further understand the features, technical means, and specific functions and purposes of the present invention, more specific embodiments are listed, followed by a detailed description of the drawings.

Referring to FIG. 1 and FIG. 2 , in the preferred embodiment, the thermoelectrically separated LED package module 10 of the present invention comprises a metal substrate 200 , an electrical connector 300 , and a light emitting diode package component 400 . And the electrical connection plate 500 and the like; the metal substrate 200 has heat dissipation characteristics and is made of a metal material, and the LED package element 400 is disposed in the bore 330 of the electrical connector 300 and bonded to the metal substrate 200 On the first surface 210, the LED package component 400 mainly includes a ceramic substrate 410, a circuit layer 420, at least one LED chip 430, and a light-permeable package 440 (shown in FIG. 3). The ceramic substrate 410 has a circuit layer 420. The at least one LED substrate 430 is disposed on the ceramic substrate 410. The circuit layer 420 is electrically coupled to the circuit layer 420. The circuit layer 420 has a shielding element 423, and a plurality of electrode portions 421 and 422 are disposed at one end. Each has a positive electrode connection pad and a negative electrode connection pad, and the electrical connector 300 has a plurality of power connection parts. 310, 320, and the electrical connection plate 500, having a plurality of conductive portions 510, 520 on one surface, and a plurality of electrode portions 421, 422 for attaching the light-emitting diode ceramic package component 400 to the other end of the surface of the electrical connection plate 500. The plurality of electrical connection portions 310, 320 for attaching the electrical connector 300 are electrically connected to each other to simplify the process step, and the positive electrode connection pads of the plurality of electrode portions 421, 422 of the light emitting diode ceramic package component 400 need not be soldered. The negative electrode connection pad and the external power source (not shown) are electrically connected to the complicated process, and the LED package 400 is coated on the first surface 210 of the metal substrate 200 to adhere to the first surface of the metal substrate 200. 210, whereby the heat of the light-emitting diode ceramic package component 400 is dissipated, and the metal substrate 200 can assist heat dissipation.

Further, for example, after the preferred embodiment, the metal substrate 200 has heat dissipation characteristics and is composed of a metal material, and the metal material may be selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy, magnesium alloy, aluminum lanthanum carbide, and carbon composite. One. Furthermore, the ceramic substrate has the characteristics of electrical insulation and heat dissipation and is composed of a ceramic material selected from the group consisting of alumina, aluminum nitride, zirconium oxide, tantalum carbide, hexagonal boron nitride and calcium fluoride. . Furthermore, the light-emitting diode wafer 430 is suitable for a light-emitting diode wafer of a vertical structure and/or a light-emitting diode wafer of a horizontal structure. Furthermore, the encapsulant colloid 441 in the LED package 400 has high light transmittance and electrical insulation, and may be composed of a material including silicone or epoxy. The phosphor 442 may be selected from fluorescent glue or fluorescent film. The opaque package 440 is formed, but not limited to, the encapsulant 441 is coated with the phosphor 442. The opaque package 440 is formed to cover the encapsulant 441 for the phosphor 442, and the transparent package 440 is formed. The opaque package 440 may further include a lens 443 for mixing the phosphor 442 (eg, phosphor) with the encapsulant 441 (eg, silicone or epoxy). Furthermore, the electrical connector 300 and the electrical connection plate 500 materials include, but are not limited to, FR4.

Referring to FIG. 4A and FIG. 4B, in the second embodiment, the thermoelectricity of the present creation The separated LED package module 10a is substantially the same as the preferred embodiment. The difference between the two is that the metal substrate 200 further includes at least one fin 100 (as shown in FIG. 4A), which is die-cast, aluminum. Formed by extrusion or stamping, the at least one fin is attached to the second surface 220 of the metal substrate; or the metal substrate is integrally formed by extending at least one fin from the other surface, the LED package component is obtained by This includes, but is not limited to, a solder paste applied to the metal substrate (as shown in FIG. 4B).

Referring to FIG. 5 and FIG. 6 , in the third embodiment, the thermoelectrically separated LED package module 10 b of the present invention is substantially the same as the preferred embodiment, and the difference is only in the metal substrate. 200 has a plurality of first through holes 230, the electrical connector 300 has a plurality of second through holes 340, and at least one of the fins 100 has a plurality of fourth through holes 110, which are overlapped with each other to form a passage for fixing the component 600 (including but not limited to screws) Passing through the channel, the at least one fin 100 attached to the second surface 220 of the metal substrate 200 is locked and fixed. The aperture of the second through hole 340 is greater than or equal to the aperture of the first through hole 230, so that the fixing component 600 is buried. In or attached to the surface of the electrical connector 300 without causing the light-emitting diode package component 400 to be broken, and the heat conduction path is from the light-emitting diode package 430 to the ceramic substrate 410 in the light-emitting diode package component 400. The solder paste is further thermally conductive to the metal substrate 200, and then thermally conductive on the fin 100 to achieve the function of reducing the thermal resistance and enhancing the strength of the module.

Referring to FIG. 7 and FIG. 8 , in the fourth embodiment, the thermoelectrically separated LED package module 10 c of the present invention is substantially the same as the preferred embodiment, and the difference between the two is only: electrical A plurality of recesses 350 are formed around the opening of the connector 300. The LED package 400 is disposed in the bore 330 of the electrical connector 300 and is attached to the first surface 210 of the metal substrate 200 to form a vent. The solder paste coated on the high-temperature treated metal substrate 200 in the process is closely adhered to the metal substrate 200 and the electrical connector 300 and the light-emitting diode ceramic package component 400 to generate a bubble discharge to the vent holes to reduce the bubble pair. The adverse effects of heat conduction can increase heat transfer effect.

Referring to FIG. 9 , in the fifth embodiment, the electrical connection module 20 of the present invention comprises an electrical connector 300 and an electrical connection board 500 , and the electrical connector 300 has a plurality of electrical terminals 310 , 320 at one end. The electrical connection board is electrically connected to the external power supply 700. The electrical connection board 500 has a plurality of conductive portions 510 and 520 formed on the surface thereof, and the plurality of electrode regions 421 and 422 of the light-emitting diode package component 400 of the light-emitting diode package module 10 are electrically connected at one end. The light-emitting diode package 430 is turned on to emit the illumination light, and the other end is used for attaching the plurality of power connection portions 310 and 320 of the electrical connector 300 for electrical connection, and the light-emitting diode package module is convenient for thermoelectric separation. The loading and unloading maintenance and simplification of the process of 10; it is worth mentioning that the two sides of the electrical connector 300 can have a plurality of positioning slots 360, the positioning slots 360 are recessed on both sides of the electrical connector 300, and the external power supply 700 The latching slot (not shown) is engaged with the buckle, and the electrical connector 300 can also include at least one third through hole 370 disposed on the surface of the electrical connector 300 and externally. Power supply 700 is opposite to the pin ( Not shown) with the holding, by electrically connecting multiple modules 20 can be fixed to an external power source 700 efficiently, affected by vibrations external environment; electrical connector 300 and electrical material web 500 include but are not limited to FR4.

In summary, the thermoelectrically separated LED package module of the present invention is disposed on the metal substrate by the LED package component to reduce the thermal resistance; the electrical component is passed through the fixing component. The connector and the metal substrate are locked with the fins to achieve multiple heat dissipation effects; and the electrical connector module is used to achieve a simplified process step.

This creation has already met the requirements of the new patent and applied in accordance with the law. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the scope of the present invention. Those skilled in the art to which the present invention pertains can be used in various ways without departing from the spirit and scope of the present invention. Change and retouch, so the scope of protection of this creation should be attached to the scope of the patent application The definition is subject to change.

10‧‧‧Thermal separation LED module

200‧‧‧Metal substrate

300‧‧‧Electrical connector

310,320‧‧‧Power Department

400‧‧‧Light Emitting Diode Ceramic Packaging Components

500‧‧‧Electrical connecting plate

Claims (16)

A thermoelectrically separated LED package module comprising: a metal substrate having a first surface and a second surface opposite to each other, wherein the heat dissipation characteristic is made of a metal material; and an electrical connector attached to the metal On the first surface of the substrate, the electrical connector has a plurality of electrical connection portions at one end, and the electrical connector has a pupil; a light-emitting diode ceramic package component for emitting light and being disposed on the electrical component The pedestal of the connector is attached to the first surface of the metal substrate, and the illuminating diode package comprises: a ceramic substrate having electrical insulation properties and composed of a ceramic material; Forming on the surface of the ceramic substrate, the circuit layer is further provided with a plurality of electrode portions at one end; at least one light-emitting diode wafer is fixed on the surface of the ceramic substrate, and electrically connected to the circuit layer; a light package body formed on a surface of the ceramic substrate and encapsulating the light emitting diode chip; and an electrical connection plate having a plurality of conductive portions formed on the surface and one end for attaching the light emitting diode ceramic Means of the circuit element layer, and electrically connected to those portions of the electrode wiring layers, such that the other end for attaching the connector electrically connected to the electrical portion, and electrically connected to such electrical connection portion. The thermoelectrically separated LED package module of claim 1, further comprising at least one fin formed by die casting, aluminum extrusion or stamping, the at least one fin attached And a second surface of the metal substrate. The thermoelectrically separated light-emitting diode package module of claim 1, wherein the metal substrate is integrally formed by extending at least one fin from the other surface. The method of claim 2, wherein the metal substrate further comprises a plurality of first through holes, the first through holes are disposed on the surface of the metal substrate, and are fixed by a plurality of The component is locked to the at least one fin. The galvanic diode package module of claim 4, wherein the electrical connector further comprises a plurality of second through holes, the second holes are disposed on the surface of the electrical connector, The second perforating apertures are greater than or equal to the first perforation apertures by the fixing elements being fixed relative to the at least one fin by opposing the first perforations and the second perforations. The thermoelectrically separated LED package module according to claim 5, wherein the fixing component is a screw. The thermoelectrically separated LED package module of claim 1, wherein the electrical connector further comprises at least one recess, the at least one recess being disposed around the periphery of the bore. The illuminating diode assembly module of the pyroelectric separation method of claim 1, wherein the electrical connector further comprises a plurality of positioning slots, wherein the positioning slots are recessed on both sides of the power receiving portion. The galvanic diode package module of claim 2, wherein the electrical connector further comprises at least one third through hole, the at least one third through hole being disposed on the electrical connector surface . The galvanic diode package module of claim 1, wherein the permeable package comprises an encapsulant and a phosphor formed on the surface of the encapsulant. The illuminating diode assembly module of the thermoelectrically separated package of claim 1, wherein the permeable package comprises a phosphor coated on the surface of the illuminating diode chip and covered with a phosphor The encapsulant colloid of the phosphor. The thermoelectrically separated LED package module according to claim 1, wherein the permeable package is formed by mixing a phosphor and an encapsulant. The thermoelectrically separated light emitting diode package module according to any one of claims 10 to 12, wherein the light permeable package further comprises a lens. An electrical connection module is used for electrically connecting an external power source of a light-emitting diode package component of a thermoelectrically separated LED package module, comprising: an electrical connector having a plurality of electrical connections at one end, and electricity The external power source is connected to the external power source; and an electrical connecting plate is formed with a plurality of conductive portions on the surface, the light emitting diode package module is electrically connected at one end, and the other end is used for attaching the electrical connector The power supply unit is electrically connected. The electrical connection module of claim 14, wherein the electrical connector further comprises a plurality of positioning slots, the positioning slots are recessed on opposite sides of the power receiving portion, and are engaged with the external power supply. . The electrical connector module of claim 14, wherein the electrical connector further comprises at least one third through hole disposed on one side of the power receiving portion and coupled to the external power source.