TWM498387U - Light emitting diode module package structure having thermal-electric separated function and electrical connection module - Google Patents

Light emitting diode module package structure having thermal-electric separated function and electrical connection module Download PDF

Info

Publication number
TWM498387U
TWM498387U TW103211644U TW103211644U TWM498387U TW M498387 U TWM498387 U TW M498387U TW 103211644 U TW103211644 U TW 103211644U TW 103211644 U TW103211644 U TW 103211644U TW M498387 U TWM498387 U TW M498387U
Authority
TW
Taiwan
Prior art keywords
electrical connector
electrical
emitting diode
light
module
Prior art date
Application number
TW103211644U
Other languages
Chinese (zh)
Inventor
Yi-Wen Chen
ying-hao Chen
Hsiao-Wen Lee
I-Hsin Tung
Original Assignee
Ligitek Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ligitek Electronics Co Ltd filed Critical Ligitek Electronics Co Ltd
Priority to TW103211644U priority Critical patent/TWM498387U/en
Priority to CN201520173230.8U priority patent/CN204717541U/en
Priority to CN201510134560.0A priority patent/CN105202437B/en
Priority to CN201520516824.4U priority patent/CN204885155U/en
Publication of TWM498387U publication Critical patent/TWM498387U/en

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Landscapes

  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Description

熱電分離的發光二極體封裝模組及電連接模組 Thermoelectrically separated LED package module and electrical connection module

本創作係關於一種發光二極體(light-emitted diode)模組,特別是有關於一種可熱電分離的發光二極體封裝模組。 The present invention relates to a light-emitted diode module, and more particularly to a thermoelectrically separable light emitting diode package module.

近年來,隨著環保、節能及減碳的世界風潮之逐漸盛行,發光二極體因具有高發光效率而成為取代一般發光源的重要選項之一。 In recent years, with the gradual prevalence of environmental protection, energy conservation and carbon reduction, the light-emitting diode has become one of the important options to replace the general light source because of its high luminous efficiency.

現有板上晶片(chip-on-board,COB)封裝結構大部分使用金屬基板或是陶瓷基板進行發光二極體封裝,金屬基板需要加上一絕緣層隔絕電路與散熱基板,會造成熱阻變大,陶瓷基板本身為絕緣材料,不需絕緣層將電性隔開,故沒有熱阻變大問題,但陶瓷COB在鎖附螺絲時容易造成破碎情形。 Most of the existing chip-on-board (COB) package structures use a metal substrate or a ceramic substrate for light-emitting diode packaging. The metal substrate needs to be insulated with an insulating circuit and a heat-dissipating substrate to cause thermal resistance change. Large, the ceramic substrate itself is an insulating material, and the insulating layer is not required to be electrically separated, so there is no problem that the thermal resistance becomes large, but the ceramic COB is liable to cause breakage when the screw is locked.

習知技術如中華民國公開第201126777號之發光裝置(申請日為2010年5月20日,申請號為099116190),該裝置係為板上晶片(chip-on-board,COB)封裝結構,具有一層壓之構造且包括三層:一熱傳導基板、一電路層、一腔蓋及一陣列之透鏡;該熱傳導基底將熱傳導至該基底之下面,一般該基底可包括一金屬或者可包括銅合金、鋁、陽極氧化鋁、 鋁的合金、鎂合金或可能為熱傳導陶瓷;該電路層在其上形成電導體之一圖案。每個發光二極體晶片憑藉其正、負電極藉由用例如金錫共晶焊料焊接而安裝於且電連接至一各自之電導體,該焊接使用一焊料膏(例如錫或銀焊料膏)或使用一負載金屬之環氧樹脂(諸如一負載銀之環氧樹脂)。 A conventional technology such as the illuminating device of the Republic of China Public Publication No. 201126777 (application date is May 20, 2010, application number 099116190), which is a chip-on-board (COB) package structure having a laminated structure and comprising three layers: a thermally conductive substrate, a circuit layer, a cavity cover and an array of lenses; the thermally conductive substrate conducts heat to the underside of the substrate, generally the substrate may comprise a metal or may comprise a copper alloy, Aluminum, anodized aluminum, An alloy of aluminum, a magnesium alloy or possibly a thermally conductive ceramic; the circuit layer forming a pattern of electrical conductors thereon. Each of the light-emitting diode wafers is mounted and electrically connected to a respective electrical conductor by virtue of soldering thereof, for example, with gold and tin eutectic solder, using a solder paste (eg, tin or silver solder paste). Or use a metal-loaded epoxy resin (such as a silver-loaded epoxy resin).

惟,現有一般金屬基板COB產品,由於熱傳導基板需要加上一電絕緣層隔絕電路與散熱基板,上述方式雖可達到散熱需求,但會造成熱阻變大,由於發光二極體亮度隨驅動電流的增大而增大,對更高亮度的發光二極體,金屬基板散熱效果有限,已經無法滿足其散熱要求。 However, in the conventional metal substrate COB product, since the heat conduction substrate needs to be provided with an electrical insulation layer insulation circuit and a heat dissipation substrate, the above method can achieve heat dissipation requirements, but the thermal resistance becomes large, because the brightness of the light emitting diode varies with the driving current. The increase and increase of the light-emitting diode of higher brightness, the metal substrate has a limited heat dissipation effect, and can no longer meet the heat dissipation requirement.

惟,該電路層經組態使得該等發光二極體晶片在正(+)電連接墊與負(-)電連接墊之間電互連成為平行串聯。該等電連接墊亦位於該PCB之上表面,由於正(+)電連接墊與負(-)電連接墊需要分別藉電性連接線使用銲接方式而電性連接至外部電源的正電端及負電端,製程複雜。 However, the circuit layer is configured such that the light emitting diode chips are electrically interconnected in a parallel series between the positive (+) electrical connection pads and the negative (-) electrical connection pads. The electrical connection pads are also located on the upper surface of the PCB, since the positive (+) electrical connection pads and the negative (-) electrical connection pads need to be electrically connected to the positive power terminals of the external power supply by means of soldering, respectively, by means of soldering. And the negative terminal, the process is complicated.

因此,需要發展一種新式需金屬基板且具高效率散熱發光二極體封裝模組,及發展一種電連接模組將該等發光二極體電連接至電導體之正(+)電連接墊與負(-)電連接墊直接透過電連接模組電性連接線至外部電源的正電端及負電端,以解決上述散熱不易及製程複雜的問題。 Therefore, there is a need to develop a new type of metal substrate and a high efficiency heat emitting diode package module, and to develop an electrical connection module for electrically connecting the light emitting diodes to the positive (+) electrical connection pads of the electrical conductors. The negative (-) electrical connection pad directly passes through the electrical connection cable of the electrical connection module to the positive and negative terminals of the external power supply, so as to solve the problem that the heat dissipation is difficult and the process is complicated.

本創作之目的在於,提供一種熱電分離的發光二極體封裝模組,包括金屬基板、電性連接器、發光二極體陶瓷封裝元件及電性連接板等構成;該金屬基板具有相對之第一表面及第二表面,係為散熱特性金屬材料構成;該電性連接器貼附於該金屬基板之第一表面上,該電性連接器一端具複數接電部,且該電性連接器開設有一鏤孔;該發光二極體陶瓷封 裝元件設置於該電性連接器之鏤孔中,並貼合於該金屬基板之第一表面上,該發光二極體陶瓷封裝元件包括陶瓷基板、線路層、至少一發光二極體晶片及可透光封裝體等構成;該電性連接板表面上形成複數導電部,一端用於貼附該發光二極體陶瓷封裝元件之複數電極部,並電性連接該等電極部,另一端用於貼附該電性連接器之複數接電部,並電性連接該等接電部。 The purpose of the present invention is to provide a thermoelectrically separated LED package module comprising a metal substrate, an electrical connector, a light emitting diode ceramic package component, and an electrical connection plate; the metal substrate has a relative a surface and a second surface are made of a heat-dissipating metal material; the electrical connector is attached to the first surface of the metal substrate, the electrical connector has a plurality of electrical terminals at one end, and the electrical connector Opening a boring hole; the illuminating diode ceramic seal The component is disposed in the pupil of the electrical connector and is attached to the first surface of the metal substrate, the LED package component comprises a ceramic substrate, a circuit layer, and at least one LED chip and The light-transmitting package body and the like are formed; a plurality of conductive portions are formed on the surface of the electrical connection plate, and one end is used for attaching the plurality of electrode portions of the light-emitting diode ceramic package component, and is electrically connected to the electrode portions, and the other end is electrically connected The plurality of power receiving portions of the electrical connector are attached, and the power receiving portions are electrically connected.

本創作之另一目的在於,提供一種熱電分離的發光二極體封裝模組尚包括至少一鰭片,在電性連接器與金屬基板上穿孔,並藉由固定元件(例如螺絲)將電性連接器與金屬基板與鰭片彼此鎖固,以達到降低熱阻與增強模組強度的功能。 Another object of the present invention is to provide a thermoelectrically separated LED package module that includes at least one fin, is perforated in the electrical connector and the metal substrate, and is electrically connected by a fixing component (such as a screw). The connector and the metal substrate and the fins are locked to each other to achieve the function of reducing the thermal resistance and enhancing the strength of the module.

本創作之再一目的在於,提供一種熱電分離的發光二極體封裝模組尚包括複數排氣孔,於電性連接器鏤孔週圍開設有複數凹部,該陶瓷封裝元件安置於電性連接器之鏤孔內,並貼合於金屬基板第一表面形成排氣孔。 A further object of the present invention is to provide a thermoelectrically separated LED package module that further includes a plurality of vent holes, and a plurality of recesses are formed around the openings of the electrical connectors, and the ceramic package components are disposed on the electrical connectors. The vent hole is formed in the first hole of the metal substrate and is attached to the first surface of the metal substrate.

本創作之又一目的在於,提供一種使用於熱電分離的發光二極體封裝模組之發光二極體陶瓷封裝元件的電連接模組,包括電性連接器以及電性連接板,連接至外部電源的正極電端及負極電端。 Another object of the present invention is to provide an electrical connection module for a light-emitting diode package component of a light-emitting diode package module for thermoelectric separation, comprising an electrical connector and an electrical connection plate, connected to the outside The positive and negative terminals of the power supply.

本創作增益之功效(一)在於,所提供熱電分離的發光二極體封裝模組藉由結合一發光二極體陶瓷封裝元件與金屬基板,將散熱路徑與電路分離,且熱傳導路徑由發光二極體陶瓷封裝元件內發光二極體晶片至陶瓷基板,再利用錫膏導熱至金屬基板,以達到降低熱阻與增強模組強度的功能。 The effect of the creation gain (1) is that the provided thermoelectrically separated LED package module separates the heat dissipation path from the circuit by combining a light emitting diode ceramic package component and a metal substrate, and the heat conduction path is illuminated by two The polar ceramic package component emits the diode chip to the ceramic substrate, and then transfers the solder paste to the metal substrate to reduce the thermal resistance and enhance the strength of the module.

本創作增益之功效(二)在於,所提供熱電分離的發光二極體封裝模組藉由在金屬基板上複數第一穿孔與電性連接器對應位置複數第二穿孔,以固定元件(包括但不限於螺絲)通過每一相對之第一穿孔與第二穿孔,與位於金屬基板另一面至少一鰭片鎖固,而不會造成發光二極體陶瓷封裝元件破碎,且熱傳導路徑由發光二極體陶瓷封裝元件內發光二極體晶片至陶瓷基板,再利用錫膏導熱至金屬基板,再導熱在鳍片,以達到多重散熱的效果與增強模組強度的功能。 The effect of the creation gain (2) is that the provided thermoelectrically separated LED package module has a plurality of second perforations corresponding to the position of the first perforation and the electrical connector on the metal substrate to fix the component (including Not limited to the screw) through each of the opposite first and second perforations, and at least one fin on the other side of the metal substrate is locked, without causing the LED package component to be broken, and the heat conduction path is caused by the light-emitting diode The body ceramic package component emits the diode chip to the ceramic substrate, and then uses the solder paste to conduct heat to the metal substrate, and then conducts heat on the fin to achieve the effect of multiple heat dissipation and the strength of the module.

本創作增益之功效(三)在於,所提供熱電分離的發光二極體封裝模組藉由於電性連接器鏤孔週圍開設有複數凹部形成排氣孔,將製程中高溫處理該金屬基板上塗佈錫膏與電性連接器及陶瓷封裝元件結合產生氣泡排擠至該等排氣孔,降低氣泡對熱傳導的不良影響,可提昇熱傳導效果。 The effect of the creation gain (3) is that the provided thermoelectrically separated LED package module is formed by forming a plurality of recesses around the pupil of the electrical connector to form a vent hole, and coating the metal substrate on the high temperature process in the process. The paste paste is combined with the electrical connector and the ceramic package component to generate bubbles to be discharged into the vent holes, thereby reducing the adverse effect of the bubbles on the heat conduction and improving the heat conduction effect.

本創作增益之功效(四)在於,所提供使用於熱電分離的發光二極體封裝模組之發光二極體陶瓷封裝元件的電連接模組連接至外部電源,藉由電性連接器以及電性連接板,整個熱電分離的發光二極體封裝模組之發光二極體陶瓷封裝元件複數電極部電性連接至外部電源,不需要使用複數接合線銲接方式進行電性連接,以簡化熱電分離的發光二極體封裝模組之製程步驟及提升後續組裝與維修效率與便利性。 The effect of the creation gain (four) is that the electrical connection module of the light-emitting diode package component for the thermoelectric separation of the light-emitting diode package module is connected to an external power source, through an electrical connector and electricity The connecting plate, the plurality of electrodes of the light-emitting diode package component of the entire thermoelectrically separated LED package module are electrically connected to the external power source, and do not need to be electrically connected by using multiple bonding wires to simplify the thermoelectric separation. The process steps of the LED package module and improve the efficiency and convenience of subsequent assembly and maintenance.

本創作所採取的技術手段(一)為提供一種熱電分離的發光二極體封裝模組,包括一金屬基板、發光二極體陶瓷封裝元件、電性連接器及電性連接板等構成;該金屬基板(鋁質基板或銅質基板),具散熱特性且由金屬材料構成;該電性連接器,貼附於該金屬基板之第一表面上,該電 性連接器一端具複數接電部,且該電性連接器開設有一鏤孔;該發光二極體陶瓷封裝元件,設置於該電性連接器之鏤孔中,並貼合於該金屬基板上,該發光二極體陶瓷封裝元件主要包含一陶瓷基板、一線路層、至少一個發光二極體晶片以及一可透光封裝體,該陶瓷基板具有一線路層,該等發光二極體晶片安置於該線路層上,電性分別耦合於線路層,該線路層一端還設有複數電極部,可具有至少一正電極連接墊與至少一負電極連接墊,藉由不同線路控制不同的光型;以及該電性連接板,表面上形成複數導電部,利用塗佈於該表面錫膏,一端用於貼合該發光二極體陶瓷封裝元件複數電極部,另一端用於貼合該電性連接器之複數接電部,彼此電性連接。 The technical means adopted by the present invention (1) is to provide a thermoelectrically separated LED package module comprising a metal substrate, a light emitting diode ceramic package component, an electrical connector and an electrical connection board; a metal substrate (aluminum substrate or a copper substrate) having heat dissipation characteristics and composed of a metal material; the electrical connector being attached to the first surface of the metal substrate, the electricity The electrical connector has a plurality of electrical connection portions, and the electrical connector has a pupil; the LED package component is disposed in the pupil of the electrical connector and is attached to the metal substrate The LED package component mainly includes a ceramic substrate, a circuit layer, at least one LED chip, and a light transmissive package. The ceramic substrate has a circuit layer, and the LED array is disposed. The circuit layer is electrically coupled to the circuit layer, and the circuit layer is further provided with a plurality of electrode portions at one end thereof, and may have at least one positive electrode connection pad and at least one negative electrode connection pad, and different light patterns are controlled by different lines. And the electrical connecting plate, a plurality of conductive portions are formed on the surface, and the solder paste is applied to the surface, one end is used for bonding the plurality of electrode portions of the light emitting diode ceramic package component, and the other end is used for bonding the electrical property. The plurality of electrical connectors of the connector are electrically connected to each other.

本創作所採取的技術手段(二)為提供一種熱電分離的發光二極體封裝模組,包括一金屬基板、發光二極體陶瓷封裝元件、電性連接器及電性連接板等構成;該金屬基板,具散熱特性且由金屬材料構成;該電性連接器,貼附於該金屬基板之第一表面上,該電性連接器一端具複數接電部,且該電性連接器開設有一鏤孔,於該鏤孔週圍開設有複數凹部;該發光二極體陶瓷封裝元件,設置於該電性連接器之鏤孔中,並貼合於該金屬基板上,形成排氣孔,該發光二極體陶瓷封裝元件主要包含一陶瓷基板、一線路層、至少一個發光二極體晶片以及一可透光封裝體,該陶瓷基板具有一線路層,該發光二極體晶片安置於該線路層上,電性分別耦合於線路層,該線路層一端還設有複數電極部,具有至少一正電極連接墊與至少一負電極連接墊;以及該電性連接板,表面上形成複數導電部,利用塗佈於該表面錫膏,一端用於貼合該發光二極體陶瓷封裝元件複數電極部,另一端用於貼合該電性連接器之複數接電部,彼此電性連接。 The technical means adopted by the present invention (2) is to provide a thermoelectric separation LED package module, comprising a metal substrate, a light-emitting diode ceramic package component, an electrical connector and an electrical connection board; The metal substrate has a heat dissipation characteristic and is made of a metal material; the electrical connector is attached to the first surface of the metal substrate, the electrical connector has a plurality of electrical connection portions at one end, and the electrical connector has a a plurality of recesses are formed around the pupil; the LED package component is disposed in the pupil of the electrical connector and is attached to the metal substrate to form a vent hole. The diode ceramic package component mainly comprises a ceramic substrate, a circuit layer, at least one light emitting diode chip and a light transmissive package, the ceramic substrate has a circuit layer, and the light emitting diode chip is disposed on the circuit layer The electrical layer is respectively coupled to the circuit layer, and the circuit layer is further provided with a plurality of electrode portions at one end thereof, and has at least one positive electrode connection pad and at least one negative electrode connection pad; and the electrical connection plate, the surface Forming a plurality of conductive portions, one end of which is applied to the surface solder paste, one end for bonding the plurality of electrode portions of the light-emitting diode package component, and the other end for bonding the plurality of power-on portions of the electrical connector, and electrically connecting each other Sexual connection.

本創作所採取的技術手段(三)為提供一種熱電分離的發光二極體封裝模組,包括一金屬基板、發光二極體陶瓷封裝元件、電性連接器、電性連接板、鰭片及固定元件等構成;該金屬基板,具散熱特性且由金屬材料構成;該電性連接器,貼附於該金屬基板之第一表面上,該電性連接器一端具複數接電部,且該電性連接器開設有一鏤孔;該發光二極體陶瓷封裝元件,設置於該電性連接器之鏤孔中,並貼合於該金屬基板上,該發光二極體陶瓷封裝元件主要包含一陶瓷基板、一線路層、至少一個發光二極體晶片以及一可透光封裝體;該電性連接器複數接電部與該電性連接板複數導電部電性連接,另利用該金屬基板具有複數第一穿孔與電性連接器具有複數第二穿孔相對應重疊形成通道,以固定元件穿透該通道,與貼附於該金屬基板第二表面之至少一鳍片鎖附固定,其中該等第二穿孔孔徑大於或等於該等第一穿孔孔徑,使固定元件埋入或貼附於該電性連接器表面。 The technical means adopted by the creation (3) is to provide a thermoelectrically separated LED package module, comprising a metal substrate, a light-emitting diode ceramic package component, an electrical connector, an electrical connection plate, a fin and The metal substrate has a heat dissipation characteristic and is made of a metal material; the electrical connector is attached to the first surface of the metal substrate, and the electrical connector has a plurality of power receiving portions at one end, and the electrical connector The electrical connector has a boring hole; the illuminating diode package component is disposed in the boring of the electrical connector and is attached to the metal substrate, and the illuminating diode package component mainly comprises a a ceramic substrate, a circuit layer, at least one light emitting diode chip, and a light transmissive package; the plurality of electrical connectors of the electrical connector are electrically connected to the plurality of conductive portions of the electrical connection plate, and the metal substrate has The plurality of first through holes and the electrical connector have a plurality of second through holes correspondingly overlapping to form a channel, wherein the fixing component penetrates the channel and is attached to at least one of the fins attached to the second surface of the metal substrate Set, wherein such second perforation diameter equal to or greater than those of the first aperture of the hole, the fixing element is embedded in or attached to the surface of the electrical connector.

本創作所採取的技術手段(四)為提供一種熱電分離的發光二極體封裝模組,包括一金屬基板、發光二極體陶瓷封裝元件、電性連接器及電性連接板等構成;該金屬基板另一面延伸出至少一鳍片係一體成形,具散熱特性且由金屬材料構成;該電性連接器,貼附於該金屬基板之第一表面上,該電性連接器一端具複數接電部,且該電性連接器開設有一鏤孔;該發光二極體陶瓷封裝元件,設置於該電性連接器之鏤孔中,包括但不限於上錫膏作回焊貼合於該金屬基板上,該發光二極體陶瓷封裝元件主要包含一陶瓷基板、一線路層、至少一個發光二極體晶片以及一可透光封裝體;該電性連接器複數接電部與該電性連接板複數導電部電性連接。 The technical means adopted by the present invention (4) is to provide a thermoelectric separation LED package module, comprising a metal substrate, a light-emitting diode ceramic package component, an electrical connector and an electrical connection board; The other surface of the metal substrate extends at least one fin integrally formed with heat dissipation characteristics and is made of a metal material; the electrical connector is attached to the first surface of the metal substrate, and the electrical connector has a plurality of ends The electrical connector has a boring hole; the illuminating diode ceramic package component is disposed in the boring of the electrical connector, including but not limited to the solder paste for reflow bonding to the metal On the substrate, the LED package component mainly includes a ceramic substrate, a circuit layer, at least one LED chip, and a light transmissive package; the electrical connector is electrically connected to the plurality of electrical components. The plurality of conductive portions of the board are electrically connected.

本創作所採取的技術手段(五)為提供一種使用於熱電分離的發光二極體封裝模組之發光二極體陶瓷封裝元件的電連接模組,包括電性連接器以及電性連接板;該電性連接器一端具複數接電部,電性連接至外部電源的正極電端及負極電端;該電性連接板,其表面上形成複數導電部,一端貼附該熱電分離的發光二極體封裝模組之發光二極體陶瓷封裝元件之複數電極部作電性連接,另一端用於貼附該電性連接器之複數接電部作電性連接。 The technical means adopted by the present invention (5) is to provide an electrical connection module for a light-emitting diode package component of a light-emitting diode package module for thermoelectric separation, comprising an electrical connector and an electrical connection plate; The electrical connector has a plurality of electrical connecting portions at one end thereof, and is electrically connected to the positive electrical terminal and the negative electrical terminal of the external power source; the electrical connecting plate has a plurality of conductive portions formed on the surface thereof, and the one end is attached with the thermoelectrically separated light emitting diode The plurality of electrode portions of the LED package component of the polar package module are electrically connected, and the other end is used for electrically connecting the plurality of electrical connectors of the electrical connector.

為便 貴審查委員能對本創作目的、技術特徵及其功效,做更進一步之認識與瞭解,茲舉實施例配合圖式,詳細說明如下: For the sake of your review, you can make a further understanding and understanding of the purpose, technical features and efficacy of this creation. The examples are shown in the following diagram:

10,10a,10b,10c‧‧‧熱電分離的發光二極體封裝模組 10,10a,10b,10c‧‧‧Thermal separation LED module

20‧‧‧電連接模組 20‧‧‧Electrical connection module

100‧‧‧鰭片 100‧‧‧Fins

110‧‧‧第四穿孔 110‧‧‧fourth perforation

200‧‧‧金屬基板 200‧‧‧Metal substrate

210‧‧‧第一表面 210‧‧‧ first surface

220‧‧‧第二表面 220‧‧‧ second surface

230‧‧‧第一穿孔 230‧‧‧First perforation

300‧‧‧電性連接器 300‧‧‧Electrical connector

310,320‧‧‧接電部 310,320‧‧‧Power Department

330‧‧‧鏤空 330‧‧‧镂空

340‧‧‧第二穿孔 340‧‧‧Second perforation

350‧‧‧凹部 350‧‧‧ recess

360‧‧‧定位槽 360‧‧‧ positioning slot

370‧‧‧第三穿孔 370‧‧‧ third perforation

400‧‧‧發光二極體陶瓷封裝元件 400‧‧‧Light Emitting Diode Ceramic Packaging Components

410‧‧‧陶瓷基板 410‧‧‧ceramic substrate

420‧‧‧線路層 420‧‧‧Line layer

421,422‧‧‧電極部 421,422‧‧‧Electrode

423‧‧‧防護元件 423‧‧‧ protective elements

430‧‧‧發光二極體晶片 430‧‧‧Light Emitter Wafer

440‧‧‧可透光封裝體 440‧‧‧Light permeable package

441‧‧‧封裝膠體 441‧‧‧Package colloid

442‧‧‧螢光體 442‧‧‧Fluorite

443‧‧‧透鏡 443‧‧‧ lens

500‧‧‧電性連接板 500‧‧‧Electrical connecting plate

510,520‧‧‧導電部 510,520‧‧‧Electrical Department

600‧‧‧固定元件 600‧‧‧Fixed components

700‧‧‧外部電源 700‧‧‧External power supply

圖1係本創作較佳實施例熱電分離的發光二極體封裝模組之立體示意圖。 1 is a perspective view of a light-emitting diode package module of the preferred embodiment of the present invention.

圖2係本創作較佳實施例熱電分離的發光二極體封裝模組之部份立體分解圖。 FIG. 2 is a partially exploded perspective view of the thermoelectrically separated LED package of the preferred embodiment of the present invention.

圖3係本創作較佳實施例熱電分離的發光二極體封裝模組之發光二極體陶瓷封裝元件部份剖面圖。 3 is a partial cross-sectional view of a light-emitting diode package component of the thermoelectrically separated LED package of the preferred embodiment of the present invention.

圖4A係本創作第二實施例熱電分離的發光二極體封裝模組之立體示意圖。 4A is a perspective view of a thermoelectrically separated LED package of the second embodiment of the present invention.

圖4B係本創作第二實施例熱電分離的發光二極體封裝模組之另一立體示意圖。 4B is another perspective view of the thermoelectrically separated LED package of the second embodiment of the present invention.

圖5係本創作第三實施例熱電分離的發光二極體封裝模組之立體示意 圖。 FIG. 5 is a perspective view of a light-emitting diode package module of the third embodiment of the present invention. Figure.

圖6係本創作第三實施例熱電分離的發光二極體封裝模組之部份立體分解圖。 FIG. 6 is a partially exploded perspective view of the thermoelectrically separated LED package of the third embodiment of the present invention.

圖7係本創作第四實施例熱電分離的發光二極體封裝模組之立體示意圖。 FIG. 7 is a schematic perspective view of a thermoelectrically separated LED package module according to a fourth embodiment of the present invention.

圖8係本創作第四實施例熱電分離的發光二極體封裝模組之部份立體分解圖。 FIG. 8 is a partially exploded perspective view of the thermoelectrically separated LED package of the fourth embodiment of the present invention.

圖9係本創作第五實施例使用於熱電分離的發光二極體封裝模組之發光二極體陶瓷封裝元件的電連接模組之立體分解圖。 FIG. 9 is an exploded perspective view showing the electrical connection module of the light-emitting diode package component of the light-emitting diode package module of the fifth embodiment of the present invention.

為能進一步瞭解本創作之特徵、技術手段以及所達成之具體功能、目的,茲列舉較具體之實施例,繼以圖式圖號詳細說明如後。 In order to further understand the features, technical means, and specific functions and purposes of the present invention, more specific embodiments are listed, followed by a detailed description of the drawings.

請參考圖1以及圖2所示,在較佳實施例中,本創作之熱電分離的發光二極體封裝模組10包括金屬基板200、電性連接器300、發光二極體陶瓷封裝元件400及電性連接板500等構成;金屬基板200具散熱特性且由金屬材料構成,發光二極體陶瓷封裝元件400設置於電性連接器300之鏤孔330中,並貼合於該金屬基板200之第一表面210上,發光二極體陶瓷封裝元件400主要包含陶瓷基板410、線路層420、至少一個發光二極體晶片430以及可透光封裝體440等構成(如圖3所示),其中陶瓷基板410具有線路層420,至少一個發光二極體晶片430安置於該陶瓷基板410上,電性分別耦合於線路層420,線路層420具有防護元件423,一端還設有複數電極部421,422,分別具有正電極連接墊與負電極連接墊,電性連接器300具有複數接電部 310,320,以及電性連接板500,一面具有複數導電部510,520,利用塗佈於該電性連接板500表面錫膏一端用於貼附發光二極體陶瓷封裝元件400之複數電極部421,422,另一端用於貼附電性連接器300複數接電部310,320,彼此電性連接,以簡化製程步驟,而不需以銲接方式將該發光二極體陶瓷封裝元件400複數電極部421,422之正電極連接墊與負電極連接墊與外部電源(圖未示)電性連接複雜製程,發光二極體陶瓷封裝元件400利用塗佈於金屬基板200第一表面210錫膏,貼合於金屬基板200第一表面210上,藉以將發光二極體陶瓷封裝元件400的熱散逸出來,該金屬基板200能夠輔助散熱。 Referring to FIG. 1 and FIG. 2 , in the preferred embodiment, the thermoelectrically separated LED package module 10 of the present invention comprises a metal substrate 200 , an electrical connector 300 , and a light emitting diode package component 400 . And the electrical connection plate 500 and the like; the metal substrate 200 has heat dissipation characteristics and is made of a metal material, and the LED package element 400 is disposed in the bore 330 of the electrical connector 300 and bonded to the metal substrate 200 On the first surface 210, the LED package component 400 mainly includes a ceramic substrate 410, a circuit layer 420, at least one LED chip 430, and a light-permeable package 440 (shown in FIG. 3). The ceramic substrate 410 has a circuit layer 420. The at least one LED substrate 430 is disposed on the ceramic substrate 410. The circuit layer 420 is electrically coupled to the circuit layer 420. The circuit layer 420 has a shielding element 423, and a plurality of electrode portions 421 and 422 are disposed at one end. Each has a positive electrode connection pad and a negative electrode connection pad, and the electrical connector 300 has a plurality of power connection parts. 310, 320, and the electrical connection plate 500, having a plurality of conductive portions 510, 520 on one surface, and a plurality of electrode portions 421, 422 for attaching the light-emitting diode ceramic package component 400 to the other end of the surface of the electrical connection plate 500. The plurality of electrical connection portions 310, 320 for attaching the electrical connector 300 are electrically connected to each other to simplify the process step, and the positive electrode connection pads of the plurality of electrode portions 421, 422 of the light emitting diode ceramic package component 400 need not be soldered. The negative electrode connection pad and the external power source (not shown) are electrically connected to the complicated process, and the LED package 400 is coated on the first surface 210 of the metal substrate 200 to adhere to the first surface of the metal substrate 200. 210, whereby the heat of the light-emitting diode ceramic package component 400 is dissipated, and the metal substrate 200 can assist heat dissipation.

進一步說明較佳實施例如后,金屬基板200具散熱特性且由金屬材料材質組成,金屬材料材質可選自銅、銅合金、鋁、鋁合金、鎂合金、鋁矽碳化物以及碳合成物其中之一者。再者,陶瓷基板,具有電性絕緣及散熱之特性且由陶瓷材質組成,陶瓷材質可選自氧化鋁、氮化鋁、氧化鋯、碳化矽、六方氮化硼以及氟化鈣其中之一者。再者,發光二極體晶片430適用於垂直結構的發光二極體晶片及/或水平結構的發光二極體晶片。再者,發光二極體陶瓷封裝元件400內封裝膠體441具高透光性及電性絕緣,可由包括矽膠或環氧樹脂的材料構成,螢光體442可選自螢光膠或螢光膠片,可透光封裝體440形成但是不限於封裝膠體441包覆螢光體442,可透光封裝體440形成亦可為螢光體442包覆封裝膠體441,另可透光封裝體440形成可為螢光體442(例如螢光粉)與封裝膠體441(例如矽膠或環氧樹脂)混合,可透光封裝體440進一步亦可包括透鏡443。再者,電性連接器300及電性連接板500材質包括但不限於FR4。 Further, for example, after the preferred embodiment, the metal substrate 200 has heat dissipation characteristics and is composed of a metal material, and the metal material may be selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy, magnesium alloy, aluminum lanthanum carbide, and carbon composite. One. Furthermore, the ceramic substrate has the characteristics of electrical insulation and heat dissipation and is composed of a ceramic material selected from the group consisting of alumina, aluminum nitride, zirconium oxide, tantalum carbide, hexagonal boron nitride and calcium fluoride. . Furthermore, the light-emitting diode wafer 430 is suitable for a light-emitting diode wafer of a vertical structure and/or a light-emitting diode wafer of a horizontal structure. Furthermore, the encapsulant colloid 441 in the LED package 400 has high light transmittance and electrical insulation, and may be composed of a material including silicone or epoxy. The phosphor 442 may be selected from fluorescent glue or fluorescent film. The opaque package 440 is formed, but not limited to, the encapsulant 441 is coated with the phosphor 442. The opaque package 440 is formed to cover the encapsulant 441 for the phosphor 442, and the transparent package 440 is formed. The opaque package 440 may further include a lens 443 for mixing the phosphor 442 (eg, phosphor) with the encapsulant 441 (eg, silicone or epoxy). Furthermore, the electrical connector 300 and the electrical connection plate 500 materials include, but are not limited to, FR4.

請參閱圖4A及圖4B所示,在第二實施例中,本創作之熱電 分離的發光二極體封裝模組10a與較佳實施例者大致相同,兩者之差異處僅在於:金屬基板200更包含至少一鰭片100(如圖4A所示),藉由壓鑄、鋁擠或沖壓形成,該至少一鰭片貼附於該金屬基板之第二表面220;或該金屬基板自另一面向外延伸至少一鳍片係一體成形,該發光二極體陶瓷封裝元件藉由包括但不限於上錫膏作回焊貼合於該金屬基板上(如圖4B所示)。 Referring to FIG. 4A and FIG. 4B, in the second embodiment, the thermoelectricity of the present creation The separated LED package module 10a is substantially the same as the preferred embodiment. The difference between the two is that the metal substrate 200 further includes at least one fin 100 (as shown in FIG. 4A), which is die-cast, aluminum. Formed by extrusion or stamping, the at least one fin is attached to the second surface 220 of the metal substrate; or the metal substrate is integrally formed by extending at least one fin from the other surface, the LED package component is obtained by This includes, but is not limited to, a solder paste applied to the metal substrate (as shown in FIG. 4B).

請參閱圖5以及圖6所示,在第三實施例中,本創作之熱電分離的發光二極體封裝模組10b與較佳實施例者大致相同,兩者之差異處僅在於:金屬基板200具有複數第一穿孔230,電性連接器300具有複數第二穿孔340,至少一鳍片100具有複數第四穿孔110,彼此相對應重疊形成通道,以固定元件600(包括但不限於螺絲)穿透該通道,與貼附於金屬基板200第二表面220之至少一鳍片100鎖附固定,其中該等第二穿孔340孔徑大於或等於該等第一穿孔230孔徑,使固定元件600埋入或貼附於電性連接器300表面,而不會造成發光二極體陶瓷封裝元件400破碎,且熱傳導路徑由發光二極體陶瓷封裝元件400內發光二極體晶片430至陶瓷基板410,再利用錫膏導熱至金屬基板200,再導熱在鳍片100,以達到降低熱阻與增強模組強度的功能。 Referring to FIG. 5 and FIG. 6 , in the third embodiment, the thermoelectrically separated LED package module 10 b of the present invention is substantially the same as the preferred embodiment, and the difference is only in the metal substrate. 200 has a plurality of first through holes 230, the electrical connector 300 has a plurality of second through holes 340, and at least one of the fins 100 has a plurality of fourth through holes 110, which are overlapped with each other to form a passage for fixing the component 600 (including but not limited to screws) Passing through the channel, the at least one fin 100 attached to the second surface 220 of the metal substrate 200 is locked and fixed. The aperture of the second through hole 340 is greater than or equal to the aperture of the first through hole 230, so that the fixing component 600 is buried. In or attached to the surface of the electrical connector 300 without causing the light-emitting diode package component 400 to be broken, and the heat conduction path is from the light-emitting diode package 430 to the ceramic substrate 410 in the light-emitting diode package component 400. The solder paste is further thermally conductive to the metal substrate 200, and then thermally conductive on the fin 100 to achieve the function of reducing the thermal resistance and enhancing the strength of the module.

請參閱圖7以及圖8所示,在第四實施例中,本創作之熱電分離的發光二極體封裝模組10c與較佳實施例者大致相同,兩者之差異處僅在於:電性連接器300鏤孔330週圍開設有複數凹部350,發光二極體陶瓷封裝元件400安置於電性連接器300之鏤孔330內,並貼合於金屬基板200第一表面210形成排氣孔,將製程中高溫處理金屬基板200上塗佈之錫膏,因金屬基板200與電性連接器300及發光二極體陶瓷封裝元件400緊密貼合產生氣泡排擠至該等排氣孔,降低氣泡對熱傳導的不良影響,相對可提昇熱傳導 效果。 Referring to FIG. 7 and FIG. 8 , in the fourth embodiment, the thermoelectrically separated LED package module 10 c of the present invention is substantially the same as the preferred embodiment, and the difference between the two is only: electrical A plurality of recesses 350 are formed around the opening of the connector 300. The LED package 400 is disposed in the bore 330 of the electrical connector 300 and is attached to the first surface 210 of the metal substrate 200 to form a vent. The solder paste coated on the high-temperature treated metal substrate 200 in the process is closely adhered to the metal substrate 200 and the electrical connector 300 and the light-emitting diode ceramic package component 400 to generate a bubble discharge to the vent holes to reduce the bubble pair. The adverse effects of heat conduction can increase heat transfer effect.

請參考圖9所示,在第五實施例中,本創作之電連接模組20包括電性連接器300及電性連接板500等構成;電性連接器300一端具複數接電部310,320,電性連接外部電源700,電性連接板500其表面上形成複數導電部510,520,一端貼附前述發光二極體封裝模組10發光二極體陶瓷封裝元件400之複數電極區421,422作電性連接,藉以導通發光二極體晶片430,而得以發射照射光線,另一端用於貼附電性連接器300之複數接電部310,320作電性連接,具有方便熱電分離的發光二極體封裝模組10的裝卸維修與簡化製程;值得一提的是,電性連接器300兩側可具有複數定位槽360,該等定位槽360凹設在電性連接器300兩側,並與該外部電源700之卡扣槽(圖未示)配合卡扣銜接,另電性連接器300亦可包含至少一第三穿孔370,該至少一第三穿孔370設置於電性連接器300面上,並與外部電源700相對之插腳(圖未示)配合固持,藉由電連接模組20可多重有效與外部電源700固定,不受外力環境振動影響;電性連接器300及電性連接板500材質包括但不限於FR4。 Referring to FIG. 9 , in the fifth embodiment, the electrical connection module 20 of the present invention comprises an electrical connector 300 and an electrical connection board 500 , and the electrical connector 300 has a plurality of electrical terminals 310 , 320 at one end. The electrical connection board is electrically connected to the external power supply 700. The electrical connection board 500 has a plurality of conductive portions 510 and 520 formed on the surface thereof, and the plurality of electrode regions 421 and 422 of the light-emitting diode package component 400 of the light-emitting diode package module 10 are electrically connected at one end. The light-emitting diode package 430 is turned on to emit the illumination light, and the other end is used for attaching the plurality of power connection portions 310 and 320 of the electrical connector 300 for electrical connection, and the light-emitting diode package module is convenient for thermoelectric separation. The loading and unloading maintenance and simplification of the process of 10; it is worth mentioning that the two sides of the electrical connector 300 can have a plurality of positioning slots 360, the positioning slots 360 are recessed on both sides of the electrical connector 300, and the external power supply 700 The latching slot (not shown) is engaged with the buckle, and the electrical connector 300 can also include at least one third through hole 370 disposed on the surface of the electrical connector 300 and externally. Power supply 700 is opposite to the pin ( Not shown) with the holding, by electrically connecting multiple modules 20 can be fixed to an external power source 700 efficiently, affected by vibrations external environment; electrical connector 300 and electrical material web 500 include but are not limited to FR4.

綜上所述,本創作之熱電分離的發光二極體封裝模組,藉由發光二極體陶瓷封裝元件貼合設置金屬基板上,以達到降低熱阻的效果;利用固定元件穿過電性連接器及金屬基板與鰭片鎖固,達到多重散熱的效果;並且藉由電連接器模組達到簡化製程步驟。 In summary, the thermoelectrically separated LED package module of the present invention is disposed on the metal substrate by the LED package component to reduce the thermal resistance; the electrical component is passed through the fixing component. The connector and the metal substrate are locked with the fins to achieve multiple heat dissipation effects; and the electrical connector module is used to achieve a simplified process step.

本創作實已符合新型專利之要件,依法提出申請。雖然本創作已用較佳實施例揭露如上,然其並非用以限定本案的權利範圍,本創作所屬技術領域中具有通常知識者,在不脫離本創作之精神和範圍內,當可作各種之更動與潤飾,因此本創作之保護範圍當視後附之申請專利範圍所 界定者為準。 This creation has already met the requirements of the new patent and applied in accordance with the law. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the scope of the present invention. Those skilled in the art to which the present invention pertains can be used in various ways without departing from the spirit and scope of the present invention. Change and retouch, so the scope of protection of this creation should be attached to the scope of the patent application The definition is subject to change.

10‧‧‧熱電分離的發光二極體封裝模組 10‧‧‧Thermal separation LED module

200‧‧‧金屬基板 200‧‧‧Metal substrate

300‧‧‧電性連接器 300‧‧‧Electrical connector

310,320‧‧‧接電部 310,320‧‧‧Power Department

400‧‧‧發光二極體陶瓷封裝元件 400‧‧‧Light Emitting Diode Ceramic Packaging Components

500‧‧‧電性連接板 500‧‧‧Electrical connecting plate

Claims (16)

一種熱電分離的發光二極體封裝模組,包含:一金屬基板,具有相對之一第一表面及一第二表面,係為散熱特性金屬材料構成;一電性連接器,貼附於該金屬基板之該第一表面上,該電性連接器一端具複數接電部,且該電性連接器開設有一鏤孔;一發光二極體陶瓷封裝元件,用於發射光線,設置於該電性連接器之該鏤孔中,並貼合於該金屬基板之該第一表面上,該發光二極體陶瓷封裝元件包含:一陶瓷基板,具電氣絕緣特性且由陶瓷材料構成;一線路層,形成於該陶瓷基板之表面上,該線路層一端還設有複數電極部;至少一發光二極體晶片,固接於該陶瓷基板之表面上,並電性連接該線路層;及一可透光封裝體,形成於該陶瓷基板之表面上,並封裝該發光二極體晶片;以及一電性連接板,其表面上形成複數導電部,一端用於貼附該發光二極體陶瓷封裝元件之該線路層,並電性連接該線路層之該等電極部,另一端用於貼附該電性連接器之該等接電部,並電性連接該等接電部。 A thermoelectrically separated LED package module comprising: a metal substrate having a first surface and a second surface opposite to each other, wherein the heat dissipation characteristic is made of a metal material; and an electrical connector attached to the metal On the first surface of the substrate, the electrical connector has a plurality of electrical connection portions at one end, and the electrical connector has a pupil; a light-emitting diode ceramic package component for emitting light and being disposed on the electrical component The pedestal of the connector is attached to the first surface of the metal substrate, and the illuminating diode package comprises: a ceramic substrate having electrical insulation properties and composed of a ceramic material; Forming on the surface of the ceramic substrate, the circuit layer is further provided with a plurality of electrode portions at one end; at least one light-emitting diode wafer is fixed on the surface of the ceramic substrate, and electrically connected to the circuit layer; a light package body formed on a surface of the ceramic substrate and encapsulating the light emitting diode chip; and an electrical connection plate having a plurality of conductive portions formed on the surface and one end for attaching the light emitting diode ceramic Means of the circuit element layer, and electrically connected to those portions of the electrode wiring layers, such that the other end for attaching the connector electrically connected to the electrical portion, and electrically connected to such electrical connection portion. 如申請專利範圍第1項所述之熱電分離的發光二極體封裝模組,更包含至少一鰭片,藉由壓鑄、鋁擠或沖壓形成,該至少一鰭片貼附 於該金屬基板之第二表面。 The thermoelectrically separated LED package module of claim 1, further comprising at least one fin formed by die casting, aluminum extrusion or stamping, the at least one fin attached And a second surface of the metal substrate. 如申請專利範圍第1項所述之熱電分離的發光二極體封裝模組,其中該金屬基板自另一面向外延伸至少一鳍片係一體成形。 The thermoelectrically separated light-emitting diode package module of claim 1, wherein the metal substrate is integrally formed by extending at least one fin from the other surface. 如申請專利範圍第2項所述之熱電分離的發光二極體封裝模組,其中該金屬基板進一步包含有複數第一穿孔,該等第一穿孔在該金屬基板面上設置,藉由複數固定元件與該至少一鰭片鎖固。 The method of claim 2, wherein the metal substrate further comprises a plurality of first through holes, the first through holes are disposed on the surface of the metal substrate, and are fixed by a plurality of The component is locked to the at least one fin. 如申請專利範圍第4項所述之熱電分離的發光二極體封裝模組,其中該電性連接器進一步包含有複數第二穿孔,該等第二穿孔在該電性連接器面上設置,藉由該等固定元件通過相對之第一穿孔、第二穿孔與該至少一鰭片組態固定,而該等第二穿孔孔徑大於或等於該等第一穿孔孔徑。 The galvanic diode package module of claim 4, wherein the electrical connector further comprises a plurality of second through holes, the second holes are disposed on the surface of the electrical connector, The second perforating apertures are greater than or equal to the first perforation apertures by the fixing elements being fixed relative to the at least one fin by opposing the first perforations and the second perforations. 如申請專利範圍第5項所述之熱電分離的發光二極體封裝模組,其中該固定元件係為螺絲。 The thermoelectrically separated LED package module according to claim 5, wherein the fixing component is a screw. 如申請專利範圍第1項所述之熱電分離的發光二極體封裝模組,其中該電性連接器進一步包含至少一凹部,該至少一凹部係圍繞設置於該鏤孔之周緣。 The thermoelectrically separated LED package module of claim 1, wherein the electrical connector further comprises at least one recess, the at least one recess being disposed around the periphery of the bore. 如申請專利範圍第1項所述之熱電分離的發光二極體封裝模組,其中該電性連接器進一步包含複數定位槽,該等定位槽凹設在該接電部兩側。 The illuminating diode assembly module of the pyroelectric separation method of claim 1, wherein the electrical connector further comprises a plurality of positioning slots, wherein the positioning slots are recessed on both sides of the power receiving portion. 如申請專利範圍第8項所述之熱電分離的發光二極體封裝模組,其中該電性連接器進一步包含至少一第三穿孔,該至少一第三穿孔設置在該電性連接器面上。 The galvanic diode package module of claim 2, wherein the electrical connector further comprises at least one third through hole, the at least one third through hole being disposed on the electrical connector surface . 如申請專利範圍第1項所述之熱電分離的發光二極體封裝模組,其中該可透光封裝體包含一封裝膠體及一形成於該封裝膠體表面上之螢光體。 The galvanic diode package module of claim 1, wherein the permeable package comprises an encapsulant and a phosphor formed on the surface of the encapsulant. 如申請專利範圍第1項所述之熱電分離的發光二極體封裝模組,其中該可透光封裝體包含一塗佈於該發光二極體晶片表面上之螢光體及一包覆住該螢光體之封裝膠體。 The illuminating diode assembly module of the thermoelectrically separated package of claim 1, wherein the permeable package comprises a phosphor coated on the surface of the illuminating diode chip and covered with a phosphor The encapsulant colloid of the phosphor. 如申請專利範圍第1項所述之熱電分離的發光二極體封裝模組,其中該可透光封裝體為螢光體與封裝膠體混合成形。 The thermoelectrically separated LED package module according to claim 1, wherein the permeable package is formed by mixing a phosphor and an encapsulant. 如申請專利範圍第10項至第12項中任一項所述之熱電分離的發光二極體封裝模組,其中該可透光封裝體更包括一透鏡。 The thermoelectrically separated light emitting diode package module according to any one of claims 10 to 12, wherein the light permeable package further comprises a lens. 一種電連接模組,用於一熱電分離的發光二極體封裝模組之發光二極體陶瓷封裝元件電性連接一外部電源,包括:一電性連接器,一端具複數接電部,電性連接該外部電源;以及一電性連接板,其表面上形成複數導電部,一端貼附該發光二極體封裝模組作電性連接,另一端用於貼附該電性連接器之該等接電部作電性連接。 An electrical connection module is used for electrically connecting an external power source of a light-emitting diode package component of a thermoelectrically separated LED package module, comprising: an electrical connector having a plurality of electrical connections at one end, and electricity The external power source is connected to the external power source; and an electrical connecting plate is formed with a plurality of conductive portions on the surface, the light emitting diode package module is electrically connected at one end, and the other end is used for attaching the electrical connector The power supply unit is electrically connected. 如申請專利範圍第14項所述之電連接模組,其中該電性連接器進一步包含複數定位槽,該等定位槽凹設在該接電部一端兩側,並與該外部電源配合卡扣。 The electrical connection module of claim 14, wherein the electrical connector further comprises a plurality of positioning slots, the positioning slots are recessed on opposite sides of the power receiving portion, and are engaged with the external power supply. . 如申請專利範圍第14項所述之電連接模組,其中該電性連接器進一步包含至少一第三穿孔,該等第三穿孔在接電部一面上設置,並與該外部電源配合固持。 The electrical connector module of claim 14, wherein the electrical connector further comprises at least one third through hole disposed on one side of the power receiving portion and coupled to the external power source.
TW103211644U 2014-06-30 2014-06-30 Light emitting diode module package structure having thermal-electric separated function and electrical connection module TWM498387U (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
TW103211644U TWM498387U (en) 2014-06-30 2014-06-30 Light emitting diode module package structure having thermal-electric separated function and electrical connection module
CN201520173230.8U CN204717541U (en) 2014-06-30 2015-03-26 LED head lamp for vehicle
CN201510134560.0A CN105202437B (en) 2014-06-30 2015-03-26 Vehicle light-emitting diode head lamp and light-emitting diode packaging module
CN201520516824.4U CN204885155U (en) 2014-06-30 2015-03-26 Light emitting diode packaging module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103211644U TWM498387U (en) 2014-06-30 2014-06-30 Light emitting diode module package structure having thermal-electric separated function and electrical connection module

Publications (1)

Publication Number Publication Date
TWM498387U true TWM498387U (en) 2015-04-01

Family

ID=53440208

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103211644U TWM498387U (en) 2014-06-30 2014-06-30 Light emitting diode module package structure having thermal-electric separated function and electrical connection module

Country Status (2)

Country Link
CN (3) CN105202437B (en)
TW (1) TWM498387U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601906B (en) * 2016-10-26 2017-10-11 LED fixtures
US10066800B1 (en) 2017-09-21 2018-09-04 Keeper Technology Co., Ltd. Light-emitting diode fixing apparatus
US10260696B2 (en) 2016-12-22 2019-04-16 Keeper Technology Co., Ltd. Light-emitting diode module holder

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM498387U (en) * 2014-06-30 2015-04-01 Ligitek Electronics Co Ltd Light emitting diode module package structure having thermal-electric separated function and electrical connection module
FR3056685B1 (en) * 2016-09-28 2021-01-15 Valeo Vision MONOBLOC BRACKET FOR LUMINOUS DEVICES WITH MICRO-MIRRORS MATRIX
US20230167831A1 (en) * 2017-03-28 2023-06-01 Faizan Ahmed Thermo-electric chiller/heater component methods and systems
CN107316933A (en) * 2017-07-18 2017-11-03 中山市圣上光电科技有限公司 The special LED high beams of high ferro
KR102036749B1 (en) * 2017-12-14 2019-10-28 에스엘 주식회사 Lamp for vehicle
CN109027958A (en) * 2018-07-04 2018-12-18 河海大学常州校区 A kind of radiator for matrix LED car light

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08167301A (en) * 1994-12-12 1996-06-25 Nippondenso Co Ltd Headlamp for vehicle
JP2008016362A (en) * 2006-07-07 2008-01-24 Koito Mfg Co Ltd Light-emitting module and vehicular lighting fixture
CN101298906B (en) * 2007-11-30 2010-09-08 上海小糸车灯有限公司 Automobile front shining lamp based on double-convex lens
DE102010029176A1 (en) * 2009-10-05 2012-12-27 Automotive Lighting Reutlingen Gmbh Motor vehicle headlight with a semiconductor light sources, a primary optics and a secondary optics having light module
AT511760B1 (en) * 2011-08-08 2013-12-15 Zizala Lichtsysteme Gmbh LED LIGHT SOURCE MODULE FOR A LED MOTOR VEHICLE HEADLIGHT AND LED MOTOR VEHICLE HEADLAMP AND HEADLAMP SYSTEM
US8878221B2 (en) * 2011-08-19 2014-11-04 Lg Innotex Co., Ltd. Light emitting module
CN103133997A (en) * 2011-11-24 2013-06-05 南昌祥美照明设计有限公司 Automobile headlamp grading structure and light-emitting diode (LED) automobile headlamp
TWI469387B (en) * 2012-05-16 2015-01-11 Ligitek Electronics Co Ltd Light-emitting module
TWM498387U (en) * 2014-06-30 2015-04-01 Ligitek Electronics Co Ltd Light emitting diode module package structure having thermal-electric separated function and electrical connection module

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI601906B (en) * 2016-10-26 2017-10-11 LED fixtures
US10260696B2 (en) 2016-12-22 2019-04-16 Keeper Technology Co., Ltd. Light-emitting diode module holder
US10066800B1 (en) 2017-09-21 2018-09-04 Keeper Technology Co., Ltd. Light-emitting diode fixing apparatus

Also Published As

Publication number Publication date
CN204717541U (en) 2015-10-21
CN204885155U (en) 2015-12-16
CN105202437B (en) 2018-10-02
CN105202437A (en) 2015-12-30

Similar Documents

Publication Publication Date Title
TWM498387U (en) Light emitting diode module package structure having thermal-electric separated function and electrical connection module
TWI640713B (en) Led lead frame array for general illumination
KR101049698B1 (en) Led array module and manufacturing method thereof
KR101134671B1 (en) LED lamp module with the cooling structure
KR100990331B1 (en) Heat dissipation structure of high power led using fr4 pcb
JP2005158957A (en) Light emitting device
US8371715B2 (en) LED illuminator module with high heat-dissipating efficiency and manufacturing method therefor
WO2006128375A1 (en) Package structure of semiconductor light-emitting device
JP2011146353A (en) Lighting apparatus
JP2007096320A (en) Light-emitting device
JP2011192703A (en) Light emitting device, and illumination apparatus
JP2016171147A (en) Light emission device and luminaire
WO2011057433A1 (en) Light emitting diode lamp bar and manufacture method thereof, light emitting diode lamp tube
US20100084673A1 (en) Light-emitting semiconductor packaging structure without wire bonding
JP4655735B2 (en) LED unit
US20050047140A1 (en) Lighting device composed of a thin light emitting diode module
JP2006073699A (en) Light emitting element accommodating package
US10222048B2 (en) Light emitting device and method for manufacturing a light emitting device
JPWO2012057276A1 (en) Light emitting module and lighting apparatus
JP3186004U (en) Chip unsealed LED lighting
KR101278835B1 (en) Led pcb substrate, pcb, led unit, lighting and its manufacture
TW201244056A (en) Light emitting diode module package structure
TWI658614B (en) Light emitting diode module package structure having thermal-electric separated function
TWI610469B (en) Flip-chip type light-emitting diode and manufacturing method thereof
JP2011159825A (en) Module device for led lighting, and method of manufacturing the same