TWI658614B - Light emitting diode module package structure having thermal-electric separated function - Google Patents

Abstract

The thermoelectrically separated light-emitting diode package module of the present invention achieves the effect of thermal conduction and circuit separation by modularly combining a metal substrate, a light-emitting diode ceramic packaging element, an electrical connector, and an electrical connection board. , Can effectively reduce the thermal resistance. And by using the light-emitting diode ceramic packaging element with an electrical connector and an electrical connection board, the plurality of electrode portions of the light-emitting diode ceramic packaging element in the entire thermoelectrically separated light-emitting diode packaging module do not need to be soldered. It is electrically connected to an external power supply device, which simplifies the assembly process and subsequent maintenance costs of the light-emitting diode package module separated by thermoelectricity.

Description

Thermoelectrically separated light emitting diode package module

The invention relates to a light-emitted diode module, and more particularly to a light-emitting diode package module capable of thermoelectric separation.

In recent years, with the world trend of environmental protection, energy saving and carbon reduction, light-emitting diodes have become one of the important options to replace general light-emitting sources due to their high light-emitting efficiency.

Most of the existing chip-on-board (COB) packaging structures use metal or ceramic substrates for light-emitting diode packaging. The metal substrate needs to be added with an insulating layer to isolate the circuit and the heat-dissipating substrate, which will cause thermal resistance changes. The ceramic substrate itself is an insulating material and does not require an insulating layer to electrically isolate it, so there is no problem of large thermal resistance. However, ceramic COBs are liable to cause breakage when locking screws.

Known technologies such as the light-emitting device of the Republic of China Publication No. 201126777 (application date is May 20, 2010, application number 099116190), the device is a chip-on-board (COB) package structure, which has A laminated structure and includes three layers: a thermally conductive substrate, a circuit layer, a cavity cover, and an array of lenses; the thermally conductive substrate will conduct heat below the substrate. Generally, the substrate may include a metal or may include a copper alloy, Aluminum, anodized aluminum, aluminum alloys, magnesium alloys or possibly thermally conductive ceramics; the circuit layer forms one of the electrical conductors on it pattern. Each light emitting diode wafer is mounted on and electrically connected to a respective electrical conductor by virtue of its positive and negative electrodes being soldered with, for example, gold-tin eutectic solder, which solder uses a solder paste (such as tin or silver solder paste) Or use a metal-loaded epoxy (such as a silver-loaded epoxy).

However, the existing general metal substrate COB products, because the thermal conductive substrate needs to be added with an electrically insulating layer to isolate the circuit from the heat sink substrate. Although the above method can meet the heat dissipation requirements, it will cause the thermal resistance to increase. With the increase of the thickness, for higher brightness light-emitting diodes, the heat dissipation effect of the metal substrate is limited, and it can no longer meet its heat dissipation requirements.

However, the circuit layer is configured so that the light-emitting diode wafers are electrically connected in parallel in series between the positive (+) electrical connection pad and the negative (-) electrical connection pad. These electrical connection pads are also located on the upper surface of the PCB. Because the positive (+) electrical connection pads and the negative (-) electrical connection pads need to be electrically connected to the positive electrical end of the external power supply by using a solder connection method, respectively. And negative terminal, the process is complicated.

Therefore, there is a need to develop a new type of light emitting diode packaging module that requires a metal substrate and has high efficiency heat dissipation, and an electrical connection module to electrically connect these light emitting diodes to the positive (+) electrical connection pads of the electrical conductors and The negative (-) electrical connection pad directly passes the electrical connection line of the electrical connection module to the positive and negative electrical terminals of the external power supply, so as to solve the above-mentioned problems of difficult heat dissipation and complicated manufacturing process.

The object of the present invention is to provide a thermoelectrically separated light-emitting diode package module, which includes a metal substrate, an electrical connector, a light-emitting diode ceramic package element, and an electrical connection plate. The metal substrate has a relatively first A surface and a second surface are made of a metal material with heat dissipation characteristics; the electrical connector is attached to the first surface of the metal substrate, the electrical connector has a plurality of electrical connection portions at one end, and the electrical connector A through-hole is opened; the light-emitting diode ceramic package element is disposed in the through-hole of the electrical connector and is attached to the first surface of the metal substrate The light-emitting diode ceramic packaging element includes a ceramic substrate, a circuit layer, at least one light-emitting diode chip, and a light-transmissive package. The surface of the electrical connection board is formed with a plurality of conductive portions, and one end is used for attachment. The plurality of electrode portions of the light-emitting diode ceramic packaging component are electrically connected to the electrode portions, and the other end is used for attaching the plurality of electrical connection portions of the electrical connector and electrically connected to the electrical connection portions.

Another object of the present invention is to provide a thermoelectrically separated light-emitting diode package module which further includes at least one fin, which is perforated on the electrical connector and the metal substrate, and the electrical property is fixed by a fixing element (such as a screw). The connector, the metal substrate and the fin are locked to each other, so as to achieve the functions of reducing thermal resistance and enhancing module strength.

Another object of the present invention is to provide a thermoelectrically separated light emitting diode package module which further includes a plurality of exhaust holes, a plurality of recesses are formed around the electrical connector through-holes, and the ceramic packaging element is disposed on the electrical connector. An exhaust hole is formed in the perforation hole and is adhered to the first surface of the metal substrate.

Another object of the present invention is to provide an electrical connection module for a light-emitting diode ceramic packaging element used in a thermo-electrically separated light-emitting diode package module, which includes an electrical connector and an electrical connection board, and is connected to the outside. The positive and negative electrical terminals of the power supply.

The effect (1) of the gain of the present invention is that the provided thermoelectrically separated light-emitting diode package module separates a heat dissipation path from a circuit by combining a light-emitting diode ceramic packaging element and a metal substrate, and the heat conduction path is controlled by the light-emitting diode. The light emitting diode chip in the polar ceramic package element is transferred to the ceramic substrate, and then the solder paste is used to conduct heat to the metal substrate to achieve the functions of reducing thermal resistance and enhancing module strength.

The effect (b) of the gain of the present invention is that the provided thermoelectrically separated light-emitting diode The packaging module passes a plurality of first through holes on the metal substrate and a plurality of second through holes corresponding to the electrical connector to fix components (including but not limited to screws) through each of the opposite first through holes and the second through holes. At least one fin on the other side of the metal substrate is locked without breaking the light-emitting diode ceramic package element, and the heat conduction path is from the light-emitting diode chip in the light-emitting diode ceramic package element to the ceramic substrate, and then the solder paste is used to conduct heat To the metal substrate, and then conduct heat to the fins to achieve multiple heat dissipation effects and enhance the strength of the module.

The effect (3) of the gain of the present invention is that the provided thermoelectrically separated light-emitting diode package module has a plurality of recesses formed around the perforations of the electrical connector to form exhaust holes, and coats the metal substrate at a high temperature during the manufacturing process. The solder paste is combined with electrical connectors and ceramic packaging components to generate air bubbles squeezed out to these exhaust holes, reducing the adverse effect of air bubbles on heat conduction, and improving the heat conduction effect.

The effect (4) of the gain of the present invention is that the electrical connection module of the light-emitting diode ceramic packaging element used for the thermoelectric-separated light-emitting diode packaging module is connected to an external power source through an electrical connector and an electrical connector. Connection board, the entirety of the light-emitting diode ceramic packaged component of the light-emitting diode ceramic package module is electrically connected to an external power source, and does not require the use of a plurality of bonding wires for electrical connection to simplify the thermo-electric separation Process steps of the light-emitting diode packaging module and improve the efficiency and convenience of subsequent assembly and maintenance.

The technical means (1) adopted by the present invention is to provide a thermoelectrically separated light-emitting diode packaging module, which includes a metal substrate, a light-emitting diode ceramic packaging element, an electrical connector, and an electrical connection plate. A metal substrate (aluminum substrate or copper substrate) having heat dissipation characteristics and composed of a metal material; the electrical connector is attached to the first surface of the metal substrate, and one end of the electrical connector has a plurality of electrical connection portions And the electrical connector is provided with a through hole; the light emitting diode Body ceramic packaging element is disposed in the through hole of the electrical connector and is attached to the metal substrate. The light emitting diode ceramic packaging element mainly includes a ceramic substrate, a circuit layer, and at least one light emitting diode. A chip and a light-transmissive package. The ceramic substrate has a circuit layer. The light-emitting diode chips are disposed on the circuit layer and are electrically coupled to the circuit layer. The circuit layer is also provided with a plurality of electrode portions at one end. It can have at least one positive electrode connection pad and at least one negative electrode connection pad to control different light types through different lines; and the electrical connection plate has a plurality of conductive parts formed on the surface, and one end is coated with solder paste on the surface. The light emitting diode ceramic package element is used to adhere to a plurality of electrode portions, and the other end is used to adhere to the plurality of electrical connection portions of the electrical connector to be electrically connected to each other.

The technical means (2) adopted by the present invention is to provide a thermoelectrically separated light-emitting diode packaging module, which includes a metal substrate, a light-emitting diode ceramic packaging element, an electrical connector, and an electrical connection board. A metal substrate having heat dissipation characteristics and composed of a metal material; the electrical connector is attached to the first surface of the metal substrate, the electrical connector has a plurality of electrical connection portions at one end, and the electrical connector is provided with a A plurality of recesses are formed around the perforations; the light-emitting diode ceramic package element is disposed in the perforations of the electrical connector and is attached to the metal substrate to form an exhaust hole, and the light A diode ceramic package element mainly includes a ceramic substrate, a circuit layer, at least one light-emitting diode chip, and a light-transmissive package. The ceramic substrate has a circuit layer, and the light-emitting diode chip is disposed on the circuit layer. On the circuit layer, a plurality of electrode portions are further provided at one end of the circuit layer, and the circuit layer has at least one positive electrode connection pad and at least one negative electrode connection pad; A plurality of conductive portions are formed, and one end is used to adhere to the plurality of electrode portions of the light-emitting diode ceramic packaging element using the solder paste coated on the surface, and the other end is used to adhere to the plurality of electrical connection portions of the electrical connector to electrically communicate with each other. Sexual connection.

The technical means (3) adopted by the present invention is to provide a thermoelectrically separated luminescence A diode package module includes a metal substrate, a light emitting diode ceramic package element, an electrical connector, an electrical connection plate, a fin, and a fixing element; the metal substrate has heat dissipation characteristics and is made of a metal material The electrical connector is attached to the first surface of the metal substrate, the electrical connector has a plurality of electrical connection portions at one end, and the electrical connector is provided with a through hole; the light-emitting diode ceramic package element The light-emitting diode ceramic package element mainly includes a ceramic substrate, a circuit layer, at least one light-emitting diode chip, and a light-emitting diode. A light-transmitting package; the plurality of electrical connection portions of the electrical connector are electrically connected to the plurality of conductive portions of the electrical connection plate, and the metal substrate has a plurality of first perforations and the electrical connector has a plurality of second perforations. Forming a channel, penetrating the channel with a fixing element, and fixing and fixing with at least one fin attached to the second surface of the metal substrate, wherein the second perforation holes are larger than or equal to the first perforation holes , The fixing member is attached to or embedded in the surface of the electrical connector.

The technical means (4) adopted by the present invention is to provide a thermoelectrically separated light-emitting diode packaging module, which includes a metal substrate, a light-emitting diode ceramic packaging element, an electrical connector, and an electrical connection board. At least one fin extending from the other side of the metal substrate is integrally formed, has heat dissipation characteristics and is composed of a metal material; the electrical connector is attached to the first surface of the metal substrate, and one end of the electrical connector has a plurality of connections. The electrical connector, and the electrical connector is provided with a through hole; the light-emitting diode ceramic packaging component is disposed in the through hole of the electrical connector, including but not limited to soldering paste on the metal On the substrate, the light-emitting diode ceramic package element mainly includes a ceramic substrate, a circuit layer, at least one light-emitting diode chip, and a light-transmissive package; the plurality of electrical connection portions of the electrical connector are electrically connected to the electrical connection. The plurality of conductive portions of the board are electrically connected.

The technical means (5) adopted by the present invention is to provide a method for thermoelectric separation. The light-emitting diode ceramic module's electrical connection module of the light-emitting diode package module includes an electrical connector and an electrical connection board; the electrical connector has a plurality of electrical connection portions at one end for electrical connection to the outside The positive electrical terminal and the negative electrical terminal of the power supply; the electrical connection plate has a plurality of conductive portions formed on its surface, and one end is attached to the plurality of electrode portions of the light emitting diode ceramic packaging element of the thermoelectrically separated light emitting diode packaging module. For electrical connection, the other end is used for attaching the plurality of electrical connection parts of the electrical connector for electrical connection.

In order that the review committee can further understand and understand the purpose, technical features and effects of the present invention, the embodiments are described in detail with the drawings, as follows:

10,10a, 10b, 10c ‧‧‧thermoelectrically separated light emitting diode package module

20‧‧‧Electrical connection module

100‧‧‧ fins

110‧‧‧ Fourth perforation

200‧‧‧ metal substrate

210‧‧‧first surface

220‧‧‧ second surface

230‧‧‧ first perforation

300‧‧‧electrical connector

310,320‧‧‧Receiving Department

330‧‧‧hole

340‧‧‧second perforation

350‧‧‧ Recess

360‧‧‧ positioning groove

370‧‧‧ third perforation

400‧‧‧Light-emitting diode ceramic package components

410‧‧‧ceramic substrate

420‧‧‧line layer

421,422‧‧‧electrode section

423‧‧‧protective element

430‧‧‧light-emitting diode chip

440‧‧‧Translucent package

441‧‧‧ encapsulated colloid

442‧‧‧ phosphor

443‧‧‧lens

500‧‧‧electrical connection board

510,520‧‧‧Conductive section

600‧‧‧Fixed element

700‧‧‧external power

FIG. 1 is a schematic perspective view of a thermoelectrically separated light emitting diode package module according to a preferred embodiment of the present invention.

FIG. 2 is a partial exploded view of a thermoelectrically separated light emitting diode package module according to a preferred embodiment of the present invention.

FIG. 3 is a partial cross-sectional view of a light emitting diode ceramic packaging component of a thermoelectrically separated light emitting diode packaging module according to a preferred embodiment of the present invention.

FIG. 4 is a schematic perspective view of a thermoelectrically separated light emitting diode package module according to a second embodiment of the present invention.

FIG. 5 is a schematic perspective view of a thermoelectrically separated light emitting diode package module according to a third embodiment of the present invention.

FIG. 6 is a partial exploded view of a light-emitting diode package module with thermoelectric separation according to a third embodiment of the present invention.

FIG. 7 is a schematic perspective view of a thermoelectrically separated light emitting diode package module according to a fourth embodiment of the present invention.

FIG. 8 is a partial exploded view of a thermoelectrically separated light emitting diode package module according to a fourth embodiment of the present invention.

FIG. 9 is an exploded perspective view of an electrical connection module of a light emitting diode ceramic packaging element used in a thermoelectric separation light emitting diode packaging module according to a fifth embodiment of the present invention.

In order to further understand the characteristics, technical means, and specific functions and objectives achieved by this creation, more specific examples are listed below, followed by detailed descriptions with diagram numbers.

Please refer to FIG. 1 and FIG. 2. In a preferred embodiment, the thermoelectrically separated light emitting diode packaging module 10 of the present invention includes a metal substrate 200, an electrical connector 300, and a light emitting diode ceramic packaging element 400. And the electrical connection plate 500; the metal substrate 200 has heat dissipation characteristics and is made of a metal material, and the light emitting diode ceramic package element 400 is disposed in the through hole 330 of the electrical connector 300 and is attached to the metal substrate 200 On the first surface 210, the light-emitting diode ceramic package element 400 mainly includes a ceramic substrate 410, a circuit layer 420, at least one light-emitting diode wafer 430, and a light-transmissive package 440, as shown in FIG. 3, The ceramic substrate 410 has a circuit layer 420. At least one light-emitting diode wafer 430 is disposed on the ceramic substrate 410, and is electrically coupled to the circuit layer 420. The circuit layer 420 has a protection element 423. One end is also provided with a plurality of electrode portions 421, 422. There are a positive electrode connection pad and a negative electrode connection pad, respectively. The electrical connector 300 has a plurality of electrical connection portions 310 and 320 and an electrical connection plate 500 with a plurality of conductive portions 510 and 520 on one side. One end of the solder paste on the surface of the flexible connection board 500 is used to attach the plurality of electrode portions 421,422 of the light-emitting diode ceramic package component 400, and the other end is used to attach the plurality of electrical connection portions 310,320 of the electrical connector 300. This electrical connection simplifies the manufacturing steps, without the need to solder the positive electrode connection pads, negative electrode connection pads of the plurality of electrode portions 421, 422 of the light emitting diode ceramic package 400, and an external power source (not shown). For complex processes, the light-emitting diode ceramic package element 400 uses a solder paste coated on the first surface 210 of the metal substrate 200 and adheres to the first surface 210 of the metal substrate 200, so that the heat of the light-emitting diode ceramic package element 400 can be applied. Dissipated, the metal substrate 200 can assist in heat dissipation.

After further explaining the preferred embodiment, the metal substrate 200 has heat dissipation characteristics and is composed of a metal material. The metal material may be selected from the group consisting of copper, copper alloy, aluminum, aluminum alloy, magnesium alloy, aluminum silicon carbide, and carbon composite. One. Furthermore, the ceramic substrate has electrical insulation and heat dissipation characteristics and is composed of a ceramic material. The ceramic material may be selected from one of alumina, aluminum nitride, zirconia, silicon carbide, hexagonal boron nitride, and calcium fluoride. . Furthermore, the light emitting diode wafer 430 is suitable for a light emitting diode wafer having a vertical structure and / or a light emitting diode wafer having a horizontal structure. Furthermore, the encapsulating gel 441 in the light-emitting diode ceramic packaging element 400 has high light transmittance and electrical insulation, and may be composed of a material including silicone or epoxy resin. The phosphor 442 may be selected from fluorescent glue or fluorescent film. The light-transmissive package 440 is formed but is not limited to the encapsulating gel 441 to cover the phosphor 442. The light-transmissive package 440 may be formed of the phosphor 442 to cover the encapsulation 441, and the light-transmissive package 440 may be formed. To mix the phosphor 442 (such as phosphor) with the encapsulant 441 (such as silicone or epoxy), the light-transmissive package 440 may further include a lens 443. Furthermore, the material of the electrical connector 300 and the electrical connection board 500 includes, but is not limited to, FR4.

Please refer to FIG. 4. In the second embodiment, the thermoelectrically separated light emitting diode package module 10 a of the present invention is substantially the same as that of the preferred embodiment. The difference between the two is only that the metal substrate 200 further includes At least one fin 100 is formed by die casting, aluminum extrusion or stamping, and the at least one fin is attached to the second surface 220 of the metal substrate; or the metal substrate extends outward from the other side to At least one fin is integrally formed, and the light emitting diode ceramic package element is bonded to the metal substrate by including but not limited to a solder paste.

Please refer to FIG. 5 and FIG. 6. In the third embodiment, the thermoelectrically separated light emitting diode package module 10 b of the present invention is substantially the same as that of the preferred embodiment. The difference between the two is only that: the metal substrate 200 has a plurality of first through holes 230, the electrical connector 300 has a plurality of second through holes 340, and at least one fin 100 has a plurality of fourth through holes 110, which overlap each other to form a channel to fix the element 600 (including but not limited to screws) Pass through the channel and be fixed with at least one fin 100 attached to the second surface 220 of the metal substrate 200, wherein the apertures of the second perforations 340 are greater than or equal to the apertures of the first perforations 230, so that the fixing element 600 is buried. The light-emitting diode ceramic package element 400 is not broken, and the heat conduction path is from the light-emitting diode chip 430 to the ceramic substrate 410 in the light-emitting diode ceramic package element 400, The solder paste is then used to conduct heat to the metal substrate 200 and then to the fins 100 to achieve the functions of reducing thermal resistance and enhancing module strength.

Please refer to FIG. 7 and FIG. 8. In the fourth embodiment, the thermoelectrically separated light emitting diode package module 10 c of the present invention is substantially the same as that of the preferred embodiment. The difference between the two is only in electrical properties. A plurality of recesses 350 are opened around the through-hole 330 of the connector 300. The light-emitting diode ceramic package element 400 is disposed in the through-hole 330 of the electrical connector 300 and is attached to the first surface 210 of the metal substrate 200 to form an exhaust hole. The solder paste coated on the metal substrate 200 during the high-temperature treatment in the process, due to the close adhesion of the metal substrate 200 with the electrical connector 300 and the light-emitting diode ceramic packaging component 400, bubbles are squeezed out to these exhaust holes, reducing the bubble pair. The adverse effect of heat conduction can relatively improve the heat conduction effect.

Please refer to FIG. 9. In a fifth embodiment, the electrical connection module 20 of the present invention includes an electrical connector 300 and an electrical connection board 500. One end of the electrical connector 300 has a plurality of connections. The electrical parts 310 and 320 are electrically connected to the external power source 700. The electrical connection board 500 has a plurality of conductive parts 510 and 520 formed on the surface thereof. One end is attached to the plurality of electrode areas 421 and 422 of the light emitting diode packaging module 10 and the light emitting diode ceramic packaging element 400. For electrical connection, the light-emitting diode chip 430 is turned on to emit light, and the other end is used for attaching the plurality of electrical connection sections 310 and 320 of the electrical connector 300 for electrical connection, and the light-emitting diode is convenient for thermoelectric separation. The mounting and disassembly maintenance of the body package module 10 and the simplified manufacturing process; it is worth mentioning that the electrical connector 300 may have a plurality of positioning grooves 360 on both sides, and the positioning grooves 360 are recessed on both sides of the electrical connector 300 and communicate with the electrical connector 300. The buckle slot (not shown) of the external power supply 700 is engaged with the buckle. In addition, the electrical connector 300 may include at least a third through hole 370, and the at least one third through hole 370 is disposed on the surface of the electrical connector 300. And it is held in cooperation with the pins (not shown) opposite to the external power supply 700. The electrical connection module 20 can be used to fix the external power supply 700 effectively without being affected by external force and environmental vibration. The electrical connector 300 and the electrical connection board 500 material Including but not limited to FR4.

In summary, the thermoelectrically separated light-emitting diode packaging module of the present invention uses a light-emitting diode ceramic packaging element to be attached to a metal substrate to achieve the effect of reducing thermal resistance. The fixed element is used to pass through electrical properties. The connector, the metal substrate and the fin are locked to achieve the effect of multiple heat dissipation; and the electrical connector module is used to simplify the process steps.

The present invention has actually met the requirements of the invention patent, and an application is filed in accordance with the law. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the scope of rights of the present case. Those with ordinary knowledge in the technical field to which the present invention pertains can make various modifications without departing from the spirit and scope of the present invention. Changes and retouching, so the protection scope of the present invention shall be determined by the scope of the appended patent application.

Claims (17)

A thermoelectrically separated light-emitting diode package module includes: a metal substrate having a first surface and a second surface opposite to each other, which are made of a metal material with heat dissipation characteristics; an electrical connector attached to the metal On the first surface of the substrate, one end of the electrical connector has a plurality of electrical connection parts, and the electrical connector is provided with a through hole; a light-emitting diode ceramic packaging element for emitting light is disposed on the electrical property. In the through hole of the connector, and attached to the first surface of the metal substrate, the light emitting diode ceramic package element includes: a ceramic substrate having electrical insulation characteristics and composed of a ceramic material; a circuit layer, Formed on the surface of the ceramic substrate, and one end of the circuit layer is further provided with a plurality of electrode portions; at least one light emitting diode chip is fixed on the surface of the ceramic substrate and electrically connected to the circuit layer; and a transparent layer An optical package is formed on the surface of the ceramic substrate and encapsulates the light-emitting diode chip; and an electrical connection plate having a plurality of conductive portions formed on the surface thereof and one end for attaching the light-emitting diode ceramic Means of the circuit element layer, and electrically connected to those portions of the electrode wiring layers, such that the other end for attaching the connector electrically connected to the electrical portion, and electrically connected to such electrical connection portion. The thermoelectrically separated light-emitting diode package module described in item 1 of the scope of the patent application, further includes at least one fin, which is formed by die casting, aluminum extrusion or stamping, and the at least one fin is attached to the metal substrate.第二 表面。 The second surface. According to the thermoelectrically separated light-emitting diode package module described in item 1 of the scope of the patent application, wherein the metal substrate extends at least one fin from the other side to be integrally formed. The thermoelectrically separated light-emitting diode package module according to item 2 of the scope of patent application, wherein the metal substrate further includes a plurality of first perforations, and the first perforations are provided on the surface of the metal substrate and fixed by the plurality of The element is locked with the at least one fin. According to the thermoelectrically separated light-emitting diode package module described in item 4 of the scope of the patent application, wherein the electrical connector further includes a plurality of second through holes, and the second through holes are provided on the surface of the electrical connector, The fixing elements are fixed through the opposite first and second perforations and the at least one fin configuration, and the second perforation apertures are greater than or equal to the first perforation apertures. The thermoelectrically separated light-emitting diode package module according to item 5 of the scope of patent application, wherein the fixing element is a screw. According to the thermoelectrically separated light-emitting diode package module described in item 1 of the scope of the patent application, wherein the electrical connector further includes at least one recessed portion, and the at least one recessed portion is disposed around the periphery of the through hole. According to the thermoelectrically separated light-emitting diode package module described in item 1 of the scope of the patent application, the electrical connector further includes a plurality of positioning grooves, which are recessed on both sides of the electrical connection portion. The thermoelectrically separated light-emitting diode package module according to item 8 of the scope of patent application, wherein the electrical connector further includes at least a third perforation, and the at least one third perforation is disposed on the electrical connector surface. . The thermoelectrically separated light-emitting diode package module according to item 1 of the scope of the patent application, wherein the light-transmissive package includes a packaging colloid and a phosphor formed on a surface of the packaging colloid. The thermoelectrically separated light-emitting diode packaging module according to item 1 of the scope of the patent application, wherein the light-transmissive package includes a phosphor coated on a surface of the light-emitting diode wafer and a covering The encapsulant of the phosphor. The thermoelectrically separated light-emitting diode packaging module according to item 1 of the scope of patent application, wherein the light-transmissive packaging body is formed by mixing a phosphor and a packaging gel. The thermoelectrically separated light-emitting diode package module according to any one of the tenth to twelve patent applications, wherein the light-transmissive package further includes a lens. The thermoelectrically separated light-emitting diode package module according to item 1 of the patent application scope, wherein the metal substrate is composed of copper, copper alloy, aluminum, aluminum alloy, magnesium alloy, aluminum silicon carbide, and carbon composite. Select from the group. The thermoelectrically separated light-emitting diode package module according to item 1 of the scope of the patent application, wherein the ceramic substrate is made of alumina, aluminum nitride, zirconia, silicon carbide, hexagonal boron nitride, and calcium fluoride. one of them. The thermoelectrically separated light-emitting diode package module as described in item 1 of the scope of the patent application, wherein the material of the electrical connector is FR4. The thermoelectrically separated light-emitting diode package module described in item 1 of the scope of patent application, wherein the material of the electrical connection board is FR4.