CN204717541U - LED head lamp for vehicle - Google Patents
LED head lamp for vehicle Download PDFInfo
- Publication number
- CN204717541U CN204717541U CN201520173230.8U CN201520173230U CN204717541U CN 204717541 U CN204717541 U CN 204717541U CN 201520173230 U CN201520173230 U CN 201520173230U CN 204717541 U CN204717541 U CN 204717541U
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- light
- emitting diode
- backlight unit
- lens
- diode chip
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- 238000012634 optical imaging Methods 0.000 claims abstract description 27
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 238000005538 encapsulation Methods 0.000 claims description 45
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a vehicle LED headlight. The LED head lamp for vehicle is an LED head lamp capable of generating specific vehicle lamp light shape, and comprises a head end seat and a tail end seat, an LED packaging module, a diaphragm and an optical imaging lens, wherein the body is provided with a through groove, and the two ends of the head end seat and the tail end seat are respectively provided with an opening; at least one die casting lens, a diaphragm and an optical imaging lens of the LED packaging module are utilized to generate a specific light shape which accords with the international standard specification of the car lamp, and the non-reflective light is utilized to shorten the focal length required by the car lamp. The LED packaging module comprises a metal substrate, an electrical connector, an LED ceramic packaging element and an electrical connecting plate, the effect of heat conduction and circuit separation is achieved through modular combination, and meanwhile, the LED ceramic packaging element is matched with the electrical connector and the electrical connecting plate for use, so that the assembly process and the subsequent maintenance cost of the LED packaging module are simplified.
Description
Technical field
The utility model, about a kind of LED headlight, refers to a kind of vehicle LED headlight especially.
Background technology
Light emitting diode (Light Emitting Diode, LED) be in recent years important light energy source, LED has economize on electricity, subtracts the advantage of carbon and long service life, so the application on lighting source is more and more extensive, right LED is used for the light source of Vehicular headlamps, although very easily displacement replaces conventional light source, so, vehicle travels the danger with height, especially, when night running, the illumination of Vehicular headlamps naturally must meet the requirements such as clear zone in International Standard, illumination, illumination maximum.
Existing Vehicular headlamps, comprise the reflecting shade body that a luminescence component and covers at this luminescence component rear, the cambered surface that one has specific curvature is formed inside this reflecting shade body, and this luminescence component is located at the focus of this reflecting shade body, the light that luminescence component produces forwards can penetrate for illumination by reflecting shade body reflection, and one lens are set through reflecting shade body front, the light therethrough lens via reflecting shade body reflection are made to carry out light correction, produce the light form of car lamp that meets International Standard, so, light is through reflection, after refraction, by causing, the focal length required for car light is longer, the volume that car light forms not easily manufacturing cost that is miniaturized and car light is larger, also the loss of light will be caused, therefore the necessity having it to improve.
Another driving of sending a car in order to avoid light direct projection in subtend, the light shape of car light dead line also has specific shape, existing Vehicular headlamps meets the light form of car lamp with clear dead line of International Standard in order to produce, comprise the reflecting shade body that a luminescence component and covers at this luminescence component rear, the cambered surface that one has specific curvature is formed inside this reflecting shade body, and this luminescence component is located at the focus of this reflecting shade body, the light that luminescence component produces forwards can penetrate for illumination by reflecting shade body reflection, and one anti-dazzling screen is set in addition through reflecting shade body front, make via reflecting shade body reflection light by anti-dazzling screen with stop portions light, generation one is made to meet the upper and lower asymmetric light form of car lamp of specification, so, this anti-dazzling screen can cause the utilization rate of light to reduce, therefore the necessity having it to improve.
Be applied to now the LED head lamp structure of car light as No. I354746th, the TaiWan, China patent No., the applying date is on May 14th, 2008, disclosed " LED light emission device and car light " then comprises for a kind of LED light emission device: a LED light source, include at least one LED element, the light-emitting area of this at least one LED element is towards a reflector; This reflector, covers at this at least one LED element outside, and comprises multiple reflectings surface of each tool different curvature; One matte, presets light shape for the light converged from those multiple reflectings surface is adjusted to one; And a projection lens, for this default light shape outwards being projected, but the reflector of this reflective car light occupies car light volume, and the light-emitting area of described LED element is towards a reflector, will cause hot gas upwards, and heat radiation is conducted not easily, therefore the necessity having it to improve.
Therefore, this creator is because existing LED car lamp has its necessity improved really, then the utility model design of association area and professional manufacturing experience is engaged in for many years with it, Upgrading is carried out energetically for vehicle LED headlight, under the discretion of each side's condition is considered, finally develop the utility model.
Utility model content
Because above-mentioned disappearance, the purpose of this utility model is, a kind of vehicle LED headlight is provided, comprise a body, one LED encapsulation module, one diaphragm (stop), and an optical imaging lens, the structure of vehicle LED headlight of the present utility model is simple, do not use reflection shield, avoid light through reflection, refraction or after being in the light, cause the loss of light, the focal length required for car light can be shortened, utilize body, LED encapsulation module, diaphragm and optical imaging lens can reduce volume that car light forms and make car light volume-diminished, reduce the manufacturing cost of car light, another at least one cast lens (Molding Lens) by LED encapsulation module or collimate lens group, diaphragm (stop), the optical elements such as optical imaging lens or imaging len group are directly revised its beam pattern and make its light beam irradiation to assigned address, generation meets International Standard specific light form.
Another object of the present utility model is, a kind of LED encapsulation module is provided, there is thermoelectricity separation function, by modular combination one metal substrate, one light emitting diode ceramic package element, one electric connector and one is electrically connected plate etc., reach the effect that heat transfer is separated with circuit, effectively can reduce thermal resistance value, and used by light emitting diode ceramic package element collocation electric connector and electric connection plate, in whole LED encapsulation module, the multiple electrode section of light emitting diode ceramic package element does not need to use welding manner to carry out being electrically connected with external electrical apparatus, simplify LED encapsulation module assembling processing procedure and subsequent maintenance cost.
An object more of the present utility model is, comprise a radiating subassembly further, include a heat radiation metal substrate, at least one heat pipe and at least one radiating fin, this heat radiation metal substrate is attached at the bottom surface of this LED encapsulation module, each heat pipe has an endotherm section and a heat release section respectively, this endotherm section includes but not limited to cemented or is welded on this heat radiation metal substrate, this heat release section is sticked at described radiating fin, this LED encapsulation module LED light emitting heat source is solved car light heat dissipation problem by this radiating subassembly, car light radiating module is moved by outside inner space simultaneously, also the problem that light-emitting diode (LED) car lamp space is excessive and processing procedure is complicated is solved, vehicle LED headlight of the present utility model is made to have more power saving and good advantage of dispelling the heat.
Effect (one) of the utility model gain is, this LED encapsulation module utilizes this at least one cast lens (Molding Lens) with continuously not separate mode or single separate mode this at least one fluorophor coated and this at least one light-emitting diode chip for backlight unit, and adjusted by the surface curvature of this at least one cast lens, guide this beam collimation cover that at least one light-emitting diode chip for backlight unit sends to assigned address, improve the shortcoming that the reflective car light of prior art accounts for car light volume.
Effect (two) of the utility model gain is, this diaphragm (stop) through hole is utilized to produce specific light form, the cover light beam exported by this at least one cast lens, by this diaphragm, repairs the light spot shape of light shape, the overall length of control both optical system.
Effect (three) of the utility model gain is, utilize this optical imaging lens to adjust light and form luminous intensity as size and test position, the specification that meets international standards LED head lamp regulation also can shorten optical system overall length.
Effect (four) of the utility model gain is, this LED encapsulation module is by conjunction with this light emitting diode ceramic package element and this metal substrate, heat dissipation path is separated with circuit, and heat conduction path by least one light-emitting diode chip for backlight unit in this light emitting diode ceramic package element to this ceramic substrate, recycle tin cream heat conduction to this metal substrate, to reach the function reducing thermal resistance and enhancement mode bulk strength.
Effect (five) of the utility model gain is, this electric connector one end of this LED encapsulation module is utilized to have an electrical plug-and-pull port and an external power source is electrically connected, to obtain electric power running, do not need to use multiple closing line welding manner to be electrically connected, to promote follow-up assembling and maintenance efficiency and convenience.
Effect (six) of the utility model gain is, utilize radiating subassembly, include a heat radiation metal substrate, at least one heat pipe and at least one radiating fin, this heat radiation metal substrate is attached at the bottom surface of this LED encapsulation module, each heat pipe has an endotherm section and a heat release section respectively, this endotherm section includes but not limited to cemented or is welded on this heat radiation metal substrate, this heat release section is attached at this radiating fin, by car light radiating module is moved by outside inner space, to solve the problem that light-emitting diode (LED) car lamp space is excessive and processing procedure is complicated.
In order to achieve the above object, the technological means (one) that the utility model is taked includes a body, a LED encapsulation module, a diaphragm and an optical imaging lens for providing a kind of vehicle LED headlight, this body comprises one and runs through groove, a housing, a head end seat and a tail end seat, coated this of this housing runs through groove, this head end seat is positioned at this to be run through groove one end and has one first openend, and this tail end seat is positioned at this to be run through the groove other end and have one second openend, this optical diode package module, this diaphragm and this optical imaging lens will be sent out and be sequentially arranged at this body, this LED encapsulation module is placed in the second openend of this body tail end seat, and this diaphragm is arranged at this to be run through in groove and to be close to the first openend that the second openend of this body tail end seat and this optical imaging lens are placed in this body head end seat, this LED encapsulation module, at least comprise a line layer, at least one light-emitting diode chip for backlight unit, at least one fluorophor and at least one cast lens, this at least one light-emitting diode chip for backlight unit is placed on this line layer, electrically be coupled in line layer respectively, this at least one fluorophor covers this at least one light-emitting diode chip for backlight unit, again by this at least one cast lens this at least one fluorophor coated and this at least one light-emitting diode chip for backlight unit, the collimate characteristic of this at least one light-emitting diode chip for backlight unit utilizing emitted light tool can be made, this at least one light-emitting diode chip for backlight unit lighting angle is reduced cover to assigned address, this diaphragm is the through hole of an optical element tool specific light form (such as trapezoidal or tool dead line profile etc.), this through hole has the 3rd openend and the 4th openend, this diaphragm through hole the 4th openend is close to this body tail end seat second openend and is connected, this at least one cast lens of this LED encapsulation module is placed in the 4th openend, by adjusting this through hole suitable length, the cover light beam that this at least one cast lens can be exported is by the through hole of this diaphragm, repair the light spot shape of light shape, an accommodation space is formed between the 3rd openend of this diaphragm through hole and this optical imaging lens, by adjusting this accommodation space suitable length, this diaphragm injection light source is made to make to meet the specification of regulation through its light shape produced of this optical imaging lens reinforcement.
This at least one light-emitting diode chip for backlight unit of this LED encapsulation module is applicable to the light-emitting diode chip for backlight unit of vertical stratification and/or the light-emitting diode chip for backlight unit of horizontal structure, moreover, more than these at least one light-emitting diode chip for backlight unit arrangement at least 1 row, often row light-emitting diode chip for backlight unit with equal or not etc. given number be electrically connected this line layer.
This at least one cast lens of this LED encapsulation module is with not separate mode or single separate mode this at least one fluorophor coated and this at least one light-emitting diode chip for backlight unit continuously, this at least one cast lens another can also form one first lens group with other collimate lens combinations, this at least one cast lens arrangement between the column and the column can formula parallel to each other or incline towards each other to be inclined upwardly or all downward-sloping etc. relatively or all, for reaching light extraction efficiency and light-emitting diode chip for backlight unit rising angle reduces to produce cover light beam, different refractive indexes can be reached by Material selec-tion, can also be adjusted by the surface curvature of cast lens, usual classification has symmetroid or asymmetric curved surface.
This optical imaging lens also can combine formation one second lens group with other imaging lens, and reinforcement light forms the luminous intensity as test position.
With technological means (one) difference, the technological means (two) that the utility model is taked, for providing a kind of vehicle LED headlight, is that this LED encapsulation module comprises a metal substrate, a light emitting diode ceramic package element, an electric connector and are electrically connected plate etc., this metal substrate tool heat dissipation characteristics and being made up of metal material, this electric connector, is attached on the first surface of this metal substrate, and this electric connector one end has multiple power part, and this electric connector offers one engraves hole, this light emitting diode ceramic package element, what be arranged at this electric connector engraves in hole, and fit on this metal substrate, this light emitting diode ceramic package element mainly comprises a ceramic substrate, one line layer, at least one light-emitting diode chip for backlight unit and cover the light-permeable packaging body of this at least one light-emitting diode chip for backlight unit, this ceramic substrate has a line layer, this at least one light-emitting diode chip for backlight unit is arranged on this line layer, electrically be coupled in this line layer respectively, this line layer one end is also provided with multiple electrode section, at least one positive electrode connection gasket and at least one negative electrode connection gasket can be had, different light shapes is controlled by different circuit, and this electric connection plate, inner face forms multiple conductive part, and utilize and coat this surperficial tin cream, one end is for the multiple electrode section of this light emitting diode ceramic package element of fitting, and the other end, for multiple power parts of this electric connector of fitting, is electrically connected to each other.
Further illustrate as rear, this light-permeable packaging body is formed on the surface of this ceramic substrate, by at least one packing colloid, this at least one fluorophor and this at least one cast lens are formed, this at least one cast lens this at least one fluorophor coated, this at least one packing colloid and this at least one light-emitting diode chip for backlight unit, but this light-permeable packaging body is formed is not limited to this packing colloid this fluorophor coated, light-permeable packaging body is formed and also can be this fluorophor this packing colloid coated, another light-permeable packaging body formation can be this fluorophor (such as fluorescent material) and mixes with this packing colloid (such as silica gel or epoxy resin), this metal substrate tool heat dissipation characteristics and being made up of metal material material, metal material material can be selected from copper, copper alloy, aluminium, aluminium alloy, magnesium alloy, aluminium silicon carbide and carbon synthetic one wherein.Moreover this ceramic substrate has and is electrically insulated and loose thermal property and being made up of ceramic material, the optional self-alumina of ceramic material, aluminium nitride, zirconia, carborundum, hexagonal boron nitride and calcirm-fluoride one wherein, moreover this light-emitting diode chip for backlight unit is applicable to the light-emitting diode chip for backlight unit of vertical stratification and/or the light-emitting diode chip for backlight unit of horizontal structure, moreover, more than these at least one light-emitting diode chip for backlight unit arrangement at least 1 row, often row light-emitting diode chip for backlight unit with equal or not etc. given number be fixed on the surface of this ceramic substrate, and be electrically connected this line layer, this at least one packing colloid tool high light transmittance and being electrically insulated in light emitting diode ceramic package element, can be made up of the material comprising silica gel or epoxy resin, the optional autofluorescence glue of this at least one fluorophor or fluorescence film, in order to produce the light shape and Luminance Distribution that meet International Standard LED head lamp regulation, this at least one light-emitting diode chip for backlight unit is arranged with juxtaposition, often arrange this at least one light-emitting diode chip for backlight unit number equal or unequal, by this at least one cast lens this at least one fluorophor coated, this at least one packing colloid and this at least one light-emitting diode chip for backlight unit, this at least one light-emitting diode chip for backlight unit can be made to launch the collimate characteristic of bright dipping tool, this at least one light-emitting diode chip for backlight unit lighting angle is reduced cover to assigned address, this at least one cast lens another can form one first lens group with other collimate lens combinations, it is a collimator apparatus, arrangement between the column and the column can formula parallel to each other or the relative type motor or to be all inclined upwardly or all downward-sloping etc. of inclining towards each other, for reaching light extraction efficiency, different refractive indexes can be reached by Material selec-tion, can also be adjusted by the surface curvature of described cast lens, usual classification has symmetroid or asymmetric curved surface.
This at least one cast lens is with continuous not separate mode or single separate mode this at least one fluorophor coated, this at least one packing colloid and this at least one light-emitting diode chip for backlight unit, and adjusted by the surface curvature of this at least one cast lens, guide this light beam cover that at least one light-emitting diode chip for backlight unit sends to assigned address, if this at least one cast lens with continuously not between separate mode row and row shape can for parallel, tilt relative, to be inclined upwardly or downward-sloping etc.
Coordinate International Standard LED head lamp regulation, this optical imaging lens is adjustable lay the grain forms the luminous intensity as size and test position, and optical system overall length can be shortened, this optical imaging lens can combine formation one second lens group with other imaging lens, reinforcement light forms the luminous intensity as test position, and this optical imaging lens comprises aspheric lens, bitoric lens or micro-structural camera lens etc.
With technological means (two) difference, the technological means (three) that the utility model is taked, for providing a kind of vehicle LED headlight, is that the electric connector of this LED encapsulation module is engraved around hole and offers at least one recess; This light emitting diode ceramic package element, what be arranged at this electric connector engraves in hole, and fit on this metal substrate, form steam vent, produce bubble squeeze to described steam vent by this metal substrate of high-temperature process in processing procedure being coated with tin cream and electric connector and ceramic package combination of elements, reduce bubble to heat conducting harmful effect, can thermal conduction effect be promoted.
The technological means (four) that the utility model is taked is for providing a kind of vehicle LED headlight, be that these electric connector both sides can have multiple locating slot with technological means (two) difference, described locating slot is recessed in electric connector both sides, and coordinate buckle to be connected with the buckle slot of external power source, another electric connector also can offer at least one 3rd perforation, and the pin relative with external power source coordinates fixing, by this electric connector can effectively and external power source fix, not by external force influence of ambient vibration.
The technological means (five) that the utility model is taked is for providing a kind of vehicle LED headlight, be separately to comprise a radiating subassembly with technological means (one) difference, this radiating subassembly includes a heat radiation metal substrate, at least one heat pipe and at least one radiating fin, this heat radiation metal substrate can be attached at this LED encapsulation module, make this LED encapsulation module efficiently radiates heat to this radiating subassembly, wherein this at least one heat pipe has an endotherm section and a heat release section, this endotherm section includes but not limited to cemented or is welded on this heat radiation metal substrate, this heat release section is attached at described radiating fin, by car light radiating module is moved by outside inner space, to solve the problem that light-emitting diode (LED) car lamp space is excessive and processing procedure is complicated, this heat radiation metal substrate also can for the locking of body tail end seat, this body and this radiating subassembly is fixed to combine, this body tail end seat has multiple 5th perforation, the heat radiation metal substrate of radiating subassembly has multiple 6th lockhole, penetrate the 5th perforation with retaining element (including but not limited to screw), lock fixing with multiple 6th lockholes of heat radiation metal substrate.
The technological means (six) that the utility model is taked is for providing a kind of vehicle LED headlight, be separately to comprise radiating subassembly with technological means (two) difference, include a heat radiation metal substrate, at least one heat pipe and at least one radiating fin, this LED encapsulation module is offered multiple second by offering multiple first perforation on this metal substrate bore a hole with this electric connector correspondence position, bored a hole with second by each first relative perforation with retaining element (including but not limited to screw), lock with the radiating subassembly being positioned at this metal substrate bottom surface, and light emitting diode ceramic package elements breaking apart can not be caused, and heat conduction path by least one light-emitting diode chip for backlight unit pyrotoxin heat conduction in light emitting diode ceramic package element to ceramic substrate, the heat conduction of recycling tin cream is to metal substrate, heat conduction is at this radiating subassembly again, with the function of the effect and enhancement mode bulk strength that reach multiple heat dissipation, this heat radiation metal substrate another and this body tailstock tool locking function, this body tail end seat has multiple 5th perforation, the heat radiation metal substrate of radiating subassembly has multiple 6th lockhole, penetrate the 5th perforation with retaining element (including but not limited to screw), lock fixing with multiple 6th lockholes of heat radiation metal substrate.
The technological means (seven) that the utility model is taked, for providing a kind of LED encapsulation module, has thermoelectricity separation function, comprises a metal substrate, a light emitting diode ceramic package element, an electric connector and an electric connection plate etc., this metal substrate tool heat dissipation characteristics and being made up of metal material, this electric connector, is attached on the first surface of this metal substrate, the multiple power part of this electric connector one end tool, and this electric connector offers one engraves hole, this light emitting diode ceramic package element, what be arranged at this electric connector engraves in hole, and fit on this metal substrate, this light emitting diode ceramic package element mainly comprises a ceramic substrate, one line layer, at least one light-emitting diode chip for backlight unit and cover the light-permeable packaging body of this at least one light-emitting diode chip for backlight unit, this ceramic substrate has a line layer, this at least one light-emitting diode chip for backlight unit is arranged on this line layer, electrically be coupled in this line layer respectively, this line layer one end is also provided with multiple electrode section, at least one positive electrode connection gasket and at least one negative electrode connection gasket can be had, different light shapes is controlled by different circuit, and this electric connection plate, inner face forms multiple conductive part, and utilize and coat this surperficial tin cream, one end is for the multiple electrode section of this light emitting diode ceramic package element of fitting, and the other end, for multiple power parts of this electric connector of fitting, is electrically connected to each other.
The utility model is not limited to above-mentioned each technological means, various change can be carried out in the scope shown in right, and the appropriately combined technical characteristic disclosed respectively in each technological means and the embodiment obtained, be also included in technical scope of the present utility model.
For can to the utility model object, technical characteristic and effect thereof, do further understanding and understanding, hereby lift following described specific embodiment only in order to explain the utility model, and be not used in restriction the utility model scope, embodiment coordinates graphic, is described in detail as follows:
Accompanying drawing explanation
Fig. 1 is the vehicle LED headlight exploded perspective view of the utility model preferred embodiment.
Fig. 2 is the LED encapsulation module three-dimensional exploded view of the utility model second embodiment.
Fig. 3 is the light emitting diode ceramic package componentry sectional view of the utility model second embodiment.
Fig. 4 is the LED encapsulation module three-dimensional exploded view of the utility model the 3rd embodiment.
Fig. 5 is the LED encapsulation module three-dimensional exploded view of the utility model the 4th embodiment.
Fig. 6 is the vehicle LED headlight exploded perspective view of the utility model the 5th embodiment.
Fig. 7 is the LED encapsulation module three-dimensional exploded view of the utility model the 5th embodiment.
[symbol description]
1,1a vehicle LED headlight
100 LED encapsulation modules
443 cast lens
20 diaphragms
21 through holes
22 the 3rd openends
23 the 4th openends
30 optical imaging lens
50 bodies
501 run through groove
51 housings
52 head end seats
521 first openends
53 tail end seats
531 second openends
54 the 5th perforation
55 accommodation spaces
10,10a, 10b, 10c LED encapsulation module
200 metal substrates
210 first surfaces
220 second surfaces
230 first perforation
300 electric connectors
310,320 power parts
330 engrave hole
340 second perforation
350 recesses
360 locating slots
370 the 3rd perforation
400 light emitting diode ceramic package elements
410 ceramic substrates
420 line layers
421,422 electrode section
423 protective elements
430 light-emitting diode chip for backlight unit
440 light-permeable packaging bodies
441 packing colloids
442 fluorophor
500 are electrically connected plate
510,520 conductive parts
600 retaining elements
700 external power sources
40 radiating subassemblies
41 heat radiation metal substrates
411 the 3rd surfaces
412 the 4th surfaces
42 heat pipes
43 endotherm sections
44 heat release section
45 radiating fins
46 the 4th lockholes
47 the 6th lockholes
Detailed description of the invention
For understanding feature of the present utility model, technological means and the concrete function reached, object further, hereby enumerate comparatively specific embodiment, continuing is described in detail as follows with graphic figure number.
Please refer to shown in Fig. 1, in the preferred embodiment, vehicle LED headlight 1 provided by the utility model includes body 50, LED encapsulation module 100, diaphragm 20 and an optical imaging lens 30.
In this preferred embodiment, this body 50 has one and runs through groove 501, one housing 51, one head end seat 52 and a tail end seat 53, this head end seat 52 is positioned at this and runs through tool one first openend 521, groove 501 one end this optical imaging lens 30 accommodating, this tail end seat 53 is positioned at this and runs through groove 501 other end tool one second openend 531 this LED encapsulation module 100 accommodating, this diaphragm 20 is arranged at this and runs through in groove 501 the second openend 531 being close to this body 50 tail end seat 53, by this LED encapsulation module 100, this diaphragm 20 and this optical imaging lens 30 are sequentially arranged at body 50, this body 50 interior surface is with black absorption face or white diffusingsurface or mirror reflection surface (not shown), this LED encapsulation module 100, at least comprise a line layer (not shown), at least one light-emitting diode chip for backlight unit (not shown), at least one fluorophor (not shown) and at least one cast lens 443, this at least one light-emitting diode chip for backlight unit (not shown) is placed in this line layer (not shown), electrically be coupled in line layer (not shown) respectively, this at least one fluorophor (not shown) covers this at least one light-emitting diode chip for backlight unit (not shown), again by this at least one cast lens 443 this at least one fluorophor (not shown) coated and this at least one light-emitting diode chip for backlight unit (not shown), the collimate characteristic of this at least one light-emitting diode chip for backlight unit (not shown) utilizing emitted light tool can be made, this at least one light-emitting diode chip for backlight unit (not shown) lighting angle is reduced cover to assigned address, this diaphragm 20 is the through hole 21 of an optical element tool specific light form (such as trapezoidal or tool dead line profile etc.), this through hole 21 has the 3rd openend 22 and the 4th openend 23, this diaphragm 20 through hole 21 the 4th openend 23 is close to this body 50 tail end seat 53 second openend 531 and is connected, this at least one cast lens 443 of LED encapsulation module 100 is placed in this diaphragm 20 through hole 21 the 4th openend 23, by adjusting this through hole 21 suitable length, the cover light beam that this at least one cast lens 443 can be exported is by the through hole 21 of this diaphragm 20, repair the light spot shape of light shape, an accommodation space 55 is formed between the 3rd openend 22 of this diaphragm 20 through hole 21 and this optical imaging lens 30, by adjusting this accommodation space 55 suitable length, make this diaphragm 20 penetrate light source and make to meet the specification of regulation through its light shape produced of this optical imaging lens 30 reinforcement.
This at least one light-emitting diode chip for backlight unit (not shown) is applicable to the light-emitting diode chip for backlight unit of vertical stratification and/or the light-emitting diode chip for backlight unit (not shown) of horizontal structure, moreover, more than these at least one light-emitting diode chip for backlight unit (not shown) arrangement at least 1 row, often row light-emitting diode chip for backlight unit (not shown) with equal or not etc. given number be electrically connected this line layer (not shown).
This at least one cast lens 443 is with continuously not separate mode or single separate mode this at least one fluorophor (not shown) coated and this at least one light-emitting diode chip for backlight unit (not shown), this at least one cast lens 443 another can also be combined to form one first lens group (not shown) with other collimate lens (not shown), cover is reduced to assigned address for this at least one light-emitting diode chip for backlight unit utilizing emitted light angle, this at least one cast lens 443 arrangement between the column and the column can formula parallel to each other or incline towards each other to be inclined upwardly or all downward-sloping etc. relatively or all, for reaching light extraction efficiency and light-emitting diode chip for backlight unit rising angle reduces to produce cover light beam, different refractive indexes can be reached by Material selec-tion, can also be adjusted by the surface curvature of cast lens 443, usual classification has symmetroid or asymmetric curved surface.
The through hole 21 tool dead line rectangular light shape of this diaphragm 20, the cover light beam that this at least one cast lens 443 can be exported, by this diaphragm 20, repairs the light spot shape of light shape, the overall length of control both optical system; It should be noted that, the through hole 21 one-tenth specific light form of this diaphragm 20 of the utility model can have the shape of trapezoidal or tool dead line profile etc., and graphic in only display tool dead line rectangular light shape, in order to convenient, technical characteristic of the present utility model is described, and is not used to limit the utility model scope.
This optical imaging lens 30 comprises aspheric lens, bitoric lens or micro-structural camera lens etc., adjustable lay the grain forms the luminous intensity as size and test position, and optical system overall length can be shortened, this optical imaging lens 30 another also can be combined to form one second lens group (not shown) with other imaging len (not shown), and reinforcement light forms the luminous intensity as test position.
Please refer to shown in Fig. 2 and Fig. 3, in a second embodiment, vehicle LED headlight of the present utility model is roughly the same with preferred embodiment person, both difference places are only: this LED encapsulation module 10, comprise metal substrate 200, light emitting diode ceramic package element 400, electric connector 300 and and are electrically connected the formations such as plate 500, this metal substrate 200 tool heat dissipation characteristics and being made up of metal material (aluminum substrate or copper substrate etc.), this electric connector 300, is attached on the first surface 210 of this metal substrate 200, the multiple power part 310,320 of this electric connector 300 one end tool, and this electric connector 300 offers one engraves hole 330, what this light emitting diode ceramic package element 400 was arranged at this electric connector 300 engraves in hole 330, and fit on the first surface 210 of this metal substrate 200, this light emitting diode ceramic package element 400 mainly comprises a ceramic substrate 410, one line layer 420, at least one light-emitting diode chip for backlight unit 430 and cover the light-permeable packaging body 440 of this at least one light-emitting diode chip for backlight unit 430, this ceramic substrate 410 has a line layer 420, this at least one light-emitting diode chip for backlight unit 430 is placed on this line layer 420, electrically be coupled in this line layer 420 respectively, this line layer 420 has a protective element 423, one end is also provided with multiple electrode section 421, 422, at least one positive electrode connection gasket (not shown) and at least one negative electrode connection gasket (not shown) can be had, different light shapes is controlled by different circuit, and this electric connection plate 500, form multiple conductive part 510 on the surface, 520, this surperficial tin cream is coated in utilization, one end is for this light emitting diode ceramic package element more than 400 electrode section 421,422 of fitting, and the other end is for multiple power parts 310 of this electric connector 300 of fitting, 320, be electrically connected to each other.
Further illustrate the second embodiment as rear, this metal substrate 200 tool heat dissipation characteristics and being made up of metal material material, metal material material can be selected from copper, copper alloy, aluminium, aluminium alloy, magnesium alloy, aluminium silicon carbide and carbon synthetic one wherein, moreover ceramic substrate 410, has and is electrically insulated and loose thermal property and being made up of ceramic material, the optional self-alumina of ceramic material, aluminium nitride, zirconia, carborundum, hexagonal boron nitride and calcirm-fluoride one wherein, moreover this at least one light-emitting diode chip for backlight unit 430 is applicable to the light-emitting diode chip for backlight unit of vertical stratification and/or the light-emitting diode chip for backlight unit of horizontal structure, moreover, this at least one light-emitting diode chip for backlight unit 430 arranges more than at least 1 row, often row light-emitting diode chip for backlight unit 430 with equal or not etc. given number be fixed on the surface of this ceramic substrate 410, and be electrically connected this line layer 420, light-permeable packaging body 440 is formed on the surface of this ceramic substrate 410, by at least one packing colloid 441, this at least one fluorophor 442 and this at least one cast lens 443 are formed, this at least one cast lens 443 this at least one fluorophor 442 coated, this at least one packing colloid 441 and this at least one light-emitting diode chip for backlight unit 430, but light-permeable packaging body 440 is formed is not limited to the coated fluorophor 442 of packing colloid 441, light-permeable packaging body 440 is formed and also can be the coated packing colloid 441 of fluorophor 442, another light-permeable packaging body 440 formation can be fluorophor 442 (such as fluorescent material) and mixes with packing colloid 441 (such as silica gel or epoxy resin), packing colloid 441 tool high light transmittance and being electrically insulated in light emitting diode ceramic package element 400, can be made up of the material comprising silica gel or epoxy resin, the optional autofluorescence glue of fluorophor 442 or fluorescence film, this at least one cast lens 443 is continuous not separate mode or single separate mode this at least one fluorophor 442 coated, this at least one packing colloid 441 and this at least one light-emitting diode chip for backlight unit 430, and adjusted by the surface curvature of this at least one cast lens 443, guide this light beam cover that at least one light-emitting diode chip for backlight unit 430 sends to assigned address, this at least one cast lens 443 arranges and arranges a shape and comprise parallel, tilt relatively, to be inclined upwardly or downward-sloping.
Please refer to shown in Fig. 4, in the third embodiment, vehicle LED headlight of the present utility model is roughly the same with the second embodiment person, and both difference places are only: the electric connector 300 of this LED encapsulation module 10a is engraved around hole 330 offer at least one recess 350 in this; What this light emitting diode ceramic package element 400 was arranged at this electric connector 300 engraves in hole 330, and fit on the first surface 210 of this metal substrate 200, form at least one steam vent, to be combined with this electric connector 300 and this light emitting diode ceramic package element 400 and to produce bubble by this metal substrate 200 of high-temperature process in processing procedure being coated with tin cream and squeeze to described steam vent, reduce bubble to heat conducting harmful effect, can thermal conduction effect be promoted.
Please refer to shown in Fig. 5, in the fourth embodiment, vehicle LED headlight of the present utility model is roughly the same with the second embodiment person, both difference places are only: electric connector 300 both sides of this LED encapsulation module 10b have multiple locating slot 360, described locating slot 360 is recessed in electric connector 300 both sides, and coordinate buckle to be connected with the buckle slot (not shown) of this external power source 700, another electric connector 300 also can comprise at least one 3rd perforation 370, this at least one 3rd perforation 370 is worn and is penetrated in electric connector 300, and the pin (not shown) relative with this external power source 700 coordinates fixing, can be multiple effectively fixing with this external power source 700 by this electric connector 300, not by external force influence of ambient vibration.
Please refer to shown in Fig. 6 and Fig. 7, in the 5th embodiment, vehicle LED headlight 1a of the present utility model is roughly the same with the second embodiment person, both difference places are only: separately comprise a radiating subassembly 40, include a heat radiation metal substrate 41, at least one heat pipe 42 and at least one radiating fin 45.
Heat radiation metal substrate 41 has one the 3rd relative surface 411 and one the 4th surface 412,3rd surface 411 of this heat radiation metal substrate 41 is attached at this second surface 220 of this metal substrate 200 of this LED encapsulation module 10c, this at least one heat pipe 42 is attached at the 4th surface 412 of this heat radiation metal substrate 41, and this at least one radiating fin 45 is attached on described heat pipe 42.
Each heat pipe 42 has endotherm section 43 and a heat release section 44 respectively, this endotherm section 43 includes but not limited to cemented or is welded on the 4th surface 412 of this heat radiation metal substrate 41, this heat release section 44 is attached at radiating fin 45, this heat radiation metal substrate 41 has multiple 4th lockhole 46, the metal substrate 200 of this LED encapsulation module 10c has multiple first perforation 230, this electric connector 300 has multiple second perforation 340, corresponding to each other overlaps forms passage, this passage is penetrated respectively with multiple retaining element 600 (including but not limited to screw), lock fixing with corresponding multiple 4th lockholes 46 of heat radiation metal substrate 41 of the radiating subassembly 40 being attached at this metal substrate 200 second surface 220, wherein said second perforation 340 apertures are more than or equal to described first perforation 230 apertures, described retaining element 600 is made to imbed or be attached at this electric connector 300 surface, and this light emitting diode ceramic package element 400 can not be caused broken, and heat conduction path by light-emitting diode chip for backlight unit 430 heat source in this light emitting diode ceramic package element 400 to ceramic substrate 410, the heat conduction of recycling tin cream is to metal substrate 200, heat conduction is at the heat radiation metal substrate 41 of radiating subassembly 40 again, absorbed heat by the endotherm section 43 of heat pipe 42 and conduct to the heat release section 44 of heat pipe 42 again, heat conduction is to radiating fin 45 again, reach the function reducing thermal resistance and enhancement mode bulk strength.
This heat radiation metal substrate 41 locks with this body 50 tail end seat 53, by this body 50 tail end seat 53, there is multiple 5th perforation 54, to the heat radiation metal substrate 41 of radiating subassembly 40 having multiple 6th lockhole 47, penetrate described 5th perforation 54 respectively with multiple retaining element (not shown), described six lockhole 47 corresponding with this heat radiation metal substrate 41 locks fixing.
Please refer to Fig. 2 and Fig. 3 again, the utility model LED encapsulation module 10, tool thermoelectricity separation function, comprise metal substrate 200, light emitting diode ceramic package element 400, electric connector 300 and and be electrically connected the formations such as plate 500, this metal substrate 200 tool heat dissipation characteristics and being made up of metal material (aluminum substrate or copper substrate etc.), this electric connector 300, is attached on the first surface 210 of this metal substrate 200, the multiple power part 310,320 of this electric connector 300 one end tool, and this electric connector 300 offers one engraves hole 330, what this light emitting diode ceramic package element 400 was arranged at this electric connector 300 engraves in hole 330, and fit on the first surface 210 of this metal substrate 200, this light emitting diode ceramic package element 400 mainly comprises a ceramic substrate 410, one line layer 420, at least one light-emitting diode chip for backlight unit 430 and cover the light-permeable packaging body 440 of this at least one light-emitting diode chip for backlight unit 430, this ceramic substrate 410 has a line layer 420, this at least one light-emitting diode chip for backlight unit 430 is placed on this line layer 420, electrically be coupled in this line layer 420 respectively, this line layer 420 has a protective element 423, one end is also provided with multiple electrode section 421, 422, at least one positive electrode connection gasket (not shown) and at least one negative electrode connection gasket (not shown) can be had, different light shapes is controlled by different circuit, and this electric connection plate 500, form multiple conductive part 510 on the surface, 520, this surperficial tin cream is coated in utilization, one end is for this light emitting diode ceramic package element more than 400 electrode section 421,422 of fitting, and the other end is for multiple power parts 310 of this electric connector 300 of fitting, 320, be electrically connected to each other.
Further illustrate as rear, metal substrate 200 tool heat dissipation characteristics and being made up of metal material material, metal material material can be selected from copper, copper alloy, aluminium, aluminium alloy, magnesium alloy, aluminium silicon carbide and carbon synthetic one wherein.Moreover ceramic substrate 410, has and is electrically insulated and loose thermal property and being made up of ceramic material, the optional self-alumina of ceramic material, aluminium nitride, zirconia, carborundum, hexagonal boron nitride and calcirm-fluoride one wherein.Moreover light-emitting diode chip for backlight unit 430 is applicable to the light-emitting diode chip for backlight unit of vertical stratification and/or the light-emitting diode chip for backlight unit of horizontal structure.Moreover, packing colloid 441 tool high light transmittance and being electrically insulated in light emitting diode ceramic package element 400, can be made up of the material comprising silica gel or epoxy resin, the optional autofluorescence glue of fluorophor 442 or fluorescence film, but light-permeable packaging body 440 is formed is not limited to the coated fluorophor 442 of packing colloid 441, light-permeable packaging body 440 is formed and also can be the coated packing colloid 441 of fluorophor 442, another light-permeable packaging body 440 formation can be fluorophor 442 (such as fluorescent material) and mixes with packing colloid 441 (such as silica gel or epoxy resin), light-permeable packaging body 440 also can comprise cast lens 443 further.Moreover electric connector 300 and electric connection plate 500 material include but not limited to FR4.
Although the utility model explains with embodiment, but be skillful in this those skilled in the art and can not make various multi-form change under the utility model spirit and category, above illustrated embodiment is only in order to illustrate the utility model, not be used for limiting the utility model scope, the utility model is not limited to above-mentioned each embodiment person, various change can be carried out in the scope shown in right, and the appropriately combined technological means disclosed respectively in different embodiment and the embodiment obtained, also be included in technical scope of the present utility model, namely all equalizations done according to the utility model right change and modify, all should still belong in patent covering scope of the present utility model, the real requirement having met utility model patent of the utility model, file an application in accordance with the law.
Claims (19)
1. a vehicle LED headlight, is characterized in that comprising:
One body, comprise one and run through groove, a housing, a head end seat and a tail end seat, coated this of this housing runs through groove, and this head end seat is positioned at this and runs through groove one end tool one first openend, and this tail end seat is positioned at this and runs through groove other end tool one second openend;
One LED encapsulation module, be placed in this second openend of this tail end seat, at least comprise a line layer, at least one light-emitting diode chip for backlight unit be electrically connected this line layer, at least one phosphor coated in this at least one light-emitting diode chip for backlight unit on the surface and at least one cast lens this at least one fluorophor coated and this at least one light-emitting diode chip for backlight unit, and adjusted by the surface curvature of this at least one cast lens, make this at least one light-emitting diode chip for backlight unit launch bright dipping tool collimate;
One diaphragm, be positioned at this and run through groove and this second openend being close to this tail end seat, there is pass through aperture, this through hole has one the 3rd openend and one the 4th openend, this at least one cast lens of this LED encapsulation module is placed in the 4th openend, by adjusting this through hole length, injection light is penetrated from this diaphragm, for the light spot shape repairing light shape; And
One optical imaging lens, is positioned at this first openend of this head end seat, forms an accommodation space with the 3rd openend of this diaphragm, and for the light spot shape repairing the light shape penetrated from this diaphragm, adjustment light forms the luminous intensity as size and test position.
2. vehicle LED headlight as claimed in claim 1, it is characterized in that, also comprise at least one collimate lens, be combined to form one first lens group with this at least one cast lens, reduce cover to assigned address for described light-emitting diode chip for backlight unit utilizing emitted light angle.
3. vehicle LED headlight as claimed in claim 1, is characterized in that, also comprise at least one imaging len, be combined to form one second lens group with this optical imaging lens, forms the luminous intensity as test position for reinforcement light.
4. vehicle LED headlight as claimed in claim 1, it is characterized in that, this optical imaging lens comprises aspheric lens, bitoric lens or micro-structural camera lens.
5. vehicle LED headlight as claimed in claim 1, is characterized in that, this at least one cast lens comprises with not separate mode or single separate mode this at least one fluorophor coated and this at least one light-emitting diode chip for backlight unit continuously.
6. vehicle LED headlight as claimed in claim 1, it is characterized in that, these at least one light-emitting diode chip for backlight unit arrangement at least 1 row, often arrange described light-emitting diode chip for backlight unit quantity equal or unequal, and between these at least one cast lens row and row spread geometry comprise parallel, tilt relative, to be inclined upwardly or downward-sloping.
7. vehicle LED headlight as claimed in claim 1, it is characterized in that, this enclosure interior surface comprises black absorption face, white diffusingsurface or mirror reflection surface.
8. vehicle LED headlight as claimed in claim 1, it is characterized in that, this LED encapsulation module also comprises:
One metal substrate, has a relative first surface and a second surface, for heat dissipation characteristics metal material is formed;
One electric connector, is attached on this first surface of this metal substrate, the multiple power part of this electric connector one end tool, and this electric connector offers one engraves hole;
One light emitting diode ceramic package element, for emission of light, this being arranged at this electric connector is engraved in hole, and fits on this first surface of this metal substrate, and this light emitting diode ceramic package element comprises:
One ceramic substrate, tool electrical insulative property and being made up of ceramic material, this line layer is formed on the surface of this ceramic substrate, and this line layer one end also comprises multiple electrode section, this at least one light-emitting diode chip for backlight unit is fixed on the surface of this ceramic substrate, and is electrically connected this line layer; And
One light-permeable packaging body, be formed on the surface of this ceramic substrate, comprise at least one packing colloid, this at least one fluorophor and this at least one cast lens, this at least one cast lens this at least one fluorophor coated, this at least one packing colloid and this at least one light-emitting diode chip for backlight unit; And
One is electrically connected plate, it forms multiple conductive part on the surface, and one end for attaching this line layer of this light emitting diode ceramic package element, and is electrically connected the described electrode section of this line layer, the other end for attaching the described power part of this electric connector, and is electrically connected described power part.
9. vehicle LED headlight as claimed in claim 8, it is characterized in that, this electric connector also comprises at least one recess, and this at least one recess is compassingly set at the periphery that this engraves hole.
10. vehicle LED headlight as claimed in claim 8, it is characterized in that, this electric connector also comprises multiple locating slot, and described locating slot is recessed in these power part both sides, connects for an external power source plug.
11. vehicle LED headlights as claimed in claim 8, it is characterized in that, these at least one light-emitting diode chip for backlight unit arrangement at least 1 row, often arrange described light-emitting diode chip for backlight unit quantity equal or unequal, and between these at least one cast lens row and row spread geometry comprise parallel, tilt relative, to be inclined upwardly or downward-sloping.
12. vehicle LED headlights as claimed in claim 8, it is characterized in that, this at least one fluorophor is formed at this at least one packing colloid on the surface.
13. vehicle LED headlights as claimed in claim 8, is characterized in that, coated this at least one fluorophor coated on this at least one light-emitting diode chip for backlight unit surface of this at least one packing colloid.
14. vehicle LED headlights as claimed in claim 8, is characterized in that, this at least one fluorophor and this at least one packing colloid hybrid shaping coat this at least one light-emitting diode chip for backlight unit on the surface.
15. vehicle LED headlights as claimed in claim 8, it is characterized in that, also comprise a radiating subassembly, include a heat radiation metal substrate and there is one the 3rd relative surface and one the 4th surface, at least one heat pipe and at least one radiating fin, 3rd surface of this heat radiation metal substrate is attached at this second surface of this metal substrate of this LED encapsulation module, this at least one heat pipe comprises an endotherm section and a heat release section, this endotherm section is attached at the 4th surface of this heat radiation metal substrate, and this heat release section is attached at this at least one radiating fin.
16. vehicle LED headlights as claimed in claim 15, it is characterized in that, this metal substrate also includes multiple first perforation, this electric connector also includes multiple second perforation, this heat radiation metal substrate also includes multiple 4th lockhole, multiple retaining element is locked by relative described first perforation, described second perforation described 4th lockhole relative with this heat radiation metal substrate, and described second piercing aperture is more than or equal to described first piercing aperture.
17. vehicle LED headlights as claimed in claim 16, it is characterized in that, this tail end seat also comprises multiple 5th perforation, this heat radiation metal substrate also comprises multiple 6th lockhole, utilizes multiple retaining element to be locked by described 5th perforation described 6th lockhole relative with this heat radiation metal substrate.
18. vehicle LED headlights as claimed in claim 8, it is characterized in that, also comprise at least one collimate lens, be combined to form one first lens group with this at least one cast lens, reduce cover to assigned address for this at least one light-emitting diode chip for backlight unit utilizing emitted light angle.
19. vehicle LED headlights as claimed in claim 8, is characterized in that, also comprise at least one imaging len, be combined to form one second lens group with this optical imaging lens, form the luminous intensity as test position for reinforcement light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520516824.4U CN204885155U (en) | 2014-06-30 | 2015-03-26 | Light emitting diode packaging module |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW103211644 | 2014-06-30 | ||
| TW103211644U TWM498387U (en) | 2014-06-30 | 2014-06-30 | Light emitting diode module package structure having thermal-electric separated function and electrical connection module |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520516824.4U Division CN204885155U (en) | 2014-06-30 | 2015-03-26 | Light emitting diode packaging module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204717541U true CN204717541U (en) | 2015-10-21 |
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Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520173230.8U Withdrawn - After Issue CN204717541U (en) | 2014-06-30 | 2015-03-26 | LED head lamp for vehicle |
| CN201520516824.4U Expired - Fee Related CN204885155U (en) | 2014-06-30 | 2015-03-26 | Light emitting diode packaging module |
| CN201510134560.0A Active CN105202437B (en) | 2014-06-30 | 2015-03-26 | Vehicle light-emitting diode head lamp and light-emitting diode packaging module |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520516824.4U Expired - Fee Related CN204885155U (en) | 2014-06-30 | 2015-03-26 | Light emitting diode packaging module |
| CN201510134560.0A Active CN105202437B (en) | 2014-06-30 | 2015-03-26 | Vehicle light-emitting diode head lamp and light-emitting diode packaging module |
Country Status (2)
| Country | Link |
|---|---|
| CN (3) | CN204717541U (en) |
| TW (1) | TWM498387U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202437A (en) * | 2014-06-30 | 2015-12-30 | 立碁电子工业股份有限公司 | Vehicle light-emitting diode head lamp and light-emitting diode packaging module |
| US20230167831A1 (en) * | 2017-03-28 | 2023-06-01 | Faizan Ahmed | Thermo-electric chiller/heater component methods and systems |
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| FR3056685B1 (en) * | 2016-09-28 | 2021-01-15 | Valeo Vision | MONOBLOC BRACKET FOR LUMINOUS DEVICES WITH MICRO-MIRRORS MATRIX |
| TWI601906B (en) * | 2016-10-26 | 2017-10-11 | LED fixtures | |
| US10260696B2 (en) | 2016-12-22 | 2019-04-16 | Keeper Technology Co., Ltd. | Light-emitting diode module holder |
| CN107316933A (en) * | 2017-07-18 | 2017-11-03 | 中山市圣上光电科技有限公司 | The special LED high beams of high ferro |
| US10066800B1 (en) | 2017-09-21 | 2018-09-04 | Keeper Technology Co., Ltd. | Light-emitting diode fixing apparatus |
| KR102036749B1 (en) * | 2017-12-14 | 2019-10-28 | 에스엘 주식회사 | Lamp for vehicle |
| CN109027958A (en) * | 2018-07-04 | 2018-12-18 | 河海大学常州校区 | A kind of radiator for matrix LED car light |
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| CN101298906B (en) * | 2007-11-30 | 2010-09-08 | 上海小糸车灯有限公司 | Automobile front shining lamp based on double-convex lens |
| DE102010029176A1 (en) * | 2009-10-05 | 2012-12-27 | Automotive Lighting Reutlingen Gmbh | Motor vehicle headlight with a semiconductor light sources, a primary optics and a secondary optics having light module |
| AT511760B1 (en) * | 2011-08-08 | 2013-12-15 | Zizala Lichtsysteme Gmbh | LED LIGHT SOURCE MODULE FOR A LED MOTOR VEHICLE HEADLIGHT AND LED MOTOR VEHICLE HEADLAMP AND HEADLAMP SYSTEM |
| US8878221B2 (en) * | 2011-08-19 | 2014-11-04 | Lg Innotex Co., Ltd. | Light emitting module |
| CN103133997A (en) * | 2011-11-24 | 2013-06-05 | 南昌祥美照明设计有限公司 | Automobile headlamp grading structure and light-emitting diode (LED) automobile headlamp |
| TWI469387B (en) * | 2012-05-16 | 2015-01-11 | Ligitek Electronics Co Ltd | Light-emitting module |
| TWM498387U (en) * | 2014-06-30 | 2015-04-01 | Ligitek Electronics Co Ltd | Light emitting diode module package structure having thermal-electric separated function and electrical connection module |
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2015
- 2015-03-26 CN CN201520173230.8U patent/CN204717541U/en not_active Withdrawn - After Issue
- 2015-03-26 CN CN201520516824.4U patent/CN204885155U/en not_active Expired - Fee Related
- 2015-03-26 CN CN201510134560.0A patent/CN105202437B/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105202437A (en) * | 2014-06-30 | 2015-12-30 | 立碁电子工业股份有限公司 | Vehicle light-emitting diode head lamp and light-emitting diode packaging module |
| US20230167831A1 (en) * | 2017-03-28 | 2023-06-01 | Faizan Ahmed | Thermo-electric chiller/heater component methods and systems |
Also Published As
| Publication number | Publication date |
|---|---|
| CN204885155U (en) | 2015-12-16 |
| CN105202437B (en) | 2018-10-02 |
| TWM498387U (en) | 2015-04-01 |
| CN105202437A (en) | 2015-12-30 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20151021 Effective date of abandoning: 20181002 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20151021 Effective date of abandoning: 20181002 |
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |