JP3186004U - Chip unsealed LED lighting - Google Patents

Abstract

Provided is a chip unsealed LED illumination which can enhance the heat dissipation effect and enhance the practicality of a product.
A heat dissipation member, at least one LED chip, an adhesive layer, a conductive adhesive, and a resin plate are included. The LED chip 4 is installed on the heat dissipation member 3. The adhesive layer 5 covers the periphery of the LED chip 4 and fixes the entire structure. The conductive adhesive 6 forms a line and connects the LED chips 4 in series to supply power. The resin plate 7 is used in place of a frame of a general LED package, and a hole 71 corresponding to the position of the LED chip 4 is provided in the upper part. The hole 71 is filled with a resin containing fluorescent powder 8, and the LED chip. 4 is protected. Thereby, multicolor light or white light can be emitted.
[Selection] Figure 5

Description

The present invention relates to a chip unsealed LED illumination, and more particularly to an LED illumination that can enhance a heat dissipation effect and increase the practicality of a product.

Please refer to FIG. As shown in FIG. 1, in the conventional general LED package structure, the LED package 1 is mainly configured by combining the LED chip 12 with the frame 14 and sealing. Generally, the frame 14 is made of a plastic material or a ceramic material. The LED package 1 is installed or inserted on the printed circuit board 10, and the conductive wire 11 on the printed circuit board 10 and the electrode contact 121 of the LED chip 12 are electrically connected. Thereby, when a power supply is connected to the printed circuit board 10, the LED chip 12 is energized to emit light.

As shown in FIG. 1, the LED chip 12 can emit light by the conventional LED package structure, but the contact area between the LED package 1 and the printed circuit board 10 is limited, and the periphery of the LED chip 12 is Since it is covered with the frame 14, the heat dissipation effect is extremely inferior. Thus, an improved LED package structure as shown in FIG. 2 has been devised. In the improved LED package structure shown in FIG. 2, the heat conductive adhesive 21 is provided on the heat conductive material 20, and the LED chip 22 is installed on the heat conductive adhesive 21. A transparent material 23 is coated on the LED chip 22. A metal line 24 is provided on the bottom edge of the transparent material 23. Although this type of conventional LED package structure has an excellent heat dissipation effect, the LED chip 22 is oxidized because the resin is not sealed around the LED chip 22 and is directly exposed to the air. Product life is likely to be shortened. In addition, since the transparent material 23 is solid and covers the LED chip 22, the volume and thickness of the product increase, and there is no space for installing the fluorescent resin. For this reason, this type of conventional LED package structure can only emit monochromatic light (for example, blue light), which is inferior in practicality of the product. Further, since the metal line 24 is installed above the LED chip 22, the light emitted from the LED chip 22 is easily shielded by the metal line 24. That is, the prior art has been required to be improved because it is difficult to implement or commercialize.

JP 2013-26207 A

An object of the present invention is to provide a chip-unsealed LED illumination that can solve the drawbacks of the conventional LED package structure that has poor heat dissipation and monochromatic light emission, and that limits the practicality of the product. There is.

In order to solve the above-described problems, the unsealed LED lighting of the present invention includes a heat dissipation member, at least one LED chip, an adhesive layer, and a resin plate. The LED chip is installed above the heat dissipation member. The adhesive layer is installed above the heat dissipation member. The adhesive layer covers the periphery of the LED chip. The resin plate is installed above the adhesive layer. On the resin plate, at least one hole corresponding to the position of the LED chip is provided. The hole is filled with a fluorescent resin.

In the chip unsealed LED illumination of the present invention, an unsealed LED chip (that is, a die state) is provided above the heat radiating member, so that heat generated from the LED chip is directly radiated through the heat radiating member. Thereby, an extremely excellent heat dissipation effect can be realized. Moreover, since a hole is provided in the resin plate and the fluorescent resin is directly filled in the hole, the LED chip and the light emitting resin are mixed, and a plurality of types of color light or white light are emitted. That is, according to the present invention, the heat dissipation effect of LED lighting can be increased, the volume of the product can be reduced, and the practicality of the product can be increased.

It is sectional drawing which shows the conventional LED package structure. It is sectional drawing which shows another conventional LED package structure. It is a disassembled perspective view which shows the state by which the resin plate of the chip | tip unsealed LED illumination by 1st Embodiment of this invention is not filled with the fluorescent resin. It is a disassembled perspective view which shows the state with which the resin plate of the chip | tip unsealed LED illumination by 1st Embodiment of this invention was filled with the fluorescent resin. 1 is a perspective view showing a chip unsealed LED illumination according to a first embodiment of the present invention. It is sectional drawing which shows the chip | tip unsealed LED illumination by 1st Embodiment of this invention. It is sectional drawing which shows the chip | tip unsealed LED device by 2nd Embodiment of this invention. It is sectional drawing which shows the state which peels the base material of FIG. It is sectional drawing which shows the state after completing the operation | movement of FIG.

(First embodiment)
Please refer to FIG. 4 and FIG. As shown in FIGS. 4 and 5, the chip unsealed LED illumination of the present invention includes a heat radiating member 3, at least one LED chip 4, an adhesive layer 5, and a resin plate 7.

The heat radiating member 3 may be a heat radiating fin. Here, since the chip unsealed LED illumination according to the first embodiment has the heat dissipating member 3, it is particularly applied to lighting fixtures such as general light bulbs and lamp tubes.

At least one LED chip 4 is installed above the heat dissipation member 3.

The adhesive layer 5 is installed above the heat radiating member 3. As shown in FIG. 6, the adhesive layer 5 covers the periphery of the LED chip 4. Thereby, the adhesive layer 5 can fix the LED chip 4 on the heat dissipation member 3. The light emitting surface 41 and the electrode end 42 of the LED chip 4 are exposed outside the adhesive layer 5. Each electrode end 42 of the LED chip 4 is connected to the conductive adhesive 6. The conductive adhesive 6 may be colloidal silver. Thus, when the conductive adhesive 6 is connected to an external power source, the LED chip 4 can be energized to emit light. When there are two or more LED chips 4, electrode ends 42 (that is, PN electrodes) between adjacent LED chips 4 are connected in series via the conductive adhesive 6. The detailed connection method of each conductive adhesive 6 is a conventional technique and does not show the technical features of the present invention, and therefore will not be described here.

The resin plate 7 is installed above the adhesive layer 5. The resin plate 7 has a flat plate shape. As shown in FIG. 3, at least one hole 71 corresponding to the position of the LED chip 4 is provided on the resin plate 7. Thereby, the resin plate 7 can be used in place of the frame 14 of the conventional LED package 1. The hole 71 is located directly above the LED chip 4. The hole 71 is filled with a fluorescent resin 8 (a resin containing fluorescent powder) (see FIGS. 4 and 5).

Please refer to FIG. 3 and FIG. As shown in FIGS. 3 and 6, in the present invention, since the resin plate 7 is used instead of the frame 14 of the conventional LED package 1, the unsealed LED chip 4 (that is, the die) is disposed above the heat dissipation member 3. The LED chip 4 can be covered and fixed by the adhesive layer 5. That is, according to the present invention, the LED chip 12 need not be sealed first to form the LED package 1 as in the prior art, and the LED chip 4 is directly radiated through the heat radiating member 3. Thereby, an extremely excellent heat dissipation effect can be realized. Further, since the hole 71 is provided in the resin plate 7 and the fluorescent resin 8 is directly filled in the hole 71, the thickness and volume of the resin plate 7 and the space of the hole 71 are utilized to the maximum, and the LED chip. 4 and the fluorescent resin 8 can be mixed and various kinds of color light or white light can be emitted. That is, according to the present invention, the heat dissipation effect can be enhanced, the volume of the product can be reduced, and the practicality of the product can be enhanced. Further, since the periphery and the upper part of the LED chip 4 are in a sealed state and do not come into direct contact with air, it is possible to prevent or reduce the LED chip 4 from being oxidized and damaged, and to increase the service life of the product. In addition, the present invention uses the conductive adhesive 6 instead of the conventional metal line 24, and the LED chips 4 are connected in series and supplied with power, thereby simplifying the manufacturing process and increasing the processing efficiency. be able to.

(Second Embodiment)
Please refer to FIG. FIG. 7 is a cross-sectional view illustrating a chip unsealed LED device according to a second embodiment of the present invention. The second embodiment of the present invention is different from the first embodiment in that the heat radiating member 3 is not included. The LED unsealed LED illumination according to the second embodiment can be further reduced in overall volume and thickness, and thus is particularly applied to the use of a backlight of a liquid crystal display device. In this embodiment, since the heat dissipation member 3 is not included and the adhesive layer 5 and the LED chip 4 are attached and cured, the LED chip 4 is first manufactured when manufacturing the unsealed LED device of this embodiment. A base member 9 provided below the adhesive layer 5 is prepared. The base member 9 includes an adhesive release layer 91 and a resin plate layer 92 fixed below the release layer 91. The release layer 91 may be a silicon layer, and the resin plate layer 92 may be a polyethylene terephthalate (PET) layer. As a result, the LED chip 4 and the adhesive layer 5 can be attached and cured to the base member 9. As shown in FIGS. 8 and 9, when the chip unsealed LED device according to the second embodiment of the present invention is mounted, the base member 9 may be removed. In the present embodiment, the thickness and volume are further reduced as compared with the first embodiment, and the heat generated from the LED chip 4 is directly radiated into the air, so that the heat radiation effect can be further enhanced.

DESCRIPTION OF SYMBOLS 1 LED package 10 Printed circuit board 11 Conductor 12 LED chip 121 Electrode contact 14 Frame 20 Heat conducting material 21 Heat conducting adhesive 22 LED chip 23 Transparent material 24 Metal line 3 Heat radiation member 4 LED chip 41 Light emitting surface 42 Electrode end 5 Adhesive layer 6 Conductivity Adhesive 7 Resin plate 71 Hole 8 Fluorescent resin 9 Base member 91 Peeling layer 92 Resin plate layer

Claims (4)

Chip unsealed LED lighting comprising a heat dissipation member, at least one LED chip, an adhesive layer and a resin plate,
The LED chip is installed above the heat dissipation member,
The adhesive layer is installed above the heat dissipation member, the adhesive layer covers the periphery of the LED chip, the light emitting surface and the electrode end of the LED chip are exposed outside the adhesive layer, Each electrode end of the LED chip is connected to a conductive adhesive,
The resin plate is installed above the adhesive layer, and at least one hole corresponding to the position of the LED chip is provided on the resin plate, and the hole is filled with a fluorescent resin. A chip non-sealed LED illumination.   The chip unsealed LED illumination according to claim 1, further comprising a heat dissipating member on which the adhesive layer and the LED chip are respectively installed. A base member provided below the LED chip and the adhesive layer;
2. The chip-unsealed LED illumination according to claim 1, wherein the base member includes a release layer having temporary adhesiveness, and a resin plate layer fixed below the release layer.   4. The chip-unsealed LED illumination according to claim 3, wherein the release layer is a silicon layer, and the resin plate layer is a polyethylene terephthalate (PET) layer.

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