TWI553384B - Back light - Google Patents

Description

Backlight module

The invention relates to a backlight module, in particular to a light-emitting diode backlight module.

A conventional backlight module includes a circuit board and a plurality of spaced-apart LED packages mounted on one side of the circuit board. Each of the light emitting diode package structures includes two electrodes arranged at intervals and arranged side by side, a light emitting diode chip fixed on an electrode and electrically connected to the two electrodes, fixed on the two electrodes and enclosing the light emitting diode An inner hollow frame of the polar body wafer and a phosphor powder layer housed in the frame and enclosing the light emitting diode chip. The ends of the two electrodes are soldered to the conductive contacts of the circuit board by solder paste. Since the backlight module of the structure protrudes directly from the circuit board, the backlight module has a large height in the vertical direction, which is disadvantageous for the thin design and heat dissipation of the backlight module. inconvenient.

In view of this, it is necessary to provide a backlight module having a simple structure and a small thickness.

A backlight module includes a circuit board, a light emitting diode chip, and a frame enclosing a light emitting diode chip, wherein the light emitting diode chip is attached to a top surface of the circuit board, and the circuit board is recessed The bottom end of the frame is received in the receiving slot to be fixed to the circuit board.

In the present invention, since the light-emitting diode wafer is directly attached to the top surface of the circuit board and the bottom end of the frame surrounding the light-emitting diode chip is received in the receiving groove, the back The height of the optical module in the vertical direction is reduced relative to the conventional backlight module, and can meet the requirements for thinning.

10‧‧‧ boards

11‧‧‧Electrical contacts

12‧‧‧ housing trough

20‧‧‧ frame

21‧‧‧reflective layer

30‧‧‧Light Emitter Wafer

31‧‧‧Metal wire

40‧‧‧colloid

50‧‧‧Flame powder layer

100‧‧‧Backlight module

FIG. 1 is a schematic view of a combination of backlight modules of the present invention.

Referring to FIG. 1 , a backlight module 100 of the present invention includes a circuit board 10 , a plurality of hollow frames 20 fixed on the circuit board 10 , and is fixed on the circuit board 10 and respectively received in each frame 20 . The inner light emitting diode chip 30, the colloid 40 filled in the frame body 20 and enclosing the light emitting diode chip 30, and a phosphor powder layer 50 fixed to the top end of the frame body 20.

The circuit board 10 is an elongated plate body having a flat top surface and a bottom surface parallel to the top surface. A circuit (not shown) and a conductive contact 11 electrically connected to the circuit are formed on the top surface. These conductive contacts 11 are convexly outwardly spaced from the top surface and spaced apart. Each of the light emitting diodes has two metal wires 31. The LEDs 30 are attached to the top surface of the circuit board 10 and the two metal wires 31 are electrically connected to the two conductive contacts 11 respectively. The height of the conductive contacts 11 protruding upward from the top surface is smaller than the height of the LED array 30 protruding upward from the top surface. The plurality of receiving slots 12 are recessed from the top surface toward the bottom surface for receiving the frame 20, thereby reducing the height of the backlight module 100 in the vertical direction.

Each of the frames 20 is an inner annular body, and the bottom end is received in the corresponding receiving groove 12, and the top end is located above the top surface of the LED body 30. After the frames 20 are mounted on the circuit board 10, the top ends thereof are parallel and coplanar. A portion of the inner surface of each of the frames 20 that is beyond the top surface of the circuit board 10 is coated with a luminescent material, thereby forming a reflective layer 21 for reflecting the light emitted by the illuminating diode chip 30, thereby improving the illuminating diode chip 30. Out Light efficiency. The LED wafer 30 housed in the corresponding housing 20 is located in the middle of the housing 20. In the present embodiment, the outer wall faces of the frames 20 are connected to each other such that the frames 20 are joined together. It can be understood that in other embodiments, the frames 20 can also be spaced apart from each other.

The colloid 40 fills the receiving groove 12 and its top end is coplanar with the top end of the frame 20. The colloid 40 is a transparent or translucent colloid 40 in which the phosphor powder is uniformly mixed.

The phosphor layer 50 is a sheet having a uniform thickness, is fixed to the top end of the frame 20 and completely covers the LED wafer 30, and its bottom surface is spaced apart from the top surface of the LED wafer 30.

When the backlight module 100 is used, the light emitted by the LED chip 30 passes through the colloid 40 and is then directed toward the phosphor layer 50 at the top end thereof to excite the phosphor powder in the phosphor layer 50 to emit white light.

In the present invention, since the light-emitting diode wafer 30 is directly attached to the top surface of the circuit board 10 and the bottom end of the frame 20 surrounding the light-emitting diode wafer 30 is housed in a recess formed from the top surface of the circuit board 10 In the receiving slot 12, the height of the backlight module 100 in the vertical direction is reduced relative to the conventional backlight module 100, and the thinning requirement can be satisfied.

Further, in the present invention, the phosphor layer 50 having a uniform thickness is located above the LED array 30 and completely covers the LED wafer 30, and thus, the LED chip 30 is emitted. The light can simultaneously excite the phosphor powder layer 50 to obtain white light of uniform color temperature, thereby avoiding the occurrence of color temperature drift.

10‧‧‧ boards

11‧‧‧Electrical contacts

12‧‧‧ housing trough

20‧‧‧ frame

21‧‧‧reflective layer

30‧‧‧Light Emitter Wafer

31‧‧‧Metal wire

40‧‧‧colloid

50‧‧‧Flame powder layer

100‧‧‧Backlight module

Claims (9)

A backlight module includes a circuit board, a light emitting diode chip, and a frame enclosing a light emitting diode chip, wherein the light emitting diode chip is attached to a top surface of the circuit board, and the circuit The bottom of the frame is formed in the receiving groove to be fixed on the circuit board, and the backlight module further includes filling the receiving groove and wrapping the light emitting diode a colloid within the body wafer, the top surface of the colloid being flush with the top surface of the frame. The backlight module of claim 1, wherein the receiving groove is recessed from a top surface of the circuit board toward a bottom surface. The backlight module of claim 1, wherein the light emitting diode chip is located in a middle portion of the frame. The backlight module of claim 1, wherein the colloid is a transparent or transparent plate. The backlight module of claim 1, wherein the gel body is uniformly mixed with phosphor powder. The backlight module of claim 1, further comprising a phosphor layer fixed to the top of the frame away from the circuit board. The backlight module of claim 6, wherein the phosphor powder has a sheet thickness of the same thickness. The backlight module of claim 1, wherein an inner surface of the frame is formed with an emissive layer for reflecting light emitted by the light emitting diode chip. The backlight module of claim 1, wherein the circuit board is provided with a plurality of light emitting diode chips and a frame surrounding the light emitting diode chips, and the outer casings of the light emitting diodes The sides of the wall are connected to each other so that the frames are joined together.