TWI523271B - Plug-in light-emitting unit and light-emitting device - Google Patents

Description

Plug-in type light emitting unit and light emitting device

The present invention relates to a plug-in type light-emitting unit, and more particularly to a light-emitting device.

Among luminaires that use light-emitting diodes as illumination sources (eg, bulbs, light bars, or flat lamps, etc.), the LED packages or wafers are typically adhered or soldered directly to the panel. Here, the heat dissipation effect of the adhesive substance between the light-emitting diode wafer and the light board often determines the limit of the light-emitting power of the light-emitting diode. In addition, in order to enable a luminaire using a light-emitting diode to have a larger light-emitting angle (that is, to achieve a full-circumference effect), the luminaire must also increase the light-emitting angle through a special optical design of the outer casing or by adding a lens, thereby Causes increased manufacturing costs. Furthermore, in the case where a plurality of light emitting diode packages or wafers are directly adhered or soldered to the light board, if one of the light emitting diode packages or the wafer is damaged, the overall light of the light is emitted. The brightness will decrease. At this time, since all the LED packages or wafers are directly adhered or soldered to the lamp board, and the individual LED package or wafer cannot be replaced, the user can only replace the entire lamp. Replace it, thus causing unnecessary waste.

In view of this, the object of the present invention is to provide a lighting device It can simultaneously improve the luminous power, achieve the full-circumference effect and reduce the cost of use.

The present invention basically employs the features detailed below in order to solve the above problems.

An embodiment of the present invention provides a plug-in type light emitting unit including a die plate including a first substrate, a second substrate, and an insulating layer, and the insulating layer is disposed adjacent to the first and second substrates. The first and second substrates can be spliced into the solid crystal plate and insulated from each other, and the first and second substrates respectively include a first contact pad and a second contact pad; a first electrode pin Extending from the first substrate and electrically connected to the first contact pad; a second electrode pin extending from the second substrate and electrically connected to the second contact pad; and at least one The light-emitting element is connected to the first and second substrates of the solid crystal board, and is electrically connected to the first and second contact pads, respectively.

Another embodiment of the present invention provides a light emitting device including a circuit board including a driving circuit, and at least one plug-in type light emitting unit, the plug-in type light emitting unit includes: a solid crystal plate a first substrate, a second substrate, and an insulating layer, and the insulating layer is disposed adjacent to the first and second substrates, so that the first and second substrates can be spliced into the solid crystal plate and Insulating each other, and the first and second substrates respectively include a first contact pad and a second contact pad; a first electrode pin extending from the first substrate and electrically connected to the first contact a second electrode pin extending from the second substrate and electrically connected to the second contact pad, wherein the plug-in light-emitting unit is coupled to the driving circuit by the first and second electrode pins Electrical connection And the at least one light-emitting element is connected to the first and second substrates of the solid crystal plate, and electrically connected to the first and second contact pads respectively.

According to an embodiment of the present invention, the light emitting device includes a light emitting diode chip having a first type electrode and a second type electrode, and the first and second type electrodes are electrically connected to the first and the second Two contact pads.

According to an embodiment of the invention, the LED chip is a flip-chip LED, and the first and second electrodes are respectively separated from the first by a first solder and a second solder. The second contact pad is combined.

According to an embodiment of the invention, the light emitting diode chip is a horizontal light emitting diode chip.

According to an embodiment of the invention, the plug-in type light-emitting unit or the light-emitting device further includes a first wire and a second wire, which are respectively wired from the first and second electrodes to the first and second contact pads.

According to an embodiment of the invention, the illuminating device further includes a casing and a transparent lampshade, wherein the transparent lampshade is connected to the casing and defines an accommodating space, so that the circuit board and the plug-in illuminating unit are covered In the accommodating space.

According to an embodiment of the invention, the plug-in type light-emitting unit or the light-emitting device further comprises an encapsulant that completely or partially covers the first and second substrate surfaces.

According to an embodiment of the invention, the encapsulant further comprises a plurality of phosphors.

According to an embodiment of the invention, the surface of the light-emitting diode wafer is coated with a phosphor layer.

According to an embodiment of the invention, the die plate, the first and second electrode pins are made of a metal material.

According to an embodiment of the present invention, the first and second electrode pins are made of a transparent non-conductive material, and the first and second electrode pins further comprise an electrical connection. The third wire of the contact pad and the fourth wire electrically connected to the second contact pad are respectively exposed at the ends of the first and second electrode pins.

According to an embodiment of the invention, the surface of the die plate, the first electrode pin and the second electrode pin further comprises a reflective layer.

According to an embodiment of the present invention, the light-emitting device further includes a light guide plate having an edge of the light-incident surface, and the light-emitting direction of the plug-in light-emitting unit faces the light-incident surface, so that the light passing through the light-incident surface can be The light guide plate is guided to be emitted in a predetermined direction.

The above described objects, features and advantages of the present invention will become more apparent from the description of the appended claims.

100, 100'‧‧‧ plug-in lighting unit

110‧‧‧Solid plate

111‧‧‧First substrate

111a‧‧‧First contact pad

112‧‧‧second substrate

112a‧‧‧Second contact pad

113‧‧‧Insulation

121‧‧‧First electrode pin

121a‧‧‧ third conductor

122‧‧‧Second electrode pins

122a‧‧‧fourth wire

130, 130'‧‧‧Lighting elements

131‧‧‧first type electrode

132‧‧‧Second type electrode

140‧‧‧Package colloid

151‧‧‧First wire

152‧‧‧second wire

160‧‧‧reflective layer

201, 202, 203‧‧‧ illuminating devices

210‧‧‧Shell

220‧‧‧Transparent lampshade

230‧‧‧ boards

231‧‧‧ drive circuit

240‧‧‧Light guide plate

241‧‧‧Into the glossy surface

S‧‧‧ accommodating space

1A and 1D are perspective views showing a plug-in type light-emitting unit according to an embodiment of the present invention; and FIG. 1B is a perspective view showing a part of a plug-in type light-emitting unit according to FIG. 1A; FIG. 1C is a view showing A perspective view of another portion of the plug-in type light-emitting unit according to FIG. 1A; FIGS. 2A and 2C show a plug-in type of another embodiment of the present invention 3B is a perspective view showing a part of the structure of the plug-in type light-emitting unit according to FIG. 2A; and FIG. 3 is a perspective view showing a part of the structure of the plug-in type light-emitting unit according to still another embodiment of the present invention. Figure 4 is a perspective view showing a light-emitting device to which the plug-in type light-emitting unit of the present invention is applied; Figure 5 is a perspective view showing another light-emitting device to which the plug-in type light-emitting unit of the present invention is applied; and Figure 6 is a view showing A perspective view of still another light-emitting device to which the plug-in type light-emitting unit of the present invention is applied.

The preferred embodiment of the invention is described in conjunction with the drawings.

The above and other technical contents, features and advantages of the present invention will be apparent from the following detailed description of the preferred embodiments. The directional terms mentioned in the following embodiments, such as up, down, left, right, front or back, etc., are only directions referring to the additional drawings. Therefore, the directional terminology used is for the purpose of illustration and not limitation.

Please refer to FIG. 1A and FIG. 1D, which are perspective views showing a plug-in type light-emitting unit 100 according to an embodiment of the present invention. The plug-in type light emitting unit 100 mainly includes a solid crystal plate 110, a first electrode pin 121, a second electrode pin 122, at least one light emitting element 130, and an encapsulant 140.

As shown in FIG. 1A, FIG. 1B, FIG. 1C and FIG. 1D, the die plate 110 includes a first substrate 111, a second substrate 112, and an insulating layer 113. Here, the insulating layer 113 is disposed adjacent to the first substrate 111 and the second substrate 112 such that the first substrate 111 and the second substrate 112 can be spliced into the metal plate 110 and insulated from each other. In addition, as shown in FIG. 1B and FIG. 1C, the first substrate 111 and the second substrate 112 respectively include a first contact pad 111a and a second contact pad 112a.

The first electrode pin 121 extends from the first substrate 111, and the first electrode pin 121 is electrically connected to the first contact pad 111a.

The second electrode pin 122 extends from the second substrate 112, and the second electrode pin 122 is electrically connected to the second contact pad 112a.

As shown in FIG. 1C, the light-emitting element 130 is connected across the first substrate 111 and the second substrate 112 on the metal plate 110, and the light-emitting elements 130 are electrically connected to the first contact pads 111a and the second, respectively. Contact pad 112a. Here, the light-emitting element 130 may include a light-emitting diode wafer, and has a first-type electrode 131 and a second-type electrode 132. The first type electrode 131 and the second type electrode 132 are electrically connected to the first contact pad 111a and the second contact pad 112a, respectively. Further, in the present embodiment, the light-emitting diode chip is a flip-chip light-emitting diode wafer. As described above, the flip-chip LED chip is such that the first electrode 131 and the second electrode 132 are in contact with the first contact pad 111a and the second electrode, respectively, by a first solder and a second solder. The pads 112a are joined. In addition, in the embodiment, the surface of the light-emitting element 130 or the light-emitting diode wafer may be selectively coated with a phosphor layer.

As shown in FIG. 1A, the encapsulant 140 partially covers the surfaces of the first substrate 111 and the second substrate 112. Here, the plurality of phosphors may be selectively included in the encapsulant 140.

In addition, as shown in FIG. 1D, the encapsulant 140 may completely cover the surfaces of the first substrate 111 and the second substrate 112. Similarly, in this embodiment, the phosphor powder may be coated on the surface of the light-emitting element 130 or the light-emitting diode wafer, or the phosphor powder may be distributed in the encapsulant 140, or the phosphor powder may be coated on the surface. The outer surface or inner surface of the encapsulant 140 is encapsulated.

In addition, in the embodiment shown in FIGS. 1A and 1D, the die plate 110, the first electrode pin 121, and the second electrode pin 122 are made of a metal material (for example, aluminum, copper, etc.). The surface of the die plate 110, the first electrode pin 121, and the second electrode pin 122 may further include a reflective layer 160.

Referring to Figures 2A and 2C, there is shown a perspective view of a plug-in type light-emitting unit 100' according to another embodiment of the present invention. The plug-in type light emitting unit 100 ′ also includes a solid crystal plate 110 , a first electrode pin 121 , a second electrode pin 122 , at least one light emitting element 130 ′, an encapsulant 140 , a first wire 151 and a second Wire 152.

As shown in FIG. 2A, FIG. 2B, and FIG. 2C, the die plate 110 includes a first substrate 111, a second substrate 112, and an insulating layer 113. Here, the insulating layer 113 is disposed adjacent to the first substrate 111 and the second substrate 112 such that the first substrate 111 and the second substrate 112 can be spliced into the metal plate 110 and insulated from each other. In addition, as shown in FIG. 2B, the first substrate 111 and the second substrate 112 respectively include a first contact pad 111a and a second contact pad 112a.

The first electrode pin 121 extends from the first substrate 111, and the first electrode pin 121 is electrically connected to the first contact pad 111a.

The second electrode pin 122 extends from the second substrate 112, and the second electrode pin 122 is electrically connected to the second contact pad 112a.

The light-emitting element 130' is connected across the first substrate 111 and the second substrate 112 on the metal plate 110, and the light-emitting elements 130' are electrically connected to the first contact pad 111a and the second contact pad 112a, respectively. Here, the light-emitting element 130 may include a light-emitting diode wafer, and has a first-type electrode 131 and a second-type electrode 132. The first type electrode 131 and the second type electrode 132 are electrically connected to the first contact pad 111a and the second contact pad 112a, respectively. Further, in the present embodiment, the light emitting diode chip is a horizontal light emitting diode chip. As described above, the first conductive line 151 and the second conductive line 152 are respectively routed from the first type electrode 131 and the second type electrode 132 to the first contact pad 111a and the second contact pad 112a, and the horizontal light emitting diode chip is The first contact pad 111a and the second contact pad 112a may be combined with each other. Similarly, in the present embodiment, the surface of the light-emitting element 130' or the light-emitting diode wafer may be selectively coated with a phosphor layer.

As shown in FIG. 2A, the encapsulant 140 partially covers the surfaces of the first substrate 111 and the second substrate 112. Here, the plurality of phosphors may be selectively included in the encapsulant 140.

In addition, as shown in FIG. 2C, the encapsulant 140 may completely cover the surfaces of the first substrate 111 and the second substrate 112. Similarly, in this embodiment, the phosphor powder may be coated on the surface of the light-emitting element 130 or the light-emitting diode wafer, or the phosphor powder may be distributed in the encapsulant 140, or the phosphor powder may be coated on the surface. The outer surface or inner surface of the encapsulant 140 is encapsulated.

In addition, in the embodiments shown in FIGS. 2A and 2C, the die plate 110, the first electrode pin 121, and the second electrode pin 122 are made of a metal material (for example, aluminum, copper, etc.). The surface of the die plate 110, the first electrode pin 121, and the second electrode pin 122 may further include a reflective layer 160.

Further, in the embodiments shown in FIGS. 1A, 1D, 2A, and 2C, the die plate 110, the first electrode pins 121, and the second electrode pins 122 may be made of a transparent non-conductive material. Made of materials. In this regard, as shown in FIG. 3, when the solid crystal board 110, the first electrode pin 121, and the second electrode pin 122 are made of a transparent non-conductive material, the first electrode pin 121 and the second electrode pin 122 are respectively The third wire 121a electrically connected to the first contact pad 111a and the fourth wire 122a electrically connected to the second contact pad 112a are included, and the third wire 121a and the fourth wire 122a are respectively disposed on the first electrode pin 121 and The end of the second electrode pin 122 is exposed.

Fig. 4 is a perspective view showing a light-emitting device 201 to which the plug-in type light-emitting unit 100 (or 100') of the present invention is applied. The illuminating device 201 is a ball bulb type, and mainly includes a housing 210, a transparent lamp cover 220, a circuit board 230, and a plug-in illuminating unit 100. As shown in FIG. 1A or FIG. 1C, the plug-in type light-emitting unit 100' is as shown in FIG. 2A or FIG. 2C.

The transparent lamp cover 220 is coupled to the housing 210 and defines an accommodation space S.

The circuit board 230 includes a drive circuit 231.

The plug-in type light emitting unit 100 is inserted on the circuit board 230. In more detail, the plug-in type light-emitting unit 100 is electrically connected to the driving circuit 231 of the circuit board 230 by the first electrode pin 121 and the second electrode pin 122, thereby enabling the plug-in type light-emitting unit 100 to obtain operation. Electricity.

In addition, the circuit board 230 and the plug-in type light emitting unit 100 are covered in the accommodating space S.

Fig. 5 is a perspective view showing another light-emitting device 202 to which the plug-in type light-emitting unit 100 (or 100') of the present invention is applied. Here, the light-emitting device 202 is of a type of light-emitting light bar, and mainly includes a circuit board 230 and a plurality of plug-in light-emitting units 100.

Similarly, circuit board 230 includes a drive circuit 231.

A plurality of plug-in type light emitting units 100 are inserted on the circuit board 230. In more detail, each of the plug-in type light-emitting units 100 is electrically connected to the driving circuit 231 of the circuit board 230 by the first electrode pin 121 and the second electrode pin 122, so that each of the plug-in type light-emitting units 100 can be made. Get the power you need to operate.

Fig. 6 is a perspective view showing still another light-emitting device 203 to which the plug-in type light-emitting unit 100 (or 100') of the present invention is applied. Here, the light-emitting device 203 is applied to a panel lamp, and mainly includes a circuit board 230, a plurality of plug-in type light-emitting units 100 or 100', and a light guide plate 240.

Similarly, circuit board 230 includes a drive circuit 231.

A plurality of plug-in lighting units 100 or 100' are interposed on the circuit board 230. In more detail, each of the plug-in type light-emitting units 100 or 100' is electrically connected to the driving circuit 231 of the circuit board 230 by the first electrode pin and the second electrode pin, thereby enabling each of the plug-in type light-emitting units. 100 or 100' to get the power needed for operation.

The light guide plate 240 is adjacent to the circuit board 230 and a plurality of plug-in type light-emitting units 100 or 100'. Here, one edge of the light guide plate 240 is a light incident surface 241, and the light exiting direction of the plurality of plug-in light emitting units 100 or 100' faces the light incident surface 241, so that the light incident through the light incident surface 241 can be made. Can be guided by the light guide plate 240 A predetermined direction is emitted.

In summary, according to the plug-in type light-emitting unit or the light-emitting device (1A-6) disclosed in the foregoing embodiments, the present invention mainly "cross-connects" the light-emitting element 130/130' to the solid crystal board 110. The first and second substrates 111 and 112 are electrically connected to the first and second contact pads 111a and 112a, respectively, wherein the light-emitting elements 130/130' are located on the "side" of the solid plate 110, and the side is substantially Parallel to the extending direction of the first and second electrode pins 121, 122, thereby making the plug-in type lighting unit or the light-emitting device disclosed in the present invention have the following advantages. First, since the plug-in type light-emitting unit is not directly adhered or soldered to the light-emitting device, the light-emitting power of the light-emitting device can be improved. Secondly, the plug-in type light-emitting unit or the light-emitting device can achieve an effect of having a larger light-emitting angle (or full-period light) without increasing the manufacturing cost. Furthermore, the individual plug-in type light-emitting units can be easily removed from the light-emitting device, thereby saving the use cost.

Although the present invention has been disclosed in its preferred embodiments, it is not intended to limit the scope of the invention, and those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the invention. Therefore, the scope of the invention is defined by the scope of the appended claims.

100‧‧‧Plug-in lighting unit

110‧‧‧Solid plate

111‧‧‧First substrate

112‧‧‧second substrate

113‧‧‧Insulation

121‧‧‧First electrode pin

122‧‧‧Second electrode pins

130‧‧‧Lighting elements

140‧‧‧Package colloid

160‧‧‧reflective layer

Claims (24)

The invention relates to a plug-in type light-emitting unit, comprising: a solid crystal plate, comprising a first substrate, a second substrate and an insulating layer, wherein the insulating layer is disposed adjacent to the first and second substrates, so that the first The second substrate may be spliced into the solid crystal plate and insulated from each other, and the first and second substrates respectively include a first contact pad and a second contact pad; a first electrode pin extending from the first substrate And electrically connected to the first contact pad; a second electrode pin extending from the second substrate and electrically connected to the second contact pad; and at least one light emitting element connected across the On the first and second substrates of the die plate, and electrically connected to the first and second contact pads respectively, wherein the light emitting element is located at one side of the solid plate, and the side is substantially parallel to the first 1. The direction in which the second electrode pins extend. The plug-in type light-emitting unit of claim 1, wherein the light-emitting element comprises a light-emitting diode chip having a first type electrode and a second type electrode, and the first and second type electrodes Electrically connected to the first and second contact pads, respectively. The plug-in type light-emitting unit of claim 2, wherein the light-emitting diode chip is a flip-chip light-emitting diode chip, and the first one is made by a first solder and a second solder. The second type electrode is combined with the first and second contact pads, respectively. The plug-in type light-emitting unit of claim 2, wherein the light-emitting diode chip is a horizontal light-emitting diode chip. The plug-in type light-emitting unit of claim 4, further comprising a first wire and a second wire, which are respectively wired from the first and second electrodes to the first and second contact pads. The plug-in type light-emitting unit according to any one of claims 1 to 5, further comprising an encapsulant that completely or partially covers the first and second substrate surfaces. The plug-in type light-emitting unit of claim 6, wherein the package body further comprises a plurality of phosphors. The plug-in type light-emitting unit of claim 6, wherein the surface of the light-emitting diode wafer is coated with a phosphor layer. The plug-in type light-emitting unit of claim 1, wherein the die-bonding plate, the first and second electrode pins are made of a metal material. The plug-in type light-emitting unit of claim 1, wherein the solid crystal plate, the first and second electrode pins are made of a transparent non-conductive material, and the first and second electrode pins are Further comprising a third wire electrically connected to the first contact pad and a fourth wire electrically connected to the second contact pad, and respectively exposed at the ends of the first and second electrode pins. The plug-in type light-emitting unit according to any one of claims 9 to 10, wherein the surface of the solid crystal plate, the first electrode pin and the second electrode pin further comprises a reflective layer. A light-emitting device includes: a circuit board including a driving circuit; and at least one plug-in type light-emitting unit, the plug-in type light-emitting unit includes: a die plate includes a first substrate, a second substrate, and an insulating layer, and the insulating layer is disposed adjacent to the first and second substrates, so that the first and second substrates can be spliced into the The first and second substrates respectively include a first contact pad and a second contact pad; a first electrode pin extending from the first substrate and electrically connected to a first contact pad; a second electrode pin extending from the second substrate and electrically connected to the second contact pad, wherein the plug-in light-emitting unit is configured by the first electrode pin and the first The two electrode pins are electrically connected to the driving circuit; and the at least one light emitting element is connected to the first and second substrates of the solid crystal plate, and electrically connected to the first and second contact pads respectively. The light emitting element is located on one side of the solid crystal plate, and the side surface is substantially parallel to the extending direction of the first and second electrode pins. The illuminating device of claim 12, wherein the illuminating element comprises a light emitting diode chip having a first type electrode and a second type electrode, and the first and second type electrodes are respectively electrically Optionally connected to the first and second contact pads. The light-emitting device of claim 13, wherein the light-emitting diode chip is a flip-chip light-emitting diode chip, and the first and the first solder are made by a first solder and a second solder. A type II electrode is coupled to the first and second contact pads, respectively. The illuminating device of claim 13, wherein the illuminating diode chip is a horizontal illuminating diode chip. The illuminating device according to claim 15 of the patent application, further comprising a first A wire and a second wire are respectively wired from the first and second electrodes to the first and second contact pads. The illuminating device of claim 12, further comprising a casing and a transparent lampshade, wherein the transparent lampshade is connected to the casing and defines an accommodating space, so that the circuit board and the plug-in illuminating unit It is covered in the accommodating space. The illuminating device according to any one of claims 12 to 17, further comprising an encapsulant completely or partially covering the surfaces of the first and second substrates. The illuminating device of claim 18, wherein the encapsulating body further comprises a plurality of phosphors. The illuminating device of claim 18, wherein the surface of the illuminating diode chip is coated with a phosphor layer. The illuminating device of claim 12, wherein the die plate, the first and second electrode pins are made of a metal material. The illuminating device of claim 12, wherein the first and second electrode pins are made of a transparent non-conductive material, and the first and second electrode pins are respectively different. The third wire electrically connected to the first contact pad and the fourth wire electrically connected to the second contact pad are respectively exposed and exposed at the ends of the first and second electrode pins, respectively. The illuminating device according to any one of claims 21 to 22, wherein the surface of the solid crystal plate, the first electrode pin and the second electrode pin further comprises a reflective layer. The illuminating device according to claim 12, further comprising a guide The light panel has an edge that is a light incident surface, and the light emitting direction of the plug-in light emitting unit faces the light incident surface, so that the light passing through the light incident surface can be guided by the light guide plate in a predetermined direction.