JP5530321B2 - Lamp and lighting device - Google Patents

Description

  The present invention relates to a lamp and a lighting device using a semiconductor light emitting element.

  In recent years, semiconductor light emitting devices such as light emitting diodes (LEDs) have been used in various lamps as high-efficiency and space-saving light sources.

  An LED lamp using such an LED includes an LED module (light emitting module), and the LED module is configured by sealing an LED mounted on a substrate with a resin. The LED lamp includes a straight tube type (straight tube type LED lamp) and a light bulb type (bulb type LED lamp). In any lamp, a plurality of LEDs are arranged on a substrate. An LED module is used (see, for example, Patent Document 1).

JP 2009-43447 A

  By the way, in the straight tube type LED lamp, the length in the longitudinal direction of the LED module arranged inside, that is, the length in the longitudinal direction of the substrate is long. Therefore, the substrate is easily broken and the LED module is easily broken.

  At this time, it is conceivable that the LED module is composed of a plurality of substrates, and the plurality of substrates are arranged in the tube axis direction of the LED lamp to suppress the cracking of the substrate. However, in this case, it is necessary to provide as many members for fixing each substrate as the number of the substrates, which increases the number of components, complicates the manufacturing process, and complicates the structure of the lamp. Furthermore, since the wiring for electrically connecting the respective substrates increases corresponding to the number of substrates, this also complicates the manufacturing process and the lamp structure.

  Therefore, in view of such a problem, an object of the present invention is to provide a lamp and an illumination device that can suppress cracking of a substrate without complicating the structure of the lamp.

  In order to achieve the above object, a lamp according to an aspect of the present invention includes a straight tube, a base inserted into the straight tube, a plurality of substrates provided on a surface of the base, A semiconductor light emitting element mounted on each of a plurality of substrates, a first fixing member that is fixed to the base, fixes the plurality of substrates to the base, and electrically connects the plurality of substrates. It is characterized by providing. Here, the straight tube may be a glass tube.

  According to this aspect, since the light emitting module is configured by a plurality of substrates, it is possible to suppress the substrate from cracking in the straight tube lamp. At this time, since the common first fixing member fixes the plurality of substrates, an increase in the number of components accompanying an increase in the number of substrates can be suppressed, and the complexity of the manufacturing process and the lamp structure can be suppressed. In addition, since the first fixing member also plays a role of electrical connection between the plurality of substrates, it is possible to further suppress the increase in the number of components accompanying the increase in the number of substrates and further suppress the complexity of the manufacturing process and the lamp structure. it can. As a result, it is possible to realize an inexpensive straight tube lamp that is hard to break.

  Here, the first fixing member fixes one end of the plurality of substrates, and the base includes a flat portion on which the plurality of substrates are placed, and the other end and the side surface of the plurality of substrates are in contact with each other. One convex portion may be provided on the surface, and the first convex portion may have a flange portion protruding toward the upper side of the substrate, and the other ends of the plurality of substrates may be fixed.

  According to this aspect, since the substrate can be firmly fixed to the base, variations in the light emitting points in the lamp can be suppressed.

Moreover, the recessed part may be provided in the part which contact | connects the said 1st convex part of the said flat part.
According to this aspect, the substrate is lifted at an angle where the main surface of the flat portion and the side surface of the first convex portion intersect, and the substrate is placed on the flat portion in a form lifted from the main surface of the flat portion. Can be avoided. As a result, it is possible to suppress variations in light emitting points and deterioration of heat dissipation efficiency in the lamp.

  In addition, the base may further include a second protrusion on the surface, which is in contact with one end and a side surface of the plurality of substrates.

  According to this aspect, since the substrate is located between the first convex portion and the second convex portion of the base, the movement of the substrate in the short direction is limited, and the variation of the light emitting points in the lamp is further suppressed. be able to.

  In addition, the first fixing member is provided in common on the surfaces of the plurality of substrates, and a flexible component on which wiring for electrically connecting the plurality of substrates is formed, and the component is connected to the plurality of substrates. In addition, a common retaining plate that is retained on the surface of the base may be included. At this time, the wiring of the component may be electrically connected to the terminals of the plurality of substrates by the component being held by the holding plate.

  According to this aspect, by interposing a flexible member between the holding plate and the substrate, the force received by the substrate from the holding plate can be absorbed and relaxed to further suppress the cracking of the substrate.

  The first fixing member is fixed to the surface of the base in a state where the plurality of boards are sandwiched between the bases, and a common wiring is formed to electrically connect the plurality of boards. You may have flexible parts.

  According to this aspect, since the configuration of the first module fixing member is simplified, the manufacturing process can be simplified.

  In addition, the first fixing member fixes one end of the plurality of substrates to the base, the lamp is further provided on a surface of the base, and the other end of the plurality of substrates is used as the base. You may provide the 2nd fixing member to fix.

  According to this aspect, since the other end of the substrate is fixed by a member different from the base and the base is easily molded, the manufacturing process can be simplified.

In addition, a lighting device according to one embodiment of the present invention includes the above-described lamp.
According to this aspect, it is possible to suppress cracking of the substrate without complicating the structure of the lamp.

  According to one embodiment of the present invention, there is an effect that it is possible to realize a lamp and a lighting device that can suppress cracking of a substrate without complicating the structure of the lamp.

It is a perspective view which shows the outline of a structure of the LED lamp which concerns on the 1st Embodiment of this invention. It is a perspective view which shows the internal structure of the LED lamp which concerns on the embodiment in detail. It is a side view which shows the internal structure of the LED lamp which concerns on the embodiment in detail. FIG. 3 is a cross-sectional view (cross-sectional view taken along line AA ′ in FIG. 2) illustrating in detail an internal configuration of the LED lamp according to the embodiment. It is a perspective view which shows the detailed structure of the LED module which concerns on the embodiment. It is a perspective view which shows the structure of the 1st module fixing member which concerns on the embodiment, and the fixing method of a LED module in detail. It is a perspective view which shows the structure of the base which concerns on the same embodiment in detail. It is a perspective view which shows in detail the internal structure of the LED lamp which concerns on the modification 1 of the embodiment. It is a perspective view which shows in detail the internal structure of the LED lamp which concerns on the modification 2 of the embodiment. It is a perspective view which shows in detail the internal structure of the LED lamp which concerns on the modification 3 of the embodiment. It is a perspective view which shows in detail the internal structure of the end of the LED lamp which concerns on the modification 4 of the embodiment. It is a perspective view which shows in detail the internal structure of the nozzle | cap | die of the one end of the LED lamp which concerns on the modification 4 of the embodiment. It is a perspective view of the nozzle | cap | die which was provided in the end of the straight pipe which concerns on the modification 4 of the embodiment, and was integrated. It is a perspective view of the nozzle | cap | die disassembled provided in the other end of the straight pipe which concerns on the modification 4 of the embodiment. It is a perspective view of the nozzle | cap | die which was provided in the other end of the straight pipe which concerns on the modification 4 of the embodiment, and was integrated. It is a perspective view which shows the detailed structure of the LED module which concerns on the modification 5 of the embodiment. (A) It is a perspective view of the LED lamp which concerns on the modification 6 of the embodiment. (B) It is sectional drawing of the LED lamp which concerns on the modification 6 cut | disconnected along X-X 'of Fig.15 (a). It is a perspective view which shows the structure of the illuminating device which concerns on the 2nd Embodiment of this invention.

  Hereinafter, a lamp and an illumination device according to an embodiment of the present invention will be described with reference to the drawings.

(First embodiment)
FIG. 1 is a perspective view schematically showing the configuration of an LED lamp 100 according to the first embodiment of the present invention. 2 and 3 are a perspective view and a side view, respectively, showing in detail the internal configuration of the LED lamp 100 according to the embodiment. FIG. 4 is a cross-sectional view (a cross-sectional view taken along the line AA ′ in FIG. 2) showing in detail the internal configuration of the LED lamp 100 according to the embodiment.

  In FIG. 1, the inside of the LED lamp 100 is shown by cutting out a part of the straight tube 200. 2 and 3, the inside of the LED lamp 100 is shown with the base 201 omitted and the straight tube 200 being transparent.

  The LED lamp 100 is a straight tube lamp for general illumination, has a long straight tube 200, a pair of cap pins 202, a cap 201 provided at both ends of the straight tube 200, a light source As a plurality of LED modules 300 arranged in the straight tube 200, one base 303 inserted into the straight tube 200, and a first module fixing member 305 for fixing the plurality of LED modules 300 to the base 303. With.

The straight tube 200 is a cylindrical glass tube, an acrylic tube, a polycarbonate tube, or the like, and has the same dimensional standard as the straight tube before sealing both ends used for manufacturing a fluorescent lamp specified in JIS (Japanese Industrial Standards). Things are used. As the straight pipe 200, for example, a pipe having a length of 1198 [mm], an outer diameter of 30 [mm], and a thickness of 0.7 [mm] is used. The straight pipe 200 is made of, for example, soda-lime glass, and has a glass composition of silica (SiO ₂ ) of 70 to 72 [%]. Further, a diameter-reduced portion 203 is formed at both ends of the straight pipe 200 so as to reduce the diameter. In addition, the inner surface of the straight tube 200 such as a glass tube is subjected to diffusion treatment by applying silica, calcium carbonate, or the like as necessary.

  The base 201 is appropriately selected according to the lighting fixture on which the LED lamp 100 is mounted, and for example, a G-type base or the like is used.

  The LED module 300 includes a single substrate 301, a phosphor-containing resin 302, and an LED (not shown) provided on the surface of the base 303.

  The substrate 301 is rectangular and long, and is, for example, a light-transmitting ceramic substrate such as aluminum nitride, a resin substrate, a glass substrate, a flexible substrate, an alumina substrate, or the like. The substrate 301 has a size that can be arranged inside the straight tube 200, has a width (length in the short direction perpendicular to the longitudinal direction of the substrate 301) and thickness smaller than the inner diameter of the straight tube 200, and is long. The length in the direction is shorter than the length of the straight pipe 200 (the length in the pipe axis direction), for example, the length in the longitudinal direction is 14 [cm].

  On the surface of the base 303, a plurality of LED modules 300 (substrate 301), for example, eight LED modules 300, are arranged in a line in the longitudinal direction of the base 303 (a direction parallel to the tube axis direction of the straight pipe 200). Arranged in a shape (one-dimensional shape) and bonded (adhered) in contact with an adhesive (not shown) having high thermal conductivity. Similarly, the back surface of the base 303 is joined (adhered) to the inner surface of the straight pipe 200 in contact with an adhesive (not shown) having high thermal conductivity. As such an adhesive, for example, cement and silicone resin adhesive are used, and inorganic particles are appropriately mixed in order to increase the thermal conductivity. Inorganic particles include metal particles such as silver, copper and aluminum, and non-metallic particles such as alumina, aluminum nitride, silicon carbide and graphite. Note that an adhesive having a thermal conductivity of 1 [W / m · K] or more is preferable from the viewpoint of heat dissipation, and an adhesive having a specific gravity of 2 or less, such as a silicone resin adhesive, is preferable from the viewpoint of weight reduction.

  Here, the amount of the adhesive that bonds the base 303 and the straight pipe 200 increases the adhesive force between the base 303 and the straight pipe 200, and suppresses the warp of the base 303. It is preferable that the number is increased near the center in the axial direction and is decreased near the end in the tube axis direction of the straight pipe 200. Further, when an adhesive for bonding the base 303 and the straight pipe 200 is partially provided in an island shape in the pipe axis direction of the straight pipe 200, the thermal conductivity between the base 303 and the straight pipe 200. In order to improve the temperature, a thermally conductive grease (for example, TIS380C manufactured by Momentive Co., Ltd.) that does not solidify even if the temperature is raised is provided at a location where the adhesive between the base 303 and the straight pipe 200 is not provided. It is preferable.

  As shown in FIG. 5, the LED module 300 has a plurality of LEDs 321 arranged in a line on the surface of the substrate 301 in the longitudinal direction of the substrate 301 (a direction parallel to the tube axis direction of the straight tube 200) by a die attach agent or the like. This is a line module mounted (die-bonded) in a straight line (one-dimensional shape). The plurality of LEDs 321 mounted on the respective surfaces of the plurality of substrates 301 are covered with one common phosphor-containing resin 302. The plurality of LEDs 321 covered with the common phosphor-containing resin 302 are connected in series by a wiring pattern formed on the surface of the substrate 301.

  The LED 321 is a bare chip that emits monochromatic visible light, and is mounted on the substrate 301 by flip chip mounting or wire bonding. For example, a blue LED chip that emits blue light is used as the LED 321. As the blue LED chip, a gallium nitride based semiconductor light emitting element having a center wavelength of 440 [nm] to 470 [nm], which is made of an InGaN based material, can be used.

  The phosphor-containing resin 302 has a substantially semicircular dome shape with a convex upward cross section, and is provided to run linearly in the direction in which the LEDs 321 are arranged. The phosphor-containing resin 302 is provided corresponding to the plurality of LEDs 321 and functions as a wavelength conversion layer that converts the wavelength of light from the corresponding LEDs 321 by receiving the light emitted from the corresponding LEDs 321 and emitting fluorescence. The corresponding LED 321 is sealed and protected. The phosphor-containing resin 302 is preferably composed of a highly thixotropic material in order to easily form a dome shape. In addition, the sealing member (wavelength conversion layer) for covering the LED chip is not limited to the resin, and is known for chip sealing, for example, using a transparent material such as glass. It may be formed.

  The phosphor-containing resin 302 contains a light wavelength converter made of phosphor fine particles and the like. For example, when the LED 321 is a blue LED, the phosphor-containing resin 302 is configured by dispersing yellow phosphor fine particles as phosphor fine particles in a silicone resin in order to obtain white light. As the yellow phosphor particles, YAG (yttrium, aluminum, garnet) phosphor materials, silicate phosphor materials, and the like can be used.

  FIG. 6 is a perspective view illustrating the configuration of the first module fixing member 305 and the LED module fixing method in detail.

  The first module fixing member 305 is fixed to the base 303, and one end in the short direction of the plurality of substrates 301 (LED module 300) is fixed to the surface of the base 303 in common (simultaneously) with respect to the plurality of substrates 301. And a plurality of substrates 301 to be fixed are electrically connected. The first module fixing member 305 includes a holding plate 313 such as a leaf spring having both ends of a substantially rectangular thin plate bent in a crank shape, a screw 311 for screwing the holding plate 313 to the base 303, and 312 and two resin parts 330 provided between the holding plate 307 and the plurality of substrates 301. At this time, the retaining plate 313 and the resin component 330 are made of a flexible material. By interposing a flexible member between the holding plate 313 and the substrate 301, the force received by the substrate 301 from the holding plate 307 can be absorbed and relaxed, and cracking of the substrate 301 can be suppressed.

  The base 303 is provided with screw holes 314 and 315 that are screwed into the screws 311 and 312, and the retaining plate 313 is screwed to the base 303 so that the resin component 330 is shared by the plurality of substrates 301. Stop it. The holding plate 313 holds the resin component 330 on the surface of the base 303 together with the plurality of substrates 301, that is, by holding the resin component 330 to the plurality of substrates 301, the plurality of substrates 301 are simultaneously attached to the base 303. Stop it. Accordingly, one end of the substrate 301 in the short direction is sandwiched between the base 303 and the resin component 330 and is held on the base 303.

  A wiring 340 is provided inside one of the two resin parts 330. The wiring 340 exposed to the surface at two places on the bottom surface of the resin component 330 is joined and electrically connected to terminals 309 and 310 on different substrates 301 by the resin component 330 being held by the holding plate 313, respectively. The Since the terminals 309 and 310 are electrically connected to the LEDs 321, the LEDs 321 of the plurality of substrates 301 are electrically connected.

  In a state where the first module fixing member 305 fixes the LED module 300 to the base 303, both of the two resin parts 330 are in contact with the retaining plate 313 on the top surface and in contact with the surface of the substrate 301.

FIG. 7 is a perspective view showing the configuration of the base 303 in detail.
The base 303 is a metal plate heat radiator such as a heat sink for dissipating the heat of the plurality of LED modules 300 to the outside and further mounting the plurality of LED modules 300, and is made of, for example, an aluminum alloy material. The In the base 303, the back surface opposite to the surface on which the substrate 301 is provided is a curved surface having a curvature similar to the curvature of the tube inner surface so that the entire surface is in close contact with the tube surface (tube inner surface) inside the straight tube 200. ing. Specifically, the back surface of the base 303 has an arc shape with a curvature that is half the inner diameter of the straight pipe 200, and has a maximum thickness of 1.2 [mm], for example. By interposing the base 303 between the substrate 301 and the straight tube 200, the heat of the LED 321 can be efficiently guided to the straight tube 200, and the heat of the substrate 301 can be dissipated from the surface of the straight tube 200. The heat dissipation efficiency can be further improved by bringing the base 303 into close contact with the straight pipe 200 to increase the contact area between the two.

  A first convex portion 350 that runs in the longitudinal direction of the base 303 is provided on the surface of the base 303, and a second convex portion 360 that runs parallel to the first convex portion 350 is provided, and the first convex A flat portion 370 on which the plurality of substrates 301 are placed is provided between the portion 350 and the second convex portion 360. The movement of the plurality of substrates 301 placed on the flat portion 370 in the short direction (direction perpendicular to the tube axis direction of the straight pipe 200) is restricted by the first convex portion 350 and the second convex portion 360. The distance between the first convex portion 350 and the second convex portion 360 (interval A in FIG. 6), that is, the width of the flat portion 370 is the length in the short direction of the substrate 301 (the direction perpendicular to the tube axis direction of the straight tube 200). Is almost equal. Therefore, in a state where the plurality of substrates 301 are placed on the flat portion 370, one side surface (end surface) in the short direction is in contact with the side surface of the second convex portion 360, and the other side surface in the short direction. Is in contact with the side surface of the first convex portion 350 and the movement in the short direction is strongly restricted.

  Here, it is difficult to form the angle formed between the main surface of the flat portion 370 and the side surface of the first convex portion 350 to be the same as the angle of the corner of the substrate 301, and the substrate 301 on the flat portion 370 has an end portion. Easy to lift. In this case, the substrate 301 cannot come into contact with the entire surface of the flat portion 370, and a part of the substrate 301 is placed on the flat portion 370 so as to float from the main surface of the flat portion 370. As a result, the light emitting points in the LED lamp 100 vary, and the heat dissipation path between the substrate 301 and the base 303 becomes longer, resulting in a deterioration in heat dissipation efficiency. Therefore, the recessed part 352 is provided in the part which contact | connects the 1st convex part 350 in the flat part 370, and this is avoided.

  At the upper end of the first convex portion 350, a flange portion 351 that protrudes above the substrate 301 (in the short direction of the base 303), that is, toward the main surface of the substrate 301 is provided. The flange portion 351 sandwiches the plurality of substrates 301 together with the flat portion 370 and fixes the other end in the short direction of the plurality of substrates 301 to the base 303 in common with respect to the plurality of substrates 301. The movement in the thickness direction 301 (thickness direction of the base 303) is restricted. The distance between the flange portion 351 and the flat portion 370 is substantially equal to the thickness of the substrate 301. Therefore, when the substrate 301 is placed on the flat portion 370, the main surface (upper surface) of the substrate 301 is in contact with the lower surface of the flange portion 351 and the main surface of the flat portion 370, and the substrate 301 moves strongly in the thickness direction. Be regulated.

  A step portion 362 is provided on the side wall of the second convex portion 360 on the flat portion 370 side, so that the substrate 301 can be easily inserted between the flange portion 351 and the flat portion 370. Note that when it is desired to further facilitate the insertion of the substrate 301 between the flange portion 351 and the flat portion 370, the flange portion 351 is made of a flexible material.

  For the same reason as that for providing the concave portion 352 in the flat portion 370, the concave portion 361 is provided in a portion in contact with the step portion 362 (second convex portion 360) in the flat portion 370, thereby preventing the substrate 301 from floating.

  As described above, according to the LED lamp 100 of the present embodiment, since the LED module 300 includes the plurality of substrates 301, it is possible to suppress the cracking of the substrate 301 in the straight tube LED lamp. In addition, since the first module fixing member 305 common to the plurality of substrates 301 fixes the plurality of substrates 301 to the base 303, an increase in the number of components accompanying an increase in the number of substrates 301 can be suppressed. Further, the complexity of the manufacturing process and the lamp structure can be suppressed. In addition, since the first module fixing member 305 also has a function of electrical connection between the plurality of substrates 301, an increase in the number of components can be further suppressed, and the complexity of the manufacturing process and the lamp structure can be further suppressed. .

(Modification 1)
In the LED lamp 100 of this embodiment, the first module fixing member 305 is configured to hold the plurality of substrates 301 to the base 303 by the holding plate 313, but the resin component 330 commonly holds the plurality of substrates 301 on the base 303. You may hold it down.

  FIG. 8 is a perspective view showing in detail the internal configuration of the LED lamp 100 according to this modification. In FIG. 8, the inside of the LED lamp 100 is shown with the base 201 omitted and the straight tube 200 being transparent.

  The first module fixing member 305 includes a resin component 330 on which wirings for electrically connecting a plurality of substrates 301 are formed. One resin component 330 includes a plurality of substrates 301 that are electrically connected to a base 303. It is fixed by being screwed to the surface of the base 303 with being sandwiched between them.

  According to the LED lamp 100 according to this modification, the configuration of the first module fixing member 305 is simplified, so that the manufacturing process can be simplified.

(Modification 2)
In the LED lamp 100 of the present embodiment, the structure for fixing the other end of the substrate 301 to the base 303 is formed. However, the second module fixing member provided as a separate component from the base 303 is the substrate 301. The other end may be fixed to the base 303.

  FIG. 9 is a perspective view showing in detail the internal configuration of the LED lamp 100 according to this modification. In FIG. 9, the inside of the LED lamp 100 is shown with the base 201 omitted and the straight tube 200 being transparent.

  The second module fixing member 304 is provided on the surface of the base 303, and fixes the other end of the plurality of substrates 301 in the short direction to the surface of the base 303. One end of a substantially rectangular thin plate is crank-shaped. A holding plate 307 such as a leaf spring having a bent shape, and a screw 306 for screwing the holding plate 307 to the base 303.

  The holding plate 307 is provided with a screw hole to be screwed with the screw 306. When the holding plate 307 is screwed to the base 303, the holding plate 307 holds the substrate 301 to the base 303. . As a result, the other end of the substrate 301 in the short direction is sandwiched between the base 303 and the retaining plate 307 and is held by the base 303.

  According to the LED lamp 100 according to the present modification, since the base 303 can be easily formed, the manufacturing process can be simplified.

(Modification 3)
In the LED lamp 100 of the present embodiment, the first module fixing member 305 is configured to hold the plurality of substrates 301 to the base 303 by the holding plate 313, but the resin component in which no wiring is formed is a plurality of substrates. 301 may be fixed to the base 303 in common. Also, the structure for fixing the other end of the substrate 301 to the base 303 is formed. However, the second module fixing member provided as a separate component from the base 303 is connected to the base 303 at the other end of the substrate 301. It may be fixed.

  FIG. 10 is a perspective view showing in detail the internal configuration of the LED lamp 100 according to this modification. In FIG. 10, the inside of the LED lamp 100 is shown with the base 201 omitted and the straight tube 200 being transparent.

  The first module fixing member 305 is provided on the surface of the base 303, and fixes one end of the plurality of substrates 301 in the short direction to the surface of the base 303, and electrically connects the plurality of substrates 301. It is comprised from wiring 500, such as a wire and a pattern, and the flexible resin component 501 provided in common on the surface of the some board | substrate 301. FIG. One resin component 501 is fixed by being screwed to the surface of the base 303 in a state where a plurality of substrates 301 to be electrically connected are sandwiched between the bases 303. At this time, the wiring 500 is joined to the terminal of the substrate 301 by solder or the like, and is sandwiched between the substrate 301 and the resin component 501. Further, no wiring is formed inside the resin component 501.

  The second module fixing member 503 is provided on the surface of the base 303, and fixes the other end in the short direction of one substrate 301 to the surface of the base 303. It is composed of a flexible resin component that is fixed by being screwed to the surface of the base 303 while being sandwiched between the two. No wiring is formed inside the resin component.

  The LED lamp 100 of FIG. 10 is further provided with a third module fixing member 502 that is provided on the surface of the base 303 and fixes one end of one substrate 301 in the short direction to the surface of the base 303. . The third module fixing member 502 is composed of a flexible resin component that is fixed by being screwed to the surface of the base 303 with one substrate 301 being sandwiched between the base 303. No wiring is formed inside the resin component.

  Here, the second module fixing member 503 and the third module fixing member 502 are provided to face each other in the vicinity of the approximate center in the longitudinal direction of the substrate 301 in order to surely prevent the substrate 301 from lifting from the surface of the base 303. ing.

  According to the LED lamp 100 according to this modification, the configuration of the first module fixing member 305 is simplified, so that the manufacturing process can be simplified.

  In this modification, the first module fixing member 305 is configured to hold one end of the plurality of substrates 301 (LED modules 300) in the short direction to the base 303. However, the first module fixing member 305 is not limited to this as long as it can be fixed to the base 303. Absent. For example, the first module fixing member 305 may be composed of the wiring 500 and a white resin and a transparent silicon resin provided on the surfaces of the plurality of substrates 301 so as to cover the wiring 500 in common.

(Modification 4)
In the LED lamp 100 of the present embodiment, one end in the longitudinal direction of the base 303 may be fixed to the inner surface of the straight tube 200 by a base fixing member provided between the base 201 and the end of the straight tube 200. .

  11A and 11B are perspective views showing a state in which the base fixing member 400 is attached to the straight pipe 200. FIG. In FIG. 11A, the straight tube 200 is transparent and the inside of the LED lamp 100 is shown, and in FIG. 11B, the straight tube 200 and its members are omitted.

  The base fixing member 400 is a member made of a flexible material. The base fixing member 400 projects from the main body 401 into the straight pipe 200 and covers the opening at the end of the straight pipe 200. The fixing portion 402 and the three locking portions 403 are provided. The base fixing member 400 is attached to the straight tube 200 by fitting the fixing portion 402 and the three locking portions 403 into the straight tube 200 so as to fit into the end of the straight tube 200.

  The main body 401 is provided with a through hole, and wirings 205c and 205d from the pair of base pins 202 of the base 201 are passed through the through hole. The wirings 205c and 205d are electrically connected to the LED 321 of the LED module 300.

  The main body 401 is sandwiched between two convex portions 210 and 211 provided on the inner wall of the base 201. At this time, a substrate 800 having a lighting circuit formed therein is provided inside a base 201 provided at one end of the straight pipe 200, and two convex portions 211 and 212 provided on the inner wall of the base 201 narrow the substrate 800. I have it.

  The lighting circuit provided on the substrate 800 includes a rectifier circuit element 810 such as a diode bridge circuit, and an input / output unit 811 electrically connected to the rectifier circuit element 810 through a wiring provided on the substrate 800. . A short component such as the rectifier circuit element 810 is a space near the screw portion 820 on the substrate 800 (between a screw portion (screw hole portion) 820 into which a screw for integrating the base 201 is inserted and the substrate 800. Space). The input / output unit 811 is electrically connected to the base pin 202 by welding, soldering, insertion, or the like, and at the same time, is electrically connected to the wirings 205c and 205d electrically connected to the LED 321 of the LED module 300. The wires 205c and 205d are guided from the substrate 800 into the straight tube 200 through the notch 812 provided in the substrate 800 and the gap 813 between the substrate 800 and the main body 401 of the base fixing member 400. .

  The base 303 is provided with a resin component 801 for fixing the LED module 300 (board 301) to the base 303 by being screwed and fixed to the base 303. A part of the wiring 205c is part of the board 301. And one end of the resin component 801 are joined to the terminal 309 on the substrate 301. On the other hand, the wiring 205d passes through the gap between the base 303 and the base fixing member 400 and reaches a recess that runs in the tube axis direction provided on the surface of the base 303 facing the straight pipe 200, and passes through this recess. The LED module 300 provided at the other end of the straight pipe 200 is electrically connected.

  The base 201 provided at one end of the straight pipe 200 is configured to be disassembled in half, and as shown in FIGS. 11A and 11B, the base 800 and the base fixing member 400 are disassembled in the base 201. After being disposed, the base 201 is integrated by screws 803 as shown in the perspective view of FIG.

  Similarly, as shown in FIGS. 13A and 13B, the base 201 provided at the other end of the straight pipe 200 is also configured to be disassembled in half. Since the base 201 is provided with only one base pin 202, two screws 804 are arranged so as to sandwich the base pin 202, and the base 201 can be integrated by the two screws 804. On the inner surface of the base 201, a rotation prevention rib 821 and a retaining rib 822 are provided. The rotation stop rib 821 meshes with an adhesive that bonds the base 201 to the straight pipe 200, thereby preventing the base 201 and the straight pipe 200 from idling when torque about the axis is applied to the LED lamp 100. On the other hand, the retaining rib 822 meshes with an adhesive that bonds the base 201 to the straight pipe 200, thereby preventing the base 201 from coming out of the straight pipe 200 when an axial force is applied to the LED lamp 100. . The one cap pin 202 is provided for grounding and for attaching to a lighting fixture.

(Modification 5)
In the LED lamp 100 of this embodiment, the LED module 300 is a COB type (Chip On Borad) in which the LED itself (bare chip) is directly mounted on the substrate. However, the LED module 300 is a package type in which an LED chip is mounted in a cavity molded with a resin or the like, and the inside of the cavity is sealed with a phosphor-containing resin, that is, a surface mount type (SMD: Surface Mount Device). May be.

FIG. 14 is a perspective view showing a detailed configuration of the LED module 300 according to this modification.
In the LED module 300, a plurality of packages 390 are arranged on the surface of the substrate 301 in a line (one-dimensional shape) in a line in the longitudinal direction of the substrate 301 (direction parallel to the tube axis direction of the straight tube 200) by a die attach agent or the like. ) (Die bonding).

  The package 390 is made of resin or the like, and the LED 321 is mounted in the cavity. The mounted LED 321 is covered with a phosphor-containing resin 302. The plurality of packages 390 are electrically connected to each other by a wiring pattern, a wire, and the like, and are also electrically connected to the external terminal 391.

(Modification 6)
Next, an LED lamp 100 according to Modification 6 of the present embodiment will be described with reference to FIGS. 15 (a) and 15 (b). FIG. 15A is a perspective view of an LED lamp 100 according to this modification. Moreover, FIG.15 (b) is sectional drawing of the LED lamp 100 which concerns on the modification which cut | disconnected along XX 'of Fig.15 (a).

  As shown in FIGS. 15A and 15B, an LED lamp 100 according to this modification includes a metal casing 900 made of a metal such as aluminum and a cover 910 attached to the metal casing 900. Become.

  The metal housing 900 has a substantially semi-cylindrical shape, and the LED module 300 is mounted on the surface covered with the cover 910. Further, the cylindrical surface portion of the metal casing 900 is exposed to the outside, and heat generated in the LED module 300 is released from the exposed portion.

  The cover 910 has a substantially semi-cylindrical shape and is made of a synthetic resin such as plastic.

  Note that a bottomed cylindrical base 201 is attached to both ends of the cover 910 and the metal casing 900.

(Second Embodiment)
FIG. 16 is a perspective view illustrating a configuration of a lighting device according to the second embodiment.

The lighting device 600 includes an LED lamp 100 and a lighting fixture 700.
The lighting fixture 700 includes a pair of sockets 701 that are electrically connected to the LED lamp 100 and hold the LED lamp 100, a fixture body 703 to which the socket 701 is attached, and a circuit box (not shown). .

  The inner surface 703a of the instrument body 703 is a reflecting surface that reflects light emitted from the LED lamp 100 in a predetermined direction (for example, downward).

  The circuit box houses therein a lighting circuit that supplies power to the LED lamp 100 when the switch (not shown) is on and does not supply power when the switch is off. As the lighting circuit, for example, a rectifier circuit composed of a diode bridge using four Zener diodes is used.

The lighting fixture 700 is mounted on a ceiling or the like via a fixture.
As mentioned above, although the LED lamp and the illuminating device of this invention were demonstrated based on embodiment, this invention is not limited to these embodiment. The present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention. Moreover, you may combine each component in several embodiment arbitrarily in the range which does not deviate from the meaning of invention.

  For example, in the above embodiment, the plurality of LEDs 321 on the substrate 301 of the LED module 300 are collectively sealed with the common phosphor-containing resin 302. However, each of the plurality of LEDs 321 may be individually sealed with another phosphor-containing resin 302.

  Moreover, in the said embodiment, although the illuminating device 600 was provided with the lighting circuit, the LED lamp 100 may be provided with the lighting circuit inside the nozzle | cap | die 201. FIG. In this case, the lighting circuit may be provided on one side of the two bases 201, or may be provided on both sides of the base 201.

  Moreover, in the said embodiment, although the resin component 330 was illustrated as a component which comprises the 1st module fixing member 305, it is a flexible component in which the wiring which electrically connects the some board | substrate 301 was formed, The present invention is not limited to this as long as it is a component that can be provided across the surfaces of a plurality of substrates 301 to be electrically connected.

  In the above embodiment, the holding plate 313 of the first module fixing member 305 is screwed to the base 303. However, the fixing plate 313 is not limited to this as long as it can be fixed to the base 303. It may be crimped to 303 or may be bonded with an adhesive.

  In the above embodiment, one resin component 330 of the first module fixing member 305 holds the plurality of substrates 301 in common on the base 303. However, even if different resin components 330 electrically connected to each other are provided on the plurality of substrates 301, and even if these separate resin components 330 are held by the base plate 303 with one common holding plate 313. Good.

  Moreover, although LED was illustrated as a semiconductor light-emitting device in the said embodiment, a semiconductor laser and organic EL (Electro Luminescence) may be sufficient.

  The present invention can be used for alternative lighting of a straight tube fluorescent lamp, in particular, an LED lamp and a lighting device.

100 LED lamp 200 Straight tube 201 Base 202 Base pin 203 Reduced diameter portion 205c, 205d, 500 Wiring 210, 211, 212 Convex portion 300 LED module 301, 800 Substrate 302 Phosphor-containing resin 303 Base 304, 503 Fixed to second module Member 305 First module fixing member 306, 311, 312, 803, 804 Screw 307, 313 Holding plate 309, 310 Terminal 321 LED
330, 501 and 801 Resin parts 340 Wiring 350 1st convex part 351 Ridge part 352, 361 Concave part 360 Second convex part 362 Stepped part 370 Flat part 390 Package 391 External terminal 400 Base fixing member 401 Main body 402 Fixed part 403 Locking Part 502 Third module fixing member 600 Lighting device 700 Lighting fixture 701 Socket 703 Appliance main body 703a Inner surface 810 Rectifier circuit element 811 Input / output portion 812 Notch portion 813 Clearance 820 Screw portion 821 Rotation stopper rib 822 Retaining rib 900 Metal housing 910 cover

Claims (11)

Straight pipe,
A base inserted into the straight pipe;
A plurality of substrates provided on the surface of the base;
A semiconductor light emitting element mounted on each of the plurality of substrates;
A lamp comprising: a common first fixing member fixed to the base, fixing the plurality of substrates to the base, and electrically connecting the plurality of substrates. The first fixing member fixes one end of the plurality of substrates,
The base has on its surface a flat portion on which the plurality of substrates are placed, and a first convex portion in contact with the other end of the plurality of substrates.
The lamp according to claim 1, wherein the first convex portion has a flange portion that protrudes upward from the substrate and fixes the other ends of the plurality of substrates. The lamp according to claim 2, wherein a concave portion is provided in a portion of the flat portion that contacts the first convex portion. The lamp according to claim 2, wherein the base further has a second convex portion on a surface thereof, which is in contact with one end and a side surface of the plurality of substrates. The first fixing member is provided in common on the surfaces of the plurality of substrates, and includes a flexible component on which wiring for electrically connecting the plurality of substrates is formed, and the component together with the plurality of substrates. The lamp according to any one of claims 1 to 4, further comprising a common retaining plate that is secured to the surface of the base. The lamp according to claim 5, wherein the wiring of the component is electrically connected to terminals of the plurality of substrates by the component being held by the holding plate. The first fixing member is fixed to the surface of the base in a state where the plurality of boards are sandwiched between the bases, and a common flexible member formed with wirings for electrically connecting the plurality of boards. The lamp according to claim 1, comprising a flexible part. The first fixing member fixes one end of the plurality of substrates to the base,
The lamp according to claim 1, further comprising a second fixing member that is provided on a surface of the base and fixes the other ends of the plurality of substrates to the base. The lamp according to claim 1, wherein the first fixing member includes a flexible component that is provided in common on the surfaces of the plurality of substrates, and wiring that electrically connects the plurality of substrates. The lamp according to claim 1, wherein the straight tube is a glass tube. An illuminating device comprising the lamp according to claim 1.

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