JP2012142406A - Lamp and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lamp and a lighting device which are easily assembled and enable weight reduction.SOLUTION: An LED lamp 100 has a tubular housing 200, a substrate 301, and an LED 321 mounted on the substrate 301. The LED lamp includes LED modules 300 provided in the housing 200. Two recessed parts 410 and 420, which are positioned so as to face each other, are formed on an inner surface of the housing 200. Both end parts of the substrate 301 are held in the two recessed parts 410 and 420.

Description

  The present invention relates to a lamp and a lighting device using a semiconductor light emitting element.

  In recent years, semiconductor light emitting devices such as light emitting diodes (LEDs) have been used in various lamps as high-efficiency and space-saving light sources.

  An LED lamp using such an LED includes an LED module (light emitting module), and by selecting and using the shape of the LED module as appropriate, a straight tube type (straight tube type LED lamp) and a light bulb shape are used. Things (bulb-type LED lamps) have been proposed. In any lamp, an LED module configured by arranging a plurality of LEDs on a substrate is used (see, for example, Patent Document 1).

JP 2009-43447 A

  By the way, in the LED lamp, in order to realize a desired light distribution characteristic by adjusting the height of the LED module from the inner surface of the casing such as a straight pipe, and to facilitate the arrangement of the LED module in the casing, A configuration in which a plurality of LED modules are held on the surface and a base to be bonded to the inner surface of the housing is provided is widely used.

  However, in the structure in which such a base is provided, the weight of the LED lamp is increased by the provision of the base, and thus it is difficult to reduce the weight of the LED lamp. In addition, since most of the light traveling from the LED module toward the base is absorbed, it is difficult to realize an LED lamp having light distribution characteristics in all directions in which light is extracted in all directions.

  On the other hand, such a problem does not occur in the structure in which the LED module is directly bonded to the inner surface of the housing without providing a base, but a plurality of LED modules are bonded to the inner surface of the housing one by one. The need arises and the assembly of the LED lamp is complicated. In addition, it is difficult to fix the LED module to the housing while realizing a good light distribution balance by aligning the central axes of the housing and the LED module.

  In view of the above problems, it is a first object of the present invention to provide a lamp and a lighting device that can be easily assembled and reduced in weight.

  It is a second object of the present invention to provide a lamp and a lighting device that can realize light distribution characteristics in all directions.

  In order to achieve the above object, a lamp according to one embodiment of the present invention includes a tubular casing, a substrate, and a semiconductor light-emitting element mounted on the substrate, and a light emission provided in the casing. And a module, wherein at least two recesses are formed on the inner surface of the housing, and both end portions of the substrate are held in the two recesses.

  According to this aspect, the light emitting module is held in the housing by the recess provided on the inner surface of the housing. Therefore, it is not necessary to provide a base in the housing, and a lamp that can be reduced in weight can be realized. It is also possible to realize a lamp having light distribution characteristics in all directions. Furthermore, since the light emitting module can be held in the housing simply by inserting both end portions of the substrate into the recess, the assembly of the lamp can be facilitated.

  Here, the housing includes a tubular first housing and a tubular second housing provided inside the first housing, and the two recesses are formed on the second housing. The light emitting module may be provided in an inner surface of the second housing.

  According to this aspect, since the light emitting module is held by the second housing, it is not necessary to perform processing for holding the light emitting module, that is, processing for forming a recess, on the inner surface of the first housing. Therefore, a plastic tube or the like that is relatively easy to process can be used as the second housing, and a glass tube that is relatively difficult to process can be used as the first housing. Since the fire resistance can be ensured by using a glass tube for the portion of the housing that contacts the outside air, the versatility of the lamp can be expanded.

  The second housing may be fitted with the first housing.

  According to this aspect, since the first housing and the second housing can be coupled simply by inserting the second housing into the first housing, the assembly of the lamp can be further facilitated. it can.

  Moreover, the said recessed part may be formed from the two convex parts formed along with the inner surface of the said housing | casing, and each of the both ends of the said board | substrate may be clamped by the said two convex parts. At this time, the casing is configured by a first casing and a second casing that are divided along the tube axis direction, and one of the two convex portions is formed on the first casing, and the 2 The other of the two convex portions may be formed on the second housing.

  According to this aspect, the both ends of the substrate are simply placed on the side surfaces of the convex portions of either the first casing or the second casing in a separated state, and the first casing and the second casing are mounted. Since the light emitting module can be held in the housing by coupling, the assembly of the lamp can be further facilitated.

  The two convex portions may be positioned outside a half beam angle of light from the semiconductor light emitting element.

  According to this aspect, it is possible to suppress the light from the light emitting module from being blocked by the convex portion, so that the light extraction efficiency of the lamp can be improved.

  The lighting device according to one embodiment of the present invention may include the lamp.

  According to this aspect, it is possible to realize an illumination device that can be easily assembled and can be reduced in weight. In addition, it is possible to realize an illuminating device that can realize light distribution characteristics in all directions.

  According to the present invention, it is possible to realize a lamp and a lighting device that can be easily assembled and can be reduced in weight. Further, it is possible to realize a lamp and an illumination device that can realize light distribution characteristics in all directions.

It is a perspective view which shows the outline of a structure of the LED lamp which concerns on the 1st Embodiment of this invention. It is a perspective view of the LED module of the embodiment. It is a perspective view of the LED lamp of the embodiment. FIG. 4 is a cross-sectional view (cross-sectional view taken along the line AA ′ of FIG. 3) of the LED lamp of the same embodiment. FIG. 4 is a cross-sectional view (cross-sectional view taken along the line AA ′ of FIG. 3) of the LED lamp of the same embodiment. It is a perspective view for demonstrating the manufacturing method of the LED lamp of the embodiment. It is a perspective view of the LED lamp which concerns on the modification 1 of the embodiment. It is a top view of the LED module which concerns on the modification 2 of the embodiment. It is sectional drawing (sectional drawing in the AA 'line | wire of FIG. 7A) of the LED module which concerns on the modification 2 of the embodiment. It is a perspective view of the LED module which concerns on the modification 3 of the embodiment. It is sectional drawing of the LED lamp which concerns on the modification 4 of the embodiment. It is sectional drawing of the housing | casing which concerns on the modification 5 of the embodiment. It is a perspective view of the LED lamp which concerns on the 2nd Embodiment of this invention. It is a perspective view for demonstrating the manufacturing method of the LED lamp of the embodiment. It is a perspective view of the LED lamp which concerns on the 3rd Embodiment of this invention. FIG. 14 is a cross-sectional view (cross-sectional view taken along the line AA ′ in FIG. 13) of the LED lamp of the same embodiment. FIG. 14 is a cross-sectional view (cross-sectional view taken along the line AA ′ in FIG. 13) of the LED lamp of the same embodiment. It is a perspective view for demonstrating the manufacturing method of the LED lamp of the embodiment. It is a perspective view which shows the structure of the illuminating device which concerns on the 4th Embodiment of this invention.

  Hereinafter, a lamp and an illumination device according to an embodiment of the present invention will be described with reference to the drawings.

  In the drawings, elements that represent substantially the same configuration, operation, and effect are denoted by the same reference numerals. In addition, the dimensions, materials, shapes, relative arrangements, and the like of the constituent elements exemplified in the embodiments are appropriately changed depending on the configuration of the apparatus to which the present invention is applied and various conditions. However, the present invention is not limited to these examples. Moreover, the dimension of each component in each figure may differ from an actual dimension.

(First embodiment)
FIG. 1 is a perspective view schematically showing the configuration of an LED lamp 100 according to the first embodiment of the present invention. In FIG. 1, a part of the housing 200 is cut away to show the inside of the LED lamp 100. In FIG. 1, the X, Y, and Z directions are orthogonal to each other. The X, Y, and Z directions shown in the following figures are also orthogonal to each other.

  The LED lamp 100 is a long lamp for general illumination, has a long casing 200 having openings at both ends, and a pair of cap pins 202 so as to cover the openings at both ends of the casing 200. And a plurality of LED modules 300 provided inside the housing 200 as a light source.

  A lighting circuit (not shown) for supplying power to the LED module 300 using one of the two caps 201 is installed inside or outside the LED lamp 100. The lighting circuit can be configured by a rectifier circuit including a diode bridge using four Zener diodes, for example. When a lighting circuit is installed inside the LED lamp 100, a lighting circuit is provided in one base 201, and the other base 201 is used only for mounting on a lighting fixture.

The casing 200 is a tubular casing such as a circular glass tube, an acrylic tube, or a polycarbonate tube. For example, the casing 200 is a straight tube before sealing both ends used for manufacturing a fluorescent lamp specified in JIS (Japanese Industrial Standard). A straight pipe with the same dimensional standard as the pipe is used. As the straight pipe, for example, a pipe having a length of 1198 [mm], an outer diameter of 30 [mm], and a thickness of 0.7 [mm] is used. The straight pipe is made of, for example, soda lime glass, and has a glass composition of silica (SiO ₂ ) of 70 to 72 [%]. Note that the outer surface and the inner surface of the housing 200 are subjected to diffusion treatment by applying silica, calcium carbonate, or the like, if necessary.

  The base 201 is appropriately selected according to the lighting fixture on which the LED lamp 100 is mounted, and for example, a G-type base or the like is used.

  FIG. 2 is a perspective view of the LED module 300. In FIG. 2, electrode terminals are not shown for simplification of the drawing.

  The LED module 300 is a COB (Chip On Board) type light emitting module, and includes a substrate 301, a phosphor-containing resin 302 and an LED 321 constituting a light emitting unit. The LED module 300 is a line in which a plurality of LEDs 321 are mounted on the surface of the substrate 301 in a straight line (one-dimensional) (die bonding) in a line in the longitudinal direction (X direction) of the substrate 301 with a die attach agent or the like. It is a module.

  However, in the present invention, the form of the LED module is not particularly limited. Besides the configuration in which the LED mounted on the substrate as described above is directly sealed with resin (COB type), the LED module is made of resin or ceramic. An SMD type sealed with a light-transmitting member such as a resin in a state where LEDs are mounted in advance in the case may be used. The form using the SMD type will be described later with reference to the drawings.

  The substrate 301 is rectangular and long, and is, for example, a light-transmitting ceramic substrate such as aluminum nitride, a resin substrate, a glass substrate, a flexible substrate, an alumina substrate, or the like. The substrate 301 has a size that can be disposed inside the housing 200, and has a width (length in the short direction (Y direction) orthogonal to the longitudinal direction of the substrate 301) and thickness smaller than the inner diameter of the housing 200. In addition, the length in the longitudinal direction is shorter than the length of the housing 200, for example, the length in the longitudinal direction is 14 [cm] and the thickness is 1 [mm].

  Here, the length in the longitudinal direction of the substrate 301 is L1, and the length in the short direction is L2. In this case, L1 and L2 are defined by a relational expression of 10 ≦ L1 / L2, for example.

  A plurality of linear LEDs 321 on the surface of the substrate 301 are covered with a common phosphor-containing resin 302. The plurality of LEDs 321 covered with the common phosphor-containing resin 302 are connected in series by a wiring pattern, a wire, and the like formed on the surface of the substrate 301.

  The LED 321 is a bare chip that emits monochromatic visible light, and is mounted on the substrate 301 by flip chip mounting or wire bonding. For example, a blue LED chip that emits blue light is used as the LED 321. As the blue LED chip, a gallium nitride based semiconductor light emitting element having a center wavelength of 440 [nm] to 470 [nm], which is made of an InGaN based material, can be used.

  The phosphor-containing resin 302 has a substantially semicircular dome shape with a convex upward cross section, and is provided to run linearly in the direction in which the LEDs 321 are arranged. The phosphor-containing resin 302 is provided corresponding to the plurality of LEDs 321 and functions as a wavelength conversion layer that converts the wavelength of light from the corresponding LEDs 321 by receiving the light emitted from the corresponding LEDs 321 and emitting fluorescence. The corresponding LED 321 is sealed and protected. The phosphor-containing resin 302 is preferably composed of a highly thixotropic material in order to easily form a dome shape. In addition, the sealing member (wavelength conversion layer) for covering the LED chip is not limited to the resin, and is known for chip sealing, for example, using a transparent material such as glass. It may be formed.

  The phosphor-containing resin 302 contains a light wavelength converter made of phosphor fine particles and the like. For example, when the LED 321 is a blue LED, the phosphor-containing resin 302 is configured by dispersing yellow phosphor fine particles as phosphor fine particles in a silicone resin in order to obtain white light. As the yellow phosphor particles, YAG (yttrium, aluminum, garnet) phosphor materials, silicate phosphor materials, and the like can be used.

  Next, a method for holding the LED module 300 will be described.

  FIG. 3 is a perspective view of the LED lamp 100 (the LED lamp 100 with the base 201 removed). 4A is a cross-sectional view of the LED lamp 100 in a state where the LED module 300 is not held by the housing 200 (a cross-sectional view taken along the line AA ′ in FIG. 3). FIG. 4B is a cross-sectional view (cross-sectional view taken along the line AA ′ in FIG. 3) of the LED lamp 100 in a state where the LED module 300 is held by the housing 200.

  The LED module 300 is provided inside the housing 200. Two recesses 410 and 420 for holding both ends of the substrate 301 are formed on the inner surface of the housing 200 so as to face each other. One recess 420 holds one side of the substrate 301 (one end in the short direction), and the other recess 420 holds the other side of the substrate 301 (the other end in the short direction). The recesses 410 and 420 are continuously formed so as to run from the opening at one end of the housing 200 toward the opening at the other end.

  The concave portion 410 is formed by a first convex portion 411 and a second convex portion 412 that are formed side by side on the inner surface of the housing 200. Similarly, the concave portion 420 is formed by a first convex portion 421 and a second convex portion 422 formed side by side on the inner surface of the housing 200. The first convex portions 411 and 421 and the second convex portions 412 and 422 are continuously formed so as to run from one end opening of the housing 200 toward the other end opening. One end portion of the substrate 301 in the short direction is sandwiched between the first convex portion 411 and the second convex portion 412, and the other end portion is sandwiched between the first convex portion 421 and the second convex portion 422.

  The distance between the first convex portion 411 and the second convex portion 412, that is, the width of the concave portion 410 is larger than the thickness of the substrate 301. Similarly, the distance between the first convex portion 421 and the second convex portion 422, that is, the width of the concave portion 420 is larger than the thickness of the substrate 301. At this time, in order to limit the movement of the substrate 301 in the thickness direction (Z direction), the width between the first convex portion 411 and the second convex portion 412 and the distance between the first convex portion 421 and the second convex portion 422. It is preferable that the width is substantially equal to the thickness of the substrate 301, that is, the widths of the two concave portions 410 and 420 are substantially equal to the thickness of the substrate 301.

  The distance between the bottom of the recess 410 and the bottom of the recess 420 is larger than the width of the substrate 301 in the short direction. At this time, in order to limit the movement of the substrate 301 in the short direction, the distance between the bottom of the recess 410 and the bottom of the recess 420 is preferably substantially equal to the width of the substrate 301 in the short direction.

  The first convex portion 411 and the second convex portion 412 are ½ beams of light from the LED 321 (light emitting portion) in order to suppress a decrease in light emission efficiency due to light shielding from the light from the LED 321 (light emitting portion). Located outside the corner. Similarly, the 1st convex part 421 and the 2nd convex part 422 are also located outside the 1/2 beam angle of the light from LED321 (light emission part).

  When the housing 200 is a straight tube, the holding position of the LED module 300 is such that the position of the center of gravity of the LED lamp 100 projected onto a virtual plane (ZY plane) orthogonal to the tube axis of the housing 200 is the virtual plane (ZY It is determined so as to substantially coincide with the position of the center (tube axis) of the housing 200 projected onto the plane. Thereby, since the LED lamp 100 becomes a lamp in which the weight distribution in the circumferential direction of the casing 200 is substantially uniform, the deviation of the center of gravity (weight) of the LED lamp 100 is reduced.

  Note that an adhesive member that is transparent to visible light is provided between both lateral ends of the substrate 301 and the recesses 410 and 420, and the substrate 301 (LED module 300) is fixed to the inner surface of the housing 200. May be.

  FIG. 5 is a perspective view for explaining a method for manufacturing the LED lamp 100, that is, a method for holding the LED module 300 in the housing 200.

  After the LED 321 and the phosphor-containing resin 302 are formed on the surface of the substrate 301, the substrate 301 is inserted from the opening at the end of the housing 200 so that both ends in the short direction of the substrate 301 enter the recesses 410 and 420. (FIGS. 5A and 5B). Thereafter, the entire substrate 301 is pushed into the housing 200 using the recesses 410 and 420 as a guide (FIG. 5C). Then, a new substrate 301 is inserted and pushed in so as to push in the already inserted substrate 301. As a result, the plurality of substrates 301 on which the LEDs 321 and the phosphor-containing resin 302 are formed are held in the casing 200, that is, the plurality of LED modules 300 are held in the casing 200.

  As described above, according to the LED lamp 100 of the present embodiment, the LED module 300 is held in the housing 200 by the concave portions 410 and 420 provided on the inner surface of the housing 200. Therefore, it is not necessary to provide a base in the housing 200, and the LED lamp 100 that can be reduced in weight can be realized. In addition, the LED lamp 100 having omnidirectional light distribution characteristics can be realized. Furthermore, since the LED module 300 can be held in the housing 200 simply by inserting both ends of the substrate 301 into the recesses 410 and 420, the assembly of the LED lamp 100 can be facilitated.

  In addition, although the housing | casing 200 was taken as the circular tube shape, if it is a tubular shape, it will not be restricted to this.

(Modification 1)
FIG. 6 is a perspective view of the LED lamp 100 (the LED lamp 100 with the base 201 removed) according to this modification.

  The LED lamp 100 according to this modification includes the heat sink 500 for radiating the heat of the LED module 300 to the outside in addition to the housing 200, the base 201, and the LED module 300. Different from the LED lamp 100.

  The heat radiating plate 500 is a long and metal plate-type heat radiating body for mounting a plurality of LED modules 300, and is made of a material having a higher thermal conductivity than the substrate 301, for example, an aluminum alloy material. The heat radiating plate 500 is provided inside the housing 200.

  On the surface of the heat sink 500, a plurality of LED modules 300 (substrate 301), for example, eight LED modules 300, are arranged in a straight line (one-dimensional shape) in a line in the longitudinal direction (X direction) of the heat sink 500. They are joined (adhered) in contact with an adhesive (not shown) with high thermal conductivity. As such an adhesive, for example, cement and silicone resin adhesive are used, and inorganic particles are appropriately mixed in order to increase the thermal conductivity. Inorganic particles include metal particles such as silver, copper and aluminum, and non-metallic particles such as alumina, aluminum nitride, silicon carbide and graphite. Note that an adhesive having a thermal conductivity of 1 [W / m · K] or more is preferable from the viewpoint of heat dissipation, and an adhesive having a specific gravity of 2 or less, such as a silicone resin adhesive, is preferable from the viewpoint of weight reduction.

  Both ends of the heat dissipation plate 500 in the short direction (Y direction) are held by the recesses 410 and 420 together with the LED module 300. Specifically, one end of both ends of the heat sink 500 in the short direction is sandwiched between the first convex portion 411 and the second convex portion 412, and the other is sandwiched between the first convex portion 421 and the second convex portion 422. Has been.

  The distance between the first convex portion 411 and the second convex portion 412, that is, the width of the concave portion 410 is larger than the total thickness of the substrate 301 and the heat sink 500. Similarly, the distance between the first convex portion 421 and the second convex portion 422, that is, the width of the concave portion 420 is larger than the total thickness of the substrate 301 and the heat sink 500. At this time, in order to limit the movement of the substrate 301 and the heat sink 500 in the thickness direction (Z direction), the width of the two concave portions 410 and 420 should be approximately equal to the sum of the thickness of the substrate 301 and the heat sink 500. preferable.

  The distance between the bottom of the recess 410 and the bottom of the recess 420 is larger than the width of the heat sink 500 in the short direction. At this time, in order to limit the movement of the heat sink 500 in the short direction (Y direction), it is preferable that the distance between the bottom of the recess 410 and the bottom of the recess 420 is substantially equal to the width of the heat sink 500 in the short direction. .

  In the assembly of the LED lamp 100 according to this modification, after the plurality of LED modules 300 and the heat sink 500 are integrated, the integrated one is inserted into the housing 200.

  As described above, according to the LED lamp 100 of the present modification, it is not necessary to separately insert the plurality of LED modules 300 into the housing 200, so that the LED module 300 can be easily held in the housing 200. . As a result, the assembly of the LED lamp 100 can be further facilitated.

  In this modification, a plurality of LED modules 300 may be disposed not only on the front surface of the heat radiating plate 500 but also on the back surface in order to realize omnidirectional light distribution characteristics.

  In this case, both ends of the heat sink 500 in the short direction and both ends of the substrate 301 of the LED module 300 provided on the front and back surfaces of the heat sink 500 are held by the recesses 410 and 420. Therefore, the widths of the recesses 410 and 420 are equal to or greater than the total thickness of the two substrates 301 and the heat sink 500.

  Further, in assembling the LED lamp 100, a plurality of LED modules 300 are mounted on the front and back surfaces of the heat sink 500, and then a plurality of LED modules 300 and a heat sink 500 are integrated into the housing 200. Is done.

(Modification 2)
FIG. 7A is a plan view of an LED module 300 according to this modification. FIG. 7B is a cross-sectional view (cross-sectional view taken along line AA ′ of FIG. 7A) of the LED module 300. Note that FIG. 7A does not show an electrostatic protection element or the like provided in the LED module 300 for simplification of the drawing.

  The LED lamp 100 according to the present modification includes the LED lamp 100 according to this embodiment in that a wiring such as a copper wiring is formed inside the substrate 301 in the LED module 300, and the LED module 300 further includes two electrode terminals 360. And different.

  The substrate 301 is a multilayer substrate configured by stacking a plurality of substrates. On the substrate 301, two electrode terminals 350, two electrode terminals 360, two vias 361, and wirings 362 are formed.

  Two LEDs 321 positioned at both ends of the plurality of LEDs 321 are electrically connected to two electrode terminals 350 formed on the surface of the substrate 301, respectively. Between the different LED modules 300, the electrode terminals 350 are connected by a wire or the like.

  The two electrode terminals 360 are electrically connected to the wiring 362 formed inside the substrate 301 by the wiring in the via 361. The electrode terminals 360 are connected by wires or the like between different LED modules 300.

  As described above, according to the LED lamp 100 of the present modification, it is not necessary to route the wiring for connecting the LED module and the lighting circuit that are located away from the lighting circuit in the LED module 300. As a result, the assembly of the LED lamp 100 can be further facilitated.

(Modification 3)
FIG. 8 is a perspective view of an LED module 300 according to this modification. In FIG. 8, electrode terminals are not shown for simplification of the drawing.

  In the LED lamp 100 according to this modification, the LED module 300 is a package type in which an LED chip is mounted in a cavity molded with resin or the like, and a phosphor-containing resin is sealed in the cavity, that is, surface mounting (SMD). : Surface Mount Device) type, which is different from the LED lamp 100 of this embodiment.

  In the LED module 300, a plurality of packages 390 are linearly mounted on the surface of the substrate 301 in a line.

  The package 390 is made of resin or the like, and the LED 321 is mounted in the cavity. The mounted LED 321 is covered with a phosphor-containing resin 302. The plurality of packages 390 are electrically connected to each other by a wiring pattern, a wire, or the like.

  As described above, according to the LED lamp 100 of the present modification, the LED module 300 is the SMD type, and thus the LED 321 can be easily mounted on the substrate 301. As a result, the assembly of the LED lamp 100 can be further facilitated.

(Modification 4)
FIG. 9 is a cross-sectional view of the LED lamp 100 according to the present modification (a cross-sectional view perpendicular to the longitudinal direction of the housing 200 at the base 201 portion).

  The LED lamp 100 according to this modification is different from the LED lamp 100 of the present embodiment in that a plurality of ribs 250 for dispersing external stress are provided on the inner surface of the base 201.

  The rib 250 is made of, for example, a resin that absorbs an external force (stress), and is located between the outer surface of the housing 200 and the inner surface of the base 201.

  As described above, according to the LED lamp 100 of the present modification, even when stress is generated on the base 201 when the LED lamp 100 is attached to a lighting fixture, the stress transmitted to the housing 200 is significantly reduced. be able to. As a result, it is possible to suppress the occurrence of problems due to stress, such as breakage of the housing 200.

(Modification 5)
FIG. 10 is a cross-sectional view (a cross-sectional view perpendicular to the longitudinal direction of the housing 200) of the housing 200 according to this modification.

  The LED lamp 100 according to this modification has an inner surface of the housing 200 that has an optical function with respect to light emitted from the LED module 300, that is, a shape capable of condensing light and diffusing light (for example, an uneven shape). It differs from the LED lamp 100 of this embodiment by the point which is carried out.

  10 may be applied to the entire inner surface of the housing 200 or may be applied to the outer surface of the housing 200.

  As described above, according to the LED lamp 100 of the present modification, an optical function can be added to the housing 200, so that the versatility of the LED lamp 100 can be expanded.

(Second Embodiment)
FIG. 11 is a perspective view of the LED lamp 110 (the LED lamp 110 with the base 201 removed) according to the second embodiment of the present invention.

  The LED lamp 110 of the present embodiment is composed of two parts from which the casing 200 can be separated, that is, a first casing 210 and a second casing 220 that are divided along the tube axis direction (X direction). This is different from the LED lamp 100 of the first embodiment.

  The first casing 210 is a semicircular and long casing that constitutes the upper half of the casing 200 when the casing 200 is divided on a virtual plane including the tube axis, and has a main opening and both end openings. Have. First convex portions 411 and 421 are formed on the inner surface in the vicinity of the main opening of the first housing 210 so as to face each other. Each of the first convex portions 411 and 421 is continuously formed so as to run from the opening at one end of the first housing 210 toward the opening at the other end.

  The second casing 220 is a semicircular and long casing that constitutes the lower half of the casing 200 when the casing 200 is divided on a virtual plane including the tube axis. Have. Second convex portions 412 and 422 are formed on the inner surface in the vicinity of the main opening of the second housing 220 so as to face each other. Each of the second convex portions 412 and 422 is continuously formed so as to run from the opening at one end of the second housing 220 toward the opening at the other end.

  The second housing 220 is coupled to the first housing 210 with an adhesive or the like so that the main opening faces the main opening of the first housing 210, thereby forming the housing 200. One of the first convex portion and the second convex portion is formed on the first housing 210, and the other of the first convex portion and the second convex portion is formed on the second housing 220.

  FIG. 12 is a perspective view for explaining a method of holding the LED module 300 in the housing 200.

  After the LEDs 321 and the phosphor-containing resin 302 are formed on the surfaces of the plurality of substrates 301, both ends in the short direction of the plurality of substrates 301 are on the side surfaces of the second convex portions 412 and 422 of the second housing 220. It is mounted on (FIGS. 12A and 12B). After that, the side surfaces of the first convex portions 411 and 421 of the first housing 210 from the upper side of the second housing 220 are connected to both end portions of the plurality of substrates 301 on the side surfaces of the second convex portions 412 and 422 of the second housing 220. The first casing 210 and the second casing 220 are coupled to each other (FIGS. 12C and 12D). As a result, the plurality of substrates 301 on which the LEDs 321 and the phosphor-containing resin 302 are formed are held in the casing 200, that is, the plurality of LED modules 300 are held in the casing 200.

  As described above, according to the LED lamp 110 of the present embodiment, the LED lamp 110 that can be reduced in weight can be realized for the same reason as the LED lamp 100 of the first embodiment. In addition, the LED lamp 110 having light distribution characteristics in all directions can be realized. Furthermore, the assembly of the LED lamp 110 can be facilitated.

  Further, according to the LED lamp 110 of the present embodiment, it is not necessary to insert the LED modules 300 into the housing 200 one by one, so that the LED modules 300 can be easily held in the housing 200. As a result, the assembly of the LED lamp 110 can be further facilitated.

  Although the first casing 210 and the second casing 220 are semicircular, the casing 200 is divided along the tube axis direction, that is, divided by a virtual plane parallel to the tube axis direction. If it is a case to be made, it is not limited to a semicircular tubular shape.

  Further, the first housing 210 and the second housing 220 may be connected to each other via a connecting member such as a hinge so as to be opened and closed. In this case, the first housing 210 is opened with respect to the second housing 220 to hold the plurality of LED modules 300, and then the first housing 210 is closed with respect to the second housing 220 to form a plurality of LEDs. The module 300 is held in the housing 200.

(Third embodiment)
FIG. 13 is a perspective view of an LED lamp 120 (the LED lamp 120 with the base 201 removed) according to the third embodiment of the present invention. 14A is a cross-sectional view of the LED lamp 120 in a state where the LED module 300 is not held by the housing 200 (cross-sectional view taken along the line AA ′ in FIG. 13). FIG. 14B is a cross-sectional view (cross-sectional view taken along the line AA ′ in FIG. 13) of the LED lamp 120 in a state where the LED module 300 is held in the housing 200.

  The LED lamp 120 of the present embodiment is different from the LED lamp 100 of the first embodiment in that the housing 200 includes a tubular first housing 230 and a second housing 240.

  The first casing 230 is a long casing, and the second casing 240 is provided inside the first casing 230. The inner diameter of the first casing 230 and the outer diameter of the second casing 240 are substantially the same, and the first casing 230 and the second casing 240 are fitted.

  The LED module 300 is provided inside the second housing 240. Two concave portions 410 and 420 for holding the substrate 301 are formed on the inner surface of the second housing 240 so as to face each other. The recesses 410 and 420 are continuously formed so as to run from the opening at one end of the second housing 240 toward the opening at the other end.

  The concave portion 410 is formed by a first convex portion 411 and a second convex portion 412 that are formed side by side on the inner surface of the second housing 240. Similarly, the concave portion 420 is formed by a first convex portion 421 and a second convex portion 422 formed side by side on the inner surface of the second housing 240. The first convex portions 411 and 421 and the second convex portions 412 and 422 are continuously formed so as to run from the opening at one end of the second housing 240 toward the opening at the other end.

  FIG. 15 is a perspective view for explaining a method of holding the LED module 300 in the housing 200.

  After the LED 321 and the phosphor-containing resin 302 are formed on the surface of the substrate 301, the substrate 301 is opened from the opening at the end of the second housing 240 so that both ends in the short direction of the substrate 301 enter the recesses 410 and 420. 301 is inserted. Thereafter, the entire substrate 301 is pushed into the second housing 240 using the recesses 410 and 420 as a guide. Then, a new substrate 301 is inserted and pushed in so as to push in the already inserted substrate 301. Accordingly, the plurality of substrates 301 on which the LEDs 321 and the phosphor-containing resin 302 are formed are held in the second casing 240, that is, the plurality of LED modules 300 are held in the second casing 240 (FIG. 15A). )). After that, the second housing 240 is inserted until the entirety enters the first housing 230 (FIG. 15B). Thereby, the first housing 230 is fitted to the second housing 240, and as a result, the plurality of LED modules 300 are held in the first housing 230.

  As described above, according to the LED lamp 120 of the present embodiment, the LED lamp 120 that can be reduced in weight can be realized for the same reason as the LED lamp 100 of the first embodiment. In addition, the LED lamp 120 having omnidirectional light distribution characteristics can be realized. Furthermore, the assembly of the LED lamp 120 can be facilitated.

  Further, according to the LED lamp 120 of the present embodiment, since the LED module 300 is held by the second housing 240, processing for holding the LED module 300, that is, formation of the recesses 410 and 420 is formed on the inner surface of the first housing 230. There is no need to apply the process. Accordingly, a plastic tube or the like that is relatively easy to process can be used as the second housing 240, and a glass tube that is relatively difficult to process can be used as the first housing 230. Since fire resistance can be ensured by using a glass tube for the portion of the housing 200 that is in contact with the outside air, the versatility of the LED lamp 120 can be expanded.

  In addition, although the 1st housing | casing 230 2nd housing | casing 240 assumed that it was a circular tube shape, if it is a tubular shape, it will not be restricted to this. The shape of the housing according to the present invention may be any as long as it has a tubular structure including a space for housing the LED module. That is, the cross-sectional shape obtained by cutting the casing in the radial direction may be a combination of a straight line and a curved line, for example, a quadrangular or hexagonal polygonal shape, or a trapezoidal shape.

  Further, when at least two or more casings are fitted and used, the materials of the casings may be the same or different. For example, if a housing made of a highly heat-resistant material is used as the outermost shell of the LED lamp, an LED lamp having excellent heat resistance can be obtained, and a material having excellent scratch resistance. If an LED lamp is used, it is possible to obtain an LED lamp that is less likely to be damaged. If materials having different refractive indexes are used, it is possible to obtain an LED lamp with controlled light distribution.

(Fourth embodiment)
FIG. 16 is a perspective view showing a configuration of a lighting apparatus according to the fourth embodiment of the present invention.

  The lighting device 600 includes an LED lamp 100 and a lighting fixture 700.

  The lighting fixture 700 includes a pair of sockets 701 that are electrically connected to the LED lamp 100 and hold the LED lamp 100, and a fixture body 703 to which the socket 701 is attached.

  The inner surface 703a of the instrument body 703 is a reflecting surface that reflects light emitted from the LED lamp 100 in a predetermined direction (for example, downward).

  The lighting fixture 700 is mounted on a ceiling or the like via a fixture.

  As mentioned above, although the LED lamp and the illuminating device of this invention were demonstrated based on embodiment, this invention is not limited to these embodiment. The present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention. Moreover, you may combine each component in several embodiment arbitrarily in the range which does not deviate from the meaning of invention.

  For example, in the above embodiment, the plurality of LEDs 321 on the substrate 301 of the LED module 300 are collectively sealed with the common phosphor-containing resin 302. However, each of the plurality of LEDs 321 may be individually sealed with another phosphor-containing resin 302.

  Moreover, although LED was illustrated as a semiconductor light-emitting device in the said embodiment, a semiconductor laser and organic EL (Electro Luminescence) may be sufficient.

  In the above embodiment, the recesses 410 and 420 are formed continuously from one opening of the housing 200 toward the other opening. However, if the interval is shorter than the length of the substrate 301 in the longitudinal direction, the recesses 410 and 420 may be separated.

  Further, in the above-described embodiment, the single-side power supply type lamp that is fed from one base 201 of the housing 200 has been described, but a double-sided feed type that is fed from both ends of the housing 200 may be used.

  In the above embodiment, the substrate 301 has a rectangular cross-sectional shape. However, the cross-sectional shape may be a polygonal substrate other than a square (rectangle). That is, the cross-sectional shape of the substrate 301 may be a triangular prism, a pentagonal prism, a hexagonal prism, or the like.

  Moreover, although the nozzle | cap | die 201 which concerns on the said embodiment was comprised from one integrated housing, it is not limited to this. For example, the base 201 may be composed of two housings having a semicircular cross section.

  In the above embodiment, the concave portions 410 and 420 are formed by providing two convex portions on the inner surface of the housing 200. However, the concave portions 410 and 420 are simply formed by recessing a part of the inner surface of the housing 200. Also good.

  In the above-described embodiment, the recesses 410 and 420 are positioned to face the inner surface of the housing 200, but may be alternately provided in the tube axis direction of the housing 200 without facing each other. In addition, although two recesses are provided on the inner surface of the housing 200, it is sufficient that at least two recesses are provided on the inner surface of the housing 200. More preferably, at least two recesses are provided to achieve good light distribution characteristics. What is necessary is just to provide a recessed part in the inner surface of the housing | casing 200 in the form located in line symmetry with respect to a housing | casing central axis, and two or more, for example, four recessed parts may be provided.

  The present invention can be used for alternative lighting of a straight tube fluorescent lamp, in particular, an LED lamp and a lighting device.

100, 110, 120 LED lamp 200 Case 201 Base 202 Base pin 210, 230 First case 220, 240 Second case 250 Rib 300 LED module 301 Substrate 302 Phosphor-containing resin 321 LED
350, 360 Electrode terminal 361 Via 362 Wiring 390 Package 410, 420 Concave part 411, 421 First convex part 412, 422 Second convex part 500 Heat sink 600 Illuminating device 700 Illuminating instrument 701 Socket 703 Instrument main body 703a Inner surface

Claims (7)

A tubular housing;
A substrate and a semiconductor light emitting element mounted on the substrate, and a light emitting module provided inside the housing;
At least two recesses are formed on the inner surface of the housing,
Both ends of the substrate are held in the two recesses. The housing includes a tubular first housing and a tubular second housing provided inside the first housing,
The two recesses are formed on the inner surface of the second housing,
The lamp according to claim 1, wherein the light emitting module is provided inside the second housing. The lamp according to claim 2, wherein the second housing is fitted to the first housing. The concave portion is formed of two convex portions formed side by side on the inner surface of the housing,
The lamp according to claim 1, wherein each of both end portions of the substrate is sandwiched between the two convex portions. The housing is composed of a first housing and a second housing divided along the tube axis direction,
The lamp according to claim 4, wherein one of the two convex portions is formed on the first housing, and the other of the two convex portions is formed on the second housing. The lamp according to claim 4, wherein the two convex portions are located outside a ½ beam angle of light from the semiconductor light emitting element. An illuminating device comprising the lamp according to any one of claims 1 to 6.

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