JP2018041806A - Light-emitting device, and illuminating device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light-emitting device which enables the suppression of wire disconnection.SOLUTION: A light-emitting device 10 comprises: a substrate 11; an LED chip 12 disposed on the substrate 11; and a convex portion 11a on the substrate 11. The light-emitting device 10 further comprises: a wire 17 used for power supply to the LED chip 12, in which at least a part is located over the convex portion 11a, and one end is connected to the LED chip 12; and an encapsulating member 13 for encapsulating the LED chip 12, the wire 17 and a structure member. The convex portion 11a is formed by a material smaller than the encapsulating member 13 in linear expansion coefficient.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a light emitting device and a lighting device using the light emitting device.

  Conventionally, a light emitting device that emits white light by sealing an LED (Light Emitting Diode) chip with a sealing member containing a phosphor is known. As such a light emitting device, Patent Document 1 discloses a light emitting device having a so-called SMD (Surface Mount Device) structure.

JP 2001-168398 A

  In the light emitting device as described above, the sealing member expands and contracts due to a temperature change caused by turning on and off the light emitting device. Stress is applied to the wires that electrically connect the LED chips due to the expansion and contraction of the sealing member, which may cause breakage of the wires.

  The present invention provides a light-emitting device and a lighting device that can suppress disconnection of a wire.

  A light-emitting device according to one embodiment of the present invention includes a substrate, a light-emitting element disposed on the substrate, a structural member disposed on the substrate, and a wire used to supply power to the light-emitting element, A wire having at least a portion located above the structural member and having one end connected to the light emitting element, and a sealing member for sealing the light emitting element, the wire, and the structural member The structural member is formed of a material having a smaller linear expansion coefficient than the sealing member.

  An illumination device according to one embodiment of the present invention includes any one of the above light-emitting devices and a lighting device that supplies power to the light-emitting device to light the light-emitting device.

  The light-emitting device and the lighting device according to one embodiment of the present invention can suppress wire breakage.

FIG. 1 is an external perspective view of the light emitting device according to Embodiment 1. FIG. FIG. 2 is a plan view of the light emitting device according to the first embodiment. FIG. 3 is a plan view showing the internal structure of the light emitting device according to Embodiment 1. FIG. FIG. 4 is a schematic cross-sectional view of the light emitting device taken along line IV-IV in FIG. FIG. 5 is a schematic cross-sectional view of a light emitting device according to Modification 1. FIG. 6 is a schematic cross-sectional view of a light emitting device according to Modification 2. FIG. 7 is a diagram illustrating a detailed configuration of a structural member included in the light emitting device according to the second modification. FIG. 8 is a schematic cross-sectional view of a light emitting device according to Modification 3. FIG. 9 is a schematic cross-sectional view of a light emitting device according to Modification 4. FIG. 10 is a cross-sectional view of the lighting apparatus according to Embodiment 2. FIG. 11 is an external perspective view of the lighting device and its peripheral members according to Embodiment 2. FIG.

  Hereinafter, a light-emitting device and the like according to embodiments will be described with reference to the drawings. It should be noted that each of the embodiments described below shows a comprehensive or specific example. The numerical values, shapes, materials, constituent elements, arrangement positions and connecting forms of the constituent elements, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. In addition, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims indicating the highest concept are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, and the overlapping description may be abbreviate | omitted or simplified.

  In the drawings used for explanation in the following embodiments, coordinate axes may be shown. The Z-axis direction in the coordinate axes is, for example, the vertical direction, the Z-axis + side is expressed as the upper side (upper), and the Z-axis-side is expressed as the lower side (lower). In other words, the Z-axis direction is a direction perpendicular to the substrate included in the light emitting device. The X-axis direction and the Y-axis direction are directions orthogonal to each other on a plane (horizontal plane) perpendicular to the Z-axis direction. The XY plane is a plane parallel to the main surface of the substrate included in the light emitting device. For example, in the following embodiments, the “planar shape” means a shape viewed from the Z-axis direction.

(Embodiment 1)
[Configuration of light emitting device]
First, the structure of the light-emitting device according to Embodiment 1 will be described with reference to the drawings. FIG. 1 is an external perspective view of the light emitting device according to Embodiment 1. FIG. FIG. 2 is a plan view of the light emitting device according to the first embodiment. FIG. 3 is a plan view showing the internal structure of the light emitting device according to Embodiment 1. FIG. 4 is a schematic cross-sectional view taken along line IV-IV in FIG.

  Note that FIG. 3 is a plan view showing the internal structure of the LED chip 12 and the arrangement of the LED chips 12, with the sealing member 13 and the dam material 15 removed in FIG.

  As shown in FIGS. 1 to 4, the light emitting device 10 according to Embodiment 1 includes a substrate 11, a plurality of LED chips 12, a sealing member 13, a yellow phosphor 14, a dam material 15, Wire 17 is provided.

  The light emitting device 10 is an LED module having a so-called COB (Chip On Board) structure in which an LED chip 12 is directly mounted on a substrate 11.

  The substrate 11 is a substrate having a wiring region where the wiring 16 is provided. The wiring 16 (and the electrodes 16a and 16b) is formed of a metal for supplying power to the LED chip 12. The substrate 11 is, for example, a metal base substrate or a ceramic substrate. The substrate 11 may be a resin substrate having a resin as a base material. The substrate 11 (the base material of the substrate 11) is formed of a material having a smaller linear expansion coefficient (or volume expansion coefficient) than that of the sealing member 13.

  As the ceramic substrate, an alumina substrate made of aluminum oxide (alumina), an aluminum nitride substrate made of aluminum nitride, or the like is employed. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate, or the like having an insulating film formed on the surface is employed. As the resin substrate, for example, a glass epoxy substrate made of glass fiber and epoxy resin is employed.

  As the substrate 11, for example, a substrate having a high light reflectance (for example, a light reflectance of 90% or more) may be employed. By adopting a substrate having a high light reflectance as the substrate 11, the light emitted from the LED chip 12 can be reflected on the surface of the substrate 11. As a result, the light extraction efficiency of the light emitting device 10 is improved. An example of such a substrate is a white ceramic substrate based on alumina.

  Further, as the substrate 11, a translucent substrate having a high light transmittance may be adopted. Examples of such a substrate include a light-transmitting ceramic substrate made of polycrystalline alumina or aluminum nitride, a transparent glass substrate made of glass, a crystal substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin substrate made of a transparent resin material. Illustrated.

  In the first embodiment, the planar view shape of the substrate 11 is a rectangle, but may be other shapes such as a circle. Moreover, the board | substrate 11 has the convex part 11a. Details of the convex portion 11a will be described later.

  The LED chip 12 is an example of a light emitting element, and is a blue LED chip that emits blue light. As the LED chip 12, for example, a gallium nitride LED chip having a center wavelength (peak wavelength of emission spectrum) of 430 nm or more and 470 nm or less made of an InGaN material is employed. Note that the light emitting device 10 may include at least one LED chip 12. The linear expansion coefficient of the LED chip 12 is smaller than the linear expansion coefficient of the sealing member 13.

  On the substrate 11, a plurality of light emitting element arrays composed of a plurality of LED chips 12 are arranged. As illustrated in FIG. 3, four light emitting element arrays each including a plurality of LED chips 12 arranged in the X-axis direction are arranged on the substrate 11. In each light emitting element row, the plurality of LED chips 12 are connected in series. The four light emitting element rows are arranged side by side in the Y-axis direction. The four light emitting element arrays are connected in parallel and emit light when electric power is supplied between the electrodes 16a and 16b.

  The wire 17 is a so-called bonding wire and is used for electrical connection of the LED chip 12. The wire 17 is used for power supply to the LED chip 12. At least a part of the wire 17 is located above the convex portion 11a. The light emitting device 10 includes a plurality of wires 17, but it is sufficient that at least one wire is provided.

  The plurality of LED chips 12 included in one light-emitting element array are electrically connected by a chip 17 to the chip 17 with a wire 17. That is, one end of the wire 17 is connected to the upper surface of one LED chip 12, and the other end of the wire 17 is connected to the upper surface of the other LED chip 12. At this time, as shown in FIG. 4, the shape of the wire 17 viewed from the side is an arch shape in which the top portion is biased.

  In addition, the LED chip 12 positioned at the end in the light emitting element array is connected to the wiring 16 by a wire 17. One end of the wire 17 is connected to the upper surface of the LED chip 12 located at the end in the light emitting element array, and the other end is connected to the wiring.

  The wire 17 and the above-described wiring 16, the electrode 16a, and the electrode 16b are formed of a metal material such as gold (Au), silver (Ag), or copper (Cu). All (the whole) of the wire 17 is sealed by the sealing member 13, and the wire 17 is not exposed to the outside of the light emitting device 10 in the light emitting device 10.

  The sealing member 13 seals a part of the plurality of LED chips 12, the wires 17, the convex portions 11 a, and the wirings 16.

  The sealing member 13 is formed of a resin material having translucency, for example. Specifically, the sealing member 13 is formed of, for example, a methyl silicone resin, but may be formed of a phenyl silicone resin, or may be formed of an epoxy resin or a urea resin.

  The sealing member 13 contains a yellow phosphor 14. Although not shown, the sealing member 13 may include a filler such as silica. The sealing member 13 may not include a phosphor such as the yellow phosphor 14, and may be disposed mainly for the protection of the LED chip 12, the wire 17, and the like.

  The yellow phosphor 14 is an example of a phosphor (phosphor particle) and is excited by light emitted from the LED chip 12 to emit light. Specifically, the yellow phosphor 14 emits yellow fluorescence. As the yellow phosphor 14, for example, an yttrium aluminum garnet (YAG) phosphor is employed.

  A part of the blue light emitted from the LED chip 12 is wavelength-converted into yellow light by the yellow phosphor 14 included in the sealing member 13. The blue light that has not been absorbed by the yellow phosphor 14 and the yellow light that has been wavelength-converted by the yellow phosphor 14 are diffused and mixed in the sealing member 13. Thereby, white light is emitted from the sealing member 13.

  The dam material 15 is a member for damming the sealing member 13 disposed on the substrate 11. For the dam material 15, for example, an insulating thermosetting resin or thermoplastic resin is used. More specifically, the dam material 15 is made of silicone resin, phenol resin, epoxy resin, bismaleimide triazine resin, polyphthalamide (PPA) resin, or the like.

The dam material 15 desirably has light reflectivity in order to increase the light extraction efficiency of the light emitting device 10. Therefore, in the first embodiment, a white resin (so-called white resin) is used for the dam material 15. In addition, in order to improve the light reflectivity of the dam material 15, the dam material 15 may contain particles such as TiO ₂ , Al ₂ O ₃ , ZrO ₂ , and MgO.

  In the light emitting device 10, the dam material 15 is formed in an annular shape so as to surround the plurality of LED chips 12 when viewed from above. In the region surrounded by the dam material 15, the sealing member 13 is disposed. The dam material 15 may be formed in an annular shape having a rectangular outer shape.

[Effects obtained by convex portions]
As described above, the substrate 11 has the convex portion 11a. Hereinafter, the effect obtained by the convex part 11a is demonstrated.

  The sealing member 13 expands and contracts due to a temperature change caused by turning on and off the light emitting device 10. Stress is applied to the wire 17 due to expansion and contraction of the sealing member 13. In particular, when the sealing member 13 located below the wire 17 expands, a stress that pushes up the wire 17 is generated, and the wire 17 may be disconnected and the wire 17 may be peeled off from the LED chip 12.

  With respect to such a problem, in the light emitting device 10, the convex portion 11 a is arranged on the substrate 11. The convex portion 11 a is an example of a structural member integrally formed with the substrate 11, and is formed of a material having a smaller linear expansion coefficient than that of the sealing member 13 like the substrate 11. In other words, the convex portion 11 a is a partition wall that separates the plurality of LED chips 12.

  Five protrusions 11 a are arranged on the substrate 11 side by side in the X-axis direction. Each of the five convex portions 11a has a long shape (cuboid shape) that is long in the Y-axis direction in plan view. Of the five convex portions 11 a arranged in the X-axis direction, each of the middle three convex portions 11 a is located between the LED chip 12 and the LED chip 12. Of the five convex portions 11 a arranged in the X-axis direction, each of the two convex portions 11 a located at both ends is located on the side of the LED chip 12. In addition, the board | substrate 11 should just have at least 1 convex part 11a.

  At least a part of the wire 17 is located above the convex portion 11a. In other words, the convex portion 11 a is disposed below the wire 17.

  Thereby, below the wire 17, the amount of the sealing member 13 is reduced by the convex portion 11 a having a smaller linear expansion coefficient than that of the sealing member 13. If it does so, the stress which pushes up the wire 17 when the sealing member 13 expand | swells will be reduced, and the disconnection of the wire 17 and peeling from the LED chip 12 of the wire 17 can be suppressed.

  In addition, although the height of the convex part 11a may be higher than the height of the LED chip 12, in Embodiment 1, it is lower than the height of the LED chip 12. The height of the convex portion 11a is the length from the upper surface (upper main surface) of the portion of the substrate 11 where the convex portion 11a is not disposed to the upper surface of the convex portion 11a, and the Z axis of the convex portion 11a. The length in the direction. Similarly, the height of the LED chip 12 is the length in the Z-axis direction of the LED chip 12 in a state of being disposed on the substrate 11.

  Thus, if the height of the convex part 11a is lower than the height of the LED chip 12, the light emitted from the LED chip 12 is less likely to hit the convex part 11a, so that the light extraction efficiency in the light emitting device 10 is suppressed from decreasing. Further, interference between the wire 17 and the convex portion 11a is suppressed.

  As described above, the shape of the convex portion 11a in plan view is a long shape that is long in the direction (Y-axis direction) intersecting the arrangement direction (X-axis direction) of the plurality of LED chips 12 constituting the light-emitting element array. It is. In this case, one convex portion 11 a can be arranged below each of the plurality of wires 17. However, the shape of the convex portion 11a in plan view is not limited to such a shape. The protrusions 11a may be disposed below the wires 17, for example, each of which is a plurality of island-shaped protrusions 11a, and the plurality of protrusions 11a corresponding to the plurality of wires 17 in a one-to-one manner are planar. They may be arranged in a matrix when viewed. In either case, the convex portion 11 a does not surround the LED chip 12.

[Modification 1]
The light emitting device 10 may include a structural member separate from the substrate 11 in place of the convex portion 11 a formed integrally with the substrate 11. FIG. 5 is a schematic cross-sectional view of the light emitting device according to the first modification.

  Unlike the substrate 11, the substrate 11 b included in the light emitting device 10 a illustrated in FIG. 5 has a flat plate shape that does not have the convex portion 11 a. On the board | substrate 11b, it replaces with the convex part 11a and the structural member 18 is arrange | positioned. The structural member 18 is separate from the substrate 11b and is placed on the substrate 11b. In other words, the structural member 19 is a partition that separates the plurality of LED chips 12.

  The structural member 18 is formed of a material having a smaller linear expansion coefficient than that of the sealing member 13. The structural member 18 is formed of, for example, a ceramic material such as aluminum oxide (alumina). The material forming the structural member 18 is a resin material or a metal material having a smaller linear expansion coefficient than that of the sealing member 13. There is no particular limitation. The structural member 18 may have insulating properties.

  Although not shown in detail, the plan view shape of the structural member 18 is, for example, a long shape (cuboid shape) that is long in the Y-axis direction, like the convex portion 11a. A plurality of structural members 18 that correspond one-to-one to the plurality of wires 17 may be arranged in a matrix (island shape) in plan view.

  Such a structural member 18 can be easily formed of a material different from that of the substrate 11b. For example, if the structural member 18 is formed of a material having a smaller linear expansion coefficient than that of the substrate 11b, the wire is more expanded when the sealing member 13 is expanded than when the structural member 18 is formed integrally with the substrate 11. The stress pushing up 17 is reduced.

[Modification 2]
The structural member 18 described in Modification 1 may have a function of converting the wavelength of light emitted from the LED chip 12. FIG. 6 is a schematic cross-sectional view of a light-emitting device (light-emitting device according to Modification 2) including a structural member having a wavelength conversion function. FIG. 7 is a diagram illustrating a detailed configuration of the structural member 19 included in the light emitting device according to the second modification.

  The structural member 19 included in the light emitting device 10b shown in FIG. 6 includes a base material 19a and a yellow phosphor 19b as shown in FIG.

  The base material 19 a is formed of a material having a smaller linear expansion coefficient than that of the sealing member 13. The base material 19a is formed of a ceramic material such as aluminum oxide (alumina), for example.

  The yellow phosphor 19b is an example of a phosphor, and is excited by light emitted from the LED chip 12 to emit light. That is, the yellow phosphor 19b has a function of converting the wavelength of light emitted from the LED chip 12. The yellow phosphor 19b is, for example, an yttrium aluminum garnet (YAG) phosphor similar to the yellow phosphor 14.

  Such a structural member 19 is produced, for example, by sintering a base material 19a including a yellow phosphor 19b.

  Thus, if the yellow phosphor 19b is included in the structural member 19, the yellow phosphor 14 in the sealing member 13 can be reduced. If the yellow phosphor 14 in the sealing member 13 is reduced, heat generated by the excitation of the yellow phosphor 14 is suppressed. That is, the thermal influence on the sealing member 13 can be reduced.

[Modification 3]
In the structural member 19 described in the second modification, the yellow phosphors 19b are dispersedly arranged in the base material 19a. However, the yellow phosphors 19b may be arranged only on the surface of the base material 19a. FIG. 8 is a schematic cross-sectional view of a light-emitting device (light-emitting device according to Modification 3) including a structural member having a yellow phosphor disposed on the surface.

  The structural member 20 included in the light emitting device 10c shown in FIG. 8 includes a base material 20a and a phosphor layer 20b.

  The base material 20 a is formed of a material having a smaller linear expansion coefficient than that of the sealing member 13. The base material 20a is formed of a ceramic material such as aluminum oxide (alumina), for example. The base material 20a does not include a yellow phosphor (phosphor).

  The phosphor layer 20b is a layer that covers the surface of the substrate 20a. The phosphor layer 20b has the structure shown in FIG. 7 and includes a yellow phosphor that emits light when excited by the light emitted from the LED chip 12. That is, the phosphor layer 20b has a function of converting the wavelength of light emitted from the LED chip 12.

  Such a structural member 20 is molded using, for example, a mold.

  Thus, if the phosphor layer 20 b (phosphor) is disposed only on the surface of the structural member 20, the amount of yellow phosphor used in the structural member 20 can be reduced compared to the structural member 19. Moreover, the heat | fever generate | occur | produced when the yellow fluorescent substance contained in the fluorescent substance layer 20b is excited can be thermally radiated to the base material 20a.

[Modification 4]
The upper surface of the structural member 18 is a plane parallel to the main surface of the substrate 11b, but may be curved. For example, the upper surface of the structural member 18 may have a shape along the wire 17. FIG. 9 is a schematic cross-sectional view of a light-emitting device (light-emitting device according to Modification 4) including a structural member having an upper surface shaped along the wire 17.

  The structural member 21 included in the light emitting device 10d illustrated in FIG. 9 is formed of a material having a smaller linear expansion coefficient than that of the sealing member 13. The structural member 21 is formed of, for example, a ceramic material such as aluminum oxide (alumina). The material forming the structural member 20 is a resin material or a metal material having a smaller linear expansion coefficient than that of the sealing member 13. There is no particular limitation.

  As described above, the shape of the wire 17 viewed from the side is an arch shape in which the top portion is biased. Correspondingly, the upper surface of the structural member 21 has a shape along the wire 17 when viewed from the side.

  Such a structural member 21 does not easily interfere with the wire 17 even if the size is increased in the height direction (Z-axis direction). If the size of the structural member 21 is increased in the height direction, the amount of the sealing member 13 below the wire 17 is further reduced. For this reason, the stress which pushes up the wire 17 when the sealing member 13 expand | swells is further reduced, and disconnection of the wire 17 and peeling of the wire 17 from the LED chip 12 can be suppressed.

  In the modification 4, the example in which the upper surface of the structural member 21 separate from the substrate 11b has a shape along the wire 17 has been described, but the upper surface of the convex portion 11a may have a shape along the wire 17. Alternatively, the upper surface of the structural member 19 or the structural member 20 described above may have a shape along the wire 17.

[Effects]
As described above, the light emitting device 10 includes the substrate 11, the LED chip 12 disposed on the substrate 11, and the structural member (for example, the convex portion 11 a) disposed on the substrate 11. The light emitting device 10 is a wire 17 used for power feeding to the LED chip 12, and at least a part of the wire 17 is located above the convex portion 11 a and one end is connected to the LED chip 12. , LED chip 12, wire 17, and sealing member 13 for sealing the structural member. The structural member is formed of a material having a smaller linear expansion coefficient than that of the sealing member 13. The LED chip 12 is an example of a light emitting element.

  Thereby, below the wire 17, the amount of the sealing member 13 is reduced by the convex portion 11 a having a smaller linear expansion coefficient than that of the sealing member 13. If it does so, the stress which pushes up the wire 17 when the sealing member 13 expand | swells will be reduced, and the disconnection of the wire 17 and peeling from the LED chip 12 of the wire 17 can be suppressed.

  Further, the structural member may be a convex portion 11 a of the substrate 11 formed integrally with the substrate 11.

  Thereby, in manufacture of the light-emitting device 10, since the process of mounting a structural member can be omitted, the manufacturing process is simplified.

  Further, like the light emitting device 10a, the structural member 18 may be separate from the substrate 11b and may be placed on the substrate 11b.

  Such a structural member 18 can be easily formed of a material different from that of the substrate 11. For example, if the structural member 18 is formed of a material having a smaller linear expansion coefficient than that of the substrate 11, the stress that pushes up the wire 17 when the sealing member 13 expands is reduced.

  Further, like the light emitting device 10b, the structural member 19 may include a base material 19a having a smaller linear expansion coefficient than the sealing member 13 and a yellow phosphor 19b that is excited by light emitted from the LED chip 12 to emit light. Good. The yellow phosphor 19b is an example of a phosphor.

  Thereby, the yellow fluorescent substance 14 in the sealing member 13 can be reduced. If the yellow phosphor 14 in the sealing member 13 is reduced, heat generated by the excitation of the yellow phosphor 14 is suppressed. That is, the thermal influence on the sealing member 13 can be reduced.

  Further, like the structural member 20 included in the light emitting device 10c, the phosphor layer 20b may be disposed on the surface of the base material 20a. The phosphor layer 20b is an example of a phosphor.

  Thereby, compared with the structural member 19, the usage-amount of the yellow fluorescent substance in the structural member 20 can be reduced. Moreover, the heat | fever generate | occur | produced when the yellow fluorescent substance contained in the fluorescent substance layer 20b is excited can be thermally radiated to the base material 20a.

  Further, like the light emitting device 10 d, the upper surface of the structural member 21 may have a shape along the wire 17.

  Such a structural member 21 is unlikely to interfere with the wire 17 even if the size is increased in the height direction. If the size of the structural member 21 is increased in the height direction, the amount of the sealing member 13 below the wire 17 is further reduced. For this reason, the stress which pushes up the wire 17 when the sealing member 13 expand | swells is further reduced, and disconnection of the wire 17 and peeling of the wire 17 from the LED chip 12 can be suppressed.

  Further, the height of the structural member may be lower than the height of the LED chip 12.

  As described above, when the height of the structural member is lower than the height of the LED chip 12, light emitted from the LED chip 12 is less likely to hit the structural member, and therefore, a decrease in light extraction efficiency in the light emitting device 10 is suppressed. Further, interference between the wire 17 and the convex portion 11a is suppressed.

  The light emitting device 10 may further include an LED chip 12 different from the one LED chip 12, and the other end of the wire 17 may be connected to another LED chip.

  As described above, the wire 17 may connect the plurality of LED chips 12 in series by Chip To Chip. In such a case, when the wire 17 is disconnected, all of the LED chips 12 connected in series do not emit light, and therefore, measures against disconnection of the wire 17 using a structural member are particularly useful.

(Embodiment 2)
Next, the illumination device 200 according to Embodiment 2 will be described with reference to FIGS. 10 and 11. FIG. 10 is a cross-sectional view of lighting apparatus 200 according to Embodiment 2. FIG. 11 is an external perspective view of lighting device 200 and its peripheral members according to Embodiment 2. FIG.

  As shown in FIGS. 10 and 11, the lighting device 200 according to Embodiment 2 is, for example, embedded in a ceiling of a house or the like to irradiate light downward (such as a hallway or a wall). It is an embedded illumination device such as a light.

  The lighting device 200 includes the light emitting device 10. The lighting device 200 further includes a substantially bottomed tubular instrument body configured by coupling the base 210 and the frame body part 220, and a reflector 230 and a translucent panel 240 disposed in the instrument body. Is provided.

  The base 210 is a mounting base to which the light emitting device 10 is attached and a heat sink that dissipates heat generated in the light emitting device 10. Base 210 is formed in a substantially cylindrical shape using a metal material, and is made of aluminum die casting in the second embodiment.

  A plurality of radiating fins 211 projecting upward are provided on the upper portion (ceiling side portion) of the base portion 210 at regular intervals along one direction. Thereby, the heat generated in the light emitting device 10 can be radiated efficiently.

  The frame body part 220 has a substantially cylindrical cone part 221 having a reflection surface on the inner surface, and a frame body part 222 to which the cone part 221 is attached. The cone portion 221 is formed using a metal material, and can be manufactured by drawing or press-molding an aluminum alloy or the like, for example. The frame main body 222 is formed of a hard resin material or a metal material. The frame body part 220 is fixed by attaching the frame body body part 222 to the base part 210.

  The reflection plate 230 is an annular frame-shaped (funnel-shaped) reflection member having an internal reflection function. The reflector 230 can be formed using a metal material such as aluminum. The reflector 230 may be formed of a hard white resin material instead of a metal material.

  The translucent panel 240 is a translucent member having light diffusibility and translucency. The translucent panel 240 is a flat plate disposed between the reflection plate 230 and the frame body portion 220, and is attached to the reflection plate 230. The translucent panel 240 can be formed in a disk shape with a transparent resin material such as acrylic or polycarbonate.

  Note that the lighting device 200 may not include the translucent panel 240. By not providing the translucent panel 240, the luminous flux of the light emitted from the lighting device 200 can be improved.

  As shown in FIG. 11, the lighting device 200 includes a lighting device 250 that supplies power to the light emitting device 10 to light the light emitting device 10, and AC power from a commercial power source to the lighting device 250. A relay terminal block 260 is connected. Specifically, the lighting device 250 converts AC power relayed from the terminal block 260 into DC power and outputs the DC power to the light emitting device 10.

  The lighting device 250 and the terminal block 260 are fixed to a mounting plate 270 provided separately from the instrument body. The mounting plate 270 is formed by bending a rectangular plate member made of a metal material. The lighting device 250 is fixed to the lower surface of one end portion in the longitudinal direction, and the terminal block 260 is mounted on the lower surface of the other end portion. Fixed. The mounting plate 270 is connected to a top plate 280 fixed to the upper part of the base 210 of the instrument body.

  As described above, the lighting device 200 includes the light emitting device 10 and the lighting device 250 that supplies the light emitting device 10 with power for lighting the light emitting device 10. Thereby, in the illuminating device 200, the disconnection etc. of the wire 17 can be suppressed.

  Note that the lighting device 200 may include a light emitting device 10a, a light emitting device 10b, a light emitting device 10c, or a light emitting device 10d instead of the light emitting device 10. Also in this case, in the illuminating device 200, disconnection of the wire 17 and the like can be suppressed.

  In the second embodiment, the downlight is exemplified as the lighting device, but the present invention may be realized as another lighting device such as a spotlight.

(Other embodiments)
Although the light-emitting device and the lighting device according to the embodiment have been described above, the present invention is not limited to the above-described embodiment.

  For example, the COB structure light emitting device has been described in the above embodiment, but the present invention can also be applied to an SMD structure light emitting device. A light emitting device (light emitting element) having an SMD structure includes, for example, a resin container having a recess, an LED chip mounted in the recess, and a sealing member (phosphor-containing resin) sealed in the recess. Prepare.

  Moreover, in the said embodiment, although the light-emitting device radiate | emitted white light with the combination of the LED chip which emits blue light, and yellow fluorescent substance, the structure for radiating | emitting white light is not restricted to this. For example, a sealing member containing a red phosphor and a green phosphor and an LED chip that emits blue light may be combined. In this case, the structural member may include a red phosphor and a green phosphor.

  Alternatively, an LED chip that emits violet light or ultraviolet light having a shorter wavelength than an LED chip that emits blue light, and a blue phosphor that emits blue light, red light, and green light when excited by violet light or ultraviolet light. A green phosphor and a red phosphor may be combined. In this case, the structural member may include a blue phosphor, a green phosphor, and a red phosphor.

  Moreover, in the said embodiment, the LED chip mounted in the board | substrate was connected by Chip To Chip with the other LED chip by the wire. However, the LED chip may be connected to a wiring (metal film) provided on the substrate by a wire and electrically connected to another LED chip through the wiring.

  Moreover, in the said embodiment, the LED chip was illustrated as a light emitting element used for a light-emitting device. However, a semiconductor light emitting element such as a semiconductor laser, or a solid light emitting element such as an organic EL (Electro Luminescence) or an inorganic EL may be adopted as the light emitting element.

  In the light emitting device, two or more types of light emitting elements having different emission colors may be used. For example, the light emitting device may include an LED chip that emits red light in addition to an LED chip that emits blue light for the purpose of enhancing color rendering.

  In addition, it is realized by variously conceiving various modifications conceived by those skilled in the art for each embodiment, or by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention. This form is also included in the present invention.

10, 10a, 10b, 10c, 10d Light emitting device 11, 11b Substrate 11a Convex portion 12 LED chip (light emitting element)
13 Sealing member 14, 19b Yellow phosphor (phosphor)
17 Wire 18, 19, 20, 21 Structural member 19a, 20a Base material 200 Lighting device 250 Lighting device

Claims (9)

A substrate,
A light emitting device disposed on the substrate;
A structural member disposed on the substrate;
A wire used for power feeding to the light emitting element, at least a part of which is located above the structural member, and one end of which is connected to the light emitting element;
A sealing member for sealing the light emitting element, the wire, and the structural member;
The structural member is formed of a material having a smaller linear expansion coefficient than the sealing member. The light emitting device according to claim 1, wherein the structural member is a convex portion of the substrate integrally formed with the substrate. The light emitting device according to claim 1, wherein the structural member is separate from the substrate and is placed on the substrate. The structural member is
A base material having a smaller linear expansion coefficient than the sealing member;
The light emitting device according to claim 3, further comprising a phosphor that emits light when excited by light emitted from the light emitting element. The light emitting device according to claim 4, wherein the phosphor is disposed on a surface of the base material. The light emitting device according to claim 1, wherein an upper surface of the structural member has a shape along the wire. The light emitting device according to claim 1, wherein a height of the structural member is lower than a height of the light emitting element. The light emitting device further includes a light emitting element different from the light emitting element,
The light emitting device according to claim 1, wherein the other end of the wire is connected to the another light emitting element. A light emitting device according to any one of claims 1 to 8,
A lighting device comprising: a lighting device that supplies power for lighting the light emitting device to the light emitting device.

Images