JP4266242B1 - Lighting device - Google Patents

Abstract

Provided is an illumination device using an LED that can maintain airtightness even when there is a change in environmental temperature.
A substrate 57, a support body 58 that supports the substrate 57, a translucent housing 11, a first terminal portion 12a having a hollow structure, and a second terminal portion 12b are provided. When the distance connecting the bottom surfaces of the hollow structures of the terminal portion 12a and the second terminal portion 12b is α, the distance connecting the top surfaces is β, and the length of the housing 11 is γ, the lighting device 1 is used. The relationship of α>γ> β is satisfied within the environmental temperature range, the casing 11 is configured to be movable within the range of α, and the contact surface between the support 58 and the casing 11 has a shape corresponding to each other. Configured as
[Selection] Figure 6

Description

  The present invention relates to an illuminating device, and more particularly to an illuminating device using a solid light emitting element as a light source.

Recently, environmental awareness is high Mari, incandescent bulbs, as a new light source to replace the lamp such as fluorescent lamp and mercury lamp, solid state light emitting devices, in particular light-emitting diodes have attracted attention. This is because a light-emitting diode (hereinafter referred to as an LED) is a light source that has a longer life than the above-described lamps and does not contain harmful substances such as mercury and lead, that is, is an environmentally friendly light source. Because.

  Among LEDs, a so-called high power LED having an input capacity of 1 W or more has a high emission intensity and is optimal for lighting applications. In addition, the light conversion efficiency of LEDs has been improving year by year, and in the future, illumination using LEDs as light sources is also expected to be energy-saving light sources.

  Here, unlike the fluorescent lamp, the LED has a characteristic that the light emission efficiency hardly decreases even in a low temperature environment (for example, an environment of −30 ° C.). Therefore, it has been studied to apply an illumination device using LEDs to illumination in a low temperature environment such as in a freezer warehouse.

  On the other hand, when applying the illuminating device using LED with respect to the inside of a freezing warehouse etc. as mentioned above, there is a concern about the influence of moisture. This is because an electrical short circuit or the like may occur due to moisture adhering to the LED or a power supply wiring path to the LED. If such an event occurs, it directly leads to a failure of the lighting device using the LED. Therefore, it is necessary to arrange the LED or the like in an airtight (drip-proof) space so that moisture does not adhere to the LED or the like.

  Moreover, even if the lighting device is used in a situation where strict airtightness is not required as described above, the invasion of insects or the like into the lighting device not only impairs the beauty, but also lighting by the dead body There is also concern about adverse effects on the device itself. For this reason, there are cases where airtightness is required so that insects and the like do not enter the lighting device.

In view of such a situation, Patent Document 1 discloses a waterproof structure of the tubular case end in a linear light source in which an LED module is inserted into the tubular case. In this waterproof structure, a filler is injected into a recess formed by a sealing plug attached to the end of the tubular case and the tubular case. It is said that this waterproof structure can realize a linear light source that is highly airtight, that is, that can prevent moisture from entering the tube case.
JP 2007-207768 A JP 2003-289620 A JP 2002-367413 A

  However, it is considered difficult to apply the waterproof structure disclosed in Patent Document 1 to a lighting device used in a low temperature environment. In the linear light source disclosed in Patent Document 1, a sealing plug is attached to the end of the tube case as described above, and a filler is injected into a recess formed by the tube case.

  Here, in a low temperature environment, each component generally shrinks, but the degree of shrinkage varies depending on the material of each component. This is because the linear expansion coefficient differs depending on the material.

  In the waterproof structure disclosed in Patent Document 1, there is a gap between the sealing plug and the filler, or between the tubular case and the filler, based on the difference of each material in the degree of shrinkage in a low temperature environment. May occur. Therefore, the airtightness is impaired, and there is a risk of moisture intrusion into the tube body. Furthermore, there is a concern that insects and the like may enter through the gap.

  This invention is made | formed in view of the said situation, Comprising: Even if there exists a change of environmental temperature, it aims at providing the illuminating device using LED which can maintain airtightness.

In order to achieve the above object, an illuminating device according to the present invention is an illuminating device using a solid-state light-emitting element, and a mounting substrate on which the solid-state light-emitting element is mounted and a support unit on which the mounting substrate is closely arranged The supporting means is disposed inside, and the casing means is configured to be translucent in the light emitting direction of the solid state light emitting element, and is fixed to one end of the supporting means, A first sealing means having a first hollow structure into which one end is inserted, and a second hollow structure fixed to the other end of the support means and into which the other end of the housing means is inserted A distance between the bottom surface of the first hollow structure and the bottom surface of the second hollow structure, α, the top surface of the first hollow structure, and the second hollow structure. When the distance connecting the upper surface is β and the length along the longitudinal direction of the housing means is γ There are, alpha, beta, magnitude relation of γ within environmental temperature range of using the lighting device,
α>γ> β
The casing means is configured to be movable along the longitudinal direction of the support means within the range of α, and is arranged in close contact with the inner wall surface of the casing means of the support means. The surface is configured as a shape corresponding to the shape of the inner wall surface of the casing means on which the close contact arrangement is made.

  With this configuration, it is possible to ensure the airtightness of the inside of the lighting device configured by the casing means, the first sealing means, and the second sealing means.

  Moreover, even if the environmental temperature changes, the airtightness can be maintained. Furthermore, the heat generated as a loss in the solid state light emitting device can be radiated to the outside of the lighting device through the mounting substrate, the support means, and the housing means being in close contact with each other.

Here, the support means and the housing means may be fitted and arranged.
Further, the inner wall surface of the housing means further includes a first fitting portion that is a concave portion or a convex portion along the longitudinal direction of the housing means and on both side surfaces with respect to the light emitting direction of the solid state light emitting element. The supporting means is further provided with a convex portion corresponding to the first fitting portion of the housing means and a second fitting portion which is a concave portion, and the first fitting portion and the The second fitting portion may be fitted and arranged. Further, a support plate is provided on the inner wall surface of the casing means along the longitudinal direction of the casing means and on both side surfaces with respect to the light emitting direction of the solid state light emitting device, and the supporting means is provided with the support plate. And the inner wall surface of the housing means in the non-light-emitting direction of the solid state light emitting device.

  With this configuration, there is an effect that the support means and the casing means are fitted to each other, and the adhesion between them can be further improved.

  Here, the mounting board may be fitted and disposed between the support plate and the support means.

  With this configuration, it is possible to prevent the mounting substrate from being lifted (peeled) from the support means.

  Here, the support means may further include a hollow portion along the longitudinal direction of the support means.

With this configuration, there is an effect that the supporting means can be reduced in weight.
Here, each of the first hollow structure and the second hollow structure includes a first elastic body that is a ring-shaped elastic body on each side surface, and an external surface near one end of the housing means, The side surface of the first hollow structure and the outer surface near the other end of the housing means and the side surface of the second hollow structure may be in contact with each other via the first elastic body.

  With this configuration, the gap between the casing means and the first sealing means and the gap between the casing means and the second sealing means can be filled, and airtightness can be improved.

  Here, the first hollow structure and the second hollow structure each include a second elastic body that is a ring-shaped elastic body having airtightness on the bottom surface, and one end of the housing means and the The bottom surface of the first hollow structure and the other end of the housing means and the bottom surface of the second hollow structure may be in contact with each other via the second elastic body.

With this configuration, there is an effect that drip-proofness (waterproofness) can be provided.
Here, the lighting device further includes a blocking unit that blocks power when there is an abnormality in the power supplied to the solid state light emitting device, and the blocking unit is mounted on a first mounting board, and The mounting substrate may be disposed in at least one of the first hollow structure and the second hollow structure.

  Furthermore, the first mounting substrate may be disposed in the first hollow structure and / or the second hollow structure such that a mounting surface is perpendicular to the longitudinal direction of the support means.

  With this configuration, the solid light-emitting element can be protected from abnormal power, and the solid light-emitting element can be disposed up to the vicinity of the end of the lighting device. In addition, the light emitting area can be enlarged, and the convenience of the user can be improved.

  Here, each of the mounting board and the first mounting board includes a pad portion which is a component mounting pad, and the pad portion is made of metal and is a planar first connected to the pad portion. Two members connected to the first member in the longitudinal direction on the opposite side of the surface connected to the pad portion of the first member and perpendicular to the first member. A chip component having a spire portion is disposed, and the two spire portions are flat, have the same size and the same shape, and are arranged on the pad portion of the mounting substrate. One of the two spire portions is connected to the conductor by soldering in a state of being inserted into one through hole of a conductor having through holes formed at both ends, and is connected to the pad portion of the first mounting substrate. Two of the chip parts to be placed Either the spire portion, while the other is inserted into the through hole of the conductor may be connected to the conductor by soldering.

  Further, the spire portion has a maximum width A and a recess having a width B, and the through hole of the conductor has an elliptical shape in which the long side direction is C and the short side direction is D, The size relationship of A, B, C, and D satisfies the relationship “C> A> D> B”, the through hole is located in the concave portion, and the short side direction of the through hole and the plane of the spire portion The spire portion may be connected to the conductor in a state in which the directions match.

  With this configuration, the mounting board and the first mounting board can be reliably electrically connected, and based on this, the durability of the lighting device can be improved.

  ADVANTAGE OF THE INVENTION According to this invention, even if there exists a change of environmental temperature, the illuminating device using LED which can maintain airtightness can be provided.

(Embodiment 1)
The lighting device 1 according to the first embodiment includes a substrate 57 on which the solid light emitting element 56 is mounted, a support 58 on which the substrate 57 is disposed in close contact, and a support 58 that is disposed inside. A first structure having a hollow structure in which one end of the casing 11 is inserted, and the casing 11 having translucency in the direction and the connection portion 61 disposed on one of the supports 58 are fixed. The terminal part 12a and the 2nd terminal part 12b which is fixed to the connection part 61 distribute | arranged to the other of the support body 58, and has the hollow structure in which the other edge part of the housing | casing 11 is inserted are provided. The distance connecting the bottom surface of the hollow structure of the first terminal portion 12a and the bottom surface of the hollow structure of the second terminal portion 12b, α, the top surface of the hollow structure of the first terminal portion 12a, and the hollow structure of the second terminal portion 12b When the distance connecting the upper surface of the housing 11 is β and the length along the longitudinal direction of the housing 11 is γ, the magnitude relationship between α, β, and γ is “within the environmental temperature range in which the lighting device 1 is used. α>γ> β ”, and the casing 11 is configured to be movable along the longitudinal direction of the support body 58 within the range of α, and the inner wall surface of the casing 11 of the support body 58. The surface arranged in close contact is configured as a shape corresponding to the shape of the inner wall surface of the housing 11 in which the close contact arrangement is made.

  As described above, the space formed by the casing 11, the first terminal portion 12 a, and the second terminal portion 12 b (hereinafter referred to as the internal space of the light source unit 2) is hermetic (here, airtightness). Is an airtight space that does not allow insects or the like to enter the interior space of the light source unit 2.

  Moreover, since the material which comprises each of the housing | casing 11 and the support body 58 differs, it is the X direction (direction along the longitudinal direction of the light source unit 2 (the housing | casing 11, the support body 58)) by the change of environmental temperature. Variations in length are different from each other. However, in the lighting device 1, the housing 11 is configured to be movable along the X direction within the range of α. For this reason, even if the variation in the length in the X direction due to a change in the environmental temperature differs between the housing 11 and the support 58, the difference in the variation can be absorbed and the airtightness can be maintained.

  Further, although it is important for the solid light emitting element 56 to dissipate heat generated as a driving loss, since the support body 58 is in close contact with the housing 11, heat can be radiated through the housing 11. Is possible.

  Hereinafter, the illumination device 1 according to Embodiment 1 of the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a plan view showing the appearance of the lighting device 1. FIG. 2 is a perspective view showing the appearance of the light source unit 2. 3 is a plan view showing the appearance of the light source unit 2 viewed from the direction A in FIG. 2, and FIG. 4 is a plan view showing the appearance of the light source unit 2 viewed from the direction B in FIG. These are top views which show the external appearance of the light source unit 2 seen from the C direction in FIG.

  6 is a diagram showing the structure of the light source unit 2 viewed from the D1-D2 plane in FIG. 4, and FIG. 7 is a diagram showing the structure of the light source unit 2 viewed from the D3-D4 plane in FIG. FIG. 8 is a diagram showing the structure of the light source unit 2 as viewed from the D5-D6 plane in FIG.

  FIG. 9 is a view showing the connection using the relay component 54 between the conductor 55 and the substrate 57. FIG. 10 is a perspective view showing the appearance of the relay component 54. FIG. 11 is a perspective view showing the appearance of the relay component 81. 12 is a plan view showing the appearance of the relay component 81 as viewed from the direction E in FIG. FIG. 13 is a plan view showing the configuration of the conductor 55 to which the lug terminal 86 is attached.

  FIG. 14 is a plan view showing the appearance of the holding unit 3. 15 is a plan view showing the appearance of the first mounting portion 92a viewed from the direction F of FIG. 14, and FIG. 16 is a plan view showing the appearance of the second mounting portion 92b viewed from the direction G of FIG. is there.

  Here, the X direction is a direction along the longitudinal direction of the light source unit 2 (the casing 11 and the support body 58), and the Y direction is a direction perpendicular to the X direction (see FIG. 6). ).

  The illumination device 1 includes a light source unit 2 and a holding unit 3. Among these, the structure of the light source unit 2 is demonstrated first.

  The light source unit 2 includes a housing 11, a first terminal portion 12a, a second terminal portion 12b, a first sensing pin 14a, a second sensing pin 14b, a first power supply pin 15a, and a second power supply. The pin 15b, the first support pin 15c, and the second support pin 15d are configured.

  Moreover, the housing | casing 11 has a hollow structure and the solid light emitting element 56, the board | substrate 57, the support body 58 grade | etc., Are arrange | positioned. Further, the first terminal portion 12a has a hollow structure, and the substrate 52, the element 53, and the like are disposed therein. Note that the relay component 54 is mounted on the wiring pad 62 provided on both the substrate 52 and the substrate 57, and is electrically connected to the conductor 55 via the relay component 54.

  Similarly to the first terminal portion 12a, the second terminal portion 12b has a hollow structure, and the substrate 52, the element 53, and the like may be disposed therein. For example, when the first support pin 15c and the second support pin 15d are used as pins for supplying power to the solid state light emitting device 56, the substrate 52, the device 53, and the like are placed in the hollow structure of the second terminal portion 12b. Deploy.

  Here, the edge part of the housing | casing 11 is inserted in the hollow structure with which the 1st terminal part 12a and the 2nd terminal part 12b are each provided. Further, the support body 58 is not fixed to the housing 11, and the first terminal portion 12 a and the second terminal portion 12 b are not fixed to the housing 11.

  Further, the first terminal portion 12 a and the second terminal portion 12 b are fixed to the support body 58 using the connection portion 61.

  By adopting such a structure, the casing 11 is connected to the bottom surface of the hollow structure of the first terminal portion 12a and the bottom surface of the hollow structure of the second terminal portion 12b along the X direction shown in FIG. (Range of α in 6). The reason for adopting such a configuration will be described later.

  The casing 11 has a light-transmitting property, and has only to have a hollow structure and can be disposed with the support body 58 and the like therein. For example, it may be a cylindrical shape having translucency as shown. However, the shape is not limited to this, and may be a quadrangular prism shape or the like having a hollow structure, and may be arbitrarily configured as necessary.

  As the material, the inventors have adopted polycarbonate in consideration of weather resistance, durability and the like, but may be composed of glass, other resin materials (acrylic), or the like. The material may be selected in consideration of the environment where the light source unit 2 is used.

  In addition, the whole housing | casing 11 does not need to have translucency. It is sufficient that at least the light emitting direction of the solid light emitting element 56 has translucency. By doing in this way, the light emitted from the solid light emitting element 56 can be used for illumination without waste.

  In addition, since light emitted from the solid state light emitting element 56 is directional, illumination tends to be performed locally as compared with a conventional illumination device such as a fluorescent lamp. As a countermeasure, the light emitted from the solid state light emitting element 56 may be diffused by coloring the housing 11 while maintaining translucency (for example, milky white). Further, fine irregularities may be provided on the housing 11 by a method such as sandblasting. Of course, coloring and providing fine irregularities may be used in combination. In addition, a light diffusing material (a fine light diffusing agent) may be mixed.

  The first terminal portion 12 a is provided at one end of the housing 11. It plays a role of sealing the end of the housing 11, a role of holding the first sensing pin 14a, the second sensing pin 14b, the first power supply pin 15a, and the second power supply pin 15b.

  The first terminal portion 12a (the same applies to the second terminal portion 12b) may be formed of a resin material having electrical insulation. The first sensing pin 14a, the second sensing pin 14b, the first power supply pin 15a, and the second power supply pin 15b need to be electrically insulated from each other. In addition, there is an advantage that the above-described electrical insulation can be easily realized by using an insulating material having electrical insulation.

  On the other hand, the first terminal portion 12a (the same applies to the second terminal portion 12b) made of metal is advantageous in that heat dissipation using this can be realized. In this case, in order to electrically insulate the first sensing pin 14a, the second sensing pin 14b, the first power supply pin 15a, and the second power supply pin 15b from each other, the first terminal portion is used. 12a and the 1st sensing pin 14a are comprised so that it may contact only through an electrical insulator (not shown). Similarly, the second sensing pin 14b, the first power supply pin 15a, and the second power supply pin 15b are configured to come into contact with the first terminal portion 12a only through an electrical insulator (not shown). There is a need.

  The first terminal portion 12a has a hollow structure. In this hollow structure, an element 53 and a substrate 52 on which they are mounted are arranged. This means that it is not necessary to dispose the substrate 52 in the hollow structure of the housing 11, and an area in which the solid light emitting element 56 can be disposed in the hollow structure of the housing 11 is expanded (for example, X It is possible to dispose the solid light emitting element 56 in the direction up to the vicinity of the end of the light source unit 2).

  An increase in the area where the solid light emitting element 56 can be arranged leads to an enlargement of the illuminable range in the light source unit 2 and also to an improvement in convenience for the user.

  In this case, arranging the substrate 52 so that the mounting surface is arranged along the Y direction leads to minimizing the width occupied by the substrate 52 in the X direction. Thereby, the area | region which can arrange | position the solid light emitting element 56 can be expanded more.

  That is, the illuminable range in the light source unit 2 can be further expanded, and the convenience for the user can be further improved.

  Further, in this case, making the element 53 a small element exhibits an effect that the region where the solid light emitting element 56 can be arranged can be further expanded.

That is, the area occupied by the element 53 (particularly, the width occupied by the element 53 in the X direction when the substrate 52 is arranged so that the mounting surface is arranged along the Y direction) can be minimized. Because. The inventors made a prototype of the light source unit 2 with the mounting height of the element 53 with respect to the mounting surface of the substrate 52 being 5 mm or less, and confirmed that a desired effect was obtained.

Here, if placed along the substrate 52 in the X direction, rather than further hollow structure of the substrate 52 in the first terminal portion 12a, when placed on the support 58, the solid-state light-emitting element 56 according to the X-direction Is reduced (that is, it becomes impossible to dispose the solid light emitting element 56 near the end of the light source unit 2 in the X direction). This leads to a reduction in the illuminable range of the light source unit 2 and may lead to a loss of convenience for the user. Therefore, as described above, it is necessary to arrange the substrate 52 so that the mounting surface is arranged along the Y direction in the hollow structure in the first terminal portion 12a.

  Moreover, the edge part of the housing | casing 11 is inserted in the hollow structure of the 1st terminal part 12a. In addition, the edge part of this housing | casing 11 is only inserted in the hollow structure of the 1st terminal part 12a, and is not fixed.

  The first sensing pin 14a and the second sensing pin 14b are respectively disposed on the end surface 16a of the first terminal portion 12a. The first sensing pin 14 a and the second sensing pin 14 b are provided for sensing whether or not the light source unit 2 is held by the holding unit 3.

  The first power supply pin 15a and the second power supply pin 15b are respectively disposed on the end surface 16a of the first terminal portion 12a (that is, the same surface as the first sensing pin 14a and the second sensing pin 14b). The first power supply pin 15 a and the second power supply pin 15 b are used to supply power to the solid state light emitting device 56 from the power supply device 101. At the same time, it is also used as a base for attaching the light source unit 2 to the holding unit 3.

  The second terminal portion 12b is provided at the other end portion of the housing 11 (an end portion different from the end portion where the first terminal portion 12a is provided). It plays the role which seals the edge part of the housing | casing 11, the role which hold | maintains the 1st support pin 15c and the 2nd support pin 15d, etc.

  The second terminal portion 12b has a hollow structure. Also in this hollow structure, although not shown in FIG. 6, similarly to the hollow structure of the first terminal portion 12 a, the elements 53 and the substrate 52 on which they are mounted may be arranged as necessary.

  In addition, when arrange | positioning the board | substrate 52 grade | etc., In the hollow structure of the 2nd terminal part 12b, it is necessary to arrange | position similarly to the case in the said 1st terminal part 12a. The reason why this arrangement is necessary is as described in the first terminal portion 12a.

  Further, the end of the housing 11 is inserted into the hollow structure of the second terminal portion 12b. In addition, the edge part of this housing | casing 11 is only inserted in the hollow structure of the 2nd terminal part 12b, and is not fixed like the case in the 1st terminal part 12a.

  The first support pin 15c and the second support pin 15d are respectively disposed on the end face 16b of the second terminal portion 12b. These are used as a base for attaching the light source unit 2 to the holding unit 3.

The first power supply pin 15a, the second power supply pin 15b, the first support pin 15c, and the second support pin 15d are preferably all the same shape. By doing in this way, these can be comprised by the same components.

  Furthermore, a first power supply pin hole 94a, a second power supply pin hole 94b, a first support pin hole 94c, and a second support pin hole 94d, which will be described later, can also share components. Sharing it is advantageous in that the lighting device 1 can be manufactured at low cost.

  Here, the first sensing pin 14a and the second sensing pin 14b are disposed on the same surface (end surface 16a) as the first power supply pin 15a and the second power supply pin 15b as described above, and the first power supply It is appropriate to make the height relative to the end face 16a lower than the supply pin 15a and the second power supply pin 15b (that is, the height relative to the end face 16a of the first power supply pin 15a and the second power supply pin 15b). T1> t2, where t1 is the height of the first sensing pin 14a and the second sensing pin 14b with respect to the end face 16a.

  This is because the first sensing pin 14a, the second sensing pin 14b, the first power supply pin 15a, and the second power supply pin 15b are holes of the first mounting portion 92a of the holding unit 3 (in the case of the first sensing pin 14a). In the case of the first sensing pin hole 93a and the second sensing pin 14b, the second sensing pin hole 93b. In the case of the first power supply pin 15a, the first power supply pin hole 94a and the second power supply pin 15b. Is inserted into the second power supply pin hole 94b).

  Since t1> t2, when the first sensing pin 14a and the second sensing pin 14b are inserted into the first sensing pin hole 93a and the second sensing pin hole 93b, the first power supply pins 15a and The second power supply pin 15b is inserted into the first power supply pin hole 94a and the second power supply pin hole 94b.

  That is, after the insertion of the first sensing pin 14a and the second sensing pin 14b into the first sensing pin hole 93a and the second sensing pin hole 93b is sensed, the light source unit 2 (solid state light emitting element 56) by the power supply device 101 is sensed. When the first power supply pin 15a and the second power supply pin 15b are already inserted into the first power supply pin hole 94a and the second power supply pin hole 94b, the normal power supply is started. It will be possible to supply.

  If the first power supply pin 15a and the second power supply pin 15b are not securely inserted into the first power supply pin hole 94a and the second power supply pin hole 94b, the light source unit 2 (solid state light emitting element 56). When the power supply to) is started, there is a concern that the control related to the power supply is disturbed. This is a risk of causing damage to the light source unit 2 (solid light emitting element 56). Therefore, as described above, it is necessary to configure the first sensing pin 14a, the second sensing pin 14b, the first power supply pin 15a, and the second power supply pin 15b.

  The substrate 52 is used for electrical connection between the first sensing pin 14a and the second sensing pin 14b. The reason why the first sensing pin 14a and the second sensing pin 14b are electrically connected will be described later. The electrical connection between the first sensing pin 14a and the second sensing pin 14b is a direct connection. Alternatively, substantial electrical connection via the element 53 may be used.

  The element 53 is an electric element mounted on the substrate 52, and specifically, an element having a resistance component for preventing overcurrent.

  Further, a rectifying element or the like may be employed for the purpose of preventing current from flowing in the direction opposite to the desired direction. By adopting this, there is an effect that when the light source unit 2 is attached to the holding unit 3, power can be prevented from being supplied to the solid state light emitting element 56 even if it is attached in the wrong direction. .

  This is because, when the light source unit 2 is attached to the holding unit 3 in the wrong direction, the rectifying element as the element 53 electrically cuts off between the first sensing pin 14a and the second sensing pin 14b. The sensing of the holding of the light source unit 2 to the holding unit 3 is performed by electrically connecting the first sensing pin hole 93a and the second sensing pin hole 93b. Since the pin 14a and the second sensing pin 14b are electrically disconnected, the first sensing pin hole 93a and the second sensing pin hole 93b are not electrically connected.

  Therefore, the holding of the light source unit 2 to the holding unit 3 is not sensed, and the power supply to the solid state light emitting element 56 is not performed.

  Here, the first sensing pin 14 a and the second sensing pin 14 b are not electrically connected to the first power supply pin 15 a and the second power supply pin 15 b, and are not electrically connected to the solid state light emitting device 56.

  This is because the first sensing pin 14a and the second sensing pin 14b are electrically connected to the first power supply pin 15a, the second power supply pin 15b, and the solid state light emitting element 56 itself. This is to make them independent. This leads to detection of holding / non-holding of the light source unit 2 to the holding unit 3 using the first sensing pin 14a and the second sensing pin 14b being appropriately performed without receiving electrical disturbance.

  In addition, the first power supply pin 15a and the second power supply pin 15b are electrically connected to the substrate 52, respectively.

Note that the first power supply pin 15a, and the second power supply pin 15b, independently of each electrically, after being connected to the substrate 52, electrically connected to the substrate 57 where the solid-state light-emitting element 56 is mounted Is done. That is, the solid state light emitting device 56 is connected between the first power supply pin 15a and the second power supply pin 15b. Therefore, the first power supply pin 15 a and the second power supply pin 15 b can be used for supplying power to the solid state light emitting device 56.

  Further, an element 53 may be further connected between the first power supply pin 15a and the second power supply pin 15b (that is, the element 53 is connected in series with the solid state light emitting element 56). .)

  As the element 53, for example, an element having a resistance component or a fuse is used for the purpose of protecting the solid light emitting element 56 when there is an abnormality in the power supplied to the solid light emitting element 56 such as an overcurrent. To do. In particular, the use of a fuse can cut off the power when there is an abnormality, and is effective in protecting the solid state light emitting device 56.

  Further, a rectifying element or the like may be employed for the purpose of preventing current from flowing in the direction opposite to the desired direction.

In addition, the electrical connection between the substrate 52 and the substrate 57 is performed via the relay component 54 and the conductor 55.
FIG. 9 is a diagram showing a connection between the conductor 55 and the substrate 57 using the relay component 54 (note that the other end of the conductor 55 is similarly connected to the substrate 52 using the relay component 54).

  The substrate 57 is a rigid substrate and is made of a material such as glass epoxy, metal (aluminum, copper, etc.), alumina ceramic, aluminum nitride, or the like. Metal, alumina ceramic, aluminum nitride, and the like have high thermal conductivity, and it is preferable to employ these if the necessity of heat dissipation of the solid light emitting element 56 is taken into consideration.

  The substrate 52 may be made of the same material as the substrate 57. However, this is irrelevant to the heat radiation of the solid state light emitting element 56, and even if it is made of a material having low thermal conductivity such as glass epoxy, no particular problem occurs.

  The conductor 55 is a general wiring wire, a flexible substrate, or the like. When a general wiring wire is applied, lug terminals 63 are attached to both ends thereof.

  In addition, when a flexible substrate is applied, through holes (not shown) in which wiring parts (not shown) are exposed are provided at both ends.

  The relay component 54 is configured as shown in FIG. As shown in FIG. 10, the relay component 54 has a substantially U-shape when viewed from the side. In other words, the relay component 54 has a planar first member 71 connected to the wiring pad 62 and the length of the first member 71 on the surface opposite to the surface connected to the wiring pad 62 of the first member 71. Two planar spire portions 73 connected perpendicularly to the first member 71 are provided at both ends in the direction.

  Here, the shape of the relay component 54 is not limited to the U-shape, and may be an L-shape. In other words, the relay component 54 has a planar first member 71 connected to the wiring pad 62 and the length of the first member 71 on the surface opposite to the surface connected to the wiring pad 62 of the first member 71. One spire portion 73 connected perpendicularly to the first member 71 may be provided at one end in the direction.

  However, considering the convenience of mounting on the substrate 57 (or the substrate 52), the U-shape is desirable.

  This is efficient in mass production of the light source unit 2 when the relay component 54 is mounted on the substrate 57 (or the substrate 52) by using an automatic mounting apparatus. At this time, the relay component 54 is embossed and automatically arranged on the substrate 57 (or the substrate 52).

  At this time, if the relay component 54 is L-shaped, the balance of the relay component 54 is lost during automatic placement on the substrate 57 (or the substrate 52), making it difficult to place the relay component 54 at a desired position. On the other hand, when the U-shape is used, the balance of the relay component 54 is not lost, and automatic placement on the substrate 57 (or the substrate 52) can be performed at a desired position.

  The relay component 54 is made of a conductive material. The relay component 54 is mounted on the wiring pad 62 of the substrate 57 (or the substrate 52) by soldering. Furthermore, the spire portion 73 is connected to the lug terminal 63 of the conductor 55 by soldering (this is a case where the conductor 55 is constituted by a wire for wiring, and a through hole (not shown) when constituted by a flexible substrate. The same shall apply hereinafter.) That is, it is necessary to select a material having heat resistance that can withstand soldering for the relay component 54. Usually, the relay component 54 is made of a metal such as aluminum or copper.

  The relay component 54 is preferably mounted on the wiring pad 62 by a reflow soldering method. Thereby, the relay component 54 can be mounted on the wiring pad 62 simply and reliably.

  Moreover, it is desirable that a predetermined step 74 is provided in the spire portion 73 of the relay component 54. By doing in this way, in the state which inserted the lug terminal 63 of the conductor 55 in the spire part 73 of the relay component 54, the solder shape at the time of joining both by soldering only presses the lug terminal 63 from upper direction. In addition, the lug terminal 63 is pressed from below, and it is possible to join more reliably.

  Here, the connection structure related to the electrical connection includes the wiring pad 62, the relay component 54, and the lug terminal 63. That is, in the connection structure related to electrical connection, the spire portion 73 is joined to the lug terminal 63 by soldering while being inserted into the lug terminal 63.

  On the other hand, conventionally, the electrical connection in such a case is generally performed by spot soldering the end portion of the conductor 55 directly to the wiring pad 62 of the substrate 57 (or the substrate 52) (hand using a soldering iron). Soldering or the like).

  However, in this method, since the wiring pad 62 and the conductor 55 are connected only by soldering, the connection strength is not sufficient. Therefore, there is a possibility that the conductor 55 may be detached from the wiring pad 62 due to vibration accompanying the occurrence of a major earthquake. In particular, when the substrate 57 (or the substrate 52) is a metal substrate, it is difficult to raise the temperature of the wiring pad 62 to a desired temperature because the thermal conductivity of the metal substrate is high. Therefore, the risk that the conductor 55 is detached from the wiring pad 62 due to poor soldering increases.

  Further, in the case of an alumina ceramic substrate, an aluminum nitride substrate, or the like, the risk that the conductor 55 is detached from the wiring pad 62 is increased as in the case of the metal substrate.

  As a countermeasure against this, it is conceivable to provide a through-hole portion for wiring (not shown) in the substrate 57 (or the substrate 52). In this way, the risk that the conductor 55 is surely disconnected from the wiring through-hole portion (not shown) (that is, the risk that the electrical connection between the board 57 (or the board 52) and the conductor 55 is cut) is reduced. can do.

  However, if the substrate 57 is made of metal, there is a problem that an extra portion is electrically connected and an electrical short circuit occurs. That is, it is not easy to provide a through-hole portion for wiring (not shown).

  Moreover, even if the substrate 57 (or substrate 52) is an alumina ceramic substrate, an aluminum nitride substrate, or the like, it is technically difficult to provide a wiring through-hole portion (not shown). Therefore, providing the through-hole portion for wiring (not shown) increases the cost.

  Furthermore, regardless of the material of the substrate 57 (or the substrate 52), a wiring through-hole portion (not shown) is provided, and the surface is provided with the wiring pad 62 by connecting to the conductor 55 using the wiring through-hole portion (not shown). As a result, a convex portion (projection of the end portion of the conductor 55) occurs on the back surface of the conductor.

  The substrate 57 needs to be placed in close contact with the support 58 in order to perform processing (heat dissipation) of the heat generated from the solid state light emitting device 56. However, due to the presence of the convex portions, it is extremely possible to realize this close placement. It becomes difficult to.

  On the other hand, the connection structure related to the electrical connection using the relay component 54 can solve such problems. That is, when the board 57 (or the board 52) and the conductor 55 are electrically connected, by using the relay component 54, the connection can be easily made and the connection can be made firmly. The risk of detachment is greatly reduced.

  Further, since no convex portion is generated on the back surface of the mounting surface of the substrate 57 (or the substrate 52) (the surface on which the wiring pads 62 are provided and the solid light emitting element 56 is mounted), the surface is supported by the support 58. The heat treatment generated from the solid state light emitting device 56 is not adversely affected.

Here, the connection structure according to the electrical connection can be created as follows.
First, as a first step, the relay component 54 is arranged on the wiring pad 62 of the substrate 57 (or the substrate 52) and then mounted. Mounting is performed by soldering. At this time, soldering is performed using a reflow method.

  In the reflow method, the entire substrate 57 (or substrate 52) is raised to a temperature suitable for soldering. Therefore, even if the substrate 57 (or the substrate 52) is a metal substrate, the relay component 54 can be mounted on the wiring pad 62 without causing a soldering failure.

  Here, the relay part 54 has a U-shape and is symmetrical. Also embossed taping. Accordingly, when the automatic mounting apparatus is used to place the wiring pads 62, the balance is not lost and the left and right are not reversed. Therefore, the relay component 54 can be easily arranged at a desired position.

  Next, as the second step, the spire portion 73 of the relay component 54 mounted on the wiring pad 62 of the substrate 57 (or the substrate 52) in the first step is inserted into the lug terminal 63 of the conductor 55.

  Next, as a third step, the spire portion 73 inserted into the lug terminal 63 in the second step is fixed to the lug terminal 63 by applying a spot solder method. At this time, since the solder step is provided with the predetermined step 74, not only can the lug terminal 63 be pressed from above but also the lug terminal 63 can be pressed from below, and the solder can be reliably joined. It becomes.

  In addition, you may join using a resistance welding method etc. instead of the spot solder method. By applying the resistance welding method, there is also an advantage that the thermal durability of the joint can be further improved.

  Here, the solder has a relatively low thermal conductivity. Therefore, the spire portion 73 inserted into the lug terminal 63 in the second step is applied by applying a spot soldering method (for example, manual soldering using a soldering iron) regardless of the material of the rigid board. The lug terminal 63 can be fixed.

  By the method described above, the substrate 57 (or the substrate 52) and the conductor 55 can be electrically connected easily. Therefore, the electric cable is not detached due to a vibration such as a large earthquake unlike the connection by direct soldering to the substrate using the electric cable which has been generally performed conventionally.

  In addition, connector terminals that can be attached to the substrate 57 (or the substrate 52) using the reflow method have been developed, but such connector terminals generally have a large volume. Therefore, when a light emitting element such as an LED is mounted on the substrate 57, there is a problem that the connector terminal blocks light emitted from the light emitting element.

  On the other hand, the relay part 54 used in the method of the present invention is very compact, and such a problem does not occur. Therefore, the merit is great.

  Further, since it is not necessary to provide a through-hole portion for wiring (not shown) on the substrate 57 (or substrate 52), the substrate 57 (or substrate 52) can be a metal, an alumina ceramic substrate, an aluminum nitride substrate, or the like. Is possible.

  Further, since no convex portion is formed on the back surface of the mounting surface (the surface on which the wiring pads 62 are provided and the solid light emitting element 56 is mounted) of the substrate 57 (or the substrate 52), the surface is supported by the support 58. The heat treatment generated from the solid state light emitting device 56 is not adversely affected.

Instead of the relay component 54, the relay component 81 may be applied.
11 is a perspective view showing the appearance of the relay part 81, and FIG. 12 is a plan view of the relay part 81 as viewed from the direction E in FIG. 11. In this way, the relay part 81 is connected to the relay part 54. A portion different from that of FIG. Other components are denoted by the same reference numerals as those of the relay component 54, and description thereof is omitted here.

  The steeple portion 83 includes a recess 84. The concave portion is configured to have a narrow width t4 with respect to the maximum width t3 of the spire portion 83. A lug terminal 86 shown in FIG. 13 is attached to the end of the conductor 55 into which the spire 83 is inserted.

  The lug terminal 86 has an elliptical through hole, t5 on the long side, and t6 on the short side.

  The magnitude relationship of t3, t4, t5, and t6 is set as follows.

  t5> t3> t6> t4

The spire portion 83 and the lug terminal 86 are connected as follows.
First, as a first step, the width direction of the spire portion 83 (direction along t3, t4) and the long side direction of the lug terminal 86 (direction along t5) are matched. The spire portion 83 is inserted into the through hole. At this time, since t5 is larger than t3, the spire portion 83 can be smoothly inserted into the lug terminal 86.

  Next, as the second step, when the spire portion 83 is inserted into the through hole of the lug terminal 86 to the position of the recess 84, the width direction (direction along t3, t4) of the spire portion 83 and the lug The lug terminal 86 (conductor 55) is rotated so that the short side direction (direction along t6) of the terminal 86 coincides.

  At this time, t6 is larger than t4, but smaller than t3. Therefore, the lug terminal 86 is not easily detached from the spire portion 83 (that is, temporarily secured). Then, it can connect more firmly by connecting both by soldering.

Moreover, since it temporarily fixes as mentioned above, there exists an advantage that the operation | work at the time of soldering the spire part 83 and the lug terminal 86 becomes easy.

  In addition, the shape of the relay components 54 and 81 shown above is an example, and the present invention is not limited to this. For example, the shape of the spire portions 73 and 83 may be a cone or an elliptical cone. Moreover, the shape which has a curve shape in part may be sufficient. The lug terminal 86 is an elliptical through hole, but may be a rectangular through hole.

  Here, as described above, the substrate 52 is disposed inside the hollow structure included in the first terminal portion 12a (or inside the hollow structure included in the second terminal portion 12b). Furthermore, a mounting surface (surface on which the element 53 is mounted) is arranged along the Y direction shown in FIG.

  By performing such an arrangement, it is not necessary to arrange the substrate 52 in the housing 11, and the width of the first terminal portion 12a in the X direction can be reduced. This leads to an increase in the range in which the solid-state light emitting elements 56 in the X direction shown in FIG. That is, the irradiation area of the light emitted from the light source unit 2 can be expanded, and the convenience for the user can be improved.

  The solid light emitting element 56 is, for example, an LED. Since the light source unit 2 (illuminating device 1) is used for illumination, when an LED is used as the solid state light emitting device 56, a high power LED (an LED having a power capacity of 1 W or more and a surface mount type LED) should be adopted. Is desirable.

  High power LEDs have high luminous intensity and are therefore suitable for lighting applications. It seems that LED manufacturers are also making progress toward improving the luminous efficiency of this high-power LED, and at the present time, high-power LEDs that have luminous efficiency comparable to fluorescent lamps are commercially available. It is coming. In view of such a flow, the inventors adopted a high power LED as the solid state light emitting device 56.

  The substrate 57 is a substrate on which the solid light emitting element 56 is mounted. As described above, it is preferable to adopt a metal substrate, an alumina ceramic substrate, an aluminum nitride substrate, etc. in consideration of thermal conductivity. This is because, when a high power LED is used as the solid state light emitting device 56 as described above, if heat generated as a loss from these accumulates in the vicinity of the high power LED, it may cause failure, deterioration of life characteristics, and the like. sell. Therefore, heat accumulation was prevented by adopting the above-described high thermal conductivity material as the substrate 57.

As the role of the support 58, the following three can be cited as main ones.
First, the substrate 57 is supported. Within the housing 11, the position of the substrate 57 (including the solid light emitting element 56 mounted on the substrate 57) is defined.

  Secondly, heat generated as a loss in the solid state light emitting device 56 (high power LED) is transferred to contribute to discharging the heat to the outside of the housing 11. Therefore, the support 58 is made of a material having excellent thermal conductivity (the inventors adopt metal, specifically, aluminum), and is disposed so as to be in close contact with the housing 11 and the substrate 57. (Arranged so that air does not enter as much as possible.) By doing in this way, the heat | fever discharge | emission to the exterior of the desired housing | casing 11 can be performed.

  Here, the inventors assumed that the support 58 is made of a material in which fine metal powder, carbon powder, carbon nanotubes, or the like are mixed in a resin material such as polycarbonate. May be. Such materials are based on the fact that metal powder or the like is mixed therein, and can improve thermal conductivity as compared with ordinary polycarbonates in which these materials are not mixed. Therefore, from this point of view, it can be adopted for this purpose. Further, configuring the support body 58 with such a material has an advantage that the weight can be reduced.

  Third, it plays a role of reflecting a part of the light emitted from the solid state light emitting device 56. This is a so-called point light source when the high power LED is used as the solid state light emitting device 56, and the emitted light has directivity. Therefore, even if the plurality of solid-state light emitting elements 56 (high power LEDs) are arranged as shown in FIG. 6, the light obtained by the light source unit 2 (illumination device 1) may be uneven.

  Therefore, a part of the support 58 is used as the reflection surface 59 to reflect a part of the light emitted from the solid state light emitting device 56 (high power LED). In the tests of the inventors, it has been confirmed that this can reduce unevenness of light obtained by the light source unit 2 (illumination device 1).

  The reflective surface 59 is provided along the side surface of the solid light emitting element 56. In addition, good results are obtained when the angle θ1 of the reflecting surface 59 is in the range of 30 degrees to 60 degrees.

  In the light source unit 2, the casing 11 is configured to have translucency in at least the light emitting direction of the solid light emitting element 56 as described above. The inventors configured the casing 11 using polycarbonate in consideration of weather resistance and durability, but may be configured with glass, other resin materials (acrylic), or the like. The constituent material may be selected according to the application.

  Here, the above-described material constituting the housing 11 has a drawback that its thermal conductivity is very low as compared with a metal or the like. Therefore, in order to overcome this drawback, the light source unit 2 has the following heat dissipation mechanism.

  The solid light emitting element 56 is mounted on the substrate 57, and a high power LED is adopted as the solid light emitting element 56. This high power LED is a surface mount type. The surface mount type LED has a large electrode area, and therefore, a contact area with the substrate 57 becomes large. Therefore, heat generated as a loss in the high power LED can be efficiently transferred to the substrate 57.

  The substrate 57 and the support 58 are made of a material having high thermal conductivity such as metal (the inventors have made the substrate 57 of aluminum, alumina ceramic, or aluminum nitride, and made the support 58 of aluminum. And are in close contact with each other. That is, the back surface of the surface on which the solid light emitting element 56 of the substrate 57 is mounted is configured to be in close contact with the support body 58.

  Here, the reason why the substrate 57 and the support body 58 are in close contact with each other is to prevent air from entering between the substrate 57 and the support body 58.

  Since the thermal conductivity of air is very low (compared to polycarbonate or the like constituting the housing 11), it becomes a factor that hinders heat transfer from the substrate 57 to the support 58. Therefore, it is important that the substrate 57 and the support body 58 are brought into close contact with each other to prevent air from entering. The above may be realized, for example, by sandwiching an adhesive (not shown) and a double-sided tape without a base material (not shown) between the substrate 57 and the support 58. Furthermore, it is also preferable to enhance the adhesion by performing press working in the above state.

  Heat dissipation from the support 58 configured as described above to the outside of the light source unit 2 is performed via the housing 11. Here, the polycarbonate or the like constituting the housing 11 has a very low thermal conductivity as compared with a metal or the like as described above. However, on the other hand, the surface area of the outer side of the light source unit 2 of the housing 11 has a significant area in the surface area of the light source unit 2. Therefore, heat can be radiated using the housing 11.

  Specifically, heat is transferred from the support 58 to the housing 11. Then, heat is radiated from the housing 11 to the outside air of the light source unit 2. At this time, it is important that the support body 58 and the housing 11 are brought into close contact with each other as much as possible (to eliminate the influence of air having low thermal conductivity even when compared with polycarbonate or the like constituting the housing 11. It is important.)

  In order to make the support body 58 and the housing | casing 11 contact | adhere, the shape of the part (surface) closely_contact | adhered with the inner wall surface of the housing | casing 11 of the support body 58 is the shape of the inner wall surface of the housing | casing 11 in which the said contact | adherence arrangement | positioning is made. It was made to correspond.

  For example, when the casing 11 is configured as a cylindrical shape, the inner wall surface of the casing 11 has an arc shape in a cross section along the Y direction (for example, D3-D4 plane shown in FIG. 7). Corresponding to this, the portion of the support 58 that is in close contact with the inner wall surface of the casing 11 is also formed in an arc shape. By doing in this way, the support body 58 and the housing | casing 11 can be stuck.

  Furthermore, the adhesion between the support 58 and the housing 11 can be improved by the following method.

  A heat dissipation sheet is sandwiched between the support body 58 and the housing 11. Thereby, it is possible to prevent air from entering between the support body 58 and the housing 11, and a heat dissipation sheet having better thermal conductivity than air is interposed between the support body 58 and the housing 11. Can do. That is, this effectively increases the adhesion between the support 58 and the housing 11.

  In addition, for the purpose of improving the heat dissipation of the housing 11 itself, while keeping the necessary light transmissivity in the housing 11, a material for improving the heat dissipation (fine metal powder, carbon powder, or It is also effective to mix carbon nanotubes). By doing in this way, the heat conductivity of the housing | casing 11 can be improved compared with the case where the material which improves the said heat dissipation is not mixed.

  In particular, the non-light-emitting direction of the solid-state light emitting element 56 does not require translucency. Therefore, the material that enhances the heat dissipation can be mixed into the housing 11 without considering translucency.

  Moreover, it is also possible to radiate heat using the first terminal portion 12a and the second terminal portion 12b. In this case, the 1st terminal part 12a and the 2nd terminal part 12b are comprised with a material with high heat conductivity. For example, these are made of aluminum.

  The first terminal portion 12a and the second terminal portion 12b are fixed using the support 58 and the connection portion 61, respectively. In this case, the connection portion 61 is also made of a material having high thermal conductivity.

  As described above, the first terminal portion 12a, the second terminal portion 12b, the support body 58, and the connection portion 61 are all made of a material having high thermal conductivity.

  Here, the first terminal portion 12a and the second terminal portion 12b are fixed using the support body 58 and the connection portion 61, respectively, as described above. However, it is important to arrange them in close contact with each other. is there.

  By comprising in this way, heat can be smoothly transferred from the support body 58 to the 1st terminal part 12a and the 2nd terminal part 12b via the connection part 61. FIG. Then, heat is radiated to the outside air of the light source unit 2 from the first terminal portion 12a and the second terminal portion 12b.

  The close contact arrangement with the connection portions 61 of the first terminal portion 12a and the second terminal portion 12b is realized by fixing using, for example, a metal bolt (not shown). At this time, an adhesive (not shown) and a double-sided tape without a substrate (not shown) are sandwiched between the first terminal portion 12a and the connecting portion 61 and between the second terminal portion 12b and the connecting portion 61. This is effective in the sense of further improving the adhesion and preventing air from entering.

  Further, the close contact arrangement between the support body 58 and the connection portion 61 can be realized by, for example, integrally forming them.

With the heat dissipation mechanism described above, the light source unit 2 can perform appropriate heat dissipation.
Here, the light source unit 2 is a light source unit having airtightness. The airtightness is maintained even when the environmental temperature changes. This will be described below.

  Here, for the sake of explanation, as shown in FIG. 6, the distance connecting the bottom surface of the hollow structure of the first terminal portion 12a and the bottom surface of the hollow structure of the second terminal portion 12b is α, and the hollow of the first terminal portion 12a. The distance connecting the upper surface of the structure and the upper surface of the hollow structure of the second terminal portion 12b is β, and the length in the longitudinal direction of the housing 11 (distance along the X direction) is γ.

  As described above, the first terminal portion 12 a and the second terminal portion 12 b are fixed to the support body 58 using the connection portion 61. Further, the end portions of the housing 11 are inserted into the hollow structures provided in the first terminal portion 12 a and the second terminal portion 12 b, respectively, but the first terminal portions 12 a and the second terminal portions 12 b are connected to the housing 11. It is not fixed. Further, the support body 58 is not fixed to the housing 11. With such a structure, the housing 11 can be moved in the range of α along the X direction.

  Here, the light source unit 2 can maintain the airtightness of the internal space of the light source unit 2 within the environmental temperature range in which it is used. The reason will be explained.

  Here, for explanation, it is assumed that α at an environmental temperature of 20 ° C. is 1000 mm, β is 990 mm, and γ is 995 mm. Further, it is assumed that the casing 11 is made of polycarbonate, and the support body 58 (including the connecting portion 61) is made of aluminum. The linear expansion coefficients are 0.000066 / ° C. for polycarbonate and 0.000024 / ° C. for aluminum. Moreover, the environmental temperature range which uses the light source unit 2 at this time shall be -30 degreeC to 70 degreeC.

First, at an environmental temperature of 20 ° C. , the magnitude relationship among α, β, and γ is as follows.
α>γ> β
It becomes the relationship. Thus, the structure constituted by the support body 58 (including the connection portion 61), the first terminal portion 12a, and the second terminal portion 12b does not cause the housing 11 to be detached. Therefore, the airtightness of the internal space of the light source unit 2 can be ensured.

  In addition, the airtightness said here is airtightness of a grade which an insect, dust, etc. do not enter into the inside of the said space.

  Here, in the use of the light source unit 2, when an insect or the like enters the space, not only the aesthetic appearance is impaired, but there is a concern that the dead body or the like may adversely affect the lighting device 1 (light source unit 2) itself. .

  Therefore, ensuring the airtightness is valuable in terms of providing convenience to the user of the lighting device 1 (light source unit 2).

  Next, at an environmental temperature of −30 ° C., which is the lower limit of the operating environmental temperature, γ becomes relatively small (short) with respect to α and β based on the difference in linear expansion coefficient.

  Specifically, under the above conditions, the distances (lengths) of α, β, and γ are approximately 999 mm for α, approximately 989 mm for β, and approximately 992 mm for γ.

Therefore, even in this case,
α>γ> β
The airtightness of the internal space of the light source unit 2 is also maintained in this case.

  Next, at an environmental temperature of 70 ° C., which is the upper limit of the use environmental temperature, γ is relatively large (long) with respect to α and β based on the linear expansion coefficient.

  Specifically, under the above conditions, the distances (lengths) of α, β, and γ are approximately 1001 mm for α, approximately 991 mm for β, and approximately 998 mm for γ.

Therefore, even in this case,
α>γ> β
The airtightness of the internal space of the light source unit 2 is also maintained in this case.

  That is, as described above, the light source unit 2 can maintain the airtightness of the internal space of the light source unit 2 within the environmental temperature range in which the light source unit 2 is used.

In the design stage of the light source unit 2, the above is within the environmental range in which the light source unit 2 is used.
α>γ> β
Can be easily realized by setting the size (length) of these components based on the linear expansion coefficient of the material used for the housing 11 and the support 58 (including the connecting portion 61). .

Further, the housing 11 is configured to be movable within a range of α along the X direction of FIG. Therefore, the housing 11 and the like are not subjected to stress due to changes in the values of α, β, and γ based on the difference in the linear expansion coefficient .

  Combined with this, the light source unit 2 can ensure the airtightness of the internal space of the light source unit 2 without applying stress to its constituent elements (for example, the casing 11).

  Here, after connecting the first terminal portion 12a, the second terminal portion 12b, and the support body 58, one end portion of the housing 11 and the first terminal portion 12a are connected, and the other end portion and the second terminal portion are connected. Connecting each of 12b is a problem because it leads to damage of the casing 11 and the like. This is because stress is applied to the fixed portion and the like.

  Further, after connecting the first terminal portion 12a, the second terminal portion 12b, and the support body 58, only one end portion of the housing 11 is connected to the first terminal portion 12a (or the second terminal portion 12b). This is because stress applied to the casing 11 and the like is compared with the case where one end of the casing 11 is connected to the first terminal portion 12a and the other end is connected to the second terminal portion 12b. Can be reduced.

  However, the stress is only reduced. That is, unlike the light source unit 2 according to the present embodiment, the housing 11 cannot be configured to be movable, and therefore there is a possibility that stress is applied to the fixed portion.

  Patent Document 1 discloses a waterproof structure of an end portion of the tubular case in a linear light source in which an LED module is inserted into the tubular case. In this waterproof structure, a filler is injected into a recess formed by a sealing plug attached to the end of the tubular case and the tubular case. It is said that this waterproof structure can realize a linear light source that is highly airtight, that is, that can prevent moisture from entering the tube case.

  However, it is considered difficult to apply the waterproof structure disclosed in Patent Document 1 to a lighting device used in a low temperature environment. In the linear light source disclosed in Patent Document 1, a sealing plug is attached to the end portion of the tube case as described above, and a filler is injected into a recess formed by the tube case.

  Here, in a low temperature environment, each component is generally shrunk, but the degree of shrinkage varies depending on the material of each component. This is because the linear expansion coefficient differs depending on the material.

  In the waterproof structure disclosed in Patent Document 1, there is a gap between the sealing plug and the filler or between the tubular case and the filler based on the difference in the degree of shrinkage between the materials in a low temperature environment. May occur. Therefore, it is considered that airtightness is impaired.

  On the other hand, as for the light source unit 2 of the illuminating device 1 of this invention, the 1st terminal part 12a and the 2nd terminal part 12b are being fixed to the support body 58 using the connection part 61. FIG. With such a structure, the housing 11 can be moved in the range of α along the X direction.

Therefore, the housing 11 and the like are not subjected to stress due to changes in the values of α, β, and γ based on the difference in the linear expansion coefficients of the materials constituting the housing 11 and the support body 58. Furthermore, α>γ> β within the ambient temperature range in which the light source unit 2 is used.
Is maintained. Therefore, the light source unit 2 can ensure the airtightness of the internal space of the light source unit 2.

  Further, in the light source unit 2, the first terminal portion 12 a and the second terminal portion 12 b are connected to the support body 58 via the connection portion 61 and are not fixed to the housing 11. Therefore, when the support body 58 and the connection part 61 are comprised with aluminum, the change of the full length by the fluctuation | variation of environmental temperature will generate | occur | produce based on the linear expansion coefficient of aluminum. For example, when the total length of the light source unit 2 is 1000 mm, the variation of the total length (length along the X direction) is about ± 1 mm when the environmental temperature is in the range of −30 ° C. to 70 ° C.

  Here, if the first terminal portion 12a and the second terminal portion 12b are fixed to the housing 11 and are not connected to the support body 58 and the connecting portion 61, and the housing 11 is made of polycarbonate. Based on the linear expansion coefficient of polycarbonate, a change in the total length due to a change in environmental temperature occurs. As described above, when the total length is 1000 mm, the fluctuation of the total length (length along the X direction) is about ± 3 mm when the environmental temperature is in the range of −30 ° C. to 70 ° C. That is, in the case of such a configuration, the first terminal portion 12a and the second terminal portion 12b are very large compared to the case where the first terminal portion 12a and the second terminal portion 12b are configured to be connected to the support body 58 via the connection portion 61. Variations in the overall length will occur. When such a large change in the overall length occurs, there is a risk that the light source unit 2 is detached from the holding unit 3 due to a change in the environmental temperature, which is dangerous.

  Therefore, it is important to configure the first terminal portion 12a and the second terminal portion 12b to be connected to the support body 58 via the connection portion 61.

As described above, the light source unit 2 is configured.
Next, the holding unit 3 will be described. The holding unit 3 includes a main body portion 91, a first attachment portion 92a, and a second attachment portion 92b.

The main body 91 incorporates a power supply device 101.
The first mounting portion 92a is provided with a first sensing pin hole 93a, a second sensing pin hole 93b, a first power supply pin hole 94a, and a second power supply pin hole 94b. Each of the first sensing pin 14a, the second sensing pin 14b, the first power supply pin 15a, and the second power supply pin 15b included in the light source unit 2 can be inserted.

  The second mounting portion 92b is provided with a first support pin hole 94c and a second support pin hole 94d. A first support pin 15c and a second support pin 15d can be inserted into each.

  The first sensing pin hole 93 a and the second sensing pin hole 93 b are connected to the sensing unit 104 of the power supply device 101. That is, it is detected whether the light source unit 2 is attached to the holding unit 3 using the first sensing pin hole 93a, the second sensing pin hole 93b, the first sensing pin 14a, and the second sensing pin 14b. Is done.

  Further, the first power supply pin hole 94 a and the second power supply pin hole 94 b are connected to the supply unit 102 of the power supply device 101. That is, power is supplied to the solid state light emitting device 56 using the first power supply pin hole 94a, the second power supply pin hole 94b, the first power supply pin 15a, and the second power supply pin 15b. .

  Further, the first support pin hole 94c and the second support pin hole 94d are not connected to the power supply device 101. This is because the light source unit 2 including the first support pin 15c and the second support pin 15d is purely used for attachment (support) to the holding unit 3.

The holding unit 3 is configured as described above.
Since the light source unit 2 and the holding unit 3 have the above-described configuration, the light source unit 2 can be attached / detached to / from the holding unit 3.

  In the lighting device 1, the light source unit 2 is provided with the first sensing pin 14a and the second sensing pin 14b, and the holding unit 3 is provided with the first sensing pin hole 93a and the second sensing pin hole 93b. The appearance is the same as that of a fluorescent lamp. Further, as described above, the substrate 52 is arranged to expand the possible arrangement range of the solid-state light emitting elements 56 in the X direction in the light source unit 2. Therefore, the user does not feel uncomfortable with the fluorescent lamp.

  Further, by adopting a high power LED as the solid state light emitting device 56, it is possible to provide the user with illumination with a long life. In addition, it has a mechanism that can appropriately handle heat generated as a loss in the solid state light emitting device 56 (high power LED), and does not impair its long life.

Next, the operation (mainly electrical operation) of the lighting device 1 will be described.
FIG. 17 is a functional block diagram illustrating functions of the lighting device 1. The illumination device 1 includes a light source unit 2 and a holding unit 3. The holding unit 3 includes a power supply device 101.

  The power supply apparatus 101 includes a supply unit 102, an instruction unit 103, and a sensing unit 104. A commercial power supply 105 is connected to the power supply device 101.

  Here, the commercial power source 105 is AC power supplied from a power company to general households, factories, and the like.

  Supply unit 102 is driven based on an instruction from instruction unit 103. Specifically, the instruction unit 103 generates DC power to be supplied to the solid state light emitting element 56 (light source unit 2) based on the instruction. The generated DC power is supplied to the solid state light emitting device 56 (light source unit 2).

  The instruction unit 103 gives an instruction to the supply unit 102 based on an instruction from the sensing unit 104. That is, when the sensing unit 104 senses that the light source unit 2 is attached to the holding unit 3, it generates DC power to supply power to the solid state light emitting element 56 (light source unit 2) to the supply unit 102. Instruct.

  At this time, the instruction unit 103 uses the direct-current power to be supplied to the solid-state light emitting element 56 (light source unit 2) based on information sent from the outside or information held in a memory (not shown) included in the instruction unit 103. And the supply unit 102 is instructed to generate the DC power.

  In addition, the instruction unit 103 monitors the value of the DC power supplied from the supply unit 102 to the solid state light emitting element 56 (light source unit 2) (that is, the operating point of the solid state light emitting element 56 (light source unit 2)), and Is held in a memory (not shown).

  Further, when the sensing unit 104 does not sense attachment of the light source unit 2 to the holding unit 3, it instructs the supply unit 102 to stop.

  The sensing unit 104 senses whether or not the light source unit 2 is attached to the holding unit 3 and notifies the instruction unit 103 of the sensing result.

  FIG. 18 is an example of a circuit configuration of the lighting device 1. This circuit configuration is merely an example, and any circuit that implements the above-described functions is acceptable, and the present invention is not limited to this.

  The supply unit 102 includes coils 121 and 122, capacitors 123 and 130, a diode bridge circuit 124, a resistor 124a, a driver 125, a field effect transistor (hereinafter referred to as FET) 126, a transformer 127, diodes 128 and 129, a connection point 134, 135.

  The coils 121 and 122, the capacitor 123, and the diode bridge circuit 124 remove noise components included in the alternating current supplied from the commercial power supply 105, and rectify the alternating current in a full wave to generate a pulsating flow.

  The resistor 124 a is used to monitor the direct current (instantaneous value) output from the diode bridge circuit 124.

  The driver 125, the FET 126, and the transformer 127 make the pulsating flow a duty-controlled pulse waveform based on an instruction from the instruction unit 103. That is, if the instruction from the instruction unit 103 instructs generation of an ON pulse, the FET 126 is turned on and an ON pulse is generated on the secondary side of the transformer 127. On the other hand, if the instruction from the instruction unit 103 instructs generation of an OFF pulse, the FET 126 is turned off and an OFF pulse is generated on the secondary side of the transformer 127.

  The diodes 128 and 129 and the capacitor 130 rectify the pulse waveform generated on the secondary side of the transformer 127 (removal of noise components, etc.). The DC power that has passed through these is supplied to the solid-state light-emitting element 56 via resistors 131 and 132 and connection points 134 and 135 that are components of the instruction unit 103 described later.

  The connection point 134 indicates a connection point between the first power supply pin 15a and the first power supply pin hole 94a, and the connection point 135 includes the second power supply pin 15b and the second power supply pin hole 94b. The point of connection.

The instruction unit 103 includes resistors 131 and 132 and a controller 133.
The resistors 131 and 132 are provided for monitoring the value of DC power supplied from the supply unit 102 to the solid state light emitting device 56. The value of DC power monitored by the resistors 131 and 132 is sent to the controller 133. The value of the monitored DC power is referred to as an operating point. The operating point is held as history information in a memory (not shown) in the controller 133.

  The controller 133 holds the operating point in a memory (not shown) as history information as described above. In addition, based on information sent from the outside, information held in advance in a memory (not shown), and an operating point, a target operating point (a value of DC power to be supplied to the solid state light emitting element 56) is indicated. Ask. An instruction is given to the supply unit 102 in order to achieve the target operating point. That is, it instructs the conduction / non-conduction of the FET 126.

  However, the conduction of the FET 126 is instructed only during the period in which the sensing unit 104 senses the attachment of the light source unit 2 to the holding unit 3. For a period in which attachment of the light source unit 2 to the holding unit 3 is not sensed, the FET 126 is always instructed to be non-conductive.

  The sensing unit 104 includes a controller 133, connection points 136 and 137, and a connection unit 139. The connection point 136 corresponds to an electrical contact portion between the first sensing pin 14a and the first sensing pin hole 93a. The connection point 137 corresponds to an electrical contact portion between the second sensing pin 14b and the second sensing pin hole 93b.

  The connection part 139 is a part where the first sensing pin 14a and the second sensing pin 14b in the light source unit 2 are electrically connected. In the substrate 52, the first sensing pin 14a and the second sensing pin 14b are connected. The electrical connection is made. In the connection part 139, the first sensing pin 14a and the second sensing pin 14b may be directly electrically connected, and the element 53 (for example, an element having a successful component for preventing overcurrent) ) Through a substantially electrical connection.

  The controller 133 recognizes that the light source unit 2 is attached to the holding unit 3 when a closed circuit with the path from the connection point 136 to the connection part 139 to the connection point 137 is established.

  On the other hand, when a closed circuit with the path from the connection point 136 to the connection part 139 to the connection point 137 is not established (that is, when it is open), the light source unit 2 is not attached to the holding unit 3. Recognize.

FIG. 19A is a flowchart showing the operation of the lighting device 1.
In S111, the power supply apparatus 101 is turned on. This may be performed by a switch (not shown) provided in the holding unit 3 or the like, or may be performed using a wired or wireless communication line (not shown).

  In S <b> 112, the sensing unit 104 senses the attachment state of the light source unit 2 to the holding unit 3 and notifies the instruction unit 103 of the result. When it is recognized that the light source unit 2 is attached to the holding unit 3 (YES in S112), the process proceeds to S113. On the other hand, when it is recognized that the light source unit 2 is not attached to the holding unit 3 (NO in S112), the process proceeds to S114.

  In S113, the instruction unit 103 determines the target operating point (based on information sent from the outside, information stored in advance in a memory (not shown), and operating points held in memory (not shown) as history information. DC power generated by the supply unit 102). Then, the supply unit 102 is controlled to achieve the target operating point. The supply unit 102 supplies the generated DC power to the solid state light emitting device 56 (light source unit 2).

  In addition, the directing unit 103 supplies power to the solid light emitting element 56 (light source unit 2) from the supplying unit 102 during the period when power is supplied from the supplying unit 102 to the solid light emitting element 56 (light source unit 2). The power value (that is, the operating point of the solid state light emitting device 56 (light source unit 2)) is monitored and stored in the memory as history information.

  Note that the period of monitoring may be arbitrary. The inventors set an interval in the range of 0.2 to 1 second, and obtained good results. The operating point held in the memory (not shown) as the history information is used as one of the indices when the instruction unit 103 obtains the target operating point as described above.

  When obtaining the target operating point, the instruction unit 103 determines the target operating point based on the operating point immediately before obtaining the target operating point among the operating points held in the memory (not shown) as history information. You may ask. The operating point immediately before obtaining the target operating point here refers to the operating point monitored by the instruction unit 103 last time.

  The previous operation of S112 is performed when it is recognized that the light source unit 2 is not attached to the holding unit 3, and the light source to the holding unit 3 when the operation of S112 is performed this time. When it is recognized that the unit 2 is attached (hereinafter referred to as a transition), the instruction unit 103 obtains the target operating point among the operating points held in memory (not shown) as history information. It is preferable to obtain the target operating point not based on the operating point immediately before (latest) but on the operating point a predetermined number of times before the latest.

  Here, in the case of transition, the reason for obtaining the target operating point based on the operating point a predetermined number of times in this way is as follows.

  If the target operating point is obtained based on the latest operating point, the target operating point is determined based on the operating point monitored by the instruction unit 103 at the end of the period in which the light source unit 2 was previously attached to the holding unit 3. It will be required. If the removal of the light source unit 2 from the holding unit 3 is being performed while the instruction unit 103 is finally monitoring, the monitored operating point may be an abnormal value. . Therefore, when the target operating point is obtained based on this, there is a risk that the target operating point itself also becomes an abnormal value. It is therefore necessary to avoid this risk.

  As described above, if the operating point is a predetermined number of times before, it is not an abnormal value, and therefore the target operating point based on it is not an abnormal value. Therefore, it is preferable to obtain the target operating point based on the operating point a predetermined number of times ago.

  Note that the predetermined number of times may be arbitrary, but if the number of times is too large (that is, the past operating point is too much), there is a possibility that information sent from the outside has changed during that time (that is, In the meantime, there is a possibility that the target operating point has been greatly changed). This naturally affects the operating point, so it is problematic to set the target operating point based on past operating points too.

  Therefore, it is necessary to select an appropriate number as the predetermined number of times. In the inventors' tests, the operating point immediately before the latest (latest) operating point is excluded except the previous (latest) operating point. If the count is 1 or more and 10 or less, good results are obtained.

  In the case of transition, it is desirable that the supply of power to the solid state light emitting device 56 (light source unit 2) by the supply unit 102 is started after a predetermined time has elapsed.

  For this reason, the operator attaches the light source unit 2 to the holding unit 3, but when the supply of power to the solid state light emitting device 56 (light source unit 2) by the supply unit 102 is started, Naturally, light emission of the solid light emitting element 56 (light source unit 2) is also started.

  As soon as the solid-state light emitting element 56 (light source unit 2) starts to emit light immediately after the attachment, the operator is surprised by sudden light emission, and in the worst case, an accident may occur.

  Therefore, in the case of transition as described above, it is desirable that the supply of power to the solid state light emitting device 56 (light source unit 2) by the supply unit 102 is started after a predetermined time has elapsed. The predetermined time may be arbitrary, but may be, for example, 1 second or longer after the transition. As a result, the safety of the operator can be further enhanced.

  In S <b> 114, the instruction unit 103 instructs the supply unit 102 to stop the operation. That is, in this case, the supply unit 102 does not generate DC power and does not supply power to the solid state light emitting device 56 (light source unit 2). Of course, the operating point is not monitored.

  In S115, it is determined whether or not the power supply of the power supply apparatus 101 is turned off. The power supply device 101 may be turned off by a switch (not shown) provided in the holding unit 3 or the like, or may be used using a wired or wireless communication line (not shown).

  If the power supply 101 is turned off (YES in S115), the operation of the lighting device 1 is terminated. On the other hand, when the power supply of the power supply apparatus 101 is not cut off (NO in S115), the process returns to S112 and continues the operation.

  Here, the solid light emitting element 56 (LED) is easily dimmable, but in order to perform dimming, it is necessary to control DC power supplied to the LED from the power supply device. In this case, if the light source unit is inserted into the holding unit in the live state, power supply to the LED is suddenly started, and there is a concern that the control may be disturbed. This has a risk of leading to LED damage and the like.

  In view of such a situation, Patent Document 2 discloses that although it is not a lighting device using an LED, it is a power supply device and can prevent an overvoltage state of an output voltage due to load fluctuation. A power supply device is disclosed. By applying the power supply device disclosed in Patent Document 2 to a lighting device using LEDs, it is possible to prevent disturbance in control when the light source unit is inserted into the holding unit in a live state. At first glance it seems.

  However, the power supply device disclosed in Patent Document 2 is considered difficult to apply to a lighting device using LEDs. This is because the power supply device uses a dummy load and is configured to pass a current through the dummy load when the load is not connected.

  That is, when the power supply device disclosed in Patent Document 2 is applied to the illumination device using the LED, when the light source unit is detached from the holding unit in a live state, power is supplied by a dummy load. Will be consumed. This is because the power consumed by the dummy load is wasted, and thus it becomes impossible to realize the reduction of power consumption expected for the lighting device using the LED.

  On the other hand, the illuminating device 1 according to Embodiment 1 includes a light source unit 2 including a solid light emitting element 56 and a power supply device 101 that can hold the light source unit 2 and supply power to the light source unit 2. The power supply apparatus 101 includes the holding unit 3 configured, and the power supply device 101 generates a power by detecting the holding / non-holding of the light source unit 2 with respect to the holding unit 3, and the light source unit. The supply unit 102 supplies power to the light source unit 2 only during a period when the sensing unit 104 senses holding, and the sensing unit 104 senses non-holding. No power is generated during the period.

  In such a lighting device 1, power is generated in the supply unit 102 only during a period in which the light source unit 2 is held by the holding unit 3, and wasteful power consumption can be reduced.

  In the power supply apparatus 101, it is also effective to control the conduction period / non-conduction period of the FET 126 from the controller 133 based on the average value of instantaneous values of the current output from the diode bridge circuit 124.

  By doing so, it is possible to prevent fluctuations in the light emission intensity of the solid state light emitting element 56, failure thereof, or failure of the power supply device 101 itself without being affected by voltage fluctuations of the commercial power supply 105. Convenience can be provided to users.

  FIG. 19B is a flowchart for explaining control of the conduction period / non-conduction period of the FET 126 based on the average value of instantaneous values of the current output from the diode bridge circuit 124 within a predetermined period.

  In S161, the controller 133 obtains the current flowing through the resistor 124a (the instantaneous value of the current output from the diode bridge circuit 124), and obtains the average value within a predetermined period.

  Note that the predetermined period must be longer than a period corresponding to ½ of the cycle of the commercial power source 105. This is because the waveform of the current flowing through the resistor 124a is a waveform having a periodicity in a period that is 1/2 of the period of the commercial power supply 105 in principle.

  In S162, the controller 133 estimates the waveform of the current estimated to flow through the resistor 124a based on the average current value obtained in S161. This estimated waveform (estimated waveform) is stored in an internal memory (not shown) in the controller 133.

  In S163, the controller 133 compares the estimated waveform estimated in S162 with the current value (instantaneous value) flowing through the resistor 124a at the present time.

  That is, the controller 133 reads a current value (instantaneous value) estimated to flow through the resistor 124a at the present time from an estimated waveform stored in its internal memory (not shown). The read value is compared with the current value (instantaneous value) flowing through the resistor 124a at the present time.

  If the current value (instantaneous value) flowing through resistor 124a at the current time is higher than the estimated current value (instantaneous value) (YES in S163), the process proceeds to S164.

  On the other hand, if the current value (instantaneous value) flowing through resistor 124a is lower than the estimated current value (instantaneous value) (NO in S163), the process proceeds to S165.

  In S164, the controller 133 controls the conduction period / non-conduction period of the FET 126. Specifically, a control signal necessary for reducing the conduction period of the FET 126 from immediately before is generated. The created control signal is sent to the driver 125, and the FET 126 is controlled.

  The reason for performing such an operation is to reduce the current value (instantaneous value) flowing through the resistor 124a. Since the current value (instantaneous value) that actually flows through the current value (instantaneous value) that is estimated is larger than the estimated current value (instantaneous value), the conduction period of the FET 126 is reduced from the previous time to correct it.

  In S165, the controller 133 controls the conduction period / non-conduction period of the FET 126. Specifically, a control signal necessary for extending the conduction period of the FET 126 from immediately before is created. The created control signal is sent to the driver 125, and the FET 126 is controlled.

  The reason for performing such an operation is to increase the current value (instantaneous value) flowing through the resistor 124a. Since the current value (instantaneous value) that actually flows through the current value (instantaneous value) that is estimated is smaller than the estimated current value (instantaneous value), the conduction period of the FET 126 is expanded from immediately before to correct it.

  In S166, the controller 133 determines whether or not the total number of times since the designation (correction) of the ratio based on the average value of the current output from the resistor 124a has reached the reference number. The reference number may be arbitrarily set.

  If the total number has reached the reference number (YES in S166), this designation (correction) is terminated. On the other hand, if the total number has not reached the reference number, the process returns to S163 to continue the designation (correction).

  By controlling the conduction period / non-conduction period of the FET 126 based on the average value of the instantaneous value of the current output from the diode bridge circuit 124 within the predetermined period as described above, voltage fluctuations of the commercial power supply 105 can be quickly caused. It becomes possible to detect and avoid the influence which the illuminating device 1 receives by it.

  Specifically, even when the voltage of the commercial power source 105 increases, the operating point of the solid state light emitting element 56 increases due to the increase in power supplied to the solid state light emitting element 56 (that is, the emission intensity). Can be avoided). Of course, it is possible to cope with the case where the voltage of the commercial power supply 105 becomes low.

  This avoids fluctuations in the light emission intensity of the light source unit 2 (solid-state light emitting element 56) and provides stable illumination for the user of the lighting apparatus 1 as well as the power supply apparatus 101 due to voltage fluctuations in the commercial power supply 105. It is also effective for avoiding failure of the light source unit 2 and the like.

(Embodiment 2)
The illumination device 200 according to Embodiment 2 includes a light source unit 201 and a holding unit 211.

  FIG. 20 is a plan view showing the appearance of the lighting device 200. FIG. FIG. 21 is a perspective view showing an appearance of the light source unit 201. 22 is a plan view of the light source unit 201 viewed from the H direction in FIG. FIG. 23 is a plan view showing the appearance of the holding unit 211. FIG. 24 is a plan view of the holding unit 211 viewed from the I direction in FIG.

  The light source unit 201 is different from the light source unit 2 only in that the first terminal portion 12a is changed to the first terminal portion 202 and the second sensing pin 14b is changed to the second sensing pin 203. Other parts are denoted by the same reference numerals as those of the light source unit 2 and description thereof is omitted.

  Further, the holding unit 211 is different from the holding unit 3 only in that the first mounting portion 92 a is changed to the first mounting portion 212 and the second sensing pin hole 93 b is changed to the second sensing pin hole 221. is there. Other parts are denoted by the same reference numerals as those of the holding unit 3 and description thereof is omitted.

  In the lighting device 200, the first sensing pin 14a and the second sensing pin 203 of the light source unit 201 are different in shape. Along with this, the shapes of the first sensing pin hole 93a and the second sensing pin hole 221 which are holes for inserting them are different.

  Here, when attaching the light source unit 201 to the holding unit 211, there is a concern that power may be supplied to an undesired polarity by attaching it in the wrong direction. This is not preferable because the solid state light emitting device 56 may be damaged.

  In the lighting device 200, as described above, the first sensing pin 14a and the second sensing pin 203 of the light source unit 201 have different shapes, and the first sensing pin hole 93a is a hole for inserting them. The shape of the second sensing pin hole 221 is different. For this reason, it is possible to eliminate mounting in the wrong direction. This eliminates the possibility of power being supplied to an undesired polarity and eliminates the risk of damaging the solid state light emitting device 56.

(Embodiment 3)
The illumination device 300 according to Embodiment 3 includes a light source unit 301 and a holding unit 311.

  FIG. 25 is a plan view showing the external appearance of the illumination device 300. FIG. 26 is a perspective view showing the appearance of the light source unit 301. FIG. 27 is a plan view of the light source unit 301 viewed from the J direction in FIG. FIG. 28 is a plan view showing the appearance of the holding unit 311. FIG. 29A is a plan view of the holding unit 311 viewed from the K direction in FIG.

  The light source unit 301 is different from the light source unit 2 in that the first terminal portion 12a is the first terminal portion 302, the first sensing pin 14a and the second sensing pin 14b are the first sensing pin 303a and the second sensing pin 303b. It is only changed to. Other parts are denoted by the same reference numerals as those of the light source unit 2 and description thereof is omitted.

  Further, the holding unit 311 is different from the holding unit 3 in that the first mounting portion 92a is in the first mounting portion 312 and the first sensing pin hole 93a and the second sensing pin hole 93b are for the first sensing pin. Only the hole 321a and the second sensing pin hole 321b are changed. Other parts are denoted by the same reference numerals as those of the holding unit 3 and description thereof is omitted.

  In the illumination device 300, the first sensing pin 303 a and the second sensing pin 303 b of the light source unit 301 are disposed asymmetrically when viewed from the center point of the end face 304. Accordingly, the first sensing pin hole 321a and the second sensing pin hole 321b, which are holes for inserting them, are also arranged asymmetrically when viewed from the center point of the first mounting portion 312.

  Here, when the light source unit 301 is attached to the holding unit 311 in a wrong direction, there is a concern that power may be supplied to an undesired polarity. This is not preferable because the solid state light emitting device 56 may be damaged.

  In the illumination device 300, as described above, the first sensing pin 303a and the second sensing pin 303b of the light source unit 301 are asymmetrically arranged when viewed from the center point of the end surface 304, and are holes for inserting them. The first sensing pin hole 321 a and the second sensing pin hole 321 b are also arranged asymmetrically when viewed from the center point of the first mounting portion 312. Therefore, it is possible to eliminate attachment in the wrong direction as in the lighting device 200. This eliminates the possibility of power being supplied to an undesired polarity and eliminates the risk of damaging the solid state light emitting device 56.

  Here, the shapes of the first sensing pin 303a and the second sensing pin 303b may be the same or different. Having the same shape has the advantage of cost reduction by sharing parts.

  In addition, the shapes of the first sensing pin hole 321a and the second sensing pin hole 321b need to be set corresponding to the first sensing pin 303a and the second sensing pin 303b.

(Embodiment 4)
The light source unit 351 according to the fourth embodiment can be used in place of the light source unit 2.

  FIG. 29B is a plan view showing the appearance of the light source unit 351. FIG. 29C is a diagram showing the structure of the light source unit 351 viewed from the K1-K2 plane in FIG. 29B.

  The light source unit 351 is different from the light source unit 2 only in that the housing 11 is changed to the housing 352 and the support body 58 is changed to the support body 353. Other parts are denoted by the same reference numerals as those of the light source unit 2 and description thereof is omitted.

  The inner wall surface of the housing 352 is provided with convex portions along the longitudinal direction and on both side surfaces of the solid light emitting element 56 with respect to the light emitting direction. In addition, the support 353 is provided with a recess corresponding to the protrusion provided on the inner wall surface of the housing 352. Then, the convex portion provided on the inner wall surface of the housing 352 and the concave portion provided on the support body 353 are fitted and arranged.

  By doing so, the support body 353 is held in close contact with the housing 352. This is particularly useful when the length of the light source unit 351 in the longitudinal direction is long.

  This is because when the length of the light source unit 351 in the longitudinal direction is long, the length of the casing 352 and the support 353 in the longitudinal direction inevitably increases. In this case, there is a concern that the housing 352 may be warped.

  If warpage occurs, the adhesion between the housing 352 and the support 353 may not be maintained. The inability to maintain the adhesion can cause a decrease in heat dissipation of the light source unit.

Therefore, the housing 352 and the support body 353 are structured as described above. As a result, even when warpage occurs in the housing 352, the concave portion provided in the support body 353 and the convex portion provided in the inner wall surface of the housing 352 are fitted, whereby the warpage of the housing 352 is prevented. It is corrected and the adhesion between the housing 352 and the support 353 can be maintained. Therefore, it is possible to avoid the deterioration of the heat dissipation of the light source unit 2. In the above case, the housing 352 and the support body 353 are configured to be fitted, but are not fixed. That is, as the light source unit 2 shown in the first embodiment, a predetermined range, the housing 352 is movable in the longitudinal direction of the light source unit 351 (support 353). Therefore, when the environmental temperature fluctuates, no stress is applied to the housing 352 and the like.

  That is, similarly to the light source unit 2 and the like described in the first embodiment, a space configured by the housing 352, the first terminal portion 12a, and the second terminal portion 12b even if the environmental temperature changes. It is possible to ensure the airtightness of the inside.

  In the above description, the support 353 is provided with a convex portion and the housing 352 is provided with a convex portion. However, the housing 352 may be provided with a concave portion and the support 353 may be provided with a convex portion. .

  Needless to say, the number of recesses is not limited. In this case, naturally, it is necessary to provide convex portions according to the number of concave portions.

(Modification of Embodiment 4)
The light source unit 381 according to the modification of the fourth embodiment can be used by replacing the light source unit 2 in the same manner as the light source unit 351.

  FIG. 29D is a plan view showing the appearance of the light source unit 381. FIG. 29E is a diagram showing the structure of the light source unit 381 as seen from the K3-K4 plane in FIG. 29D. FIG. 29F is a diagram showing the structure of the light source unit 381 as seen from the K5-K6 plane in FIG. 29D.

  The light source unit 381 is different from the light source unit 351 only in that the housing 352 is changed to the housing 382 and the support body 353 is changed to the support body 383. Other parts are denoted by the same reference numerals as those of the light source unit 351 (light source unit 2), and the description thereof is omitted.

  Fixed plates 384 are provided on the inner wall surface of the housing 382 along the longitudinal direction and on both side surfaces of the solid light emitting element 56 with respect to the light emitting direction. The fixed plate 384 is fixed to the housing 382 (or formed integrally with the fixed plate 384).

  Note that the molding of the fixing plate 384 and the casing 382 can be easily performed simultaneously using the extrusion method, and the casing 382 and the fixing plate 384 can be separately manufactured. There is an advantage that the work of joining is not required.

  The fixing plate 384 is provided to maintain the adhesion between the housing 382 and the support 383. That is, even if warpage occurs in the housing 382, the support 383 is fitted between the fixing plate 384 and the inner wall surface of the solid light emitting element 56 of the housing 382 in the non-light-emitting direction. The warpage of 382 is corrected, and the adhesion between the housing 382 and the support 383 can be maintained. This is advantageous from the viewpoint of heat dissipation.

  In this case, it is also effective to dispose the board 57 between the fixing plate 384 and the support body 383 so as to be fitted.

  With this configuration, the substrate 57 can be prevented from being lifted (peeled) from the support 383. Normally, such uplift is not expected, but it is possible to take a countermeasure in case of emergency.

The support body 383 is provided with a hollow structure 385 along the longitudinal direction thereof.
By providing the support 383 with the hollow structure 385, the support 383 can be reduced in weight. By reducing the weight, not only the light source unit 381 can be easily handled, but also the material constituting the light source unit 381 can be reduced, and the cost can be reduced.

  The inventors have confirmed that even when the support 383 is provided with the hollow structure 385 as described above, the adhesion between the housing 382 and the support 383 can be maintained, and heat dissipation using them can be appropriately performed. I have confirmed.

  In addition, the hollow structure 385 has an effect that the manufacturing cost can be reduced by providing the opening 386 along the longitudinal direction of the support 383. This is because providing the opening 386 makes it easy to apply the extrusion method, which is an inexpensive manufacturing method, in manufacturing the support 383.

  In the above case, the support 383 is fitted between the fixing plate 384 and the inner wall surface of the solid light emitting element 56 of the housing 382 in the non-light emitting direction, but they are not fixed. That is, similarly to the light source unit 2 described in Embodiment 1, the housing 382 is configured to be movable along the longitudinal direction of the light source unit 381 (support 383) within a predetermined range. Therefore, no stress is applied to the housing 382 and the like when the environmental temperature fluctuates.

  That is, similarly to the light source unit 2 and the like described in the first embodiment, a space configured by the housing 382, the first terminal portion 12a, and the second terminal portion 12b even if the environmental temperature changes. It is possible to ensure the airtightness of the inside.

  In addition, as for the support 383, the reflecting surface 59 is not shown in FIG. 29E, but it may be provided as a matter of course. Alternatively, the shape of the fixed plate 384 may be changed, and a reflective surface corresponding to the reflective surface 59 may be provided on the fixed plate 384.

(Embodiment 5)
The power supply device 401 according to Embodiment 5 can be applied to the lighting devices 1, 200, and 300 in place of the power supply device 101.

  Note that the circuit configuration and electronic circuit functions of the power supply device 401 are the same as those of the power supply device 101, and a description thereof is omitted here. Hereinafter, structural features of the power supply device 401 will be described.

  FIG. 30 is a perspective view illustrating an appearance of the power supply device 401. FIG. 31 is a plan view showing the appearance of the power supply device 401 viewed from the L direction in FIG. FIG. 32 is a cross-sectional view showing the structure of the power supply device 401 as viewed from the M1-M2 plane of FIG. FIG. 33 is a cross-sectional view showing the structure of the power supply device 401 as viewed from the N1-N2 plane of FIG.

  31, 32, 33, and 36, the short side direction of the plate 411 is the X1 direction, the short side direction of the substrate 455 is the Y1 direction, and the plate 411 and the long side of the substrate 455 are described. The direction is the Z1 direction.

  The housing 451 has a column shape (here, a quadrangular column shape, but may be a columnar shape or the like), and has a hollow structure 458. Inside the hollow structure 458, circuit elements constituting the power supply device 401 are provided.

  Here, in the following, among the circuit elements constituting the power supply device 401, the diode bridge circuit 124, the FET 126, and the like are elements that generate a large amount of heat, and these are collectively referred to as heating elements 453a, 453b, and 453c. Further, the transformer 127 and the like are referred to as a winding element 463. Further, a circuit element constituting the power supply device 401 that does not belong to any of the heating elements 453 a, 453 b, 453 c, and the winding element 463 is referred to as a general element 454.

  Further, a substrate 455, an insulator 457, and a pressing metal 461 are also arranged inside the hollow structure 458.

  The housing 451 is made of a material made of an electrical insulator. This is for ensuring long life. The specific reason will be explained later.

  In addition, in this case, an electrical insulator such as an insulating sheet (not shown) may be attached to a predetermined surface of the hollow structure 458 in order to ensure long life. preferable. This specific reason will also be described later.

  The housing 451 (hollow structure 458) has an opening 459 on one of the side surfaces (surface along the Z1 direction), and the opening 459 is sealed with a plate 411.

  The plate 411 is made of metal (the inventors adopted aluminum, but is not limited to this. It is important that the plate 411 is made of a material having excellent thermal conductivity and heat dissipation), and the housing 451 (hollow) The opening 459 of the structure 458) is sealed. In addition, the heat radiation electrodes 471 of the heating elements 453a, 453b, and 453c are arranged in close contact with each other. This is because the heat generated in the heating elements 453a, 453b, and 453c is radiated using the plate 411.

  Here, the plate 411 may be a member having a high thermal conductivity such as a metal and a large surface area, that is, a member exhibiting a high heat dissipation effect (not shown, for example, a main body portion 91 made of metal, and in addition, a large surface area. It may be a metal panel, etc. In addition, any member may be used as long as the above conditions are satisfied. By comprising in this way, the thermal radiation using the plate 411 can be performed still more efficiently.

  Here, the plate 411 needs to be configured as a plane having at least a predetermined thickness t7. By doing so, the plate 411 can be prevented from being distorted. In addition, according to the experiments by the inventors, the predetermined thickness t7 may be 1 mm or more when the plate 411 is made of aluminum, and a better result is obtained if it is 2 mm or more. By doing so, it is confirmed that the plate 411 is not distorted and can be arranged in good contact with a member (not shown) in combination with the following configuration.

  The surface area of the member (not shown) is the surface area of the surface that is in close contact with the member (not shown) of the plate 411 (the back surface of the surface that is partially hidden by the housing 451 (hollow structure 458)). The surface area of the surface to be larger). As a result, heat can be radiated over a wide area, and the heat dissipation effect is enhanced.

  Furthermore, the part where the plate 411 of the member (not shown) is in close contact with each other needs to be a flat surface. By doing in this way, adhesiveness can be improved.

  Moreover, in order to maintain the close arrangement of the plate 411 and the member (not shown), it is important to fix the plate 411 to the member (not shown).

  The inventors provided the plate 411 with three through holes 412a, 412b, and 413, and fixed the plate 411 to the member (not shown) with screws (not shown) or the like.

  Here, the through hole 412a is one end of the long side direction of the plate (Z1 direction), and the through hole 412b is the long side direction of the plate (Z1 direction) at the center of the short side direction (X1 direction) of the plate. The through hole 413 is the center of the long side direction of the plate (Z1 direction), and is one of the short side direction (X1 direction) of the plate. Placed at the end of the. Then, the plate 411 was fixed to the member (not shown) using the three through holes 412a, 412b, and 413.

  The inventors have actually conducted a test and confirmed that the plate 411 and the above-described member (not shown) can be disposed in close contact with each other in combination with the thickness t7 of the plate 411 being equal to or greater than a predetermined value. ing.

  In addition, although it was set as three about the through-holes 412a, 412b, and 413 in the above, it is not limited to this, You may provide many more through-holes.

  Further, the adhesiveness may be enhanced by sandwiching an adhesive or a double-sided tape without a base material between the plate 411 and the member (not shown) and pressing it.

  Further, the plate 411 needs to be configured so that the portions other than the heat radiation electrode 471 of the heat generating elements 453a, 453b, and 453c, the general element 454, and the winding element 463 are not in contact with each other (that is, the power supply device). Of the circuit elements constituting 401, only the heat radiation electrodes 471 of the heating elements 453a, 453b, and 453c are in contact with the plate 411. Furthermore, it is necessary to prevent the substrate 455 from coming into contact with the plate 411.

  The reason for this is to realize the long life of the power supply device 401. That is, the heat generating elements 453a, 453b, and 453c are surely radiated from the heat radiating electrode 471. On the other hand, contact with the plate 411 that is made of metal, that is, a conductor, directly leads to the occurrence of an electrical short circuit. If an electrical short circuit occurs, it naturally leads to a failure of the power supply device 401, and long life cannot be realized. Therefore, the power supply device 401 has the above configuration.

  FIG. 34 is a schematic view of the heat generating element 453a (the heat generating elements 453b and 453c are basically the same), and has a heat radiation electrode 471 as shown in this figure. This is arranged so as to be in close contact with the plate 411.

  Here, some of the heating elements 453a, 453b, and 453c are provided with a fixing through hole (not shown). For example, it is assumed that a fixing through-hole (not shown) is not provided in 453a and 453b. In such a case, it is preferable to fix using the presser fitting 461 and the screw 462.

  At this time, heating elements (in this case, heating elements 453a and 453b) not provided with fixing through-holes (not shown) are arranged close to each other, and a screw 462 or the like is used only by a single pressing metal 461. It is preferable that the plate 411 and the heat radiation electrode 471 are in close contact with each other.

  By doing in this way, the number of parts can be reduced as compared with the case where the pressing metal fitting 461 is provided for each heating element (in this case, the heating elements 453a and 453b) not provided with a fixing through hole (not shown). Can do. Therefore, the cost of the power supply device 401 can be reduced.

  The general element 454 and the winding element 463 do not need to be in close contact with the plate 411 because they generate a small amount of heat, and are arranged so that no contact occurs to prevent the electrical short circuit.

  However, as shown in FIG. 33, the winding element 463 is disposed on the substrate 455 so that the central axis of the winding element 463 is at an angle θ2 with respect to the Z1 direction which is the long side direction of the substrate 455. By disposing the winding element 463 in this way, the power supply device 401 is reduced in size.

  As shown in FIG. 35, the winding element 463 is configured by winding a conducting wire (not shown) around the core 463a. A winding portion 463b is formed by winding a conducting wire (not shown). At this time, the width t12 of the core 463a (that is, the width along the central axis of the winding element 463) t12 is a circuit element (heating elements 453a, 453b, 453c, general element 454) constituting the power supply device 401 constituting the power supply device 401. In general, the inventors have prototyped the power supply device 401 with a maximum output power of 100 W. As a result, the width t12 of the core 463a of the winding element 463 is obtained. Is the largest value among the circuit elements constituting the power supply device 401 (heating elements 453a, 453b, 453c, general element 454, and winding element 463).

  Therefore, in determining the size of the power supply device 401, the arrangement of the winding element 463 on the substrate 455 is a key point. Therefore, the inventors arranged the winding element 463 on the substrate 455 so that the central axis of the winding element 463 becomes an angle θ2 with respect to the Z1 direction which is the long side direction of the substrate 455 as described above.

  By doing so, the width t10 in the short side direction (the direction along the Y1 direction) of the substrate 455 can be made smaller than the width t12 of the core 463a.

  Here, the angle θ2 is preferably in the range of 30 to 60 degrees, and more preferably in the range of 40 to 50 degrees.

  For this reason, if the angle θ2 is set to 60 degrees or more, it is necessary to increase the width t10 in the short side direction of the substrate 455. Conversely, if the angle θ2 is set to 30 degrees or less, This is because it is necessary to increase the width t11 in the long side direction of the substrate 455.

  In particular, when a plurality of winding elements 463 are required, it is not preferable to set the angle θ2 to 30 degrees or less.

  For this reason, in the present embodiment, as described above, the winding element 463 has only one winding element. However, for example, a power factor correction circuit (not shown) is connected to the power supply device 401. When added to the circuit, a step-up coil (not shown) is required. The step-up coil (not shown) is also a winding element 463, and in this case, two winding elements 463 are present in the circuit elements constituting the power supply device 401. In this case, if the angle θ2 is 30 degrees or less, it is necessary to cumulatively increase the width t11 of the substrate 455 in the long side direction.

  Here, it is also preferable to configure the substrate 455 as a double-sided mounting substrate. In this manner, circuit elements constituting the power supply device 401 can be efficiently arranged on the substrate 455, and the power supply device 401 can be further downsized.

At this time, part of the circuit elements constituting the power supply 401 (in this, the heating elements 453a, 453b, and all 453c, includes all of the winding device 463, and one common element 454 Is also held (mounted) on one surface of the substrate 455. Further, the remainder of the circuit elements constituting the power supply device 401 (including the remainder of the general elements 454) is held (mounted) on the other surface of the substrate 455.

  Here, the circuit elements mounted on the other surface of the substrate 455 are the remainder of the general elements 454 as described above, but these elements are limited to the small elements 460. The small element 460 mentioned here is an element of the general element 454 whose mounting height (height along the X1 direction with the other surface of the substrate 455 as the origin) is a width t8 or less. .

  As will be described later, the other surface of the substrate 455 is disposed to face the surface of the hollow structure 458 via a width t8. Therefore, only the small element 460 having a mounting height of the width t8 or less is mounted on the other surface of the substrate 455. The width t8 is about several mm (for example, 5 mm or less).

  Note that the general element 454 mounted on one surface of the substrate 455 is not particularly limited in height at the time of mounting (a height along the X1 direction with one surface of the substrate 455 as an origin). The inventors made a prototype of the power supply device 401 with a maximum output power of 100 W, and the height when the winding element 463 was mounted was the circuit element (heating elements 453a, 453b, 453c, general Among the circuit elements included in the element 454 and the winding element 463), it was high. That is, the height when the heating elements 453a, 453b, 453c, and the general element 454 are mounted is equal to or less than the height when the winding element 463 is mounted. Therefore, even if there is no particular limitation on the height when the general element 454 mounted on one surface of the substrate 455 is mounted, the power supply device 401 is not enlarged.

  Therefore, the effect of configuring the substrate 455 as a double-sided mounting substrate is exhibited, and the power supply device 401 can be further downsized.

  Further, as for the substrate 455, it may be a general glass epoxy substrate. Of course, a metal substrate, an alumina ceramic substrate, an aluminum nitride substrate, or the like may be used.

  Further, the substrate 455 has a rectangular shape as shown in the figure. The heating elements 453a, 453b, and 453c are located outside the end portion of the substrate 455 along the long side direction (Z1 direction) by a predetermined interval t9 from one end portion (specific end portion 456). Then, it is mounted on the substrate 455 so that the heat radiation electrode 471 is positioned on an axis (X1 direction) perpendicular to the mounting surface of the substrate 455.

  FIG. 36 shows a state of the heat generating element 453b mounted on the substrate 455. FIG. In this way, the heating element 453b is placed on the substrate 455 so that the heat radiation electrode 471 is positioned on the axis (X1 direction) that is outside the specific end 456 by a predetermined interval t9 and perpendicular to the mounting surface of the substrate 455. Implemented. The heating elements 453a and 453c are also mounted on the substrate 455 in the same manner.

  That is, in the power supply device 401, a predetermined interval t9 is generated between the plate 411 and the specific end portion 456.

  The predetermined interval t9 may be an arbitrary interval. However, if the interval is too narrow, the withstand voltage between the substrate 455 and the plate 411 may be insufficient (that is, the wiring pattern ( (Not shown) may cause an electrical short circuit to the plate 411.) In the experiments by the inventors, it has been confirmed that if there is an interval of 1 mm or more, no electrical short circuit occurs.

  Further, an insulator 457 that is an electrical insulator is inserted between the plate 411 and the specific end portion 456 (a portion at a predetermined interval t9). Thereby, there is an effect that the withstand voltage between the plate 411 and the substrate 455 can be further increased. This also has the effect of preventing the substrate 455 from moving within the hollow structure 458.

  Further, the plate 411 and the substrate 455 are arranged along the Z1 direction (see FIG. 33) so that the longitudinal directions thereof are parallel to each other, and the angle formed by the short side direction is arranged to be approximately 90 degrees (see FIG. 32. That is, the angle formed by the X1 direction along the short side direction of the plate 411 and the Y1 direction along the short side direction of the substrate 455 is approximately 90 degrees.

  Further, the length along the Z1 direction of the housing 451 (when the prismatic shape is used) substantially coincides with the longitudinal width (the width along the Z1 direction) t11 of the substrate 455, and the length along the Y1 direction. The height substantially matches the width t10 in the short side direction (width along the Y1 direction) of the substrate 455.

  The width along the X1 direction of the housing 451 is the highest mounting height (X1 direction) among circuit elements (heating elements 453a, 453b, 453c, general element 454, and winding element 463) constituting the power supply device 401. (Along the winding element 463 in the inventors' prototype) (width t8 is about several millimeters and has almost no effect).

  By doing so, the size of the housing 451 can be minimized. This contributes to reducing the size of the power supply device 401.

  Furthermore, with the above-described configuration, even if an impact is applied to the power supply device 401, the substrate 455 has little space to move in the hollow structure 458. In addition, the hollow structure 458 includes five surfaces including an insulator (resin) except for the surface on the plate 411 side.

  In particular, the other surface of the substrate 455 can be cited as a portion where the occurrence of an electrical short circuit is a concern. This is because this surface is arranged to face the surface of the hollow structure 458 with a width t8 (about several mm). However, as described above, the surface of the hollow structure facing this surface (the other surface of the substrate 455) is made of an insulator (resin), so that the risk of an electrical short circuit is eliminated.

  In addition, an insulator 457 is inserted between the plate 411 and the specific end 456 also on the surface on the plate 411 side.

  Therefore, in the power supply device 401, the possibility of an electrical short circuit occurring therein can be eliminated. Therefore, since there is no failure due to the occurrence of an electrical short circuit, stable long life can be exhibited. Furthermore, although the occurrence of an electrical short circuit has a risk of electric shock to the user, the possibility of this occurrence is also eliminated, and it can be said that this is a safe power supply device.

  Note that in the case where the housing 451 of the power supply device 401 is made of metal, it is preferable to attach an electrical insulator such as an insulating sheet (not shown) to the surface of the hollow structure 458 facing the other surface of the substrate 455. . By doing in this way, it is possible to prevent an electrical short circuit from occurring on the other surface of the substrate 455, which is a part where the electrical short circuit is a concern.

  Here, in the in-vehicle discharge lamp lighting device disclosed in Patent Document 3, the lighting circuit unit is disposed in the opened metal case body. And it is supposed that the opening part of a case body will be obstruct | occluded with the attachment flange made from resin.

  With such a configuration, it is said that heat generated from the components constituting the lighting circuit unit can be radiated.

  However, it is considered difficult to apply the in-vehicle discharge lamp lighting device disclosed in Patent Document 3 to a power supply device for a lighting device using LEDs. In Patent Document 3, a lighting circuit portion (corresponding to a circuit constituting the power supply device) is inserted into a metal case body (corresponding to a casing of the power supply device). Certainly, it can be considered that heat generated as a loss from the circuit elements constituting the lighting circuit portion can be radiated by adopting such a configuration, but the case body is made of metal as described above.

  That is, in the in-vehicle discharge lamp lighting device disclosed in Patent Document 3, the mounting flange that closes the case body is made of resin, but most of the surrounding flange is made of metal. In such a state, there is a risk that a part of the lighting circuit portion touches the case body made of metal due to some impact or the like. Since the case body is made of metal, an accident such as an electrical short circuit may occur.

  This is a problem that, contrary to the long life required for the power supply device of the lighting device using LEDs, leads to unstable life characteristics.

  On the other hand, the power supply device 401 realizes long life. Specifically, the housing 451 is made of resin, and a metal plate 411 is attached to the opening 459 thereof. On the plate 411, the heat radiation electrodes 471 of the heating elements 453a, 453b, and 453c among the circuit elements (heating elements 453a, 453b, and 453c, the general element 454, and the winding element 463) constituting the power supply device 401 are provided on the plate 411. Only the plate 411 and the heat radiation electrode 471 were placed in close contact with each other. As a result, heat generated as a loss in the heating elements 453a, 453b, and 453c can be appropriately dissipated.

  Furthermore, since the housing 451 is a resin case, unnecessary portions of the heating elements 453a, 453b, 453c and the general element 454 are prevented from contacting the metal plate 411 even if there is any impact. Yes. Therefore, an electrical short circuit does not occur, and a stable long life is realized.

  Further, the arrangement of the winding element 463 has been devised, and the power supply device 401 has been successfully reduced in size. The inventors made a prototype of the power supply device 401 with a maximum output power of 100 W. As a result, it has been confirmed that the size can be 28 mm (width along the X1 direction) × 28 mm (width along the Y1 direction) × 220 mm (width along the Z1 direction).

(Embodiment 6)
The light source unit 501 according to the sixth embodiment can be used in place of the light source unit 2.

  FIG. 37 is a plan view showing the appearance of the light source unit 501. FIG. FIG. 38A is a diagram showing the structure of the light source unit 501 viewed from the O1-O2 plane in FIG. 37, and FIG. 38B is an enlarged view of the O3 portion in FIG. 38A.

  The light source unit 501 is different from the light source unit 2 only in that the first terminal portion 12a is changed to the first terminal portion 502a and the second terminal portion 12b is changed to the second terminal portion 502b. Other parts are denoted by the same reference numerals as those of the light source unit 2 and description thereof is omitted.

  As shown in FIGS. 38A and 38B, the first terminal portion 502a is provided with a groove 511 so as to come into contact with the housing 11 via an O-ring 512 configured in a ring shape with an elastic material such as rubber. Similarly, the second terminal portion 502 b is also provided with a groove 511 so as to come into contact with the housing 11 via the O-ring 512.

  With such a configuration, the O-ring 512 closes the gap between the housing 11 and the first terminal portion 502a and between the housing 11 and the second terminal portion 502b.

  Therefore, the airtightness of the space constituted by the housing 11, the first terminal portion 502a, and the second terminal portion 502b can be further improved. This leads to more reliably preventing insects, dust, etc. from entering from the outside, thereby improving the convenience for the user.

(Embodiment 7)
The light source unit 601 according to the seventh embodiment can be used in place of the light source unit 2.

  FIG. 39 is a plan view showing the appearance of the light source unit 601. FIG. 40A is a diagram showing the structure of the light source unit 601 viewed from the P1-P2 plane in FIG. 39, and FIG. 40B is an enlarged view of the P3 portion in FIG. 40A.

  The light source unit 601 is different from the light source unit 501 in that it has a cylindrical shape (ring shape) between the end portion of the housing 11 and the bottom surface of the hollow structure of the first terminal portion 502a as shown in FIGS. 40A and 40B. Similarly, the cylindrical elastic body 611 is only inserted between the point where the elastic body 611 is inserted and the end of the housing 11 and the bottom surface of the hollow structure of the second terminal portion 502b.

  In addition, the external appearance of this cylindrical elastic body 611 is shown to FIG. 40C and FIG. 40D. FIG. 40C is a plan view of the cylindrical elastic body 611, and FIG. 40D is a plan view of the cylindrical elastic body 611 viewed from the P4 direction in FIG. 40C. The cylindrical elastic body 611 is made of a material having both flexibility and airtightness, and the inventors adopted a rubber sponge.

  Here, the reason for inserting the cylindrical elastic body 611 as described above is to provide the light source unit 601 with drip-proof (waterproof) properties.

  The cylindrical elastic body 611 seals between the end portion of the housing 11 and the bottom surface of the hollow structure of the first terminal portion 502a to the extent that it exhibits drip-proof properties (waterproof properties). Similarly, the space between the end portion of the housing 11 and the bottom surface of the hollow structure of the second terminal portion 502b is sealed to such an extent that the waterproof property is exhibited.

  Accordingly, it is possible to prevent water droplets or the like from entering the space formed by the first terminal portion 502a, the second terminal portion 502b, and the housing 11. The light tightness of the light source unit 501 and the like was such that insects, dust, and the like were prevented from entering the inside thereof. However, the light source unit 601 can further enhance its air tightness and have drip-proof (waterproof) properties. it can.

  Further, the cylindrical elastic body 611 follows the expansion and contraction of the casing 11 and the like even when the environmental temperature of the light source unit 601 changes, and the end of the casing 11 and the first terminal portion 502a. The space between the bottom surface of the hollow structure and the space between the end of the housing 11 and the bottom surface of the hollow structure of the second terminal portion 502b are sealed to such an extent that they are drip-proof (waterproof).

  Therefore, the light source unit 601 does not impair its drip-proof property (waterproof property) even when the environmental temperature changes.

(Modification of Embodiment 7)
A light source unit 701 according to a modification of the seventh embodiment is obtained by applying a case 702 provided with an edge at an end thereof instead of the case 11 in the light source unit 601.

  FIG. 41 is a plan view showing the appearance of the light source unit 701. FIG. 42A is a diagram showing the structure of the light source unit 701 as viewed from the Q1-Q2 plane in FIG. 41, and FIG. 42B is an enlarged view of the Q3 portion in FIG. 42A.

  As shown in these drawings, since the edge of the end of the housing 702 bites into the cylindrical elastic body 611, the light source unit 701 should have more reliable drip-proof (drip-proof) properties. Leads to.

(Embodiment 8)
Unlike the light source unit 2 or the like, the light source unit 801 according to Embodiment 8 does not use the holding unit 3 but is directly connected to the power supply device 101 by the power supply cable 803 and used.

  FIG. 43 is a perspective view showing the external appearance of the light source unit 801. FIG. 44 is a plan view showing the appearance of the light source unit 801 viewed from the R direction in FIG. 45 is a cross-sectional view showing the structure of the light source unit 801 in FIG. 44 on the S1-S2 plane. 46 is a cross-sectional view showing the structure of the light source unit 801 in FIG. 44 on the S3-S4 plane.

  The light source unit 801 is different from the light source unit 2 in that the first terminal portion 12a is changed to the first terminal portion 802a, the second terminal portion 12b is changed to the second terminal portion 802b, and the support body 58 is changed to the support body 811. It is. Further, a feeding cable 803 is provided (note that pins such as the first sensing pins 14a are not provided. The substrate 52 and the element 53 mounted thereon may be provided, but are not shown here).

  Note that as shown in the fourth embodiment and the modified example of the fourth embodiment, the housing 11 may be the housing 352 or the housing 382, and the configuration of the support body 811 may be changed so as to correspond thereto. Good. By doing in this way, even when the full length of the light source unit 801 is long, there exists an effect that the adhesiveness of a housing | casing and a support body can be maintained reliably.

  The first terminal portion 802a is provided with a pull-out point 804. Using the pull-out point 804, the power supply cable 803 is connected to the first terminal portion 802a, the second terminal portion 802b, and the housing 11 of the light source unit 801. Are drawn out from the inside (hereinafter referred to as the internal space of the light source unit 801). Note that the second terminal portion 802b does not need to be provided with the extraction point 804.

  The power supply cable 803 is provided to supply power to the solid state light emitting device 56. One end of the power supply cable 803 is connected to the substrate 57 via the relay component 54 (or the relay component 81) (this connection point is referred to as a connection point 805).

Further, the other end of the power supply cable 803 is connected to the power supply device 101.
Note that the lead-out point 804 is a through-hole provided for drawing the power supply cable 803 from the internal space of the light source unit 801 to the outside. Although not shown, it is desirable that the power supply cable 803 is filled with resin after the power supply cable 803 is pulled out. This is for fixing the power feeding cable 803 together with the purpose of maintaining airtightness.

  By fixing the power supply cable 803 to the pull-out point 804, it is possible to prevent the connection point 805 from being stressed even if the power supply cable 803 is pulled from the outside of the light source unit 801.

  The support body 811 is similar to the support body 58, but has one point different from the support body 58. The difference is that a groove-like hollow structure 812 opened along the longitudinal direction (X2 direction) of the light source unit 801 is provided. The hollow structure 812 is used as a path in the internal space of the light source unit 801 of the power supply cable 803. Moreover, it serves for fixing a diffusion film (not shown).

  The diffusion film (not shown) is a film in which a diffusing material is mixed or a film in which fine irregularities are formed on the surface, and plays a role of diffusing light emitted from the plurality of solid state light emitting elements 56. The light emitted from the solid state light emitting element 56 has a strong directivity and therefore tends to be irradiated locally. By diffusing the light emitted from the solid state light emitting element 56 with a diffusion film (not shown), the directivity of the light can be weakened and the light can be uniformly irradiated over a wide area.

  The fixing component 813 is inserted into the hollow structure 812 and is provided to fix the end portion of the diffusion film (not shown) in the hollow structure 812 included in the support body 811. Further, it also plays a role of supporting the power supply cable 803 disposed in the hollow structure 812.

  Here, the connection point 805 and the drawing point 804 need to be provided with a predetermined interval. This is because the stress on the connection point 805 is reduced. This is because when the connection point 805 and the lead-out point 804 are close to each other, the feeding cable 803 is sharply bent. The power supply cable 803 is generally a thicker cable than the conductor 55. Therefore, the spring property is strong, and when it is bent sharply as described above, excessive stress is applied to the connection point 805.

  Applying excessive stress to the connection point 805 in this manner may damage the connection point 805. At the connection point 805, the power supply cable 803 and the substrate 57 are connected. Therefore, by applying excessive stress to the connection point 805, the power supply cable 803 may be detached from the substrate 57 in the worst case.

  On the other hand, the connection point 805 and the lead-out point 804 are arranged with a predetermined interval in the light source unit 801, so that the power supply cable 803 can be arranged loosely and thus be bent sharply. can avoid. Therefore, it is possible to avoid applying excessive stress to the connection point 805, and it is possible to prevent the power supply cable 803 which is the worst case from being detached from the substrate 57.

  In the above description, the connection point 805 is shown as being near one end of the light source unit 801, and the extraction point 804 is shown near the other end of the light source unit 801. However, the present invention is not limited to this. The connection point 805 and the extraction point 804 may be arranged with a predetermined interval. Specifically, although it depends on the material, thickness, and the like of the power supply cable 803, according to the inventor's test, it has been obtained that it is preferable to dispose the cable with an interval of 5 cm or more.

  However, it is preferable that the lead-out point 804 from the internal space of the light source unit 801 of the power supply cable 803 to the outside is provided near the end in the longitudinal direction of the light source unit 801 for other reasons. More specifically, it is preferable to provide the first terminal portion 802a. This is because the light source unit 801 can be easily configured by providing the pull-out point 804 in the first terminal portion 802a.

  That is, if a pull-out point 804 is provided at an intermediate point in the longitudinal direction of the light source unit 801, it is necessary to make a hole in the housing 11. Since the housing 11 is on a pipe, it can be easily created by a drawing method or the like. However, if a hole is to be made in it, it is necessary to additionally process a member created by the above-described drawing method or the like. This leads to an increase in cost.

  On the other hand, the first terminal portion 802a is an ordinary mold-molded product, and even when a hole to be the pulling point 804 is opened, no additional work is required and the cost is not increased. Therefore, it is preferable to provide the drawing point 804 in the first terminal portion 802a.

Here, the hollow structure 812 is provided for the following two purposes.
First, it is for use in a route inside the light source unit 801 of the power supply cable 803. In this way, the path of the power feeding cable 803 can be fixed inside the light source unit 801. Therefore, it is possible to prevent the connection point 805 from being stressed due to the path of the power supply cable 803 changing inside the light source unit 801 (the power supply cable 803 moves).

  Second, it is for fixing a diffusion film (not shown). The hollow structure 812 is open. The end portion of the diffusion film (not shown) is inserted into the hollow structure 812 from the opened portion. Thus, the diffusion film (not shown) can be prevented from moving inside the light source unit 801, that is, can be fixed.

  When the diffusion film (not shown) moves inside the light source unit 801, the light emission of the solid light emitting element 56 may not pass through the diffusion film (not shown). That is, there is a possibility that the light emitted from the desired solid state light emitting element 56 cannot be diffused. Therefore, it is important to fix the diffusion film (not shown).

  Further, in order to more reliably fix the diffusion film (not shown), the end of the diffusion film (not shown) is inserted into the hollow structure 812 from the opened portion, and then the fixing component 813 is attached to the hollow structure 812. insert. Thereby, the adhesiveness between the fixing component 813 and the hollow structure 812 is increased, and the diffusion film (not shown) can be more reliably fixed.

  In addition, although it is a position which provides the opened part, providing in the non-light-emitting direction of the solid light emitting element 56 is preferable. By doing so, the light emission from the solid light emitting element 56 is not adversely affected (such as blocking light).

  As described above, the light source unit 801 can reduce the stress applied to the connection point 805 by devising the arrangement of the drawing points 804 and the connection points 805. Accordingly, it is possible to prevent the feeding cable 803 from being detached from the substrate 57 at the connection point 805.

  In addition, the illuminating devices 1, 200, 300, the light source units 2, 201, 301, 351, 381, 501, 601, 701, 801 and the power supply devices 101, 401 of the present invention are not limited to the above embodiments. The present invention can be freely modified and implemented without departing from the spirit of the present invention.

  Although the power supply apparatuses 101 and 401 operate using the commercial power supply 105, the present invention is not limited to this. For example, it may be driven by DC power.

Further, the power supply devices 101 and 401 may generate alternating current. In this case, a circuit configuration (for example, a diode bridge circuit) for converting the AC power into DC power is required. However, when this circuit configuration is provided in the light source unit 2 or the like , the circuit configuration (mounting) )Should. By configuring on the substrate 52, there is an advantage that the solid-state light emitting element 56 can be arranged near the end of the light source unit 2 and the like.

Further, the solid light emitting element 56 may be EL (electroluminescence).
In the light source unit 2 or the like, the light source unit 2 includes a first sensing pin 14a, a second sensing pin 14b, a first power supply pin 15a, a second power supply pin 15b, a first support pin 15c, and a second support pin 15d. However, these may be provided in the holding unit 3.

  In this case, the light source unit 2 includes a first sensing pin hole 93a, a second sensing pin hole 93b, a first power supply pin hole 94a, a second power supply pin hole 94b, and a first support pin hole. 94c and second support pin hole 94d may be provided.

  In the light source unit 2 and the like, the first power supply pin 15a, the second power supply pin 15b, the first support pin 15c, and the second support pin 15d are different from each other (at least one of the above is different). This is effective in preventing the light source unit 2 from being attached in the wrong direction when attached to the holding unit.

  In addition, providing the support 58 and the like with a hollow structure corresponding to the hollow structure 385 provided in the support 383 is effective for reducing the weight of the support 58 and the like.

  Further, the light source unit may be configured as a light source unit 901 shown in FIGS. 47 is a plan view showing the appearance of the light source unit 901, and FIG. 48 is a diagram showing the structure of the light source unit 901 viewed from the T1-T2 plane in FIG.

  The light source unit 901 is different from the light source unit 2 in that the housing 11 is changed to the housing 902 and the support body 58 is changed to the support body 903. Other components are the same as those of the light source unit 2, and are denoted by the same reference numerals and description thereof is omitted.

  The casing 902 is configured such that the thickness of the wall surface differs between the light emitting direction of the solid light emitting element 56 and the non-light emitting direction. Specifically, the thickness t14 on the non-light emitting direction side of the solid light emitting element 56 is configured to be thinner than the thickness t13 on the light emitting direction side of the solid light emitting element 56.

  Here, the polycarbonate or the like constituting the housing 902 has lower thermal conductivity than metal or the like. As a countermeasure against this, as described above, the heat dissipation is enhanced by closely arranging the support (support 58, etc.) and the housing (housing 11 etc.).

  In order to further improve the heat dissipation, it is effective to reduce the thickness of the wall surface of the housing. This is because it is possible to reduce the influence of polycarbonate or the like constituting the casing having low thermal conductivity as described above.

  On the other hand, the housing also has an effect of reducing the directivity of light emitted from the solid state light emitting device 56. For example, when a material that diffuses light (a fine light diffusing agent) is mixed into polycarbonate or the like constituting the casing to reduce the directivity of the light, a certain degree of wall thickness of the casing is required. There is a case.

  The housing 902 can simultaneously meet the demand from the heat dissipation and the demand for reducing the directivity of light. That is, as described above, since the thickness t14 of the portion that is in close contact with the support 903 used for heat dissipation (that is, the non-light emitting direction of the solid light emitting element 56) is thin, heat dissipation can be further improved.

  On the other hand, since the thickness t13 of the portion used for reducing the directivity of light emitted from the solid light emitting element 56 (that is, the light emitting direction of the solid light emitting element 56) is thick, the necessary directivity of light can be reduced. it can.

  Since the housing 902 is configured as described above, there is a problem that warpage is likely to occur. However, this problem can be solved by providing the fixing plate 384 in the same manner as the housing 382. . That is, the support 903 is fitted between the fixed plate 384 and the inner wall surface of the housing 902 in the non-light-emitting direction of the solid light emitting element 56. Therefore, even if warpage occurs in the housing 902, the close contact arrangement with the support 903 can be maintained.

  The support body 903 is basically the same as the support body 383, but may be configured so as to conform to the configuration (shape) of the housing 902 (that is, the thickness t14 of the solid light emitting element 56 in the non-light emitting direction). Can be configured to cope with the decrease in thickness.)

  The light source unit 901 may be configured to be directly connected to the power supply apparatus 101 (or the power supply apparatus 401) and the power supply cable 803 without using the holding unit 3.

  Further, the light source unit may be configured as a light source unit 951 shown in FIGS. 49 and 50. 49 is a plan view showing the appearance of the light source unit 951, and FIG. 50 is a diagram showing the structure of the light source unit 951 viewed from the T3-T4 plane in FIG.

  The light source unit 951 is different from the light source unit 2 in that the housing 11 is changed to the housing 952 and the support body 58 is changed to the support body 953. Other components are the same as those of the light source unit 2, and are denoted by the same reference numerals and description thereof is omitted.

  As shown in FIG. 50, the light source unit 951 has a solid body light emitting element 56 (substrate 57) disposed on both sides of a support 953. That is, the light source unit 951 emits light both in the upper direction in FIG. 50 and in the lower direction in the drawing.

  In this manner, the housing 952 is provided with the fixed plate 954 and the fixed plate 955 based on the configuration of the support body 953. These fixed plates 954 and 955 are configured in the same manner as the fixed plate 384. That is, the fixing plates 954 and 955 are provided on the inner wall surface of the housing 952 along the longitudinal direction and on both side surfaces with respect to the light emitting direction of the solid light emitting element 56.

  A support body 953 is fitted between the fixed plate 954 and the fixed plate 955. Accordingly, even if warpage occurs in the housing 952, the warpage is corrected, and adhesion between the housing 952 and the support body 953 can be maintained. That is, heat dissipation can be maintained.

  Both side surfaces along the longitudinal direction of the support body 953 and the light emitting direction of the solid state light emitting element 56 are configured to correspond to the inner wall surface of the housing 952.

  Therefore, it can be disposed in close contact with the housing 952 (the inner wall surface thereof), and furthermore, by providing the fixing plates 954 and 955, the adhesion between the housing 952 and the support body 953 can be maintained. Thus, heat dissipation using the housing 952 can be appropriately performed.

  Further, the light source unit 951 may be configured to be used by being directly connected to the power supply apparatus 101 (or the power supply apparatus 401) by the power supply cable 803 without using the holding unit 3.

  Further, in the light source unit 801, the substrate 52 is disposed in the hollow structure provided in the first terminal portion 802a, the power supply cable 803 is connected to the substrate 52, and then the substrate 52 and the substrate 57 are connected to the relay component 54, And the conductor 55 may be used for connection. Also by doing so, the stress applied to the connection point 805 can be reduced (eliminated).

  The present invention can be applied to an illuminating device, and particularly applicable to an illuminating device using a solid light emitting element such as an LED as a light source.

It is a top view which shows the external appearance of the illuminating device 1 which concerns on Embodiment 1 of this invention. 2 is a perspective view showing an appearance of a light source unit 2. FIG. It is a top view which shows the external appearance of the light source unit 2 seen from the A direction in FIG. It is a top view which shows the external appearance of the light source unit 2 seen from the B direction in FIG. It is a top view which shows the external appearance of the light source unit 2 seen from the C direction in FIG. It is a figure which shows the structure of the light source unit 2 seen from the D1-D2 surface in FIG. It is a figure which shows the structure of the light source unit 2 seen from the D3-D4 surface in FIG. It is a figure which shows the structure of the light source unit 2 seen from the D5-D6 surface in FIG. It is a figure which shows the connection using the relay component 54 of the conductor 55 and the board | substrate 57. FIG. FIG. 6 is a perspective view showing an appearance of a relay component 54. FIG. 6 is a perspective view showing an appearance of a relay part 81. FIG. 12 is a plan view showing an appearance of the relay component 81 as viewed from the direction E in FIG. 11. It is a top view which shows the structure of the conductor 55 to which the lug terminal 86 was attached. FIG. 4 is a plan view showing an external appearance of a holding unit 3. It is a top view which shows the external appearance of the 1st attaching part 92a seen from the F direction of FIG. It is a top view which shows the external appearance of the 2nd attachment part 92b seen from the G direction of FIG. 3 is a functional block diagram showing functions of the lighting device 1. FIG. 2 is an example of a circuit configuration of the lighting device 1. 3 is a flowchart showing the operation of the lighting device 1. 7 is a flowchart for explaining control of a conduction period / non-conduction period of an FET 126 based on an average value of instantaneous values of currents output from the diode bridge circuit 124 within a predetermined period. It is a top view which shows the external appearance of the illuminating device 200 which concerns on Embodiment 2. FIG. 2 is a perspective view showing an appearance of a light source unit 201. FIG. It is the top view seen from the H direction of the light source unit 201 in FIG. FIG. 6 is a plan view showing an appearance of a holding unit 211. FIG. 24 is a plan view of the holding unit 211 viewed from the I direction in FIG. 23. It is a top view which shows the external appearance of the illuminating device 300 which concerns on Embodiment 3. FIG. 2 is a perspective view showing an appearance of a light source unit 301. FIG. It is the top view seen from the J direction of the light source unit 301 in FIG. FIG. 6 is a plan view showing an appearance of a holding unit 311. It is the top view seen from the K direction of the holding | maintenance unit 311 in FIG. FIG. 10 is a plan view showing an appearance of a light source unit 351 according to Embodiment 4. It is a figure which shows the structure of the light source unit 351 seen from the K1-K2 surface in FIG. 29B. It is a top view which shows the external appearance of the light source unit 381 which concerns on the modification of Embodiment 4. FIG. It is a figure which shows the structure of the light source unit 381 seen from the K3-K4 surface in FIG. 29D. It is a figure which shows the structure of the light source unit 381 seen from the K5-K6 surface in FIG. 29D. FIG. 10 is a perspective view showing an appearance of a power supply device 401 according to a fifth embodiment. It is a top view which shows the external appearance of the power supply device 401 seen from the L direction of FIG. It is sectional drawing which shows the structure of the power supply device 401 seen from the M1-M2 surface of FIG. It is sectional drawing which shows the structure of the power supply device 401 seen from the N1-N2 surface of FIG. It is a schematic diagram of the heat generating element 453a. 4 is a schematic diagram of a winding element 463. FIG. The state of the heating element 453b mounted on the substrate 455 is shown. FIG. 10 is a plan view showing the appearance of a light source unit 501 according to Embodiment 6. It is a figure which shows the structure of the light source unit 501 seen from the O1-O2 surface in FIG. It is an enlarged view of the O3 portion in FIG. 38A. FIG. 20 is a plan view showing the appearance of a light source unit 601 according to Embodiment 7. It is a figure which shows the structure of the light source unit 601 seen from the P1-P2 surface in FIG. 40B is an enlarged view of the P3 portion in FIG. 40A. It is a top view which shows the external appearance of the cylindrical elastic body 611. FIG. It is a top view of the cylindrical elastic body 611 seen from the P4 direction in FIG. 40C. FIG. 38 is a plan view showing the appearance of a light source unit 701 according to a modification of the seventh embodiment. It is a figure which shows the structure of the light source unit 701 seen from the Q1-Q2 surface in FIG. This is an enlarged view of Q3 in FIG. 42A. FIG. 20 is a perspective view showing an appearance of a light source unit 801 according to Embodiment 8. It is a top view which shows the external appearance seen from the R direction in FIG. 43 of the light source unit 801. It is sectional drawing which shows the structure in the S1-S2 surface of the light source unit 801 in FIG. It is sectional drawing which shows the structure in the S3-S4 surface of the light source unit 801 in FIG. 2 is a plan view showing an appearance of a light source unit 901. FIG. It is a figure which shows the structure of the light source unit 901 seen from the T1-T2 surface in FIG. 2 is a plan view showing an appearance of a light source unit 951. FIG. It is a figure which shows the structure of the light source unit 951 seen from the T3-T4 surface in FIG.

Explanation of symbols

1,200,300 Illumination device 2,201,301,351,381,501,601,701,801,901,951 Light source unit 3,211,311 Holding unit 11,352,382,451,702,902,952 Housing 12a, 202, 302, 502a, 802a First terminal portion 12b, 502b, 802b Second terminal portion 14a, 303a First sensing pin 14b, 203, 303b Second sensing pin 15a First power supply pin 15b Second power source Supply pin 15c First support pin 15d Second support pin 16a, 16b, 304 End face 52, 57, 455 Substrate 53 Element 54, 81 Relay component 55 Conductor 56 Solid state light emitting element 58, 353, 383, 811, 903, 953 Support 59 Reflective surface 61 Connection 62 Pad for wiring 63, 86 Lug Child 71 First member 73, 83 Spire portion 74 Predetermined step 84 Recess 91 Body portion 92a, 212, 312 First mounting portion 92b Second mounting portion 93a, 321a First sensing pin hole 93b, 221, 321b Second sensing Pin hole 94a First power supply pin hole 94b Second power supply pin hole 94c First support pin hole 94d Second support pin hole 101, 401 Power supply device 102 Supply unit 103 Instruction unit 104 Sensing unit 105 Commercial power supply 121, 122 Coil 123, 130 Capacitor 124 Diode bridge circuit 124a, 131, 132 Resistance 125 Driver 126 FET
127 Transformer 128, 129 Diode 133 Controller 134, 135, 136, 137, 805 Connection point 139 Connection part 384, 954, 955 Fixed plate 385, 458, 812 Hollow structure 386 Opening 411 Plate 412a, 412b, 413 Through hole 453a, 453b, 453c Heating element 454 General element 456 Specific end 457 Insulator 459 Opening 460 Small element 461 Press fitting 462 Screw 463 Winding element 463a Core 463b Winding part 471 Heat radiation electrode 511 Groove 512 O-ring 611 Cylindrical elastic body 803 Feeding cable 804 Pull-out point 813 Fixed part

Claims (6)

A lighting device using a solid state light emitting device,
A mounting substrate on which the solid state light emitting device is mounted;
A support means for closely mounting the mounting substrate;
Housing means having the support means disposed therein and having translucency in the light emitting direction of the solid state light emitting device;
A first sealing means having a first hollow structure fixed to one end of the support means and into which one end of the housing means is inserted;
A second sealing means fixed to the other end of the support means and having a second hollow structure into which the other end of the housing means is inserted,
The distance between the bottom surface of the first hollow structure and the bottom surface of the second hollow structure is α,
The distance connecting the upper surface of the first hollow structure and the upper surface of the second hollow structure is β,
In the case where the length along the longitudinal direction of the housing means is γ, the magnitude relationship of α, β, γ is within the environmental temperature range in which the lighting device is used,
α>γ> β
Relationship
The casing means is configured to be movable along the longitudinal direction of the support means within a range of α,
The surface of the support means that is disposed in close contact with the inner wall surface of the housing means is configured as a shape corresponding to the shape of the inner wall surface of the housing means in which the close contact arrangement is made ,
On the inner wall surface of the housing means,
Support plates are provided along the longitudinal direction of the housing means and on both side surfaces with respect to the light emitting direction of the solid state light emitting device,
The support means and the housing means are:
The illuminating device, wherein the support means is fitted and arranged by being positioned between the support plate and an inner wall surface of the housing means in the non-light-emitting direction of the solid state light emitting device. The lighting device according to claim 1 , wherein the mounting substrate is fitted and disposed between the support plate and the support means. The lighting device further includes:
A cutoff means for cutting off the power when there is an abnormality in the power supplied to the solid state light emitting device;
The blocking means is mounted on the first mounting board,
The first mounting board, the illumination device according to claim 1 or 2, characterized in that disposed on at least one of the first hollow structure and the second hollow structure. The first mounting board is disposed in the first hollow structure and / or the second hollow structure so that a mounting surface is perpendicular to a longitudinal direction of the support means. 3. The lighting device according to 3 . The mounting substrate and the first mounting substrate each include a pad portion that is a component mounting pad;
In the pad portion,
A first planar member made of metal and connected to the pad portion;
Two spire portions that are made of metal and are connected perpendicularly to the first member at both ends in the longitudinal direction of the first member on a surface opposite to the surface connected to the pad portion of the first member; A chip component comprising:
The two spires are flat and have the same dimensions and the same shape as each other,
Either one of the two spire portions of the chip component disposed on the pad portion of the mounting substrate is inserted into one through hole of a conductor having through holes formed at both ends, and is soldered. Connected to the conductor;
One of the two spire portions of the chip component disposed on the pad portion of the first mounting substrate is connected to the conductor by soldering while being inserted into the other through hole of the conductor. The lighting device according to claim 3 or 4 , wherein The spire portion has a recess having a maximum width A and a width B,
The through hole of the conductor has an elliptical shape in which the long side direction is C and the short side direction is D,
The relationship between A, B, C, and D is
C>A>D> B
Is established,
The through hole is positioned in the recess, in a state in which the planar direction of the spire portion and the short side direction of the through hole matches the spire section to claim 5, characterized in that it is connected to the conductor The lighting device described.

Images