JP2013004704A - Light emitter and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitter where a sealing resin is formed into a predetermined shape without using a mound and the like specifically used for damming the sealing resin, and to provide a lighting device including the light emitter.SOLUTION: A light emitter 1A includes: a substrate 2; a pair of wiring layers 6 and 6 provided on one surface 2a side of the substrate 2; a semiconductor light emitting element 4 positioned inward between the wiring layers 6 and 6 and mounted on the one surface 2a side of the substrate 2; and a translucent sealing resin 5 covering the semiconductor light emitting element 4, provided inward between the wiring layers 6 and 6, and dammed by the wiring layers 6 and 6.

Description

  One embodiment of the present invention relates to a light emitter using a semiconductor light emitting element as a light source, and an illumination device including the light emitter.

  In this type of light emitter, a plurality of semiconductor light emitting elements mounted on a substrate are surrounded by a bank (frame), and the semiconductor light emitting element is sealed with a sealing resin filled in the bank. The bank is provided exclusively for blocking the sealing resin and is made of a synthetic resin such as a white silicone resin. The sealing resin is made of a translucent silicone resin or the like mixed with a phosphor. And the yellow fluorescent substance which radiates | emits the yellow light excited by the blue light which the semiconductor light-emitting element emitted is used for fluorescent substance (for example, refer patent document 1).

  In the illuminant, white light is formed by mixing blue light and yellow light having a complementary color relationship with the blue light. The light emitter is used in various lighting devices such as a light bulb shaped lamp, a downlight, and a spotlight so that white light is emitted from the surface of the sealing resin in the light utilization direction.

JP 2011-54303 A (Page 7, FIG. 2)

  The light emitting body has a drawback that if a dedicated bank for damming the sealing resin is provided, the cost increases due to the cost required for the material of the bank and the time for forming.

  Embodiments of the present invention provide a light emitter capable of forming a sealing resin into a predetermined shape without requiring a dedicated bank for damming the sealing resin, and a lighting device including the light emitter. Objective.

  The light emitter of the embodiment of the present invention includes a substrate, a wiring layer, a semiconductor light emitting element, and a sealing resin.

  The substrate is provided with a pair of wiring layers on one side thereof.

  The semiconductor light emitting element is mounted on one surface side of the substrate located inside the wiring layer. The semiconductor light emitting element is electrically connected to the pair of wiring layers.

  The sealing resin has translucency, and is provided so as to cover the semiconductor light emitting element and be blocked by the wiring layer inside the wiring layer.

  According to the embodiment of the present invention, the sealing resin that covers the semiconductor light emitting element is provided inside the wiring layer and is blocked by the wiring layer, so that a dedicated member that fills the sealing resin can be omitted. Therefore, it can be expected that the light emitter can be formed at a low cost.

It is a schematic top view of the light emitter showing the first embodiment of the present invention. Similarly, it is a schematic sectional side view of a light emitter. It is a schematic sectional side view of the light-emitting body which shows the 2nd Embodiment of this invention. It is a schematic sectional side view of the light-emitting body which shows the 3rd Embodiment of this invention. It is a schematic front view of the tube light-emitting lamp which shows the 4th Embodiment of this invention. Similarly, it is a schematic perspective view of a lighting fixture.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings. First, a first embodiment of the present invention will be described.

  The light emitter 1 of the present embodiment is configured as shown in FIGS. In addition, in each figure, the same code | symbol is attached | subjected to the same part and the overlapping description is abbreviate | omitted. The same applies to the following embodiments.

  In FIG. 1, the light emitter 1 includes a substrate 2, a pair of wiring patterns 3 and 3, an LED bare chip 4 as a semiconductor light emitting element, and a sealing resin 5.

  The board | substrate 2 consists of ceramics and is formed in the elongate rectangle. For example, the long dimension is 230 mm, and the short (width) dimension is 20 mm. Further, the substrate 2 having a thickness of 0.5 to 1.8 mm is used, and a substrate having a thickness of 1 mm is used here.

  The pair of wiring patterns 3 and 3 includes a wiring layer 6 and a protective layer 7, respectively. The wiring layer 6 is made of, for example, a 10 μm metal foil such as silver foil, and is formed on the one surface 2a side of the substrate 2 by, for example, screen printing. The pair of wiring layers 6 and 6 are provided so as to face each other along the longitudinal direction of the substrate 2. That is, the wiring layers 6 and 6 are formed symmetrically with respect to a center line (not shown) in the longitudinal direction of the substrate 2, and the inner interval is, for example, 10 mm.

  The protective layer 7 is made of an electrically insulating material such as glass, and is formed so as to cover the wiring layer 6 by, for example, screen printing. The thickness is, for example, 10 μm. The protective layer 7 prevents the wiring layer 6 from coming into contact with air and prevents the surface degradation of the wiring layer 6.

  The wiring layers 6 and 6 are electrically connected to a connection connector 8 provided at one end 2c in the longitudinal direction of the substrate 2. The connection connector 8 is a female connector and is soldered and attached to the one surface 2a of the substrate 2, and a pair of connection terminals (not shown) are electrically connected to the wiring layers 6 and 6 by soldering. The connection connector 8 is formed so that a male connector (not shown) is connected along the longitudinal direction of the substrate 2. The connection terminal of the connection connector 8 is electrically connected to the connection pin of the male connector.

  Note that a male connector connected to the connection connector 8 of another light emitter 1 may be provided on the other end 2d of the substrate 2, and the wiring layers 6 and 6 may be connected to the male connector. Thereby, the several light-emitting body 1 arranged in parallel by the longitudinal direction can be electrically connected one by one.

  The LED bare chip 4 is formed in a known configuration, for example, in a substantially rectangular parallelepiped shape so as to emit blue light. A plurality of the LED bare chips 4 are located on the inner side between the wiring layers 6 and 6 and are mounted on the one surface 2 a of the substrate 2. The plurality of LED bare chips 4 are arranged in parallel at equal intervals along the wiring patterns 3 and 3 at an intermediate position between the wiring patterns 3 and 3 (wiring layers 6 and 6). The space | interval of LED bare chips 4 and 4 is set to 5-20 mm, for example, and is 10 mm here.

  The sealing resin 5 is made of, for example, a silicone resin having translucency, and is provided on the one surface 2 a side of the inner substrate 2 between the pair of wiring patterns 3 and 3. Further, the sealing resin 5 is mixed with a yellow phosphor 9 at a predetermined ratio. The sealing resin 5 has a predetermined fluidity (viscosity) at the beginning, and is dropped onto the one surface 2a side of the substrate 2 between the pair of wiring patterns 3 and 3, and solidifies on the one surface 2a side. Provided.

  The sealing resin 5 can cover the plurality of LED bare chips 4 arranged side by side, and a predetermined amount of the cross-sectional shape between the pair of wiring patterns 3 and 3 is formed in a predetermined shape, for example, a hemisphere. It is dripped over the formation range of a pair of wiring patterns 3 and 3 in the longitudinal direction. The dropped sealing resin 5 is blocked by the protective layers 7 and 7 of the pair of wiring patterns 3 and 3 in the short direction of the substrate 2 and has a bowl shape due to surface tension.

  And the sealing resin 5 is formed in the shape of a semispherical cross section by solidifying, as shown in FIG. In the sealing resin 5, the width dimension W1 on the one surface 2a of the substrate 2 is about 10 mm between the protective layers 7 and 7, and the height dimension H1 from the one surface 2a of the substrate 2 is, for example, 2.5 mm. Yes.

  The sealing resin 5 has the width dimension W1 according to the size of the LED bare chip 4, the inner space between the pair of wiring patterns 3 and 3, the thickness of each of the wiring layer 6 and the protective layer 7, and the like. The height dimension H1 is set in the range of 0.5 to 5 mm in the range of 1 to 10 mm. Further, the cross-sectional shape of the sealing resin 2 is not limited to a hemispherical shape, and may be formed in a predetermined shape such as a bullet shape or a semi-elliptical shape.

  Further, the viscosity of the sealing resin 5 does not sag or drool outside the pair of wiring patterns 3 and 3 while being dammed by the pair of wiring patterns 3 and 3 (the pair of protective layers 7 and 7). It is set to a predetermined viscosity value, and is set as appropriate according to the respective thicknesses of the wiring layer 6 and the protective layer 7, the total amount of the sealing resin 5 between the pair of wiring patterns 3, 3. And it is suitable that the said viscosity is set to the range of 10-80 poise (P), More preferably, it is good to set to 20-60 poise (P). Here, for example, 40 poise (P) sealing resin 5 is used.

  Next, the operation of the first embodiment of the present invention will be described.

  The sealing resin 5 is continuously dropped onto the one surface 2a of the intermediate substrate 2 between the pair of wiring patterns 3 and 3 in a fluid state. The sealing resin 5 on the substrate 2 spreads on the one surface 2a of the substrate 2 as the sealing resin 5 is dropped, and reaches the protective layers 7 and 7 of the pair of wiring patterns 3 and 3. The thickness of each of the wiring layer 6 and the protective layer 7 is 10 μm, and the protruding length of the upper surface of the protective layer 7 from the one surface 2a of the substrate 2 is 20 μm. The wiring patterns 3 and 3 are blocked by the protective layers 7 and 7. The sealing resin 5 has a resistance against spreading force that spreads from the pair of wiring patterns 3 and 3.

  When the total dripping amount of the sealing resin 5 increases and the sealing resin 5 on the substrate 2 reaches the upper surface line of the protective layer 7, it passes over the protective layer 7 and spreads outside the pair of wiring patterns 3 and 3. I will try. Here, the sealing resin 5 has a predetermined viscosity, for example, 40 poises (P) and is not easily spread. Then, by receiving the drag from the pair of wiring patterns 3, 3, the spread (movement) of the pair of wiring patterns 3, 3 is prevented.

  The sealing resin 5 is formed in a substantially arc shape on the outer surface 5a side with the middle of the inner side between the pair of wiring patterns 3 and 3 as a vertex due to the surface tension. Thus, the sealing resin 5 is prevented from dripping or drooling on the pair of wiring patterns 3 and 3 side. The sealing resin 5 is formed into a bowl shape having a hemispherical cross section when a predetermined amount is dropped and solidified.

  When predetermined power is supplied to the connection connector 8 provided on the substrate 2, the light emitter 1 emits the LED bare chip 4 to emit blue light. A part of the blue light is wavelength-converted into yellow light by the yellow phosphor 9 mixed in the sealing resin 5. Then, white light in which blue light and yellow light are mixed is emitted outward from the outer surface 5 a of the sealing resin 5. Since the cross-sectional shape of the sealing resin 5 is formed in a predetermined shape, for example, a hemispherical shape, white light is emitted from the outer surface 5a of the sealing resin 5 in a predetermined direction.

  The plurality of LED bare chips 4 are arranged in parallel along the pair of wiring patterns 3 and 3 (the pair of wiring layers 6 and 6) at equal intervals. A substantially constant white light is emitted throughout.

  Here, the space between both ends in the longitudinal direction of the pair of wiring patterns 3 and 3 is open, and there is nothing to block the sealing resin 5. However, the cross-sectional shape of the sealing resin 5 in the vicinity of the outermost LED bare chip 4 has a predetermined shape, for example, a hemispherical shape, by appropriately increasing the distance between the virtual line between both ends in the longitudinal direction and the outermost LED bare chip 4. Displacement is suppressed. Therefore, white light is also emitted in a predetermined direction from the outer surface 5a of the sealing resin 5 in the vicinity of the outermost LED bare chip 4.

  In addition, when the light emitter 1 emits blue light, the yellow phosphor 9 or the like is not mixed with the sealing resin 5.

  According to the present embodiment, the sealing resin 5 covering the LED bare chip 4 is provided inside the protective layers 7 and 7 of the pair of wiring patterns 3 and 3 and is dammed by the protective layers 7 and 7. A dedicated member for filling the sealing resin 5 is not required, and the light emitter 1 can be formed at a low cost. Further, since the sealing resin 5 is dammed by the protective layers 7 and 7, the pair of wiring patterns 3 and 3 are less likely to sag to the one surface 2a side of the substrate 2, and the cross-sectional shape of the sealing resin 5 is set to a predetermined shape. For example, it can be formed in a hemispherical shape, thereby having an effect that the emitted light from the sealing resin 5 can be emitted in a predetermined direction.

Next, a second embodiment of the present invention will be described.
A light emitter 1A shown in FIG. 3 shows a second embodiment of the present invention. In the light emitter 1 shown in FIGS. 1 and 2, the pair of wiring patterns 3, 3 is formed only by a pair of wiring layers 6, 6. Has been. That is, the protective layers 7 and 7 that cover the wiring layers 6 and 6 are not provided, and the wiring layers 6 and 6 are formed so as to be exposed on the one surface 2 a side of the substrate 2.

  The sealing resin 5 is provided inside the wiring layers 6 and 6 and is blocked by the wiring layers 6 and 6. Here, the wiring layers 6 and 6 are preferably thicker than the protective layers 7 and 7 so as to completely dam the sealing resin 5. Further, the viscosity of the sealing resin 5 may be somewhat increased so that it does not sag or droop outside the wiring layers 6 and 6.

  According to this embodiment, since the sealing resin 5 is provided inside the pair of wiring layers 6 and 6 and is blocked by the wiring layers 6 and 6, a dedicated member that fills the sealing resin 5 is provided. Since it is not used, the light emitter 1A can be formed at low cost. Further, since the sealing resin 5 is dammed by the wiring layers 6 and 6, the pair of wiring layers 6 and 6 are less likely to sag to the one surface 2a side of the substrate 2, and the cross-sectional shape of the sealing resin 5 is a predetermined shape. For example, it can be formed in a hemispherical shape, thereby having an effect that the emitted light from the sealing resin 5 can be emitted in a predetermined direction.

Next, a third embodiment of the present invention will be described.
A light emitter 1B shown in FIG. 4 shows a third embodiment of the present invention. In the light emitter 1 shown in FIG. 2, the substrate 2 is the substrate 11, the pair of wiring patterns 3 and 3 are the pair of wiring patterns 12a, 12b. Other configurations are substantially the same as those of the light emitter 1.

  The substrate 11 is made of a synthetic resin such as a glass epoxy material. It is formed in the same manner as the substrate 2 except that this material is different.

  The pair of wiring patterns 12a and 12b is formed to have a pair of wiring layers 13a and 13b and a pair of protective layers 14a and 14b.

  Each of the wiring layers 13a and 13b is made of, for example, a 10 μm metal foil such as a copper foil, and is formed on the one surface 11a of the substrate 11 by, for example, screen printing. The wiring layer 13a is formed wider than the wiring layer 13b. The wiring layers 13a and 13b are provided so that they face each other along the longitudinal direction of the substrate 11, and the gap 15 between them is a predetermined value, for example, 1 to 2 mm.

  The protective layers 14a and 14b are made of, for example, an electrically insulating white resist, and are formed on the one surface 11a side of the substrate 11 by, for example, screen printing so as to cover a part of the wiring layers 13a and 13b, respectively. The protective layers 14a and 14b are formed on almost the entire surface 11a of the substrate 11 excluding the formation region of the wiring layers 13a and 13b, the region of the gap 15 between the wiring layers 13a and 13b and the region where the connection connector 8 (not shown) is provided. Yes. The thicknesses of the protective layers 14a and 14b are, for example, 10 μm for the wiring layers 13a and 13b and 20 μm for the substrate 11, for example.

  The LED bare chip 4 is mounted on the wide wiring layer 13a by an adhesive 16 which is transparent and has an insulating property. The plurality of LED bare chips 4 are arranged in parallel along the wiring layer 13a at equal intervals, and are electrically connected in series by bonding wires (not shown). And the LED bare chips 4 and 4 (only one is shown in FIG. 4) arranged in parallel at the both ends are electrically connected to the wiring layers 13a and 13b by bonding wires 17 and 17, respectively.

  Thus, the LED bare chip 4 is mounted on the one surface 11a side of the substrate 11 via the wiring layer 13a. The LED bare chip 4 is mounted on the one surface 11a side of the substrate 11 so as to be located inside the protective layers 14a and 14b.

  Note that the LED bare chip 4 is not limited to this embodiment, and may be provided so as to be located at one or both of the inside of the wiring layer and the inside of the protective layer.

  The sealing resin 5 is a translucent and electrically insulating silicone resin, for example, and covers the LED bare chip 4 and the bonding wires 17 and 17 and is provided between the protective layers 14a and 14b of the wiring patterns 12a and 12b. It is provided and is dammed by the protective layers 14a and 14b. At this time, the sealing resin 5 fills the gap 15 between the wiring layers 13a and 13b to improve the electrical insulation between the wiring layers 13a and 13b. The sealing resin 5 is prevented from sagging or drooling on the surface side of the protective layers 14a and 14b, and is formed in a predetermined cross-sectional shape, for example, a hemispherical shape.

  In the light emitting body 1B, a part of white light emitted from the outer surface 5a of the sealing resin 5 is reflected by the protective layers 14a and 14b and emitted to the front side of the one surface 11a of the substrate 11. The protective layers 14a and 14b are made of a white resist and have a high reflectance, and are provided on almost the entire surface 11a of the substrate 11, so that the emission efficiency of white light is improved.

  According to the present embodiment, the sealing resin 5 is provided on the inner side between the pair of protective layers 14a and 14b of the pair of wiring patterns 12a and 12b on the one surface 11a side of the substrate 11 made of synthetic resin. Since it is dammed by 14b, there is no need for a dedicated member for filling the sealing resin 5, and the light emitter 1B can be formed at a lower cost. Further, since the sealing resin 5 is dammed by the protective layers 14a and 14b, the sealing resin 5 is less likely to sag toward the pair of protective layers 14a and 14b, and the cross-sectional shape of the sealing resin 5 can be formed into a predetermined shape, for example, a hemispherical shape. This has the effect that the emitted light from the sealing resin 5 can be emitted in a predetermined direction.

Next, a fourth embodiment of the present invention will be described.
5 and 6 show a fourth embodiment of the present invention, FIG. 5 is a schematic front view of a straight tube type light emitting lamp, and FIG. 6 is a schematic perspective view of a lighting fixture. The same parts as those in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted.

  A straight tube light-emitting lamp 21 shown in FIG. 5 forms the illumination device of the present invention. The light-emitting body 1 shown in FIG. It is formed.

  The attachment body 22 is made of a metal having a light weight and high thermal conductivity, such as aluminum (Al), and has a substantially bowl shape. That is, the attachment body 22 is formed in an arcuate column having an arcuate surface 22b along the flat portion 22a and the inner surface 23b of the tube body 23.

  And the attachment body 22 is provided so that the circular-arc-shaped surface 22b may be mounted in the inner surface 23b of the tubular body 23, and the light-emitting body 1 is attached to the plane part 22a. The light-emitting body 1 is attached to the flat portion 22a with screws (not shown) such that the other surface opposite to the one surface 2a of the substrate 2 is in surface contact. A plurality of the light emitters 1 are arranged in parallel in the longitudinal direction of the plane portion 22a.

  The tube body 23 is made of a light-transmitting synthetic resin such as polycarbonate (PC) resin, and is formed in a cylindrical shape having an outer diameter of 25 mm and a wall thickness of 1 mm, for example. And the light-emitting body 1 attached to the attachment body 22 and the attachment body 22 is accommodated over the longitudinal direction.

  The pair of caps 24 and 25 is made of an electrically insulating synthetic resin such as polybutylene terephthalate (PBT) resin, and is molded into a bottomed cylindrical shape having the same outer diameter as the tube body 23, and both ends of the tube body 23. It is provided on the 23c, 23d side. In other words, the pair of caps 24 and 25 are attached to the attachment body 22 with screws (not shown) screwed to the attachment body 22 from the end faces 24 a and 25 a side so as to sandwich the tube body 23.

  The base 24 is provided with a pair of power supply contacts 26, 26 (only one is shown in FIG. 5), and the base 25 is provided with a single ground contact 27. The pair of power feeding contacts 26, 26 are connected to the connection connector 8 of the light emitter 1 via a male connector (not shown). The ground contact 27 is connected to the mounting body 22 by a lead wire (not shown).

  When a predetermined power is supplied to the pair of power supply contacts 26 and 26 from a lighting device (not shown), the straight tube type light emitting lamp 21 lights (emits light) the LED bare chip 4 of the light emitting body 1 and the sealing resin 5. White light is emitted from the outer surface 5a. White light passes through the translucent tube 23 and is emitted from the outer surface 23a of the tube 23 to the external space.

  The straight tube-type light-emitting lamp 21 of the present embodiment is formed at a low cost and includes the light emitter 1 that emits radiated light (white light) in a predetermined direction. This has the effect of emitting emitted light in the direction to illuminate the object and the illumination space.

  And the straight tube | pipe-type light-emitting lamp 21 is mounted | worn with the lighting fixture 28 as an illuminating device shown in FIG. The lighting fixture 28 is directly attached to the ceiling surface, and includes a straight tube type light emitting lamp 21, a fixture main body 29 as a device main body, and a lighting device 30. The instrument body 29 is formed of a cold-rolled steel sheet or the like, and has an existing configuration in which a conventional straight tube fluorescent lamp is mounted except for the sockets 31a and 31b.

  The appliance main body 29 has sockets 31a and 31b to / from which the straight tube light-emitting lamp 21 is attached / detached at both longitudinal ends 29a and 29b. One socket 31a is formed in a structure in which a pair of power feeding contacts 26, 26 (not shown) provided on the base 24 of the straight tube light-emitting lamp 21 are inserted and connected. The other socket 31b is formed in a structure in which one ground contact 27 (not shown) provided on the base 25 of the straight tube light-emitting lamp 21 is inserted and connected.

  The instrument body 29 includes a base (not shown) attached to the ceiling surface with screws or the like, and a reflector 32 fixed to the base with screws (not shown) via an attachment member (not shown). The base is formed in a long and substantially rectangular shape, and the reflector 32 is formed in a box shape that is long and has a substantially pentagonal cross section perpendicular to the longitudinal direction.

  The lighting device 30 is attached to the base. The lighting device 30 has an input line (not shown) connected to an external commercial AC power source. A pair of output lines (not shown) are connected to one socket 31a, and a ground line (not shown) is connected to the other socket 31b. Thus, the lighting device 30 is disposed in the appliance main body 29. The lighting device 30 is formed by a known configuration that supplies a predetermined current to the straight tube light emitting lamp 21 to light the LED bare chip 4 of the light emitter 1.

  Since the lighting fixture 28 of the present embodiment includes the straight tube light emitting lamp 21 that can be formed at a low cost and emits the radiated light of the light emitter 1 in a predetermined direction, the running cost can be reduced and a predetermined illumination area can be reduced. The illumination area can be efficiently irradiated with illumination light to illuminate the illumination area.

  DESCRIPTION OF SYMBOLS 1,1A, 1B ... Light-emitting body, 2,11 ... Board | substrate, 4 ... LED bare chip as a semiconductor light emitting element, 5 ... Sealing resin, 6, 6, 13a, 13b ... Wiring layer, 7, 7, 14a, 14b ... Protective layer, 28 ... lighting fixture as lighting device, 29 ... fixture main body as device main body, 30 ... lighting device

Claims (4)

A substrate;
A pair of wiring layers provided on one side of the substrate;
A semiconductor light emitting device mounted on one side of the substrate located inside the wiring layer;
A translucent sealing resin that covers the semiconductor light emitting element and is provided inside the wiring layer and is blocked by the wiring layer;
A light emitter characterized by comprising:   The light emitting body according to claim 1, wherein the wiring layer is covered with a protective layer, and the sealing resin is blocked by the protective layer.   2. The wiring layer is provided so as to face each other along a longitudinal direction of the substrate, and a plurality of the semiconductor light emitting elements are arranged in parallel along the wiring layer. Or the light-emitting body of 2. A light emitter according to any one of claims 1 to 3;
An apparatus main body in which the light emitter is disposed;
A lighting device for lighting the semiconductor light emitting element;
An illumination device comprising:

Images