JP6704182B2 - Lighting equipment - Google Patents

Description

The present invention relates to a light emitting module and a lighting device including the light emitting module.

A semiconductor light emitting element such as a light emitting diode (LED) is widely used as a light source for various devices because of its high efficiency and long life. For example, the LED is used as a light source for illumination of a lamp or a lighting device, or is used as a backlight light source of a liquid crystal display device.

Generally, LEDs are unitized as an LED module and built in various devices. The LED module includes, for example, a substrate and one or more LEDs mounted on the substrate (for example, Patent Document 1).

JP, 2011-176017, A

As an LED module, a COB (Chip On Board) type configuration in which one or a plurality of LEDs (LED chips) are directly mounted on a substrate is known. The COB type LED module includes, for example, a long board, a plurality of LED chips linearly mounted on the board along the longitudinal direction of the board, and a linear board so as to collectively seal the plurality of LED chips. And a sealing member formed into a shape. The LED chip mounted on the board is connected to a metal wiring formed on the board or an adjacent LED chip by a wire. The wire connected to the LED chip is sealed in the sealing member together with the LED chip. The sealing member is made of, for example, a translucent resin containing a phosphor.

When incorporating the light emitting module configured as described above into a lighting device, a plurality of light emitting modules may be arranged adjacent to each other along the longitudinal direction of the substrate. In this case, in order to prevent light from being interrupted between two adjacent light emitting modules, in each light emitting module, a sealing member may be formed up to both end edges in the longitudinal direction of the substrate.

When such a sealing member is formed, for example, the material of the sealing member is applied to both end edges of the substrate in the longitudinal direction. May protrude from the edge of. Therefore, when a plurality of light emitting modules are arranged adjacent to each other along the longitudinal direction of the substrate, the sealing members of the respective light emitting modules come into contact with each other at the joints between the adjacent light emitting modules, and the sealing member generated at this time The wire embedded in the sealing member may be deformed and broken due to the stress.

The present invention has been made to solve such a problem, and suppresses deformation of a wire sealed by a sealing member even when a plurality of light emitting modules are arranged adjacent to each other. An object of the present invention is to provide a light emitting module and a lighting device that can be used.

In order to achieve the above object, one mode of a light emitting module according to the present invention is a substrate, a plurality of light emitting elements linearly arranged on a main surface of the substrate, and a plurality of light emitting elements connected to each of the plurality of light emitting elements. A wire and a sealing member that seals the plurality of light emitting elements and the wire, and a recessed portion located on an extension of the array direction of the plurality of light emitting elements is formed at an end portion of the substrate, The shape of the recess is a shape in which a part of each of the main surface and the side surface of the substrate is cut out, and in plan view, the sealing member is formed along the array direction of the plurality of light emitting elements. It is formed in a straight line up to the position, and the tip portion is formed so as not to protrude from the recess.

Further, an aspect of the lighting device according to the present invention includes a plurality of the light emitting modules, and the plurality of light emitting modules are arranged adjacent to each other along a longitudinal direction of the sealing member.

According to the present invention, even when a plurality of light emitting modules are arranged adjacent to each other, it is possible to suppress deformation of the wire sealed by the sealing member.

The top view of the light emitting module which concerns on Embodiment 1. Sectional drawing of the light emitting module which concerns on Embodiment II in the II-II line of FIG. A schematic diagram for explaining a situation when two conventional light emitting modules are arranged adjacent to each other. FIG. 3B is an enlarged cross-sectional view of the connecting portion of the two light emitting modules in FIG. Schematic diagram for explaining a state when two light emitting modules according to Embodiment 1 are arranged adjacent to each other. FIG. 3 is an external perspective view of the lighting device according to the second embodiment. Sectional expanded sectional view of the light emitting module which concerns on the modification 1. Sectional expanded sectional view of the light emitting module which concerns on the modification 2.

Hereinafter, embodiments of the present invention will be described. It should be noted that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements, steps (steps), order of steps, and the like shown in the following embodiments are examples and are intended to limit the present invention. is not. Therefore, among the constituent elements in the following embodiments, the constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as arbitrary constituent elements.

Each drawing is a schematic diagram, and is not necessarily an exact illustration. Therefore, for example, the scales and the like do not necessarily match in each drawing. In addition, in each drawing, the same reference numerals are given to substantially the same configurations, and overlapping description will be omitted or simplified.

(Embodiment 1)
The configuration of the light emitting module 1 according to the first embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a plan view of the light emitting module 1 according to the first embodiment. FIG. 2 is a cross-sectional view of the light emitting module 1 taken along the line II-II of FIG.

As shown in FIG. 1, the light emitting module 1 includes a substrate 10, a light emitting element 20, a wire 30, and a sealing member 40. The light emitting module 1 in the present embodiment is a line-shaped light source that emits light in a line and emits white light, for example. The light emitting module 1 is a COB type LED module in which an LED chip is directly mounted as the light emitting element 20 on the substrate 10.

Hereinafter, each component of the light emitting module 1 will be described in detail.

[substrate]
The substrate 10 shown in FIGS. 1 and 2 is a mounting substrate for mounting the light emitting element 20. As the substrate 10, a ceramic substrate made of ceramic, a resin substrate made of resin, a metal base substrate made of metal, or a glass substrate made of glass can be used.

As the ceramic substrate, an alumina substrate made of alumina, an aluminum nitride substrate made of aluminum nitride, or the like can be used. As the resin substrate, for example, a glass epoxy substrate made of glass fiber and epoxy resin (CEM-3, FR-4, etc.), a substrate made of paper phenol or paper epoxy (FR-1, etc.), or polyimide, etc. A flexible substrate or the like having different flexibility can be used. As the metal base substrate, for example, an aluminum alloy substrate, an iron alloy substrate, a copper alloy substrate, or the like having an insulating film formed on its surface can be used. The substrate 10 is not limited to the rigid substrate, but may be a flexible substrate.

The substrate 10 is preferably a white substrate having a high light reflectance (for example, a light reflectance of 90% or more). Since the light emitted from the light emitting element 20 can be reflected on the surface of the substrate 10 by using the white substrate, the light extraction efficiency of the light emitting module 1 can be improved. In this embodiment, a white polycrystalline ceramic substrate is used. More specifically, as the substrate 10, for example, a white polycrystalline alumina substrate (polycrystalline ceramic substrate) having a thickness of about 1 mm configured by firing alumina particles can be used. The ceramic substrate has a higher thermal conductivity than the resin substrate and can efficiently dissipate the heat generated in the light emitting element 20. Further, the ceramic substrate has little deterioration with time and has excellent heat resistance.

In the present embodiment, the substrate 10 is a long rectangular substrate. That is, the plan view shape of the substrate 10 is a long rectangular shape. When the length (long side length) of the long substrate 10 is L1 and the short direction length (short side length) thereof is L2, The aspect ratio (L1/L2) of the substrate 10 is, for example, L1/L2≧10. The shape of the substrate 10 is not limited to a long shape, and may be a square. Further, the shape of the substrate 10 is not limited to the rectangular shape.

Although not shown, metal wiring formed in a pattern of a predetermined shape is formed on the substrate 10 to electrically connect the plurality of light emitting elements 20 to each other. The metal wiring is formed, for example, between the adjacent light emitting elements 20.

Further, the substrate 10 is provided with a pair of electrode terminals for receiving DC power for causing the light emitting element 20 to emit light from the outside of the light emitting module 1. The pair of electrode terminals are electrically connected to an external power supply device (power supply circuit) via, for example, a lead wire or the like. The electric power received by the pair of electrode terminals is supplied to the light emitting element 20 through the metal wiring.

[Light emitting element]
As shown in FIGS. 1 and 2, the light emitting element 20 is arranged on the substrate 10. In the present embodiment, a plurality of light emitting elements 20 are used, and the plurality of light emitting elements 20 are linearly arranged on the main surface of substrate 10. Specifically, the plurality of light emitting elements 20 are arranged in only one row along the longitudinal direction of the substrate 10. The plurality of light emitting elements 20 are arranged at the same pitch, and the distances between the adjacent light emitting elements 20 are all the same. Each light emitting element 20 is mounted on the substrate 10 by die bonding with a die attach agent or the like. In the present embodiment, the light emitting element 20 is directly mounted on the substrate 10.

Each light emitting element 20 is an example of a semiconductor light emitting element, and emits light with predetermined power. In the present embodiment, each light emitting element 20 is a bare chip (LED chip) that emits monochromatic visible light, for example, a blue LED chip that emits blue light when energized. The blue LED chip has a single-sided electrode structure in which both a p-side electrode and an n-side electrode are formed on the upper surface of a nitride semiconductor layer formed on a sapphire substrate, for example, a gallium nitride-based material having a center wavelength of 440 nm to 470 nm. The semiconductor light emitting element of can be used.

In the present embodiment, the two adjacent light emitting elements 20 are electrically connected via the metal wiring (land) and the wire 30 formed between the two adjacent light emitting elements 20, It is not limited to this. For example, in the plurality of light emitting elements 20, two adjacent light emitting elements 20 may be directly connected by the wire 30. That is, two adjacent light emitting elements 20 may be wire-bonded by Chip-to-Chip.

[Wire]
As shown in FIGS. 1 and 2, the wire 30 is connected to each of the plurality of light emitting elements 20. In the present embodiment, a pair of wires 30 is connected to each light emitting element 20. The wire 30 is connected to, for example, the light emitting element 20 and a metal wiring (not shown) formed on the substrate 10. That is, the light emitting element 20 and the metal wiring are wire-bonded by the wire 30, one end of the wire 30 is connected to the light emitting element 20, and the other end of the wire 30 is connected to the metal wiring. The wire 30 is a metal wire such as a gold wire, and is provided so as to extend from the light emitting element 20 to the metal wiring by using a capillary.

The wire 30 is sealed by the sealing member 40. In the present embodiment, the wire 30 is entirely embedded in the sealing member 40, but a part thereof may be exposed from the sealing member 40.

Further, all the wires 30 sealed by the sealing member 40 are provided so as to be in the same direction as the longitudinal direction of the sealing member 40. That is, all the wires 30 connected to the light emitting element 20 are provided so as to be aligned on a straight line when seen in a plan view.

[Sealing member]
As shown in FIGS. 1 and 2, the sealing member 40 seals the plurality of light emitting elements 20 and the plurality of wires 30. That is, the sealing member 40 is formed on the substrate 10 so as to cover the plurality of light emitting elements 20 and the plurality of wires 30. The light emitting element 20 and the wire 30 can be protected by sealing the light emitting element 20 and the wire 30 with the sealing member 40.

The sealing member 40 collectively seals the plurality of light emitting elements 20 arranged in a straight line. That is, the sealing member 40 is linearly formed on the main surface of the substrate 10 along the arrangement direction of the light emitting elements 20. In the present embodiment, the sealing member 40 is formed along the longitudinal direction of the substrate 10. Specifically, the sealing member 40 is formed from one of the two short sides of the substrate 10 to the other. That is, the sealing member 40 is formed up to the vicinity of both end edges of the substrate 10 in the longitudinal direction, and is continuously formed from one short side of the substrate 10 to the other short side facing the substrate 10 without interruption.

The sealing member 40 is mainly made of a translucent material, but when it is necessary to convert the wavelength of light emitted by the light emitting element 20 into a predetermined wavelength, the sealing member 40 changes the wavelength of light emitted by the light emitting element 20. It includes a wavelength conversion material for conversion. In this case, the sealing member 40 includes a phosphor as a wavelength conversion material, and functions as a wavelength conversion member that converts the wavelength (color) of the light emitted by the light emitting element 20. The phosphor is excited by the light emitted from the light emitting element 20 and emits light of a desired color (wavelength).

As the translucent material forming the sealing member 40, for example, a translucent insulating resin material such as silicone resin, epoxy resin, or fluorine resin can be used. The translucent material is not necessarily limited to an organic material such as a resin material, and an inorganic material such as low melting point glass or sol-gel glass may be used.

In the present embodiment, since the light emitting element 20 is a blue LED chip, a yttrium-aluminum-garnet (YAG)-based yellow phosphor can be used as the phosphor in order to obtain white light. As a result, part of the blue light emitted by the blue LED chip is absorbed by the yellow phosphor and the wavelength thereof is converted into yellow light. That is, the yellow phosphor emits yellow light when excited by the blue light of the blue LED chip. White light is generated as a combined light in which yellow light by the yellow phosphor and blue light not absorbed by the yellow phosphor are mixed, and the white light is emitted from the sealing member 40.

The sealing member 40 may further include a red phosphor in order to enhance color rendering. Further, in the sealing member 40, a light diffusing material such as silica for enhancing the light diffusing property, or a filler or the like for suppressing the sedimentation of the phosphor may be dispersed.

Sealing member 40 in the present embodiment is a phosphor-containing resin in which a yellow phosphor is dispersed in a silicone resin as a translucent material. The sealing member 40 applies the material (phosphor-containing resin) of the sealing member 40 to the main surface of the substrate 10 by a dispenser so as to cover the light emitting elements 20 along the arrangement direction of the light emitting elements 20, and then cures. It can be formed by that. The sealing member 40 formed by applying in this way is in a semi-cylindrical shape, and the shape of the sealing member 40 in a cross section perpendicular to the longitudinal direction is, for example, a substantially semicircular shape.

[Features and effects of light emitting module]
Next, a characteristic configuration of the light emitting module 1 will be described with reference to FIGS. 1 and 2.

As shown in FIGS. 1 and 2, a recess 11 is formed at the end of the substrate 10. In this embodiment, the recess 11 is formed at the end of the substrate 10 in the longitudinal direction. That is, it is formed on the short side of the substrate 10. The recess 11 may be formed on at least one of the two opposing short sides of the substrate 10, but in the present embodiment, the recess 11 is formed on each of the two opposing short sides of the substrate 10. There is.

The recess 11 is located on an extension of the plurality of light emitting elements 20 in the arrangement direction. Therefore, the recess 11 is located on the extension of the sealing member 40 that seals the plurality of light emitting elements 20 in the longitudinal direction.

The shape of the recess 11 is a shape obtained by cutting out a part of each of the main surface and the side surface of the substrate 10. Specifically, the recess 11 has a shape in which a part of the short side of the substrate 10 is receded in a plan view, and in a cross-sectional view, a part of the surface of the substrate 10 is receded in the thickness direction. In addition, the side surface of the substrate 10 is partially retracted.

In the present embodiment, the recess 11 penetrates in the thickness direction of the substrate 10. That is, the recess 11 is a through hole formed so as to cut out a part of the substrate 10. The shape of the recess 11 in plan view is, for example, a rectangular shape. As an example, the length of the recess 11 in the longitudinal direction of the substrate 10 (the amount of receding from the short side) is 1 mm. The length of the recess 11 in the lateral direction of the substrate 10 is almost the same as the width of the sealing member 40. The shape and size of the recess 11 are not limited to the above.

Such a recess 11 may be formed by cutting out one side of the substrate 10 having a rectangular shape, or the substrate 10 having the recess 11 may be formed by molding using a mold or the like.

Then, in light emitting module 1 in the present embodiment, sealing member 40 for sealing the plurality of light emitting elements 20 is formed so as not to protrude from the short side of the rectangle of substrate 10.

Specifically, as shown in FIG. 1, in a plan view, the sealing member 40 is linearly formed to the position of the recess 11 along the arrangement direction of the plurality of light emitting elements 20, and the tip portion is recessed. It is formed so as not to protrude from 11. That is, the tip of the sealing member 40 is located inward of the substrate 10 with respect to the rectangular short side of the substrate 10 (the portion where the recess 11 is not formed) in plan view and cross-sectional view.

Note that the sealing member 40 does not necessarily have to enter the recess 11, but when the material of the sealing member 40 is applied to the recess 11 when forming the sealing member 40, the sealing member 40 is not covered. Due to the viscosity of the material, the wettability of the substrate 10, or the like, the tip of the material of the sealing member 40 hangs along the inner surface of the recess 11 and wraps below the main surface of the substrate 10. As a result, the sealing member 40 may be formed so as to enter the recess 11.

Next, the function and effect of the light emitting module 1 will be described with reference to FIGS. FIG. 3 is a schematic diagram for explaining a state in which two conventional light emitting modules 1X are arranged adjacent to each other. FIG. 4 is an enlarged cross-sectional view of the connecting portion of the two light emitting modules 1X in FIG. 3(b). FIG. 5 is a schematic diagram for explaining how two light emitting modules 1 according to Embodiment 1 are arranged adjacent to each other.

Unlike the light emitting module 1 of the first embodiment shown in FIG. 1, the conventional light emitting module 1X shown in FIG. It has the same configuration as the light emitting module 1 of the first aspect.

When the light emitting module 1X as shown in FIG. 3 is incorporated in a lighting device or the like, a plurality of light emitting modules 1X may be arranged adjacent to each other along the longitudinal direction of the substrate 10. For this reason, the sealing member 40 may be formed up to both end edges in the longitudinal direction of the substrate 10 so that light is not interrupted between two adjacent light emitting modules 1X.

In this case, the material of the sealing member 40 is linearly applied by the dispenser so as to cover the light emitting element 20 and the wire 30, but when the material of the sealing member 40 is applied to both longitudinal edges of the substrate 10, the sealing is performed. Due to the viscosity of the material of the member 40, the wettability of the substrate 10, or the like, the material of the sealing member 40 may hang out from both edges of the substrate 10 in the longitudinal direction and stick out. As a result, the end portion of the sealing member 40 after curing in the longitudinal direction may protrude from the edge of the substrate 10.

However, when the end portion of the sealing member 40 in the longitudinal direction protrudes from the edge of the substrate 10, a plurality of light emitting modules 1X are adjacent to each other in the longitudinal direction of the substrate 10, as shown in FIG. 3B, the sealing members 40 of the respective light emitting modules 1X come into contact with each other at the joint (connecting portion) of two adjacent light emitting modules 1X, as shown in FIG. The wire 30 embedded in the sealing member 40 may be deformed and broken due to the stress of the sealing member 40 generated at this time.

In particular, when a plurality of light emitting modules 1X are slidably brought close to each other so that the plurality of light emitting modules 1X are adjacent to each other, if the end portion in the longitudinal direction of the sealing member 40 protrudes from the edge of the substrate 10, the two light emitting modules 1X are brought into contact with each other. The sealing members 40 of the respective light emitting modules 1X are pressed against each other at the joint between the two light emitting modules 1X. As a result, when the wire 30 existing at the position closest to the joint of the light emitting module 1X (that is, the position closest to the edge in the longitudinal direction of the substrate 10) is deformed and broken by the pressing of the sealing member 40. There is.

On the other hand, in the light emitting module 1 according to the present embodiment, as shown in FIGS. 1 and 2, the concave portion 11 located on the extension of the array direction of the plurality of light emitting elements 20 is provided at the end portion of the substrate 10. It is formed so that the tip of the sealing member 40 does not protrude from the recess 11. That is, the tip of the sealing member 40 formed in a straight line along the arrangement direction of the plurality of light emitting elements 20 is housed in the recess 11.

As a result, even when a plurality of light emitting modules 1 are arranged adjacent to each other along the longitudinal direction of the substrate 10 as shown in FIG. 5A, they are adjacent to each other as shown in FIG. 5B. The sealing members 40 of the respective light emitting modules 1 do not come into contact with each other at the joint between the two light emitting modules 1. Therefore, it is possible to suppress the deformation of the wire 30 due to the stress generated by the sealing members 40 of the two adjacent light emitting modules 1 pressing each other, and it is possible to prevent the wire 30 from breaking.

[Summary]
As described above, according to the light emitting module 1 of the present embodiment, the substrate 10, the plurality of light emitting elements 20 linearly arranged on the main surface of the substrate 10, and the wires 30 connected to each of the plurality of light emitting elements 20. And a sealing member 40 that seals the plurality of light emitting elements 20 and the wires 30, and at the end of the substrate 10, the recessed portion 11 located on the extension of the plurality of light emitting elements 20 in the arrangement direction is formed. Has been done. The shape of the recess 11 is a shape obtained by cutting out a part of each of the main surface and the side surface of the substrate 10, and the sealing member 40 is recessed along the arrangement direction of the plurality of light emitting elements 20 in plan view. It is formed in a straight line up to the position of 11, and the tip portion is formed so as not to protrude from the recess 11.

Thereby, even when a plurality of light emitting modules 1 are arranged adjacent to each other, the sealing members 40 of the two adjacent light emitting modules 1 do not contact each other, so that the wire 30 sealed by the sealing member 40 is The deformation of the sealing member 40 due to the stress can be suppressed.

Further, in the present embodiment, the plan view shape of substrate 10 is an elongated rectangle, and recess 11 is formed on at least one of the two opposing short sides of substrate 10.

Accordingly, even if the plurality of light emitting modules 1 are arranged adjacent to each other along the longitudinal direction of the substrate 10, the sealing members 40 do not contact each other, and thus the wire 30 can be prevented from being deformed by the stress of the sealing member 40. ..

In addition, in the present embodiment, the recess 11 is formed on each of two opposing short sides of the substrate 10, and the sealing member 40 is formed from one of the two short sides of the substrate 10 to the other. There is. Thereby, even if another light emitting module 1 is arranged adjacent to both sides of the light emitting module 1 in the longitudinal direction of the substrate 10, the wire 30 can be prevented from being deformed by the stress of the sealing member 40.

Moreover, in the present embodiment, the recess 11 penetrates in the thickness direction of the substrate 10.

As a result, the recess 11 can be easily formed in the substrate 10.

In addition, in the present embodiment, the sealing member 40 includes a wavelength conversion material that converts the wavelength of the light emitted by the light emitting element 20.

Thereby, the wavelength of the light emitted from the light emitting element 20 can be converted into a desired wavelength, and thus the light emitted from the sealing member 40 can be a light of a desired color. In addition, in the present embodiment, white light is emitted from the sealing member 40.

(Embodiment 2)
Next, the illumination device 100 according to the second embodiment will be described with reference to FIG. FIG. 6 is an external perspective view of lighting device 100 according to the second embodiment.

As shown in FIG. 6, the lighting device 100 is, for example, a ceiling-mounted type base light, and is fixed to the fixture body 110, and a fixture body 110 that is attached and fixed to a ceiling in a room by a hanging bolt or the like. And a light source unit 120.

The instrument main body 110 is made of sheet metal, and is formed into a long and flat box shape by bending a metal plate. A rectangular opening 111 is provided on the lower surface of the instrument body 110.

The light source unit 120 is detachably attached to the opening 111 of the instrument body 110. The light source unit 120 is turned on by a power supply device (not shown) housed in the instrument body 110. The power supply device has a power supply circuit that generates electric power for causing the light source unit 120 to emit light, and supplies the generated electric power to the light source unit 120. The power supply device is arranged inside the instrument body 110, for example.

The light source unit 120 includes a plurality of light emitting modules 1 and a long transparent cover 121 that covers the plurality of light emitting modules 1. The plurality of light emitting modules 1 are arranged adjacent to each other along the longitudinal direction of the sealing member 40 (the longitudinal direction of the substrate 10). Specifically, the short sides of the substrates 10 of two adjacent light emitting modules 1 are arranged so as to face each other. Although four light emitting modules 1 are used in the present embodiment, the number of light emitting modules 1 is not limited to four.

(Modification)
Although the light emitting module and the lighting device according to the present invention have been described above based on the embodiments, the present invention is not limited to the above embodiments.

For example, in Embodiments 1 and 2 above, the recess 11 is a through-hole penetrating in the thickness direction of the substrate 10, but the present invention is not limited to this. As shown in FIG. In the above, the stepped portion may be a stepped portion in which the thickness of a part of the substrate 10 is reduced. By thus forming the recess 11A in a stepped shape, it is possible to prevent the sealing member 40 from reaching the back surface of the substrate 10.

In this case, the step surface of the recess 11A may be inclined with respect to the main surface of the substrate 10, as shown in FIG. Specifically, the step surface of the concave portion 11A may be inclined so as to be an uphill slope toward the short side of the substrate 10 (outward). As a result, even if the material of the sealing member 40 drips into the recess 11A, the sealing member 40 can be prevented from protruding from the recess 11.

Further, although the light emitting elements 20 are arranged in one row in the first and second embodiments, they may be arranged in a plurality of rows. In this case, a plurality of sealing members 40 may be formed for each row of the light emitting elements 20, and a plurality of recesses 11 may be formed corresponding to the number of the sealing members 40.

Further, in the above-described first and second embodiments, the light emitting module 1 is configured to emit white light by the blue LED chip and the yellow phosphor, but it is not limited to this. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used, and the resin may be combined with a blue LED chip to emit white light.

In the first and second embodiments, the LED chip may be an LED chip that emits a color other than blue. For example, in the case of using an ultraviolet LED chip that emits ultraviolet light having a shorter wavelength than that of a blue LED chip, a combination of phosphors of respective colors that are excited mainly by ultraviolet light and emit light in three primary colors (red, green, blue) is used. Can be used.

Further, in the above-described first and second embodiments, the phosphor is used as the wavelength conversion material, but it is not limited to this. For example, as the wavelength conversion material, a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light, such as a semiconductor, a metal complex, an organic dye, or a pigment, can be used.

In addition, in the above-described first and second embodiments, the light emitting module 1 may have a configuration capable of color matching.

Further, in the second embodiment, the example in which the light emitting module 1 is applied to the base light has been described, but the present invention is not limited to this. For example, the light emitting module 1 may be applied to a long lighting device such as a straight tube lamp, or may be applied to a lighting device such as a downlight, a spotlight, or a light bulb shaped lamp. Furthermore, the light emitting module 1 can also be used for devices other than lighting applications.

In addition, forms obtained by making various modifications to those skilled in the art by those skilled in the art, and forms realized by arbitrarily combining the constituent elements and functions in the embodiments without departing from the spirit of the present invention Also included in the present invention.

DESCRIPTION OF SYMBOLS 1 Light emitting module 10 Substrate 11, 11A Recess 20 Light emitting element 30 Wire 40 Sealing member 100 Lighting device

Claims (5)

A lighting device comprising a plurality of light emitting modules,
Each of the plurality of light emitting modules,
Board,
A plurality of light emitting elements linearly arranged on the main surface of the substrate,
A wire connected to each of the plurality of light emitting elements,
A sealing member that seals the plurality of light emitting elements and the wires,
In an end portion of the substrate, a recessed portion located on an extension of the array direction of the plurality of light emitting elements is formed,
The shape of the recess is a shape obtained by cutting out a part of each of the main surface and the side surface of the substrate,
In plan view, the sealing member, the plurality of which in the arrangement direction of the light emitting element is formed in a straight line to the position of the recess, and does not protrude from the recess together with the tip has entered into the recess is formed so as to,
The plurality of light emitting modules are arranged adjacent to each other along the longitudinal direction of the sealing member,
Lighting equipment . The plan view shape of the substrate is a long rectangular shape,
The lighting device according to claim 1, wherein the recess is formed on at least one of two opposing short sides of the substrate. The recess is formed on each of two opposing short sides of the substrate,
The lighting device according to claim 2, wherein the sealing member is formed from one of the two short sides to the other. The illumination device according to claim 1, wherein the recess penetrates in a thickness direction of the substrate. The illumination device according to claim 1, wherein the sealing member includes a wavelength conversion material that converts a wavelength of light emitted by the light emitting element.

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