JP4808550B2 - Light emitting diode light source device, lighting device, display device, and traffic signal device - Google Patents

Description

  The present invention relates to a light-emitting diode light source device in which a light-emitting diode is mounted on a substrate, an illumination device having the light-emitting diode light source device as a light source, a display device, and a traffic signal device.

  A light emitting diode is a semiconductor light source that converts electrical energy into light energy. When a light emitting diode is used in a lighting device, a display device, a traffic light, etc., since one light emitting diode is a small light emitting light source, the amount of light per one is small, and thus a plurality of light emitting diodes must be assembled. Secure the amount of light.

  However, there is a problem that the size of the light source device increases as the number of light emitting diodes increases, and therefore, a device has been devised to increase the amount of light extracted from one light emitting diode as much as possible. Since light-emitting diode chips are generally manufactured by laminating a light-emitting layer on a transparent substrate such as a sapphire substrate, light-emitting diode chips emit light not only from the entire surface of the light-emitting diode chip but also from the back and side surfaces. Is emitted. For this reason, in general, a substrate or package on which a light emitting diode chip is mounted has been provided with a reflective surface for taking out the light in the lateral direction from the side surface of the light emitting diode chip to the front of the light source.

For example, FIG. 1 is a cross-sectional view showing a light-emitting diode light source device disclosed in Patent Document 1. In FIG. 1, reference numeral 1 denotes a glass epoxy substrate, 2 denotes a light emitting diode chip mounted on a concave portion of the substrate 1, and is electrically wired to a circuit pattern 3 on the substrate 1 by a gold wire 4. It is sealed by. Further, the substrate 1 is electrically connected to the mother board 6. A lens member 7 is formed on the upper part.
In the light source device configured as described above, since the light emitted from the side surface of the light emitting diode chip 2 is reflected forward and taken out from the inner wall of the concave portion of the glass epoxy substrate 1, the width of the concave portion cross section becomes closer to the front. A reflecting surface 8 that is inclined outward is formed so as to spread. In this light-emitting diode light source device, light emitted from the side surface of the light-emitting diode chip 2 is reflected by the concave reflecting surface 8 and extracted to the outside, so that the light from the light-emitting diode chip 2 can be efficiently extracted to the front side of the device. Has the advantage of being able to

  Further, the light emitting diode has a feature that heat is always generated when electric energy is converted into light energy. The heat generated from the light emitting diode is small if there is only one light emitting diode, but as the number of light emitting diodes to be mounted increases, the heat generated increases, and the heat generated in the vicinity of the light emitting diodes concentrates on the substrate surface. There is a case where it is impossible to dissipate the generated heat only by heat radiation from. At this time, since the light emitting diode is a semiconductor, the life characteristics of the light emitting diode are deteriorated due to the influence of the generated heat, and the light emission efficiency is lowered, so that it is difficult to secure the amount of light required for the light emitting device. For this reason, in general, a heat sink made of a material with good thermal conductivity is attached to the back side of the light emitting surface of a light emitting diode module on which a plurality of light emitting diodes are mounted, to achieve uniform heat distribution and to increase heat dissipation by increasing the area in contact with air. It has been provided with a structure that enhances the effect.

For example, FIG. 2 is a front view of a light-emitting diode light source device disclosed in Patent Document 2. In FIG. 2, reference numeral 11 is a metal substrate, 12 is a heat sink, 13 is a light emitting diode, 14 is a resin, and 15 is a convex portion. In this prior art, the resin 14 for sealing the light emitting diode 13 mounted on the substrate 11 is formed in a convex shape up to the back surface of the substrate 11 to form a convex portion 15, and is fitted with the concave portion formed in the heat sink 12. Connected in a state. In the light-emitting diode light source device configured as described above, the heat generated from the light-emitting diode 13 can increase the area in contact with the heat sink 12 by the convex portions 15 formed on the substrate 11 and the back surface of the substrate. The heat transmitted to the heat sink 12 can be radiated into the air.
JP 2002-324917 A JP 2002-33011 A

  However, in the prior art disclosed in Patent Document 1 described above, white that has a higher reflectance than other color resins as the reflective surface material of the recess provided to take out the light emitted from the light emitting diode to the outside. However, there is a problem that the white resin is oxidized and colored during heating in the mounting process of the light emitting diode, and the reflectance is lowered. Further, when a blue light emitting diode is used as the light emitting diode, there is a problem that the resin of the reflective surface material is deteriorated and colored by the blue light emitted from the light emitting diode, and the reflection performance is lowered.

  In the prior art disclosed in Patent Document 1 described above, since the heat sink having the heat radiation fin is attached to the back side of the light emitting surface of the light emitting diode, the heat radiation fin is attached in a direction to attach the light emitting diode light source device to the ceiling surface or the like. For this reason, there is a problem that it is difficult to attach to the instrument housing, and that the heat dissipation effect due to heat conduction to the instrument housing cannot be expected due to the reduced installation area to the instrument housing. In addition, since the heat dissipating fins must be attached so as to be in contact with the outside air, there is a problem that the heat dissipating fins cannot be applied to a direct-mounted lighting fixture that is directly attached to the ceiling surface.

  The present invention has been made in view of the above circumstances, and it is possible to improve the light extraction efficiency from the light emitting diode by providing a reflective surface having a high reflectance in the recess in which the light emitting diode is mounted, and to reduce the reflectance of the reflective surface member due to heat or light. At the same time, it has a heat sink that dissipates the heat generated from the light-emitting diodes, while increasing the heat dissipation effect by increasing the contact area to the instrument housing. It is an object of the present invention to provide a highly reliable light-emitting diode light source device that can improve the mountability of the lighting device, a lighting device using the same, a display device, and a traffic signal device.

In order to achieve the above object, the present invention is provided with an insulating substrate having an insertion hole drilled and having a circuit pattern formed on one surface thereof, and a protrusion that fits into the insertion hole of the insulating substrate. A metal plate having a reflective surface on a side surface; a light-emitting diode chip electrically connected to a circuit pattern formed on an insulating substrate ; and a light-transmitting sealing material for sealing the light-emitting diode chip. And
The protruding portion has an inverted V-shaped cross section, and the inclined side surface of the protruding portion forms a reflecting surface that reflects light emitted from the light emitting diode chip, and the reflecting surface is formed from a wiring surface of the insulating substrate. It is set to be inclined from a lower position to provide an LED apparatus according to claim Rukoto.

  In the light-emitting diode light source device of the present invention, the metal plate may have a heat radiating surface at the end of the protruding portion.

In the light-emitting diode light source device of the present invention, the protruding portion may be fitted into the insertion hole, and the light-emitting diode chip may be disposed on the metal plate directly or via the insulating substrate .

  In the light-emitting diode light source device of the present invention, a configuration may be adopted in which a reflective film made of a metal material having a higher reflectance than the metal plate is laminated on at least a side surface of the protruding portion of the metal plate.

  In the light-emitting diode light source device of the present invention, it is preferable that the sealing material is made of a transparent resin.

  In the light emitting diode light source device, the transparent resin may include a pigment or a phosphor that is excited by light emission of the light emitting diode chip and emits light having a wavelength different from that of the excitation light.

The present invention also relates to a method of manufacturing the above-described light-emitting diode light source device, the step of forming an insulating substrate by forming a circuit pattern on one surface of an insulating substrate body having an insertion hole, and a light-emitting diode chip. A step of electrically connecting to the circuit pattern, a step of forming a metal plate having a projecting portion having an inverted V-shaped cross section and an inclined side surface being a reflecting surface, a projecting portion of the metal plate in the insertion hole of the insulating substrate And a step of sealing the light emitting diode chip with a light-transmitting sealing material, and the inclined side surface of the protruding portion forms a reflection surface that reflects light emitted from the light emitting diode chip. And providing a method of manufacturing a light-emitting diode light source device, wherein the reflecting surface is set to be inclined from a position lower than a wiring surface of the insulating substrate. The present invention also provides an illuminating device, a display device or a traffic signal having the light emitting diode light source device according to the present invention as a light source.

In the light emitting diode light source device of the present invention, the thermal conductivity in the vertical direction of the insulating substrate is enhanced by fitting and joining the protruding portion of the metal plate to the insertion hole of the insulating substrate on which the light emitting diode chip is mounted, The heat generated from the light emitting diode chip can be quickly equalized over the entire board, and the contact area of the metal plate to the instrument housing can be increased to efficiently transfer the heat in the board to the instrument housing side. The heat can be radiated well, and the attachment to the appliance housing can be improved.
The light-emitting diode light source device of the present invention uses a metal plate that is provided with a protrusion that fits into the insertion hole of the insulating substrate and has a reflective surface formed on the side surface of the protrusion. The same member can be provided with the take-out structure, and the number of members necessary for manufacturing the apparatus can be reduced, the manufacturing process can be simplified, and the manufacturing cost can be reduced.
In addition, since the lighting device, display device and traffic signal of the present invention use the light-emitting diode light source device of the present invention as a light source, it is excellent in attachment to an instrument housing, and the manufacturing process of each of these devices is simplified. Manufacturing cost can be reduced. In addition, since the heat dissipation is good, an increase in the substrate temperature during light emission can be suppressed, and the life of the light emitting diode can be extended and the light emission efficiency can be increased.

Hereinafter, embodiments of a light-emitting diode light source device of the present invention will be described with reference to the drawings.
3 and 4 are views showing a first embodiment of the light-emitting diode light source device of the present invention, FIG. 3 is a perspective view showing an assembled state of the light-emitting diode light source device 20A of the present embodiment, and FIG. It is sectional drawing of the light emitting diode light source device 20A of a form.

  The light-emitting diode light source device 20A of the present embodiment is provided with an insulating substrate 21 in which a plurality of elongated insertion holes 22 are formed, and a protrusion 27 that fits into the insertion holes 22 of the insulating substrate 21. A metal plate 26 having a reflecting surface 28 inclined on the side surface of the protruding portion, a number of light emitting diode chips 24 mounted on the circuit pattern 23 of the insulating substrate 21, and a transparent seal for sealing the light emitting diode chips 24 The resin 29 is provided.

  The insulating substrate 21 includes an insulating substrate body such as a glass epoxy substrate, a hollow substrate, and a ceramic substrate, and a circuit pattern 23 made of a conductive material provided on one surface of the body. 3 and 4, the insulating substrate 21 has a rectangular plate shape, and two elongated insertion holes 22 are formed with the center interposed therebetween. The shape and the number of the holes 22 are not limited to this example, and can be appropriately set according to the use of the light-emitting diode light source device 20A (for example, a lighting device, a display device, and a traffic signal device).

  In addition, the circuit pattern 23 of the insulating substrate 21 is formed by a method of bonding a copper foil processed into a desired pattern to the insulating substrate body, a plating method, a vacuum deposition method, a method of printing a copper paste or a silver paste, and heat curing. Can be formed. The shape and formation region of the circuit pattern 23 can also be set as appropriate according to the application of the light emitting diode light source device 20A.

  The light-emitting diode chip 24 mounted on the insulating substrate 21 is appropriately selected from various light-emitting diode chips that emit red to purple visible light or near-ultraviolet light according to the purpose of use described above. It can be selected and used. In this embodiment, a light-emitting diode chip 24 of a type in which two electrodes are provided on one surface side is used, and the surface opposite to the surface on which this electrode is formed is fixed on the circuit pattern 23, and each electrode and circuit are connected. The pattern 23 is electrically connected by wire bonding using a gold wire 25.

  The material of the metal plate 26 is not particularly limited, but it is preferable to use a metal having high thermal conductivity such as aluminum, an aluminum alloy, or copper. In the present embodiment, the protrusion 27 of the metal plate 26 has an inverted V-shaped cross section, and the base of the protrusion 27 is fitted into the insertion hole 22. The inclined side surface of the protruding portion 27 is a reflecting surface 28 so that light emitted from the light emitting diode chip 24 is reflected and can be efficiently extracted outside the apparatus. The reflecting surface 28 is set so as to be inclined from a position lower than the wiring surface of the insulating substrate 21, and the light emitted from the light emitting diode chip 24 in the lateral direction is also reflected by the reflecting surface 28 of the projecting portion 27 and forward of the substrate. To be taken out.

  In the present embodiment, the protruding height of the protruding portion 27 is such that the tip of the protruding portion 27 is higher than the light emitting diode chip 24 when the metal plate 26 and the insulating substrate 21 are combined as shown in FIG. Is set to The space between the line connecting the tips of the plurality of protrusions 27 and the upper surface of the insulating substrate 21 is filled with a transparent resin such as a transparent epoxy resin and cured to form the light emitting diode chip 24 and the circuit pattern 23. A sealing resin (sealing material) 29 that seals in a lump is provided.

  The sealing resin 29 may be formed of only a transparent resin, or mixed with a pigment or phosphor that emits light having a wavelength different from that of the excitation light by being excited by light emission of the light emitting diode chip in the transparent resin. You may comprise the light source device of the light emission color different from the light emission color of a diode chip (For example, the white light source device which combined the blue light emitting diode chip and the yellow light emission fluorescent substance).

In the light emitting diode light source device 20A of the present embodiment, the protruding portion 27 of the metal plate 26 is fitted and joined to the insertion hole 22 of the insulating substrate 21 on which the light emitting diode chip 24 is mounted. The heat conductivity of the light emitting diode chip 24 can be increased, the heat generated from the light emitting diode chip 24 can be quickly equalized over the entire substrate, and the contact area of the metal plate 26 to the instrument housing can be increased, The heat in the substrate can be efficiently dissipated to the appliance housing side, and the attachment to the appliance housing can be improved.
In addition, the light emitting diode light source device 20A uses the metal plate 26 provided with the protruding portion 27 that fits into the insertion hole 22 of the insulating substrate 21, and the reflecting surface 28 is formed on the side surface of the protruding portion. The structure and the light reflection extraction structure can be provided in the same member, and the number of members required for manufacturing the apparatus can be reduced, so that the manufacturing process is simplified and the manufacturing cost can be reduced.
Further, the light emitted from the light emitting diode chip 24 is reflected to the front of the apparatus by the reflection surface 28 having a high reflectivity provided on the side surface of the protruding portion of the metal plate 26, so that the light emitted from the light emitting diode chip 24 is transmitted to the outside. And can be taken out efficiently. Further, it is possible to prevent the reflection performance of the reflection surface 28 from being deteriorated during heating in the mounting process of the light emitting diode chip 24, and the reflection performance from being deteriorated by irradiating the reflection surface 28 with the light of the light emitting diode chip 24. it can.

  The light-emitting diode light source device 20A of the present embodiment is preferably used as a light source for lighting devices, display devices, and traffic signals. By using the light-emitting diode light source device 20A of the present embodiment as a light source, it can be easily attached to a fixture housing, the manufacturing process of each device can be simplified, and the manufacturing cost can be reduced. In addition, since the light emitting diode light source device 20A of the present embodiment has good heat dissipation, the lighting device, display device, and traffic signal device using the light emitting diode light source device 20A can suppress an increase in the substrate temperature during light emission. The life of the light emitting diode can be extended and the luminous efficiency can be increased.

FIG. 5 is a view showing a second embodiment of the light-emitting diode light source device of the present invention. The light-emitting diode light source device 20B of the present embodiment includes substantially the same components as those of the first embodiment described above, and the same components are denoted by the same reference numerals.
In the light-emitting diode light source device 20B of this embodiment, instead of the metal plate 26 used in the first embodiment, the protrusion 32 has a trapezoidal cross-sectional shape and is provided with a flat front heat radiating surface 31 at the tip. The structure using the plate 30 is used.

  As the material of the metal plate 30, it is preferable to use a metal having high thermal conductivity such as aluminum, an aluminum alloy, or copper, as in the case of the metal plate 26 used in the first embodiment. The inclined side surface of the protrusion 32 is formed as a reflection surface 28 so that light emitted from the light emitting diode chip 24 is reflected and can be efficiently taken out of the apparatus. The reflecting surface 28 is set so as to be inclined from a position lower than the wiring surface of the insulating substrate 21, and the light emitted from the light emitting diode chip 24 in the lateral direction is also reflected by the reflecting surface 28 of the projecting portion 27 and forward of the substrate. To be taken out.

  The light emitting diode light source device 20B of this embodiment has the same effect as the light emitting diode light source device 20A of the first embodiment described above, and further has a front heat radiating surface 31 provided at the tip of the protruding portion 32 of the metal plate 30. As a result, the heat generated from the light emitting diode chip 24 is transmitted to the metal plate 30 through the insulating substrate 21 and moves to the side of the instrument housing that is in contact with the back surface of the metal plate 31 and radiates heat from the front heat radiating surface 31. Since the temperature of the metal plate 30 can be lowered, the heat dissipation performance of the light source device can be further enhanced.

  FIG. 6 is a diagram showing a third embodiment of the light-emitting diode light source device of the present invention. The light-emitting diode light source device 20 </ b> C according to the present embodiment includes a metal plate 30 having a plurality of trapezoidal projections 32 each having a front heat radiating surface 31 provided at the tip, and between the projections 32 of the metal plate 30. An insulating substrate 34 fitted in a groove provided on the mounting surface, a plurality of light emitting diode chips 33 mounted on the mounting surface in the vicinity of the insulating substrate 34, and each protrusion 32 of the metal plate 30. And a sealing resin 29 provided in the space therebetween.

  In this embodiment, a light emitting diode chip 33 of a type in which electrodes are formed on both main surfaces of the chip is used. Then, one main surface of the light emitting diode chip 33 is fixed to the mounting surface of the metal plate 30 by die bonding, and one electrode and the metal plate 30 are electrically connected and insulated from the other electrode. The circuit pattern 35 of the substrate 34 is electrically connected by wire bonding with the gold wire 25.

  The light emitting diode light source device 20C of the present embodiment can obtain the same effects as the light emitting diode light source device 20A of the first embodiment described above, and further, the light emitting diode chip 33 is a metal plate having a higher thermal conductivity than the insulating substrate. Since it is directly mounted on 30, the effect that the heat generated from the light emitting diode chip 33 can be efficiently radiated to the outside is obtained. Here, if a hollow substrate or a ceramic substrate having a high thermal conductivity is used as the insulating substrate, the effect of heat radiation can be further enhanced, and a highly reliable light-emitting diode light source device can be obtained.

  FIG. 7 is a diagram showing a third embodiment of the light-emitting diode light source device of the present invention. The basic configuration of the light-emitting diode light source device 20D of the present embodiment is the same as that of the light-emitting diode light source device 20B of the second embodiment shown in FIG. By the way, in 2nd Embodiment, although the aluminum plate was used as the metal plate 30, in this embodiment, the copper plate whose heat conductivity is higher than an aluminum plate is used as the metal plate 30, and as shown in FIG. The difference is that a reflective film 36 made of aluminum, which is a metal material having a higher reflectance than the metal plate 30, is provided on the reflective surface formed at the tip of the protruding portion 32 that protrudes from the front surface of the metal plate 30. The reflective film 36 is formed by evaporating aluminum on the metal plate 30. The thermal conductivity of aluminum is 236 W / (m · K), and the thermal conductivity of copper is 403 W / (m · K).

  In this embodiment, since the copper plate is used as the metal plate 30, the heat generated in the light-emitting diode chip 24 can be radiated to the outside more efficiently than in the case where an aluminum plate is used as the metal plate. Can be further enhanced.

  By the way, when a blue light emitting diode chip is used as the light emitting diode chip 24, copper has a low reflectance with respect to light of a blue wavelength, and therefore, the efficiency of extracting light from the light emitting diode chip 24 to the outside may be reduced. There is. In the present embodiment, the reflection film 36 made of aluminum having a higher reflectance than copper is formed on the reflection surface of the protruding portion 32, so that the reflectance can be improved even when the metal plate 30 made of copper and the blue light emitting diode chip are used. Thus, a light-emitting device with high heat dissipation and high light extraction efficiency can be realized. In this embodiment, aluminum is used as the material of the reflective film formed on the surface of the metal plate. However, the material is not limited to aluminum, and for example, silver may be used. When silver is used, it may be formed by silver plating, for example.

  The light-emitting diode light source device 20D of the present embodiment can obtain the same effects as the light-emitting diode light source device 20A of the first embodiment and the light-emitting diode light source device 20B of the second embodiment described above. Since the reflective film 36 made of a metal material having a higher reflectance than the metal plate is provided on the surface, options for the material of the metal plate 30 can be increased, and a material with high heat dissipation can be selected.

[Example]
The light emitting diode light source device 20A shown in FIGS. 3 and 4 was produced.
The metal plate 26 made of aluminum is provided with a plurality of inverted V-shaped protrusions 27 protruding forward (upward in FIG. 4), and the reflection surface 28 for reflecting light to the front of the substrate on the side surface of each protrusion 27. Formed.
A printed circuit board (insulating board 21) made of a glass epoxy board with a copper foil attached thereto was bonded to the front surface of the metal plate 26. The surface of the printed circuit board opposite to the surface provided with the circuit pattern 23 made of copper foil was bonded to the metal plate 26. In the printed circuit board, a plurality of insertion holes 22 into which the protruding portions 27 protruding from the metal plate 26 are respectively inserted are formed in parallel. Twelve light emitting diode chips 24 were mounted on the circuit pattern 23 of the printed wiring board. These light emitting diode chips 24 are thermally coupled to a printed wiring board.
The projecting height of the projecting portion 27 was set to be larger than the sum of the thickness of the printed wiring board and the thickness of the light emitting diode chip 24.
As the light emitting diode chip 24, a blue light emitting diode chip in which a gallium nitride based light emitting portion is formed on a sapphire substrate was used.
The light emitting diode chip 24 and the gold wire 25 were sealed with a sealing resin 29 made of an epoxy resin.
In this embodiment, the thickness of the metal plate 26 is 1.0 mm, the width of each protrusion 27 is 1.5 mm, the protrusion height of each protrusion 27 is 1.2 mm, and the height of the reflecting surface 28 of the protrusion is set. Set to 1.0 mm. On the other hand, the thickness of the printed circuit board was set to 0.3 mm. The light emitting diode chip 24 was set to a chip size of 350 μm square and a thickness of 80 μm.

[Comparative example]
A light emitting diode chip similar to that used in the above example was mounted in each concave portion of a printed circuit board in which a circuit pattern made of copper foil was bonded to a glass epoxy substrate having cup-shaped concave portions (12 pieces). Then, wiring with a gold wire was performed, and the recess was filled with an epoxy resin, cured, and sealed to produce a light-emitting diode light source device having a conventional structure shown in FIG.

[Performance comparison]
In the light-emitting diode light source device of the comparative example (12 mounted units), when the light-emitting diode was lit at a rated 20 mA per light-emitting diode, the substrate temperature was about 80 ° C. higher than room temperature after 30 minutes. Furthermore, when the same test was performed with the light-emitting diode light source device of the comparative example attached to the fixture case, the temperature of the substrate after lighting for 30 minutes was 70 ° C. higher than the room temperature, and the installation area on the fixture case was large. Since it is small, the heat dissipation effect by the instrument housing was small.
On the other hand, in the light emitting diode light source device of the example (12 mounted units), the temperature of the substrate after lighting for 30 minutes was 90 ° C. higher than the room temperature. When the measurement was performed, the temperature of the substrate after lighting for 30 minutes remained at 50 ° C. higher than the room temperature, and the effect of improving the heat dissipation by expanding the installation area between the light source and the instrument housing was confirmed. In addition, the attachment to the instrument housing has become very easy. This measurement was performed with a small thermocouple directly attached to the substrate surface.

  In the light-emitting diode light source device of the comparative example, the light output after 1000 hours of continuous lighting at a high temperature (95 ° C.) decreased to about 80% compared to the initial light output, whereas in the light-emitting diode light source having the structure of the present invention, 1000%. After continuous lighting for a long time, the light output remained almost unchanged compared to the initial non-temporary output, and it was confirmed that there was no deterioration of the reflection performance due to heat applied to the package or blue light emitted from the light emitting diode.

It is sectional drawing which shows an example of the conventional light emitting diode light source device. It is sectional drawing which shows the other example of the conventional light emitting diode light source device. It is a perspective view which shows 1st Embodiment of the light-emitting-diode light source device of this invention. It is sectional drawing which shows 1st Embodiment of the light emitting diode light source device of this invention. It is sectional drawing which shows 2nd Embodiment of the light-emitting-diode light source device of this invention. It is sectional drawing which shows 3rd Embodiment of the light-emitting-diode light source device of this invention. It is sectional drawing which shows 4th Embodiment of the light-emitting-diode light source device of this invention.

Explanation of symbols

20A, 20B, 20C, 20D ... light emitting diode light source device, 21, 34 ... insulating substrate, 22 ... insertion hole, 23,35 ... circuit pattern, 24,33 ... light emitting diode chip, 25 ... gold wire, 26,30 ... metal Plates 27, 32... Projection, 28... Reflecting surface, 29... Sealing resin, 31.

Claims (10)

An insulating substrate having an insertion hole formed therein and a circuit pattern formed on one surface; a metal plate provided with a protrusion that fits into the insertion hole of the insulating substrate; and a reflective surface formed on a side surface of the protrusion; a light emitting diode chip is electrically connected to the circuit pattern formed on the insulating substrate, and a sealing material having translucency to seal the light-emitting diode chips possess,
The protruding portion has an inverted V-shaped cross section, and the inclined side surface of the protruding portion forms a reflecting surface that reflects light emitted from the light emitting diode chip, and the reflecting surface is formed from a wiring surface of the insulating substrate. LED apparatus characterized that you have been set so as to be inclined from a lower position.  The light emitting diode light source device according to claim 1, further comprising a heat dissipation surface at a tip of the protruding portion of the metal plate. 3. The light emitting device according to claim 1, wherein the protrusion is fitted in the insertion hole, and the light emitting diode chip is disposed on the metal plate directly or via the insulating substrate. Diode light source device.  The light emitting diode light source device according to claim 1, wherein a reflective film made of a metal material having a higher reflectance than the metal plate is laminated on at least a side surface of the protruding portion of the metal plate.  The light emitting diode light source device according to claim 1, wherein the sealing material is made of a transparent resin.  6. The light emitting diode light source device according to claim 5, wherein the transparent resin includes a pigment or a phosphor that is excited by light emission of the light emitting diode chip and emits light having a wavelength different from that of the excitation light. 7. The method for manufacturing a light-emitting diode light source device according to claim 1, wherein a circuit pattern is formed on one surface of the insulating substrate body in which the insertion hole is formed to form an insulating substrate. A step of electrically connecting the light-emitting diode chip to the circuit pattern, a step of forming a metal plate having a projecting portion having an inverted V-shaped cross-section and a reflecting surface being a reflecting surface, an insertion hole of the insulating substrate A step of fitting the protruding portion of the metal plate to the substrate, and a step of sealing the light emitting diode chip with a light-transmitting sealing material, and the inclined side surface of the protruding portion reflects light emitted from the light emitting diode chip. A method of manufacturing a light-emitting diode light source device, wherein the reflecting surface is inclined from a position lower than a wiring surface of the insulating substrate.  An illumination device comprising the light-emitting diode light source device according to claim 1 as a light source.  A display device comprising the light-emitting diode light source device according to claim 1 as a light source.  A traffic signal device comprising the light-emitting diode light source device according to claim 1 as a light source.

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