WO2011057433A1

WO2011057433A1 - Light emitting diode lamp bar and manufacture method thereof, light emitting diode lamp tube

Info

Publication number: WO2011057433A1
Application number: PCT/CN2009/001416
Authority: WO
Inventors: 江如翔; 江旭民
Original assignee: Chiang Juhsiang
Priority date: 2009-11-16
Filing date: 2009-12-10
Publication date: 2011-05-19
Also published as: CN102062306A

Abstract

A light emitting diode lamp bar (102) includes a circuit board (110), a plurality of light emitting diodes (120), heat-conducting material (130), a heat-conducting insulating layer (140) and a heat-conducting plate (150). The circuit board (110) has the first surface (112) and the second surface (114) opposite to each other. The first surface (112) has a plurality of wafer configuring regions (115) arrayed to multiple rows, and at least one heat-dissipating through hole (116) is provided in each wafer configuring region (115). The light emitting diodes (120) are arranged at the wafer configuring regions (115) one to one. The heat-conducting material (130) is filled in the heat-dissipating through holes (116) and contacts the corresponding light emitting diode (120). The heat-conducting material (130) extending from the heat-dissipating through holes (116) in the same row's wafer configuring regions (115) is connected as a whole on the second surface (114). The heat-conducting plate (150) is pasted to the second surface (114), and the heat-conducting insulating layer (140) is configured between the heat-conducting plate (150) and the circuit board (110). The light emitting diode lamp bar (102) has good heat-dissipating effect. A manufacture method of the corresponding light emitting diode lamp bar (102) and a light emitting diode lamp tube (100) including the corresponding light emitting diode lamp bar (102) are also provided.

Description

LED light bar and manufacturing method thereof, LED light tube

The present invention relates to a light source device, and more particularly to an LED light bar and a method of fabricating the same, and an LED lamp using the LED light bar. Background technique

Light-emitting diodes (LEDs) have the advantages of high efficiency, long life, low power consumption, and are not easily damaged. Therefore, the application of light-emitting diodes is becoming more and more popular, such as large-scale display electronic billboards, traffic lights, and automobile directions. Lamps and lighting applications.

The conventional light-emitting diode light source device usually directly mounts the light-emitting diode on a circuit board (PCB) and packaged into a product. However, since the LED generates a large amount of thermal energy during operation, especially a high-power LED, the LED light source device must have a good heat dissipation function to prevent the thermal energy generated by the LED from accumulating in the light source device and reducing its use. life.

It can be seen that the above-mentioned existing LED light source device obviously has inconveniences and defects in product structure, manufacturing method and use, and needs to be further improved. In order to solve the above problems, the relevant manufacturers do not bother to find a solution, but the design that has not been applied for a long time has been developed, and the general products and methods have no suitable structure and methods to solve the above problems. This is obviously an issue that the relevant industry is anxious to solve. Therefore, how to create a new LED light bar, its manufacturing method, and LED tube is one of the most important research topics, and it has become an urgent goal for the industry. Summary of the invention

It is an object of the present invention to provide an LED light bar with good heat dissipation. Another object of the present invention is to provide an LED lamp which uses a light-emitting diode strip having a good heat dissipation effect and thus has a long service life.

It is still another object of the present invention to provide a method of fabricating a light-emitting diode strip to produce an LED strip having a good heat dissipation effect.

The object of the present invention and solving the technical problems thereof are achieved by the following technical solutions. An LED light bar according to the present invention includes: a circuit board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of rows arranged in a plurality of rows a chip arrangement area, and the circuit board has at least one heat dissipation through hole in each of the wafer arrangement areas, penetrates the first surface and the second surface; and a plurality of light emitting diodes are disposed one-to-one in the wafer arrangement area And electrically connected to the circuit board; a heat conductive material filled in the heat dissipation through hole to contact the corresponding light emitting diode and extending onto the second surface, wherein the wafer arrangement area from the same row The heat conductive material extending from the heat dissipation through hole is connected to the second surface Integral; a heat conducting plate attached to the second surface of the circuit board; and a thermally conductive insulating layer disposed between the heat conducting plate and the circuit board.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. In the foregoing LED light bar, wherein the heat conducting plate is an aluminum plate.

The foregoing LED light bar, wherein the heat conductive material comprises solder, copper glue or silver glue. In the foregoing LED light bar, the circuit board further has a plurality of electrical connection holes in each of the wafer arrangement regions, and each of the light emitting diodes comprises: a body covering the heat dissipation through holes; and a plurality of pins, The main body extends from the main body and is electrically connected to the circuit board.

The object of the present invention and solving the technical problems thereof are also achieved by the following technical solutions. An LED tube according to the present invention includes: a lamp housing having an accommodating space; an LED strip disposed in the lamp housing, and comprising: a circuit board having a first surface And a second surface opposite to the first surface, wherein the first surface has a plurality of wafer arrangement regions arranged in a plurality of rows, and the circuit board has at least one heat dissipation through hole in each of the wafer arrangement regions, a first surface and the second surface; a plurality of light emitting diodes are disposed one-to-one in the wafer arrangement area and electrically connected to the circuit board; a heat conductive material is filled in the heat dissipation through hole to contact Corresponding light emitting diodes extend to the second surface, wherein the heat conductive material extending from the heat dissipation through holes of the wafer arrangement area of the same row is integrally connected to the second surface; Bonding to the second surface of the circuit board; and a thermally conductive insulating layer disposed between the heat conducting plate and the circuit board.

The object of the present invention and solving the technical problems thereof can be further achieved by the following technical measures. In the foregoing LED lamp tube, the heat conducting plate is an aluminum plate.

The aforementioned LED tube, wherein the heat conductive material comprises solder, copper glue or silver glue. In the foregoing LED lamp tube, the circuit board further has a plurality of electrical connection holes in each of the wafer arrangement regions, and each of the light emitting diodes comprises: a body covering the heat dissipation through hole; and a plurality of pins, The main body extends from the main body and is electrically connected to the circuit board.

The object of the present invention and solving the technical problems thereof are additionally achieved by the following technical solutions. A method for fabricating an LED light strip according to the present invention includes the steps of: providing a circuit board having a first surface and a second surface opposite the first surface, wherein the first surface Having a plurality of wafer arrangement regions arranged in a plurality of rows; forming at least one heat dissipation through hole in each of the wafer arrangement regions of the circuit board to penetrate the first surface and the second surface; filling a heat conductive material in the Extending into the second surface of the heat dissipation through hole, so that the heat conductive material extending from the heat dissipation through hole of the wafer arrangement area of the same row is integrally connected to the second surface; One of the light emitting diodes is disposed in the wafer arrangement area to be electrically connected to the circuit board, and is in contact with the corresponding heat conductive material in the heat dissipation through hole; forming a heat conduction on the second surface of the circuit board An insulating layer; and a heat conducting plate is attached to the second surface of the circuit board by the thermally conductive insulating layer. The present invention has significant advantages and advantageous effects over the prior art. According to the above technical solution, the LED light bar of the present invention, the manufacturing method thereof, and the LED lamp tube have at least the following advantages and advantages: The present invention is to form a heat dissipation through hole through the circuit board on the circuit board on which the light emitting diode is mounted, and The heat conductive material is filled in the heat dissipation through hole so as to extend from the heat dissipation through hole to the back surface of the circuit board. Moreover, the heat conducting plate is adhered to the back surface of the circuit board by the heat conducting insulating layer, so that the heat energy generated when the light emitting diode is operated can be transmitted to the heat conducting plate through the heat conducting material and the heat conducting insulating layer to dissipate, thereby improving the light emitting diode light strip. Cooling effect.

In summary, the LED light bar of the present invention has a good heat dissipation effect. The invention has significant technical advancement and has obvious positive effects, and is a novel, progressive and practical new design.

The above description is only an overview of the technical solutions of the present invention, and the technical means of the present invention can be more clearly understood, and can be implemented in accordance with the contents of the specification, and the above and other objects, features and advantages of the present invention can be more clearly understood. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, preferred embodiments will be described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

1 is a perspective view of a light-emitting diode tube according to an embodiment of the present invention.

2 is an enlarged schematic view of the LED light bar shown in FIG. 1.

3 is a cross-sectional view of the LED strip of FIG. 2 taken along line I I - I I .

100: LED tube 102 LED strip

104: Lamp housing 105 accommodation space

110: circuit board 112 first surface

114: second surface 115 wafer configuration area

116: heat dissipation through hole 117 electrical connection hole

120: LED 122 main body

124: Pin 130 Thermally conductive material

140: Thermally conductive insulation 150 Thermally conductive plate The best way to achieve the invention

In order to further explain the technical means and efficacy of the present invention for achieving the intended purpose of the invention, the LED light bar and the manufacturing method thereof and the LED light tube according to the present invention are specifically described below with reference to the accompanying drawings and preferred embodiments. The embodiments, structures, manufacturing methods, procedures, features, and effects are described in detail below.

The foregoing and other objects, features, and advantages of the invention will be apparent from Through the description of the specific embodiment, when

It is understood that the drawings are provided for the purpose of illustration and description only and are not intended to Limitation.

1 is a perspective view of an LED tube according to an embodiment of the present invention, FIG. 2 is an enlarged schematic view of the LED strip of FIG. 1, and FIG. 3 is an LED strip of FIG. 2 along line II-II. Sectional view. Referring to FIG. 1, the LED tube 100 includes an LED strip 102 and a lamp housing 104. The LED strip 102 is disposed in the housing space 105 of the lamp housing 104.

Referring to FIG. 1 and FIG. 3, the LED light bar 102 of the present embodiment includes a circuit board 110, a plurality of light emitting diodes 120, a heat conductive material 130, a thermal conductive insulating layer 140, and a heat conducting plate 150. The circuit board 110 has a first surface 112 and a second surface 114 opposite to the first surface 112, and the first surface 112 has a plurality of wafer arrangement regions 115 for arranging the LEDs 120. In this embodiment, the chip arrangement regions 115 are arranged in two rows on the first surface 112 of the circuit board 110. However, the present invention is not limited thereto, that is, the chip configuration region 115 can be implemented according to actual needs. And arranged in any number of rows.

In the above, the circuit board 110 can have one or more heat dissipation through holes 116 in each of the wafer arrangement areas 115. The heat dissipation through hole 116 penetrates the first surface 112 and the second surface 114. It should be noted that the number of the heat dissipation through holes 116 in each of the wafer arrangement areas 115 may be the same or different. In the present embodiment, each of the wafer arrangement regions 115 has a heat dissipation through hole 116, but the present invention is not limited thereto.

On the other hand, the light emitting diodes 120 are disposed one-to-one in the wafer arrangement area 115 and are electrically connected to the circuit board 110. That is, a light emitting diode 120 is disposed in a wafer configuration area 115. In the present embodiment, since the wafer arrangement regions 115 of the circuit board 110 are arranged in two rows, the light emitting diodes 120 disposed thereon are also arranged in two rows. In addition, the circuit board 110 further has a plurality of electrical connection holes 117 in each of the wafer arrangement areas 115, and each of the light emitting diodes 120 includes a main body 122 and a plurality of pins 124 extending from the main body 122. In each of the wafer arrangement regions 115, the body 122 of the LED 120 covers the heat dissipation via 116, and the pins 124 are inserted into the corresponding electrical connection holes 117 to be electrically connected to the circuit board 110.

It is worth mentioning that the LED 120 covering the thermal via 116 conducts thermal energy through contact of the body 122 with the thermally conductive material 130. In detail, the thermally conductive material 130 is filled in the heat dissipation through holes 116 of the respective wafer arrangement regions 115 and extends onto the second surface 114 of the circuit board 110. Moreover, the thermally conductive material 130 extending from the heat dissipation through holes 116 of the wafer arrangement area 115 of the same row is integrally connected to the second surface 114. In this embodiment, the heat conductive material 130 is, for example, solder, but not limited thereto, and the heat conductive material 150 may be, for example, copper glue, silver glue or other suitable heat conductive material.

More specifically, the heat conducting plate 150 is attached to the second surface 114 of the circuit board 110. In detail, the heat conducting plate 150 is bonded to the second surface 114 of the circuit board 110 by the heat conductive insulating layer 140. In other words, the thermally conductive insulating layer 140 is disposed between the heat conducting plate 150 and the circuit board 110. In this implementation For example, the thermally conductive insulating layer 140 is, for example, a thermally conductive insulating adhesive material that can bond the heat conducting plate 150 to the circuit board 110 to prevent short circuiting of the circuit (not shown) on the circuit board 110 due to electrical contact with the heat conducting plate 150. In addition, the heat conducting plate 150 is generally a metal plate with better thermal conductivity, such as an aluminum plate, but the invention is not limited thereto.

As described above, the thermally conductive material 130 filled in the heat dissipation through-hole 116 and extending to the second surface 114 of the circuit board 110 forms a heat conduction path with the thermally conductive insulating layer 140 and the heat conducting plate 150. Moreover, since the heat conductive material 130 extending from the heat dissipation through holes 116 of the wafer arrangement area 115 of the same row is integrally connected to the second surface 114, the heat conduction area of the heat conductive material 130 can be greatly increased, and the light emitting diode is facilitated in time. The thermal energy generated during the operation of 120 is conducted to the thermally conductive insulating layer 140 and the heat conducting plate 150 to dissipate to the outside.

The method of fabricating the LED strip 102 will be specifically described below with reference to Figs. 2 and 3. First, a circuit board 110 is provided having a first surface 112 and a second surface 114 opposite the first surface 112. The first surface 112 has a plurality of wafer arrangement regions 115 arranged in a plurality of rows. In the embodiment, the wafer arrangement regions 115 are arranged in two rows, but the invention is not limited thereto.

Next, one or more heat dissipation through holes 116 are formed in each of the wafer arrangement regions 115 to penetrate the first surface 112 and the second surface 114 of the circuit board 110. In the present embodiment, each of the wafer arrangement regions 115 is formed with a heat dissipation through hole 116. In detail, the heat dissipation through hole 116 can be produced by, for example, mechanical drilling or laser drilling.

Further, a heat conductive material 1 30 is filled in the heat dissipation through holes 116 and extended to the second surface 114 of the circuit board 110. The heat conductive material 130 extending from the heat dissipation through holes 116 of the same row of wafer arrangement regions 115 is integrally connected to the second surface 114. In this embodiment, for example, after the heat conductive material 130 is first filled into the heat dissipation through holes 116, the heat conductive material 130 is coated on a portion of the second surface 114 of the circuit board 110 to connect the heat dissipation of the same row of wafer arrangement regions 115. The heat conductive material 130 in the through hole 116, but the invention is not limited thereto.

Thereafter, a plurality of light emitting diodes 120 are disposed in a one-to-one arrangement in the wafer arrangement regions 115 to be electrically connected to the circuit board 110 and in contact with the heat conductive material 130 in the corresponding heat dissipation through holes 116. In this embodiment, the method of disposing the LED 120 on the circuit board 110 includes covering the main body 122 of the LED 120 with the heat dissipation through hole 116 in the wafer arrangement area 115 to contact the heat conductive material 130, and The pin 124 of the LED 120 is inserted into the electrical connection hole 117 of the circuit board 110 to be electrically connected to the circuit board 110.

Then, a thermally conductive insulating layer 140 is formed on the second surface 114 of the circuit board 110, and the heat conducting plate 150 is attached to the second surface 114 of the circuit board 110 by the thermally conductive insulating layer 140. In this embodiment, the thermal conductive insulating layer 140 may be formed on the second surface 114 of the circuit board 110 by using a corresponding thermal conductive insulating material, or may be formed by using a corresponding thermal conductive insulating material to be thermally pressed. The second surface 114 is formed on the circuit board 110, but the invention is not limited thereto. In addition, the heat conducting plate 150 is attached to the second surface 114 of the circuit board 110 by, for example, thermocompression bonding. In summary, the present invention is to form a heat dissipation through hole penetrating through the first surface and the second surface of the circuit board on the circuit board of the LED light bar, and filling the heat conductive material into the heat dissipation through hole to extend to the circuit board The second surface is then attached to the second surface of the circuit board by a thermally conductive insulating layer to form a heat conduction connection between the light emitting diode and the heat conducting plate, thereby greatly increasing the heat dissipation area of the light emitting diode. The heat generated by the LEDs on the board during operation can be discharged in time.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Although the present invention has been disclosed in the above preferred embodiments, it is not intended to limit the present invention. A person skilled in the art can make some modifications or modifications to the equivalent embodiments by using the methods and technical contents disclosed above without departing from the technical scope of the present invention. Any simple modifications, equivalent changes and modifications made to the above embodiments in accordance with the technical spirit of the present invention are still within the scope of the technical solutions of the present invention.

Claims

Rights request

An LED light bar characterized by comprising:

a circuit board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality of wafer arrangement regions arranged in a plurality of rows, and the circuit board is in each of the wafer configuration regions Having at least one heat dissipation through hole penetrating the first surface and the second surface;

a plurality of light emitting diodes disposed one-to-one in the wafer arrangement area and electrically connected to the circuit board;

a thermally conductive material filled in the heat dissipation through hole to contact the corresponding light emitting diode and extending onto the second surface, wherein the heat sinking through the wafer arrangement area of the same row The heat conductive material is integrally connected to the second surface;

a heat conducting plate attached to the second surface of the circuit board;

A thermally conductive insulating layer is disposed between the heat conducting plate and the circuit board.

2. A light-emitting diode light strip according to claim 1, wherein said heat conducting plate is an aluminum plate.

3. The LED light strip of claim 1, wherein the heat conducting material comprises solder, copper glue or glue.

The LED light bar of claim 1 , wherein the circuit board further has a plurality of electrical connection holes in each of the wafer arrangement regions, and each of the light emitting diodes comprises: a body covering the Heat sinking through hole;

A plurality of pins extend from the body and are inserted into the electrical connection holes to be electrically connected to the circuit board.

5. A light-emitting diode lamp, characterized in that it comprises:

a lamp housing having an accommodation space;

An LED light bar is disposed in the lamp housing and includes:

a plurality of light emitting diodes are disposed one-to-one in the wafer arrangement area and electrically connected to the circuit board;

a heat conducting plate attached to the second surface of the circuit board;

6. The LED tube of claim 5 wherein said guide The hot plate is 4 slabs.

7. The LED tube of claim 5, wherein the heat conducting material comprises solder, copper or silver glue.

8. The LED tube of claim 5, wherein the circuit board further has a plurality of electrical connection holes in each of the wafer arrangement regions, and each of the light emitting diodes comprises: a body covering the Heat sinking through hole;

A method of fabricating an LED strip, characterized in that it comprises the steps of: providing a circuit board having a first surface and a second surface opposite the first surface, wherein the first The surface has a plurality of wafer arrangement areas arranged in a plurality of rows;

Forming at least one heat dissipation through hole in each of the wafer arrangement regions of the circuit board to penetrate the first surface and the second surface;

Filling a heat conductive material into the heat dissipation through hole to extend to the second surface, so that the heat conductive material extending from the heat dissipation through hole of the wafer arrangement area of the same row is in the second Surface connection as one; and

Disposing a plurality of light emitting diodes in a one-to-one manner in the wafer arrangement area to be electrically connected to the circuit board, and contacting the corresponding heat conductive material in the heat dissipation through hole;

Forming a thermally conductive insulating layer on the second surface of the circuit board;

A heat conducting plate is attached to the second surface of the circuit board by the thermally conductive insulating layer.