201105185 六、發明說明： 【發明所屬之技術領域】 本發明係為一種具有具孔隙之電路基板之發光二極體及 其電路基板結構，特別為一種應用於發光二極體元件之具有具 孔隙之電路基板之發光二極體及其電路基板結構。 【先前技術】 隨著環保意識的提升，節能減碳已成為全球最重要的話 題，而由於發光二極體具有省電之特性，因此使得發光二極體 成為環保光源之最佳選擇，以台灣為例，目前全台灣的交通號 誌燈，大多已換成發光二極體，藉此每年將可省下約十億台幣 的電費。 除了交通號誌燈之外，目前生活中發光二極體的應用範圍 還包括了：汽車頭燈、電腦指示燈、手電筒、背光源…等。而 由於發光二極體出光時會不停地產熱，因此發光二極體封裝時 需特別注意散熱之設計，因為若無法即時使熱散出，熱將累積 於發光二極體中，導致發光二極體之使用壽命縮短、可靠度降 低、出光品質不佳…等問題。 又為了因應照明需求，因此已有眾多業者嘗試製造高功率 發光二極體，用以提高發光二極體之出光亮度。然而在提高輸 入功率的同時，卻造成更多的產熱使得發光二極體整體溫度提 高，因此對於發光二極體來說，溫度管理是相當重要的課題， 所以便有廠商發展出COB (Chip On Board)之封裝技術。 COB封裝技術是將發光二極體晶粒直接結合於電路板 201105185 上，而為了提高發光二極體晶粒之散熱效率，可於發光二極體 晶粒與電路板間加設金屬導熱層，以幫助發光二極體晶粒導 熱，然而由於發光二極體出光時之產熱有可能導致金屬導熱層 過度膨脹，並且因為金屬導熱層與發光二極體晶粒間的膨脹係 數不同，因此連接於發光二極體晶粒與導電層間金屬導線易因 金屬導線層膨脹形變受到拉扯而導致脫離或斷裂，進而造成發 光二極體壞損。 ®【發明内容】 本發明係為一種具有具孔隙之電路基板之發光二極體及 其電路基板結構，其係使用具有開孔之金屬導熱層，因此當金 屬導熱層受熱膨脹時，開孔可以減緩熱膨脹所產生之形變，進 而可避免金屬導熱層因熱膨脹而拉扯金屬導線，以達到防止金 屬導線斷裂之功效。 本發明係為一種具有具孔隙之電路基板之發光二極體及 Φ其電路基板結構，由於可有效防止金屬導熱層因為熱膨脹而扯 斷金屬導線，因此可避免發光二極體結構因高溫而壞損。 為達上述功效，本發明提供一種具有具孔隙之電路基板之 發光二極體結構，其具有：一電路基板，其具有：一基板，其 係覆蓋有一導熱絕緣層；一金屬導熱層，其係導熱結合於導熱 絕緣層上，且金屬導熱層具有複數個開孔；以及至少一對導電 層，其係設置於導熱絕緣層上並位於金屬導熱層之兩側，又導 電層係與金屬導熱層電性絕緣；以及至少一發光二極體晶粒， 其係導熱結合於金屬導熱層，且與導電層電性連接 201105185 為達上述功效，本發明又提供一種具孔隙之電路基板結 構，其具有：一基板，其係覆蓋有一導熱絕緣層；一金屬導熱 層，其係導熱結合於導熱絕緣層上，且金屬導熱層具有複數個 開孔；以及至少一對導電層，其係設置於導熱絕緣層上並位於 金屬導熱層之兩侧，又導電層係與金屬導熱層電性絕緣。 藉由本發明的實施，至少可達到下列進步功效： 一、利用具有開孔之金屬導熱層，可減少金屬導熱層於高溫環 土兄下因熱膨脹而產生大幅之形變，進而解決金屬導線因受 到拉扯而斷裂的問題。 一、由於具有開孔之金屬導熱層可防止金屬導線受拉扯而斷 裂脫離，因此可避免發光二極體結構因高溫而壞損。 為了使任何熟習相關技藝者了解本發明之技術内容並據 以實施，且根據本說明書所揭露之内容、巾請專利範圍及圖 式’任何熟習㈣技藝者可輕易地理解本發明相關之目的及優 點因此將在實知方式中詳細敘述本發明之詳細特徵以及優 點。 【實施方式】 第1圖係為本發明之一種具有具孔隙之電路基板之發光二 極體結構謂之立體實施例圖—。第以圖係為沿第】圖中μ 剖線之剖視實施例圖。帛2B圖係為第2A圖中A區域之放大 實施例圖。第3 ®係為本發明之—種具有具孔隙之電路基板之 發光-極體、構100之立體實施例圖二。第4圖係為沿第3圖 中B-B剖線之剖視實施例圖。第5圖係為本發明之—種具有具 201105185 ㈣之電路基板之發光二極體⑽之立體實施例圖三。 =丨圖所^，本實_係為—種有具有孔狀電路基板 發先—極體結構1⑻’其具有：一電路基板;以及至少一 發光二極體晶粒20。 ^第1圖所示，電路基板1G，其具有··—基板n ; 一金 屬V熱層12，·以及至少一對導電層13。 如第1圖所示，基板U，其係覆蓋有一導熱絕緣層⑴， φ 土板11之材貝係可以為鋁或銅，因此基板11可具有良好之 熱傳導特性，進而可幫助將發光二極體晶粒2G之產熱散除。 又基板11上之導熱絕緣層ln可以為一平面結構，並且 由於導熱絕緣層111亦具有良好之熱傳導特性，因此發光二極 體晶粒20之產熱可快速地傳導至基板u而散除。 如第1圖及第2A圖所示，金屬導熱層12，其係導熱結合 於基板11之導熱絕緣層lu上，又金屬導熱層12之材質係可 以為銅、鋁、銀、鎳、金、錫或其組合，並且金屬導熱層Η φ具有複數個開孔121，又每一開孔121皆可以為一圓形開孔、 一方型開口（如第3圖所示）或一線型開口（如第5圖所示）。 如第1圖及第2A圖所示’導電層π，係設置於基板^ 之導熱絕緣層111上並位於金屬導熱層丨2之兩側，又每一導 電層13係與金屬導熱層丨2相距一段距離並且電性絕緣。又如 第3圖所示’基板丨丨之導熱絕緣層m可進一步具有一凹槽 U2’而金屬導熱層12可導熱結合於凹槽ip之一底面113(如 第4圖所示）’又導電層π則可設置於凹槽112之開口側，也 就是位於凹槽112外側的表面上。 201105185 A於及第3圖所示，發光二極體晶粒2〇，補導教结 叫光高⑷㈣物開孔⑵ 二極體晶粒Ιοί:Μ㈣晶粒Μ四料設㈣孔121，但發光 第Μ :及第4;所干H 12接合處並不會設有開孔121(如 焊㈣此當發光二極體晶粒20以錫膏或 孔’ 一° ° “屬導熱層12時，錫膏或焊料並不會堵塞開 子匕121 〇201105185 VI. Description of the Invention: [Technical Field] The present invention relates to a light-emitting diode having a circuit board having a hole and a circuit board structure thereof, and particularly to a light-emitting diode element having a void A light-emitting diode of a circuit board and a circuit board structure thereof. [Prior Art] With the improvement of environmental awareness, energy saving and carbon reduction has become the most important topic in the world, and because the light-emitting diode has the characteristics of power saving, it makes the light-emitting diode the best choice for environmentally friendly light source, in Taiwan. For example, most of the traffic lights in Taiwan have been replaced by light-emitting diodes, which will save about one billion Taiwan dollars in electricity bills every year. In addition to traffic lights, the current range of applications for LEDs in life includes: car headlights, computer lights, flashlights, backlights, etc. Since the light-emitting diodes will continue to be heated when the light is emitted, it is necessary to pay special attention to the design of the heat-dissipating diode when the light-emitting diode package is packaged, because if the heat cannot be dissipated immediately, the heat will accumulate in the light-emitting diode, resulting in the light-emitting diode. Problems such as shortened service life of the polar body, reduced reliability, poor light quality, etc. In order to meet the lighting demand, many manufacturers have tried to manufacture high-power light-emitting diodes to improve the brightness of the light-emitting diodes. However, while increasing the input power, it causes more heat generation to increase the overall temperature of the light-emitting diode. Therefore, temperature management is a very important issue for the light-emitting diodes, so that manufacturers can develop COB (Chip). On Board) packaging technology. The COB package technology directly integrates the light-emitting diode die on the circuit board 201105185, and in order to improve the heat dissipation efficiency of the light-emitting diode die, a metal heat conduction layer may be added between the light-emitting diode die and the circuit board. In order to help the light-emitting diode die heat conduction, however, the heat generation of the light-emitting diode may cause the metal heat-conducting layer to excessively expand, and because the coefficient of expansion between the metal heat-conducting layer and the light-emitting diode die is different, the connection is made. The metal wire between the light-emitting diode and the conductive layer is easily pulled or broken due to the expansion deformation of the metal wire layer, thereby causing the light-emitting diode to be damaged. The present invention is a light-emitting diode having a circuit board having a void and a circuit substrate structure thereof, which uses a metal heat conductive layer having an opening, so that when the metal heat conductive layer is thermally expanded, the opening may be The deformation caused by thermal expansion is slowed down, and the metal conductive layer is prevented from pulling the metal wire by thermal expansion to prevent the metal wire from breaking. The invention relates to a light-emitting diode with a circuit board with apertures and a circuit board structure thereof. Since the metal heat conduction layer can effectively prevent the metal heat conductor from tearing off the metal wire due to thermal expansion, the structure of the light-emitting diode can be prevented from being damaged due to high temperature. damage. In order to achieve the above-mentioned effects, the present invention provides a light emitting diode structure having a circuit substrate having a void, comprising: a circuit substrate having: a substrate covered with a heat conductive insulating layer; and a metal heat conductive layer The heat conductive layer is bonded to the heat conductive insulating layer, and the metal heat conductive layer has a plurality of openings; and at least one pair of conductive layers are disposed on the heat conductive insulating layer and located on both sides of the metal heat conductive layer, and the conductive layer and the metal heat conductive layer Electrically insulating; and at least one light-emitting diode die electrically coupled to the metal heat-conducting layer and electrically connected to the conductive layer 201105185 to achieve the above-mentioned effects, the present invention further provides a circuit substrate structure having a void, which has a substrate covered with a thermally conductive insulating layer; a metallic thermally conductive layer bonded to the thermally conductive insulating layer, wherein the metallic thermally conductive layer has a plurality of openings; and at least one pair of electrically conductive layers disposed on the thermally conductive insulating layer The layers are located on both sides of the metal heat conducting layer, and the conductive layer is electrically insulated from the metal heat conducting layer. Through the implementation of the present invention, at least the following advancements can be achieved: 1. Using a metal heat conducting layer having an opening, the metal heat conducting layer can be reduced in deformation due to thermal expansion under the high temperature ring, thereby solving the pulling of the metal wire. And the problem of breakage. 1. Since the metal heat conducting layer having the opening prevents the metal wire from being broken and broken, the structure of the light emitting diode can be prevented from being damaged due to high temperature. In order to make the technical content of the present invention familiar to those skilled in the art and to implement it, and according to the disclosure of the present specification, the scope of the patent and the drawings, any skilled person can easily understand the related purposes of the present invention. Advantages The detailed features and advantages of the present invention will be described in detail in the Detailed Description. [Embodiment] FIG. 1 is a perspective view showing a three-dimensional embodiment of a light-emitting diode structure having a circuit substrate having a void. The first drawing is a cross-sectional view of the section along the line u in the first drawing. The Fig. 2B diagram is an enlarged embodiment of the A area in Fig. 2A. The third embodiment is a perspective embodiment of a three-dimensional embodiment of the light-emitting body of the present invention having a circuit board having a void. Fig. 4 is a cross-sectional view of the embodiment taken along line B-B of Fig. 3. Fig. 5 is a perspective view showing a three-dimensional embodiment of a light-emitting diode (10) having a circuit board of 201105185 (4). The present invention is a substrate having a hole-like structure. The first-pole structure 1 (8)' has a circuit substrate and at least one light-emitting diode die 20. As shown in Fig. 1, a circuit board 1G has a substrate n, a metal V thermal layer 12, and at least a pair of conductive layers 13. As shown in FIG. 1, the substrate U is covered with a heat conductive insulating layer (1), and the shell of the φ earth plate 11 may be aluminum or copper, so that the substrate 11 can have good heat conduction characteristics, thereby helping to emit the light emitting diode. The heat production of bulk crystal 2G is dissipated. Further, the thermally conductive insulating layer ln on the substrate 11 may have a planar structure, and since the thermally conductive insulating layer 111 also has good heat transfer characteristics, the heat generated by the light emitting diode die 20 can be quickly conducted to the substrate u to be dispersed. As shown in FIG. 1 and FIG. 2A, the metal heat conductive layer 12 is thermally conductively bonded to the heat conductive insulating layer lu of the substrate 11, and the material of the metal heat conductive layer 12 may be copper, aluminum, silver, nickel, gold, Tin or a combination thereof, and the metal heat conduction layer φ φ has a plurality of openings 121, and each of the openings 121 may be a circular opening, a one-piece opening (as shown in FIG. 3) or a one-line opening (such as Figure 5). As shown in FIG. 1 and FIG. 2A, the conductive layer π is disposed on the thermally conductive insulating layer 111 of the substrate and located on both sides of the metal thermal conductive layer ,2, and each conductive layer 13 is bonded to the metal thermal conductive layer 丨2. They are separated by a distance and are electrically insulated. Further, as shown in FIG. 3, the heat conductive insulating layer m of the substrate may further have a recess U2', and the metal heat conductive layer 12 may be thermally coupled to one of the bottom surfaces 113 of the recess ip (as shown in FIG. 4). The conductive layer π may be disposed on the open side of the groove 112, that is, on the surface outside the groove 112. 201105185 A and Fig. 3 show that the LED of the LED is 2 〇, the guide is called the light high (4) (four) the opening (2) the diode grain Ιοί: Μ (4) the grain Μ four materials (four) hole 121, but the light Dimensions: and 4; the dry H 12 joint is not provided with openings 121 (such as welding (4). When the light-emitting diode die 20 is solder paste or hole '° ° ° "is a heat conductive layer 12, Solder paste or solder does not block the plug 匕121 〇
如第1 ®第3圖及第5圖所示，發光二極體晶粒可 透過金屬導線30分別與每—導電層13電性連接，且電路基板 10之外型可以為方形（如第】圖所示)、圓形(如第3圖所示) 或六角型（如第5圖所示），但不以此為限。 而虽發光一極體晶粒2〇受電流驅動而出光時，發光二極 體晶粒20之產熱便可透過金屬導熱層12傳導至導熱絕緣層 111後由基板U散除。 θ 然而當發光二極體結構100中設置有多個發光二極體晶粒 2〇時，發光二極體晶粒2〇之產熱便容易使得金屬導熱層12 因高溫而出現熱膨脹之現象（如第2Β圖所示），而由於金屬導 熱層12具有開孔121，所以可藉此減緩金屬導熱層12因熱膨 服而產生之形變，使得發光二極體晶粒2〇與導電層13間的金 屬導線30不易受到拉扯而產生斷裂或脫離，因此金屬導線3〇 仍可保持正常連接狀態，進而達到避免發光二極體結構1〇〇於 高溫下因金屬導線斷裂而產生壞損。 上述之凹槽112之設置、開孔121以及電路基板1〇之外 ^•白可依需求而搭配使用’並不以此為限。 201105185 惟上述各實施例係用以說明本發明之特點，其目的在使熟 習該技術者能瞭解本發明之内容並據以實施，而非限定本發明 之專利範圍，故凡其他未脫離本發明所揭示之精神而完成之等 效修飾或修改，仍應包含在以下所述之申請專利範圍中。 【圖式簡單說明】 第1圖係為本發明之一種具有具孔隙之電路基板之發光二極體 結構之立體實施例圖一。 鲁第2A圖係為沿第1圖中A-A剖線之剖視實施例圖。 第2B圖係為第2A圖中A區域之放大實施例圖。 第3圖係為本發明之一種具有具孔隙之電路基板之發光二極體 結構之立體實施例圖二。 第4圖係為沿第3圖中B-B剖線之剖視實施例圖。 第5圖係為本發明之一種具有具孔隙之電路基板之發光二極體 之立體實施例圖三。 【主要元件符號說明】 100......具有具孔隙之電路基板之發光二極體結構 10 ........電路基板 11 ........基板 111……導熱絕緣層 112……凹槽 113......底面 12 ........金屬導熱層 201105185 121......開孔 13........導電層 20........發光二極體晶粒 金屬導線 30As shown in the first FIG. 3 and FIG. 5, the LED dies can be electrically connected to each of the conductive layers 13 through the metal wires 30, and the external shape of the circuit substrate 10 can be square (eg, the first) Figure), round (as shown in Figure 3) or hexagonal (as shown in Figure 5), but not limited to this. When the light-emitting diodes 2 are driven by the current to emit light, the heat generated by the light-emitting diodes 20 can be conducted through the metal heat-conducting layer 12 to the thermally-conductive insulating layer 111 and then dispersed by the substrate U. θ However, when a plurality of light-emitting diode crystal grains 2 are disposed in the light-emitting diode structure 100, the heat generation of the light-emitting diode crystal grains 2 tends to cause thermal expansion of the metal heat conductive layer 12 due to high temperature ( As shown in FIG. 2, since the metal heat conduction layer 12 has the opening 121, the deformation of the metal heat conduction layer 12 due to thermal expansion can be slowed down, so that the light-emitting diode die 2 and the conductive layer 13 The metal wire 30 is not easily pulled or broken or broken, so that the metal wire 3 can still maintain a normal connection state, thereby preventing the light-emitting diode structure 1 from being damaged due to the breakage of the metal wire at a high temperature. The above-mentioned arrangement of the recesses 112, the opening 121, and the circuit board 1 ^ can be used together as needed. The above-mentioned embodiments are intended to illustrate the features of the present invention, and the purpose of the present invention is to enable those skilled in the art to understand the present invention and to implement the present invention without limiting the scope of the present invention. Equivalent modifications or modifications made by the spirit of the invention should still be included in the scope of the claims described below. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a perspective view showing a three-dimensional embodiment of a light-emitting diode structure having a circuit board having apertures. Lu 2A is a cross-sectional view of the embodiment taken along line A-A in Fig. 1. Fig. 2B is a diagram showing an enlarged embodiment of the A area in Fig. 2A. Fig. 3 is a perspective view showing a two-dimensional embodiment of a light-emitting diode structure having a circuit board having apertures. Fig. 4 is a cross-sectional view of the embodiment taken along line B-B of Fig. 3. Fig. 5 is a perspective view showing a three-dimensional embodiment of a light-emitting diode having a circuit board having a void. [Description of main component symbols] 100...Light-emitting diode structure having a circuit board with apertures 10 ........Circuit board 11 ........substrate 111 ...heat conduction Insulating layer 112 ... recess 113 ... bottom surface 12 ........ metal heat conductive layer 201105185 121 ... opening 13 ..... conductive layer 20. .......Light Emitting Diode Grain Metal Wire 30