WO2009094829A1 - A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly - Google Patents

A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly Download PDF

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Publication number
WO2009094829A1
WO2009094829A1 PCT/CN2008/002028 CN2008002028W WO2009094829A1 WO 2009094829 A1 WO2009094829 A1 WO 2009094829A1 CN 2008002028 W CN2008002028 W CN 2008002028W WO 2009094829 A1 WO2009094829 A1 WO 2009094829A1
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WO
WIPO (PCT)
Prior art keywords
light source
led light
high
heat dissipation
source assembly
Prior art date
Application number
PCT/CN2008/002028
Other languages
French (fr)
Chinese (zh)
Inventor
Jie She
Original Assignee
Jie She
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN 200810019370 priority Critical patent/CN101198216A/en
Priority to CN200810019370.4 priority
Application filed by Jie She filed Critical Jie She
Publication of WO2009094829A1 publication Critical patent/WO2009094829A1/en

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Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/021Components thermally connected to metal substrates or heat-sinks by insert mounting
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/642Heat extraction or cooling elements characterized by the shape
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0058Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Abstract

A high heat dissipation LED light source module (1) includes a flip-chip LED light source and a high heat conduction insulating sheet (12). The flip-chip LED light source includes a heat dissipation base (112). The high heat conduction insulating sheet (12) is directly connected with the bottom surface of the heat dissipation base (112).The thermal conductivity of the insulating sheet (12) is between 170 and 237w/ (m ×k). A high heat dissipation and high power LED light source assembly includes a connection board (2), a heat sink (3) and a plurality of LED light sources.

Description

 High heat dissipation LED light source assembly and high heat dissipation high power LED light source component

 The invention belongs to the technical field of semiconductor lighting applications, and particularly relates to a high heat dissipation LED light source assembly and a high heat dissipation high power LED light source assembly.

Background technique

 Light-emitting diode (LED) technology began in the late 1960s. After half a century of rapid development, LED light sources, especially high-power high-brightness LED light sources, have high luminous efficiency, small size, long service life, and environmental protection and energy saving. And many other advantages, occupy an important position in the field of lighting sources, and continue to develop rapidly.

 In the original LBD lighting products, the LED light source was directly packaged inside a metal lamp body. But nowadays, the most widely used high-power LEDs (rated at more than 1W) are mostly flip-chip packages, that is, the LED chips are packaged on the heat dissipation base, connected to the LED pins through gold wires, and the heat dissipation base is embedded in the plastic case. The LED light source formed by the LED chip is sealed with a resin or a silicone material. To protect the LED chip, electrical components such as antistatic discharge (ESD) diodes are also packaged in the light source. In order to facilitate wiring and save space, the cooling base of most LED light sources is made of metal (mainly copper or aluminum shield) and is electrically connected to one electrode of the LED light source. Therefore, when the LED light source is in contact with the metal or alloy heat sink, the insulation protection of the circuit must be considered, which is time consuming, laborious, safe, and not stable, and the circuit connection between the LEDs is complicated.

 Most of the LED lighting products on the market are first packaged on the circuit substrate, and then the LED circuit board is fixed on the heat dissipation structure of the lamp body, and the heat dissipation base of the LED light source and the metal lamp body structure are separated by the circuit substrate. It does not make direct contact. Commonly used LED circuit board substrates are resin materials, ceramic materials, and metal/alloy materials.

 High-power LEDs are heat-generating devices, and their light efficiency, power consumption, and service life are greatly affected by temperature. Therefore, effective heat dissipation from LED light sources is an important factor in improving LED performance.

The LED circuit substrate is used to separate the LED light source and the heat sink to form a heat dissipation path of "LED light source - circuit substrate → heat sink - external". The thermal conductivity of the resin material and the ceramic material is poor, and most of the high power LED light sources are applied with metal in consideration of heat dissipation. The substrate of the material. On the other hand, considering that the LED light source and the circuit substrate, the circuit substrate and the heat sink cannot be bonded together, a large gap is inevitably generated, which is not conducive to heat dissipation, and it is also necessary to fill the contact gap with a heat conductive medium to form an "LED light source → a heat transfer medium. → The heat dissipation path of the circuit board → heat transfer medium → heat sink → outside. The heat dissipation path is multiple indirect heat dissipation, and there are many heat dissipation links, and the heat dissipation path is long, and the heat dissipation effect is not obvious; each contact surface is prone to contact gap, resulting in a decrease in the overall effective thermal conductivity, resulting in an increase in the junction temperature of the LED, an increase in light decay, and a decrease in the heat dissipation path. The service life of the LED light source. Summary of the invention

 In order to overcome the deficiencies of the prior art, the present invention provides a high heat dissipation LED light source assembly and a high heat dissipation high power LED light source assembly, which shortens the heat conduction path and improves the heat dissipation effect; ensures the safety and stability of the lighting circuit; Conducive to modular production.

 The object of the invention is achieved by the following technical solutions:

 A high-heat-dissipating LED light source assembly, comprising a flip-chip LED light source; the flip-chip LED light source includes a heat dissipation base; wherein: the high heat dissipation LED light source assembly further comprises a high thermal conductive insulating sheet; The high thermal conductive insulating sheet is directly connected to the lower surface of the heat dissipating base of the flip chip type LED light source; wherein the high thermal conductive insulating sheet (1-2) has a thermal conductivity of between 170 and 237 W/(m·K). The invention also provides a high heat dissipation high power LED light source assembly, comprising: a plurality of the above light source assemblies, a coupling plate and a heat sink; wherein the LED light source assembly is located in the LED receiving hole of the connecting plate And a lower surface of the high thermal conductive insulating sheet of the LED light source assembly is directly connected to the heat sink, and the heat sink completely covers all the high thermal conductive insulating sheets. The invention has the advantages of novel structure, reasonableness and compactness, easy manufacture and low cost, convenient installation and maintenance, convenient promotion and application, and is particularly suitable for the field of high-power LED illumination. Compared with the existing LED substrate, the invention has the following beneficial technical effects:

 1. Using high-heat-conducting insulation sheet 12 to isolate the heat-dissipating base 112 of the flip-chip LBD light source and the heat sink 3 to ensure the safety and stability of the lighting circuit;

 2. The heat conduction path of "Crystalline LED light source → high thermal conductivity insulating sheet 12 - heat sink 3 → external", less heat conduction environment, short heat conduction distance, and increased heat dissipation ribs or heat pipes added to the heat sink 3 The heat dissipation area, the overall heat dissipation system is highly efficient, and can achieve good heat dissipation effect;

 3. The flip-chip LED light source, the high thermal conductive insulating sheet 12, and the heat dissipating body 3 are connected by thermocompression bonding, strong bonding or high temperature soldering to ensure the conformity of each contact surface and further ensure the heat dissipation performance. ;

4. The substrate 22 of the LED connecting plate 2 does not intervene in the heat conduction path, and the bonding degree of the substrate 22 and the heat sink 3 is small, the processing difficulty of the substrate 22 and the heat sink 3 is reduced, and the cost is controlled and the production efficiency is improved; 5. The LED light source assembly 1 is connected by the LED connecting plate 2, so that the wiring connection is relatively simple, and the installation and replacement are convenient, which is more conducive to modular production.

DRAWINGS

 The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

 1 is a schematic structural view of an embodiment of an LED light source assembly of the present invention;

 2 is a schematic perspective view of a first embodiment of a high heat dissipation high power LED light source assembly according to the present invention, wherein the high heat dissipation high power LED light source assembly has a plurality of light source assemblies mounted in the same plane and having the same illumination direction;

 3 is a partial cross-sectional view of the high heat dissipation high power LED light source assembly shown in FIG. 2;

 4 is a schematic diagram of a partial heat dissipation path of the high heat dissipation high power LED light source assembly shown in FIG. 2;

 5 is a schematic perspective view of a second embodiment of a high heat dissipation high power LED light source assembly according to the present invention, wherein the high heat dissipation high power LED light source assembly has a plurality of light source assemblies installed in different planes and having different illumination directions;

 6 is a schematic diagram of a partial heat dissipation path of the high heat dissipation high power LED light source assembly shown in FIG. 5;

 The reference numerals are as follows:

 1 LED light source assembly

 111 LED chip

 112 cooling base

 113 LED pin

 12 high thermal insulation sheet

 2 LED link plate,

 21 connection circuit,

 22 substrates,

 23 surface insulation,

3 heat sink. DETAILED DESCRIPTION As shown in FIG. 1 , in one embodiment of the LED light source assembly of the present invention, the high heat dissipation LBD light source assembly 1 includes a flip chip LED light source and a high thermal conductive insulating sheet 12; the flip chip LED light source includes LED chip 111, The heat sink base 112 and the LED pin 113; the LED chip 111 is directly connected to the upper surface of the heat sink base 112. The high thermal conductive insulating sheet 12 has a thermal conductivity of 170-237 W/(m.K), and the upper surface thereof is bonded to the upper surface by high temperature pressing (also known as thermocompression or high temperature penetration), solder bonding or superglue bonding. The bottom surface of the heat dissipation base 112 of the crystalline LED light source completely covers the heat dissipation base 112 of the flip-chip LED light source, and does not exceed the bottom surface range of the flip-chip LED light source.

 The high thermal conductive insulating sheet 12 is an alumina flake having a thickness of not more than 1 ,, or a pure aluminum flake having a thickness of not more than 2 locks and subjected to surface oxidation treatment, and the shape thereof is similar to the heat dissipating base 112 of the LED chip 111, and the size thereof does not exceed the flip chip. The size of the bottom surface of the LED light source.

 As shown in FIG. 2, 3 and 4, in the first embodiment of the high heat dissipation high power LED light source assembly of the present invention, the high heat dissipation high power LED light source assembly has six light source assemblies, and the six light source assemblies are installed in the same In the plane, the six illumination directions are in the same direction.

 As shown in Fig. 2, the high heat dissipation high power LED light source assembly of this embodiment comprises six light source assemblies 1, a flat rigid LED link plate 2 and a heat sink 3 having a flat surface. An LED receiving hole for the LED light source assembly 1 is reserved on the LED connecting plate 2, and the LED light source assembly 1 passes through the LED receiving hole on the LED connecting plate 2, and insulates the high heat conduction on the LED light source assembly 1. The bottom surface of the sheet 12 is attached to the surface of the heat sink 3 by a certain means.

 The heat dissipating body 3 adopts a rectangular aluminum alloy heat dissipating body, which completely covers the six high thermal conductive insulating sheets 12, and the other surface opposite to the mounting surface which is in contact with the LED connecting plate 2 is provided with a plurality of rows of grid-shaped heat dissipating ribs.

 In this embodiment, the heat-dissipating base 112, the high-heat-conductive insulating sheet 12, and the heat-dissipating body 3 can be combined into one unit by high-temperature pressing (also referred to as hot pressing or high-temperature penetration), welding bonding or super-adhesive bonding.

 As shown in FIG. 3, the substrate 22 of the LED coupling plate 2 of the high heat dissipation high power LED light source assembly of the present embodiment is an aluminum alloy thin plate having a thickness of about 1, and the coupling circuit 21 is a copper foil circuit printed on the surface of the substrate 22. The surface of the connecting circuit 21 and the substrate 22 is sprayed with an insulating paste to form a surface insulating layer 23. In this embodiment, the LBD connecting plate 2 is fixed on the mounting surface of the heat dissipating body 3 by high temperature pressing (also known as thermocompression or high temperature penetration), welding bonding, superglue bonding, riveting or screwing structure (screw or screw). Within a certain area.

 J of the LED link board 2 [The contact pad 21 has a pad pad soldered to the LED pin 113, and an external circuit pad soldered to the external circuit, and the pad is exposed to the surface insulating layer 23 In addition, the LED pins 113 of the flip-chip LED light source are soldered to the pin pads on the connection circuit 21 to achieve circuit connection.

As shown in FIG. 4, the heat dissipation system of the high heat dissipation high power LED light source assembly in this embodiment forms a "clad The LED light source → the high thermal conductive insulating sheet 12 heat dissipating body 3 → the external heat dissipation path, the path is not affected by the adhesion degree of the substrate 22 of the LED connecting plate 2 and the heat dissipating body 3, and the heat dissipating link is stable and reliable.

 The heat dissipating base 112 of the LED chip 111, the high thermal conductive insulating sheet 12, and the heat dissipating body 3 are combined into a heat dissipating assembly by high temperature pressing (also known as thermocompression or high temperature penetration), welding bonding or superglue bonding, and the entire heat dissipating system can be It is regarded as the heat dissipation path of "LED chip 111→heat-dissipation assembly→outside". The heat-dissipating assembly is used to increase the heat-dissipation area, the heat dissipation distance of the whole heat-dissipation path is short, and the heat-dissipation link is small, which can effectively dissipate the heat generated by the flip-chip LED light source. Achieve better heat dissipation.

 As shown in FIGS. 5 and 6, in the second embodiment of the high heat dissipation high power LED light source assembly of the present invention, the high heat dissipation high power LED light source assembly has 12 light source assemblies, and the 12 light source assemblies are installed in different planes. , 12 illumination directions are in different directions. As shown in FIG. 5, the high heat dissipation high power LED light source assembly in this embodiment includes 12 light source assemblies 1 and a flexible LED coupling plate 2 and a heat sink body 3 having a cylindrical surface. The LED light source plate 2 is reserved for the LED light source. The LED light source assembly 1 passes through the LED receiving hole on the LBD coupling plate 2, and the bottom surface of the high thermal conductive insulating sheet 12 on the LED light source assembly 1 is attached to the heat sink 3 by a certain means. surface. The heat dissipating body 3 adopts a cylindrical aluminum alloy heat dissipating body, which completely covers the 12 high thermal conductive insulating sheets 12, and the inner side surface opposite to the mounting surface which is in contact with the LED connecting plate 2 is provided with a plurality of rows of grid-shaped heat dissipating ribs. In this embodiment, the thermal conductive silver paste is coated on the bottom surface of the high thermal conductive insulating sheet 12, and the LED light source assembly 1 is combined with high temperature pressing (also known as thermal pressing or high temperature penetration), welding bonding or superglue bonding. The heat sink 3 is combined. As shown in FIG. 6, the substrate 22 of the LBD coupling plate 2 of the high heat dissipation high-power LED light source assembly of the present embodiment is a resin material film having a thickness of about 0.2, and the coupling circuit 21 is a copper foil circuit printed on the surface of the substrate 22. And a surface of the insulating film is attached to the surface of the connecting circuit 21 and the substrate 22 to form the surface insulating layer 23. In this embodiment, a strong adhesive layer is applied on the mounting surface of the LED connecting plate 2, and the LED connecting plate 2 is pressed by high temperature (also known as thermocompression or high temperature penetration), welded bonding, superglue bonding, riveting Or a threaded structure (screw or screw) is fixed in a certain area of the mounting surface of the heat sink 3.

A pin pad soldered to the LBD pin 113 and a peripheral circuit detail plated to the external circuit are reserved on the coupling circuit 21 of the LED link board 2, and the pads are exposed outside the surface insulating layer 23, The LED pin 113; t of the flip-chip LED light source is connected to the pin pad on the connection circuit 21 to realize the circuit connection. In this embodiment, the heat dissipation system of the high heat dissipation high-power LED light source assembly in the embodiment forms a heat dissipation path of a "clad-type LED light source → a high thermal conductive insulating sheet 12 → a heat sink 3 → an external", and the path is not connected by the LED. The adhesion between the substrate 22 of the board 2 and the heat sink 3 is affected, and the heat dissipation link is stable and reliable.

 The heat dissipating base 112 of the LED chip 111 and the high thermal conductive insulating sheet 12 are combined into a whole by high temperature pressing (also known as thermocompression or high temperature penetration), welding bonding or superglue bonding, and the entire heat dissipating system can be regarded as "LED chip 111". → Heat dissipation base 112 → heat sink 3 → external heat dissipation path, the heat dissipation distance of the whole heat dissipation path is short, and the heat dissipation link is small, which can effectively dissipate the heat generated by the flip-chip LED light source and achieve a good heat dissipation effect. At the same time, the LED connecting plate 1 is used to facilitate the wiring connection and adapt to the non-flat heat sink mounting surface. It has universal utility and is easy to be modularized, which is beneficial to control cost and improve production efficiency.

Claims

Rights request
 1. A high heat dissipation LED light source assembly (1) comprising a flip chip LED light source; the covered crystalline LED light source comprises a heat sink base (1-12);
 The high heat dissipation LED light source assembly (1) further includes a high thermal conductive insulating sheet (b); the high thermal conductive insulating sheet (1-2) and the heat dissipating base of the flip chip type LED light source (Bu 12) The lower surface is directly connected; wherein the high thermal conductive insulating sheet (1-2) has a thermal conductivity of between 170 and 237 W/(m.K).
 2. The LED light source assembly (1) according to claim 1, wherein:
 The direct connection of the high thermal conductive insulating sheet (1-2) to the lower surface of the heat dissipating base (1-12) is achieved by high temperature pressing, welding bonding or superglue bonding.
 3. The LED light source assembly (1) according to claim 1, wherein:
 The high thermal conductive insulating sheet (1-2) completely covers the heat dissipating base (1-12) and does not extend beyond the bottom surface of the flip chip LED light source.
The LED light source assembly (1) according to claim 1 or 2 or 3, wherein: the high thermal conductive insulating sheet (1-2) is an alumina flake having a thickness of not more than 1 mm, or a thickness of not more than Pure aluminum flakes with 2 legs and surface oxidation treatment.
5. A high heat dissipation high power LED light source assembly, characterized in that:
 a plurality of light source assemblies (1) according to claim 1 or 2 or 3 or 4, further comprising a coupling plate (2) and a heat sink (3);
 The LED light source assembly (1) is located in the LED receiving hole on the connecting plate (2), and the lower surface of the high thermal conductive insulating sheet (1-2) of the LED light source assembly (1) is The heat sink (3) is directly connected, and the heat sink (3) completely covers all the high heat conductive insulating sheets (1-2).
 6. The high heat dissipation high power LED light source assembly according to claim 5, characterized in that: the lower surface of the high thermal conductive insulating sheet (12) of the LED light source assembly (1) and the heat sink (3) The direct connection is achieved by high temperature pressing, welding bonding or superglue bonding.
 7. The high heat dissipation high power LED light source assembly according to claim 5, wherein: the other surface of the heat dissipating body (3) opposite to the mounting surface contacting the coupling plate (2) is provided with a plurality of columns Grid-shaped cooling ribs.
8. The high heat dissipation high power LED light source assembly according to claim 5, wherein: the coupling plate (2) comprises a coupling circuit (2-1); and the light source assembly (1) passes through the coupling circuit (2) - 1 ) Implement circuit connections.
 9. A high power LED light source assembly according to claim 5 or 6 or 7 or 8, characterized in that said coupling plate (2) is a rigid coupling plate.
 10. A high power LED light source assembly according to claim 5 or 6 or 7 or 8, characterized in that said coupling plate (2) is a flexible coupling plate.
PCT/CN2008/002028 2008-01-07 2008-12-18 A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly WO2009094829A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN 200810019370 CN101198216A (en) 2008-01-07 2008-01-07 Flexible circuit board of LED illumination array
CN200810019370.4 2008-01-07

Publications (1)

Publication Number Publication Date
WO2009094829A1 true WO2009094829A1 (en) 2009-08-06

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Country Status (2)

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CN (1) CN101198216A (en)
WO (1) WO2009094829A1 (en)

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* Cited by examiner, † Cited by third party
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IT1403805B1 (en) * 2011-02-01 2013-10-31 Gs Plastics S A S Di Giovanni Gervasio & C LED Lamp
WO2012109551A2 (en) * 2011-02-10 2012-08-16 Osram Sylvania Inc. Solid state light source-based module convertible between linear and non-linear shapes
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CN104157638B (en) * 2014-08-27 2017-06-13 江苏华英光宝科技股份有限公司 360 degree of formal dress flip-chip is luminous can arbitrarily around LED filament and preparation method thereof
CN104613423A (en) * 2015-01-13 2015-05-13 无锡天地合同能源管理有限公司 Pluggable tubing lamp
CN104934515B (en) * 2015-06-26 2018-03-27 浙江亿米光电科技有限公司 Flexible light piece and its processing technology apply the lighting device and manufacture method of the lamp piece
CN106678593A (en) * 2015-10-30 2017-05-17 鹤山市银雨照明有限公司 Chip LED type lamp string and fabrication method thereof
CN105371116A (en) * 2015-11-13 2016-03-02 嘉兴市正大照明有限公司 LED energy-saving illuminating lamp with radiating function
JPWO2017115712A1 (en) * 2015-12-28 2018-10-18 東芝ホクト電子株式会社 Light emitting module

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2634572Y (en) * 2003-08-15 2004-08-18 品能科技股份有限公司 Circuit board structure with modulized luminous diode
CN1830085A (en) * 2003-07-28 2006-09-06 霍尼韦尔国际公司 Heatsinking electronic devices
CN2896528Y (en) * 2005-11-28 2007-05-02 李家茂 High-power LED package structure

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1830085A (en) * 2003-07-28 2006-09-06 霍尼韦尔国际公司 Heatsinking electronic devices
CN2634572Y (en) * 2003-08-15 2004-08-18 品能科技股份有限公司 Circuit board structure with modulized luminous diode
CN2896528Y (en) * 2005-11-28 2007-05-02 李家茂 High-power LED package structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102595767A (en) * 2011-01-13 2012-07-18 钰桥半导体股份有限公司 Circuit board structure of mobile electronic product and manufacturing method thereof
CN102595767B (en) * 2011-01-13 2015-07-22 钰桥半导体股份有限公司 Circuit board structure of mobile electronic product and manufacturing method thereof
CN102691893A (en) * 2011-03-23 2012-09-26 海洋王照明科技股份有限公司 Lighting device

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