WO2009094829A1 - A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly - Google Patents

A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly Download PDF

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Publication number
WO2009094829A1
WO2009094829A1 PCT/CN2008/002028 CN2008002028W WO2009094829A1 WO 2009094829 A1 WO2009094829 A1 WO 2009094829A1 CN 2008002028 W CN2008002028 W CN 2008002028W WO 2009094829 A1 WO2009094829 A1 WO 2009094829A1
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WO
WIPO (PCT)
Prior art keywords
light source
led light
heat dissipation
source assembly
insulating sheet
Prior art date
Application number
PCT/CN2008/002028
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French (fr)
Chinese (zh)
Inventor
Jie She
Original Assignee
Jie She
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Publication date
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Publication of WO2009094829A1 publication Critical patent/WO2009094829A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Definitions

  • the invention belongs to the technical field of semiconductor lighting applications, and particularly relates to a high heat dissipation LED light source assembly and a high heat dissipation high power LED light source assembly.
  • LED Light-emitting diode
  • the LED light source was directly packaged inside a metal lamp body.
  • the most widely used high-power LEDs (rated at more than 1W) are mostly flip-chip packages, that is, the LED chips are packaged on the heat dissipation base, connected to the LED pins through gold wires, and the heat dissipation base is embedded in the plastic case.
  • the LED light source formed by the LED chip is sealed with a resin or a silicone material.
  • electrical components such as antistatic discharge (ESD) diodes are also packaged in the light source.
  • ESD antistatic discharge
  • the cooling base of most LED light sources is made of metal (mainly copper or aluminum shield) and is electrically connected to one electrode of the LED light source. Therefore, when the LED light source is in contact with the metal or alloy heat sink, the insulation protection of the circuit must be considered, which is time consuming, laborious, safe, and not stable, and the circuit connection between the LEDs is complicated.
  • LED circuit board substrates are resin materials, ceramic materials, and metal/alloy materials.
  • High-power LEDs are heat-generating devices, and their light efficiency, power consumption, and service life are greatly affected by temperature. Therefore, effective heat dissipation from LED light sources is an important factor in improving LED performance.
  • the LED circuit substrate is used to separate the LED light source and the heat sink to form a heat dissipation path of "LED light source - circuit substrate ⁇ heat sink - external".
  • the thermal conductivity of the resin material and the ceramic material is poor, and most of the high power LED light sources are applied with metal in consideration of heat dissipation.
  • the substrate of the material On the other hand, considering that the LED light source and the circuit substrate, the circuit substrate and the heat sink cannot be bonded together, a large gap is inevitably generated, which is not conducive to heat dissipation, and it is also necessary to fill the contact gap with a heat conductive medium to form an "LED light source ⁇ a heat transfer medium.
  • the heat dissipation path is multiple indirect heat dissipation, and there are many heat dissipation links, and the heat dissipation path is long, and the heat dissipation effect is not obvious; each contact surface is prone to contact gap, resulting in a decrease in the overall effective thermal conductivity, resulting in an increase in the junction temperature of the LED, an increase in light decay, and a decrease in the heat dissipation path.
  • the present invention provides a high heat dissipation LED light source assembly and a high heat dissipation high power LED light source assembly, which shortens the heat conduction path and improves the heat dissipation effect; ensures the safety and stability of the lighting circuit; Conducive to modular production.
  • a high-heat-dissipating LED light source assembly comprising a flip-chip LED light source; the flip-chip LED light source includes a heat dissipation base; wherein: the high heat dissipation LED light source assembly further comprises a high thermal conductive insulating sheet; The high thermal conductive insulating sheet is directly connected to the lower surface of the heat dissipating base of the flip chip type LED light source; wherein the high thermal conductive insulating sheet (1-2) has a thermal conductivity of between 170 and 237 W/(m ⁇ K).
  • the invention also provides a high heat dissipation high power LED light source assembly, comprising: a plurality of the above light source assemblies, a coupling plate and a heat sink; wherein the LED light source assembly is located in the LED receiving hole of the connecting plate And a lower surface of the high thermal conductive insulating sheet of the LED light source assembly is directly connected to the heat sink, and the heat sink completely covers all the high thermal conductive insulating sheets.
  • the invention has the advantages of novel structure, reasonableness and compactness, easy manufacture and low cost, convenient installation and maintenance, convenient promotion and application, and is particularly suitable for the field of high-power LED illumination. Compared with the existing LED substrate, the invention has the following beneficial technical effects:
  • the heat dissipation area, the overall heat dissipation system is highly efficient, and can achieve good heat dissipation effect;
  • the flip-chip LED light source, the high thermal conductive insulating sheet 12, and the heat dissipating body 3 are connected by thermocompression bonding, strong bonding or high temperature soldering to ensure the conformity of each contact surface and further ensure the heat dissipation performance. ;
  • the substrate 22 of the LED connecting plate 2 does not intervene in the heat conduction path, and the bonding degree of the substrate 22 and the heat sink 3 is small, the processing difficulty of the substrate 22 and the heat sink 3 is reduced, and the cost is controlled and the production efficiency is improved; 5.
  • the LED light source assembly 1 is connected by the LED connecting plate 2, so that the wiring connection is relatively simple, and the installation and replacement are convenient, which is more conducive to modular production.
  • FIG. 1 is a schematic structural view of an embodiment of an LED light source assembly of the present invention
  • FIG. 2 is a schematic perspective view of a first embodiment of a high heat dissipation high power LED light source assembly according to the present invention, wherein the high heat dissipation high power LED light source assembly has a plurality of light source assemblies mounted in the same plane and having the same illumination direction;
  • FIG. 3 is a partial cross-sectional view of the high heat dissipation high power LED light source assembly shown in FIG. 2;
  • FIG. 4 is a schematic diagram of a partial heat dissipation path of the high heat dissipation high power LED light source assembly shown in FIG. 2;
  • FIG. 5 is a schematic perspective view of a second embodiment of a high heat dissipation high power LED light source assembly according to the present invention, wherein the high heat dissipation high power LED light source assembly has a plurality of light source assemblies installed in different planes and having different illumination directions;
  • FIG. 6 is a schematic diagram of a partial heat dissipation path of the high heat dissipation high power LED light source assembly shown in FIG. 5;
  • the high heat dissipation LBD light source assembly 1 includes a flip chip LED light source and a high thermal conductive insulating sheet 12; the flip chip LED light source includes LED chip 111, The heat sink base 112 and the LED pin 113; the LED chip 111 is directly connected to the upper surface of the heat sink base 112.
  • the high thermal conductive insulating sheet 12 has a thermal conductivity of 170-237 W/(m.K), and the upper surface thereof is bonded to the upper surface by high temperature pressing (also known as thermocompression or high temperature penetration), solder bonding or superglue bonding.
  • the bottom surface of the heat dissipation base 112 of the crystalline LED light source completely covers the heat dissipation base 112 of the flip-chip LED light source, and does not exceed the bottom surface range of the flip-chip LED light source.
  • the high thermal conductive insulating sheet 12 is an alumina flake having a thickness of not more than 1 ,, or a pure aluminum flake having a thickness of not more than 2 locks and subjected to surface oxidation treatment, and the shape thereof is similar to the heat dissipating base 112 of the LED chip 111, and the size thereof does not exceed the flip chip.
  • the size of the bottom surface of the LED light source is an alumina flake having a thickness of not more than 1 , or a pure aluminum flake having a thickness of not more than 2 locks and subjected to surface oxidation treatment, and the shape thereof is similar to the heat dissipating base 112 of the LED chip 111, and the size thereof does not exceed the flip chip.
  • the size of the bottom surface of the LED light source is an alumina flake having a thickness of not more than 1 , or a pure aluminum flake having a thickness of not more than 2 locks and subjected to surface oxidation treatment, and the shape thereof is similar to the heat
  • the high heat dissipation high power LED light source assembly has six light source assemblies, and the six light source assemblies are installed in the same In the plane, the six illumination directions are in the same direction.
  • the high heat dissipation high power LED light source assembly of this embodiment comprises six light source assemblies 1, a flat rigid LED link plate 2 and a heat sink 3 having a flat surface.
  • An LED receiving hole for the LED light source assembly 1 is reserved on the LED connecting plate 2, and the LED light source assembly 1 passes through the LED receiving hole on the LED connecting plate 2, and insulates the high heat conduction on the LED light source assembly 1.
  • the bottom surface of the sheet 12 is attached to the surface of the heat sink 3 by a certain means.
  • the heat dissipating body 3 adopts a rectangular aluminum alloy heat dissipating body, which completely covers the six high thermal conductive insulating sheets 12, and the other surface opposite to the mounting surface which is in contact with the LED connecting plate 2 is provided with a plurality of rows of grid-shaped heat dissipating ribs.
  • the heat-dissipating base 112, the high-heat-conductive insulating sheet 12, and the heat-dissipating body 3 can be combined into one unit by high-temperature pressing (also referred to as hot pressing or high-temperature penetration), welding bonding or super-adhesive bonding.
  • high-temperature pressing also referred to as hot pressing or high-temperature penetration
  • welding bonding or super-adhesive bonding.
  • the substrate 22 of the LED coupling plate 2 of the high heat dissipation high power LED light source assembly of the present embodiment is an aluminum alloy thin plate having a thickness of about 1
  • the coupling circuit 21 is a copper foil circuit printed on the surface of the substrate 22.
  • the surface of the connecting circuit 21 and the substrate 22 is sprayed with an insulating paste to form a surface insulating layer 23.
  • the LBD connecting plate 2 is fixed on the mounting surface of the heat dissipating body 3 by high temperature pressing (also known as thermocompression or high temperature penetration), welding bonding, superglue bonding, riveting or screwing structure (screw or screw). Within a certain area.
  • the contact pad 21 has a pad pad soldered to the LED pin 113, and an external circuit pad soldered to the external circuit, and the pad is exposed to the surface insulating layer 23
  • the LED pins 113 of the flip-chip LED light source are soldered to the pin pads on the connection circuit 21 to achieve circuit connection.
  • the heat dissipation system of the high heat dissipation high power LED light source assembly in this embodiment forms a "clad
  • the heat dissipating base 112 of the LED chip 111, the high thermal conductive insulating sheet 12, and the heat dissipating body 3 are combined into a heat dissipating assembly by high temperature pressing (also known as thermocompression or high temperature penetration), welding bonding or superglue bonding, and the entire heat dissipating system can be It is regarded as the heat dissipation path of "LED chip 111 ⁇ heat-dissipation assembly ⁇ outside".
  • the heat-dissipating assembly is used to increase the heat-dissipation area, the heat dissipation distance of the whole heat-dissipation path is short, and the heat-dissipation link is small, which can effectively dissipate the heat generated by the flip-chip LED light source. Achieve better heat dissipation.
  • the high heat dissipation high power LED light source assembly has 12 light source assemblies, and the 12 light source assemblies are installed in different planes. , 12 illumination directions are in different directions.
  • the high heat dissipation high power LED light source assembly in this embodiment includes 12 light source assemblies 1 and a flexible LED coupling plate 2 and a heat sink body 3 having a cylindrical surface. The LED light source plate 2 is reserved for the LED light source.
  • the LED light source assembly 1 passes through the LED receiving hole on the LBD coupling plate 2, and the bottom surface of the high thermal conductive insulating sheet 12 on the LED light source assembly 1 is attached to the heat sink 3 by a certain means. surface.
  • the heat dissipating body 3 adopts a cylindrical aluminum alloy heat dissipating body, which completely covers the 12 high thermal conductive insulating sheets 12, and the inner side surface opposite to the mounting surface which is in contact with the LED connecting plate 2 is provided with a plurality of rows of grid-shaped heat dissipating ribs.
  • the thermal conductive silver paste is coated on the bottom surface of the high thermal conductive insulating sheet 12, and the LED light source assembly 1 is combined with high temperature pressing (also known as thermal pressing or high temperature penetration), welding bonding or superglue bonding.
  • the heat sink 3 is combined.
  • the substrate 22 of the LBD coupling plate 2 of the high heat dissipation high-power LED light source assembly of the present embodiment is a resin material film having a thickness of about 0.2
  • the coupling circuit 21 is a copper foil circuit printed on the surface of the substrate 22.
  • a surface of the insulating film is attached to the surface of the connecting circuit 21 and the substrate 22 to form the surface insulating layer 23.
  • a strong adhesive layer is applied on the mounting surface of the LED connecting plate 2, and the LED connecting plate 2 is pressed by high temperature (also known as thermocompression or high temperature penetration), welded bonding, superglue bonding, riveting Or a threaded structure (screw or screw) is fixed in a certain area of the mounting surface of the heat sink 3.
  • the heat dissipation system of the high heat dissipation high-power LED light source assembly in the embodiment forms a heat dissipation path of a "clad-type LED light source ⁇ a high thermal conductive insulating sheet 12 ⁇ a heat sink 3 ⁇ an external", and the path is not connected by the LED.
  • the adhesion between the substrate 22 of the board 2 and the heat sink 3 is affected, and the heat dissipation link is stable and reliable.
  • the heat dissipating base 112 of the LED chip 111 and the high thermal conductive insulating sheet 12 are combined into a whole by high temperature pressing (also known as thermocompression or high temperature penetration), welding bonding or superglue bonding, and the entire heat dissipating system can be regarded as "LED chip 111".
  • high temperature pressing also known as thermocompression or high temperature penetration
  • welding bonding or superglue bonding the entire heat dissipating system can be regarded as "LED chip 111".
  • the LED connecting plate 1 is used to facilitate the wiring connection and adapt to the non-flat heat sink mounting surface. It has universal utility and is easy to be

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  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)

Abstract

A high heat dissipation LED light source module (1) includes a flip-chip LED light source and a high heat conduction insulating sheet (12). The flip-chip LED light source includes a heat dissipation base (112). The high heat conduction insulating sheet (12) is directly connected with the bottom surface of the heat dissipation base (112).The thermal conductivity of the insulating sheet (12) is between 170 and 237w/ (m ×k). A high heat dissipation and high power LED light source assembly includes a connection board (2), a heat sink (3) and a plurality of LED light sources.

Description

一种高散热的 LED光源组合体及高散热大功率 LED光源組件 技术领域  High heat dissipation LED light source assembly and high heat dissipation high power LED light source component
本发明属于半导体照明应用技术领域，尤其涉及高散热的 LED光源组合体及高散 热大功率 LED光源组件。  The invention belongs to the technical field of semiconductor lighting applications, and particularly relates to a high heat dissipation LED light source assembly and a high heat dissipation high power LED light source assembly.
背景技术 Background technique
发光二极管（ LED )技术始于 20世纪 60年代末， 经过半个世纪的迅速发展， LED 光源， 特别是大功率高亮 LED光源， 以其光效高、 体积小、 使用寿命长， 以及环保节 能等多方面优点， 在照明光源领域占据了重要位置， 并且仍在持续迅速发展中。  Light-emitting diode (LED) technology began in the late 1960s. After half a century of rapid development, LED light sources, especially high-power high-brightness LED light sources, have high luminous efficiency, small size, long service life, and environmental protection and energy saving. And many other advantages, occupy an important position in the field of lighting sources, and continue to develop rapidly.
最初的 LBD照明产品， 其 LED光源直接封装于金属质的灯体内部。但现在市面上 应用最广泛的大功率 LED (额定功率 1W以上）， 采用的多为覆晶式封装， 即将 LED芯 片封装于散热底座， 通过金丝连接到 LED引脚， 散热底座嵌入塑料外壳， 再以树脂或 硅胶材料封住 LED芯片形成的 LED光源。为保护 LED芯片， 光源内还封装了抗静电放 电 （ESD )二极管等电气元器件。 为方便布线， 节约空间， 大部分 LED光源的散热底 座采用金属材质（主要为铜质或铝盾）， 并与 LED光源的一个电极导通。 因此， 当 LED 光源与金属或合金庸的散热体接触时，必须考虑电路的绝缘保护，费时费力且安全性、 稳定性不高， 且各 LED之间的电路联接比较繁杂。  In the original LBD lighting products, the LED light source was directly packaged inside a metal lamp body. But nowadays, the most widely used high-power LEDs (rated at more than 1W) are mostly flip-chip packages, that is, the LED chips are packaged on the heat dissipation base, connected to the LED pins through gold wires, and the heat dissipation base is embedded in the plastic case. The LED light source formed by the LED chip is sealed with a resin or a silicone material. To protect the LED chip, electrical components such as antistatic discharge (ESD) diodes are also packaged in the light source. In order to facilitate wiring and save space, the cooling base of most LED light sources is made of metal (mainly copper or aluminum shield) and is electrically connected to one electrode of the LED light source. Therefore, when the LED light source is in contact with the metal or alloy heat sink, the insulation protection of the circuit must be considered, which is time consuming, laborious, safe, and not stable, and the circuit connection between the LEDs is complicated.
现在市面上的 LED照明产品， 大多先将 LED光源封装于线路基板，再将 LED线路 板固定于灯体散热结构上， 以线路基板隔开 LED 光源的散热底座与金属质的灯体结 构， 使其不发生直接接触。 常用的 LED线路板基材有树脂材料、 陶瓷材料、 金属 /合 金材料。  Most of the LED lighting products on the market are first packaged on the circuit substrate, and then the LED circuit board is fixed on the heat dissipation structure of the lamp body, and the heat dissipation base of the LED light source and the metal lamp body structure are separated by the circuit substrate. It does not make direct contact. Commonly used LED circuit board substrates are resin materials, ceramic materials, and metal/alloy materials.
大功率 LED为发热器件， 且其光效、 功耗以及使用寿命受温度影响较大， 因此有 效发散 LED光源产生的热量是提高 LED使用性能的重要因素。  High-power LEDs are heat-generating devices, and their light efficiency, power consumption, and service life are greatly affected by temperature. Therefore, effective heat dissipation from LED light sources is an important factor in improving LED performance.
应用 LED线路基板隔开 LED光源与散热体， 形成 "LED光源—线路基板→散热体—外 界" 的散热路径， 树脂材料、 陶瓷材料导热性差， 考虑到散热， 大多数大功率 LED 光源都应用金属材料的基板。 另一方面， 考虑到 LED光源与线路基板、 线路基板与散 热体之间无法保证贴合， 必然产生较大间隙， 不利于散热， 还需要在接触间隙填充导 热介质， 形成 "LED光源→导热介质→线路基板→导热介质→散热体→外界" 的散热 路径。 该散热路径为多次间接散热， 散热环节多， 散热路径长， 散热效果并不明显； 各接触 面易产生接触间隙， 造成整体有效导热系数下降， 导致 LED结温升高， 光衰增加， 降 低了 LED光源的使用寿命。 发明内容 The LED circuit substrate is used to separate the LED light source and the heat sink to form a heat dissipation path of "LED light source - circuit substrate → heat sink - external". The thermal conductivity of the resin material and the ceramic material is poor, and most of the high power LED light sources are applied with metal in consideration of heat dissipation. The substrate of the material. On the other hand, considering that the LED light source and the circuit substrate, the circuit substrate and the heat sink cannot be bonded together, a large gap is inevitably generated, which is not conducive to heat dissipation, and it is also necessary to fill the contact gap with a heat conductive medium to form an "LED light source → a heat transfer medium. → The heat dissipation path of the circuit board → heat transfer medium → heat sink → outside. The heat dissipation path is multiple indirect heat dissipation, and there are many heat dissipation links, and the heat dissipation path is long, and the heat dissipation effect is not obvious; each contact surface is prone to contact gap, resulting in a decrease in the overall effective thermal conductivity, resulting in an increase in the junction temperature of the LED, an increase in light decay, and a decrease in the heat dissipation path. The service life of the LED light source. Summary of the invention
为了克服现有技术的不足，本发明提供一种高散热的 LED光源組合体及高散热大 功率 LED光源组件， 缩短了导热路径， 改善了散热效果； 保证了照明电路的安全与稳 定； 且有利于模块化生产。  In order to overcome the deficiencies of the prior art, the present invention provides a high heat dissipation LED light source assembly and a high heat dissipation high power LED light source assembly, which shortens the heat conduction path and improves the heat dissipation effect; ensures the safety and stability of the lighting circuit; Conducive to modular production.
本发明的目的是通过以下技术方案实现的：  The object of the invention is achieved by the following technical solutions:
一种高散热的 LED光源組合体， 包括覆晶式 LED光源； 所述覆晶式 LED光源包括 散热底座； 其特征在于： 所述高散热的 LED光源组合体还包括高导热绝缘片； 所述高 导热绝缘片与所述覆晶式 LED光源的散热底座的下表面直接连接； 其中， 所述高导热 绝缘片 ( 1-2 ) 的导热系数在 170-237W/ (m · K)之间。 本发明还提供一种高散热大功率 LED光源组件， 其特征在于： 包括多个上述光源 組合体， 联接板和散热体； 所述 LED光源组合体位于所述联接板上的 LED容置孔内， 且所述 LED光源组合体的高导热绝缘片的下表面与所述散热体直接连接，所述散热体 完全覆盖所有的高导热绝缘片。 本发明结构新颖、 合理、 紧凑， 生产制造容易， 成本低， 使用安装维护方便， 便 于推广应用， 特别适合于大功率 LED照明领域， 与现有所应用的 LED基板比较， 具有 如下有益技术效果：  A high-heat-dissipating LED light source assembly, comprising a flip-chip LED light source; the flip-chip LED light source includes a heat dissipation base; wherein: the high heat dissipation LED light source assembly further comprises a high thermal conductive insulating sheet; The high thermal conductive insulating sheet is directly connected to the lower surface of the heat dissipating base of the flip chip type LED light source; wherein the high thermal conductive insulating sheet (1-2) has a thermal conductivity of between 170 and 237 W/(m·K). The invention also provides a high heat dissipation high power LED light source assembly, comprising: a plurality of the above light source assemblies, a coupling plate and a heat sink; wherein the LED light source assembly is located in the LED receiving hole of the connecting plate And a lower surface of the high thermal conductive insulating sheet of the LED light source assembly is directly connected to the heat sink, and the heat sink completely covers all the high thermal conductive insulating sheets. The invention has the advantages of novel structure, reasonableness and compactness, easy manufacture and low cost, convenient installation and maintenance, convenient promotion and application, and is particularly suitable for the field of high-power LED illumination. Compared with the existing LED substrate, the invention has the following beneficial technical effects:
1、 利用高导热绝缘片 12隔离覆晶式 LBD光源的散热底座 112与散热体 3， 保证 了照明电路的安全与稳定；  1. Using high-heat-conducting insulation sheet 12 to isolate the heat-dissipating base 112 of the flip-chip LBD light source and the heat sink 3 to ensure the safety and stability of the lighting circuit;
2、 "覆晶式 LED光源→高导热绝缘片 12—散热体 3→外界"的导热路径， 导热环 境少， 导热距离短， 并且通过散热体 3上加设的散热筋条或导热管， 增加散热面积， 整个散热系统效率高， 能获得良好的散热效果；  2. The heat conduction path of "Crystalline LED light source → high thermal conductivity insulating sheet 12 - heat sink 3 → external", less heat conduction environment, short heat conduction distance, and increased heat dissipation ribs or heat pipes added to the heat sink 3 The heat dissipation area, the overall heat dissipation system is highly efficient, and can achieve good heat dissipation effect;
3、 覆晶式 LED光源、 高导热绝缘片 12、 散热体 3之间采用热压合、 强力粘合或 高温焊合的连接方式， 保证了各接触面的贴合度， 进一步保证了散热性能；  3. The flip-chip LED light source, the high thermal conductive insulating sheet 12, and the heat dissipating body 3 are connected by thermocompression bonding, strong bonding or high temperature soldering to ensure the conformity of each contact surface and further ensure the heat dissipation performance. ;
4、 LED联接板 2的基板 22不介入导热路径， 对基板 22与散热体 3的贴合度要 求小， 减少了基板 22与散热体 3的加工难度， 有利于控制成本， 提高生产效率； 5、 以 LED联接板 2连接各 LED光源组合体 1 , 使布线联接较为简捷， 同时安装、 更换便捷， 更利于模块化生产。 4. The substrate 22 of the LED connecting plate 2 does not intervene in the heat conduction path, and the bonding degree of the substrate 22 and the heat sink 3 is small, the processing difficulty of the substrate 22 and the heat sink 3 is reduced, and the cost is controlled and the production efficiency is improved; 5. The LED light source assembly 1 is connected by the LED connecting plate 2, so that the wiring connection is relatively simple, and the installation and replacement are convenient, which is more conducive to modular production.
附图说明 DRAWINGS
下面结合附图和实施例对本发明做进一步详细的说明。  The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.
图 1为本发明的 LED光源組合体的一个实施例的结构示意图；  1 is a schematic structural view of an embodiment of an LED light source assembly of the present invention;
图 2为本发明的高散热大功率 LED光源组件的实施例一的立体结构示意图，其中 所迷高散热大功率 LED光源组件具有安装在同一平面内，且照射方向相同的多个光源 组合体；  2 is a schematic perspective view of a first embodiment of a high heat dissipation high power LED light source assembly according to the present invention, wherein the high heat dissipation high power LED light source assembly has a plurality of light source assemblies mounted in the same plane and having the same illumination direction;
图 3为图 2所示高散热大功率 LED光源组件的局部剖视图；  3 is a partial cross-sectional view of the high heat dissipation high power LED light source assembly shown in FIG. 2;
图 4为图 2所示高散热大功率 LED光源组件的局部散热路径示意图；  4 is a schematic diagram of a partial heat dissipation path of the high heat dissipation high power LED light source assembly shown in FIG. 2;
图 5为本发明的高散热大功率 LED光源组件的实施例二的立体结构示意图，其中 所述高散热大功率 LED光源组件具有安装在不同平面内，且照射方向不同的多个光源 组合体；  5 is a schematic perspective view of a second embodiment of a high heat dissipation high power LED light source assembly according to the present invention, wherein the high heat dissipation high power LED light source assembly has a plurality of light source assemblies installed in different planes and having different illumination directions;
图 6为图 5所示高散热大功率 LED光源组件的局部散热路径示意图；  6 is a schematic diagram of a partial heat dissipation path of the high heat dissipation high power LED light source assembly shown in FIG. 5;
其中的附图标记如下：  The reference numerals are as follows:
1 LED光源组合体  1 LED light source assembly
111 LED芯片  111 LED chip
112 散热底座  112 cooling base
113 LED引脚  113 LED pin
12 高导热绝缘片  12 high thermal insulation sheet
2 LED联接板，  2 LED link plate,
21 联接电路，  21 connection circuit,
22 基板，  22 substrates,
23 表面绝缘层，  23 surface insulation,
3散热体。 具体实施方式 如图 1所示，在本发明的 LED光源组合体的一个实施例中， 高散热的 LBD光源组 合体 1包括覆晶式 LED光源和高导热绝缘片 12; 覆晶式 LED光源包括 LED芯片 111 , 散热底座 112和 LED引脚 113; LED芯片 111与散热底座 112上表面直接连接。 高导热绝缘片 12的导热系数在 170— 237W/ (m . K)之间， 其上表面通过高温压合 (又称热压合或高温渗透）、 焊接结合或强力胶粘合方式结合于覆晶式 LED光源的散 热底座 112底面， 使高导热绝缘片 12完全覆盖覆晶式 LED光源的散热底座 112 , 且 不超出覆晶式 LED光源的底面范围。 3 heat sink. DETAILED DESCRIPTION As shown in FIG. 1 , in one embodiment of the LED light source assembly of the present invention, the high heat dissipation LBD light source assembly 1 includes a flip chip LED light source and a high thermal conductive insulating sheet 12; the flip chip LED light source includes LED chip 111, The heat sink base 112 and the LED pin 113; the LED chip 111 is directly connected to the upper surface of the heat sink base 112. The high thermal conductive insulating sheet 12 has a thermal conductivity of 170-237 W/(m.K), and the upper surface thereof is bonded to the upper surface by high temperature pressing (also known as thermocompression or high temperature penetration), solder bonding or superglue bonding. The bottom surface of the heat dissipation base 112 of the crystalline LED light source completely covers the heat dissipation base 112 of the flip-chip LED light source, and does not exceed the bottom surface range of the flip-chip LED light source.
高导热绝缘片 12为厚度不大于 1瞧的氧化铝薄片， 或厚度不大于 2鎖并经过表 面氧化处理的纯铝薄片， 其形状近似于 LED芯片 111的散热底座 112 , 其大小不超过 覆晶式 LED光源的底面大小。  The high thermal conductive insulating sheet 12 is an alumina flake having a thickness of not more than 1 ,, or a pure aluminum flake having a thickness of not more than 2 locks and subjected to surface oxidation treatment, and the shape thereof is similar to the heat dissipating base 112 of the LED chip 111, and the size thereof does not exceed the flip chip. The size of the bottom surface of the LED light source.
如图 2、 3和 4所示， 在本发明的高散热大功率 LED光源组件的实施例一中， 高 散热大功率 LED光源组件具有 6个光源组合体，且 6个光源组合体安装在同一平面内， 六个照射方向为同一方向。  As shown in FIG. 2, 3 and 4, in the first embodiment of the high heat dissipation high power LED light source assembly of the present invention, the high heat dissipation high power LED light source assembly has six light source assemblies, and the six light source assemblies are installed in the same In the plane, the six illumination directions are in the same direction.
如图 2所示， 本实施例中的高散热大功率 LED光源组件包括 6个光源组合体 1、 平整的刚性 LED联接板 2和具有平整表面的散热体 3。 LED联接板 2上预留有供 LED 光源组合体 1通过的 LED容置孔， LED光源組合体 1通过 LED联接板 2上的 LED容置 孔， 并将 LED光源组合体 1上的高导热绝缘片 12底面以一定手段附加于散热体 3表 面。  As shown in Fig. 2, the high heat dissipation high power LED light source assembly of this embodiment comprises six light source assemblies 1, a flat rigid LED link plate 2 and a heat sink 3 having a flat surface. An LED receiving hole for the LED light source assembly 1 is reserved on the LED connecting plate 2, and the LED light source assembly 1 passes through the LED receiving hole on the LED connecting plate 2, and insulates the high heat conduction on the LED light source assembly 1. The bottom surface of the sheet 12 is attached to the surface of the heat sink 3 by a certain means.
散热体 3采用矩形铝合金散热体， 其完全覆盖 6个高导热绝缘片 12， 且与 LED 联接板 2接触的安装表面相对的另一表面设有多列栅格状散热筋条。  The heat dissipating body 3 adopts a rectangular aluminum alloy heat dissipating body, which completely covers the six high thermal conductive insulating sheets 12, and the other surface opposite to the mounting surface which is in contact with the LED connecting plate 2 is provided with a plurality of rows of grid-shaped heat dissipating ribs.
本实施例中， 采用高温压合（又称热压合或高温渗透 )、 焊接结合或强力胶粘合 的方式， 使散热底座 112、 高导热绝缘片 12、 散热体 3可以结合成一个整体。  In this embodiment, the heat-dissipating base 112, the high-heat-conductive insulating sheet 12, and the heat-dissipating body 3 can be combined into one unit by high-temperature pressing (also referred to as hot pressing or high-temperature penetration), welding bonding or super-adhesive bonding.
如图 3所示， 本实施例中的高散热大功率 LED光源组件的 LED联接板 2的基板 22为厚约 1讓的铝合金薄板， 联接电路 21为铜箔电路， 印刷于基板 22表面， 并在 联接电路 21与基板 22表面喷涂绝缘胶形成表面绝缘层 23。本实施例中， LBD联接板 2 通过高温压合（又称热压合或高温渗透）、 焊接结合、 强力胶粘合、 铆合或螺纹结 构 （螺钉或螺杆） 固定在散热体 3安装表面的一定区域内。  As shown in FIG. 3, the substrate 22 of the LED coupling plate 2 of the high heat dissipation high power LED light source assembly of the present embodiment is an aluminum alloy thin plate having a thickness of about 1, and the coupling circuit 21 is a copper foil circuit printed on the surface of the substrate 22. The surface of the connecting circuit 21 and the substrate 22 is sprayed with an insulating paste to form a surface insulating layer 23. In this embodiment, the LBD connecting plate 2 is fixed on the mounting surface of the heat dissipating body 3 by high temperature pressing (also known as thermocompression or high temperature penetration), welding bonding, superglue bonding, riveting or screwing structure (screw or screw). Within a certain area.
LED联接板 2的 J [关接电路 21上预留有与 LED引脚 113焊接的引脚焊盘 , 以及与 外部电路焊接的外部电路焊盘，所迷坪盘均棵露于表面绝缘层 23之外，将覆晶式 LED 光源的 LED引脚 113焊接于联接电路 21上的引脚焊盘， 实现电路连接。  J of the LED link board 2 [The contact pad 21 has a pad pad soldered to the LED pin 113, and an external circuit pad soldered to the external circuit, and the pad is exposed to the surface insulating layer 23 In addition, the LED pins 113 of the flip-chip LED light source are soldered to the pin pads on the connection circuit 21 to achieve circuit connection.
如图 4所示， 本实施例中的高散热大功率 LED光源组件的散热系统形成 "覆晶 式 LED光源→高导热绝缘片 12 散热体 3→外界"的散热路径，该路径不受 LED联接 板 2的基板 22与散热体 3的贴合度影响， 散热环节稳定可靠。 As shown in FIG. 4, the heat dissipation system of the high heat dissipation high power LED light source assembly in this embodiment forms a "clad The LED light source → the high thermal conductive insulating sheet 12 heat dissipating body 3 → the external heat dissipation path, the path is not affected by the adhesion degree of the substrate 22 of the LED connecting plate 2 and the heat dissipating body 3, and the heat dissipating link is stable and reliable.
LED芯片 111的散热底座 112、 高导热绝缘片 12、散热体 3通过高温压合（又称 热压合或高温渗透）、 焊接结合或强力胶粘合结合成一个散热组合体， 整个散热系统 可视为 "LED芯片 111→散热组合体→外界" 的散热路径， 散热组合体用做增加散热 面积， 整个散热路径散热距离短， 散热环节少， 能保证有效发散覆晶式 LED光源产生 的热量， 达到更好的散热效果。  The heat dissipating base 112 of the LED chip 111, the high thermal conductive insulating sheet 12, and the heat dissipating body 3 are combined into a heat dissipating assembly by high temperature pressing (also known as thermocompression or high temperature penetration), welding bonding or superglue bonding, and the entire heat dissipating system can be It is regarded as the heat dissipation path of "LED chip 111→heat-dissipation assembly→outside". The heat-dissipating assembly is used to increase the heat-dissipation area, the heat dissipation distance of the whole heat-dissipation path is short, and the heat-dissipation link is small, which can effectively dissipate the heat generated by the flip-chip LED light source. Achieve better heat dissipation.
如图 5和 6所示，在本发明的高散热大功率 LED光源组件的实施例二中， 高散热 大功率 LED光源组件具有 12个光源组合体， 且 12个光源组合体安装在不同平面内， 12个照射方向为不同方向。 如图 5所示， 本实施例中的高散热大功率 LED光源组件包括 12个光源组合体 1 柔性 LED联接板 2和具有圆柱形表面的散热体 3 LED联接板 2上预留有供 LED光源 组合体 1通过的 LED容置孔， LED光源组合体 1通过 LBD联接板 2上的 LED容置孔， 并将 LED光源组合体 1上的高导热绝缘片 12底面以一定手段附加于散热体 3表面。 散热体 3采用圆柱形铝合金散热体， 其完全覆盖 12个高导热绝缘片 12 , 且与 LED联 接板 2接触的安装表面相对的内侧表面设有多列栅格状散热筋条。 本实施例中， 在高导热绝缘片 12底面涂覆导热银胶， 并通过高温压合（又称热 压合或高温渗透）、 焊接结合或强力胶粘合的方式使 LED光源组合体 1与散热体 3相 结合。 如图 6所示， 本实施例中的高散热大功率 LED光源组件的 LBD联接板 2的基板 22为厚约 0. 2 的树脂材料薄膜， 联接电路 21为铜箔电路， 印刷于基板 22表面， 并在联接电路 21与基板 22表面贴覆绝缘材料薄膜形成表面绝缘层 23。 在本实施例 中， 在 LED联接板 2的安装面上涂覆强力胶层， LED联接板 2通过高温压合 (又称热 压合或高温渗透）、 焊接结合、 强力胶粘合、 铆合或螺紋结构 （螺钉或螺杆） 方式固 定在散热体 3安装表面的一定区域内。  As shown in FIGS. 5 and 6, in the second embodiment of the high heat dissipation high power LED light source assembly of the present invention, the high heat dissipation high power LED light source assembly has 12 light source assemblies, and the 12 light source assemblies are installed in different planes. , 12 illumination directions are in different directions. As shown in FIG. 5, the high heat dissipation high power LED light source assembly in this embodiment includes 12 light source assemblies 1 and a flexible LED coupling plate 2 and a heat sink body 3 having a cylindrical surface. The LED light source plate 2 is reserved for the LED light source. The LED light source assembly 1 passes through the LED receiving hole on the LBD coupling plate 2, and the bottom surface of the high thermal conductive insulating sheet 12 on the LED light source assembly 1 is attached to the heat sink 3 by a certain means. surface. The heat dissipating body 3 adopts a cylindrical aluminum alloy heat dissipating body, which completely covers the 12 high thermal conductive insulating sheets 12, and the inner side surface opposite to the mounting surface which is in contact with the LED connecting plate 2 is provided with a plurality of rows of grid-shaped heat dissipating ribs. In this embodiment, the thermal conductive silver paste is coated on the bottom surface of the high thermal conductive insulating sheet 12, and the LED light source assembly 1 is combined with high temperature pressing (also known as thermal pressing or high temperature penetration), welding bonding or superglue bonding. The heat sink 3 is combined. As shown in FIG. 6, the substrate 22 of the LBD coupling plate 2 of the high heat dissipation high-power LED light source assembly of the present embodiment is a resin material film having a thickness of about 0.2, and the coupling circuit 21 is a copper foil circuit printed on the surface of the substrate 22. And a surface of the insulating film is attached to the surface of the connecting circuit 21 and the substrate 22 to form the surface insulating layer 23. In this embodiment, a strong adhesive layer is applied on the mounting surface of the LED connecting plate 2, and the LED connecting plate 2 is pressed by high temperature (also known as thermocompression or high temperature penetration), welded bonding, superglue bonding, riveting Or a threaded structure (screw or screw) is fixed in a certain area of the mounting surface of the heat sink 3.
LED联接板 2的联接电路 21上预留有与 LBD引脚 113焊接的引脚焊盘， 以及与 外部电路坪接的外部电路详盘，所述焊盘均裸露于表面绝缘层 23之外，将覆晶式 LED 光源的 LED引脚 113 ;t早接于联接电路 21上的引脚焊盘， 实现电路连接。 本实施例中， 本实施例中的高散热大功率 LED光源组件的散热系统形成 "覆晶式 LED光源→高导热绝缘片 12→散热体 3→外界" 的散热路径， 该路径不受 LED联接板 2的基板 22与散热体 3的贴合度影响， 散热环节稳定可靠。 A pin pad soldered to the LBD pin 113 and a peripheral circuit detail plated to the external circuit are reserved on the coupling circuit 21 of the LED link board 2, and the pads are exposed outside the surface insulating layer 23, The LED pin 113; t of the flip-chip LED light source is connected to the pin pad on the connection circuit 21 to realize the circuit connection. In this embodiment, the heat dissipation system of the high heat dissipation high-power LED light source assembly in the embodiment forms a heat dissipation path of a "clad-type LED light source → a high thermal conductive insulating sheet 12 → a heat sink 3 → an external", and the path is not connected by the LED. The adhesion between the substrate 22 of the board 2 and the heat sink 3 is affected, and the heat dissipation link is stable and reliable.
LED芯片 111的散热底座 112与高导热绝缘片 12通过高温压合（又称热压合或 高温渗透）、 焊接结合或强力胶粘合结合成一个整体， 整个散热系统可视为 "LED 芯 片 111→散热底座 112→散热体 3→外界" 的散热路径， 整个散热路径散热距离短， 散热环节少，能保证有效发散覆晶式 LED光源产生的热量，达到好的散热效果。同时， 利用 LED联接板 1 , 方便布线连接的同时适应了非平整的散热体安装面， 具有适用通 用性， 也易于宍现模块化生产， 有利于控制成本， 提高生产效率。  The heat dissipating base 112 of the LED chip 111 and the high thermal conductive insulating sheet 12 are combined into a whole by high temperature pressing (also known as thermocompression or high temperature penetration), welding bonding or superglue bonding, and the entire heat dissipating system can be regarded as "LED chip 111". → Heat dissipation base 112 → heat sink 3 → external heat dissipation path, the heat dissipation distance of the whole heat dissipation path is short, and the heat dissipation link is small, which can effectively dissipate the heat generated by the flip-chip LED light source and achieve a good heat dissipation effect. At the same time, the LED connecting plate 1 is used to facilitate the wiring connection and adapt to the non-flat heat sink mounting surface. It has universal utility and is easy to be modularized, which is beneficial to control cost and improve production efficiency.

Claims

权利 要 求 Rights request
1、 一种高散热的 LED光源组合体 ( 1 ), 包括覆晶式 LED光源； 所迷覆晶式 LED 光源包括散热底座（1-12 ); 其特征在于：  1. A high heat dissipation LED light source assembly (1) comprising a flip chip LED light source; the covered crystalline LED light source comprises a heat sink base (1-12);
所述高散热的 LED光源组合体 ( 1 )还包括高导热绝缘片 （卜 2 ); 所述高导热绝 缘片 （1-2 )与所述覆晶式 LED光源的散热底座（卜 12 ) 的下表面直接连接； 其中， 所述高导热绝缘片 （ 1-2 ) 的导热系数在 170— 237W/(m . K)之间。  The high heat dissipation LED light source assembly (1) further includes a high thermal conductive insulating sheet (b); the high thermal conductive insulating sheet (1-2) and the heat dissipating base of the flip chip type LED light source (Bu 12) The lower surface is directly connected; wherein the high thermal conductive insulating sheet (1-2) has a thermal conductivity of between 170 and 237 W/(m.K).
2、 根据权利要求 1所述的 LED光源组合体 ( 1 )， 其特征在于：  2. The LED light source assembly (1) according to claim 1, wherein:
所述高导热绝缘片 （1-2 ) 与所述散热底座（1-12 ) 下表面的直接连接， 是采用 高温压合、 焊接结合或强力胶粘合实现的。  The direct connection of the high thermal conductive insulating sheet (1-2) to the lower surface of the heat dissipating base (1-12) is achieved by high temperature pressing, welding bonding or superglue bonding.
3、 根据权利要求 1所述的 LED光源组合体 ( 1 ), 其特征在于：  3. The LED light source assembly (1) according to claim 1, wherein:
所述高导热绝缘片 （1-2 ) 完全覆盖所述散热底座（1-12 )且不超出所述覆晶式 LED光源的底面范围。  The high thermal conductive insulating sheet (1-2) completely covers the heat dissipating base (1-12) and does not extend beyond the bottom surface of the flip chip LED light source.
4、 根据权利要求 1或 2或 3所述的 LED光源组合体 ( 1 )， 其特征在于： 所述高导热绝缘片 （1-2 ) 为厚度不大于 1mm的氧化铝薄片， 或厚度不大于 2腿 并经过表面氧化处理的纯铝薄片。 The LED light source assembly (1) according to claim 1 or 2 or 3, wherein: the high thermal conductive insulating sheet (1-2) is an alumina flake having a thickness of not more than 1 mm, or a thickness of not more than Pure aluminum flakes with 2 legs and surface oxidation treatment.
5、 一种高散热大功率 LED光源组件， 其特征在于： 5. A high heat dissipation high power LED light source assembly, characterized in that:
包括多个如权利要求 1或 2或 3或 4所述的光源组合体 ( 1 ), 还包括联接板（ 2 ) 和散热体（ 3 );  a plurality of light source assemblies (1) according to claim 1 or 2 or 3 or 4, further comprising a coupling plate (2) and a heat sink (3);
所述 LED光源組合体 ( 1 )位于所述联接板（ 2 )上的 LED容置孔内， 且所述 LED 光源组合体 ( 1 ) 的'高导热绝缘片 （1-2 ) 的下表面与所述散热体 ( 3 )直接连接， 所 迷散热体（ 3 )完全覆盖所有的高导热绝缘片 （ 1 - 2 )。  The LED light source assembly (1) is located in the LED receiving hole on the connecting plate (2), and the lower surface of the high thermal conductive insulating sheet (1-2) of the LED light source assembly (1) is The heat sink (3) is directly connected, and the heat sink (3) completely covers all the high heat conductive insulating sheets (1-2).
6、 居权利要求 5所迷的高散热大功率 LED光源組件， 其特征在于： 所述 LED光源组合体 ( 1 ) 的高导热绝缘片 （1 2 ) 的下表面与所述散热体（3 ) 的直接连接， 是采用高温压合、 焊接结合或强力胶粘合实现的。  6. The high heat dissipation high power LED light source assembly according to claim 5, characterized in that: the lower surface of the high thermal conductive insulating sheet (12) of the LED light source assembly (1) and the heat sink (3) The direct connection is achieved by high temperature pressing, welding bonding or superglue bonding.
7、 根据权利要求 5所迷的高散热大功率 LED光源组件， 其特征在于： 所述散热体（ 3 )与所迷联接板（ 2 )接触的安装表面相对的另一表面设有多列栅 格状散热筋条。  7. The high heat dissipation high power LED light source assembly according to claim 5, wherein: the other surface of the heat dissipating body (3) opposite to the mounting surface contacting the coupling plate (2) is provided with a plurality of columns Grid-shaped cooling ribs.
8、 根据权利要求 5所迷的高散热大功率 LED光源组件， 其特征在于： 所述联接板 ( 2 )包括联接电路（ 2-1 ); 所迷光源组合体 ( 1 )通过联接电路（ 2 - 1 ) 实现电路连接。 8. The high heat dissipation high power LED light source assembly according to claim 5, wherein: the coupling plate (2) comprises a coupling circuit (2-1); and the light source assembly (1) passes through the coupling circuit (2) - 1 ) Implement circuit connections.
9、 根据权利要求 5或 6或 7或 8所述的大功率 LED光源组件， 其特征在于： 所述联接板 ( 2 )是刚性联接板。  9. A high power LED light source assembly according to claim 5 or 6 or 7 or 8, characterized in that said coupling plate (2) is a rigid coupling plate.
10、 根据权利要求 5或 6或 7或 8所述的大功率 LED光源组件， 其特征在于: 所述联接板（ 2 )是柔性联接板。  10. A high power LED light source assembly according to claim 5 or 6 or 7 or 8, characterized in that said coupling plate (2) is a flexible coupling plate.
PCT/CN2008/002028 2008-01-07 2008-12-18 A high heat dissipation led light source module and a high heat dissipation and high power led light source assembly WO2009094829A1 (en)

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