CN219226321U

CN219226321U - LED module with radiator

Info

Publication number: CN219226321U
Application number: CN202223606803.0U
Authority: CN
Inventors: 李晨骋; 万垂铭; 温绍飞; 徐波; 曾照明
Original assignee: APT Electronics Co Ltd
Current assignee: APT Electronics Co Ltd
Priority date: 2022-12-30
Filing date: 2022-12-30
Publication date: 2023-06-20
Anticipated expiration: 2032-12-30

Abstract

The utility model belongs to the technical field of LED integrated packaging, and discloses an LED module with a radiator, which comprises an LED component, a PCB component and the radiator, wherein the PCB component is connected with the radiator, and the LED component is arranged on the PCB component; the LED light reflection layer is connected with the LED substrate, a first LED heat dissipation pad is arranged at the connection part, the LED chip and the LED light conversion element are arranged in the LED light reflection layer, and the LED chip is connected with the first LED heat dissipation pad; an LED electric pad and a second LED heat dissipation pad are arranged below the LED substrate, the LED electric pad is connected with the PCB component through an electric pad eutectic layer, and the second LED heat dissipation pad is connected with the PCB component through a heat dissipation pad eutectic layer; the PCB substrate is connected with the radiator through the heat conducting medium layer and is provided with a radiating module; the utility model is beneficial to improving the heat dissipation effect of the LED and simplifying the mounting process of the LED.

Description

LED module with radiator

Technical Field

The utility model belongs to the technical field of LED integrated packaging, and particularly relates to an LED module with a radiator.

Background

Along with the continuous development of the automobile lighting industry, more and more automobiles can use the LED lighting technology, and the application of standardized LED modules is also increasing, wherein the high-power LED applied to the automobile head lamp has higher heat dissipation requirements, and the high-power LED module integrated with the radiator is developed along with the development.

At present, most LEDs (light emitting diodes) are directly arranged on a radiator, the LEDs and a PCB (printed circuit board) are electrically connected through soldering tin, heat conduction is completed between the LEDs and the radiator through a heat conducting adhesive layer, and the overall heat dissipation effect of the LED module is poor due to the limited heat conduction capacity of the heat conducting adhesive layer; the LED is in a high temperature state for a long time, which reduces the service life of the LED. Meanwhile, the existing integration technology requires LED back mounting and LED front reflow soldering, and is complex.

The LED is directly arranged on the radiator, the bonding pads of the positive electrode and the negative electrode of the LED are wired to the lead area, the metal belt is used for realizing electric connection, and the heat conduction is completed between the LED and the radiator through the heat conduction adhesive layer.

The bonding pads of the positive electrode and the negative electrode of the LEDs are also wired to the lead area, the heat dissipation bonding pads are wired to the heat sink, and the metal belt is used for realizing electric connection and heat conduction.

Therefore, a new technology is needed to solve the problems of poor heat dissipation effect of the LED and relatively complex mounting process in the prior art.

Disclosure of Invention

In order to solve the problems in the prior art, the utility model provides an LED module with a radiator, which is beneficial to improving the radiating effect of an LED and simplifying the mounting process of the LED.

The utility model adopts the following technical scheme:

the LED module with the radiator comprises an LED assembly, a PCB assembly and the radiator, wherein the PCB assembly is connected with the radiator, and the LED assembly is arranged on the PCB assembly;

the LED component comprises an LED substrate, an LED light reflection layer, an LED chip and an LED light conversion element, wherein the LED light reflection layer is connected with the LED substrate, a first LED heat dissipation pad is arranged at the joint, the LED chip and the LED light conversion element are embedded in the LED light reflection layer, the LED chip is connected with the first LED heat dissipation pad, and the LED light conversion element is connected with the upper surface of the LED chip;

an LED electric pad and a second LED heat dissipation pad are arranged below the LED substrate, and the LED electric pad is connected with the PCB assembly through an electric pad eutectic layer; the second LED heat dissipation pad is connected with the PCB assembly through a heat dissipation pad eutectic layer;

the PCB assembly comprises a conductive module and a heat dissipation module, wherein the conductive module comprises a PCB substrate and a printed circuit layer, the PCB substrate is connected with the heat radiator through a heat conducting medium layer, the printed circuit layer is connected with the PCB substrate, and the PCB substrate is provided with the heat dissipation module.

Further, the heat dissipation module is arranged on the upper surface of the PCB substrate, and the heat dissipation module is connected with the heat dissipation pad eutectic layer.

In addition, the heat dissipation module is embedded in the PCB substrate, the lower surface of the heat dissipation module is connected with the heat conducting medium layer, and the upper surface of the heat dissipation module is connected with the heat dissipation pad eutectic layer. Specifically, the lower surface of the heat dissipation module is flush with the lower surface of the PCB substrate.

Further, the printed circuit layer comprises a lead part and an insulating part, the insulating part is arranged on the upper surface of the PCB substrate, the lead part is arranged in the insulating part, the lead part is connected with the electric welding plate eutectic layer, and the lead part is provided with a positive electrode lead and a negative electrode lead.

Further, the LED electric welding disk is provided with a plurality of LED electric welding disks, and the LED electric welding disk is provided with an anode welding disk and a cathode welding disk.

Further, the upper surface of the heat dissipation module is flush with the upper surface of the printed circuit layer, and the size of the upper surface of the heat dissipation module is not smaller than that of the lower surface of the second LED heat dissipation pad.

Further, the heat dissipation module upper surface is aligned with the second LED heat dissipation pad lower surface.

Further, the heat dissipation module and the PCB substrate are integrally pressed with alloy, and the total thickness is 1-2 mm, wherein the thickness of the heat dissipation module is 0.15-0.3 mm.

Further, the heat dissipation module material is copper or metal with higher heat conductivity coefficient.

Further, the PCB substrate material is aluminum or FR4 material.

Further, the heat conducting medium layer is a heat conducting glue layer or a heat conducting silicone grease layer or a heat conducting gasket.

Further, the radiator is made of copper or aluminum or metal with high heat conductivity coefficient, and the radiator is provided with a plane for mounting the PCB assembly.

Compared with the prior art, the utility model has the beneficial effects that: the LED component is connected with the PCB component through the electric welding plate eutectic layer and the heat dissipation pad eutectic layer, the PCB component is connected with the radiator through the heat conduction medium layer, the heat dissipation module in the PCB component is a primary heat dissipation module, and the radiator is a secondary heat dissipation module; meanwhile, in the integrated process, the direct patch of the utility model can realize heat conduction between the LED component and the heat dissipation module and electric connection between the leads of the PCB component, thereby simplifying the mounting process of the LED.

Drawings

The technology of the present utility model will be described in further detail below with reference to the attached drawings and detailed description:

FIG. 1 is a perspective view of an entirety of an embodiment;

FIG. 2 is a cross-sectional view of an important part of an embodiment of an LED assembly, a PCB assembly and a heat sink;

FIG. 3 is a perspective view of the entirety of the second embodiment;

fig. 4 is a cross-sectional view of an embodiment of a significant portion of an LED assembly, PCB assembly, and heat sink.

Reference numerals:

1-an LED assembly; 11-an LED substrate; 12-an LED light reflecting layer; 13-an LED chip; a 14-LED light conversion element; 15-a first LED heat sink pad; 16-LED electrical pads; 17-a second LED heat sink pad; a 2-PCB assembly; 21-a conductive module; 211-a PCB substrate; 212-a printed circuit layer; 2121-lead portions; 2122-insulator; 22-a heat dissipation module; 3-a eutectic layer; 31-an electric welding disk eutectic layer; 32-a heat dissipation pad work crystal layer; 4-a heat conducting medium layer; 5-heat sink.

Detailed Description

The conception, specific structure, and technical effects produced by the present utility model will be clearly and completely described below with reference to the embodiments and the drawings to fully understand the objects, aspects, and effects of the present utility model. It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. The same reference numbers will be used throughout the drawings to refer to the same or like parts.

It should be noted that, unless otherwise specified, when a feature is referred to as being "fixed" or "connected" to another feature, it may be directly or indirectly fixed or connected to the other feature. Further, the descriptions of the upper, lower, left, right, etc. used in the present utility model are merely with respect to the mutual positional relationship of the constituent elements of the present utility model in the drawings.

Referring to fig. 1 to 4, an LED module with a heat sink includes an LED assembly 1, a PCB assembly 2, and a heat sink 5, the PCB assembly 2 is connected to the heat sink 5, and the LED assembly 1 is disposed on the PCB assembly 2;

the LED assembly 1 comprises an LED substrate 11, an LED light reflection layer 12, an LED chip 13 and an LED light conversion element 14, wherein the LED light reflection layer 12 is connected with the LED substrate 11, a first LED heat dissipation pad 15 is arranged at the joint, the LED chip 13 and the LED light conversion element 14 are embedded in the LED light reflection layer 12, the LED chip 13 is connected with the first LED heat dissipation pad 15, and the LED light conversion element 14 is connected with the upper surface of the LED chip 13;

an LED electric bonding pad 16 and a second LED heat dissipation bonding pad 17 are arranged below the LED substrate 11, and the LED electric bonding pad 16 is connected with the PCB assembly 2 through an electric bonding pad eutectic layer 31; the second LED heat dissipation pad 17 is connected with the PCB assembly 2 through a heat dissipation pad eutectic layer 32; it can be seen that eutectic layer 3 includes an electrical pad eutectic layer 31 and a heat sink pad eutectic layer 32;

the PCB assembly 2 comprises a conductive module 21 and a heat dissipation module 22, the conductive module 21 comprises a PCB substrate 211 and a printed circuit layer 212, the PCB substrate 211 is connected with the heat sink 5 through a heat conducting medium layer 4, the printed circuit layer 212 is connected with the PCB substrate 211, and the PCB substrate 211 is provided with the heat dissipation module 22.

In one embodiment, the LED assembly 1 is soldered to the PCB assembly 2 by the eutectic layer 3, and the PCB assembly 2 is mounted on the heat sink 5 by the layer of thermally conductive medium 4. Further, the LED assembly 1, PCB assembly 2 may be fastened to the heat sink 5 by screws or rivets, etc. The LED light conversion element 14 is provided with at least one, the LED chip 13 is provided with at least one, the first LED heat dissipation pad 15 is provided with at least two, the second LED heat dissipation pad 17 is provided with at least one, and the LED electric pad 16 is provided with at least two.

Referring to fig. 1 to 2, in the first embodiment, the heat dissipation module 22 is disposed on the upper surface of the PCB substrate 211, and the heat dissipation module 22 is connected to the heat dissipation pad eutectic layer 32.

Referring to fig. 3 to 4, in the second embodiment, the heat dissipation module 22 is embedded in the PCB substrate 211 and the printed circuit layer 212, the lower surface of the heat dissipation module 22 is connected to the heat conducting medium layer 4, and the upper surface of the heat dissipation module 22 is connected to the heat dissipation pad eutectic layer 32. Specifically, the lower surface of the heat dissipation module 22 is flush with the lower surface of the PCB substrate 211.

In one embodiment, the printed circuit layer 212 includes a lead portion 2121 and an insulating portion 2122, the insulating portion 2122 is disposed on the upper surface of the PCB substrate 211, the lead portion 2121 is disposed in the insulating portion 2122, the lead portion 2121 is connected to the eutectic layer 31 of the electrical pad, the lead portion 2121 is provided with a positive lead and a negative lead, and the lead portion 2121 and the heat dissipation module 22 are not electrically connected to each other.

In one embodiment, the LED electrical pads 16 are provided in number, and the LED electrical pads 16 are provided with a positive electrode pad and a negative electrode pad. Specifically, lead portion 2121 is aligned with the LED electrical pad 16, wherein the positive lead is connected in alignment with the positive pad of the LED electrical pad 16 and the negative lead is connected in alignment with the negative pad of the LED electrical pad 16.

In one embodiment, the upper surface of the heat dissipating module 22 is flush with the upper surface of the printed circuit layer 212, and in particular, the upper surface of the heat dissipating module 22 is on the same plane as the positive and negative leads of the lead portion 2121. The upper surface size of the heat dissipation module 22 is not smaller than the lower surface size of the second LED heat dissipation pad 17, and the portion of the heat dissipation module 22 not connected to the second LED heat dissipation pad 17 may be covered with a solder resist layer.

In one embodiment, the upper surface of the heat dissipating module 22 is aligned with the lower surface of the second LED heat dissipating pad 17.

In one embodiment, the heat dissipating module 22 and the PCB substrate 211 are integrally pressed with an alloy, and the total thickness is 1-2 mm, wherein the thickness of the heat dissipating module 22 is 0.15-0.3 mm.

In one embodiment, the heat dissipating module 22 is copper or a metal with a high thermal conductivity.

In one embodiment, the PCB substrate 211 material is aluminum or FR4 material.

In one embodiment, the heat conducting medium layer 4 is a heat conducting glue layer or a heat conducting silicone grease layer or a heat conducting gasket.

In one embodiment, the material of the heat sink 5 is copper or aluminum or metal with high heat conductivity, and the heat sink 5 is provided with a plane on which the PCB assembly 2 is mounted.

The LED heat dissipation pad 15 can conduct heat generated by the LED chip 13 and the LED light conversion element 14 during operation to the LED substrate 11, the LED substrate 11 conducts the heat to the second LED heat dissipation pad 17 and the LED electric pad 16, and then conducts the heat to the electric welding pad eutectic layer 31 and the heat dissipation pad eutectic layer 32, and the eutectic layer 3 has a higher heat conductivity coefficient, so that the heat can be conducted to the heat dissipation module 22 and the printed circuit layer 212, and then conducts the heat to the PCB substrate 211 and the heat conduction medium layer 4 and then conducts the heat to the radiator 5, thereby achieving a gradual heat dissipation effect; during the gradual conduction process, a part of heat can be gradually attenuated, but most of the heat is dissipated through the heat dissipation module 22 and the heat sink 5.

Other contents of the LED module with a heat sink according to the present utility model are referred to the prior art, and are not described herein.

The present utility model is not limited to the preferred embodiments, and any modifications, equivalent variations and modifications made to the above embodiments according to the technical principles of the present utility model are within the scope of the technical proposal of the present utility model.

Claims

1. The LED module with the radiator is characterized by comprising an LED assembly, a PCB assembly and the radiator, wherein the PCB assembly is connected with the radiator, and the LED assembly is arranged on the PCB assembly;

2. The LED module with heat sink of claim 1, wherein the heat dissipating module is disposed on the upper surface of the PCB substrate, and the heat dissipating module is connected to the heat dissipating pad eutectic layer.

3. The LED module with the heat sink of claim 1, wherein the heat dissipating module is embedded in the PCB substrate, the lower surface of the heat dissipating module is connected to the heat conducting medium layer, and the upper surface of the heat dissipating module is connected to the heat dissipating pad eutectic layer.

4. The LED module with heat sink of claim 3, wherein the heat sink module lower surface is flush with the PCB substrate lower surface.

5. The LED module with the heat sink according to claim 1, wherein the printed circuit layer includes a lead portion and an insulating portion, the insulating portion is provided on the upper surface of the PCB substrate, the lead portion is provided in the insulating portion, and the lead portion is connected with the eutectic layer of the electrical pad, and the lead portion is provided with a positive electrode lead and a negative electrode lead.

6. The LED module with the heat sink according to claim 1, wherein the LED electric pads are provided in a plurality, and the LED electric pads are provided with a positive electrode pad and a negative electrode pad.

7. The LED module with heat sink of claim 1, wherein the PCB assembly is mounted on the heat sink through the thermally conductive medium layer.

8. The LED module with heat sink of claim 1, wherein the heat sink module upper surface is flush with the printed circuit layer upper surface, and wherein the heat sink module upper surface dimension is not less than the second LED heat sink pad lower surface dimension.

9. The LED module with heat sink of claim 1, wherein the heat sink module upper surface is aligned with the second LED heat sink pad lower surface.

10. The LED module with the heat sink of claim 1, wherein the heat sink module and the PCB substrate are integrally laminated with an alloy having a total thickness of 1-2 mm, wherein the heat sink module has a thickness of 0.15-0.3 mm.