CN210432020U - Double-layer straight-through heat-radiating copper substrate structure - Google Patents
Double-layer straight-through heat-radiating copper substrate structure Download PDFInfo
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- CN210432020U CN210432020U CN201920754762.9U CN201920754762U CN210432020U CN 210432020 U CN210432020 U CN 210432020U CN 201920754762 U CN201920754762 U CN 201920754762U CN 210432020 U CN210432020 U CN 210432020U
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Abstract
Double-deck straight through heat dissipation copper base plate structure, its characterized in that includes: the heat conduction boss copper plate is connected with one side of the double-sided copper-clad glass fiber epoxy resin plate, and the other side of the double-sided copper-clad glass fiber epoxy resin plate is bonded with the epoxy resin film. Wherein, heat conduction boss copper includes: copper, first boss and second boss. Compared with the prior art, the utility model, add double-deck heat conduction lug structure through the design, possess stable CTE value when making the copper base circuit board have higher heat conductivility, satisfy the whole demand of copper base circuit board to the car light hi-lite, improved the life of LED car light and high-power module.
Description
Technical Field
The utility model relates to the field of electronic technology, concretely relates to double-deck straight-through heat dissipation copper base plate structure.
Background
With the current technology of LED lamps becoming mature and the application of LED lamps becoming popular, the current heat dissipation technology is not only based on the packaging structure and materials, but also based on the energy transfer process. The circuit substrate material in the packaging material has new development in recent years, the latest trend points to the overall demand of a metal-based (copper-based/aluminum-based) circuit board for high brightness along with a vehicle lamp, and the traditional metal-based circuit board has heat-conducting property which is influenced by an insulating adhesive between a circuit layer and a substrate layer and is difficult to meet the requirement of the heat-conducting property in the use process of the vehicle and the like.
In order to solve the above problems, we have made a series of improvements.
SUMMERY OF THE UTILITY MODEL
The present invention provides a double-layer through heat-dissipating copper substrate structure to overcome the above-mentioned disadvantages and shortcomings of the prior art.
Double-deck straight through heat dissipation copper base plate structure, its characterized in that includes: the heat conduction boss copper plate is connected with one side of the double-sided copper-clad glass fiber epoxy resin plate, and the other side of the double-sided copper-clad glass fiber epoxy resin plate is bonded with the epoxy resin film;
wherein, heat conduction boss copper includes: the copper plate, first boss and second boss, first boss is located on the copper plate, the second boss is located on the first boss.
Further, the double-sided copper-clad glass fiber epoxy resin board comprises: the circuit board comprises a resin board and a back surface circuit, wherein the back surface circuit is arranged on the resin board.
Further, the epoxy resin film includes: the circuit comprises a resin film and a surface circuit, wherein the surface circuit is arranged on the resin film.
The utility model has the advantages that:
compared with the prior art, the utility model, add double-deck heat conduction lug structure through the design, possess stable CTE value when making the copper base circuit board have higher heat conductivility, satisfy the whole demand of copper base circuit board to the car light hi-lite, improved the life of LED car light and high-power module.
Description of the drawings:
fig. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view of the copper plate.
Fig. 3 is a schematic structural diagram of a heat-conducting boss copper plate.
Fig. 4 is a schematic structural diagram of a double-sided copper-clad glass fiber epoxy resin plate.
Reference numerals:
a heat-conducting boss copper plate 100, a copper plate 110, a first boss 120, and a second boss 130.
A double-sided copper-clad glass fiber epoxy board 200, a resin board 210, and a back wiring 220.
Epoxy film 300, resin film 310, and surface wiring 320.
Detailed Description
The present invention will be further described with reference to the following examples. It should be understood that the following examples are illustrative only and are not intended to limit the scope of the present invention.
Example 1
Fig. 1 is a schematic structural diagram of the present invention. Fig. 2 is a schematic structural view of the copper plate. Fig. 3 is a schematic structural diagram of a heat-conducting boss copper plate. Fig. 4 is a schematic structural diagram of a double-sided copper-clad glass fiber epoxy resin plate.
Double-deck direct heat dissipation copper base plate structure includes: the heat conduction boss copper plate 100 is connected with one side of the double-sided copper-clad glass fiber epoxy resin plate 200, and the other side of the double-sided copper-clad glass fiber epoxy resin plate 200 is bonded with the epoxy resin film 300;
wherein, heat conduction boss copper plate 100 includes: the copper plate 110, the first boss 120 and the second boss 130, the first boss 120 is disposed on the copper plate 110, and the second boss 130 is disposed on the first boss 120.
The double-sided copper-clad glass fiber epoxy resin board 200 includes: a resin board 210 and a back surface wiring 220, the back surface wiring 220 is provided on the resin board 210.
The epoxy film 300 includes: a resin film 310 and a surface circuit 320, the surface circuit 320 is provided on the resin film 310.
The utility model discloses an innovation point lies in the copper base circuit board that adopts double-deck boss. This innovation is based on what is mentioned in the background: the traditional metal-based circuit board is affected by the insulating glue between the circuit layer and the substrate layer, and the heat-conducting property of the traditional metal-based circuit board is difficult to meet the requirement of heat-conducting property in the use process of vehicles and the like. And the principle of the utility model is that: on the heat-conducting boss copper plate 100 with the thickness of 5mm, the specific position of the first boss 120 is marked off and covered, and 0.5mm is etched away, so that the thickness of the whole first boss 120 is 0.5mm temporarily, and the thickness of the remaining copper plate 110 is 4.5 mm.
Secondly, on the basis of the above, the specific position of the second boss 130 is marked off and covered, and etched away by 0.3mm, so that the first boss 120 and the copper plate 110 are simultaneously lowered by 0.3mm, the first boss 120 is still 0.5mm, and the copper plate 110 has a thickness of 4.2 mm. Thereby formed double-deck boss structure, and compared with traditional base plate, the utility model discloses a whole thickness reduces by a wide margin, and the glue of heat conductor is thinner, and this means the utility model discloses a copper base circuit board possesses stable CTE value when having higher heat conductivility, satisfies the whole demand of copper base circuit board to the car lamp hi-lite, has improved the life of LED car light and high-power module.
The above description has been made of the embodiments of the present invention, but the present invention is not limited thereto, and various changes may be made without departing from the spirit of the present invention.
Claims (3)
1. Double-deck straight through heat dissipation copper base plate structure, its characterized in that includes: the heat conduction copper boss plate (100), the double-sided copper-clad glass fiber epoxy resin plate (200) and the epoxy resin film (300), wherein the heat conduction copper boss plate (100) is connected with one side of the double-sided copper-clad glass fiber epoxy resin plate (200), and the other side of the double-sided copper-clad glass fiber epoxy resin plate (200) is bonded with the epoxy resin film (300);
wherein the heat-conductive boss copper plate (100) includes: the copper plate (110), first boss (120) and second boss (130), first boss (120) are located on copper plate (110), second boss (130) are located on first boss (120).
2. The double-layer through heat dissipation copper substrate structure of claim 1, wherein: the double-sided copper-clad glass fiber epoxy resin board (200) comprises: the circuit board comprises a resin board (210) and a back surface circuit (220), wherein the back surface circuit (220) is arranged on the resin board (210).
3. The double-layer through heat dissipation copper substrate structure of claim 1, wherein: the epoxy film (300) includes: the circuit board comprises a resin film (310) and a surface circuit (320), wherein the surface circuit (320) is arranged on the resin film (310).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920754762.9U CN210432020U (en) | 2019-05-24 | 2019-05-24 | Double-layer straight-through heat-radiating copper substrate structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920754762.9U CN210432020U (en) | 2019-05-24 | 2019-05-24 | Double-layer straight-through heat-radiating copper substrate structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210432020U true CN210432020U (en) | 2020-04-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920754762.9U Active CN210432020U (en) | 2019-05-24 | 2019-05-24 | Double-layer straight-through heat-radiating copper substrate structure |
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| CN (1) | CN210432020U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112406243A (en) * | 2020-11-17 | 2021-02-26 | 南京涛博能源科技有限公司 | Graphene insulation heat dissipation partition plate and preparation method and application thereof |
-
2019
- 2019-05-24 CN CN201920754762.9U patent/CN210432020U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112406243A (en) * | 2020-11-17 | 2021-02-26 | 南京涛博能源科技有限公司 | Graphene insulation heat dissipation partition plate and preparation method and application thereof |
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