CN207625874U - A kind of nested composite circuit board - Google Patents
A kind of nested composite circuit board Download PDFInfo
- Publication number
- CN207625874U CN207625874U CN201721859292.XU CN201721859292U CN207625874U CN 207625874 U CN207625874 U CN 207625874U CN 201721859292 U CN201721859292 U CN 201721859292U CN 207625874 U CN207625874 U CN 207625874U
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- layer
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- circuit board
- flexible board
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Abstract
The utility model discloses a kind of nested composite circuit boards,Including core plate,Flexible board and substrate layer,The bottom of the core plate is equipped with flexible board,The flexible board is in the bottom end for being horizontally set on core plate,And it is bonded by glue with core plate,The side of the flexible board is equipped with first surface plate,The first surface plate is in the side for being horizontally set on flexible board,And it is fixed by screws with flexible board,The bottom end of the first surface plate is equipped with the first flexible layer,This kind of nested composite circuit board is at low cost,With good flexibility,This kind of circuit board can be passed through extrusion forming,To carry out nesting,It is easy to use,It is not fixed nested form,But pass through extrusion forming,Being expressed to needs nested shape,It is complete nested to carry out,Again by being expressed to original shape after use,Convenience in transport,Turn-on power is carried out by conductive layer in circuit board,With preferable electric conductivity.
Description
Technical field
The utility model is related to composite circuit board technical field, specially a kind of nested composite circuit board.
Background technology
So-called nested composite circuit board is exactly the electronic product used in terms of electronic technology, fast with electronic technology
Speed development, modern electronic product becomes smaller and smaller, and function becomes increasingly complex, and acts to electronic component to support and interconnection
Printed circuit board (PCB) develops to two-sided, multilayer from single side, develops to high-precision, high density and high reliability direction, volume is not
Disconnected to reduce, it has adapted to the needs that current electronic product develops to high density and high reliability, miniaturization, lightweight direction, with
The development of science and technology, such composite circuit board is also more and more, and function is also stronger and stronger, and wherein nested is compound
Circuit board is also more.
Existing nested composite circuit board is typically all fixed nested shape, does not have flexible and convenient performance, makes
In, heat dissipation effect is poor, reduces the service life of device, and installation cost is higher.
So how to design a kind of nested composite circuit board, becoming us will currently solve the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of nested composite circuit boards, to solve to propose in above-mentioned background technology
The problem of.
To achieve the above object, the utility model provides the following technical solutions：A kind of nested composite circuit board, including core
The bottom of plate, flexible board and substrate layer, the core plate is equipped with flexible board, and the flexible board is in the bottom end for being horizontally set on core plate,
And bonded by glue with core plate, the side of the flexible board is equipped with first surface plate, and the first surface plate is in horizontally disposed
It being fixed by screws in the side of flexible board, and with flexible board, the bottom end of the first surface plate is equipped with the first flexible layer,
First flexible layer is bonded with flexible board by glue, and the bottom of first flexible layer is equipped with adhesive linkage and the second flexibility
Layer, first flexible layer are connect with the second flexible layer by adhesive linkage, and the bottom of second flexible layer is equipped with second surface
Plate, the second surface plate are fixed by screws with flexible board, and the side of the flexible board is equipped with holding tank, the receiving
The side of slot be equipped with it is copper-based, the copper-based insertion is arranged in the centre position of holding tank, and engages with holding tank, the substrate layer
Bottom be equipped with conductive layer, the conductive layer is in be horizontally set on the bottom end of substrate layer, and bonded by glue with substrate layer, institute
It states substrate layer to be fixed by screws with flexible board, the side of the conductive layer is equipped with perforation and conducting resinl, the conducting resinl
Fixation is fitted closely with conductive layer, the bottom of the conductive layer is equipped with cooling fin, and the cooling fin is in be horizontally set on conductive layer
Bottom, and be fixed by screws with conductive layer.
Further, the top of the flexible board is equipped with adhering layer, and the adhering layer fits closely fixation with flexible board.
Further, the bottom of the second surface plate is equipped with soft board, and the soft board is in be horizontally set on second surface plate
Bottom end, and be fixed by screws with second surface plate.
Further, the side of the substrate layer is equipped with block tin, and the block tin is vertical setting in one end of substrate layer, and
It is fixed by screws with substrate layer.
Further, the bottom of the cooling fin is equipped with radiator-grid, and the cooling fin is screwed company with radiator-grid
It connects.
Further, the adhesive linkage is made of resin and reinforcing material, thickness 1mm.
Compared with prior art, the utility model has the beneficial effects that：This kind of nested composite circuit board is at low cost, has
Good flexibility, can be easy to use to carry out nesting by this kind of circuit board by extrusion forming, is not fixed nesting
Form, but by extrusion forming, being expressed to needs nested shape, complete nested to carry out, again by being expressed to after use
Original shape, convenience in transport carry out turn-on power in circuit board by conductive layer, have preferable electric conductivity, use cooling fin
It radiates to device, to play the effect of protective device, extends the service life of device, circuit board realizes it by soft board
Flexibility plays a protective role to circuit board in transport.
Description of the drawings
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the limber board partial structural diagram of the utility model；
Fig. 3 is the sectional side view schematic diagram of the utility model.
In figure：1- core plates；2- flexible boards；3- soft boards；4- first surface plates；The first flexible layers of 5-；6- adhesive linkages；7- adhesions
Layer；8- second surface plates；9- is copper-based；10- holding tanks；The second flexible layers of 11-；12- block tins；13- substrate layers；14- conducting resinls；
15- conductive layers；16- perforations；17- cooling fins；18- radiator-grids.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
The every other embodiment obtained, shall fall within the protection scope of the present invention.
- 3 are please referred to Fig.1, the utility model provides a kind of technical solution：A kind of nested composite circuit board, including core plate
1, the bottom of flexible board 2 and substrate layer 13, the core plate 1 is equipped with flexible board 2, and the flexible board 2 is in be horizontally set on core plate 1
Bottom end, and bonded by glue with core plate 1, the side of the flexible board 2 is equipped with first surface plate 4, and the first surface plate 4 is in
It is horizontally set on the side of flexible board 2, and is fixed by screws with flexible board 2, the bottom end of the first surface plate 4 is equipped with
First flexible layer 5, first flexible layer 5 are bonded with flexible board 2 by glue, and the bottom of first flexible layer 5, which is equipped with, glues
Layer 6 and the second flexible layer 11 are connect, first flexible layer 5 is connect with the second flexible layer 11 by adhesive linkage 6, and described second is flexible
The bottom of layer 11 is equipped with second surface plate 8, and the second surface plate 8 is fixed by screws with flexible board 2, the flexible board
2 side is equipped with holding tank 10, and the side of the holding tank 10 is equipped with copper-based 9, and copper-based 9 insertion is arranged in holding tank 10
Centre position, and engage with holding tank 10, the bottom of the substrate layer 13 is equipped with conductive layer 15, and the conductive layer 15 is set in level
It sets in the bottom end of substrate layer 13, and is bonded by glue with substrate layer 13, the substrate layer 13 is screwed with flexible board 2
The side of connection, the conductive layer 15 is equipped with perforation 16 and conducting resinl 14, and the conducting resinl 14 fits closely solid with conductive layer 15
Fixed, the bottom of the conductive layer 15 is equipped with cooling fin 17, the cooling fin 17 be in be horizontally set on the bottom of conductive layer 15, and with
Conductive layer 15 is fixed by screws.
Further, the top of the flexible board 2 is equipped with adhering layer 7, and the adhering layer 7 fits closely solid with flexible board 2
It is fixed, the effect fitted closely is played to circuit board, to enhance flexibility.
Further, the bottom of the second surface plate 8 is equipped with soft board 3, and the soft board 3 is in be horizontally set on second surface
The bottom end of plate 8, and be fixed by screws with second surface plate 8, it shields when device transports.
Further, the side of the substrate layer 13 is equipped with block tin 12, and the block tin 12 is vertical setting in substrate layer 13
One end, and be fixed by screws with substrate layer 13, heat transfer transport carried out to circuit board with block tin 12.
Further, the bottom of the cooling fin 17 is equipped with radiator-grid 18, and the cooling fin 17 passes through spiral shell with radiator-grid 18
Silk is fixedly connected, and the heat generated to circuit board is passed to by radiator-grid 18 in air.
Further, the adhesive linkage 6 is made of resin and reinforcing material, thickness 1mm, and fixed function is played to device,
To make device effectively work.
Operation principle：First, this kind of nested composite circuit board of staff is installed, during the installation process, device
For original state, circuit board bottom soft board 3 is expressed to by staff by way of extruding needs nested shape, is squeezing
Cheng Shi squeezes the first flexible layer 5 and the second flexible layer 11 by adhesive linkage 6, after forming definite shape, then by this kind of electricity
Road plate is nested in the device used, is used, and circuit board works, and at work, power supply is carried out by conductive layer 15
It is powered, then conduction is carried out with conducting resinl 14, power supply is conducted to device on circuit board by copper-based 9, to which circuit board carries out work
Make, generates heat during the work time, so radiating by the cooling fin 17 in circuit board, heat is passed through into radiator-grid again
18 are discharged into air, it will be clear that in radiation processes, since circuit board components distribution relatively dissipates, so using tin
Block 12 carries out heat and is transmitted to cooling fin 17, carries out integral heat sink.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is appreciated that can these embodiments be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaiied
Change, replace and modification, the scope of the utility model are defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of nested composite circuit board, including core plate（1）, flexible board（2）And substrate layer（13）, it is characterised in that：It is described
Core plate（1）Bottom be equipped with flexible board（2）, the flexible board（2）In being horizontally set on core plate（1）Bottom end, and and core plate（1）
It is bonded by glue, the flexible board（2）Side be equipped with first surface plate（4）, the first surface plate（4）In horizontally disposed
In flexible board（2）Side, and and flexible board（2）It is fixed by screws, the first surface plate（4）Bottom end be equipped with the
One flexible layer（5）, first flexible layer（5）With flexible board（2）It is bonded by glue, first flexible layer（5）Bottom
Equipped with adhesive linkage（6）With the second flexible layer（11）, first flexible layer（5）With the second flexible layer（11）Pass through adhesive linkage（6）
Connection, second flexible layer（11）Bottom be equipped with second surface plate（8）, the second surface plate（8）With flexible board（2）It is logical
It crosses screw to be fixedly connected, the flexible board（2）Side be equipped with holding tank（10）, the holding tank（10）Side be equipped with it is copper-based
（9）, described copper-based（9）It is embedded to be arranged in holding tank（10）Centre position, and and holding tank（10）Engaging, the substrate layer
（13）Bottom be equipped with conductive layer（15）, the conductive layer（15）In being horizontally set on substrate layer（13）Bottom end, and and substrate
Layer（13）It is bonded by glue, the substrate layer（13）With flexible board（2）It is fixed by screws, the conductive layer（15）'s
Side is equipped with perforation（16）And conducting resinl（14）, the conducting resinl（14）With conductive layer（15）Fit closely fixation, the conduction
Layer（15）Bottom be equipped with cooling fin（17）, the cooling fin（17）In being horizontally set on conductive layer（15）Bottom, and with lead
Electric layer（15）It is fixed by screws.
2. a kind of nested composite circuit board according to claim 1, it is characterised in that：The flexible board（2）Top
Equipped with adhering layer（7）, the adhering layer（7）With flexible board（2）Fit closely fixation.
3. a kind of nested composite circuit board according to claim 1, it is characterised in that：The second surface plate（8）'s
Bottom is equipped with soft board（3）, the soft board（3）In being horizontally set on second surface plate（8）Bottom end, and with second surface plate（8）
It is fixed by screws.
4. a kind of nested composite circuit board according to claim 1, it is characterised in that：The substrate layer（13）Side
Equipped with block tin（12）, the block tin（12）It is vertical setting in substrate layer（13）One end, and and substrate layer（13）Pass through screw
It is fixedly connected.
5. a kind of nested composite circuit board according to claim 1, it is characterised in that：The cooling fin（17）Bottom
Equipped with radiator-grid（18）, the cooling fin（17）With radiator-grid（18）It is fixed by screws.
6. a kind of nested composite circuit board according to claim 1, it is characterised in that：The adhesive linkage（6）By resin
It is formed with reinforcing material, thickness 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721859292.XU CN207625874U (en) | 2017-12-27 | 2017-12-27 | A kind of nested composite circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721859292.XU CN207625874U (en) | 2017-12-27 | 2017-12-27 | A kind of nested composite circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207625874U true CN207625874U (en) | 2018-07-17 |
Family
ID=62830431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721859292.XU Active CN207625874U (en) | 2017-12-27 | 2017-12-27 | A kind of nested composite circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207625874U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109658831A (en) * | 2018-12-20 | 2019-04-19 | 厦门天马微电子有限公司 | A kind of display panel and display device |
-
2017
- 2017-12-27 CN CN201721859292.XU patent/CN207625874U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109658831A (en) * | 2018-12-20 | 2019-04-19 | 厦门天马微电子有限公司 | A kind of display panel and display device |
| CN109658831B (en) * | 2018-12-20 | 2021-05-04 | 厦门天马微电子有限公司 | Display panel and display device |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: 343600 No. 281, Jingjiu Avenue, Jinggangshan National Economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |