CN207491300U - A kind of epoxy acrylic resin mixed circuit board - Google Patents
A kind of epoxy acrylic resin mixed circuit board Download PDFInfo
- Publication number
- CN207491300U CN207491300U CN201721424321.XU CN201721424321U CN207491300U CN 207491300 U CN207491300 U CN 207491300U CN 201721424321 U CN201721424321 U CN 201721424321U CN 207491300 U CN207491300 U CN 207491300U
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- layer
- heat dissipating
- acrylic resin
- epoxy acrylic
- bonding sheet
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model is related to a kind of epoxy acrylic resin mixed circuit board, including core plate, upper conductor layer, lower conductor layer, upper insulating medium layer, lower insulating medium layer, upper heat dissipating layer and lower heat dissipating layer；Core plate includes upper substrate, lower substrate, the prepreg for being located in upper and lower base plate and through the upper and lower base plate and the rivet of prepreg；Between upper conductor layer and core plate, it is stacked with heat dissipating layer and upper insulating medium layer respectively from the bottom to top, upper insulating medium layer is alternately combined by one layer of upper ptfe porous membrane and one layer of upper bonding sheet, the upper bonding sheet uses epoxy acrylic resin bonding sheet, and radiating flow passage is equipped in the upper heat dissipating layer；Between lower conductor layer and core plate, it is from top to bottom stacked with lower heat dissipating layer and lower insulating medium layer respectively, lower insulating medium layer is alternately combined by one layer of lower ptfe porous membrane and one layer of lower bonding sheet, lower bonding sheet uses epoxy acrylic resin bonding sheet, and radiating flow passage is equipped in lower heat dissipating layer.
Description
Technical field
The utility model belongs to field of circuit boards, and in particular to a kind of epoxy acrylic resin mixed circuit board.
Background technology
With being constantly progressive for Electronic Design and manufacturing process, electronic product is also gradually to multifunction, densification
And the trend development of high transfer rate.It is since the rapid development of chip miniaturization, data transmission quantity increase again simultaneously
Working frequency of uniting is also higher and higher.
At present, since the electronic component on wiring board is numerous, a large amount of heat can be generated after powered up, and it is current soft
Property wiring board it is substantially athermanous, the heat on wiring board is caused not dissipate not go out, this can not only bring the energy consumption of bigger, also
The service life of component can be substantially reduced.In addition, in transportational process, after core plate receives vibrations, it is easy to cause core plate and alters
Dynamic dislocation.
In consideration of it, propose a kind of epoxy acrylic resin mixed circuit board.
Utility model content
To solve the defects of prior art poor radiation causes wiring board short life and core plate easily to misplace, this practicality is new
Type provides a kind of epoxy acrylic resin mixed circuit board, including core plate, upper conductor layer, lower conductor layer, upper insulating medium layer, under
Insulating medium layer, upper heat dissipating layer and lower heat dissipating layer, the core plate are located at centre, the upper conductor layer and lower conductor layer difference position
In the both sides up and down of core plate；
The core plate includes upper substrate, lower substrate, the prepreg and rivet for being located in upper and lower base plate, the upper base
Plate, lower substrate and prepreg offer rivet hole, and the rivet is through the upper and lower base plate and the rivet of prepreg
Kong Zhong；
Between the upper conductor layer and core plate, it is stacked with heat dissipating layer and upper insulating medium layer respectively from the bottom to top, it is described
Upper insulating medium layer is alternately combined by one layer of upper ptfe porous membrane and one layer of upper bonding sheet, the upper bonding sheet
Using epoxy acrylic resin bonding sheet, radiating flow passage is equipped in the upper heat dissipating layer；
Between the lower conductor layer and core plate, it is from top to bottom stacked with lower heat dissipating layer and lower insulating medium layer respectively, it is described
Lower insulating medium layer is alternately combined by one layer of lower ptfe porous membrane and one layer of lower bonding sheet, the lower bonding sheet
Using epoxy acrylic resin bonding sheet, radiating flow passage is equipped in the lower heat dissipating layer.
Further, it is perfused with ethyl alcohol in the radiating flow passage of the upper heat dissipating layer.
Further, it is perfused with ethyl alcohol in the radiating flow passage of the lower heat dissipating layer.
Further, the top surface of the upper heat dissipating layer and side offer several thermal vias, the lower heat dissipating layer
Bottom surface and side offer several thermal vias.
Further, the core plate offers rivet hole including upper substrate, lower substrate and prepreg.
Further, Anti-dislocation protrusion is equipped on the side of the rivet hole.
Advantageous effect：The utility model good reliability by the setting of rivet hole and rivet, can prevent each layer of core plate
Between play misplace, and by the setting of upper heat dissipating layer and lower heat dissipating layer, the heat dissipation effect of substrate can be effectively improved.
Description of the drawings
Attached drawing 1 is the structure diagram of mixed circuit board in the present embodiment.
Specific embodiment
Embodiment：A kind of epoxy acrylic resin mixed circuit board
Such as Fig. 1, including core plate 1, upper conductor layer 2, lower conductor layer 3, upper insulating medium layer 4, lower insulating medium layer 5, upper dissipate
Thermosphere 6 and lower heat dissipating layer 7, the core plate 1 are located at centre, and the upper conductor layer 2 and lower conductor layer 3 are respectively positioned at core plate 1
Upper and lower both sides.
The core plate 1 includes upper substrate 10, lower substrate 11, is located in the prepreg 12 of upper and lower base plate and rivet 13,
The upper substrate 10, lower substrate 11 and prepreg 12 offer rivet hole, and the rivet 13 is through the upper and lower base plate
With in the rivet hole of prepreg 12.
Between the upper conductor layer 2 and core plate 1, it is stacked with heat dissipating layer 6 and upper insulating medium layer 4 respectively from the bottom to top,
The upper insulating medium layer 4 is alternately combined by one layer of upper ptfe porous membrane 40 and one layer of upper bonding sheet 41, institute
It states bonding sheet 41 and uses epoxy acrylic resin bonding sheet, radiating flow passage 60 is equipped in the upper heat dissipating layer 6.
Between the lower conductor layer 3 and core plate 1, it is from top to bottom stacked with lower heat dissipating layer 7 and lower insulating medium layer 5 respectively,
The lower insulating medium layer 5 is alternately combined by one layer of lower ptfe porous membrane 50 and one layer of lower bonding sheet 51, institute
It states lower bonding sheet 51 and uses epoxy acrylic resin bonding sheet, radiating flow passage is equipped in the lower heat dissipating layer 7.
Wherein, ethyl alcohol is perfused in the radiating flow passage of the upper heat dissipating layer 6, is filled in the radiating flow passage of the lower heat dissipating layer 7
It is marked with ethyl alcohol.
In addition, the top surface and side of the upper heat dissipating layer 6 offer several thermal vias, the bottom surface of the lower heat dissipating layer
Several thermal vias are offered with side.The core plate 1 is opened up including upper substrate 10, lower substrate 11 and prepreg 12
There is rivet hole, in order to prevent the play between every layer, Anti-dislocation protrusion 13 is equipped on the side of rivet hole.
The utility model is described in detail above, it is described above, only the preferred embodiment of the utility model and
, it is when the utility model practical range cannot be limited, i.e., all to make equivalent changes and modifications according to the application range, it all should still belong to this
In utility model covering scope.
Claims (6)
1. a kind of epoxy acrylic resin mixed circuit board, it is characterised in that：Including core plate, upper conductor layer, lower conductor layer, it is upper absolutely
Edge dielectric layer, lower insulating medium layer, upper heat dissipating layer and lower heat dissipating layer, the core plate are located at centre, and the upper conductor layer is under
Conductor layer is located at the both sides up and down of core plate respectively；
The core plate include upper substrate, lower substrate, the prepreg and rivet for being located in upper and lower base plate, the upper substrate, under
Substrate and prepreg offer rivet hole, and the rivet is through in the rivet hole of the upper and lower base plate and prepreg；
Between the upper conductor layer and core plate, it is stacked with heat dissipating layer and upper insulating medium layer respectively from the bottom to top, it is described exhausted
Edge dielectric layer is alternately combined by one layer of upper ptfe porous membrane and one layer of upper bonding sheet, and the upper bonding sheet uses
Epoxy acrylic resin bonding sheet is equipped with radiating flow passage in the upper heat dissipating layer；
Between the lower conductor layer and core plate, it is from top to bottom stacked with lower heat dissipating layer and lower insulating medium layer respectively, it is described lower exhausted
Edge dielectric layer is alternately combined by one layer of lower ptfe porous membrane and one layer of lower bonding sheet, and the lower bonding sheet uses
Epoxy acrylic resin bonding sheet is equipped with radiating flow passage in the lower heat dissipating layer.
2. epoxy acrylic resin mixed circuit board according to claim 1, it is characterised in that：The upper heat dissipating layer dissipates
Ethyl alcohol is perfused in hot flow path.
3. epoxy acrylic resin mixed circuit board according to claim 2, it is characterised in that：The lower heat dissipating layer dissipates
Ethyl alcohol is perfused in hot flow path.
4. the epoxy acrylic resin mixed circuit board according to claims 1 or 2 or 3, it is characterised in that：The upper heat dissipation
The top surface and side of layer offer several thermal vias, and the bottom surface and side of the lower heat dissipating layer offer several heat dissipations and lead to
Hole.
5. epoxy acrylic resin mixed circuit board according to claim 1, it is characterised in that：The core plate includes upper base
Plate, lower substrate and prepreg offer rivet hole.
6. epoxy acrylic resin mixed circuit board according to claim 5, it is characterised in that：On the side of the rivet hole
Side is equipped with Anti-dislocation protrusion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721424321.XU CN207491300U (en) | 2017-10-31 | 2017-10-31 | A kind of epoxy acrylic resin mixed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721424321.XU CN207491300U (en) | 2017-10-31 | 2017-10-31 | A kind of epoxy acrylic resin mixed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207491300U true CN207491300U (en) | 2018-06-12 |
Family
ID=62478366
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721424321.XU Active CN207491300U (en) | 2017-10-31 | 2017-10-31 | A kind of epoxy acrylic resin mixed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207491300U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533363A (en) * | 2020-12-30 | 2021-03-19 | 泰州市博泰电子有限公司 | High-efficient radiating composite circuit board |
| WO2023272677A1 (en) * | 2021-07-01 | 2023-01-05 | 华为技术有限公司 | Printed circuit board and electronic device |
-
2017
- 2017-10-31 CN CN201721424321.XU patent/CN207491300U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112533363A (en) * | 2020-12-30 | 2021-03-19 | 泰州市博泰电子有限公司 | High-efficient radiating composite circuit board |
| WO2023272677A1 (en) * | 2021-07-01 | 2023-01-05 | 华为技术有限公司 | Printed circuit board and electronic device |
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