CN207491321U - A kind of high frequency printed circuit boards of dielectric glass fibre cloth - Google Patents
A kind of high frequency printed circuit boards of dielectric glass fibre cloth Download PDFInfo
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- CN207491321U CN207491321U CN201721424308.4U CN201721424308U CN207491321U CN 207491321 U CN207491321 U CN 207491321U CN 201721424308 U CN201721424308 U CN 201721424308U CN 207491321 U CN207491321 U CN 207491321U
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Abstract
The utility model is related to a kind of high frequency printed circuit boards of dielectric glass fibre cloth, including substrate, upper conductor layer, upper insulating layer, several upper high frequency daughter boards, several upper copper billets, lower conductor layer, lower insulating layer, several lower high frequency daughter boards and several lower copper billets；The top of substrate is stacked prepreg on one, upper prepreg is upper fiberglass cloth, the lower section of substrate is stacked prepreg, lower prepreg is lower fiberglass cloth, heat-resisting paint layer on one is coated with above upper prepreg, heat-resisting paint layer is coated with below lower prepreg；The upper surface of upper insulating layer offers several upper mixed pressure slots and several blind buried via holes, several upper high frequency daughter boards are embedded at one by one in several upper mixed pressure slots, several upper copper billets are embedded at one by one in several blind buried via holes, the lower surface of lower insulating layer offer several lower mixed pressure slots and it is several under blind buried via hole, several lower high frequency daughter boards are embedded at one by one in several lower mixed pressure slots, several lower copper billets be embedded at one by one it is several under in blind buried via hole.
Description
Technical field
The utility model belongs to field of circuit boards, and in particular to a kind of high frequency printed circuit of dielectric glass fibre cloth
Plate.
Background technology
With being constantly progressive for Electronic Design and manufacturing process, electronic product is also gradually to multifunction, densification
And the trend development of high transfer rate.It is since the rapid development of chip miniaturization, data transmission quantity increase again simultaneously
Working frequency of uniting is also higher and higher.
But wiring board under high temperature environment, is susceptible to Circuit Board Trouble, therefore to circuit since heat resistance is poor
Plate heat resistance is also to be strengthened.
In consideration of it, propose a kind of high frequency printed circuit boards of dielectric glass fibre cloth.
Utility model content
To solve the defects of prior art heat resistance is poor, the utility model provides a kind of height of dielectric glass fibre cloth
Frequency printed circuit board, including substrate, upper conductor layer, upper insulating layer, several upper high frequency daughter boards, several upper copper billets, lower conductor layer, under
Insulating layer, several lower high frequency daughter boards and several lower copper billets；
The top of the substrate is stacked prepreg on one, on this prepreg be upper fiberglass cloth, the substrate
Lower section be stacked prepreg, which is lower fiberglass cloth, is coated with above the upper prepreg
There is heat-resisting paint layer on one, heat-resisting paint layer is coated with below the lower prepreg；
The upper conductor layer is formed with conductive pattern, and the lower conductor layer is formed with lower conductive pattern, the upper conductor
Layer and lower conductor layer are located at the both sides up and down of substrate respectively；
The upper insulating layer is covered in upper conductor layer, and the lower insulating layer is covered in lower conductor layer；
The upper surface of the upper insulating layer offers several upper mixed pressure slots and several blind buried via holes, several upper high frequency
Plate is embedded at one by one in several upper mixed pressure slots, and several upper copper billets are embedded at one by one in several blind buried via holes, the lower insulation
Layer lower surface offer several lower mixed pressure slots and it is several under blind buried via hole, several lower high frequency daughter boards be embedded at one by one it is several under
In mixed pressure slot, several lower copper billets be embedded at one by one it is several under in blind buried via hole.
Further, the upper heat-resisting paint layer thickness is 90 ~ 100 nanometers.
Further, the lower heat-resisting paint layer thickness is 90 ~ 100 nanometers.
Further, the substrate thickness is 150 nanometers.
Further, the substrate and the thickness ratio of upper prepreg and lower prepreg are 1.5：1:1.
Further, heat dissipating layer is additionally provided between the upper insulating layer and upper conductor layer, the lower insulating layer is led under
Lower heat dissipating layer is additionally provided between body layer.
Advantageous effect：The utility model good reliability, thermal conductivity are high, insulating properties is good, heat resistance is strong, and can fully release
The stress between resin and glass fibre is put, while improves the heat decomposition temperature of coating itself, heat resistance is strengthened.
Description of the drawings
Attached drawing 1 is the structure diagram of circuit board in the present embodiment.
Specific embodiment
Embodiment：A kind of high frequency printed circuit boards of dielectric glass fibre cloth
Such as Fig. 1, including substrate 1, upper conductor layer 2, upper insulating layer 3, several upper high frequency daughter boards 4, several upper copper billets 5, under lead
Body layer 6, lower insulating layer 7, several lower high frequency daughter boards 8 and several lower copper billets 9.
The top of the substrate 1 is stacked prepreg 10 on one, and prepreg 10 is upper fiberglass cloth on this, described
The lower section of substrate 1 is stacked prepreg 11, the lower prepreg 11 be lower fiberglass cloth, the upper prepreg 10
Top be coated with heat-resisting paint layer 12 on one, the lower section of the lower prepreg 11 is coated with heat-resisting paint layer 13.
The upper conductor layer 2 is formed with conductive pattern, and the lower conductor layer 6 is formed with lower conductive pattern, it is described on lead
Body layer 2 and lower conductor layer 6 are located at the both sides up and down of substrate 1 respectively.
The upper insulating layer 3 is covered in upper conductor layer 2, and the lower insulating layer 7 is covered in lower conductor layer 6.
The upper surface of the upper insulating layer 3 offers several upper mixed pressure slots and several blind buried via holes, several upper high frequencies
Daughter board 4 is embedded at one by one in several upper mixed pressure slots, and several upper copper billets 5 are embedded at one by one in several blind buried via holes, under described
The lower surface of insulating layer 7 offer several lower mixed pressure slots and it is several under blind buried via hole, several lower high frequency daughter boards 8 are embedded at one by one
In several lower mixed pressure slots, several lower copper billets 9 be embedded at one by one it is several under in blind buried via hole.
In the present embodiment, upper 12 thickness of heat-resisting paint layer is 90 ~ 100 nanometers.Lower 13 thickness of heat-resisting paint layer
It is 90 ~ 100 nanometers.1 thickness of substrate is 150 nanometers.The substrate 1 and upper prepreg 10 and lower prepreg 11
Thickness ratio is 1.5：1:1.
In addition, heat dissipating layer is additionally provided between the upper insulating layer 3 and upper conductor layer 2, the lower insulating layer 7 and lower conductor
Lower heat dissipating layer is additionally provided between layer 6.
The utility model is described in detail above, it is described above, only the preferred embodiment of the utility model and
, it is when the utility model practical range cannot be limited, i.e., all to make equivalent changes and modifications according to the application range, it all should still belong to this
In utility model covering scope.
Claims (6)
1. a kind of high frequency printed circuit boards of dielectric glass fibre cloth, it is characterised in that：Including substrate, upper conductor layer, it is upper absolutely
Edge layer, several upper high frequency daughter boards, several upper copper billets, lower conductor layer, lower insulating layer, several lower high frequency daughter boards and several lower copper
Block；
The top of the substrate is stacked prepreg on one, and prepreg is upper fiberglass cloth on this, under the substrate
The stacked prepreg once in side, the lower prepreg are lower fiberglass cloth, and one is coated with above the upper prepreg
Upper heat-resisting paint layer is coated with heat-resisting paint layer below the lower prepreg；
The upper conductor layer is formed with conductive pattern, and the lower conductor layer is formed with lower conductive pattern, the upper conductor layer and
Lower conductor layer is located at the both sides up and down of substrate respectively；
The upper insulating layer is covered in upper conductor layer, and the lower insulating layer is covered in lower conductor layer；
The upper surface of the upper insulating layer offers several upper mixed pressure slots and several blind buried via holes, several upper high frequency daughter boards one
One is embedded in several upper mixed pressure slots, and several upper copper billets are embedded at one by one in several blind buried via holes, the lower insulating layer
Lower surface offer several lower mixed pressure slots and it is several under blind buried via hole, several lower high frequency daughter boards are embedded at several lower mixed pressures one by one
In slot, several lower copper billets be embedded at one by one it is several under in blind buried via hole.
2. the high frequency printed circuit boards of dielectric glass fibre cloth according to claim 1, it is characterised in that：It is described resistance to
Hot thickness of coating layer is 90 ~ 100 nanometers.
3. the high frequency printed circuit boards of dielectric glass fibre cloth according to claim 2, it is characterised in that：It is resistance under described
Hot thickness of coating layer is 90 ~ 100 nanometers.
4. the high frequency printed circuit boards of dielectric glass fibre cloth according to claim 3, it is characterised in that：The substrate
Thickness is 150 nanometers.
5. the high frequency printed circuit boards of dielectric glass fibre cloth according to claim 1, it is characterised in that：The substrate
It is 1.5 with the thickness ratio of upper prepreg and lower prepreg：1:1.
6. according to the high frequency printed circuit boards of any dielectric glass fibre cloth of claim 1-5, it is characterised in that：Institute
It states and heat dissipating layer is additionally provided between insulating layer and upper conductor layer, lower heat dissipation is additionally provided between the lower insulating layer and lower conductor layer
Layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721424308.4U CN207491321U (en) | 2017-10-31 | 2017-10-31 | A kind of high frequency printed circuit boards of dielectric glass fibre cloth |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721424308.4U CN207491321U (en) | 2017-10-31 | 2017-10-31 | A kind of high frequency printed circuit boards of dielectric glass fibre cloth |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207491321U true CN207491321U (en) | 2018-06-12 |
Family
ID=62478355
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721424308.4U Active CN207491321U (en) | 2017-10-31 | 2017-10-31 | A kind of high frequency printed circuit boards of dielectric glass fibre cloth |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207491321U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107960006A (en) * | 2017-11-29 | 2018-04-24 | 苏州诺纳可电子科技有限公司 | A kind of printed circuit board (PCB) |
| CN111970809A (en) * | 2019-05-20 | 2020-11-20 | 鹏鼎控股(深圳)股份有限公司 | High-frequency circuit board and manufacturing method thereof |
-
2017
- 2017-10-31 CN CN201721424308.4U patent/CN207491321U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107960006A (en) * | 2017-11-29 | 2018-04-24 | 苏州诺纳可电子科技有限公司 | A kind of printed circuit board (PCB) |
| CN111970809A (en) * | 2019-05-20 | 2020-11-20 | 鹏鼎控股(深圳)股份有限公司 | High-frequency circuit board and manufacturing method thereof |
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| GR01 | Patent grant |