CN202965394U - Resin-coated copper foil for printed circuit board - Google Patents
Resin-coated copper foil for printed circuit board Download PDFInfo
- Publication number
- CN202965394U CN202965394U CN 201220663856 CN201220663856U CN202965394U CN 202965394 U CN202965394 U CN 202965394U CN 201220663856 CN201220663856 CN 201220663856 CN 201220663856 U CN201220663856 U CN 201220663856U CN 202965394 U CN202965394 U CN 202965394U
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- copper foil
- layer
- resin
- halogen
- circuit board
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Abstract
The utility model discloses a resin-coated copper foil for a printed circuit board, comprising a copper foil, a polyimide layer and a semi-polymerized and semi-cured halogen-free resin layer. According to the resin-coated copper foil disclosed by the utility model, a layer of polyimide precursor composite solution is coated on the copper foil and heated to form the polyimide layer via cyclization reaction, then a layer of halogen-free resin glue solution is coated on the surface of the polyimide layer and roasted to form the semi-polymerized and semi-cured halogen-free resin layer via semi-curing, and a release layer can be coated on the surface of the halogen-free resin layer. The resin-coated copper foil disclosed by the utility model is high in insulating reliability and micro-conducting hole reliability, low in dielectric constant and dielectric loss, excellent in heat resistance and chemical resistance, capable of meeting thickness uniformity control on filling holes and an insulating layer, suitable for efficiently producing micro-holes via laser and finely producing circuits with a higher density, and quite high in processability.
Description
Technical field
The utility model relates to a kind of resin coated copper foil that is used for printed circuit board (PCB) that uses halogen-free resin composition to make.
Background technology
Along with manufacturing technology, material, equipment and the standard evolution of build-up multi layer board of new generation (BUM plate) or high density interconnect (HDI) are ripe, the dominant position of traditional multi-layer sheet manufacturing technology is subject to the challenge of BUM or HDI technology.For the change of meeting BUM or HDI strip, the PCB producer of the more domestic strength that possesses skills begins actively to drop into strength exploitation BUM or HDI plate manufacturing technology.
Resin coated copper foil (RCC) is that build-up multi layer board uses topmost a kind of dielectric material, along with the build-up multi layer board technology develops rapidly and becomes a kind of very important high-grade electronic substrate.RCC is in build-up multi layer board or manufacturing process HDI, replace traditional bonding sheet and the effect of Copper Foil, as dielectric and conductor layer, can adopt compressing together with central layer with the compressing similar technique of traditional multi-layer sheet, make multi-layer sheet, then adopt the on-mechanical drilling technique to form micropore, reach the electrical equipment interconnection, realize closeization of height of PCB.RCC has multiple advantage with respect to the bonding sheet that traditional multi-layer sheet uses for Copper Foil: simplification technique and reducing costs, quality is light, do not contain the reinforcing materials such as glass fibre, dielectric constant is little, dielectric properties are better, are conducive to lightweight and the high frequency of signal transmission and the high speed processing of data signal of PCB; Eliminated the impact of fortifying fibre weavy grain, copper foil surface is more smooth, is conducive to make meticulousr circuit; RCC is fit to the technique of laser and plasma high efficiency manufacture micropore as the multi-layer sheet dielectric.In prior art, RCC is coated on Copper Foil madely equably by resin, generally adopt epoxy resin.
The utility model content
In order to overcome defects, the utility model provides a kind of resin coated copper foil for printed circuit board (PCB), resin coated copper foil for printed circuit board (PCB) of the present utility model has high insulating reliability and micro-via reliability, low-k, low-dielectric loss, heat resistance, chemical resistance are excellent, can satisfy and cram hole and thickness of insulating layer the Uniform Control, be fit to high efficiency laser and make micropore, be fit to more highdensity fine circuitry and make, have quite high processing characteristics.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of resin coated copper foil for printed circuit board (PCB) comprises the Halogen resin bed of Copper Foil, polyimide layer and half polymerization semi-cured state (B-stage), and described polyimide layer is between described Copper Foil and described Halogen resin bed.
Say further, the thickness of described Copper Foil is 3 to 35 microns, and the thickness of described polyimide layer is 5 to 40 microns, and the thickness of described Halogen resin bed is 10 to 60 microns.
Preferably, described Copper Foil is electrolytic copper foil.
Preferably, described polyimide layer is polyimide coating.
Preferably, described Halogen resin bed is the Halogen resinous coat.
Preferably, described Halogen resin layer surface is covered with release layer, and described Halogen resin bed is between described release layer and described polyimide layer.Guarantee that described Halogen resin bed and release layer have good bonding adaptation.
Preferably, described release layer is release liners or mould release membrance.
Preferably, described Copper Foil has two relative surfaces, and one of them surface is coarse surface, and described polyimide layer is formed on the coarse surface of described Copper Foil.
the beneficial effects of the utility model are: the utility model is to apply one deck polyimide precursor composition solution on Copper Foil, and heating makes described one deck polyimide precursor composition solution form polyimide layer through cyclization, then in described polyimide layer surface coating one deck Halogen resin adhesive liquid, and baking makes described one deck Halogen resin adhesive liquid form the Halogen resin bed of half polymerization semi-cured state after semi-solid preparation, and can paste one deck release layer at the Halogen resin layer surface of described half polymerization semi-cured state, therefore resin coated copper foil of the present utility model has high insulating reliability and micro-via reliability, low-k, low-dielectric loss, heat resistance, chemical resistance is excellent, can satisfy and cram hole and thickness of insulating layer the Uniform Control, be fit to high efficiency laser and make micropore, being fit to more highdensity fine circuitry makes, has quite high processing characteristics.
Description of drawings
Fig. 1 is the utility model structural representation.
The specific embodiment
Below by specific instantiation explanation embodiment of the present utility model, those of ordinary skills can understand advantage of the present utility model and effect easily by content disclosed in the present specification.The utility model also can be implemented by other different modes, namely under the category that does not disclose departing from the utility model, can carry out different modifications and change.
Embodiment: a kind of resin coated copper foil for printed circuit board (PCB), as shown in Figure 1, comprise Copper Foil 1, polyimide layer 2 and Halogen resin bed 3, described polyimide layer 2 is between described Copper Foil 1 and described Halogen resin bed 3, and described Halogen resin bed 3 is half polymerization semi-cured state (B-stage).
Wherein, the thickness of described Copper Foil is 3 to 35 microns, and the thickness of described polyimide layer is 5 to 40 microns, and the thickness of described Halogen resin bed is 10 to 60 microns.
Described Copper Foil is electrolytic copper foil, and described polyimide layer is polyimide coating, and described Halogen resin bed is the Halogen resinous coat.
Described Halogen resin bed 3 surface labels are covered with release layer 4, and described Halogen resin bed is between described release layer and described polyimide layer.Described release layer 4 is release liners or mould release membrance.
Described Copper Foil has two relative surfaces, and one of them surface is coarse surface, and described polyimide layer is formed on the coarse surface of described Copper Foil.
the manufacture method of the above-mentioned resin coated copper foil that is used for printed circuit board (PCB) is as follows: use the surface through alligatoring, heat-resisting, the anti-oxidation Copper Foil of processing that waits, apply one deck polyimide precursor composition solution on Copper Foil, and heating makes described one deck polyimide precursor composition solution form polyimide layer through cyclization, then in described polyimide layer surface coating one deck Halogen resin adhesive liquid, this resin is for satisfying the high performance resin composition of particular characteristic requirement, and make described one deck Halogen resin adhesive liquid form the Halogen resin bed of half polymerization semi-cured state of even thickness after semi-solid preparation through the baking oven baking, Halogen resin layer surface in described half polymerization semi-cured state pastes one deck release layer, prevent the material adhesion, protection Halogen resin bed is not contaminated.
Polyimide layer 2 described in the utility model can make the dielectric constant step-down of resin coated copper foil, the dielectric loss step-down, thus the dielectric properties of resin coated copper foil can be better than general resin coated copper foil.
Resin coated copper foil of the present utility model and general resin coated copper foil (being comprised of Copper Foil and resin bed) are done the characteristic comparison, see table 1 for details:
Table 1:
Can find out from the result comparison of table 1, from glass transition temperature, dielectric constant and peel strength, the test result of embodiment is all apparently higher than comparative example, therefore prove structure and the specific Halogen resinous coat of uniqueness of the present utility model, had high insulating reliability and micro-via reliability; Low-k, low-dielectric loss; Copper Foil there is higher adhesion strength; Heat resistance, chemical resistance are excellent; Mobility is better, can satisfy and cram hole and thickness of insulating layer the Uniform Control, is fit to high efficiency laser and makes micropore, is fit to more highdensity fine circuitry and makes; Has quite high processing characteristics.
Claims (8)
1. resin coated copper foil that is used for printed circuit board (PCB), it is characterized in that: comprise the Halogen resin bed of Copper Foil, polyimide layer and half polymerization semi-cured state, described polyimide layer is between described Copper Foil and described Halogen resin bed.
2. the resin coated copper foil for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: the thickness of described Copper Foil is 3 to 35 microns, and the thickness of described polyimide layer is 5 to 40 microns, and the thickness of described Halogen resin bed is 10 to 60 microns.
3. the resin coated copper foil for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: described Copper Foil is electrolytic copper foil.
4. the resin coated copper foil for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: described polyimide layer is polyimide coating.
5. the resin coated copper foil for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: described Halogen resin bed is the Halogen resinous coat.
6. the resin coated copper foil for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: described Halogen resin layer surface is covered with release layer, and described Halogen resin bed is between described release layer and described polyimide layer.
7. the resin coated copper foil for printed circuit board (PCB) as claimed in claim 6, it is characterized in that: described release layer is release liners or mould release membrance.
8. the resin coated copper foil for printed circuit board (PCB) as claimed in claim 1, it is characterized in that: described Copper Foil has two relative surfaces, and one of them surface is coarse surface, and described polyimide layer is formed on the coarse surface of described Copper Foil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220663856 CN202965394U (en) | 2012-12-05 | 2012-12-05 | Resin-coated copper foil for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220663856 CN202965394U (en) | 2012-12-05 | 2012-12-05 | Resin-coated copper foil for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202965394U true CN202965394U (en) | 2013-06-05 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220663856 Expired - Lifetime CN202965394U (en) | 2012-12-05 | 2012-12-05 | Resin-coated copper foil for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202965394U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103847195A (en) * | 2012-12-05 | 2014-06-11 | 昆山雅森电子材料科技有限公司 | Resin coated copper foil for printed circuit board and manufacturing method thereof |
| CN109401654A (en) * | 2017-09-12 | 2019-03-01 | 广东生益科技股份有限公司 | A kind of encapsulation carrier band substrate, double interfaces carrier band and preparation method thereof |
-
2012
- 2012-12-05 CN CN 201220663856 patent/CN202965394U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103847195A (en) * | 2012-12-05 | 2014-06-11 | 昆山雅森电子材料科技有限公司 | Resin coated copper foil for printed circuit board and manufacturing method thereof |
| CN109401654A (en) * | 2017-09-12 | 2019-03-01 | 广东生益科技股份有限公司 | A kind of encapsulation carrier band substrate, double interfaces carrier band and preparation method thereof |
| CN109401654B (en) * | 2017-09-12 | 2021-04-06 | 广东生益科技股份有限公司 | Packaging carrier tape base material, double-interface carrier tape and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130605 |
|
| CX01 | Expiry of patent term |