JP2002151850A - Buildup insulation material and buildup multilayer printed wiring board - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve problems such as warpage, interface peel off at mounting and the complexity of manufacturing processes concerning insulation materials of buildup multilayer printed wiring boards, problems of storage stability of thermosetting resistances for buildup multilayers, and glass cloth-containing type migration and to produce a buildup insulation material and a buildup multilayer printed wiring board which exerts little load on the environment. SOLUTION: An insulation material of an insulation layer, laminated on a core board of a buildup multilayer printed wiring board, is a buildup insulation material composed of a mixture of 20-50 weight parts of flaky inorganic filler, having a means grain size of 15 μm or less and a means aspect ratio (mean grain size/means thickness) of 30 or more, with 100 weight parts of a thermoplastic resin composed of polyaryl ketone resin, having a crystal melting peak temperature of 260 deg.C or more 70-25 wt.% and an amorphous polyimide ether resin 30-75 wt.%. On the core board insulation layers made of the insulation material and conductor layers are laminated alternately and the conductor layers are interconnected with vias to form a buildup multilayer printed wiring board.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a build-up insulating material and a build-up multilayer printed wiring board using the same.

[0002]

2. Description of the Related Art The miniaturization and multi-functionality of electronic devices are accelerating year by year. The key technologies that support it are
It is a semiconductor package and can be said to be a printed wiring board on which electronic components are mounted. With the development of such technology, there is an urgent need for multilayer wiring boards to be made lighter, thinner, shorter and more multifunctional, and in particular, build-up multilayer printed wiring, which is an innovative method for manufacturing multilayer wiring boards. The board is drawing attention.

[0003] The build-up wiring board is basically composed of a core material and a build-up layer, and its manufacturing method is roughly classified into a sequential build-up method and a via sheet laminating method.

[0004] The sequential build-up method is a method in which an insulating layer is applied on a core substrate and a via hole is formed, a via is formed, a conductor is formed, and a circuit is formed successively. This is a method in which a layer is separately formed and then laminated with a core substrate. The formation of the pilot hole is divided into a photo via using a photosensitive resin and a laser via using a non-photosensitive resin.

[0005] The photo via is a method capable of reducing the development cost because the element technology already exists up to the density of the semiconductor chip, while the laser via is a method capable of giving a wide range of material selection.

[0006] The via formation includes a conformal via in which copper is plated along the prepared hole, a filled via formed by filling the prepared hole with a conductive material, and a stud via which forms a projection using a conductive material. Conformal vias are advantageous in cost because they form via-hole conductors simultaneously with circuit conductors.
In the case of filled vias, the upper surface of the via becomes flat, so that the via can be directly overlapped with the via. The formation of the insulating layer includes a liquid resin coating and a film laminating. The liquid resin coating can make the insulating layer thinner and absorbs the unevenness of the lower layer circuit after application to a certain extent, so that it is easy to form a multilayer and easily aim at high density. Since the film lamination uses a film-like insulating layer, the formation of the insulating layer is easy.

Circuit formation is divided into ordinary copper foil + subtractive etching, panel copper plating capable of thinning the conductor layer + subtractive etching, and additive copper plating which is easy to form fine pitch lines. .

As the insulating material of the build-up layer, a photosensitive epoxy resin, a thermosetting epoxy resin, and a thermosetting glass epoxy resin are well-known materials.

[0009]

However, in the case of forming a photosensitive insulating layer, the process is complicated and the substrate is likely to be warped because it is formed of a resin layer having no glass cloth. In addition, interface peeling during mounting due to water absorption of the insulating resin layer poses a problem.

[0010] In order to suppress the warpage of the substrate, the curing shrinkage of the insulating layer resin is reduced, the coating and curing of the insulating layers on both sides are performed simultaneously in the manufacturing process, and the pattern density (remaining copper ratio) of the symmetrical layer on both sides. Measures are taken to ensure consistency as much as possible.

When a thermosetting insulating layer is used, a prepreg in a semi-cured state is used, so that careful attention must be paid to storage stability. Further, the glass cloth-containing type has a problem that it is impossible to cope with high density due to a decrease in insulation due to migration.

In order to ensure flame retardancy, brominated epoxy is often used, and it is desirable to use a non-halogen type resin from the viewpoint of environmental load.

Accordingly, an object of the present invention is to solve the above-mentioned problems and to solve the problems of warpage of the photosensitive insulating material for a build-up multilayer, separation of an interface at the time of mounting, complexity of a manufacturing process, and problems of a build-up multilayer. In addition to improving the storage stability of thermosetting materials and the problem of migration of glass-cloth-containing types, non-halogen, build-up insulating materials with low environmental load such as recyclability and the above-mentioned An object of the present invention is to provide a build-up multilayer printed wiring board free from defects.

[0014]

In order to solve the above-mentioned problems, according to the present invention, an insulating layer and a conductor layer are alternately laminated on a core substrate, and a build-up in which each conductor layer is connected by a via hole. In a build-up insulating material which is a material of an insulating layer laminated on the core substrate of the multilayer printed wiring board, the insulating material has a crystal melting peak temperature of 2
70 to 25% by weight of a polyaryl ketone resin having a temperature of 60 ° C. or more and 30 to 75% by weight of an amorphous polyetherimide resin
With respect to 100 parts by weight of a thermoplastic resin composition comprising
This is an insulating material for build-up, which is an insulating material in which an inorganic filler is mixed in an amount of 20 parts by weight or more and 50 parts by weight or less.

In the above-mentioned insulating material for build-up,
It is preferable to employ a flaky inorganic filler as the inorganic filler. In addition, the scaly inorganic filler has an average particle size of 1
5 μm or less, average aspect ratio (average particle size / average thickness)
It is preferable to use a flaky inorganic filler having a particle size of 30 or more.

According to another aspect of the present invention, there is provided a build-up multilayer printed wiring board in which insulating layers and conductive layers are alternately stacked on a core substrate, and the conductive layers are connected by via holes. The insulating material forming the insulating layer laminated on the core substrate has a crystal melting peak temperature of 26.
20 to 50 parts by weight of an inorganic filler is added to 100 parts by weight of a thermoplastic resin composition comprising 70 to 25% by weight of a polyarylketone resin having a temperature of 0 ° C. or more and 30 to 75% by weight of an amorphous polyetherimide resin. The build-up multilayer printed wiring board is characterized by being an insulating material mixed in parts by weight or less.

As will be apparent from the results of the examples and the like described later, the above-mentioned means can solve the problems of the conventional insulating material for a build-up multilayer printed wiring board and the substrate.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION A resin composition applicable to an insulating material for a build-up multilayer printed wiring board according to the present invention comprises 70 to 25% by weight of a crystalline polyarylketone resin and 30 to 75% by weight of an amorphous polyetherimide resin. % Of the resin composition, and 20 to 50 parts by weight of an inorganic filler mixed with 100 parts by weight of the resin composition. The usual form when used is a film.

Here, the crystalline polyaryl ketone resin is a thermoplastic resin having an aromatic nucleus bond, an ether bond and a ketone bond in its structural unit, and typical examples thereof include polyether ketone, polyether ether ketone, And polyether ketone ketone. Polyetheretherketone is available from VICTREX under the trade name "PE
EK151G, PEEK381G, PEEK450
A commercially available product such as "G" can be used.

The amorphous polyetherimide resin used in the present invention is an amorphous thermoplastic resin having an aromatic nucleus bond, an ether bond and an imide bond in its structural unit, and the type thereof is not particularly limited. Can be used. Such polyetherimides are available under the trade names “Ultem CRS5001” and “Ultem1” manufactured by General Electric.
000 "or the like.

In the above resin composition, when the crystalline polyarylketone resin exceeds 70% by weight or when the amorphous polyetherimide resin is less than 30% by weight, the crystallinity of the whole composition becomes high. It is not preferable because the crystallization rate is increased, the beer strength is reduced during bonding with the copper foil by heat fusion, and delamination between the core substrate and the moisture absorption heat resistance test occurs. When the content of the crystalline polyarylketone resin is less than 25% by weight or the content of the amorphous polyetherimide resin exceeds 75% by weight, the crystallinity itself of the composition as a whole becomes low, and even if the crystal melting peak temperature is lowered. Even at a temperature of 260 ° C. or more, the solder heat resistance is lowered, and the substrate is undesirably deformed in the moisture absorption heat resistance test.

For the above reasons, in the present invention, a mixed composition comprising 70 to 25% by weight of the above-mentioned polyarylketone resin and 30 to 75% by weight of the amorphous polyetherimide resin is suitable.

The scaly inorganic filler to be filled in the above-mentioned resin composition is not particularly limited, and a well-known scaly inorganic filler can be employed. Such flaky inorganic fillers include, for example, talc, mica, mica, glass flake, boron nitride (BN), plate-like calcium carbonate (carbon char), plate-like aluminum hydroxide, plate-like silica,
Plate-like potassium titanate and the like can be mentioned.

These can be used alone or in combination of two or more. In particular,
Average particle size is 15μm or less, aspect ratio (particle size / thickness)
Is preferable because the ratio of the coefficient of linear expansion between the planar direction and the thickness direction can be kept low, and therefore, the warpage of the build-up test substrate described later and the warpage of the entire substrate after the moisture absorption heat resistance test. This is because the number of cycles up to the occurrence of cracks in the thermal shock cycle test can be increased, and the thinning required for the build-up insulating layer can be handled.

The amount of the inorganic filler is 20 to 50 parts by weight based on 100 parts by weight of the resin composition. If it exceeds 50 parts by weight, a problem of poor dispersion of the inorganic filler occurs, and the coefficient of linear expansion tends to vary. If the amount of the inorganic filler is less than 20 parts by weight,
As expected, the effect of lowering the coefficient of linear expansion to improve dimensional stability is small, and in the reflow step or the flow step, which is a component mounting step, internal stress due to the difference in the coefficient of linear expansion occurs, causing warpage of the board and the like. This is because twisting occurs.

In addition to the scaly inorganic filler, spherical silica, tetrapod-like zinc sulfide (ZnS), whisker-like potassium titanate, and aramid nonwoven fabric which is an organic fiber are also the above-mentioned scaly fillers. You may use together.

The resin composition according to the present invention may contain various additives other than other resins and inorganic fillers to such an extent that the effects of the present invention are not impaired. , An ultraviolet absorber, a light stabilizer, a nucleating agent, a coloring agent, a lubricant, a flame retardant and the like may be appropriately blended.

As a method of mixing various additives including an inorganic filler, well-known methods may be employed. For example, (a) various additives may be mixed with a polyarylketone resin and / or an amorphous polyetherimide resin. A masterbatch mixed with a suitable base resin such as a high concentration (typically about 10 to 60% by weight) is separately prepared, and the concentration is adjusted and mixed with the resin to be used. Examples thereof include a method of mechanically blending using a kneader or an extruder, and a method of (b) mechanically blending various additives directly into a resin to be used using a kneader or an extruder.

Among the above mixing methods, a method of preparing and mixing a master batch as shown in (a) is preferable from the viewpoint of dispersibility and workability. Further, the surface of the film may be appropriately subjected to embossing, corona treatment, or the like, for the purpose of improving handling properties and the like.

The composition constituting the core substrate for a build-up multilayer wiring board of the present invention is usually provided as a film or sheet material. As a film forming method, a well-known method, for example, an extrusion casting method using a T-die, a calendar method, or the like can be adopted. In particular, from the viewpoint of sheet forming properties and stable productivity, extrusion using a T-die is possible. It is preferable to adopt a casting method. The molding temperature in the extrusion casting method using a T-die is appropriately adjusted depending on the flow characteristics, film-forming properties, and the like of the composition, but is generally about the melting point or more and 430 ° C. or less. The thickness of this film is usually 25 to 800 μm.

Next, a method of manufacturing a build-up multilayer wiring board using the insulating material according to the embodiment of the present invention will be described below.

[Production Method 1] A copper foil is laminated on one side of the insulating film of the embodiment without an adhesive layer therebetween to form a one-sided copper-clad laminated film, which is laminated on a core substrate by a roll laminating method or a hot pressing method. Thereafter, the copper foil is etched to form a via opening, and then a pilot hole is formed by laser processing. Vias and circuit formation are formed by copper plating and subtractive etching.

[Preparation Method 2] A copper foil is laminated on one side of the insulating film of the embodiment without an adhesive layer therebetween to form a one-sided copper-clad laminated film, and a pilot hole is formed on the resin side by laser processing. A hole is filled with a conductive paste by a printing method to form a via sheet, and the via sheet is laminated on a core substrate by a roll laminating method or a hot pressing method.

[Manufacturing Method 3] After laminating the insulating film of the embodiment on a core substrate by a roll laminating method or a hot pressing method, a via hole is formed by a laser and a circuit is formed by a full additive method.

[Preparation Method 4] After preparing a hole in the insulating film of the embodiment by laser processing or drilling, a copper foil is laminated on one side and a conductive paste is filled into the prepared hole by a printing method to form a via sheet. Then, the via sheet is laminated on the core substrate by a roll laminating method or a hot pressing method.

[Preparation Method 5] A hole is formed in the insulating film of the embodiment by laser processing, filled with a conductive paste and laminated with a copper foil, and then a conductive circuit is formed by subtractive etching. And laminated with another via sheet.

[Manufacturing Method 6] A copper foil having bumps formed by printing with a conductive paste is laminated on one surface of the insulating film of the embodiment to form a via sheet, and the via sheet is formed on a core substrate by a roll laminating method or a hot pressing method. Laminate.

[0038]

EXAMPLES AND COMPARATIVE EXAMPLES [Example 1] A glass epoxy single-sided copper-clad laminate of 250 mm x 250 mm x 0.7 mm in which a copper foil having a thickness of 18 µm was arranged on one side was used.
81, a through-hole reliability evaluation pattern was formed. The laminated board on which the pattern was formed was subjected to soft etching of 2 μm with an organic acid-based etchant to roughen the copper surface. On the roughened copper surface, as shown in Table 1, a polyetheretherketone resin [PEEK450G, manufactured by Victrex, Tg: 147 ° C., Tm:
334 ° C.] (hereinafter abbreviated simply as PEEK), 30 parts by weight, polyetherimide resin [manufactured by General Electric Co., Ultem 1000, Tg: 216 ° C.] (hereinafter abbreviated as PEI) 70 parts by weight and inorganic. A 50 μm thick extruded film composed of 50 parts by weight of a filler (commercial mica, average particle size: 10 μm, aspect ratio: 40) was hot-pressed at 250 ° C. for 30 minutes.
A single-sided build-up test board was obtained. Using the obtained substrate, the following tests 1 to 6 were performed, and the evaluation results such as the evaluated thermal characteristics and reliability tests are shown in Table 1. (1) Glass transition temperature (Tg) Thermal stress strain measuring device (manufactured by Seiko Instruments Inc .:
Using TMA / SS6100), the temperature dependence of the amount of thermal expansion during the heating process was determined, a tangent was drawn on a curve before and after the glass transition point, and Tg was determined from the intersection of the tangents. (2) Coefficient of linear expansion (α _x , α _y ) Thermal stress strain measuring device (manufactured by Seiko Instruments Inc .:
TMA / SS6100) to determine the linear expansion coefficient. Here, the flow direction of the film from the extruder is defined as the X direction, and the direction orthogonal thereto is defined as the Y direction.
A test piece (length: 10 mm, cross-sectional area: 1 mm ² ) was prepared using the film as a strip, fixed at a tensile load of 0.1 g, and heated from room temperature at a rate of 5 ° C./min. I asked. (3) Amount of substrate warpage The amount of substrate warpage was determined in accordance with JIS C6481. A warpage of less than 2 mm was defined as a non-defective product. (4) Moisture absorption heat resistance 121 ° C. × 100 using a pressure cooker tester
% X 48 hours, and then 260 ° C
By immersing in solder for 20 seconds, deformation, warping,
The occurrence of interfacial peeling and the like was visually evaluated and determined. (5) Thermal shock cycle test The sample was subjected to a thermal cycle of −65 ° C. × 5 minutes and 150 ° C. × 5 minutes, and the number of cycles at which resin cracks occurred was measured. (6) Drop impact test A test substrate was dropped on a concrete floor from a height of 0.7 m, and the presence or absence of cracks in the substrate was visually evaluated for judgment.
The test was carried out at N = 10, and when even one crack was found to be defective.

[0039]

[Table 1]

[Embodiment 2] As shown in Table 1, Embodiment 1
In Example 1, a target single-sided build-up test substrate was obtained in the same manner as in Example 1 except that the filling amount of the inorganic filler was changed to 25 parts by weight. Test 1 using the obtained substrate
6 was performed, and the results of the evaluated thermal characteristics and reliability tests are also shown in Table 1.

Example 3 As shown in Table 1, Example 1
In Example 1, a target single-sided build-up test substrate was obtained in the same manner as in Example 1 except that the mixing weight ratio of PEEK and PEI was changed to 60/40 parts by weight. Tests 1 to 6 were performed using the obtained substrate, and the results of the evaluated thermal characteristics and reliability tests were also shown in Table 1.

Comparative Example 1 As shown in Table 1, Example 1
In Example 1, except that the mixing weight ratio of PEEK and PEI was changed to 20/80 parts by weight, a target single-sided build-up test substrate was obtained in the same manner as in Example 1. Tests 1 to 6 were performed using the obtained substrate, and the results of the evaluated thermal characteristics and reliability tests were also shown in Table 1.

Comparative Example 2 As shown in Table 1, Example 1
A target single-sided build-up test substrate was obtained in the same manner as in Example 1, except that an inorganic filler having an average aspect ratio of 20 was used instead of the inorganic filler used in the above.
Tests 1 to 6 were performed using the obtained substrate, and the results of the evaluated thermal characteristics and reliability tests were also shown in Table 1.

Comparative Example 3 As shown in Table 1, Example 1
A target single-sided build-up test substrate was obtained in the same manner as in Example 1, except that the inorganic filler having an average particle size of 20 μm and an aspect ratio of 35 was used instead of the inorganic filler used in Example 1. . Tests 1 to 6 using the obtained substrate
The results of the evaluated thermal characteristics and reliability tests are also shown in Table 1.

Comparative Example 4 As shown in Table 1, Example 1
In Example 1, a target single-sided build-up test substrate was obtained in the same manner as in Example 1 except that the amount of the inorganic filler was changed to 15 parts by weight. Tests 1 to 6 were performed using the obtained substrate, and the results of the evaluated thermal characteristics and reliability tests were shown in Table 1.
Also described in the inside.

Comparative Example 5 As shown in Table 1, Example 1
In Example 1, a target single-sided build-up test substrate was obtained in the same manner as in Example 1 except that the amount of the inorganic filler was changed to 70 parts by weight. Tests 1 to 6 were performed using the obtained substrate, and the results of the evaluated thermal characteristics and reliability tests were shown in Table 1.
Also described in the inside.

Comparative Example 6 As shown in Table 1, Example 1
In Example 1, a target single-sided build-up test substrate was obtained in the same manner as in Example 1 except that the mixing weight ratio of PEEK and PEI was changed to 80/20 parts by weight. Tests 1 to 6 were performed using the obtained substrate, and the results of the evaluated thermal characteristics and reliability tests were also shown in Table 1.

[0048]

According to the invention relating to the insulating material for build-up,
As described above, a thermoplastic resin composition obtained by mixing a predetermined amount of a polyaryl ketone resin having a predetermined crystal melting peak temperature and an amorphous polyetherimide resin is an inorganic filler having predetermined physical properties, preferably Since a predetermined amount of a flaky inorganic filler having an average particle size of 15 μm or less and an average aspect ratio of 30 or more was mixed, storage stability, which was a problem in conventional insulating materials for build-up, migration of glass cloth containing type was problematic. This has the advantage of improving the problem and being a non-halogen, recyclable and low-environmental load build-up insulating material.

Further, the invention relating to the build-up multilayer printed circuit board uses the above-mentioned advantageous insulating material for build-up, so that the warp in the conventional build-up multilayer circuit board using the insulating material, Interface delamination,
Various problems such as complexity of the manufacturing process can be solved.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) C08L 71/00 C08L 71/00 Z 79/08 79/08 B F term (Reference) 4J002 CH09W CM04X CM05X FA016 FD016 GQ01 GQ05 5E346 AA03 AA04 AA12 AA15 AA32 AA43 CC08 CC32 DD13 DD32 EE13 FF01 FF18 FF27 GG02 GG15 GG28 HH11 HH13 HH31

Claims (4)

[Claims] 1. An insulating layer laminated on the core substrate of a build-up multilayer printed wiring board in which insulating layers and conductive layers are alternately laminated on a core substrate, and each conductive layer is connected by a via hole. In a build-up insulating material, the insulating material is composed of 70 to 25% by weight of a polyarylketone resin having a crystal melting peak temperature of 260 ° C. or higher and 30 to 75% by weight of an amorphous polyetherimide resin. An insulating material for build-up, wherein the insulating material is a mixture of 20 parts by weight or more and 50 parts by weight or less of an inorganic filler with respect to 100 parts by weight of a thermoplastic resin composition. 2. The build-up insulating material according to claim 1, wherein the inorganic filler is in the form of scale. 3. The scaly inorganic filler has an average particle size of 15 μm.
m or less, average aspect ratio (average particle diameter / average thickness) is 3
Insulating material for build-up that is 0 or more. 4. In a build-up multilayer printed wiring board in which insulating layers and conductive layers are alternately laminated on a core substrate, and the respective conductive layers are connected by via holes, the insulating layers laminated on the core substrate A thermoplastic resin composition 100 in which the insulating material forming the resin composition comprises 70 to 25% by weight of a polyarylketone resin having a crystal melting peak temperature of 260 ° C. or higher and 30 to 75% by weight of an amorphous polyetherimide resin.
A build-up multilayer printed wiring board comprising an insulating material in which an inorganic filler is mixed in an amount of 20 parts by weight or more and 50 parts by weight or less with respect to parts by weight.