JP5353241B2 - Multilayer printed wiring board and semiconductor device - Google Patents

Abstract

The present invention provides a resin composition which can produce a multilayer printed wiring board not causing peeling and crack in a thermal shock test such as a cooling/heating cycle, and having high heat resistance and low-thermal expansion characteristics, when the resin composition is used for an insulating layer of the multilayer printed wiring board; and also an insulating sheet provided on a base, a prepreg, a multilayer printed wiring board and a semiconductor device using thereof. The resin composition is used for forming an insulating layer of the multilayer printed wiring board, wherein a surface roughness parameter Rvk value of the insulating layer is from 0.1 μm to 0.8 μm, measured after the insulating layer being formed with the resin composition, and subject to roughening treatment.

Description

  The present invention relates to a resin composition, an insulating sheet with a substrate, a prepreg, a multilayer printed wiring board, and a semiconductor device.

  In recent years, with the demand for higher functionality of electronic devices, etc., high-density integration of electronic components, and further high-density mounting, etc. are progressing. Compared to the conventional technology, miniaturization and high density are progressing. As a measure for increasing the density of the printed wiring board and the like, a multi-layer printed wiring board using a build-up method is often employed (for example, see Japanese Patent Application Laid-Open No. 07-106767).

  A multilayer printed wiring board by a build-up method is usually manufactured by laminating an insulating layer made of a resin composition and having a thickness of 100 μm or less and a conductor circuit layer. Moreover, as a connection method between conductor circuit layers, the formation of a via hole by a laser method, a photo method, or the like can be cited instead of the conventional drilling process. These methods achieve high density by freely arranging small-diameter via holes, and various build-up interlayer insulating materials corresponding to each method have been proposed.

Furthermore, fine circuit formation is necessary for increasing the density, and a semi-additive method is widely known as a technique for achieving this. In the semi-additive method, an insulating layer made of an insulating resin is coated on the circuit pattern surface of the inner layer circuit board, followed by a roughening treatment on the surface of the insulating layer, followed by an electroless plating treatment as a base, and a non-circuit using a plating resist. In this method, after the formation portion is protected, the circuit formation portion is thickened (deposited thick) by electroplating, and a conductor circuit is formed on the insulating layer by resist removal and soft etching.
At this time, if the unevenness (surface roughness) of the surface shape after the roughening treatment of the insulating layer is too large, it may cause a delay in the current speed flowing on the copper surface, or may absorb moisture resistance solder heat (after moisture absorption environmental load) This is not preferable because it may cause a decrease in solder heat resistance. However, when the surface roughness of the insulating layer is reduced, the adhesion between the plating metal and the insulating layer is reduced, and there is a problem that defects such as swelling of the plating metal and peeling due to a thermal shock test such as a thermal cycle are likely to occur. .

  The present invention is a multilayer printed wiring board having high adhesion, high heat resistance, low thermal expansion, flame retardancy, and capable of forming a high-density microcircuit when used in an insulating layer of a multilayer printed wiring board. And an insulating sheet with a base material, a prepreg, a multilayer printed wiring board, and a semiconductor device using the resin composition.

Such an object is achieved by the following present inventions [1] to [ 7 ].
[1] A multilayer printed wiring board comprising an insulating layer made of a cured resin composition on one or both surfaces of an inner circuit board, wherein the resin composition has an average particle diameter of 0.01 μm or more and 0.45 μm. The following inorganic filler is 20% by weight to 80% by weight, epoxy resin having a weight average molecular weight of 500 to 5000 is 5% by weight to 50% by weight, and phenoxy resin having a weight average molecular weight of 5000 to 70,000 is 1% by weight. More than 40% by weight and a cyanate resin and / or a prepolymer thereof, and the insulating layer is a cured product having a thickness of 10 to 100 μm obtained by heating and curing the resin composition, and diethylene glycol monobutyl ether 20 to 60 wt%. 3 to 2 of a swelling liquid comprising an aqueous solution containing 0.1 to 1.0 wt% of sodium hydroxide and having a temperature of 50 ° C. After soaking for 3 minutes, a roughening solution composed of an aqueous solution containing 5.0 to 15.0 wt% permanganate and 1.0 to 10.0 wt% sodium hydroxide and having a temperature of 60 ° C. or higher and 90 ° C. or lower is used. The surface roughness parameter Rvk value after the roughening treatment is 0.1 μm or more and 0.8 μm or less after being roughened by at least one of the roughening treatment conditions immersed for ˜40 minutes. A multilayer printed wiring board characterized by that.
[2] A multilayer printed wiring board comprising an insulating layer made of a cured product of a prepreg formed by impregnating a fiber base material with a resin composition on one side or both sides of an inner layer circuit board,
The resin composition comprises an inorganic filler having an average particle size of 0.01 μm or more and 0.45 μm or less, 20 wt% or more and 80 wt% or less, and an epoxy resin having a weight average molecular weight of 500 or more and 5000 or less 5 wt% or more and 50 wt%. 1% by weight to 40% by weight of a phenoxy resin having a weight average molecular weight of 5,000 to 70,000, and a cyanate resin and / or a prepolymer thereof,
The insulating layer is made of an aqueous solution containing 20 to 60% by weight of diethylene glycol monobutyl ether and 0.1 to 1.0% by weight of sodium hydroxide as a cured product having a thickness of 10 to 100 μm obtained by heat-curing the prepreg. After being immersed for 3 to 20 minutes in a swelling liquid at a temperature of not lower than 90 ° C. and lower than or equal to 90 ° C., it is composed of an aqueous solution containing 5.0 to 15.0 wt% permanganate and 1.0 to 10.0 wt% sodium hydroxide, and the temperature is The surface roughness parameter Rvk after the roughening treatment is obtained by performing a roughening treatment under at least one of the roughening treatment conditions, which is immersed in a roughening solution at 60 ° C or higher and 90 ° C or lower for 3 to 40 minutes. A multilayer printed wiring board having a value of 0.1 μm or more and 0.8 μm or less.
[3] The multilayer printed wiring board according to claim 1 or 2, wherein the inorganic filler has a specific surface area of 8 m ² / g or more and 200 m ² / g or less .
[4] The multilayer printed wiring board according to any one of claims 1 to 3, wherein the inorganic filler is spherical silica .
[5] One or more silane couplings in which the resin composition is selected from an epoxy silane coupling agent, an aminophenyl silane coupling agent, an amino silane coupling agent, a mercapto silane coupling agent, and a vinyl silane coupling agent. The multilayer printed wiring board according to any one of claims 1 to 4, comprising an agent .
[6] The multilayer printed wiring board according to any one of claims 1 to 5, wherein the resin composition contains an imidazole compound as a curing accelerator .
[7] A semiconductor device using the multilayer printed wiring board according to any one of items [1] to [6] as a package substrate .

The present invention is a resin composition used for forming an insulating layer of a multilayer printed wiring board, and the surface roughness parameter Rvk value after the roughening treatment when the insulating layer is formed is 0.1 μm or more and 0.8 μm. The resin composition is characterized by the following.
By using the resin composition of the present invention for an insulating layer of a multilayer printed wiring board, the multilayer printed circuit has high adhesion, high heat resistance, low thermal expansion, flame retardancy, and high-density microcircuit formation. A wiring board can be manufactured.

Below, the resin composition of this invention, the insulating sheet with a base material, a prepreg, a multilayer printed wiring board, and a semiconductor device are demonstrated in detail.
The resin composition of the present invention is a resin composition used for forming an insulating layer of a multilayer printed wiring board, and is measured after the insulating layer is formed using the resin composition and roughened. The surface roughness parameter Rvk value is 0.1 μm or more and 0.8 μm or less.
Moreover, the insulating sheet with a base material of the present invention is characterized in that the resin composition of the present invention is supported on a base material.
Furthermore, the prepreg of the present invention is characterized in that a fiber base material is impregnated with the resin composition of the present invention.
The multilayer printed wiring board of the present invention is characterized in that the insulating sheet with a base material of the present invention or the prepreg of the present invention is overlaid on one or both sides of an inner layer circuit board and heated and pressed. Is.
Furthermore, the semiconductor device of the present invention is characterized in that the multilayer printed wiring board of the present invention is used as a package substrate.

First, the resin composition of the present invention will be described. In addition, the content percentage of each component contained in the resin composition is a ratio when the solid content is the total amount (100% by weight), and the solid content is all components except the solvent, not the solvent. Liquid components are also included in the solid content.
The resin composition of the present invention is characterized in that an insulating layer is formed using the resin composition and a surface roughness parameter Rvk value measured after roughening treatment is 0.1 μm or more and 0.8 μm or less. To do. Furthermore, the Rvk value is preferably from 0.15 μm to 0.6 μm, and most preferably from 0.2 μm to 0.5 μm. Here, the surface roughness parameter Rvk value after the roughening treatment when the resin composition is an insulating layer is the particle characteristics of the inorganic filler contained in the resin composition, the type and blending amount of the resin, and the roughening treatment. It depends on the conditions. Therefore, by controlling these conditions, the Rvk value can be within the above range.
The surface roughness parameter Rvk can be measured using WYKO NT1100 manufactured by Veeco. Rvk is called protrusion valley depth, and is defined in JIS B0671-2: 2002 (ISO 13565-2: 1996) as the average depth of the protrusion valley below the core portion of the roughness curve. Ra (arithmetic average roughness) is well known as a parameter indicating the surface roughness, but since Ra is the arithmetic average of roughness, it is difficult to combine with actual material characteristics, and for multilayer printed boards. Rvk is most suitable for comparing the roughened shapes of the insulating layers formed from the resin composition.
If Rvk exceeds the above upper limit value, it is not preferable because it causes a delay in the current speed flowing on the copper surface or causes a decrease in heat resistance of the hygroscopic solder, and if it is less than the lower limit value, This is not preferable because sufficient adhesion cannot be obtained.

The resin composition of the present invention preferably contains an inorganic filler having an average particle size of 0.01 μm or more and 0.45 μm or less. More preferred is an inorganic filler having an average particle size of 0.1 μm or more and 0.4 μm or less. When the average particle diameter exceeds the upper limit, the surface roughness after the roughening treatment may be excessively large because the particles are coarse, and when the average particle diameter is less than the lower limit, the resin composition is excessively small. It becomes difficult to stabilize the dispersion.
The average particle diameter is the median diameter of the volume reference particle diameter, and can be measured by a laser diffraction / scattering method.

The inorganic filler preferably has a specific surface area of 8 m ² / g or more and 200 m ² / g or less. More preferably, the inorganic filler is 10 m ² / g or more and 50 m ² / g or less. If the specific surface area exceeds the above upper limit value, the inorganic fillers tend to aggregate and the structure of the resin composition becomes unstable, which is not preferable. If the specific surface area is less than the lower limit value, the inorganic filler is filled in the resin composition. Since it becomes difficult to do, it is not preferable.
The specific surface area is a BET specific surface area and can be measured by a gas adsorption method (BET method).

The inorganic filler is preferably silica. More preferred is fused silica. Fused silica is superior in low expansion compared to other inorganic fillers.
Examples of the shape of silica include a crushed shape and a spherical shape, and a spherical shape is preferable. When it is spherical, the content of the inorganic filler in the resin composition can be increased, and even in that case, the fluidity is excellent. In addition, the resin composition of the present invention can contain other inorganic fillers such as talc, alumina, glass, mica, aluminum hydroxide, if necessary.

  The inorganic filler is preferably contained in the resin composition of the present invention in a proportion of 20 wt% to 80 wt%. A more preferable content is 25% by weight or more and 70% by weight or less, and most preferably 30% by weight or more and 60% by weight or less. If the content of the inorganic filler exceeds the above upper limit, the fluidity of the resin composition becomes extremely poor. This is not preferable, and if it is less than the lower limit, the resin composition cannot sufficiently increase the strength.

  The resin composition of the present invention comprises at least one silane coupling agent selected from an epoxy silane coupling agent, an aminophenyl silane coupling agent, an amino silane coupling agent, a mercapto silane coupling agent, and a vinyl silane coupling agent. It is preferable to contain. Thereby, the adhesive force of a resin component, an inorganic filler, and a wiring metal can be improved, and the reliability of a resin composition can be improved.

Although it does not specifically limit as content of the said coupling agent, It is preferable that it is 0.05 to 5 weight part with respect to 100 weight part of inorganic fillers. More preferably, it is 0.1 to 2 parts by weight.
If the content of the coupling agent exceeds the above upper limit, cracks are likely to occur in the resin composition, which is not preferable. If the content is less than the above lower limit, the adhesion between the resin component and the inorganic filler or wiring metal is improved. In some cases, sufficient effects cannot be obtained.

  The resin composition of the present invention preferably contains one or more epoxy resins having a molecular weight of 5000 or less. As a result, heat resistance and low heat decomposability can be imparted, and film forming properties when manufacturing an insulating sheet with a base material and adhesion to an inner circuit board when manufacturing a multilayer printed wiring board are improved. Can do.

Although it does not specifically limit as an epoxy resin used with the resin composition of this invention, For example, a phenol novolak type epoxy resin, a bisphenol type epoxy resin, a naphthalene type epoxy resin, an aryl alkylene type epoxy resin etc. are mentioned. Among these, aryl alkylene type epoxy resins are preferable. Thereby, a flame retardance and moisture absorption solder heat resistance can be improved.
Here, the aryl alkylene type epoxy resin refers to an epoxy resin having one or more aryl alkylene groups in the repeating unit, and examples thereof include a xylylene type epoxy resin and a biphenyl dimethylene type epoxy resin. Among these, a biphenyl dimethylene type epoxy resin is preferable. Thereby, a flame retardance can be improved further.
As the biphenyldimethylene type epoxy resin, for example, those represented by the following general formula (I) can be used.

Although n of the biphenyl dimethylene type | mold epoxy resin shown by the said general formula (I) is not specifically limited, 0-10 are preferable and 0-2 are especially preferable.
When the number of n is larger than this, the fluidity of the epoxy resin is lowered, and the moldability may be lowered, which is not preferable.

The weight average molecular weight of the epoxy resin is preferably 5,000 or less. More preferably, it is 500-4,000, Most preferably, it is 800-3,000.
When the weight average molecular weight is less than the above lower limit, when an insulating sheet with a substrate is produced, tackiness may be generated on the surface of the insulating resin layer, and the handleability may be reduced. On the other hand, when the above upper limit is exceeded, the fluidity of the epoxy resin is lowered and the moldability may be lowered, which is not preferable. By making the molecular weight of the epoxy resin within the above range, it is possible to achieve an excellent balance of these characteristics.

Although it does not specifically limit as content of the said epoxy resin, It is preferable that it is 5 to 50 weight% with respect to the whole resin composition. More preferably, it is 10 to 40% by weight.
If the content of the epoxy resin is less than the lower limit, the effect of improving moisture-absorbing solder heat resistance and adhesion may be reduced. Moreover, since the dispersibility of an inorganic filler may worsen when it exceeds the said upper limit, it is unpreferable. By setting the content of the epoxy resin within the above range, it is possible to achieve an excellent balance of these characteristics.

  The resin composition of the present invention preferably contains one or more phenoxy resins having a molecular weight of 5000 or more. Thereby, the film formability at the time of manufacturing the insulating sheet with a base material can be further improved.

The phenoxy resin is not particularly limited.For example, a phenoxy resin having a bisphenol skeleton, a phenoxy resin having a novolac skeleton, a phenoxy resin having an anthracene skeleton, a phenoxy resin having a fluorene skeleton, a phenoxy resin having a dicyclopentadiene skeleton, Examples thereof include a phenoxy resin having a norbornene skeleton, a phenoxy resin having a naphthalene skeleton, a phenoxy resin having a biphenyl skeleton, and a phenoxy resin having an adamantane skeleton.
Examples of the phenoxy resin having a bisphenol skeleton include a phenoxy resin having a bisphenol A skeleton, a phenoxy resin having a bisphenol F skeleton, a phenoxy resin having a bisphenol S skeleton, a phenoxy resin having a bisphenol M skeleton, a phenoxy resin having a bisphenol P skeleton, Examples thereof include phenoxy resin having a bisphenol Z skeleton.
As the phenoxy resin, a structure having a plurality of types of these skeletons can be used, and phenoxy resins having different ratios of the skeletons can be used. Furthermore, a plurality of types of phenoxy resins having different skeletons can be used, a plurality of types of phenoxy resins having different weight average molecular weights can be used, or prepolymers thereof can be used in combination.

Among these, those having a biphenyl skeleton and a bisphenol S skeleton can be used. Thereby, the glass transition temperature can be increased due to the rigidity of the biphenyl skeleton, and the adhesion of the plated metal when the multilayer printed wiring board is manufactured can be improved by the bisphenol S skeleton.
Further, those having a bisphenol A skeleton and a bisphenol F skeleton can be used. Thereby, the adhesiveness to an inner-layer circuit board can be improved at the time of manufacture of a multilayer printed wiring board.
Further, the phenoxy resin having the biphenyl skeleton and the bisphenol S skeleton and the phenoxy resin having the bisphenol A skeleton and the bisphenol F skeleton may be used in combination.

Although it does not specifically limit as molecular weight of the said phenoxy resin, It is preferable that a weight average molecular weight is 5000-70000. More preferably, it is 10,000 to 60000.
If the weight average molecular weight of the phenoxy resin is less than the lower limit, the effect of improving the film forming property may not be sufficient. On the other hand, when the above upper limit is exceeded, the solubility of the phenoxy resin may decrease. By making the weight average molecular weight of the phenoxy resin within the above range, it is possible to achieve an excellent balance of these characteristics.

Although it does not specifically limit as content of a phenoxy resin, It is preferable that it is 1 to 40 weight% of the whole resin composition. More preferably, it is 5 to 30% by weight.
If the content of the phenoxy resin is less than the lower limit, the effect of improving the film forming property may not be sufficient. On the other hand, when the above upper limit is exceeded, the content of the cyanate resin is relatively reduced, and thus the effect of imparting low thermal expansion may be reduced. By making content of a phenoxy resin into the said range, it can be excellent in the balance of these characteristics.

It is preferable that both the epoxy resin and the phenoxy resin used in the composition of the present invention are substantially free of halogen atoms. Thereby, a flame retardance can be provided, without using a halogen compound.
Here, “substantially free of halogen atoms” means, for example, those in which the content of halogen atoms in the epoxy resin or phenoxy resin is 1% by weight or less.

The resin composition of the present invention preferably contains a cyanate resin and / or a prepolymer thereof. Thereby, the flame retardance of a resin composition can be improved.
The method for obtaining the cyanate resin and / or its prepolymer is not particularly limited. For example, the cyanate resin can be obtained by reacting a cyanogen halide with a phenol and prepolymerizing it by a method such as heating as necessary. it can. Moreover, the commercial item prepared in this way can also be used.

Although it does not specifically limit as a kind of cyanate resin, For example, bisphenol-type cyanate resin, such as a novolak-type cyanate resin, bisphenol A-type cyanate resin, bisphenol E-type cyanate resin, tetramethylbisphenol F-type cyanate resin, etc. can be mentioned.
Among these, a novolak type cyanate resin is preferable. Thereby, while being able to improve heat resistance by the increase in a crosslinking density, a flame retardance can further be improved. The novolak-type cyanate resin is considered to have a high proportion of benzene rings due to its structure and easily carbonize.
The novolak type cyanate resin can be obtained, for example, by reacting a novolak type phenol resin with a compound such as cyanogen chloride or cyanogen bromide. Moreover, the commercial item prepared in this way can also be used.

  Here, as the novolac-type cyanate resin, for example, those represented by the following general formula (II) can be used.

Although it does not specifically limit as a weight average molecular weight of the novolak-type cyanate resin shown by the said general formula (II), It is preferable that it is 500-4,500. More preferably, it is 600-3,000.
If the weight average molecular weight is less than the lower limit, the mechanical strength may be lowered. Moreover, when the said upper limit is exceeded, since the cure rate of a resin composition will become quick, preservability may fall.

In addition, as said cyanate resin, what prepolymerized this can also be used.
Here, the prepolymer is usually obtained by, for example, trimerizing the cyanate resin by a heat reaction or the like, and is preferably used for adjusting the moldability and fluidity of the resin composition. is there.
Although it does not specifically limit as a prepolymer here, For example, what a trimerization rate is 20 to 50 weight% can be used. This trimerization rate can be determined using, for example, an infrared spectroscopic analyzer.

  Thus, as a novolac type cyanate resin, one kind can be used alone, two or more kinds having different weight average molecular weights are used together, or one kind or two kinds or more and those prepolymers are used together. You can also do it.

In the composition of the present invention, the content of the cyanate resin is not particularly limited, but is preferably 5 to 50% by weight with respect to the entire resin composition. More preferably, it is 10 to 40% by weight. Thereby, the heat resistance which a cyanate resin has, and the flame retardance improvement effect | action can be expressed more effectively.
If the content of the cyanate resin is less than the lower limit, the effect of increasing the heat resistance may be reduced. On the other hand, when the above upper limit is exceeded, the crosslinking density increases and the free volume increases, so that the moisture resistance may decrease.

The resin composition of the present invention preferably contains an imidazole compound as a curing accelerator. More preferably, it is an imidazole compound compatible with the resin component contained in the resin composition. By using such an imidazole compound, the reaction of a cyanate resin or an epoxy resin can be effectively promoted, and equivalent characteristics can be imparted even if the amount of the imidazole compound is reduced.
Furthermore, a resin composition using such an imidazole compound can be cured with high uniformity from a minute matrix unit with a resin component. Thereby, the insulation of the resin layer formed in the multilayer printed wiring board, and heat resistance can be improved.

  Examples of the imidazole compound used in the resin composition of the present invention include 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4- Methylimidazole, 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- (2'-undecylimidazolyl) -ethyl-s -Triazine, 2,4-diamino-6- [2'-ethyl-4-methylimidazolyl- (1 ')]-ethyl-s-triazine, and the like.

  Among these, an imidazole compound selected from 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 2-ethyl-4-methylimidazole is preferable. These imidazole compounds have particularly excellent compatibility, so that a highly uniform cured product can be obtained and a fine and uniform roughened surface can be formed, so that a fine conductor circuit can be easily formed. In addition, the multilayer printed wiring board can exhibit high heat resistance.

  Although it does not specifically limit as content of the said imidazole compound, 0.01 to 5 weight% is preferable with respect to the sum total of the said cyanate resin and an epoxy resin, and 0.05 to 3 weight% is especially preferable. Thereby, especially heat resistance can be improved.

In addition to the components described above, the resin composition of the present invention can contain additives such as an antifoaming agent and a leveling agent as necessary.
When the resin composition of the present invention contains an inorganic filler, an epoxy resin, a phenoxy resin, and a cyanate resin as main components, the inorganic filler is 20 to 75% by weight, the epoxy resin is 10 to 20% by weight, and the phenoxy. It is preferable to contain 5 to 25% by weight of the resin and 10 to 35% by weight of the cyanate resin.

The method for forming an insulating layer or insulating film from the resin composition of the present invention will be described in detail. For example, a resin varnish is prepared by dissolving and dispersing the resin composition in a solvent or the like, and using various coater devices. This is dried to create an insulating sheet with a base material, and the insulating sheet side of this insulating sheet with a base material is combined with the inner circuit board to use a vacuum pressure laminator device, etc. And then heat-curing with a hot air drying device or the like. About the base material of an insulating sheet with a base material, you may peel before heat-hardening, and may peel after heat-hardening.
Although it does not specifically limit as thickness of the insulating layer or insulating film comprised from a resin composition here, It is preferable that it is 10-100 micrometers. More preferably, it is 20-80 micrometers. Although it does not specifically limit as conditions to heat-press-mold, If an example is given, it can implement at the temperature of 60-160 degreeC, and the pressure of 0.2-3 MPa. Moreover, it is although it does not specifically limit as conditions to heat-harden, It can implement in temperature 140-240 degreeC and time 30-120 minutes.

And the insulating resin layer formed from such a resin composition of the present invention is subjected to a roughening treatment on the surface using an oxidizing agent such as permanganate or dichromate, after the roughening treatment. A large number of minute uneven shapes with high uniformity can be formed on the surface of the insulating layer.
When a metal plating process is performed on the surface of the insulating resin layer after such a roughening process, the smoothness of the roughened surface is high, so that a fine conductor circuit can be accurately formed. Further, the anchor effect can be enhanced by the minute uneven shape, and high adhesion can be imparted between the insulating resin layer and the plated metal.

  Explaining in detail the roughening treatment, after immersing the insulating layer or insulating film formed from the resin composition of the present invention in a swelling solution comprising an aqueous solution containing diethylene glycol monobutyl ether and sodium hydroxide, permanganate and It is preferable to immerse in a roughening solution containing sodium hydroxide. If necessary, other solvents and additives can be added to the swelling liquid and the roughening liquid. Moreover, after immersing in a roughening liquid, it is preferable to neutralize with an acid. If neutralization is not performed, permanganate is not sufficiently removed, and there is a risk of heat generation and ignition.

  The roughening treatment is preferably performed using a swelling liquid having a temperature of 50 ° C. or higher and 90 ° C. or lower and a roughening liquid having a temperature of 60 ° C. or higher and 90 ° C. or lower. More preferably, a swelling liquid having a temperature of 65 ° C. or more and 80 ° C. or less and a roughening liquid having a temperature of 70 ° C. or more and 85 ° C. or less. If the temperature is equal to or higher than the above upper limit value, the target surface roughness cannot be achieved because the roughening proceeds too much, and if the temperature is equal to or lower than the lower limit value, the roughening does not sufficiently proceed, so that the adhesion strength with the plating metal is reduced. Is not preferable because it becomes weak.

  The roughening treatment is preferably performed with a swelling liquid immersion time of 3 minutes to 20 minutes and a roughening liquid immersion time of 3 minutes to 40 minutes. More preferably, the swelling liquid immersion time is 5 minutes to 15 minutes and the roughening liquid immersion time is 5 minutes to 25 minutes. If the immersion time is equal to or greater than the above upper limit value, the target surface roughness cannot be achieved because the roughening proceeds too much. This is not preferable because the force is weakened.

The insulating layer or insulating film formed using the resin composition of the present invention has a surface roughness parameter Rvk value of 0.1 μm or more and 0.8 μm or less in the entire range or most of the conditions of the roughening treatment described above. However, it is only necessary that the surface roughness parameter Rvk value be within the above range when the roughening treatment is performed under at least one of the roughening treatment conditions.
That is, an insulating layer or an insulating film obtained by forming a resin layer using the resin composition of the present invention and curing it by heating is measured after roughening treatment under at least one condition within the following range. The surface roughness parameter Rvk value may be 0.1 μm or more and 0.8 μm or less.
<Roughening procedure>
An insulating layer having a thickness of 10 to 100 μm is composed of an aqueous solution containing 20 to 60 wt% of diethylene glycol monobutyl ether and 0.1 to 1.0 wt% of sodium hydroxide, and is applied to a swelling liquid having a temperature of 50 ° C. or more and 90 ° C. or less for 3 minutes to After soaking for 20 minutes, it consists of an aqueous solution containing 5.0 to 15.0 wt% permanganate and 1.0 to 10.0 wt% sodium hydroxide. Immerse for 40 minutes.

Here, “the surface roughness parameter Rvk value measured after roughening the insulating layer under at least one condition within the following range is 0.1 μm or more and 0.8 μm or less” is specified. This means that the surface roughness parameter Rvk value in the range of 0.1 μm or more and 0.8 μm or less may be measured in one condition setting within the range in which the condition setting included in the roughening treatment procedure is possible.
In other words, when an insulating layer is formed using a resin composition having a specific composition and the insulating layer is subjected to the above roughening treatment, the Rvk value is 0.1 μm or more and 0 over the entire range of roughening treatment conditions. The Rvk value is not less than 0.1 μm and not more than 0.1 μm when the roughening treatment is performed under at least one specific condition setting within the condition range of the roughening treatment. It only needs to be in the range of 8 μm or less.

Next, the insulating sheet with a substrate of the present invention will be described.
The insulating sheet with a base material of the present invention is formed by supporting the resin composition of the present invention on a base material, and includes an insulating sheet formed from the resin composition, and an insulating sheet that supports and supports the insulating sheet. It is comprised from the base material which can be transcribe | transferred to another surface.

Here, the method of supporting the resin composition on the substrate is not particularly limited. For example, the resin varnish is prepared by dissolving and dispersing the resin composition in a solvent or the like, and using various coater devices. The method of drying this after apply | coating to a base material, the method of spraying the resin varnish to a base material using a spray apparatus, and drying this are mentioned.
Among these, it is preferable to apply a resin varnish to a substrate using various coaters such as a comma coater and a die coater and then dry the resin varnish. Thereby, the insulating sheet with a base material which has no void and has a uniform thickness of the insulating sheet layer can be efficiently produced.

The solvent used for the preparation of the resin varnish is not particularly limited. For example, alcohols, ethers, acetals, ketones, esters, alcohol esters, ketone alcohols, ether alcohols, ketone ethers, ketones Esters and ester ethers can be used.
Although it does not specifically limit as solid content in the said resin varnish, 30 to 80 weight% is preferable and especially 40 to 70 weight% is preferable.

  In the insulating sheet with a substrate of the present invention, the thickness of the insulating sheet composed of the resin composition is not particularly limited, but is preferably 10 to 100 μm. More preferably, it is 20-80 micrometers. Thereby, when manufacturing a multilayer printed wiring board using this insulating sheet with a base material, while being able to fill and shape the unevenness | corrugation of an inner-layer circuit, suitable insulating layer thickness can be ensured. Moreover, in an insulating sheet with a base material, generation | occurrence | production of the crack of an insulating sheet can be suppressed and powder fall at the time of cutting can be decreased.

Although it does not specifically limit as a base material used for the insulating sheet with a base material of this invention, For example, polyester resin, such as a polyethylene terephthalate and a polybutylene terephthalate, a fluororesin, a thermoplastic resin film with heat resistance, such as a polyimide resin Alternatively, copper and / or a copper-based alloy, aluminum and / or an aluminum-based alloy, iron and / or an iron-based alloy, silver and / or a metal foil of a silver-based alloy, or the like can be used.
Although it does not specifically limit as thickness of the said base material, When the thing of 10-70 micrometers is used, the handleability at the time of manufacturing an insulating sheet with a base material is favorable, and it is preferable.
In addition, when manufacturing the insulating sheet with a base material of the present invention, it is preferable that the unevenness on the surface of the base material to be bonded to the insulating sheet is as small as possible. Thereby, the effect | action of this invention can be expressed effectively.

Next, the prepreg of the present invention will be described. The prepreg of the present invention is obtained by impregnating a fiber base material with the resin composition of the present invention.
Although it does not specifically limit as a fiber base material used by the prepreg of this invention, For example, inorganic fiber groups, such as glass fiber base materials, such as a glass fiber cloth and a glass non-woven cloth, a fiber cloth formed from inorganic compounds other than glass, or a non-fiber cloth Examples thereof include organic fiber base materials formed from organic fibers such as materials, aromatic polyamide resins, polyamide resins, aromatic polyester resins, polyester resins, polyimide resins, and fluororesins.
Among these fiber base materials, glass fiber base materials represented by glass woven fabric are preferable because of high mechanical strength and low water absorption.

Examples of the method of impregnating the fiber base material with the resin composition of the present invention include a method of preparing a resin varnish by dissolving or dispersing the resin composition in a solvent and immersing the fiber base material in the resin varnish, and various coater apparatuses. The method of apply | coating a resin varnish to a fiber base material by this, the method of spraying and applying a resin varnish to a fiber base material with a spray device, etc. are mentioned.
Among these, the method of immersing the fiber base material in the resin varnish is preferable. Thereby, the impregnation property of the resin composition with respect to the fiber base material can be improved.
In addition, when a fiber base material is immersed in a resin varnish, a normal impregnation coating device can be used.

The solvent used for the resin varnish is not particularly limited, and the same solvent as used for producing the base insulating sheet can be used here.
The solid content concentration in the resin varnish is not particularly limited, but is preferably 40 to 80% by weight, and particularly preferably 50 to 70% by weight. Thereby, the viscosity of a resin varnish can be made into a suitable level, and the impregnation property to a fiber base material can further be improved.

  The prepreg of the present invention can be produced by impregnating the fiber base with a resin varnish, adjusting the amount of impregnation of the resin composition as necessary, and then drying at a predetermined temperature, for example, 80 to 200 ° C. .

Next, the multilayer printed wiring board of the present invention will be described.
The multilayer printed wiring board is an insulating layer formed by laminating and curing an insulating layer formed by transferring an insulating sheet from the insulating sheet with a base material of the present invention or a prepreg of the present invention on one or both surfaces of the inner circuit board. The conductor circuit is formed by stacking via.
In the case of using the insulating sheet with a base material, the multilayer printed wiring board is formed by heating and press-molding the insulating sheet with a base material on one or both surfaces of an inner layer circuit board.
Specifically, the insulating sheet side of the insulating sheet with a base material of the present invention and the inner circuit board are combined, vacuum-pressed using a vacuum pressure laminator device, etc., and then the base material is peeled off. And it can obtain by heat-hardening an insulating sheet with a hot air dryer etc. before or after peeling a base material.
Although it does not specifically limit as conditions to heat-press form here, if an example is given, it can implement at the temperature of 60-160 degreeC, and the pressure of 0.2-3 MPa. Moreover, it is although it does not specifically limit as conditions to heat-harden, It can implement in temperature 140-240 degreeC and time 30-120 minutes.
Alternatively, it can be obtained by superposing the insulating sheet side of the insulating sheet with a substrate of the present invention on an inner layer circuit board and heating and pressing it using a flat plate press or the like. Although it does not specifically limit as conditions to heat-press form here, For example, it can implement at the temperature of 140-240 degreeC, and the pressure of 1-4 MPa.
The inner layer circuit board used when obtaining the multilayer printed wiring board is preferably, for example, one in which a predetermined conductor circuit is formed by etching or the like on both surfaces of a copper-clad laminate and the conductor circuit portion is blackened. Can be used.

  The multilayer printed wiring board obtained above further peels and removes the substrate to expose the insulating layer (that is, the insulating layer formed by laminating and bonding the insulating sheet to the inner circuit board), and the surface of the insulating layer After roughening with an oxidizing agent such as permanganate or dichromate, a new conductive wiring circuit can be formed by metal plating. The insulating layer formed from the resin composition of the present invention can form a large number of fine irregularities with high uniformity in the roughening treatment step, and the insulating layer surface has high smoothness. A simple wiring circuit can be formed with high accuracy.

In the case of using the prepreg, the multilayer printed wiring board is formed by superposing the prepreg on one side or both sides of the inner circuit board and heating and pressing.
Specifically, an insulating layer is formed by overlaying a prepreg on the inner layer circuit surface of the inner layer circuit board and heating and pressing, and the surface of the insulating layer is oxidized with permanganate, dichromate, etc. After roughening with an agent or the like, a new conductive wiring circuit can be formed by metal plating. This method is a method according to a so-called semi-additive method in which an insulating layer is laminated and patterned metal plating is performed.

When a prepreg is used, a conductor circuit may be formed by providing a non-patterned conductor layer on an insulating layer made of prepreg and etching it into a predetermined circuit pattern by a method according to a so-called subtractive method. good.
For example, on a circuit pattern of an inner layer circuit board, a single-sided copper-clad laminate or copper foil itself is superposed on a circuit pattern of a prepreg so that the copper foil layer faces outside, and then heated and pressed to form a copper After forming a foil layer and protecting the circuit forming part of the copper foil layer with a resist, a conductor circuit is formed on the insulating layer by etching. Further, it is made of a prepreg between two single-sided copper-clad laminates or two double-sided copper-clad laminates (however, the copper foil layer facing the inside of the laminate is formed in a conductor circuit pattern in advance). There is also a method in which a conductor circuit is formed on an insulating layer by etching the copper foil layer after bonding and laminating so that the non-patterned copper foil layer faces outward through the insulating layer.

Furthermore, you may use a prepreg as a board | substrate of an inner layer circuit board. In this case, the copper foil is laminated on both sides or one side of the prepreg, and heated and pressed to form a single-sided or double-sided copper-clad laminate, and the circuit formation part of the copper foil layer is protected with a resist, and then etching is performed. By doing so, an inner layer circuit is formed.
And a multilayer printed wiring board is obtained by forming an insulating layer and a conductor circuit using the said insulating sheet with a base material or a prepreg on the inner-layer circuit board produced using the prepreg of this invention.

  According to the present invention, as described above, a prepreg made of a cured product of the resin composition of the present invention or impregnating a fiber base material with the resin composition of the present invention on one surface or both surfaces of the inner layer circuit board. A multilayer printed wiring board having an insulating layer made of a cured product is obtained. The insulating layer formed on the inner circuit board is made of plated metal because the surface roughness parameter Rvk value can be adjusted in the range of 0.1 μm to 0.8 μm by performing the above-described roughening treatment. The conductor circuit can be formed with good adhesion, and there is no problem that occurs when the surface roughness is too rough, such as a delay in current speed and a decrease in moisture-absorbing solder heat resistance.

Next, a semiconductor device using the multilayer printed wiring board of the present invention will be described.
The semiconductor device is manufactured by mounting a semiconductor chip on the multilayer printed wiring board and sealing with a sealing resin. The semiconductor chip mounting method and sealing method are not particularly limited. By using the multilayer printed wiring board of the present invention as a substrate for a package, it is possible to manufacture a semiconductor device that can be mounted at high density and has excellent reliability.

  Hereinafter, the present invention will be described in detail with reference to Examples and Comparative Examples.

The raw materials used in Examples and Comparative Examples are as follows.
(1) Inorganic filler A / spherical fused silica: “SO-C1” manufactured by Admatechs, average particle size 0.3 μm, specific surface area 17 m ² / g
(2) Inorganic filler B / spherical fused silica: “SO-25H” manufactured by Admatechs, average particle diameter of 0.5 μm, specific surface area of 6.25 m ² / g
(3) Coupling agent A / epoxy silane coupling agent: Nippon Unicar Co., Ltd. “A-187”
(4) Coupling agent B / aminophenylsilane coupling agent: Shin-Etsu Silicone "KBM573"
(5) Coupling agent C / mercaptosilane coupling agent: Shin-Etsu Silicone "KBM803"
(6) Epoxy resin / biphenyl dimethylene type epoxy resin: Nippon Kayaku Co., Ltd. “NC-3000”, epoxy equivalent 275, weight average molecular weight 1000
(7) A copolymer of phenoxy resin A / biphenyl epoxy resin and bisphenol S epoxy resin, and the terminal portion has an epoxy group: “YX-8100H30” manufactured by Japan Epoxy Resin Co., Ltd., weight average molecular weight 30000 )
(8) Copolymer of phenoxy resin B / bisphenol A type epoxy resin and bisphenol F type epoxy resin, having terminal epoxy groups: “JER4275” manufactured by Japan Epoxy Resin Co., Ltd., weight average molecular weight 60000)
(9) Cyanate resin / Novolac type cyanate resin: “Primaset PT-30” manufactured by Lonza Corporation, weight average molecular weight 700
(10) Curing catalyst / imidazole compound: "Scazole 1B2PZ (1-benzyl-2-phenylimidazole)" manufactured by Shikoku Kasei Kogyo Co., Ltd.

<Example 1>
(1) Preparation of resin varnish 20 parts by weight of epoxy resin, 15 parts by weight of phenoxy resin A, 25 parts by weight of cyanate resin, and 0.05 parts by weight of curing catalyst were dissolved and dispersed in methyl ethyl ketone. Furthermore, 40 parts by weight of inorganic filler A and 0.2 part by weight of coupling agent A were added and stirred for 10 minutes using a high-speed stirring device to prepare a resin varnish having a solid content of 50% by weight.

(2) Production of Insulating Sheet with Substrate The resin varnish obtained above is applied to one side of a PET (polyethylene terephthalate) film having a thickness of 25 μm, and the thickness of the insulating film after drying using a comma coater device is 60 μm. It coated so that it might become, and this was dried for 10 minutes with a 160 degreeC drying apparatus, and the insulating sheet with a base material was manufactured.

(3) Manufacture of multilayer printed wiring board 1 On the front and back of the inner layer circuit board on which the predetermined inner layer circuit is formed on both sides, the insulating sheet surface of the insulating sheet with the base material obtained above is overlapped, and this is laminated. Then, using a vacuum pressurizing laminator apparatus, vacuum heating and pressing were performed at a temperature of 100 ° C. and a pressure of 1 MPa, and then heat curing was performed at 170 ° C. for 60 minutes in a hot air drying apparatus.
In addition, the following were used as the inner layer circuit board.
-Insulating layer: Halogen-free FR-4 material, thickness 0.4mm
Conductor layer: copper foil thickness 18 μm, L / S = 120/180 μm, clearance holes 1 mmφ, 3 mmφ, slit 2 mm

(4) Manufacture of multilayer printed wiring board 2 A base material is peeled from the multilayer printed wiring board 1 obtained as described above, and the swelling liquid at 70 ° C. (manufactured by Atotech Japan, “Swelling Dip Securigant P”) is used for 10 minutes. It was immersed and further immersed in an aqueous potassium permanganate solution (manufactured by Atotech Japan, “Concentrate Compact CP”) at 80 ° C. for 20 minutes, followed by neutralization and roughening treatment. At this time, when the surface roughness was measured with WYKO NT1100 manufactured by Veeco, Rvk was 0.33 μm.
After passing through the steps of degreasing, applying a catalyst, and activating this, an electroless copper plating film is formed to a thickness of about 1 μm, and electroplated copper is formed to a thickness of 30 μm. A multilayer printed wiring board was obtained.

<Example 2>
15 parts by weight of epoxy resin, 20 parts by weight of phenoxy resin B, 25 parts by weight of cyanate resin, and 0.05 parts by weight of curing catalyst were dissolved and dispersed in methyl ethyl ketone. Furthermore, 40 parts by weight of inorganic filler A and 0.2 part by weight of coupling agent B were added and stirred for 10 minutes using a high-speed stirring device to prepare a resin varnish having a solid content of 50% by weight.
Using this resin varnish, an insulating sheet with a base material and multilayer printed wiring boards 1 and 2 were obtained in the same manner as in Example 1. The surface roughness Rvk after the roughening treatment was 0.25 μm.

<Example 3>
20 parts by weight of epoxy resin, 20 parts by weight of phenoxy resin A, 35 parts by weight of cyanate resin, and 0.05 parts by weight of curing catalyst were dissolved and dispersed in methyl ethyl ketone. Furthermore, 25 parts by weight of inorganic filler A and 0.2 part by weight of coupling agent C were added and stirred for 10 minutes using a high-speed stirring device to prepare a resin varnish with a solid content of 50% by weight.
Using this resin varnish, an insulating sheet with a base material and multilayer printed wiring boards 1 and 2 were obtained in the same manner as in Example 1. The surface roughness Rvk after the roughening treatment was 0.35 μm.

<Example 4>
15 parts by weight of epoxy resin, 15 parts by weight of phenoxy resin B, 20 parts by weight of cyanate resin, and 0.2 parts by weight of curing catalyst were dissolved and dispersed in methyl ethyl ketone. Further, 50 parts by weight of inorganic filler A and 0.2 part by weight of coupling agent A were added and stirred for 10 minutes using a high-speed stirring device to prepare a resin varnish having a solid content of 50% by weight.
Using this resin varnish, an insulating sheet with a base material and multilayer printed wiring boards 1 and 2 were obtained in the same manner as in Example 1. The surface roughness Rvk after the roughening treatment was 0.55 μm.

<Example 5>
10 parts by weight of epoxy resin, 5 parts by weight of phenoxy resin B, 10 parts by weight of cyanate resin, and 0.05 parts by weight of curing catalyst were dissolved and dispersed in methyl ethyl ketone. Further, 50 parts by weight of inorganic filler A and 0.2 part by weight of coupling agent A were added and stirred for 10 minutes using a high-speed stirring device to prepare a resin varnish having a solid content of 50% by weight.
Using this resin varnish, an insulating sheet with a base material and multilayer printed wiring boards 1 and 2 were obtained in the same manner as in Example 1. The surface roughness Rvk after the roughening treatment was 0.75 μm.

<Comparative Example 1>
25 parts by weight of epoxy resin, 10 parts by weight of phenoxy resin A, 25 parts by weight of cyanate resin, and 0.05 parts by weight of curing catalyst were dissolved and dispersed in methyl ethyl ketone. Furthermore, 40 parts by weight of inorganic filler B and 0.2 part by weight of coupling agent A were added and stirred for 10 minutes using a high-speed stirring device to prepare a resin varnish having a solid content of 50% by weight.
Using this resin varnish, an insulating sheet with a base material and multilayer printed wiring boards 1 and 2 were obtained in the same manner as in Example 1. The surface roughness Rvk after the roughening treatment was 0.95 μm.

<Comparative example 2>
20 parts by weight of epoxy resin, 30 parts by weight of phenoxy resin B, 40 parts by weight of cyanate resin, and 0.05 parts by weight of curing catalyst were dissolved and dispersed in methyl ethyl ketone. Furthermore, 10 parts by weight of the inorganic filler A and 0.2 parts by weight of the coupling agent were added, and the mixture was stirred for 10 minutes using a high-speed stirrer to prepare a resin varnish having a solid content of 50% by weight.
Using this resin varnish, an insulating sheet with a base material and multilayer printed wiring boards 1 and 2 were obtained in the same manner as in Example 1. The surface roughness Rvk after the roughening treatment was 0.05 μm.

<Comparative Example 3>
5 parts by weight of epoxy resin, 5 parts by weight of phenoxy resin A, 15 parts by weight of cyanate resin, and 0.05 parts by weight of curing catalyst were dissolved and dispersed in methyl ethyl ketone. Furthermore, 75 parts by weight of the inorganic filler A and 0.2 parts by weight of the coupling agent were added and stirred for 10 minutes using a high-speed stirrer to prepare a resin varnish having a solid content of 50% by weight.
Using this resin varnish, an insulating sheet with a base material and multilayer printed wiring boards 1 and 2 were obtained in the same manner as in Example 1. The surface roughness Rvk after the roughening treatment was 1.15 μm.

  The characteristics of the insulating sheets with base materials and multilayer printed wiring boards obtained in the examples and comparative examples were evaluated. The results are shown in Table 1.

The evaluation method is as follows.
(1) Plating Peel Strength From the multilayer printed wiring board 2, the peel strength of the plated copper was measured based on JIS C-6481-1996.
(2) Plating bulges ○ Those that did not bulge in any of the electroless copper plating process, electroplated copper formation process, and annealing treatment process when creating the multilayer printed wiring board 2, those that swelled Was marked with x.
(3) Moisture-absorbing solder heat resistance A 50 mm x 50 mm sample was taken from the multilayer printed wiring board 2, and the entire surface on one side and 1/2 copper foil on the other side were removed by etching. This was treated with a 125 ° C. pressure cooker for 2 hours and then floated in a solder bath at 260 ° C. for 180 seconds with the copper foil face down to confirm the presence or absence of swelling / peeling. A sample without bulging or peeling was marked with ◯, and a sample with swelling or peeling was marked with ×.

Examples 1 to 5 are the resin composition of the present invention having a surface roughness Rvk of 0.1 μm or more and 0.8 μm or less after the roughening treatment, an insulating sheet with a substrate and a multilayer printed wiring board using the resin composition. .
In each of Examples 1 to 5, the moisture-absorbing solder heat resistance was good, the peel strength of the plated metal was good, and plating swelling did not occur.
In Comparative Examples 1 to 3, since the surface roughness Rvk after the roughening treatment exceeds 0.8 μm or less than 0.1 μm, there is a problem in plating peel strength, plating swelling, and moisture-absorbing solder heat resistance. It was.

Claims (7)

A multilayer printed wiring board comprising an insulating layer made of a cured product of a resin composition on one or both surfaces of an inner layer circuit board ,
The resin composition comprises an inorganic filler having an average particle size of 0.01 μm or more and 0.45 μm or less, 20 wt% or more and 80 wt% or less, and an epoxy resin having a weight average molecular weight of 500 or more and 5000 or less 5 wt% or more and 50 wt%. 1% by weight to 40% by weight of a phenoxy resin having a weight average molecular weight of 5,000 to 70,000, and a cyanate resin and / or a prepolymer thereof,
The insulating layer is made of an aqueous solution containing 20 to 60 wt% diethylene glycol monobutyl ether and 0.1 to 1.0 wt% sodium hydroxide, and a temperature of a cured product having a thickness of 10 to 100 μm obtained by heat curing the resin composition. Is made of an aqueous solution containing 5.0 to 15.0 wt% permanganate and 1.0 to 10.0 wt% sodium hydroxide after being immersed in a swelling solution of 50 to 90 ° C for 3 to 20 minutes, The surface roughness after the roughening treatment is obtained by performing a roughening treatment under at least one of the roughening treatment conditions, which is immersed in a roughening solution having a temperature of 60 ° C or higher and 90 ° C or lower for 3 to 40 minutes. A multilayer printed wiring board having a parameter Rvk value of 0.1 μm or more and 0.8 μm or less . A multilayer printed wiring board comprising an insulating layer made of a cured product of a prepreg formed by impregnating a fiber base material with a resin composition on one side or both sides of an inner layer circuit board ,
The resin composition comprises an inorganic filler having an average particle size of 0.01 μm or more and 0.45 μm or less, 20 wt% or more and 80 wt% or less, and an epoxy resin having a weight average molecular weight of 500 or more and 5000 or less 5 wt% or more and 50 wt%. 1% by weight to 40% by weight of a phenoxy resin having a weight average molecular weight of 5,000 to 70,000, and a cyanate resin and / or a prepolymer thereof,
The insulating layer is made of an aqueous solution containing 20 to 60% by weight of diethylene glycol monobutyl ether and 0.1 to 1.0% by weight of sodium hydroxide as a cured product having a thickness of 10 to 100 μm obtained by heat-curing the prepreg. After being immersed for 3 to 20 minutes in a swelling liquid at a temperature of not lower than 90 ° C. and lower than or equal to 90 ° C., it is composed of an aqueous solution containing 5.0 to 15.0 wt% permanganate and 1.0 to 10.0 wt% sodium hydroxide and the temperature is The surface roughness parameter Rvk after the roughening treatment is obtained by performing a roughening treatment under at least one of the roughening treatment conditions, which is immersed in a roughening solution at 60 ° C or higher and 90 ° C or lower for 3 to 40 minutes. A multilayer printed wiring board having a value of 0.1 μm or more and 0.8 μm or less. The multilayer printed wiring board according to claim 1 or 2 , wherein the inorganic filler has a specific surface area of 8 m ² / g or more and 200 m ² / g or less. The multilayer printed wiring board according to claim 1, wherein the inorganic filler is spherical silica. The resin composition contains one or more silane coupling agents selected from epoxy silane coupling agents, aminophenyl silane coupling agents, amino silane coupling agents, mercapto silane coupling agents, and vinyl silane coupling agents. The multilayer printed wiring board according to any one of claims 1 to 4. The multilayer printed wiring board according to claim 1 , wherein the resin composition contains an imidazole compound as a curing accelerator. A semiconductor device using the multilayer printed wiring board according to claim 1 as a package substrate.