WO2009028493A1 - Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device - Google Patents

Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device Download PDF

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Publication number
WO2009028493A1
WO2009028493A1 PCT/JP2008/065182 JP2008065182W WO2009028493A1 WO 2009028493 A1 WO2009028493 A1 WO 2009028493A1 JP 2008065182 W JP2008065182 W JP 2008065182W WO 2009028493 A1 WO2009028493 A1 WO 2009028493A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
printed wiring
resin composition
multilayer printed
insulating resin
Prior art date
Application number
PCT/JP2008/065182
Other languages
French (fr)
Japanese (ja)
Inventor
Toshiro Takasawa
Original Assignee
Sumitomo Bakelite Company, Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Bakelite Company, Ltd. filed Critical Sumitomo Bakelite Company, Ltd.
Priority to JP2009530125A priority Critical patent/JP5446864B2/en
Priority to CN200880101953XA priority patent/CN101772526B/en
Priority to KR1020107002578A priority patent/KR101497736B1/en
Publication of WO2009028493A1 publication Critical patent/WO2009028493A1/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/54—Silicon-containing compounds
    • C08K5/541—Silicon-containing compounds containing oxygen
    • C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
  • Epoxy Resins (AREA)

Abstract

This invention provides an insulating resin composition for a multilayer printed wiring board, which is excellent in desmearing properties in a multilayer printed wiring board production process, and an insulating resin sheet with a base material. There are also provided a highly reliable multilayer printed wiring board, which has excellent thermal shock resistance, moisture absorption/soldering heat resistance and other properties, using the insulating resin composition for a printed wiring board, and a semiconductor device. The resin composition is characterized in that it comprises, as indispensable components, (A) an aminosilane coupling agent, (B) silica having an average particle diameter of not more than 2.0 µm, (C) an epoxy resin, and (D) a phenoxy resin, the content of the epoxy resin (C) is not less than 14% by weight and not more than 79% by weight based on the resin composition, a cured product of the resin composition has a coefficient of linear thermal expansion of not more than 35 ppm at a temperature in the range of 25°C to 150°C and a glass transition temperature (Tg) of 190°C or below, and the lowest dynamic viscosity of the resin composition is not more than 2000 Pa·s.
PCT/JP2008/065182 2007-08-28 2008-08-26 Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device WO2009028493A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2009530125A JP5446864B2 (en) 2007-08-28 2008-08-26 Insulating resin composition for multilayer printed wiring board, insulating resin sheet with substrate, multilayer printed wiring board and semiconductor device
CN200880101953XA CN101772526B (en) 2007-08-28 2008-08-26 Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device
KR1020107002578A KR101497736B1 (en) 2007-08-28 2008-08-26 Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007-221406 2007-08-28
JP2007221406 2007-08-28

Publications (1)

Publication Number Publication Date
WO2009028493A1 true WO2009028493A1 (en) 2009-03-05

Family

ID=40387212

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/065182 WO2009028493A1 (en) 2007-08-28 2008-08-26 Insulating resin composition for multilayer printed wiring board, insulating resin sheet with base material, multilayer printed wiring board, and semiconductor device

Country Status (5)

Country Link
JP (1) JP5446864B2 (en)
KR (1) KR101497736B1 (en)
CN (1) CN101772526B (en)
TW (1) TWI419622B (en)
WO (1) WO2009028493A1 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010285523A (en) * 2009-06-11 2010-12-24 Sumitomo Bakelite Co Ltd Resin composition, prepreg, laminated board, multilayer printed wiring, and semiconductor device
JP2011089038A (en) * 2009-10-22 2011-05-06 Ajinomoto Co Inc Resin composition
JP2011202073A (en) * 2010-03-26 2011-10-13 Namics Corp First-supply type liquid semiconductor-sealing resin composition
JP2012025914A (en) * 2010-07-27 2012-02-09 Sumitomo Bakelite Co Ltd Resin composition, metal foil with resin, and metal base substrate
JP2012131899A (en) * 2010-12-21 2012-07-12 Sumitomo Bakelite Co Ltd Resin composition, resin sheet, metal-based circuit board, inverter, and power semiconductor device
JP2012523581A (en) * 2009-04-09 2012-10-04 エルジー・ケム・リミテッド Alignment film composition, alignment film manufactured thereby, method for manufacturing alignment film, optical film including the same, and display device including optical film
JP2013153012A (en) * 2012-01-24 2013-08-08 Murata Mfg Co Ltd Manufacturing method of electronic component module
JP2013181132A (en) * 2012-03-02 2013-09-12 Sekisui Chem Co Ltd Epoxy resin material and multilayer board
KR20210019009A (en) 2018-06-12 2021-02-19 세키스이가가쿠 고교가부시키가이샤 Resin material and multilayer printed wiring board

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101908166B1 (en) * 2011-06-21 2018-10-15 스미토모 베이클리트 컴퍼니 리미티드 Method for manufacturing laminated board
KR101954051B1 (en) * 2012-11-20 2019-03-05 제이엑스금속주식회사 Copper foil with carrier
JP6277542B2 (en) * 2013-02-28 2018-02-14 パナソニックＩｐマネジメント株式会社 Prepreg, metal-clad laminate
JP6932475B2 (en) * 2015-03-26 2021-09-08 住友ベークライト株式会社 Manufacturing method of organic resin substrate, organic resin substrate and semiconductor device
JP2018024832A (en) * 2016-07-29 2018-02-15 住友ベークライト株式会社 Epoxy resin composition for semiconductor encapsulation and semiconductor device
JP2020050797A (en) * 2018-09-27 2020-04-02 パナソニックＩｐマネジメント株式会社 Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and printed wiring board
CN115895546A (en) * 2022-12-30 2023-04-04 广东生益科技股份有限公司 Thermosetting resin composition and insulating adhesive film thereof

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005126658A (en) * 2003-01-07 2005-05-19 Sekisui Chem Co Ltd Curable resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, electroconductive connecting paste, electroconductive connecting sheet and electronic parts-connected body
WO2005092945A1 (en) * 2004-03-29 2005-10-06 Sumitomo Bakelite Co., Ltd. Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board
JP2005285540A (en) * 2004-03-30 2005-10-13 Sumitomo Bakelite Co Ltd Insulation sheet, insulation sheet with base material, and multilayer printed circuit board
JP2006312751A (en) * 2006-08-10 2006-11-16 Sumitomo Bakelite Co Ltd Resin composition, prepreg and copper-clad laminate using the prepreg
JP2007087982A (en) * 2005-09-20 2007-04-05 Sumitomo Bakelite Co Ltd Resin composite, insulation sheet with substrate and multilayer printed wiring board
JP2007176169A (en) * 2005-12-01 2007-07-12 Sumitomo Bakelite Co Ltd Prepreg, substrate and semiconductor apparatus
WO2008044552A1 (en) * 2006-10-06 2008-04-17 Sumitomo Bakelite Company, Ltd. Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device
JP2008174662A (en) * 2007-01-19 2008-07-31 Sumitomo Bakelite Co Ltd Resin composition, insulating resin sheet with film or metallic foil, multilayered printed circuit board and semiconductor device
JP2008198774A (en) * 2007-02-13 2008-08-28 Sumitomo Bakelite Co Ltd Resin composition, insulating resin sheet with film or metal foil, multilayer printed wiring board, method of manufacturing multilayer printed wiring board, and semiconductor device

Family Cites Families (6)

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Publication number Priority date Publication date Assignee Title
JP2001111185A (en) * 1999-07-30 2001-04-20 Ngk Insulators Ltd Wiring substrate and printed circuit substrate using the same
CN1125488C (en) * 2000-08-25 2003-10-22 中国科学院化学研究所 Liquid epoxy composite for packaging semiconductor and its application
US20050090044A1 (en) * 2001-09-28 2005-04-28 Keiji Kayaba Epoxy resin compositions and semiconductor devices
KR100702566B1 (en) * 2003-04-07 2007-04-04 히다치 가세고교 가부시끼가이샤 Epoxy resin molding material for sealing use and semiconductor device
JP4725704B2 (en) * 2003-05-27 2011-07-13 味の素株式会社 Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg
CN1978481A (en) * 2005-12-01 2007-06-13 天津科技大学 Self-extinguishing waterborn polyurethane material

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005126658A (en) * 2003-01-07 2005-05-19 Sekisui Chem Co Ltd Curable resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, electroconductive connecting paste, electroconductive connecting sheet and electronic parts-connected body
WO2005092945A1 (en) * 2004-03-29 2005-10-06 Sumitomo Bakelite Co., Ltd. Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board
JP2005285540A (en) * 2004-03-30 2005-10-13 Sumitomo Bakelite Co Ltd Insulation sheet, insulation sheet with base material, and multilayer printed circuit board
JP2007087982A (en) * 2005-09-20 2007-04-05 Sumitomo Bakelite Co Ltd Resin composite, insulation sheet with substrate and multilayer printed wiring board
JP2007176169A (en) * 2005-12-01 2007-07-12 Sumitomo Bakelite Co Ltd Prepreg, substrate and semiconductor apparatus
JP2006312751A (en) * 2006-08-10 2006-11-16 Sumitomo Bakelite Co Ltd Resin composition, prepreg and copper-clad laminate using the prepreg
WO2008044552A1 (en) * 2006-10-06 2008-04-17 Sumitomo Bakelite Company, Ltd. Resin composition, insulating sheet with base, prepreg, multilayer printed wiring board and semiconductor device
JP2008174662A (en) * 2007-01-19 2008-07-31 Sumitomo Bakelite Co Ltd Resin composition, insulating resin sheet with film or metallic foil, multilayered printed circuit board and semiconductor device
JP2008198774A (en) * 2007-02-13 2008-08-28 Sumitomo Bakelite Co Ltd Resin composition, insulating resin sheet with film or metal foil, multilayer printed wiring board, method of manufacturing multilayer printed wiring board, and semiconductor device

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012523581A (en) * 2009-04-09 2012-10-04 エルジー・ケム・リミテッド Alignment film composition, alignment film manufactured thereby, method for manufacturing alignment film, optical film including the same, and display device including optical film
JP2010285523A (en) * 2009-06-11 2010-12-24 Sumitomo Bakelite Co Ltd Resin composition, prepreg, laminated board, multilayer printed wiring, and semiconductor device
JP2011089038A (en) * 2009-10-22 2011-05-06 Ajinomoto Co Inc Resin composition
JP2011202073A (en) * 2010-03-26 2011-10-13 Namics Corp First-supply type liquid semiconductor-sealing resin composition
JP2012025914A (en) * 2010-07-27 2012-02-09 Sumitomo Bakelite Co Ltd Resin composition, metal foil with resin, and metal base substrate
JP2012131899A (en) * 2010-12-21 2012-07-12 Sumitomo Bakelite Co Ltd Resin composition, resin sheet, metal-based circuit board, inverter, and power semiconductor device
JP2013153012A (en) * 2012-01-24 2013-08-08 Murata Mfg Co Ltd Manufacturing method of electronic component module
JP2013181132A (en) * 2012-03-02 2013-09-12 Sekisui Chem Co Ltd Epoxy resin material and multilayer board
KR20210019009A (en) 2018-06-12 2021-02-19 세키스이가가쿠 고교가부시키가이샤 Resin material and multilayer printed wiring board

Also Published As

Publication number Publication date
TWI419622B (en) 2013-12-11
TW200922396A (en) 2009-05-16
JP5446864B2 (en) 2014-03-19
JPWO2009028493A1 (en) 2010-12-02
KR20100059790A (en) 2010-06-04
CN101772526B (en) 2012-05-30
KR101497736B1 (en) 2015-03-02
CN101772526A (en) 2010-07-07

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