TW200738815A - Thermosetting resin compositions, resin films in B-stage and build-up multi-layer board - Google Patents

Thermosetting resin compositions, resin films in B-stage and build-up multi-layer board

Info

Publication number
TW200738815A
TW200738815A TW096102297A TW96102297A TW200738815A TW 200738815 A TW200738815 A TW 200738815A TW 096102297 A TW096102297 A TW 096102297A TW 96102297 A TW96102297 A TW 96102297A TW 200738815 A TW200738815 A TW 200738815A
Authority
TW
Taiwan
Prior art keywords
resin
build
stage
layer board
epoxy resin
Prior art date
Application number
TW096102297A
Other languages
Chinese (zh)
Inventor
Tetsuaki Suzuki
Naoya Kakiuchi
Yusuke Tanahashi
Original Assignee
Tamura Kaken Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tamura Kaken Corp filed Critical Tamura Kaken Corp
Publication of TW200738815A publication Critical patent/TW200738815A/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N25/00—Investigating or analyzing materials by the use of thermal means
    • G01N25/02—Investigating or analyzing materials by the use of thermal means by investigating changes of state or changes of phase; by investigating sintering
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N1/00—Sampling; Preparing specimens for investigation
    • G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
    • G01N1/44—Sample treatment involving radiation, e.g. heat

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

To provide an interlayer insulation material with a high resistance to heat and a low expansion coefficient, and excellent in peel-resistance at a low surface roughness after a roughening process adapted to a (semi)additive process, and well-balanced resin properties such as a coefficient of elasticity, a strength at break and an elongation at break. The thermosetting resin composition contains (a) an epoxy resin containing 50-100 wt.% of a liquid epoxy resin with a viscosity of 1.0-120 Pa s at 25 DEG C, (b) a triazine-modified phenol novolak resin curing agent and (c) a solvent-soluble polyimide resin. The amount of (c) the solvent-soluble polyimide resin is 10-250 pts.wt. when the total amount of (a) the epoxy resin and (b) the triazine-modified phenol novolak resin curing agent is made 100 pts.wt.
TW096102297A 2006-02-27 2007-01-22 Thermosetting resin compositions, resin films in B-stage and build-up multi-layer board TW200738815A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006050087A JP2007224242A (en) 2006-02-27 2006-02-27 Thermosetting resin composition, resin film in b stage and multilayer build-up base plate

Publications (1)

Publication Number Publication Date
TW200738815A true TW200738815A (en) 2007-10-16

Family

ID=38546338

Family Applications (1)

Application Number Title Priority Date Filing Date
TW096102297A TW200738815A (en) 2006-02-27 2007-01-22 Thermosetting resin compositions, resin films in B-stage and build-up multi-layer board

Country Status (4)

Country Link
JP (1) JP2007224242A (en)
KR (1) KR20070089053A (en)
CN (1) CN101029166A (en)
TW (1) TW200738815A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI774674B (en) * 2016-05-24 2022-08-21 日商味之素股份有限公司 Subsequent films, resin compositions, prepregs, printed wiring boards, and semiconductor devices

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5047024B2 (en) * 2008-03-25 2012-10-10 三菱電機株式会社 Thermally conductive resin composition, thermally conductive resin sheet, and power module
TW200948888A (en) * 2008-04-16 2009-12-01 Henkel Corp Flow controllable B-stageable composition
JP2010083966A (en) * 2008-09-30 2010-04-15 Sekisui Chem Co Ltd Resin composition, cured body, and laminate
WO2010071107A1 (en) * 2008-12-15 2010-06-24 宇部興産株式会社 Thermosetting modified polyamide resin composition
KR101906687B1 (en) 2010-03-08 2018-12-05 아지노모토 가부시키가이샤 Manufacturing method for trench-type circuit board
WO2012105558A1 (en) * 2011-02-01 2012-08-09 Dic株式会社 Thermosetting resin composition, cured product thereof, and interlayer adhesive film for printed wiring board
JP2013077590A (en) * 2011-09-29 2013-04-25 Tamura Seisakusho Co Ltd Resin film for interlayer insulation and build-up wiring board
CN103819870B (en) * 2012-11-16 2016-06-15 株式会社田村制作所 Resin molding, metal forming, copper-clad plate and the multilayer laminated boards substrate on compositions of thermosetting resin, B rank
JP6258770B2 (en) * 2014-04-24 2018-01-10 Ｊｆｅケミカル株式会社 Electronic board and coverlay film
KR101943698B1 (en) * 2016-01-29 2019-01-29 삼성에스디아이 주식회사 Epoxy resin composition for encapsulating semicomductor device and semiconductor device encapsulated using the same
CN106773215A (en) * 2017-01-06 2017-05-31 京东方科技集团股份有限公司 A kind of color membrane substrates, its preparation method, liquid crystal display and display device
TWI773745B (en) * 2017-04-24 2022-08-11 日商味之素股份有限公司 resin composition
JP7347931B2 (en) * 2018-12-26 2023-09-20 スリーエム イノベイティブ プロパティズ カンパニー Film for microfluidic device, microfluidic device and manufacturing method thereof

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI774674B (en) * 2016-05-24 2022-08-21 日商味之素股份有限公司 Subsequent films, resin compositions, prepregs, printed wiring boards, and semiconductor devices

Also Published As

Publication number Publication date
CN101029166A (en) 2007-09-05
JP2007224242A (en) 2007-09-06
KR20070089053A (en) 2007-08-30

Similar Documents

Publication Publication Date Title
TW200738815A (en) Thermosetting resin compositions, resin films in B-stage and build-up multi-layer board
TW200504146A (en) Resin composition for interlayer insulation of multilayer printed circuit board, adhesive film and prepreg
TW200745260A (en) Thermosetting resin composition and uses thereof
JP7026674B2 (en) Resin composition for circuit boards and metal-based circuit boards using them
WO2010123314A2 (en) Novel epoxy resin and epoxy resin composition comprising the same
TW200738775A (en) Resin composition for interlayer insulating layer of multi-layer printed wiring board
TW200833770A (en) Thermally conductive material
MY157414A (en) Epoxy resin composition and semiconductor device
JP2009060146A (en) Epoxy resin inorganic composite sheet for sealing semiconductor, and molded product
JP2008297429A (en) Adhesive composition, adhesive sheet and copper foil with adhesive agent
EP2163579A3 (en) Epoxy resin composition
TW200732366A (en) Thermosetting resin composition
WO2009060927A1 (en) Adhesive sheet for semiconductor, and dicing tape integrated adhesive sheet for semiconductor
TW200628576A (en) Acrylic adhesive composition and acrylic adhesive sheet
TW200617123A (en) Acrylic flame retardant adhesive composition and acrylic flame retardant adhesive sheet
WO2012093895A3 (en) Resin composition, prepreg using same, and printed wiring board
CN110776819A (en) Graphene heat dissipation coating for electronic and electric appliances
TW200631035A (en) Conductive paste, and method for producing printed wiring board by using the same
WO2008133246A1 (en) Epoxy resin composition, resin film, prepreg, and multilayer printed circuit board
JP2014051645A (en) Insulating composition for multilayer printed circuit board
KR20120033670A (en) Adhesive composition for halogen-free coverlay film and coverlay film using the same
KR102187491B1 (en) Resin composition for film, insulating film, and semiconductor device
KR101987305B1 (en) Insulating resin composition for printed circuit board and products having the same
WO2009060897A1 (en) Epoxy resin, method for producing the same, epoxy resin composition and cured product
JP6832987B2 (en) Resin composition used for metal substrates, resin adhesive liquid containing the resin composition, and metal-based copper-clad laminate