CN214592122U - Ceramic-based high-frequency circuit board - Google Patents
Ceramic-based high-frequency circuit board Download PDFInfo
- Publication number
- CN214592122U CN214592122U CN202120551523.0U CN202120551523U CN214592122U CN 214592122 U CN214592122 U CN 214592122U CN 202120551523 U CN202120551523 U CN 202120551523U CN 214592122 U CN214592122 U CN 214592122U
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- China
- Prior art keywords
- circuit layer
- copper foil
- foil circuit
- ceramic substrate
- ceramic
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 57
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 87
- 239000011889 copper foil Substances 0.000 claims abstract description 86
- 239000000758 substrate Substances 0.000 claims abstract description 42
- 239000010410 layer Substances 0.000 claims description 113
- 239000003365 glass fiber Substances 0.000 claims description 14
- 239000011229 interlayer Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 230000008719 thickening Effects 0.000 abstract description 17
- 239000011521 glass Substances 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000007747 plating Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The utility model provides a pair of ceramic base high frequency circuit board, which comprises a circuit board, the circuit board includes the fine PP board of first copper foil circuit layer, first ceramic substrate, the fine PP board of first glass, second copper foil circuit layer, second ceramic substrate, third copper foil circuit layer, the fine PP board of second glass, fourth copper foil circuit layer, third ceramic substrate, fifth copper foil circuit layer, the fine PP board of third glass, fourth ceramic substrate, sixth copper foil circuit layer that from the top down set gradually, second copper foil circuit layer upper end is equipped with thickening circuit layer, first ceramic substrate with still be fixed with L shape heat-conducting plate between the second ceramic substrate, L shape heat-conducting plate with it has the PP intermediate layer to fill between the thickening circuit layer. The utility model discloses a ceramic base high frequency circuit board has the thickening circuit layer, can satisfy the high frequency transmission demand of partial circuit to set up thickening circuit layer inside the circuit board, can solve thickening circuit layer and oxidized problem.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to ceramic base high frequency circuit board.
Background
The ceramic-based circuit board is a circuit board made of an electronic ceramic material serving as a substrate and has the advantages of high temperature resistance, high electrical insulation performance, low dielectric constant, low dielectric loss, high heat conductivity coefficient, good chemical stability and the like. For a high-frequency circuit board, a thicker plating layer needs to be manufactured at a part of circuit positions so as to meet the high-frequency transmission function of a part of circuits. However, in the conventional circuit board, the thickened plating layer is usually disposed on the outermost layer to improve the heat dissipation performance at this position. However, the structure easily causes the surface flatness of the circuit board to be low, and a large-area copper plating layer is exposed in the air, so that the risk of oxidation of the plating layer is greatly increased, and the defect is large.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a ceramic base high frequency circuit board has the thickening circuit layer, can satisfy the high frequency transmission demand of part circuit to set up the thickening circuit layer inside the circuit board, can solve the thickening circuit layer and oxidized the problem.
In order to achieve the above object, the present invention provides the following technical solutions:
the utility model provides a ceramic base high frequency circuit board, includes the circuit board, the circuit board includes the fine PP board of first copper foil circuit layer, first ceramic substrate, the fine PP board of first glass, second copper foil circuit layer, second ceramic substrate, third copper foil circuit layer, the fine PP board of second, fourth copper foil circuit layer, third ceramic substrate, fifth copper foil circuit layer, the fine PP board of third, fourth ceramic substrate, sixth copper foil circuit layer that from the top down set gradually, second copper foil circuit layer upper end is equipped with thickening circuit layer, first ceramic substrate with still be fixed with L shape heat-conducting plate between the second ceramic substrate, L shape heat-conducting plate with it has the PP intermediate layer to fill between the thickening circuit layer.
Specifically, the outer sides of the first ceramic substrate, the second ceramic substrate, the third copper foil circuit layer, the third ceramic substrate and the fourth ceramic substrate are all provided with layer number identification sticking blocks.
Specifically, metalized holes are connected between the first copper foil circuit layer and the second copper foil circuit layer, between the second copper foil circuit layer and the third copper foil circuit layer, between the first copper foil circuit layer and the fourth copper foil circuit layer, between the fourth copper foil circuit layer and the fifth copper foil circuit layer, and between the fifth copper foil circuit layer and the sixth copper foil circuit layer.
Specifically, the metallized holes are filled with hole plugging resin.
Specifically, the inboard electromagnetic shield that still is equipped with of the fine PP board of second, the electromagnetic shield is located third copper foil circuit layer with between the fourth copper foil circuit layer.
Specifically, the upper end of the first copper foil circuit layer and the lower end of the sixth copper foil circuit layer are both covered with a three-proofing paint film.
The utility model has the advantages that:
1. the utility model discloses a ceramic base high frequency circuit board has increased the thickening circuit layer in second copper foil circuit layer upper end, can satisfy the high frequency transmission demand of part circuit to set up the thickening circuit layer inside the circuit board, can solve the thickening circuit layer and oxidized the problem;
2. increased L shape heat-conducting plate at thickening circuit layer upside, promoted the radiating efficiency of thickening circuit layer position, and it has the PP intermediate layer to fill between L shape heat-conducting plate and thickening circuit layer, the interbedded gluey height that contains of PP, compare the great fine PP board of glass of hardness, the hot pressing in-process is out of shape more easily, the PP intermediate layer is filled between L shape heat-conducting plate and thickening circuit layer after the shaping, the degree of cooperation is good, does not produce the space, it is high with the degree of adhesion of the fine PP board of first glass.
Drawings
Fig. 1 is the structure schematic diagram of the ceramic-based high-frequency circuit board of the present invention.
The reference signs are: the glass fiber PP plate comprises a first copper foil circuit layer 1, a first ceramic substrate 2, a first glass fiber PP plate 3, a second copper foil circuit layer 4, a second ceramic substrate 5, a third copper foil circuit layer 6, a second glass fiber PP plate 7, a fourth copper foil circuit layer 8, a third ceramic substrate 9, a fifth copper foil circuit layer 10, a third glass fiber PP plate 11, a fourth ceramic substrate 12, a sixth copper foil circuit layer 13, a thickened circuit layer 14, an L-shaped heat conduction plate 15, a PP interlayer 16, a layer number identification sticking block 17, a hole plugging resin 18, an electromagnetic shielding plate 19 and a three-proofing paint film 20.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in fig. 1:
a ceramic-based high-frequency circuit board comprises a circuit board, wherein the circuit board comprises a first copper foil circuit layer 1, a first ceramic substrate 2, a first glass fiber PP plate 3, a second copper foil circuit layer 4, a second ceramic substrate 5, a third copper foil circuit layer 6, a second glass fiber PP plate 7, a fourth copper foil circuit layer 8, a third ceramic substrate 9, a fifth copper foil circuit layer 10, a third glass fiber PP plate 11, a fourth ceramic substrate 12 and a sixth copper foil circuit layer 13 which are sequentially arranged from top to bottom, a thickened circuit layer 14 is arranged at the upper end of the second copper foil circuit layer 4, an L-shaped heat-conducting plate 15 is fixedly arranged between the first ceramic substrate 2 and the second ceramic substrate 5, the L-shaped heat-conducting plate 15 has excellent heat-conducting capacity and can rapidly guide out heat generated at the position of the thickened circuit layer 14, so as to improve the heat dissipation performance of the circuit board, a PP interlayer 16 is filled between the L-shaped heat-conducting plate 15 and the thickened circuit layer 14, the glue content of the PP interlayer 16 is high, the PP interlayer is easier to deform in the hot pressing process compared with a glass fiber PP plate with larger hardness, the formed PP interlayer 16 is filled between the L-shaped heat conduction plate 15 and the thickened circuit layer 14, the matching degree is good, no gap is generated, and the adhesion degree with the first glass fiber PP plate 3 is high.
Preferably, the outer sides of the first ceramic substrate 2, the second ceramic substrate 5, the third copper foil circuit layer 6, the third ceramic substrate 9 and the fourth ceramic substrate 12 are all provided with a layer number identification sticking block 17, and a layer number identification pattern is printed on the layer number identification sticking block 17, so that a user can conveniently identify the layer number of each substrate.
Preferably, metalized holes are connected between the first copper foil circuit layer 1 and the second copper foil circuit layer 4, between the second copper foil circuit layer 4 and the third copper foil circuit layer 6, between the first copper foil circuit layer 1 and the fourth copper foil circuit layer 8, between the fourth copper foil circuit layer 8 and the fifth copper foil circuit layer 10, and between the fifth copper foil circuit layer 10 and the sixth copper foil circuit layer 13, the metalized holes are formed after the plated through hole process, and the inner wall of the metalized holes is provided with a layer of copper foil for realizing the electrical connection between the circuit layers.
Preferably, the metallized holes are also filled with a via resin 18 in order to prevent the copper foil in the metallized holes from being oxidized.
Preferably, an electromagnetic shielding plate 19 is further arranged on the inner side of the second glass fiber PP plate 7, and the electromagnetic shielding plate 19 is located between the third copper foil circuit layer 6 and the fourth copper foil circuit layer 8 and is used for shielding electromagnetic interference between the third copper foil circuit layer 6 and the fourth copper foil circuit layer 8.
Preferably, the upper end of the first copper foil circuit layer 1 and the lower end of the sixth copper foil circuit layer 13 are both covered with a three-proofing film 20, the three-proofing film 20 is used for protecting the first copper foil circuit layer 1 and the sixth copper foil circuit layer 13 from being corroded by the environment, and the three-proofing film is formed by coating the three-proofing paint and curing, so that the three-proofing film has excellent performances of moisture resistance, electric leakage resistance, corrosion resistance and the like.
The above embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A ceramic-based high-frequency circuit board comprises a circuit board and is characterized in that the circuit board comprises a first copper foil circuit layer (1), a first ceramic substrate (2), a first glass fiber PP board (3), a second copper foil circuit layer (4), a second ceramic substrate (5), a third copper foil circuit layer (6), a second glass fiber PP board (7), a fourth copper foil circuit layer (8), a third ceramic substrate (9), a fifth copper foil circuit layer (10), a third glass fiber PP board (11), a fourth ceramic substrate (12) and a sixth copper foil circuit layer (13) which are sequentially arranged from top to bottom, a thickened circuit layer (14) is arranged at the upper end of the second copper foil circuit layer (4), an L-shaped heat-conducting plate (15) is fixed between the first ceramic substrate (2) and the second ceramic substrate (5), and a PP interlayer (16) is filled between the L-shaped heat conduction plate (15) and the thickened circuit layer (14).
2. The ceramic-based high-frequency circuit board according to claim 1, characterized in that the outer sides of the first ceramic substrate (2), the second ceramic substrate (5), the third copper foil circuit layer (6), the third ceramic substrate (9) and the fourth ceramic substrate (12) are provided with layer number identification sticking blocks (17).
3. The ceramic-based high-frequency circuit board according to claim 1, wherein metallized holes are connected between the first copper foil circuit layer (1) and the second copper foil circuit layer (4), between the second copper foil circuit layer (4) and the third copper foil circuit layer (6), between the first copper foil circuit layer (1) and the fourth copper foil circuit layer (8), between the fourth copper foil circuit layer (8) and the fifth copper foil circuit layer (10), and between the fifth copper foil circuit layer (10) and the sixth copper foil circuit layer (13).
4. A ceramic-based high frequency circuit board according to claim 3, characterized in that said metallized holes are further filled with a plug-hole resin (18).
5. The ceramic-based high-frequency circuit board according to claim 1, characterized in that an electromagnetic shielding plate (19) is further disposed inside the second glass fiber PP plate (7), and the electromagnetic shielding plate (19) is located between the third copper foil circuit layer (6) and the fourth copper foil circuit layer (8).
6. The ceramic-based high-frequency circuit board according to claim 1, characterized in that the upper end of the first copper foil circuit layer (1) and the lower end of the sixth copper foil circuit layer (13) are covered with a three-proofing film (20).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120551523.0U CN214592122U (en) | 2021-03-17 | 2021-03-17 | Ceramic-based high-frequency circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120551523.0U CN214592122U (en) | 2021-03-17 | 2021-03-17 | Ceramic-based high-frequency circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214592122U true CN214592122U (en) | 2021-11-02 |
Family
ID=78354473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120551523.0U Expired - Fee Related CN214592122U (en) | 2021-03-17 | 2021-03-17 | Ceramic-based high-frequency circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214592122U (en) |
-
2021
- 2021-03-17 CN CN202120551523.0U patent/CN214592122U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20211102 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |