CN218336542U - High temperature resistant LED control circuit board - Google Patents
High temperature resistant LED control circuit board Download PDFInfo
- Publication number
- CN218336542U CN218336542U CN202221599098.3U CN202221599098U CN218336542U CN 218336542 U CN218336542 U CN 218336542U CN 202221599098 U CN202221599098 U CN 202221599098U CN 218336542 U CN218336542 U CN 218336542U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- layer
- high temperature
- copper
- clad plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The utility model provides a high temperature resistance LED control circuit board especially relates to the circuit board field. The high temperature resistant effect among the prior art is poor in order to solve, and long-term use can cause the circuit board local short circuit to appear, can influence the use in circuit board later stage, has shortened circuit board life's problem. The method comprises the following steps: the circuit substrate, the top of circuit substrate is provided with the copper-clad plate, the top of copper-clad plate is provided with the overburden, the top of overburden is provided with high temperature resistant layer, the top on high temperature resistant layer is provided with the inoxidizing coating, the copper-clad plate includes the copper-clad plate, the surface that covers the copper-clad plate is provided with the adhesive, the surface of adhesive is provided with the reinforcing material layer, high temperature resistant layer includes the polyimide layer, the surface on polyimide layer is provided with the fine cloth layer of glass. Compared with the original circuit board, the circuit board has good high temperature resistance effect, can not cause local short circuit of the circuit board after long-term use, can not influence the use in the later stage of the circuit board, and prolongs the service life of the circuit board.
Description
Technical Field
The utility model relates to a device in LED control circuit board field especially relates to a high temperature resistance LED control circuit board.
Background
The circuit board has the following names: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high-frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout.
The existing LED control circuit board is poor in high-temperature resistance effect, can cause local short circuit of the circuit board after long-term use, can influence the later-stage use of the circuit board, and shortens the service life of the circuit board.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high temperature resistant LED control circuit board to it is poor to solve the high temperature resistant effect among the prior art, and long-term use can cause the circuit board local short circuit to appear, can influence the use in circuit board later stage, has shortened circuit board life's problem. The utility model provides a plurality of technical effects that preferred technical scheme among a great deal of technical scheme can produce see the explanation below in detail.
In order to achieve the above purpose, the utility model provides a following technical scheme:
the utility model provides a pair of high temperature resistance LED control circuit board, include: the circuit substrate, the top of circuit substrate is provided with the copper-clad plate, the top of copper-clad plate is provided with the overburden, the top of overburden is provided with high temperature resistant layer, the top on high temperature resistant layer is provided with the inoxidizing coating, the copper-clad plate includes the copper-clad plate, the surface of copper-clad plate is provided with the adhesive, the surface of adhesive is provided with the reinforcing material layer, high temperature resistant layer includes the polyimide layer, the surface on polyimide layer is provided with the fine cloth layer of glass, the surface on the fine cloth layer of glass is provided with the insulating layer.
Preferably, the covering layer comprises a conductive layer, an ink layer is arranged on the outer surface of the conductive layer, and a heat conduction insulating glue layer is arranged on the outer surface of the ink layer.
Preferably, the thickness of the copper clad laminate is 1.5mm, and the thickness of the covering layer is 1.0mm.
Preferably, the adhesive is an epoxy resin material, and the outer surface of the adhesive is adhered to the inner surface of the reinforcing material layer.
Preferably, the thickness of the glass fiber cloth layer is 0.2-0.8mm, and the thickness of the insulating layer is 0.5-1.2mm.
Preferably, the thickness of the polyimide layer is the same as that of the glass fiber cloth layer.
The utility model provides a pair of high temperature resistance LED control circuit board beneficial effect is: compared with the original circuit board, the circuit board has good high temperature resistance effect, can not cause local short circuit of the circuit board after long-term use, can not influence the use in the later stage of the circuit board, and prolongs the service life of the circuit board.
Drawings
Fig. 1 is the general structure schematic diagram of the high temperature resistant LED control circuit board of the present invention.
Fig. 2 is the utility model relates to a high temperature resistant LED control circuit board's copper-clad plate structure schematic diagram.
Fig. 3 is a schematic diagram of a covering layer structure of a high temperature resistant LED control circuit board of the present invention.
Fig. 4 is the utility model relates to a high temperature resistant LED control circuit board's high temperature resistant layer structure sketch map.
In the figure: 1. a circuit substrate; 2. copper-clad plate; 201. a copper clad laminate; 202. a binder; 203. a layer of reinforcing material; 3. a cover layer; 301. a conductive layer; 302. an ink layer; 303. a heat-conducting insulating glue layer; 4. a high temperature resistant layer; 401. a polyimide layer; 402. a glass fiber cloth layer; 403. an insulating layer; 5. and (4) a protective layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The following describes in detail embodiments of the present invention with reference to the drawings. In the drawings, the same reference numerals designate the same or corresponding features. The figures are merely schematic representations, which are not necessarily drawn to scale.
Referring to fig. 1, 2, 3 and 4, a high temperature resistant LED control circuit board is shown, which includes: circuit substrate 1, circuit substrate 1's top is provided with copper-clad plate 2, copper-clad plate 2's top is provided with overburden 3, overburden 3's top is provided with high temperature resistant layer 4, high temperature resistant layer 4's top is provided with inoxidizing coating 5, copper-clad plate 2 includes copper-clad laminate 201, copper-clad laminate 201's surface is provided with adhesive 202, adhesive 202's surface is provided with reinforcing material layer 203, high temperature resistant layer 4 includes polyimide layer 401, polyimide layer 401's surface is provided with fine cloth layer 402 of glass, fine cloth layer 402's surface of glass is provided with insulating layer 403.
Further, the covering layer 3 includes a conductive layer 301, an ink layer 302 is disposed on an outer surface of the conductive layer 301, and a heat conductive insulating adhesive layer 303 is disposed on an outer surface of the ink layer 302.
In the embodiment, the high-temperature resistant layer 4 has excellent high-frequency dielectric property, high-temperature resistance and excellent radiation resistance, and can be used at a high temperature of 230 ℃ for a long time, so that the high-temperature resistance of the circuit board is improved, and the service life of the circuit board is prolonged.
Further, the thickness of the copper-clad plate 2 is 1.5mm, and the thickness of the covering layer 3 is 1.0mm.
In this embodiment, the glass fiber cloth layer 402 and the insulating layer 403 have excellent heat dissipation, electrical performance, electromagnetic shielding performance and good machining performance, so that the high temperature resistance of the circuit board is improved, the insulating performance of the circuit board is further improved, and the service life of the circuit board is prolonged.
Further, the adhesive 202 is an epoxy material, and an outer surface of the adhesive 202 is adhered to an inner surface of the reinforcing material layer 203.
In this embodiment, through conducting layer 301, printing ink layer 302 and heat conduction insulating adhesive layer 303, improved circuit board heat conduction and corrosion-resistant effect, solved the poor problem of the high temperature resistant effect of circuit board to reach the advantage that high temperature resistant effect is good, made circuit board heat conduction efficiency improve simultaneously, promoted the radiating effect of circuit board.
Further, the thickness of the glass fiber cloth layer 402 is 0.2-0.8mm, and the thickness of the insulating layer 403 is 0.5-1.2mm.
In this embodiment, by providing the covering layer 3 and the protective layer 5, the flexible printed circuit board has high reliability and excellent flexibility, and also has the characteristics of high wiring density, light weight, thin thickness and good bending property.
Further, the thickness of the polyimide layer 401 is the same as that of the fiberglass cloth layer 402.
In this embodiment, the polyimide layer 401 is disposed, so that the flexible printed circuit board has high reliability, excellent flexibility, high wiring density, light weight, small thickness, and good bending property.
When the printed circuit board is used, the high-temperature-resistant layer 4 has excellent high-frequency dielectric property, the high-temperature resistance and the excellent radiation resistance, the printed circuit board can be used at a high temperature of 230 ℃ for a long time, the high-temperature resistance of the circuit board is improved, the service life of the circuit board is prolonged, the glass fiber cloth layer 402 and the insulating layer 403 have excellent heat dissipation performance, the electrical performance, the electromagnetic shielding performance and the good machining performance are realized, the high-temperature resistance of the circuit board is improved, the insulating performance of the circuit board is further improved, the service life of the circuit board is prolonged, the heat conduction and corrosion resistance effects of the circuit board are improved through the conducting layer 301, the ink layer 302 and the heat conduction insulating adhesive layer 303, the problem of poor high-temperature-resistant effect of the circuit board is solved, the advantage of good high-temperature-resistant effect is achieved, meanwhile, the heat conduction efficiency of the circuit board is improved, the heat dissipation effect of the circuit board is improved, and the high reliability and the excellent flexible printed circuit board is also characterized by high wiring density, light weight, thin thickness and good bending property.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A high temperature resistant LED control circuit board, characterized by includes: the copper-clad plate comprises a circuit substrate (1), wherein a copper-clad plate (2) is arranged at the top of the circuit substrate (1), a covering layer (3) is arranged at the top of the copper-clad plate (2), a high-temperature-resistant layer (4) is arranged at the top of the covering layer (3), a protective layer (5) is arranged at the top of the high-temperature-resistant layer (4), the copper-clad plate (2) comprises a copper-clad plate (201), an adhesive (202) is arranged on the outer surface of the copper-clad plate (201), a reinforcing material layer (203) is arranged on the outer surface of the adhesive (202), the high-temperature-resistant layer (4) comprises a polyimide layer (401), a glass fiber cloth layer (402) is arranged on the outer surface of the polyimide layer (401), and an insulating layer (403) is arranged on the outer surface of the glass fiber cloth layer (402).
2. The high-temperature-resistant LED control circuit board as claimed in claim 1, wherein: the covering layer (3) comprises a conductive layer (301), an ink layer (302) is arranged on the outer surface of the conductive layer (301), and a heat conduction insulating glue layer (303) is arranged on the outer surface of the ink layer (302).
3. The high-temperature-resistant LED control circuit board as claimed in claim 1, wherein: the thickness of the copper-clad plate (2) is 1.5mm, and the thickness of the covering layer (3) is 1.0mm.
4. The high-temperature-resistant LED control circuit board as claimed in claim 1, wherein: the adhesive (202) is an epoxy resin material, and the outer surface of the adhesive (202) is adhered to the inner surface of the reinforcing material layer (203).
5. The high temperature resistant LED control circuit board of claim 1, wherein: the thickness of the glass fiber cloth layer (402) is 0.2-0.8mm, and the thickness of the insulating layer (403) is 0.5-1.2mm.
6. The high temperature resistant LED control circuit board of claim 1, wherein: the thickness of the polyimide layer (401) is the same as that of the glass fiber cloth layer (402).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221599098.3U CN218336542U (en) | 2022-06-24 | 2022-06-24 | High temperature resistant LED control circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221599098.3U CN218336542U (en) | 2022-06-24 | 2022-06-24 | High temperature resistant LED control circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218336542U true CN218336542U (en) | 2023-01-17 |
Family
ID=84869317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221599098.3U Active CN218336542U (en) | 2022-06-24 | 2022-06-24 | High temperature resistant LED control circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218336542U (en) |
-
2022
- 2022-06-24 CN CN202221599098.3U patent/CN218336542U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20220279648A1 (en) | Circuit board and method for manufacturing the same | |
| US7034232B2 (en) | Keysheet module | |
| CN218336542U (en) | High temperature resistant LED control circuit board | |
| CN210807782U (en) | Substrate heat dissipation substrate structure | |
| CN108492976B (en) | Coil structure and preparation method of composite coil structure | |
| CN208768331U (en) | Circuit board structure for forming connecting terminal by limiting opening window through solder mask | |
| CN219536383U (en) | High temperature resistant effectual PCB board | |
| CN207897217U (en) | A kind of high reliability carbon ink wiring board | |
| CN215871979U (en) | High-temperature-resistant flexible circuit board | |
| CN214592122U (en) | Ceramic-based high-frequency circuit board | |
| CN218103619U (en) | Novel circuit board | |
| CN209526938U (en) | A kind of sound equipment power supply circuit board structure | |
| CN212786019U (en) | Multilayer printed circuit board | |
| CN214177634U (en) | Halogen-free insulating copper-clad plate | |
| CN217197257U (en) | Flexible copper-clad plate | |
| CN107949156A (en) | A kind of double-sided wiring board | |
| CN216600185U (en) | PCB heating plate | |
| CN216721653U (en) | Smart phone integrated circuit board based on graphite film coating | |
| CN208572540U (en) | A kind of low thermal resistance can bending aluminum substrate | |
| CN111447728B (en) | Flexible circuit board and electronic equipment | |
| CN213603048U (en) | High-density multilayer ceramic circuit board | |
| CN214774479U (en) | High heat-resistant copper-clad plate | |
| CN214315746U (en) | Composite copper-clad plate | |
| CN213907030U (en) | Anti-interference bending-resistant multilayer FPC board | |
| CN211457499U (en) | Dustproof single-layer circuit board structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |