CN215871979U - High-temperature-resistant flexible circuit board - Google Patents
High-temperature-resistant flexible circuit board Download PDFInfo
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- CN215871979U CN215871979U CN202122182630.3U CN202122182630U CN215871979U CN 215871979 U CN215871979 U CN 215871979U CN 202122182630 U CN202122182630 U CN 202122182630U CN 215871979 U CN215871979 U CN 215871979U
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- circuit board
- flexible circuit
- layer
- bonding glue
- high temperature
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Abstract
The utility model discloses a high-temperature-resistant flexible circuit board which comprises a substrate, a conducting layer arranged on the top of the substrate, a bonding glue layer arranged on the top of the conducting layer, a high-temperature-resistant protective layer arranged on the top of the bonding glue layer, and an insulating protective layer arranged on the top of the high-temperature-resistant protective layer; the upper surface of the adhesive layer is provided with a plurality of transverse grooves in a downward concave manner; this flexible circuit board can paste the one side of high temperature resistant layer to the conducting layer through the bonding glue film on, improves flexible circuit board's high temperature resistance, can be again through setting up the horizontal groove on the bonding glue film, utilizes the horizontal groove to make sealed no gluey district on the bonding glue film, improves the compliance of bonding glue film, reduces the adverse effect of bonding glue film to flexible circuit board's winding folding nature.
Description
Technical Field
The utility model relates to the technical field of flexible circuit boards, in particular to a high-temperature-resistant flexible circuit board.
Background
The circuit board has the name: a circuit board, a PCB board, an aluminum substrate, a high frequency board, a thick copper board, an impedance board, a PCB, an ultra-thin circuit board, a printed (copper etching technology) circuit board, etc.; the circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout; the Circuit Board may be referred to as a Printed Circuit Board (PCB) or a Printed Circuit Board (PCB) in english, and the Circuit Board is widely used in the field of electronic products.
The FPC circuit board is also called as a flexible circuit board, and is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent performance; the prior art is fixed to the conducting layer through the direct bonding of high temperature resistant layer and is kept away from the one side of base plate, improves flexible circuit board's high temperature resistance, and this kind of mode can improve flexible circuit board's high temperature resistance, but the hardness of bonding glue film is greater than flexible circuit board's hardness, and the bonding glue film can produce great adverse effect to flexible circuit board's convolution nature.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present invention is directed to a high temperature resistant flexible circuit board, which can improve the high temperature resistant performance of the flexible circuit board and reduce the adverse effect of the adhesive layer on the folding performance of the flexible circuit board.
In order to solve the technical problems, the technical scheme of the utility model is as follows: a high-temperature-resistant flexible circuit board comprises a substrate, a conductive layer arranged on the top of the substrate, an adhesive layer arranged on the top of the conductive layer, a high-temperature-resistant protective layer arranged on the top of the adhesive layer, and an insulating protective layer arranged on the top of the high-temperature-resistant protective layer; the upper surface of the bonding glue layer is provided with a plurality of transverse grooves which are transversely arranged along the length direction of the bonding glue layer and are parallel to each other, and the transverse grooves are surrounded into a closed structure by the adhesive layer, the conductive layer and the high-temperature-resistant protective layer.
Preferably, the substrate is a polyimide substrate.
Preferably, the conductive layer is a copper foil conductive layer.
Preferably, the adhesive layer is an epoxy adhesive layer.
Preferably, the high-temperature-resistant protective layer is a carbon fiber high-temperature-resistant protective layer.
Preferably, the insulating protective layer is an acrylic resin protective layer.
The technical effects of the utility model are mainly embodied as follows: this flexible circuit board can paste the one side of high temperature resistant layer to the conducting layer through the bonding glue film on, improves flexible circuit board's high temperature resistance, can be again through setting up the horizontal groove on the bonding glue film, utilizes the horizontal groove to make sealed no gluey district on the bonding glue film, improves the compliance of bonding glue film, reduces the adverse effect of bonding glue film to flexible circuit board's winding folding nature.
Drawings
FIG. 1 is a schematic structural diagram of a high temperature-resistant flexible circuit board according to the present invention;
FIG. 2 is a schematic partial cross-sectional structural view of FIG. 1;
fig. 3 is a schematic longitudinal sectional view of fig. 1.
Detailed Description
The following detailed description of the embodiments of the present invention is provided in order to make the technical solution of the present invention easier to understand and understand.
In the present embodiment, it should be understood that the terms "middle", "upper", "lower", "top", "right", "left", "above", "back", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the present embodiment, if the connection or fixing manner between the components is not specifically described, the connection or fixing manner may be a bolt fixing manner, a pin connecting manner, or the like, which is commonly used in the prior art, and therefore, details thereof are not described in the present embodiment.
The utility model provides a high temperature resistant flexible circuit board, as shown in fig. 1-3, includes base plate 1, sets up conducting layer 2 at the top of base plate 1, still including setting up the bonding glue film 3 at the top of conducting layer 2, the setting is in the high temperature resistant inoxidizing coating 4 at the top of bonding glue film 3 sets up the insulating inoxidizing coating 5 at the top of high temperature resistant inoxidizing coating 4. The upper surface of bonding glue film 3 is provided with down caves in and carries out transverse arrangement, and a plurality of horizontal grooves 31 that are parallel to each other along the length direction of bonding glue film 3, just adhesive layer 3, conducting layer 2 and high temperature resistant inoxidizing coating 4 enclose into airtight structure horizontal grooves 31.
In the present embodiment, the substrate 1 is a polyimide substrate. The polyimide is yellow in color, and has excellent high and low temperature resistance, electric insulation, adhesion, radiation resistance and medium resistance.
In this embodiment, the conductive layer 2 is a copper foil conductive layer.
In this embodiment, the adhesive layer 3 is an epoxy adhesive layer. The epoxy resin adhesive has good chemical resistance and insulating property.
In this embodiment, the high temperature-resistant protective layer 4 is a carbon fiber high temperature-resistant protective layer. The carbon fiber has the characteristics of high temperature resistance, friction resistance, heat conduction, corrosion resistance and the like.
In this embodiment, the insulating protection layer 5 is an acrylic protection layer. The acrylic resin has good high and low temperature resistance, becomes a layer of transparent protective film after being cured, has excellent insulation, moisture resistance, electric leakage resistance, shock resistance, dust resistance, corrosion resistance, aging resistance, corona resistance and the like, and can effectively protect the flexible circuit board.
The technical effects of the utility model are mainly embodied as follows: this flexible circuit board can paste the one side of high temperature resistant layer to the conducting layer through the bonding glue film on, improves flexible circuit board's high temperature resistance, can be again through setting up the horizontal groove on the bonding glue film, utilizes the horizontal groove to make sealed no gluey district on the bonding glue film, improves the compliance of bonding glue film, reduces the adverse effect of bonding glue film to flexible circuit board's winding folding nature.
The above are only typical examples of the present invention, and besides, the present invention may have other embodiments, and all the technical solutions formed by equivalent substitutions or equivalent changes are within the scope of the present invention as claimed.
Claims (6)
1. The utility model provides a high temperature resistant flexible circuit board, includes the base plate, sets up the conducting layer at the top of base plate, its characterized in that: the conductive layer is arranged on the surface of the substrate, and the conductive layer is arranged on the surface of the substrate; the upper surface of the adhesive layer is provided with a plurality of transverse grooves which are sunken downwards.
2. A high temperature resistant flexible circuit board according to claim 1, wherein: the substrate is a polyimide substrate.
3. A high temperature resistant flexible circuit board according to claim 1, wherein: the conducting layer is a copper foil conducting layer.
4. A high temperature resistant flexible circuit board according to claim 1, wherein: the bonding glue layer is an epoxy resin bonding glue layer.
5. A high temperature resistant flexible circuit board according to claim 1, wherein: the high-temperature-resistant protective layer is a carbon fiber high-temperature-resistant protective layer.
6. A high temperature resistant flexible circuit board according to claim 1, wherein: the insulating protective layer is an acrylic resin protective layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122182630.3U CN215871979U (en) | 2021-09-09 | 2021-09-09 | High-temperature-resistant flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122182630.3U CN215871979U (en) | 2021-09-09 | 2021-09-09 | High-temperature-resistant flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215871979U true CN215871979U (en) | 2022-02-18 |
Family
ID=80257835
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122182630.3U Active CN215871979U (en) | 2021-09-09 | 2021-09-09 | High-temperature-resistant flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215871979U (en) |
-
2021
- 2021-09-09 CN CN202122182630.3U patent/CN215871979U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A high-temperature resistant flexible circuit board Effective date of registration: 20230620 Granted publication date: 20220218 Pledgee: Zhongshan Torch High-tech Industrial Development Zone Branch of Agricultural Bank of China Co.,Ltd. Pledgor: ZHONGSHAN YUANSHENG ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023980044993 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right |