CN220653607U - Stacked multilayer flexible circuit board - Google Patents
Stacked multilayer flexible circuit board Download PDFInfo
- Publication number
- CN220653607U CN220653607U CN202322315141.XU CN202322315141U CN220653607U CN 220653607 U CN220653607 U CN 220653607U CN 202322315141 U CN202322315141 U CN 202322315141U CN 220653607 U CN220653607 U CN 220653607U
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- CN
- China
- Prior art keywords
- circuit board
- flexible circuit
- layer
- multilayer flexible
- material layer
- Prior art date
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- 239000000463 material Substances 0.000 claims abstract description 27
- 239000004642 Polyimide Substances 0.000 claims abstract description 23
- 229920001721 polyimide Polymers 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000004744 fabric Substances 0.000 claims abstract description 18
- 239000003365 glass fiber Substances 0.000 claims abstract description 16
- 238000003466 welding Methods 0.000 claims abstract description 4
- 238000004891 communication Methods 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 claims description 11
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 239000011152 fibreglass Substances 0.000 claims 2
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 230000005012 migration Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model provides a stacked multilayer flexible circuit board, comprising: the surface of the anti-welding ink layer is adhered with a glass fiber cloth layer, and the surface of the glass fiber cloth layer is adhered with a polyimide substrate; and the upper curing high-frequency material layer is adhered to the surface of the polyimide substrate, and a plurality of grooves are formed in the surface of the upper curing high-frequency material layer. According to the stacked multilayer flexible circuit board provided by the utility model, the plurality of grooves are formed in the surface of the upper cured high-frequency material layer on the surface of the polyimide substrate, so that heat generated during long-time use of the whole stack can be dissipated.
Description
Technical Field
The utility model relates to the field of circuit boards, in particular to a stacked multilayer flexible circuit board.
Background
The flexible printed circuit board is also called a flexible circuit board, which is made of polyimide or polyester film as a base material, has high reliability, excellent flexibility, high wiring density, light weight, thin thickness and good flexibility.
The current multilayer flexible circuit board can be used by connecting a plurality of circuit boards up and down when being stacked, and when the current circuit boards are stacked up and down and bonded together, the temperature of the circuit boards can be increased when the circuit boards work for a long time, and heat is difficult to dissipate rapidly.
Accordingly, there is a need to provide a stacked multilayer flexible circuit board that solves the above-described technical problems.
Disclosure of Invention
The utility model provides a stacked multilayer flexible circuit board, which solves the problems that when a plurality of circuit boards are stacked up and down and are adhered together for use, the temperature of the circuit boards is increased during long-time working, and heat is difficult to dissipate rapidly.
In order to solve the above technical problems, the present utility model provides a stacked multilayer flexible circuit board, including:
the surface of the anti-welding ink layer is adhered with a glass fiber cloth layer, and the surface of the glass fiber cloth layer is adhered with a polyimide substrate;
and the upper curing high-frequency material layer is adhered to the surface of the polyimide substrate, and a plurality of grooves are formed in the surface of the upper curing high-frequency material layer.
Preferably, a plurality of conductive components are arranged on the surface of the upper cured high-frequency material layer, the plurality of conductive components comprise circular through grooves, and conductive blocks are arranged inside the circular through grooves.
Preferably, the grooves are formed to act on heat dissipation of the solder resist ink layer, the glass fiber cloth layer and the polyimide substrate during operation.
Preferably, the solder resist ink layer acts as a protection for the glass fiber cloth layer and the polyimide substrate.
Preferably, a heat dissipation assembly is arranged on the surface of the upper cured high-frequency material layer, the heat dissipation assembly comprises a communication groove, and a conductive piece is arranged inside the communication groove.
Preferably, the communication groove acts on the flow of heat.
Compared with the related art, the stacked multilayer flexible circuit board provided by the utility model has the following beneficial effects:
the utility model provides a stacked multilayer flexible circuit board, wherein a plurality of grooves are formed on the surface of a cured high-frequency material layer on the surface of a polyimide substrate, so that heat generated during long-time use of the whole stack can be dissipated.
Drawings
Fig. 1 is a schematic structural diagram of a first embodiment of a stacked multi-layer flexible circuit board according to the present utility model;
FIG. 2 is an enlarged schematic view of portion A shown in FIG. 1;
FIG. 3 is a schematic perspective view of the entire apparatus shown in FIG. 1;
fig. 4 is a schematic structural diagram of a second embodiment of a stacked multi-layer flexible circuit board according to the present utility model.
Reference numerals in the drawings: 1. the anti-welding ink layer 2, the glass fiber cloth layer 3, the polyimide substrate 4, the upper solidified high-frequency material layer 5, the groove 6, the conductive component 61, the circular through groove 62, the conductive block 7, the heat dissipation component 71, the communication groove 72 and the conductive piece.
Detailed Description
The utility model will be further described with reference to the drawings and embodiments.
Examples
Referring to fig. 1, fig. 2 and fig. 3 in combination, fig. 1 is a schematic structural diagram of a first embodiment of a stacked multi-layer flexible circuit board according to the present utility model; FIG. 2 is an enlarged schematic view of portion A shown in FIG. 1; fig. 3 is a schematic perspective view of the whole device shown in fig. 1. A stacked multilayer flexible circuit board comprising:
a glass fiber cloth layer 2 is adhered to the surface of the solder mask ink layer 1, and a polyimide substrate 3 is adhered to the surface of the glass fiber cloth layer 2;
an upper cured high-frequency material layer 4, wherein the upper cured high-frequency material layer 4 is adhered to the surface of the polyimide substrate 3, and a plurality of grooves 5 are formed in the surface of the upper cured high-frequency material layer 4.
The upper cured high-frequency material layer 4 can bond the polyimide substrates 3 together by heating at high temperature.
The surface of the upper cured high-frequency material layer 4 is provided with a plurality of conductive components 6, a plurality of the conductive components 6 comprise circular through grooves 61, and conductive blocks 62 are arranged inside the circular through grooves 61.
The upper solidified high-frequency material layer 4 is MPI film, LCP film, TFP film, PTFE film, low-Dk high-frequency functional adhesive or high-frequency material with copper ion migration resistance, and the design of the solder resist ink layer 1 can effectively protect the circuit on the circuit board, prevent the circuit from oxidation or cause open circuit or short circuit problem due to careless wiping, and improve the use safety.
The circular through grooves 61 are formed on the surface of the upper cured high-frequency material layer 4, and the conductive blocks 62 are convenient for stacking the solder resist ink layers 1, the glass fiber cloth layers 2 and the polyimide substrates 3 for use, so that the conductive blocks can play a role in conducting electricity.
The grooves 5 are formed to act on heat dissipation of the solder mask ink layer 1, the glass fiber cloth layer 2 and the polyimide substrate 3 during operation.
The solder resist ink layer 1 acts on the protection of the glass fiber cloth layer 2 and the polyimide substrate 3.
The working principle of the stacked multilayer flexible circuit board provided by the utility model is as follows:
in use, when the temperature rises after the plurality of solder resist ink layers 1, the plurality of glass fiber cloth layers 2 and the plurality of polyimide substrates 3 are stacked together to operate, heat is generated to discharge heat through the plurality of grooves 5 opened on the surface of the upper cured high frequency material layer 4.
Compared with the related art, the stacked multilayer flexible circuit board provided by the utility model has the following beneficial effects:
the utility model provides a stacked multi-layer flexible circuit board, wherein a plurality of grooves 5 are formed on the surface of a cured high-frequency material layer 4 on the surface of a polyimide substrate 3, so that heat generated during long-time use of the whole stack can be dissipated.
Examples
Referring to fig. 4 in combination, another stacked multi-layer flexible circuit board is proposed according to a second embodiment of the present application. The second embodiment is merely a preferred manner of the first embodiment, and implementation of the second embodiment does not affect the implementation of the first embodiment alone.
Specifically, the second embodiment of the present application provides a stacked multi-layer flexible circuit board, which is different in that a surface of the upper cured high-frequency material layer 4 is provided with a heat dissipating component 7, the heat dissipating component 7 includes a communication groove 71, and a conductive member 72 is disposed inside the communication groove 71.
The communicating grooves 71 are formed on the surface of the upper cured high-frequency material layer 4, and the communicating grooves 71 are formed by a plurality of rectangular communicating grooves in a staggered manner, and the conductive members 72 are also rectangular conductive blocks in a staggered manner.
The communication groove 71 acts on the flow of heat.
The working principle of the stacked multilayer flexible circuit board provided by the utility model is as follows:
in use, when the plurality of solder resist ink layers 1, the plurality of glass fiber cloth layers 2 and the plurality of polyimide substrates 3 are stacked together to operate to conduct a conductive operation through the conductive member 72, the communication groove 71 can conduct heat transfer.
Compared with the related art, the stacked multilayer flexible circuit board provided by the utility model has the following beneficial effects:
the utility model provides a stacked multi-layer flexible circuit board, wherein a communication groove 71 and a conductive member 72 are arranged on the surface of an upper cured high-frequency material layer 4, so that the stacked circuit boards can be electrified, and heat can be conveyed.
The foregoing description is only illustrative of the present utility model and is not intended to limit the scope of the utility model, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present utility model.
Claims (6)
1. A stacked multilayer flexible circuit board, comprising:
the surface of the anti-welding ink layer is adhered with a glass fiber cloth layer, and the surface of the glass fiber cloth layer is adhered with a polyimide substrate;
and the upper curing high-frequency material layer is adhered to the surface of the polyimide substrate, and a plurality of grooves are formed in the surface of the upper curing high-frequency material layer.
2. The stacked multilayer flexible circuit board of claim 1, wherein a surface of the upper cured high frequency material layer is provided with a plurality of conductive members, a plurality of the conductive members comprising circular through grooves, and conductive blocks being provided inside the circular through grooves.
3. The stacked multi-layer flexible circuit board of claim 1, wherein the opening of the grooves acts on heat dissipation of the solder resist ink layer, the fiberglass cloth layer, and the polyimide substrate when in operation.
4. The stacked multilayer flexible circuit board of claim 1, wherein the solder resist ink layer acts as a shield for the fiberglass cloth layer and the polyimide substrate.
5. The stacked multilayer flexible circuit board of claim 1, wherein a surface of the upper cured high frequency material layer is provided with a heat dissipating assembly comprising a communication slot, an inside of which is provided with a conductive member.
6. The stacked multilayer flexible circuit board of claim 5, wherein the communication slots act on the flow of heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322315141.XU CN220653607U (en) | 2023-08-28 | 2023-08-28 | Stacked multilayer flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322315141.XU CN220653607U (en) | 2023-08-28 | 2023-08-28 | Stacked multilayer flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220653607U true CN220653607U (en) | 2024-03-22 |
Family
ID=90292864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322315141.XU Active CN220653607U (en) | 2023-08-28 | 2023-08-28 | Stacked multilayer flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220653607U (en) |
-
2023
- 2023-08-28 CN CN202322315141.XU patent/CN220653607U/en active Active
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