CN216600182U - Flexible circuit board with high-frequency signal transmission function - Google Patents
Flexible circuit board with high-frequency signal transmission function Download PDFInfo
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- CN216600182U CN216600182U CN202122514475.0U CN202122514475U CN216600182U CN 216600182 U CN216600182 U CN 216600182U CN 202122514475 U CN202122514475 U CN 202122514475U CN 216600182 U CN216600182 U CN 216600182U
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Abstract
The application provides a flexible circuit board with high frequency signal transmission function includes: the circuit board comprises at least one first circuit substrate, at least one second circuit substrate and a circuit board, wherein each first circuit substrate comprises a first dielectric layer and a first conductive circuit layer arranged on the first dielectric layer, and each first conductive circuit layer comprises a first welding pad and a second welding pad; each second circuit substrate comprises a second dielectric layer and a second conductive circuit layer arranged on the second dielectric layer, and the second conductive circuit layer comprises third welding pads and fourth welding pads; and at least one conductive adhesive layer, wherein the conductive adhesive layer is positioned between the second welding pad and the third welding pad. The application improves the yield of the flexible circuit board.
Description
Technical Field
The application relates to the technical field of circuit boards, in particular to a flexible circuit board with a high-frequency signal transmission function.
Background
With the development of new energy automobiles and power batteries, the application range of Flexible Printed Circuit (FPC) is expanded. Compared with the traditional wiring harness, the FPC has the advantages of high integration, automatic assembly, light weight and the like, so that the FPC is increasingly widely applied to the power battery. Among them, the FPC plays a role of signal transmission in the power battery, and the length of the FPC is generally long. At present, when the FPC is manufactured. The prior art adopts a method of exposing the FPC in sections. However, the segmented exposure has overlapping portions and is prone to pattern misalignment. Meanwhile, the negative film needs to be replaced every time of exposure, the efficiency is low, and errors are easy to occur.
SUMMERY OF THE UTILITY MODEL
In view of the above, the present application provides a flexible circuit board having a high frequency signal transmission function, which can solve the above-mentioned problems.
An embodiment of the present application provides a flexible circuit board with a high-frequency signal transmission function, including:
the circuit board comprises at least one first circuit substrate, at least one second circuit substrate and a plurality of second circuit substrates, wherein each first circuit substrate comprises a first dielectric layer and a first conductive circuit layer arranged on the first dielectric layer, each first conductive circuit layer comprises a first welding pad and a second welding pad, and the first welding pad and the second welding pad are respectively positioned at two opposite ends of the first conductive circuit layer;
each second circuit substrate comprises a second dielectric layer and a second conductive circuit layer arranged on the second dielectric layer, the second conductive circuit layer comprises a third welding pad and a fourth welding pad, and the third welding pad and the fourth welding pad are respectively positioned at two opposite ends of the first conductive circuit layer; and
and the conductive adhesive layer is positioned between the second welding pad and the third welding pad and is used for electrically connecting the second welding pad and the third welding pad so as to electrically connect the first circuit substrate and the second circuit substrate.
In some possible embodiments, the first circuit substrate further includes a first cover film on the first conductive trace layer, and along the extending direction of the flexible circuit board, two ends of the first conductive trace layer respectively protrude to form a first step and a second step compared to the first cover film, the second circuit substrate further includes a second cover film on the second conductive trace layer, and along the extending direction of the flexible circuit board, two ends of the second conductive trace layer protrude to form a third step and a fourth step compared to the second cover film, the second pad is on the second step, and the third pad is on the third step.
In some possible embodiments, the first cover film includes a first adhesive layer on the first conductive traces and a first protective layer on the first adhesive layer, and the second cover film includes a second adhesive layer on the second conductive traces and a second protective layer on the second adhesive layer.
In some possible embodiments, a surface of the first cover film away from the first conductive circuit layer is flush with a surface of the second dielectric layer away from the second conductive circuit layer, and a surface of the second cover film away from the second conductive circuit layer is flush with a surface of the first dielectric layer away from the first conductive circuit layer.
In some possible embodiments, the flexible circuit board further includes a first surface treatment layer and a second surface treatment layer. The first surface treatment layer is located on the second bonding pad, and the second surface treatment layer is located on the third bonding pad. Wherein the conductive adhesive layer is positioned between the first surface treatment layer and the second surface treatment layer.
In some possible embodiments, the material of the first dielectric layer and the material of the second dielectric layer are both liquid crystal polymers.
In some possible embodiments, the number of the first circuit substrates is greater than or equal to two.
In some possible embodiments, the number of the second circuit substrates is greater than or equal to two.
The first welding pads and the second welding pads are arranged at two ends of each first conductive circuit layer respectively, the third welding pads and the fourth welding pads are arranged at two ends of each second conductive circuit layer respectively, and the second welding pads and the third welding pads are electrically connected through the conductive adhesive layers, so that at least one first circuit substrate and at least one second circuit substrate are electrically connected to obtain the flexible circuit board, the problem that a sectional exposure method is adopted in the prior art is solved, and the yield of the flexible circuit board is improved.
Drawings
Fig. 1 is a schematic structural diagram of a flexible circuit board provided in a first embodiment of the present application.
Fig. 2 is a schematic structural diagram of a flexible circuit board provided in a second embodiment of the present application.
Description of the main elements
First dielectric layer 11
First conductive circuit layer 12
First adhesive layer 131
First protective layer 132
First surface treatment layer 30
Second circuit board 40
Second dielectric layer 41
Second conductive trace layer 42
Second adhesive layer 431
Second protective layer 432
Second surface treatment layer 60
Conductive adhesive layer 70
The following detailed description will further illustrate the present application in conjunction with the above-described figures.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.
To further explain the technical means and effects of the present application for achieving the intended purpose, the following detailed description is given to the present application in conjunction with the accompanying drawings and preferred embodiments.
Referring to fig. 1, a flexible circuit board 100 with high frequency signal transmission function is provided in a first embodiment of the present application, where the flexible circuit board 100 includes at least one first circuit substrate 10, at least one first surface treatment layer 30, at least one second circuit substrate 40, at least one second surface treatment layer 60, and at least one conductive adhesive layer 70.
In this embodiment, each of the first circuit substrates 10 includes a first dielectric layer 11, a first conductive trace layer 12, and a first cover film 13 sequentially stacked.
In this embodiment, the material of the first dielectric layer 11 is Liquid Crystal Polymer (LCP). In other embodiments, the material of the first dielectric layer 11 may also be Polyetheretherketone (PEEK) or Polytetrafluoroethylene (PTFE) with a dielectric constant (D)k) And dielectric loss (D)f) Low material content.
The first conductive trace layer 12 includes a first pad (not shown) and a second pad 121, and the first pad and the second pad 121 are respectively located at two opposite ends of the first conductive trace layer 12. Compared with the thicknesses of other positions in the first conductive circuit layer 12, the thicknesses of the first bonding pad and the second bonding pad 121 in the first conductive circuit layer 12 are smaller, so that the flatness of the flexible circuit board 100 is improved. Along the extending direction of the flexible circuit board 100, two ends of the first conductive trace layer 12 respectively protrude to form a first step (not shown) and a second step 20 compared to the first cover film 13. Wherein the first pad is exposed to the first step, and the second pad 121 is exposed to the second step 20.
The first cover film 13 includes a first adhesive layer 131 on the first conductive trace layer 12 and a first protective layer 132 on the first adhesive layer 131.
In this embodiment, the first adhesive layer 131 may be made of an acrylic hot melt adhesive (AD adhesive). The first protection layer 132 may be made of one of epoxy resin (epoxy resin), polypropylene (PP), BT resin, Polyphenylene Oxide (PPO), Polyimide (PI), Polyethylene Terephthalate (PET), and Polyethylene Naphthalate (PEN). In this embodiment, the first protection layer 132 is made of polyimide.
The first surface treatment layer 30 is located on the second pad 121 and electrically connected to the second pad 121. In this embodiment, the first surface treatment layer 30 may be made of gold.
In this embodiment, the second circuit substrate 40 includes a second dielectric layer 41, a second conductive trace layer 42, and a second cover film 43 sequentially stacked.
In this embodiment, the material of the second dielectric layer 41 is Liquid Crystal Polymer (LCP). In other embodiments, the material of the second dielectric layer 41 may also be Polyetheretherketone (PEEK) or Polytetrafluoroethylene (PTFE) with a dielectric constant (D)k) And dielectric loss (D)f) Low material content.
The second conductive trace layer 42 includes a third pad 421 and a fourth pad (not shown), and the third pad 421 and the fourth pad are respectively located at two opposite ends of the second conductive trace layer 42. Compared with the thicknesses of other positions in the second conductive trace layer 42, the thicknesses of the third pad 421 and the fourth pad in the second conductive trace layer 42 are smaller, so as to improve the flatness of the flexible circuit board 100. Along the extending direction of the flexible circuit board 100, two ends of the second conductive trace layer 42 respectively protrude out compared with the second cover film 43 to form a third step 50 and a fourth step (not shown). Wherein the third pad 421 is exposed to the third step 50, and the fourth pad is exposed to the fourth step.
The second cover film 43 includes a second adhesive layer 431 on the second conductive trace layer 42 and a second protective layer 432 on the second adhesive layer 431.
In this embodiment, the second adhesive layer 431 may be made of an acrylic hot melt adhesive (AD adhesive). The material of the second protection layer 432 may be the same as the material of the first protection layer 132, and specific reference may be made to the material of the first protection layer 132, which is not described in detail herein.
The second surface treatment layer 60 is disposed on the third pad 421 and electrically connected to the third pad 421. In this embodiment, the second surface treatment layer 60 may be made of gold.
The conductive adhesive layer 70 is located between the first surface treatment layer 30 and the second surface treatment layer 60. That is, the conductive adhesive layer 70 is located between the second pad 121 and the third pad 421. The conductive adhesive layer 70 is electrically connected to the first surface treatment layer 30 and the second surface treatment layer 60, and further electrically connected to the second pad 121 and the third pad 421, so that the first circuit substrate 10 and the second circuit substrate 40 can be electrically connected. In this embodiment, the conductive adhesive layer 70 may be a conductive paste. The conductive paste can be solder paste, copper paste, and the like.
As shown in fig. 1, in this embodiment, a surface of the first cover film 13 away from the first conductive trace layer 12 is flush with a surface of the second dielectric layer 41 away from the second conductive trace layer 42, and a surface of the second cover film 43 away from the second conductive trace layer 42 is flush with a surface of the first dielectric layer 11 away from the first conductive trace layer 12.
In this embodiment, the second protection layer 432 has a portion of the first dielectric layer 11 thereon, but this does not affect the use of the flexible circuit board 100. In other embodiments, the first dielectric layer 11 on the second protective layer 432 may be deleted.
It should be noted that, in the present application, the number of the first circuit boards 10 and the number of the second circuit boards 40 are not limited, and both the number of the first circuit boards 10 and the number of the second circuit boards 40 can be selected according to needs. That is, the number of the first circuit boards 10 and the number of the second circuit boards 40 may be one or more than two. When the number of the first circuit substrates 10 and the number of the second circuit substrates 40 are both multiple, the connection manner of the first circuit substrates 10 and the second circuit substrates 40 may be referred to sequentially connect the two ends of the multiple first circuit substrates 10 and the two ends of the multiple second circuit substrates 40, so as to obtain the required flexible circuit board.
Referring to fig. 2, a flexible circuit board 200 with high frequency signal transmission function is provided in a second embodiment of the present application, and the flexible circuit board 200 provided in the second embodiment is different from the flexible circuit board 100 provided in the first embodiment in that: the surface of the first cover film 13 away from the first conductive trace layer 12 protrudes from the surface of the second medium layer 41 away from the second conductive trace layer 42, and the surface of the second cover film 43 away from the second conductive trace layer 42 protrudes from the surface of the first medium layer 11 away from the first conductive trace layer 12.
It should be noted that the above-mentioned protrusion does not affect the use of the flexible circuit board 200. In other embodiments, the surface of the first coverlay 13 away from the first conductive trace layer 12 may be flush with the surface of the second dielectric layer 41 away from the second conductive trace layer 42, and the surface of the second coverlay 43 away from the second conductive trace layer 42 may be flush with the surface of the first dielectric layer 11 away from the first conductive trace layer 12.
The first welding pad and the second welding pad 121 are respectively arranged at two ends of each first conductive circuit layer 12, the third welding pad 421 and the fourth welding pad are respectively arranged at two ends of each second conductive circuit layer 42, the second welding pad 121 and the third welding pad 421 are electrically connected through the conductive adhesive layer 70, so that at least one first circuit substrate 10 and at least one second circuit substrate 40 are electrically connected to obtain the flexible circuit board 100, the problem of the prior art adopting a segmented exposure method is solved, and the yield of the flexible circuit board 100 is improved.
The above description is only an embodiment optimized for the present application, but in practical application, the present invention is not limited to this embodiment.
Claims (8)
1. A flexible circuit board having a high-frequency signal transmission function, comprising:
the circuit board comprises at least one first circuit substrate, at least one second circuit substrate and a plurality of second circuit substrates, wherein each first circuit substrate comprises a first dielectric layer and a first conductive circuit layer arranged on the first dielectric layer, each first conductive circuit layer comprises a first welding pad and a second welding pad, and the first welding pad and the second welding pad are respectively positioned at two opposite ends of the first conductive circuit layer;
each second circuit substrate comprises a second dielectric layer and a second conductive circuit layer arranged on the second dielectric layer, the second conductive circuit layer comprises a third welding pad and a fourth welding pad, and the third welding pad and the fourth welding pad are respectively positioned at two opposite ends of the first conductive circuit layer; and
and the conductive adhesive layer is positioned between the second welding pad and the third welding pad and is used for electrically connecting the second welding pad and the third welding pad so as to electrically connect the first circuit substrate and the second circuit substrate.
2. The flexible circuit board according to claim 1, wherein the first circuit board further includes a first cover film on the first conductive trace layer, and both ends of the first conductive trace layer protrude from the first cover film along the extending direction of the flexible circuit board to form a first step and a second step, respectively, and the second circuit board further includes a second cover film on the second conductive trace layer, and both ends of the second conductive trace layer protrude from the second cover film along the extending direction of the flexible circuit board to form a third step and a fourth step, the second pad being on the second step, and the third pad being on the third step.
3. The flexible circuit board of claim 2, wherein the first coverlay film comprises a first adhesive layer on the first conductive traces and a first protective layer on the first adhesive layer, and the second coverlay film comprises a second adhesive layer on the second conductive traces and a second protective layer on the second adhesive layer.
4. The flexible circuit board of claim 2, wherein a surface of the first coverlay away from the first conductive trace layer is flush with a surface of the second dielectric layer away from the second conductive trace layer, and a surface of the second coverlay away from the second conductive trace layer is flush with a surface of the first dielectric layer away from the first conductive trace layer.
5. The flexible circuit board of claim 1, further comprising:
a first surface treatment layer on the second pad;
a second surface treatment layer on the third pad;
wherein the conductive adhesive layer is positioned between the first surface treatment layer and the second surface treatment layer.
6. The flexible circuit board of claim 1, wherein the first dielectric layer and the second dielectric layer are both liquid crystal polymer.
7. The flexible circuit board according to claim 1, wherein the number of the first wiring substrates is greater than or equal to two.
8. The flexible circuit board according to claim 7, wherein the number of the second wiring substrates is greater than or equal to two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122514475.0U CN216600182U (en) | 2021-10-19 | 2021-10-19 | Flexible circuit board with high-frequency signal transmission function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122514475.0U CN216600182U (en) | 2021-10-19 | 2021-10-19 | Flexible circuit board with high-frequency signal transmission function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216600182U true CN216600182U (en) | 2022-05-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122514475.0U Active CN216600182U (en) | 2021-10-19 | 2021-10-19 | Flexible circuit board with high-frequency signal transmission function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216600182U (en) |
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2021
- 2021-10-19 CN CN202122514475.0U patent/CN216600182U/en active Active
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