US11424563B2 - Board-to-board connecting structure and method for manufacturing the same - Google Patents
Board-to-board connecting structure and method for manufacturing the same Download PDFInfo
- Publication number
- US11424563B2 US11424563B2 US17/105,567 US202017105567A US11424563B2 US 11424563 B2 US11424563 B2 US 11424563B2 US 202017105567 A US202017105567 A US 202017105567A US 11424563 B2 US11424563 B2 US 11424563B2
- Authority
- US
- United States
- Prior art keywords
- dielectric layer
- layer
- circuit board
- dielectric
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active, expires
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
- H01R12/585—Terminals having a press fit or a compliant portion and a shank passing through a hole in the printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/1059—Connections made by press-fit insertion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
- H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
Description
Claims (11)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202011183271.7 | 2020-10-29 | ||
CN202011183271.7A CN114430626A (en) | 2020-10-29 | 2020-10-29 | Printed circuit board-to-printed circuit board connecting structure and manufacturing method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
US20220140508A1 US20220140508A1 (en) | 2022-05-05 |
US11424563B2 true US11424563B2 (en) | 2022-08-23 |
Family
ID=81309839
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US17/105,567 Active 2041-04-23 US11424563B2 (en) | 2020-10-29 | 2020-11-26 | Board-to-board connecting structure and method for manufacturing the same |
Country Status (3)
Country | Link |
---|---|
US (1) | US11424563B2 (en) |
CN (1) | CN114430626A (en) |
TW (1) | TWI754493B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114430626A (en) * | 2020-10-29 | 2022-05-03 | 鹏鼎控股(深圳)股份有限公司 | Printed circuit board-to-printed circuit board connecting structure and manufacturing method thereof |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5515604A (en) * | 1992-10-07 | 1996-05-14 | Fujitsu Limited | Methods for making high-density/long-via laminated connectors |
CN108028233A (en) | 2015-09-23 | 2018-05-11 | 英特尔公司 | It is used for realization the substrate, component and technology of multi-chip inversion chip package |
US20210307167A1 (en) * | 2020-03-26 | 2021-09-30 | Battelle Memorial Institute | Printed circuit board connector |
US20220140508A1 (en) * | 2020-10-29 | 2022-05-05 | Avary Holding (Shenzhen) Co., Limited. | Board-to-board connecting structure and method for manufacturing the same |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100483399B1 (en) * | 1997-09-09 | 2005-08-10 | 삼성전자주식회사 | Printed wiring board and its connection method |
GB0428591D0 (en) * | 2004-12-31 | 2005-02-09 | Bae Systems Plc | Printed circuit boards |
US20090277670A1 (en) * | 2008-05-10 | 2009-11-12 | Booth Jr Roger A | High Density Printed Circuit Board Interconnect and Method of Assembly |
DE102014222104A1 (en) * | 2014-10-29 | 2016-05-04 | Zf Friedrichshafen Ag | Circuit carrier and control unit |
CN108289368B (en) * | 2017-01-09 | 2020-07-24 | 鹏鼎控股(深圳)股份有限公司 | High-frequency signal transmission structure and manufacturing method thereof |
CN111556671A (en) * | 2020-06-29 | 2020-08-18 | 四川海英电子科技有限公司 | Manufacturing method of 5G high-frequency mixed-voltage stepped circuit board |
-
2020
- 2020-10-29 CN CN202011183271.7A patent/CN114430626A/en active Pending
- 2020-11-26 US US17/105,567 patent/US11424563B2/en active Active
- 2020-12-16 TW TW109144585A patent/TWI754493B/en active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5515604A (en) * | 1992-10-07 | 1996-05-14 | Fujitsu Limited | Methods for making high-density/long-via laminated connectors |
CN108028233A (en) | 2015-09-23 | 2018-05-11 | 英特尔公司 | It is used for realization the substrate, component and technology of multi-chip inversion chip package |
US20210307167A1 (en) * | 2020-03-26 | 2021-09-30 | Battelle Memorial Institute | Printed circuit board connector |
US20220140508A1 (en) * | 2020-10-29 | 2022-05-05 | Avary Holding (Shenzhen) Co., Limited. | Board-to-board connecting structure and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
US20220140508A1 (en) | 2022-05-05 |
CN114430626A (en) | 2022-05-03 |
TW202218501A (en) | 2022-05-01 |
TWI754493B (en) | 2022-02-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: GARUDA TECHNOLOGY CO., LTD, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHENG, XIAO-FENG;RONG, XIAO-PENG;REEL/FRAME:054475/0959 Effective date: 20201116 Owner name: QING DING PRECISION ELECTRONICS (HUAIAN) CO.,LTD, CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHENG, XIAO-FENG;RONG, XIAO-PENG;REEL/FRAME:054475/0959 Effective date: 20201116 Owner name: AVARY HOLDING (SHENZHEN) CO., LIMITED., CHINA Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:ZHENG, XIAO-FENG;RONG, XIAO-PENG;REEL/FRAME:054475/0959 Effective date: 20201116 |
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