JP4285309B2 - Electronic circuit module manufacturing method, multilayer electronic circuit module and manufacturing method thereof - Google Patents

Description

  The present invention relates to an electronic circuit module, a multilayer electronic circuit module, and a manufacturing method thereof, and in particular, a stack IC module, a memory card, a plurality of semiconductor elements, a capacitor, a resistor, and the like on which a plurality of memory chips are stacked in one stage. Relates to the multi-chip module mounted on

  2. Description of the Related Art Conventionally, a component mounting board formed by mounting a small electronic component such as a chip component on a resin substrate has been widely used in various electronic devices. Further, due to recent demands for reducing the size and weight of various electronic devices, it is strongly desired that these component mounting substrates are smaller and more electronic components and elements are mounted at a high density.

  Therefore, as a method for improving the mounting density of electronic components, Patent Document 1 discloses a method of laminating a resin substrate with built-in electronic components. FIG. 23 is a cross-sectional view of the laminated resin substrate. The laminated resin substrate 1 has a three-layer structure in which three component-embedded substrates 1A, 1B, and 1C are overlapped in the thickness direction.

Each of the component-embedded substrates 1A, 1B, and 1C has a sheet-like resin substrate 2 having a through hole 2A that is a conductive through hole, a flat electronic component 3 such as a semiconductor element, and a small electronic component 4 such as a capacitor. It is embedded by heating and pressing. The wiring layer 5 is formed so as to be connected to the electrode terminal 3A on one side of the flat electronic component 3 exposed on the surface of the resin substrate 2 and the electrode terminal 4A of the small electronic component 4. Then, the component-embedded substrates 1A, 1B, and 1C having such a configuration are overlapped and joined, and are electrically connected to each other through the through holes 2A, thereby forming the laminated resin substrate 1.
JP 2002-280744 A

  As described above, in order to incorporate the electronic component in the resin substrate, the electronic component is embedded in the sheet-shaped resin substrate by heating and pressing. At this time, a large pressing force is applied to the electronic component, but the electronic component needs to be strong enough to withstand the pressing force at the time of pressing.

  On the other hand, in order to further reduce the thickness of the laminated resin substrate, it is necessary to make the electronic component mounted in the resin substrate thinner. However, if the electronic components are made thinner, the electronic components can be damaged, such as cracks, breakage, or characteristic fluctuations, due to the large pressing force applied when the electronic components are pressed and embedded in the resin substrate as described above. There was a problem that the property became high.

The present invention has been made to solve the above-described problems. Even if the electronic component mounted in the resin substrate is thinned, the electronic component is damaged by the pressing force applied when the electronic component is pressed and embedded in the resin substrate. An object of the present invention is to provide an electronic circuit module manufacturing method , a multi-layer electronic circuit module, and a manufacturing method thereof that are less likely to be subjected to reception.

A multilayer electronic circuit module according to the present invention includes a bonded electronic component in which two electronic components each having an electrode terminal formed on at least one surface are paired, and the other surfaces of the electronic component are bonded together, and an electrode terminal A first resin sheet in which a bonded electronic component is embedded in a shape that exposes the surface of the first, a wiring layer connected to electrode terminals exposed on both surfaces of the first resin sheet, and both surfaces of the first resin sheet connecting the wiring layers formed in the first module unit having a through conductor portion stacking a plurality of multilayer first module unit between the wiring layers through the respective through conductor portion laminated is connected An electronic circuit module, wherein the multilayer electronic circuit module has a bent portion, and the thickness of the bent portion is thinner than the thickness other than the bent portion .

With such a configuration, thin electronic components can be stacked three-dimensionally, enabling higher-density mounting , and thin parts are easy to bend, so they can be easily folded around that part. Can do.

Also, the multilayer electronic circuit module of the present invention is a bonded electronic component, electrode terminal in which two electronic components having electrode terminals formed on at least one surface are paired and the other surfaces of the electronic components are bonded and integrated. Formed on both surfaces of the first resin sheet, the first resin sheet in which the bonded electronic components are embedded in a shape that exposes the surface, the wiring layer connected to the electrode terminals exposed on both surfaces of the first resin sheet A first module unit having a through conductor portion connecting between the wiring layers formed, a flat electronic component having an electrode terminal formed on at least one surface, and a flat electronic component embedded in a shape exposing the surface of the electrode terminal Each of the second module units having the second resin sheet is laminated at least one layer, and the first module unit and the second module unit are laminated. A multilayer electronic circuit module which is connected via a through conductor portion has a multi-layer electronic circuit module bent portion, the thickness of the bent portion is a thin structure than the thickness of the non-bent portion.

With such a configuration, it is possible to connect the first module unit including the junction electronic component and the second module unit including the flat plate electronic component, that is, the module units having different thicknesses, and selecting the module unit to be connected. range Ri spread, also, since the thin portion is easily bent thick, it can be folded easily around its portion.

  Further, the bent portion of the multilayer electronic circuit module of the present invention may be located at the end of the multilayer electronic circuit module, and the bent portion may be provided with a terminal portion for connecting to an external device. With such a configuration, the terminal portion can be connected to an external device, so that the multilayer electronic circuit module can be easily mounted by bending its end portion.

  The through conductor portion of the multilayer electronic circuit module of the present invention may be made of a conductive material that is softer than the bonded electronic component. With such a configuration, the through conductor portion is easily extended and conduction is ensured, so that the degree of freedom of the length is increased.

Furthermore, the electronic circuit module manufacturing method of the present invention is a bonded electronic component in which two electronic components having electrode terminals formed on at least one surface are paired, and the other surfaces of the electronic components are bonded and integrated. The bonded electronic component forming step to be formed, and the resin sheet is heated to a preset temperature and pressurized to the bonded electronic component placed at a preset position to expose the surface of the electrode terminal. A method for manufacturing an electronic circuit module, comprising: an embedding process embedded therein; and a wiring layer forming process for forming wiring layers connected to electrode terminals exposed on both surfaces of the resin sheet , embeds soft conductive material than the thickness a and bonding electronic components joining electronic parts simultaneously, there is a way that both ends thereof to form a through conductor portion is exposed on the surface of the resin sheet

By this method, the electronic components are bonded together to form a bonded electronic component, and then press-fitted into the resin sheet. Therefore, even if each electronic component is thin, rigidity is ensured, and the bonded electronic component is less likely to be damaged during press-fitting. In addition, since individual electronic components can be made thin, it is easy to produce an electronic circuit module having a thin overall dimension. Furthermore, the through conductor portion is also formed at the same time when the bonded electronic component is embedded in the resin sheet, thereby simplifying the manufacturing process.

Furthermore, in the method for manufacturing a multilayer electronic circuit module according to the present invention, a pair of two electronic components each having an electrode terminal formed on at least one surface, and the other surfaces of the electronic components are bonded together to be integrated. The first resin sheet in which the junction electronic component is embedded in a shape that exposes the surface of the electrode terminal, both the wiring layer connected to the electrode terminal exposed on both surfaces of the first resin sheet, and the first resin sheet A step of forming a first module unit having a through conductor portion connecting between wiring layers formed on the surface, and a plurality of first module units are prepared, and the first module units are arranged in a predetermined position at the wiring layer. After positioning and laminating the through conductor portions and heating, the first resin sheets are heated until they are softened, pressed and integrated by bonding, and the wiring is passed through the through conductor portions. A method of manufacturing a multilayer electronic circuit module that includes a step of connecting between the time of embedding the bonded electronic component in the first resin sheet, embedding a soft conductive material than the junction electronic component simultaneously, both ends In this method, the through conductor portion is formed by exposing the portion to the surface of the first resin sheet .

By this method, module units having bonded electronic components are stacked, so that a multilayer electronic circuit module having a small thickness and a high density can be manufactured. Further , when the bonded electronic components are embedded in the first resin sheet, they are penetrated. The conductor part is also formed at the same time, and the manufacturing process can be simplified.

Furthermore, in the method for manufacturing a multilayer electronic circuit module according to the present invention, a pair of two electronic components each having an electrode terminal formed on at least one surface, and the other surfaces of the electronic components are bonded together to be integrated. The first resin sheet in which the junction electronic component is embedded in a shape that exposes the surface of the electrode terminal, both the wiring layer connected to the electrode terminal exposed on both surfaces of the first resin sheet, and the first resin sheet A step of forming a first module unit having a through conductor portion connecting between wiring layers formed on the surface, a flat electronic component having an electrode terminal formed on at least one surface, and a shape exposing the surface of the electrode terminal Forming a second module unit having a second resin sheet in which a flat electronic component is embedded, a first module unit, and a second module unit. At least one layer is prepared, and the first module unit and the second module unit are laminated by aligning the wiring layers at preset positions, and then the first resin sheet and the second resin sheet are softened. A multilayer electronic circuit module comprising a step of heating and pressurizing until they are bonded and integrating by bonding, and connecting through a through conductor portion, and embedding a bonded electronic component in a first resin sheet In this case, a conductive material softer than the bonded electronic component is simultaneously embedded, and both end portions thereof are exposed on the surface of the first resin sheet to form a through conductor portion .

By this method, it is possible to easily connect the first module unit including the bonded electronic component and the second module unit including the flat plate electronic component, that is, the module units having different thicknesses . The through conductor portion is also formed at the same time when embedded in the first resin sheet, and the manufacturing process can be simplified.

  In the method of manufacturing a multilayer electronic circuit module according to the present invention, the bonded electronic component is composed of a semiconductor memory, the memory elements of the two wafers are aligned with each other, and the surfaces opposite to the electrode terminal forming surface are bonded together. After that, it may be formed by cutting all at once. With this method, once the other surfaces of the semiconductor memory are pasted together with high accuracy, a bonded electronic component free from misalignment can be efficiently produced.

The electronic circuit module manufacturing method , multilayer electronic circuit module and manufacturing method thereof according to the present invention have individual electronic components stacked in advance and bonded to form a bonded electronic component. Even when mounted inside, a thin and high-density electronic circuit module can be realized , and the thin portion is easy to bend, so that it has a great effect that it can be easily folded around that portion . Furthermore, the through conductor portion is also formed at the same time when the bonded electronic component is embedded in the resin sheet, and the manufacturing process can be simplified.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
In the first embodiment of the present invention, a case where a bonded electronic component is a semiconductor memory and an electronic circuit module is a memory module will be described as an example.

  FIG. 1 is a cross-sectional view of an electronic circuit module according to a first embodiment of the present invention. The electronic circuit module 21 has the following configuration. A pair of two electronic components 26 and 27 having electrode terminals 24 and 25 formed on at least one surface is paired, and the other surfaces of the electronic components 26 and 27 are bonded and integrated to form a bonded electronic component 23. A plurality of the bonded electronic components 23 are embedded in an insulating resin sheet 22 such as polyethylene terephthalate. Here, electrode terminals 24 and 25 are exposed on the upper surface 22A and the lower surface 22B, which are both surfaces of the resin sheet 22, respectively.

  As shown in FIG. 1, wiring layers 28A and 28B are connected to the electrode terminals 24 and 25 exposed on the upper surface 22A and the lower surface 22B, respectively. The wiring layer 28B on the lower surface 22B is led out to the upper surface 22A by a through conductor portion 29 made of a conductive material.

  The bonded electronic component 23 is formed by bonding the other surfaces of an electronic component 26 having an electrode terminal 24 on at least one surface and an electronic component 27 having an electrode terminal 25 on at least one surface. Therefore, even if these electronic components 26 and 27 are half as thick as the conventional electronic components, the bonded electronic component 23 has almost the same thickness as the conventional electronic components, so the strength against the pressing force is Is almost the same. In other words, in the case of a memory module, the thickness can be halved compared to a conventional memory module having an equivalent storage capacity, and the strength against the pressing force can be made substantially the same as in the past.

  Next, a method for manufacturing the electronic circuit module 21 having such a configuration will be described with reference to FIGS. 2 and 4 to 12 showing a cross section of the manufacturing process. FIG. 2 is a cross-sectional view for explaining a manufacturing process of the bonded electronic component. As shown in FIG. 2 (a), the other surfaces of the individual electronic components 26 and 27 each having the electrode terminals 24 and 25 on at least one surface are separated from a thermosetting resin such as an epoxy resin and a curing agent. Bond together with an adhesive. Then, as shown in FIG. 2B, a bonded electronic component 23 having electrode terminals 24 and 25 is formed.

  Note that the individual electronic components 26 and 27 used here can be thinned in advance by grinding the other surface of the conventional electronic component without electrode terminals.

  FIG. 3 is an external perspective view for explaining another manufacturing method of the bonded electronic component. When the electronic component forming the bonded electronic component is a semiconductor memory formed using a silicon wafer or the like as a base material, the following is performed. The other surfaces of the two silicon wafers 30A and 30B having a plurality of electrode terminals 33A formed on one surface are aligned and bonded together. After that, if dicing is performed to cut at a predetermined cutting position 31A, 31B at a time, a large number of individual bonded electronic components 32 can be obtained. By doing so, the bonded electronic component is efficiently formed with little positional deviation between the semiconductor memories to be bonded.

  As a next step, as shown in FIG. 4, the bonded electronic component 23 and the through conductor portion 29 are placed on a resin sheet 34 having electrical insulating properties such as polyethylene terephthalate. Here, the electrode terminal 24 of the bonded electronic component 23 is directed upward, and the electrode terminal 25 is directed downward.

  The through conductor portion 29 is made of a conductive material that is softer than the bonded electronic component 23. For example, the through conductor portion 29 is made of solder, gold (Au), or a resin having a metal film formed on its surface, and may have a spherical shape, a columnar shape, a polyhedral shape, or the like. This is because even when the through conductor portion 29 is thicker than the bonded electronic component 23 when pressed in a subsequent process, it can be easily extended and conduction can be obtained.

  Then, as shown in FIG. 5, the bonded electronic component 23 and the through conductor portion 29 are arranged at a preset position, and the heat press heated to a temperature at which the resin sheet 34 is softened, which is a preset temperature, by the heating device 36. It is sandwiched between the plates 35A and 35B. Thereafter, the electrode terminal 24 and the through conductor portion 29 above the bonded electronic component 23 and the lower surface of the resin sheet 34 are pressed by the pressing device 37 with a predetermined pressure.

As shown in FIG. 6, the electrode terminal 25 below the bonded electronic component 23 and the lower end of the through conductor portion 29 are pushed in until they are exposed on the lower surface of the resin sheet 34, and the upper side of the bonded electronic component 23 and the through conductor portion 29 is about The half and the upper electrode terminal 24 protrude upward from the resin sheet 34. The heating and pressing conditions of the hot press plates 35A and 35B at this time are, for example, conditions in which the pressure is increased to 30 × 10 ⁵ Pa in one minute and the pressure is maintained at 140 ° C. for one minute.

  Next, as shown in FIG. 7, the resin sheet 38 is placed on the through conductor portion 29 in which the lower half is embedded in the resin sheet 34 and the electrode terminal 24 above the bonded electronic component 23. Then, the resin sheet 34 and the resin sheet 38 are sandwiched between the hot press plates 35A and 35B. Thereafter, the resin sheet 34 and the resin sheet 38 are pressed with a predetermined pressure by the pressing device 37 while being heated by the heating device 36, and the resin sheet 34 and the resin sheet 38 are heat-bonded to form an integral resin sheet.

  At this time, as shown in FIG. 8, the bonded electronic component 23 is pushed to the position where the upper ends of the upper electrode terminal 24 and the through conductor portion 29 are exposed on the upper surface of the combined resin sheet 22, and the bonded electronic component built-in substrate 43 and To do. The heating and pressing conditions for the hot press plates 35A and 35B are the same as those described above.

  As shown in FIG. 1, the wiring layers 28A and 28B connected to the upper electrode terminal 24 and the lower electrode terminal 25 exposed on the bonding electronic component 23 are formed on both side surfaces of the resin sheet 22 with a conductive material such as silver paste. Printing is performed using a functional paste. As a result, the electronic circuit module 21 according to the first embodiment of the present invention is obtained.

  Thus, according to the first embodiment of the present invention, the electronic component 26 having the electrode terminal 24 on at least one surface and the electronic component 27 having the electrode terminal 25 on at least one surface are paired, and the other The bonded electronic components 23 are bonded to each other and have increased strength against pressing force. Therefore, even if the individual electronic parts 26 and 27 before bonding are thin, the bonded electronic parts 23, that is, the electronic parts 26 and 27 are damaged when embedded in the resin sheets 34 and 38 by heating and pressing. Hateful.

  As a method of forming the bonded electronic component built-in substrate 43, a method shown in FIG. 9 is used instead of the method of embedding the lower half of the bonded electronic component 23 in the resin sheet 34 and the upper half in the resin sheet 38. It is good. FIG. 9 shows a case where the through conductor portion is not formed simultaneously with the bonded electronic component 23.

  In FIG. 9, the bonded electronic component 23 is placed on the resin sheet 34 with the lower electrode terminal 25 facing down, and the resin sheet 38 is placed on the upper electrode terminal 24. Then, the resin sheets 34 and 38 are sandwiched between hot press plates 39A and 39B heated to a temperature at which the resin sheets 34 and 38 are softened by the heating device 40. Thereafter, the resin sheets 34 and 38 are pressed with a predetermined pressure by the pressing device 41 while being heated, and the resin sheets 34 and 38 are heat-bonded to form an integral resin sheet. At that time, the bonded electronic component 23 is pushed into the position where the upper electrode terminal 24 and the lower electrode terminal 25 are exposed on both surfaces of the integrated resin sheet.

  If it does in this way, the joining electronic component 23 pinched | interposed between the resin sheets 34 and 38 will be simultaneously heat-pressed from an up-down direction, and it will be pushed and embedded in the resin sheet which the resin sheets 34 and 38 couple | bonded. As a result, the manufacturing process of the bonded electronic component built-in substrate is simplified, and the number of times the bonded electronic component 23 is pressed during manufacturing is one. That is, the flat electronic components 26 and 27 are less damaged, and the electronic circuit module can be stably manufactured.

  Further, in FIG. 5, the thickness of the resin sheet 34 may be approximately the same as the thickness of the bonded electronic component 23, and the bonded electronic component 23 may be embedded in the resin sheet by one pressurization and heating. Also in this case, since the number of times of receiving the pressing of the bonded electronic component 23 is only one, the flat electronic component is similarly less likely to be damaged.

  FIG. 10 is an enlarged cross-sectional view of the vicinity of the upper electrode terminal portion when the bonded electronic component 23 is press-fitted into the resin sheet 22. When the thickness of the bonded electronic component 23 including the electrode terminal varies and the electrode terminal 24A is the thickest, the electrode terminal 24A is first exposed from the resin sheet 22, but the electrode terminals 24B, 24C, and 24D are exposed. Not. At this time, further press-fitting is performed until the electrode terminals 24B and 24C of the thinnest part are exposed on the surface of the resin sheet 22.

  As a result, as shown in FIG. 11, the upper ends of the electrode terminals 24 </ b> A and 24 </ b> D are extended, and all the electrode terminals can be exposed from the resin sheet 22. Here, as the electrode terminal, copper (Cu), gold (Au), aluminum (Al) or the like having a small hardness and ductility is suitable. Further, when the electrode terminal is press-fitted, the electrode terminal is sandwiched between the pressurizing device and the bonded electronic component 23 and is extended, so that at least the hardness is preferably smaller than that of the bonded electronic component 23.

  Moreover, as shown in FIG. 12, the upper part of the resin sheet 22 may be removed by dry etching, for example, and all the electrode terminals 24A, 24B, 24C, and 24D may be exposed.

  Further, the electronic circuit module 21 according to the first embodiment of the present invention may be configured without a through conductor portion. As shown in FIG. 13, wiring layers 28 </ b> A and 28 </ b> B are printed and formed on electrode terminals 24 and 25 exposed on both surfaces of the resin sheet 22 using a conductive paste such as a silver paste, respectively. In this case, connection with an external device is performed via the wiring layers 28A and 28B.

(Second Embodiment)
In the second embodiment of the present invention, a case where a stack IC module in which memory modules each having a bonded electronic component as a semiconductor memory are stacked in multiple layers will be described as an example of a multilayer electronic circuit module.

  FIG. 14 is a sectional view of a multilayer electronic circuit module according to the second embodiment of the present invention. As shown in FIG. 14, in the multilayer electronic circuit module 44, two bonded electronic components 45 and 46 are embedded in an insulating resin sheet 47 such as polyethylene terephthalate. The electrode terminals 48B and 49A are led to the upper surface 47A of the resin sheet 47 through the wiring layer 50 and the through conductor portion 51A. The electrode terminal 49B is led to the upper surface 47A of the resin sheet 47 through the wiring layer 52B and the through conductor portions 51B and 51A. The electrode terminal 48A is directly connected to the wiring layer 52A on the upper surface 47A of the resin sheet 47.

  In this multilayer electronic circuit module 44, two first module units are stacked, and the first module units are connected to each other between the wiring layers via respective through conductor portions. Here, the first module unit is similar to the electronic circuit module 21 shown in FIG. 1, and the electrode terminals of the bonded electronic components are exposed on the surface of the first resin sheet, and the wiring layer connected to the electrode terminals is connected to the wiring layer. It is the structure which has a through-conductor part to do.

  Next, a method for manufacturing the multilayer electronic circuit module 44 having such a configuration will be described with reference to FIGS.

  As the first step, the bonded electronic components 45 and 46 are formed by the same method as in the first embodiment of the present invention, and the resin sheet such as polyethylene terephthalate as shown in FIGS. 15 (a) and 15 (b) is formed. The first module units 53 and 54 in which the bonded electronic components 45 and 46 are embedded are used.

  Here, in the first module unit 53, wiring layers 52A and 50 connected to the electrode terminals 48A and 48B of the bonded electronic component 45 and the through conductor portion 51A are formed on the upper and lower surfaces. In the first module unit 54, the wiring layer 52B connected to the electrode terminal 49B of the bonded electronic component 46 is formed only on the lower surface, and the electrode terminal 49A of the bonded electronic component 46 and the end of the through conductor portion 51B are formed on the upper surface. The part is exposed. At this time, the through conductor portions 51A and 51B are each made of a conductive material softer than the bonded electronic components 45 and 46, and at the same time when the bonded electronic components 45 and 46 are embedded, both ends thereof are exposed on the surface of the resin sheet. Until embedded.

As the next step, as shown in FIG. 16, the first module unit 53 is placed on the first module unit 54 at a preset position. At that time, the wiring layers and the through conductor portions of the first module units 53 and 54 are aligned. And the 1st module units 53 and 54 are pinched | interposed between the hot press boards 56A and 56B heated to the temperature which softens a resin sheet with the heating apparatus 55. FIG. Thereafter, the first module units 53 and 54 are pressed with a predetermined pressure by the pressing device 57, and the resin sheets of the first module units 53 and 54 are pressed and bonded to form an integrated resin sheet. The electrode terminal 49A of the junction electronic component 46 embedded in the first module unit 54 and the end of the through conductor portion 51B are connected to the wiring layer 50 on the lower surface of the first module unit 53, as shown in FIG. The multilayer electronic circuit module 44 shown is assumed. The hot press plates 56A and 56B were boosted to 30 × 10 ⁵ Pa in 1 minute and held at 140 ° C. for 1 minute in the same manner as in the first embodiment of the present invention.

  Thus, a memory module using bonded electronic components can be made thinner than a memory module having the same storage capacity as the conventional one. Therefore, the multilayer electronic circuit module in which they are stacked can achieve a higher storage capacity.

  In the multilayer electronic circuit module 44 described here, the case where one bonded electronic component 45 and 46 is embedded in each of the first module units 53 and 54 to be joined together is described. A plurality of bonded electronic components may be embedded in each of the module units 53 and 54.

  Further, in the second embodiment of the present invention, the case where two module units are stacked is shown, but a multilayer electronic circuit module in which module units are further stacked may be used.

(Third embodiment)
In the third embodiment of the present invention, a multi-chip module in which a memory module having a bonded electronic component as a semiconductor memory and a module unit in which a chip electronic component such as a resistor is embedded as a flat plate electronic component is stacked is a multilayer electronic circuit. A case where a module is used will be described as an example.

  FIG. 17 is a cross-sectional view of a multilayer electronic circuit module according to the third embodiment of the present invention. As shown in FIG. 17, in the multilayer electronic circuit module 58, a bonded electronic component 59 and a flat plate electronic component 60 are embedded in a resin sheet 61 having insulation properties such as polyethylene terephthalate. The electrode terminals 62 </ b> B and 63 are led to the upper surface of the resin sheet 61 through the wiring layer 64 and the through conductor portion 65.

  The multilayer electronic circuit module 58 is formed by laminating two first and second module units, and the first and second module units are connected between wiring layers via through conductor portions. Here, as in the electronic circuit module 21 of FIG. 1, the first module unit exposes the electrode terminal of the bonded electronic component on the surface of the resin sheet, and the wiring layer connected to the electrode terminal and the through conductor connecting the wiring layers It is the structure which has a part. Further, the second module unit is configured to expose the electrode terminals of the flat plate-like electronic component on the surface of the resin sheet.

  Next, a method for manufacturing the multilayer electronic circuit module 58 having such a configuration will be described with reference to FIGS.

  As a first step, as shown in FIG. 18, a second resin sheet 67 having electrical insulation properties, such as polyethylene terephthalate, on which a flat electronic component 60 is placed with the electrode terminal 63 down, is heated by pressing plates 68A and 68B. Between them. Then, the flat electronic component 60 and the second resin sheet 67 are pressed by the pressing device 70 while being heated to a temperature at which the second resin sheet 67 is softened by the heating device 69, so that the flat electronic component 60 is The second module unit 71 shown in FIG. 19 is embedded in the resin sheet 67. In the second module unit 71, the electrode terminals 63 of the flat electronic component 60 are exposed on the surface of the second resin sheet 67, and no wiring layer is provided.

  On the other hand, as shown in FIG. 20, the first module unit 73 includes a wiring layer 66 in which a bonded electronic component 59 is embedded in the first resin sheet 72 and connected to the electrode terminals 62 </ b> A and 62 </ b> B and the through conductor portion 65. 64 is formed on the upper and lower surfaces. The through conductor portion 65 is made of a conductive material softer than the bonded electronic component 59, and is embedded at the same time when the bonded electronic component 59 is embedded. Then, both ends of the through conductor portion 65 are exposed on both surfaces of the first resin sheet 72.

Then, the electrode terminal 63 of the second module unit 71 and the wiring layer 64 of the first module unit 73 are aligned and laminated with the electrode terminal 63 side facing upward. Next, the hot press plates 68A and 68B in which the first module unit 73 and the second module unit 71 are heated to a temperature at which the first resin sheet 72 and the second resin sheet 67 are softened by the heating device 69. Between them. Thereafter, the first module unit 73 and the second module unit 71 are pressed by the pressing device 70 with a predetermined pressure, and the first resin sheet 72 and the second resin sheet 67 are bonded together to form an integral resin sheet. To do. The hot press plates 68A and 68B were boosted to 30 × 10 ⁵ Pa in 1 minute and held at 140 ° C. for 1 minute in the same manner as in the first embodiment of the present invention.

  According to such a manufacturing method, the first module unit 73 in which the junction electronic component 59 is embedded and the second module unit 71 in which the flat plate electronic component 60 is embedded are interposed via the through conductor portion 65. The connected multilayer electronic circuit module 58 is obtained.

  As in the second embodiment of the present invention, the multilayer electronic circuit module 58 also includes a plurality of junction electronic components and flat plate electronic components embedded in the first module unit 73 and the second module unit 71, respectively. May be.

  Moreover, it is good also as a structure which laminated | stacked the 1st module unit and the 2nd module unit further to the structure of the 3rd Embodiment of this invention.

(Fourth embodiment)
The fourth embodiment of the present invention is a configuration of a multilayer electronic circuit module having a bent portion.

  FIG. 21 shows a multilayer electronic circuit module 80 according to the fourth embodiment of the present invention, which has a structure in which one end portion 82 is formed and two layers of module units other than the end portion 82 are stacked. Therefore, the end portion 82 is thinner than the end portion 82, and the end portion 82 includes a terminal portion 84 for connecting to an external device. In the multilayer electronic circuit module 80, at least one of the module units incorporates the junction electronic component 23. Thus, by using the multi-layered electronic circuit module 80 having only the terminal portion 84 at the end portion 82, the mounting by bending the end portion 82 in the bending direction 86 becomes easy.

  Further, as shown in FIG. 22, a part of the multilayer electronic circuit module 88 may be made thin and the terminal portion 84 may be provided there. With such a configuration, the multilayer electronic circuit module 88 can be mounted by being folded in the folding direction 86 at an arbitrary position.

  In the embodiment of the present invention, the electronic component is described as a semiconductor memory. However, an electronic component such as a resistor, a chip capacitor, or a coil having an electrode terminal on at least one surface, that is, a side surface may be used.

  The resin sheet material is not limited to a thermoplastic resin such as polyethylene terephthalate, vinyl chloride, polycarbonate, and acrylonitrile butanediene styrene, and may be a thermosetting resin that temporarily softens when heated, such as an epoxy resin.

  Further, the through conductor portion may be formed not only by the method of forming the joint electronic component at the same time but also by forming a through hole and filling with a conductive material.

  In the embodiment of the present invention, an example in which the wiring layer is formed by a printing method has been described. However, the present invention is not limited to this, and may be formed by, for example, a photolithography method.

  The electronic circuit module, the multilayer electronic circuit module and the manufacturing method thereof according to the present invention provide a bonded electronic component in which individual electronic components are preliminarily stacked and bonded, so that rigidity is obtained by the bonded electronic component and mounted in a resin sheet. This is useful for stack IC modules, memory cards, multi-chip modules, etc. that are less susceptible to damage and require thin and high-density mounting.

Sectional drawing of the electronic circuit module by the 1st Embodiment of this invention Sectional drawing which shows the manufacturing process of the embodiment External perspective view explaining another manufacturing method of the same embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the other manufacturing process of the embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the other structure of the embodiment Sectional drawing of the multilayer electronic circuit module by the 2nd Embodiment of this invention Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing of the multilayer electronic circuit module by the 3rd Embodiment of this invention Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing which shows the manufacturing process of the embodiment Sectional drawing of the multilayer electronic circuit module by the 4th Embodiment of this invention Sectional drawing which shows the other structure of the embodiment Sectional view of a conventional laminated resin substrate

DESCRIPTION OF SYMBOLS 1 Laminated resin substrate 1A, 1B, 1C Component built-in substrate 2 Resin substrate 2A Through hole 3,60 Flat plate electronic component 3A, 4A, 24, 24A, 24B, 24C, 24D, 25, 33A, 48A, 48B, 49A, 49B , 62A, 62B, 63 Electrode terminal 4 Small electronic component 5, 28A, 28B, 50, 52A, 52B, 64, 66 Wiring layer 21 Electronic circuit module 22, 34, 38, 47, 61 Resin sheet 22A, 47A Upper surface 22B Lower surface 23, 32, 45, 46, 59 Bonded electronic component 26, 27 Electronic component 29, 51A, 51B, 65 Through conductor portion 30A, 30B Silicon wafer 31A, 31B Cutting position 35A, 35B, 39A, 39B, 56A, 56B , 68A, 68B Heat press plate 36, 40, 55, 69 Heating device 37, 41, 57, DESCRIPTION OF SYMBOLS 70 Pressing device 43 Junction electronic component built-in board | substrate 44,58,80,88 Multilayer electronic circuit module 53,54,73 1st module unit 67 2nd resin sheet 71 2nd module unit 72 1st resin sheet 82 End Part 84 Terminal

Claims (8)

A pair of two electronic components having electrode terminals formed on at least one surface, a bonded electronic component in which the other surfaces of the electronic component are bonded together, and a shape that exposes the surface of the electrode terminal Formed on both surfaces of the first resin sheet embedded in the first resin sheet, the wiring layer connected to the electrode terminals exposed on both surfaces of the first resin sheet, and the first resin sheet; said first modular unit and stacked and a through conductor portion for connecting the wiring layers was, the first module adjacent units to be stacked is that is the wiring layers connected through each of the through conductor portion a multi-layer electronic circuit module,
The multilayer electronic circuit module has a bent portion, and the thickness of the bent portion is thinner than the thickness other than the bent portion. A pair of two electronic components having electrode terminals formed on at least one surface, a bonded electronic component integrated by bonding the other surfaces of the electronic components, and a shape that exposes the surface of the electrode terminals A first resin sheet in which a bonded electronic component is embedded, a wiring layer connected to each of the electrode terminals exposed on both surfaces of the first resin sheet, and the wiring formed on both surfaces of the first resin sheet A first module unit having a through conductor portion connecting the layers;
At least a flat electronic component having electrode terminals formed on at least one surface and a second module unit having a second resin sheet in which the flat electronic components are embedded so as to expose the surface of the electrode terminals. One layer,
It said first module units to be stacked and the second module unit is a multi-layer electronic circuit module that is connected via the through conductor portion,
The multilayer electronic circuit module has a bent portion, and the thickness of the bent portion is thinner than the thickness other than the bent portion. 3. The multilayer electronic circuit according to claim 1, wherein the bent portion is located at an end of the multilayer electronic circuit module, and the bent portion includes a terminal portion for connecting to an external device. module. The multilayer electronic circuit module according to any one of claims 1 to 3 wherein the through conductor portion, characterized by comprising a conductive material softer than the joining electronic components. Bonded electronic component forming step for forming a bonded electronic component in which two electronic components having electrode terminals formed on at least one surface are paired and the other surfaces of the electronic component are bonded together, and a resin sheet An embedding step of embedding the bonding electronic component in the resin sheet in a shape that exposes the surface of the electrode terminal by pressurizing the bonding electronic component disposed at a predetermined position by heating to a preset temperature. ,
A method of manufacturing a sub-circuit module collector that includes a wiring layer forming step of forming a wiring layer respectively connected to the electrode terminals exposed on both surfaces of the resin sheet,
In the embedding step, a conductive material that is thicker than the bonded electronic component and softer than the bonded electronic component is embedded at the same time, and both end portions thereof are exposed on the surface of the resin sheet to form a through conductor portion. A method for manufacturing an electronic circuit module. A pair of two electronic components having electrode terminals formed on at least one surface, a bonded electronic component integrated by bonding the other surfaces of the electronic components, and a shape that exposes the surface of the electrode terminals A first resin sheet in which a bonded electronic component is embedded, a wiring layer connected to each of the electrode terminals exposed on both surfaces of the first resin sheet, and the wiring formed on both surfaces of the first resin sheet Forming a first module unit having a through conductor portion connecting the layers;
A plurality of the first module units are prepared, and the first module units are laminated by aligning and laminating the wiring layer and the through conductor portion at a preset position, and then softening the first resin sheets. and heated to be, as well as integrally bonded under pressure, a method for producing a multi-layer electronic circuit module that includes a step of connecting the wiring layers via the through conductor portion,
When the bonding electronic component is embedded in the first resin sheet, a conductive material softer than the bonding electronic component is simultaneously embedded and both end portions thereof are exposed on the surface of the first resin sheet so that the through conductors are embedded. A method for manufacturing a multilayer electronic circuit module comprising forming a portion. A pair of two electronic components having electrode terminals formed on at least one surface, a bonded electronic component integrated by bonding the other surfaces of the electronic components, and a shape that exposes the surface of the electrode terminals A first resin sheet in which a bonded electronic component is embedded, a wiring layer connected to each of the electrode terminals exposed on both surfaces of the first resin sheet, and the wiring formed on both surfaces of the first resin sheet Forming a first module unit having a through conductor portion connecting the layers;
Forming a second module unit having a flat plate-shaped electronic component having an electrode terminal formed on at least one surface and a second resin sheet having the flat plate-shaped electronic component embedded in a shape exposing the surface of the electrode terminal; When,
At least one each of the first module unit and the second module unit is prepared, and the first module unit and the second module unit are laminated by aligning the wiring layer at a preset position. after the first heating the resin sheet until softening and the second resin sheet, thereby bonding and integrating pressurized, multi-layer electronic circuit that includes a step of connecting via the through conductor portion A method of manufacturing a module ,
When the bonding electronic component is embedded in the first resin sheet, a conductive material softer than the bonding electronic component is simultaneously embedded and both end portions thereof are exposed on the surface of the first resin sheet so that the through conductors are embedded. A method for manufacturing a multilayer electronic circuit module comprising forming a portion. The bonded electronic component is formed of a semiconductor memory, and is formed by aligning the memory elements of two wafers, bonding the surfaces opposite to the electrode terminal forming surfaces, and then cutting them together. The method for manufacturing a multilayer electronic circuit module according to claim 6 or 7 , wherein

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