JP4407609B2 - Electronic circuit equipment - Google Patents

Description

  The present invention relates to an electronic circuit device in which a semiconductor chip and an electronic component are built in a circuit board having a multilayer structure.

  In recent years, with the demand for high performance and miniaturization of electronic devices typified by portable terminals, thin and high density electronic circuit devices have become necessary. However, the progress of high performance and miniaturization of electronic equipment has been remarkable, and this is the case with miniaturization of components, narrowing of circuit board wiring pitch, multilayering, and high density mounting of electronic components. It has become difficult to cope with the high performance and downsizing of electronic devices. Therefore, attention has been paid to an electronic component built-in substrate in which a circuit pattern is three-dimensionally provided on a substrate incorporating various electronic components including a semiconductor chip and passive components. This circuit board is also required to have a multilayer structure and be thin.

  A conventional electronic circuit device will be described below with reference to the drawings.

  FIG. 9 is a process cross-sectional view for explaining the configuration and manufacturing method of an example of a conventional electronic circuit device.

  First, as shown in FIG. 9A, patterns to be conductive wirings 41a and 41b are formed on both surfaces of a substrate 41 (hereinafter referred to as a resin substrate) made of a resin material. If necessary, through-hole conductors 41c are formed so as to pass through both surfaces at predetermined positions of the resin substrate 41 and connect the conductor wirings 41a and 41b formed on the respective surfaces.

  Next, as shown in FIG. 9B, the electrode terminals 42a of the semiconductor chip 42 are connected so as to coincide with the conductor wiring 41a. The electrode terminal 42a is formed of a solder bump, a gold ball bump, or the like, and the connection between the electrode terminal 42a and the conductor wiring 41a is performed using solder connection, an anisotropic conductive film or an anisotropic conductive resin.

  Next, as shown in FIG. 9C, an interlayer insulating layer 43 is formed on the entire surface of the resin substrate 41 by a curtain coating method or the like. The thickness of the interlayer insulating layer 43 is set to be at least enough to cover at least the side surface of the semiconductor chip 42. Thereafter, a predetermined conductor wiring 44 is formed. The conductor wiring 44 can be formed by, for example, a photoetching process after a copper plating layer is formed on the entire surface of the interlayer insulating layer 43.

  Next, as shown in FIG. 9D, an interlayer insulating layer 45 is formed by a curtain coating method or the like so as to completely cover the semiconductor chip 42. By repeating this method, as shown in FIG. 9E, an electronic circuit device incorporating the semiconductor chip 42 is constructed. An electronic component 49 is mounted using a part of the uppermost conductor wiring 48 as a connection terminal. Further, between the conductor wirings, through-hole conductors are formed in the interlayer insulating layer at necessary places, and the conductor wirings formed between the layers are connected (for example, see Patent Document 1).

  Next, another example of a conventional electronic circuit will be described with reference to the drawings.

  FIG. 10 is a diagram showing an electronic circuit device configured by bonding and laminating wiring films on which conductor wirings and connection protrusions are formed with an anisotropic conductive film, and (a) illustrates a manufacturing method thereof. FIG. 4B is a cross-sectional view of the manufactured electronic circuit device, and FIG.

  In FIG. 10, the anisotropic conductive film 53 has a configuration in which the conductive particles 53b are dispersed in the insulating resin 53a. Similarly, the anisotropic conductive film 56 has the conductive particles 56b dispersed in the insulating resin 56a. It consists of made. In addition, the wiring film 54 is formed on the surface of the wiring film 54, and a conductor wiring 55 having a protruding portion that penetrates the wiring film 54 and protrudes to the other surface is formed. Further, the wiring film 57 is formed with a conductor wiring 58 having a protruding portion in the same manner as the wiring film 54.

  As shown in FIG. 10A, an anisotropic conductive film 53, a wiring film 54 formed with a conductor wiring 55, an anisotropic conductive film 56, and a conductor are formed on a resin substrate 51 on which a conductor wiring 52 is formed. The wiring films 57 on which the wirings 58 are formed are aligned and stacked in this order, and placed between the press machines 59. Thereafter, pressurization by the press machine 59 and heating by the heater 60 cause the wiring films 54 and 57 to be laminated on the resin substrate 51, and at the same time, the conductor wirings 52, 55 and 58 of the respective layers are electrically connected. Connected to.

FIG. 10B shows a cross-sectional shape of the electronic circuit device thus manufactured. The conductor wirings 55 and 58 formed on one main surface of the wiring films 54 and 57 are led out to the other surface, and a protruding portion is formed. FIG. 10C shows an enlarged interlayer connection state at the protruding portion. When the conductor particles 53b are crushed between the protruding portion of the conductor wiring 55 and the conductor wiring 52, they overlap in the vertical direction and are electrically connected to each other. In addition, in the location where there is no protrusion part of the conductor wiring 55 and 58, the conductor particles 53b do not overlap in the vertical direction, and insulation is maintained (for example, refer to Patent Document 2).
JP 11-274734 A JP-A-4-177864

  The first example is an electronic circuit device having a multilayer structure using a build-up method, in which a semiconductor chip is built in the multilayer part, and an electronic component other than the semiconductor chip is mounted on the uppermost layer. In this example, an anisotropic conductive member may be used to connect the electrode terminal of the semiconductor chip and the connection terminal of the conductor wiring of the resin substrate.

  However, in the first example, the member used for connecting the electrode terminal of the semiconductor chip and the connection terminal of the conductor wiring is different from the member used as the interlayer insulating layer. For this reason, different processes are required.

  In the second example, an anisotropic conductive film is used for adhesion between the resin substrate and the wiring film and between the wiring films, and electrical connection between the layers, and the interlayer connection and the lamination of the wiring films are the same. It can be performed in a process.

  However, in this second example, since the wiring films are laminated, the entire thickness is increased by the thickness. Furthermore, in order to realize an electronic circuit device having a laminated structure, it is necessary to form a wiring film on which conductor wiring is formed in advance. Moreover, it is required to align and laminate these wiring films, but this process is relatively complicated. In particular, when the conductor wiring and the interlayer connection are made to have a fine pitch, it is required to align the plurality of wiring films with high accuracy and to prevent deviation even during pressurization and heating. However, for this reason, it seems difficult to produce an electronic circuit device having a fine pattern even if a high-precision alignment jig or press is used.

  SUMMARY OF THE INVENTION The present invention solves the above-mentioned problems, and by performing conductive wiring connection between layers and electrical connection of built-in electronic components using the same anisotropic conductive resin layer, the components can be manufactured with a simple manufacturing process. An object of the present invention is to provide a multi-layered electronic circuit device having a built-in structure.

In order to solve the above-described problems, an electronic circuit device of the present invention is formed on a resin substrate having a first conductor wiring formed on at least one main surface and on one main surface including the first conductor wiring. The first anisotropic conductive resin layer, and the connection terminals and electrodes that are press-fitted into the first anisotropic conductive resin layer and the first conductor wiring is set by the conductive particles in the first anisotropic conductive resin layer For the electronic component in which the terminal is electrically connected, the second conductor wiring formed on the surface of the first anisotropic conductive resin layer, and the connection terminal in which the first conductor wiring is set, the first Electrical connection is established through direct contact with the connection terminal to the connection terminal that is electrically connected through the conductive particles in the anisotropic conductive resin layer and the second conductor wiring is set. the electrically conductive and a interlayer connection member, the first anisotropic conductive resin layer containing a second conductor wiring, and The second anisotropic conductive resin layer is formed on the second anisotropic conductive resin layer and press-fitted into the second anisotropic conductive resin layer, and the conductive particles in the second anisotropic conductive resin layer set the second conductor wiring. For the electronic component in which the terminal and the electrode terminal are electrically connected, the third conductor wiring formed on the surface of the second anisotropic conductive resin layer, and the connection terminal where the second conductor wiring is set The connection terminals that are electrically connected through the conductive particles in the second anisotropic conductive resin layer and that have the third conductor wiring set are electrically connected by direct contact with the connection terminals. It has a configuration including a connected conductive interlayer connection member .

With such a configuration, the formation of the interlayer insulating layer and the electrical connection between the electrode terminal of the electronic component and the connection terminal of the first conductor wiring can be simultaneously performed using the same material. Further, since the first anisotropic conductive resin layer also serves as a sealing resin layer for electronic components, it is not necessary to form a sealing resin layer. Therefore, the manufacturing process can be simplified. Furthermore, since the electronic component is embedded in the first anisotropic conductive resin layer serving as an interlayer insulating layer, the whole can be made thin. Furthermore, an electronic circuit device having a multilayer structure can be easily realized.

  Electronic components include semiconductor chips such as IC and LSI, chip components such as chip capacitors and chip resistors, capacitors formed on a sheet-like substrate by a thin film method or a printing method, sheet devices such as resistors and inductors, and Various sensors can be used. The number of electronic components to be embedded is not limited to one and may be plural. In that case, not only a semiconductor chip but also a combination of a semiconductor chip and a chip component may be used. In the case of the present invention, since the conductive interlayer connecting member is embedded together with the electronic component, the electrical connection between the layers can be reliably performed even if a relatively thick electronic component is used.

The electronic circuit device of the present invention includes a resin substrate having a first conductor wiring formed on at least one main surface, and a first anisotropic conductive resin formed on one main surface including the first conductor wiring. Layer and first
The first conductive material is press-fitted into the anisotropic conductive resin layer, and the first conductive resin particles in the first anisotropic conductive resin layer
An electronic component in which a connection terminal and an electrode terminal for which body wiring is set are electrically connected, and a first anisotropic conductor
The second conductor wiring formed on the surface of the electrically conductive resin layer is connected to the set connection terminal of the first conductor wiring.
Then, the second conductor is electrically connected through the conductive particles in the first anisotropic conductive resin layer.
Electrical connection is made to the connection terminals with wiring by making direct contact with the connection terminals.
A conductive interlayer connecting member connected to the first anisotropic conductive resin layer including the second conductor wiring;
Further, a second anisotropic conductive resin layer is formed, press-fitted into the second anisotropic conductive resin layer, and a connection terminal in which the second conductor wiring is set by the conductive particles in the second anisotropic conductive resin layer And an electronic component having an electrode terminal electrically connected thereto .

  With this configuration, electronic components can be easily mounted on the surface on which the uppermost conductor wiring is formed using the same anisotropic conductive resin layer, and a highly functional electronic circuit device is realized. it can.

  In the above configuration, a third anisotropic conductive resin layer is further formed on the second anisotropic conductive resin layer including the third conductor wiring, and is press-fitted into the third anisotropic conductive resin layer. It is good also as a structure provided with the electronic component by which the connection terminal in which the 3rd conductor wiring was set, and the electrode terminal were electrically connected by the conductor particle in 3 anisotropically conductive resin layers.

  With this configuration, electronic components can be easily mounted on the surface on which the uppermost conductor wiring is formed using the same anisotropic conductive resin layer, and a highly functional electronic circuit device is realized. it can.

The electronic circuit device of the present invention includes a first resin substrate having a first conductor wiring formed on at least one main surface, and a first anisotropic conductive film formed on one main surface including the first conductor wiring. The electrode terminals are electrically connected to the connection terminals set in the first conductor wiring by the conductive particles in the first anisotropic conductive resin layer and the conductive particles in the first anisotropic conductive resin layer. The second electronic component is laminated on the surface of the first anisotropic conductive resin layer, and one of the conductor wires formed on both surfaces is press-fitted into the first anisotropic conductive resin layer. Electrical connection between the resin substrate, the connection terminal set with the first conductor wiring, and the connection terminal set with one conductor wiring of the second resin substrate through the conductor particles in the first anisotropic conductive resin layer and a conductive interlayer connection member for connecting the second resin substrate surface including the other conductor wires of the second resin substrate Further, a second anisotropic conductive resin layer is formed, press-fitted into the second anisotropic conductive resin layer, and the other conductor wiring is set by the conductive particles in the second anisotropic conductive resin layer. The electronic component in which the connection terminal and the electrode terminal are electrically connected, the second conductor wiring formed on the surface of the second anisotropic conductive resin layer, and the connection terminal on which the other conductor wiring is set The connection terminals that are electrically connected via the conductive particles in the second anisotropic conductive resin layer and that are set with the second conductor wiring are electrically connected to the connection terminals by direct contact. A third anisotropic conductive resin layer is formed on the second anisotropic conductive resin layer including the second conductor wiring, and a third anisotropic conductive resin is provided. The second conductor wiring is set by the conductive particles in the third anisotropic conductive resin layer that are press-fitted into the resin layer. Consisting configuration in which the connection terminals and the electrode terminals are provided with electrically connected electronic components.

With this configuration, an electronic circuit device in which an electronic component is built between the first resin substrate and the second resin substrate can be manufactured by a simple manufacturing method. That is, the formation of the interlayer insulating layer, the electrical connection between the electrode terminal of the electronic component and the connection terminal of the first conductor wiring, and the electrical connection between the connection terminal of the first conductor wiring and the connection terminal of one conductor wiring are simultaneously performed. be able to. Also, the electronic component described above can be used in the same manner for this electronic circuit device. Furthermore, an electronic circuit device having a multilayer structure can be easily realized.
In addition, an electronic component can be easily mounted on the surface on which the uppermost conductor wiring is formed by using the same anisotropic conductive resin layer, and a highly functional electronic circuit device can be realized.

  Further, in the above configuration, the resin substrate further includes an electronic component, and may be connected to the first conductor wiring formed on one main surface or the other conductor wiring formed on the other main surface. Good.

  With this configuration, it is possible to realize an electronic circuit device with higher functionality. The electrical connection between the electrode terminal of the electronic component embedded in the resin substrate and the connection terminal of the conductor wiring may be a method using an anisotropic conductive resin layer, but is not limited thereto. For example, a method using soldering or a method using a conductive adhesive may be used.

  In the above configuration, the first anisotropic conductive resin layer, the second anisotropic conductive resin layer, and the third anisotropic conductive resin layer are formed on the coil-shaped conductor particles, the fiber fluff-shaped conductor particles, and the surface. It is good also as a structure containing the at least 1 sort (s) of conductor particle | grains selected from the conductor particle | grains provided with the several protrusion part which has electroconductivity, and a resin binder.

  The anisotropic conductive resin layer having such a configuration can reduce the resistance in the vertical direction, that is, in the connection direction between the connection terminal and the electrode terminal, while the lateral direction, that is, between the electrode terminals of the electronic component is high. Easy to maintain resistance. This is due to the use of at least one type of conductive particles selected from coil-shaped conductive particles, fiber pill-shaped conductive particles, and conductive particles having a plurality of conductive projections on the surface. . That is, for example, in the case of conductor particles having large protrusions on the surface, when the anisotropic conductive resin layer is compressed, the protrusions of the conductor particles are wide with respect to the connection terminals and the electrode terminals. Contact from the stage. Further, some of them are embedded in the surfaces of the connection terminal and the electrode terminal. As a result, not only electrical connection but also mechanical fixation is achieved. For this reason, compared with the case of using a conventional anisotropic conductive sheet, even with various electronic components having different thicknesses, electrode terminal shapes, pitches, etc., the same anisotropic conductive resin layer provides better electrical properties. Mechanical connection can be made.

  In the case of conductive particles having protrusions, the conductive particles are easily entangled with each other, and in order to ensure electrical connection with the connection terminal of the conductor wiring and the electrode terminal of the electronic component, each is thin, In addition, a shape having a plurality of protrusions, a so-called sea urchin shape is desirable.

  Such a structure can be obtained, for example, by growing dendrites on the surface of silver particles or nickel particles as nuclei. Alternatively, the protrusions may be formed by a plating method. Alternatively, polymer or ceramic particles may be used as the nucleus, a conductive film may be formed on the surface, and a protrusion may be formed on the film.

  Further, as the resin binder used for the anisotropic conductive resin layer, a photo-curable insulating resin, a thermosetting insulating resin, or a resin configuration combining them can be used. When this resin binder is combined with an ultraviolet curable adhesive resin and a thermosetting adhesive resin, stress can be relaxed, and the reliability of the connection terminal portion can be further improved. Specifically, an epoxy resin, an acrylic resin, or the like is used.

  As a method for forming the anisotropic conductive resin layer, it is preferable to use a paste or sheet. In the case of a paste, it is applied by a technique such as printing. Moreover, in the case of a sheet form, it can be formed by processing and bonding to a predetermined shape.

  The electronic circuit device according to the present invention can simultaneously perform the connection between the interlayer connection and the conductor wiring of the built-in electronic component and the formation of the interlayer insulating layer using the same anisotropic conductive member, The apparatus can be thinned, and the electronic circuit device can be reduced in size and cost.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected about the same element and description may be abbreviate | omitted. In the drawings described below, the shape of the conductive particles in the resin substrate, the electronic component, the conductive interlayer connecting member, or the anisotropic conductive resin layer is schematic. Further, the number of electronic components and conductive interlayer bonding members are also limited for ease of display of the drawings.

(First embodiment)
1A and 1B are diagrams showing a configuration of an electronic circuit device according to a first embodiment of the present invention, in which FIG. 1A is a sectional view of an essential part thereof, and FIG. 1B is an enlarged sectional view showing a state of a connecting part. .

  The electronic circuit device according to the present embodiment includes a resin substrate 1 having a first conductor wiring 3 formed on at least one main surface, and a first anisotropic formed on one main surface including the first conductor wiring 3. The conductive resin layer 6 is press-fitted into the first anisotropic conductive resin layer 6, and an electrode is connected to the connection terminal set on the first conductor wiring 3 by the conductive particles 6 b in the first anisotropic conductive resin layer 6. For the electronic parts 7 and 8 to which the terminals are electrically connected, the second conductor wiring 10 formed on the surface of the first anisotropic conductive resin layer 6, and the connection terminals set for the first conductor wiring 3 For the connection terminal that is electrically connected through the conductive particles 6b in the first anisotropic conductive resin layer 6 and that is set for the second conductor wiring 10, it is directly connected to this connection terminal. And an electrically conductive interlayer connection member 9 that is electrically connected by making various contacts.

  Further, a second anisotropic conductive resin layer 11 is formed on the first anisotropic conductive resin layer 6 including the second conductor wiring 10. And in the 2nd anisotropic conductive resin layer 11, an electrode terminal is electrically connected to the connection terminal in which the 2nd conductor wiring 10 was set by the conductor particle 11b in the 2nd anisotropic conductive resin layer 11. For the connected electronic component (not shown), the third conductor wiring 13 formed on the surface of the second anisotropic conductive resin layer 11, and the connection terminal where the second conductor wiring 10 is set, 2 A connection terminal that is electrically connected via the conductive particles 11b in the anisotropic conductive resin layer 11 and that has the third conductor wiring 13 set is in direct contact with the connection terminal. Thus, the conductive interlayer connection member 12 electrically connected is provided.

  Further, a third anisotropic conductive resin layer 14 is formed on the second anisotropic conductive resin layer 11 including the third conductor wiring 13. In the third anisotropic conductive resin layer 14, the electrode terminal is electrically connected to the connection terminal set on the third conductor wiring 13 by the conductive particles 14 b in the third anisotropic conductive resin layer 14. The electronic component 15 is provided.

  The resin substrate 1 further incorporates an electronic component 2 and is connected to a first conductor wiring 3 formed on one main surface. The electrical connection between the electrode terminal 2a of the electronic component 2 and the connection terminal of the first conductor wiring 3 is performed by a general method using solder, anisotropic conductive resin, or conductive adhesive. The first conductor wiring 3 on one main surface and the other conductor wiring 4 on the other main surface are connected by a through-hole conductor 5.

  In addition, as a base material of the resin substrate 1, although it is desirable to use the thermoplastic resin represented by PET resin etc., it is not limited to this.

  Hereinafter, each configuration will be described in more detail.

  A first anisotropic conductive resin layer 6 is formed on the entire surface of one main surface of the resin substrate 1. The first anisotropic conductive resin layer 6 is obtained by dispersing conductive particles 6b in a resin binder 6a, and is formed by a printing method as a paste or a pasting method as a sheet. Electronic components 7 and 8 are press-fitted into the first anisotropic conductive resin layer 6. And as shown in FIG.1 (b), each electrode terminal is electrically connected to each connection terminal of the 1st conductor wiring 3 by the conductor particle 6b in the 1st anisotropic conductive resin layer 6, and. Yes.

  Similarly, the conductive interlayer connection member 9 is press-fitted and connected to the connection terminals of the first conductor wiring 3 via the conductor particles 6 b in the first anisotropic conductive resin layer 6. In addition, as the conductive interlayer connection member 9, it is preferable to use a columnar body having at least a surface having conductivity. For example, the surface of a columnar body made of copper may be gold-plated, or the surface of a columnar body made of resin may be gold-plated. Further, the shape of the columnar body may be not only a prismatic shape and a cylindrical shape, but also a drum shape. Furthermore, a spherical body may be sufficient. In the case of a spherical shape, since there is no shape restriction when it is arranged, it can be arranged efficiently.

  A second conductor wiring 10 is further formed on the surface of the first anisotropic conductive resin layer 6. A part of the conductive interlayer connection member 9 is embedded in the connection terminal of the second conductor wiring 10. Have been in direct contact. In such a configuration, the conductive interlayer connection member 9 may be thicker than the first anisotropic conductive resin layer 6. That is, after the electronic components 7 and 8 and the conductive interlayer connection member 9 are press-fitted and locally cured, an anisotropic conductive resin having a predetermined thickness is further supplied, whereby the electronic components 7 and 8 are A structure embedded in the anisotropic conductive resin layer 6 is obtained. In this case, if the thickness of the conductive interlayer connection member 9 is made thicker than the thickness of the first anisotropic conductive resin layer 6, a part thereof is exposed or the anisotropic conductive resin is thinly formed on the surface. Is obtained. Therefore, before the second conductor wiring 10 is formed, for example, plasma cleaning is performed and the resin component of the first anisotropic conductive resin layer 6 is removed, so that the connection resistance can be sufficiently reduced.

  When the thickness of the conductive interlayer connection member 9 is approximately the same as that of the first anisotropic conductive resin layer 6, the first anisotropic conductive resin layer on the surface of the conductive interlayer connection member 9 is obtained by plasma etching. The second conductor wiring 10 may be formed after removing the resin 6.

  A second anisotropic conductive resin layer 11 is further formed on the surface of the second conductor wiring 10. And in that, the electronic component (not shown) and the conductive interlayer connection member 12 are press-fit, and each is connected to the 2nd conductor wiring 10 via the conductor particle 11b. Similarly, the third conductor wiring 13 is formed on the second anisotropic conductive resin layer 11. The third conductor wiring 13 and the conductive interlayer connection member 12 are directly connected by partially embedding the conductive interlayer connection member 12 in the connection terminal of the third conductor wiring 13 as described above. Contact occurs and is electrically connected.

  Further, a third anisotropic conductive resin layer 14 is formed on the surface of the third conductor wiring 13, and the electronic component 15 is connected to the third conductor wiring 13 by the conductive particles 14 b of the third anisotropic conductive resin layer 14. Connected to the terminal.

  Thus, the electronic circuit device of the present embodiment is configured.

  The electronic components (not shown) embedded in the electronic components 2, 7, 8, 15 and the second anisotropic conductive resin layer 11 are, for example, semiconductor chips, chip components such as chip resistors and chip capacitors, and sheets Sheet-like thin film capacitors, sheet-like thin film resistors, or sheet-like thin film circuit components composed of thin film capacitors, thin film resistors, thin film inductors, and the like can be used. The electrode terminals of the electronic parts 7, 8, and 15 are preferably provided with bumps formed by plating or the like, but the bumps have a square shape such as a square surface so as to capture as much conductor particles as possible. It is preferable to do. The bump height is desirably about 15 μm to 25 μm.

  FIG. 1 shows a case where the third anisotropic conductive resin layer 14 is formed as the uppermost layer. The thickness of the third anisotropic conductive resin layer 14 in this case may be formed to such a thickness that the electrode terminals of the electronic component 15 are press-fitted.

  The conductor particles 6b, 11b, and 14b in the first anisotropic conductive resin layer 6, the second anisotropic conductive resin layer 11, and the third anisotropic conductive resin layer 14 use the materials described above. . The size is preferably in the range of 10 μm to 100 μm, and more preferably as uniform as possible.

  Further, as a member for forming the first anisotropic conductive resin layer 6, the second anisotropic conductive resin layer 11, and the third anisotropic conductive resin layer 14, a paste-like or sheet-like member is used. Is preferred. In the case of a paste, it is applied by a technique such as printing. Moreover, in the case of a sheet form, it can be formed by processing and bonding to a predetermined shape. As the resin binders 6a, 11a, and 14a, a photo-curable insulating resin, a thermosetting insulating resin, or a resin configuration that combines them can be used. Specifically, an epoxy resin, an acrylic resin, or the like is used. In particular, when a resin configuration in which a photocurable insulating resin and a thermosetting insulating resin are combined is used, the electronic components 7, 8, 15 and the conductive interlayer connection member are individually positioned and pressed simultaneously with ultraviolet rays. It is preferable to locally irradiate each of the electronic components and the conductive interlayer connection members because they can be connected and fixed.

  In addition, the 2nd conductor wiring 10 and the 3rd conductor wiring 13 can be formed by the screen printing system, for example using the conductor resin paste which has silver particles as a main component.

  Next, a method for manufacturing the electronic circuit device according to the present embodiment will be described with reference to the drawings. At the same time as the description of the manufacturing method, still another configuration of the embodiment of the present invention will be described.

  2, 3, and 4 are cross-sectional views of main processes for explaining the method for manufacturing the electronic circuit device of the present embodiment. In the manufacturing method shown in FIGS. 2 to 4, in order to facilitate understanding of the process, the electronic components 2, 7, and 8 are described as semiconductor chips, and the electronic component 15 is described as a chip component. Therefore, in the following, the first semiconductor chip 2 instead of the electronic component 2, the second semiconductor chip 7 instead of the electronic component 7, the third semiconductor chip 8 instead of the electronic component 8, and the chip component 15 instead of the electronic component 15 Will be described.

  In addition, about the shape and dimension, the following were used. The first semiconductor chip 2 is a bare chip IC, for example, and has a thickness of 0.08 mm and a bump height of 50 μm. The second semiconductor chip 7 and the third semiconductor chip 8 are also bare chip ICs, and have a thickness of 0.05 mm and a bump height of 25 μm. And the chip component 15 mixedly used 0603 size and 1005 size. The thickness of the resin substrate 1 is 0.15 mm, and the diameter of the through hole 5a of the through hole conductor 5 is 150 μm. Furthermore, the thickness of the conductor wiring including the first conductor wiring 3, the second conductor wiring 10, and the third conductor wiring 13 was set to 20 μm. The thicknesses of the first anisotropic conductive resin layer 6, the second anisotropic conductive resin layer 11, and the third anisotropic conductive resin layer 14 were 120 μm, 120 μm, and 50 μm, respectively.

  First, as shown in FIG. 2A, the first conductor wiring 3 is embedded so that the first semiconductor chip 2 is embedded in the resin substrate 1 and the electrode terminal 2a of the first semiconductor chip 2 exposed on one main surface is included. Form.

  This can be formed as follows. That is, a thermoplastic resin layer having a predetermined thickness is formed on a sheet (not shown). Thereafter, the thermoplastic resin layer is heated, and the first semiconductor chip 2 is press-fitted from the surface until the protruding electrode terminal 2a comes into contact with the film surface. Thereafter, the thermoplastic resin layer is cured. After this curing, the sheet is peeled off. Thereby, the electrode terminal 2a of the first semiconductor chip 2 is exposed. On the one surface where the electrode terminal 2a is exposed, the first conductor wiring 3 including the electrode terminal 2a and having a predetermined pattern shape designed in advance is formed. Further, a through hole 5a is formed at a predetermined location. The through hole 5a can be formed by laser processing, oxygen plasma processing using a resist mask, or the like.

  Further, the other conductor wiring 4 is formed on the other surface of the resin substrate 1. The through-hole conductor 5 can be formed using a conventionally employed method such as paste printing or plating. In addition, the first conductor wiring 3 and the other conductor wiring 4 can be formed by screen printing, dispensing printing, or ink jet drawing of a conductive paste such as silver paste, for example. Alternatively, the metal foil may be transferred after being processed into a predetermined pattern. Furthermore, you may form by vapor deposition, sputtering, etc.

  Next, as shown in FIG. 2B, the first anisotropic conductive resin layer 6 is formed on the entire other main surface including the first conductor wiring 3. The first anisotropic conductive resin layer 6 may be formed on a sheet, or may be formed by printing a paste.

  Next, as shown in FIG. 2C, the second semiconductor chip 7, the third semiconductor chip 8, and the conductive interlayer connection member 9 are connected to the first conductive wiring 3 in the first anisotropic conductive resin layer 6. Each of the connection terminals is press-fitted in alignment and electrically connected. This connection is made through the conductive particles 6 b dispersed in the first anisotropic conductive resin layer 6. That is, the projecting electrode terminals (not shown) formed on the second semiconductor chip 7 and the third semiconductor chip 8 and the connection terminals of the first conductor wiring 3 respectively connect the conductor particles 6b. Electrically connected. In this case, since the conductor particles 6b have protrusions that are easily elastically deformed as described above, the distance between each electrode terminal and the connection terminal and the distance between the conductive interlayer connection member and the connection terminal are set. Even if variations occur, the connection resistance can be made sufficiently small.

  In addition, it is preferable that the conductive interlayer connection member 9 is a columnar body and has a diameter of about 150 μm to 500 μm. The conductive particles in the first anisotropic conductive resin layer 6 have a size of about 10 μm to 100 μm and are electrically connected by a plurality of conductive particles, so that the connection resistance can be sufficiently reduced. . The thickness of the first anisotropic conductive resin layer 6 is preferably about 100 μm to 400 μm. For this purpose, the thickness of the second semiconductor chip 7 and the third semiconductor chip 8 needs to be about 80 μm to 380 μm. In this case, it is desirable that the thicknesses of the second semiconductor chip 7 and the third semiconductor chip 8 be as equal as possible. Furthermore, since the silicon surface that is the base material is exposed when it is polished, it is preferable to apply an insulating resin after polishing. If the insulating resin is applied in this way, even if the second conductor wiring 10 is pressed to contact the second conductor wiring 10 with the second semiconductor chip 7 or the third semiconductor chip 8, a short circuit failure occurs. Etc. can be prevented.

  In this case, for example, the second semiconductor chip 7, the third semiconductor chip 8, and the conductive interlayer connection member 9 may be individually mounted. That is, as a resin binder of the first anisotropic conductive resin layer 6, a connection process may be performed by the following method using a mixture of a photocurable insulating resin and a thermosetting insulating resin. First, the electrode terminals of the second semiconductor chip 7 and the connection terminals set on the first conductor wiring 3 are aligned and then pressed. In a sufficiently pressed state, only the peripheral part of the second semiconductor chip 7 is irradiated with ultraviolet rays and cured and fixed. If the third semiconductor chip 8 and the conductive interlayer connection member 9 are also performed in the same manner, they are electrically connected to the connection terminals of the first conductor wiring 3 and are also mechanically fixed. In addition, about the area | region which was not irradiated with an ultraviolet-ray, thermosetting is finally performed.

  When such a method is performed, the first anisotropic conductive resin layer 6 is extruded and photocured in the region into which the second semiconductor chip 7, the third semiconductor chip 8 and the conductive interlayer connection member 9 are press-fitted. The For this reason, the same anisotropic conductive resin material is applied to the entire surface to form an uncured anisotropic conductive resin on the entire surface. Thus, when the uncured anisotropic conductive resin is provided on the entire surface, the height of the conductive interlayer connection member 9 is set to be larger than the thickness of the first anisotropic conductive resin layer 6. By doing in this way, electrical connection with the 2nd conductor wiring 10 formed next can be performed easily.

  In order to obtain the above method, in the present embodiment, the thickness of the second semiconductor chip 7 and the third semiconductor chip 8 including the bumps is 75 μm. The total thickness of the first anisotropic conductive resin layer 6 may be set to 100 μm to 120 μm by setting the thickness to 25 μm to 50 μm and curing the layers.

  Next, as shown in FIG. 2D, a second conductor wiring 10 is further formed on the main surface of the first anisotropic conductive resin layer 6. In this case, it is desirable to remove in advance the resin component remaining on the surface of the conductive interlayer connection member 9 by plasma cleaning or the like. The second conductor wiring 10 can be produced, for example, by forming a silver paste by printing. Thereby, the connection terminal where the first conductor wiring 3 is set and the connection terminal where the second conductor wiring 10 is set can be electrically connected.

  Next, as shown in FIG. 3A, a second anisotropic conductive resin layer 11 is further formed on the surface of the first anisotropic conductive resin layer 6 including the second conductor wiring 10. As the anisotropic conductive resin for this purpose, the same one as that used in the first anisotropic conductive resin layer 6 can be used, and the description thereof is omitted.

  Next, as shown in FIG. 3B, the conductive interlayer connection member 12 and an electronic component (not shown) are press-fitted into the second anisotropic conductive resin layer 11. Since this step is the same as FIG.

  Next, as shown in FIG. 3C, the third conductor wiring 13 is formed, and at the same time, the connection terminal of the third conductor wiring 13 and the conductive interlayer connection member 12 are electrically connected. Since this step is the same as that in FIG. The relationship between the height of the conductive interlayer connection member 12 and the thickness of the second anisotropic conductive resin layer 11 is the same as that described with reference to FIG.

  Next, as shown in FIG. 4A, a third anisotropic conductive resin layer 14 is further formed.

  Next, as shown in FIG. 4B, the chip component 15 is press-fitted so that part of the electrode terminal is embedded in the third anisotropic conductive resin layer 14. By this press-fitting, the electrode terminal of the chip component 15 and the connection terminal of the third conductor wiring 13 can be electrically connected by the conductor particles 14 b in the third anisotropic conductive resin layer 14. Even in this case, since the conductor particles 14b have the protrusions that are easily elastically deformed as described above, even if the distance between the electrode terminal and the connection terminal varies, the connection resistance is sufficiently reduced. be able to.

  The second conductor wiring 10 and the third conductor wiring 13 and the first conductor wiring 3 and the other conductor wiring 4 are formed by screen printing, dispensing printing or ink jet drawing method using a conductive paste such as silver paste, for example. can do. Alternatively, the metal foil may be transferred after being processed into a predetermined pattern. Furthermore, you may form by vapor deposition, sputtering, etc.

  As described above, the electronic circuit device according to this embodiment shown in FIG. 1 can be manufactured.

  The electronic circuit device according to the present embodiment is not limited to the configuration shown in FIG. For example, it can be used in the state up to the step of FIG. That is, in the configuration shown in FIG. 2D, the first anisotropic conductive resin layer 6 is used as an interlayer insulating film on the resin substrate 1, and the second semiconductor chip 7 is formed in the first anisotropic conductive resin layer 6. The third semiconductor chip 8 is embedded, and the first conductor wiring 3 and the second conductor wiring 10 are interlayer-connected by the conductive interlayer connection member 9. An electronic circuit device having such a configuration may be used.

  Furthermore, it is good also as a structure shown in FIG.3 (c). That is, in the configuration shown in FIG. 3C, a second anisotropic conductive resin layer 11 is further formed with respect to the configuration of FIG. 2D, and this second anisotropic conductive resin layer 11 is interlayer-insulated. An electronic component (not shown) is embedded in the second anisotropic conductive resin layer 11 and the second conductor wiring 10 and the third conductor wiring 13 are interlayer-connected by the conductive interlayer connecting member 12. It consists of a multilayer structure. An electronic circuit device having such a configuration may be used.

  Further, based on the configuration shown in FIG. 2D, the following configuration may be further added. That is, a second anisotropic conductive resin layer is further formed on the first anisotropic conductive resin layer 6 including the second conductor wiring 10, and is press-fitted into the second anisotropic conductive resin layer. It is good also as an electronic circuit device provided with the at least 1 or more electronic component by which the electrode terminal was electrically connected to the connection terminal in which the 2nd conductor wiring 10 was set with the conductor particle | grains in an anisotropic conductive resin layer. More specifically, after the configuration shown in FIG. 2D, the third anisotropic conductive resin layer 14 as the uppermost layer shown in FIG. 4B is formed, and this third anisotropic conductive resin is formed. In the layer 14, the chip component 15 is press-fitted and connected. The electronic circuit device having such a configuration may be used.

(Second Embodiment)
FIG. 5 is a cross-sectional view of an essential part of an electronic circuit device according to a second embodiment of the present invention.

  The electronic circuit device according to the present embodiment includes a first resin substrate 21 having a first conductor wiring 21b formed on at least one main surface, and a first resin surface formed on one main surface including the first conductor wiring 21b. 1 anisotropic conductive resin layer 22 and a connection in which first conductor wiring 21b is set by conductor particles 22b in first anisotropic conductive resin layer 22 and press-fitted into first anisotropic conductive resin layer 22 One conductor wiring 25c is laminated on the surface of the electronic component 23 in which the electrode terminal 23a is electrically connected to the terminal and the first anisotropic conductive resin layer 22 and is formed on both surfaces. A second resin substrate 25 press-fitted into the anisotropic conductive resin layer 22; a connection terminal on which the first conductor wiring 21b is set; and a connection terminal on which one conductor wiring 25c of the second resin substrate 25 is set. The conductive particles 22b in the first anisotropic conductive resin layer 22 Through it and a conductive interlayer connection member 24 for electrically connecting.

  Further, a second anisotropic conductive resin layer 26 is formed on the second resin substrate 25 including the other conductor wiring 25 b of the second resin substrate 25. Then, the electrode terminal is electrically inserted into the second anisotropic conductive resin layer 26, and the electrode terminal is electrically connected to the connection terminal set on the other conductor wiring 25 b by the conductive particles 26 b in the second anisotropic conductive resin layer 26. For the connected electronic components 27, 28, the second conductor wiring 30 formed on the surface of the second anisotropic conductive resin layer 26, and the connection terminal set for the other conductor wiring 25b, the second By making direct contact with the connection terminal, which is electrically connected via the conductive particles 26 b in the anisotropic conductive resin layer 26, and the set connection terminal of the second conductor wiring 30 is performed. A conductive interlayer connection member 29 that is electrically connected is provided.

  In the present embodiment, in addition to the above-described configuration, a third anisotropic conductive resin layer 31 is further formed on the second anisotropic conductive resin layer 26 including the second conductor wiring 30. Then, the electrode terminal is electrically inserted into the connection terminal set in the second conductor wiring 30 by the conductor particles 31b in the third anisotropic conductive resin layer 31 and press-fitted into the third anisotropic conductive resin layer 31. A connected electronic component 32 is provided.

  Hereinafter, this configuration will be described in more detail.

  In the present embodiment, a first anisotropic conductive resin layer 22 is disposed between a first resin substrate 21 and a second resin substrate 25 which are flexible wiring boards, and the first anisotropic conductive resin layer 22. The electronic component 23 is built in.

  The first resin substrate 21 and the second resin substrate 25 each have a three-layer structure. That is, in the first resin substrate 21, the first conductor wiring 21b and the surface conductor wiring 21c are formed on both surfaces of the flexible base material 21a, and these conductor wirings are connected by the through-hole conductor 21d. Similarly, the 2nd resin substrate 25 is comprised from the flexible base material 25a, the one conductor wiring 25c, the other conductor wiring 25b, and the through-hole conductor 25d. The first conductor wiring 21b and the surface layer conductor wiring 21c formed on the first resin substrate 21 and the one conductor wiring 25c and the other conductor wiring 25b formed on the second resin substrate 25 are generally materials and processes for producing a flexible wiring substrate. May be formed. For example, a copper foil may be formed by etching, or a silver paste may be formed by a printing method. Alternatively, it may be formed by vapor deposition and plating.

  The electrical connection between the first resin substrate 21 and the second resin substrate 25 is performed by the conductive interlayer connection member 24 and the conductor particles 22b press-fitted into the first anisotropic conductive resin layer 22. . In this case, the thickness of the conductive interlayer connection member 24 is set to the same level as the electronic component having the maximum thickness among the electronic components 23.

  Further, the connection between the electronic component 23 and the connection terminal of the first conductor wiring 21b is performed by the conductor particles 22b. Similarly, the connection between the first conductor wiring 21b and the one conductor wiring 25c is performed by the conductive interlayer connection member 24 through the conductor particles 22b.

  The conductive particles 22b in the first anisotropic conductive resin layer 22 are those having projections that are easily elastically deformed as in the first embodiment. Also, the resin binder 22a may be made of the material described in the first embodiment, and the description thereof is omitted. Furthermore, as a member for forming the first anisotropic conductive resin layer 22, it is preferable to use a paste-like or sheet-like member. In the case of a paste, it is applied by a technique such as printing. Moreover, in the case of a sheet form, it can be formed by processing and bonding to a predetermined shape.

  Since such a first anisotropic conductive resin layer is used, even if the distance between each electrode terminal and the connection terminal and the distance between the conductive interlayer connection member and the connection terminal vary, the connection resistance is reduced. It can be made sufficiently small.

  A second anisotropic conductive resin layer 26 is further formed on the thus configured substrate surface. Electronic components 27 and 28 are press-fitted into the second anisotropic conductive resin layer 26, and each electrode terminal (not shown) is connected to the connection terminal of the other conductor wiring 25b. On the other hand, the conductive interlayer connection member 29 is electrically connected to the connection terminal on which the other conductor wiring 25b is set via the conductive particles 26b in the second anisotropic conductive resin layer 26. In addition, the connection terminal set with the second conductor wiring 30 is electrically connected by being partly embedded in the connection terminal and performing direct contact. As the conductive interlayer connection member 29, the same material and shape as those of the first embodiment can be used, and the description thereof is omitted.

  In addition, the connection between the electronic components 27 and 28 and the connection terminal of the other conductor wiring 25b is also performed through the conductor particles 26b in the second anisotropic conductive resin layer 26. Even in this connection, the connection resistance can be sufficiently reduced even if the distance between each electrode terminal and the connection terminal and the distance between the conductive interlayer connection member and the connection terminal vary as described above.

  Further, a second conductor wiring 30 is formed on the surface of the second anisotropic conductive resin layer 26. When the second conductor wiring 30 is formed, the conductive interlayer connection member 29 and the connection terminal of the second conductor wiring 30 are electrically connected simultaneously. For this connection, as in the first embodiment, for example, the second conductor wiring 30 can be formed by printing using silver paste, and at the same time, electrical connection can be performed.

  A third anisotropic conductive resin layer 31 is further formed on the surface of the second conductor wiring 30, and an electronic component 32 is mounted thereon. When the third anisotropic conductive resin layer 31 is the uppermost layer, the thickness thereof may be such that the electrode terminal of the electronic component 32 is embedded. Also in this case, the electrode terminal of the electronic component 32 is electrically connected to the connection terminal of the second conductor wiring 30 through the conductor particles 31b.

  The electronic components 23, 27, 28, and 32 are constituted by, for example, a semiconductor chip, a chip component such as a chip resistor or a chip capacitor, a sheet-like thin film capacitor, a sheet-like thin film resistor or thin film capacitor, a thin film resistor, a thin film inductor, or the like. Each of the sheet-like thin film circuit components can be used.

  Further, the resin binders 26a and 31a and the conductor particles 26b and 31b constituting the second anisotropic conductive resin layer 26 and the third anisotropic conductive resin layer 31 are formed of the resin of the first anisotropic conductive resin layer 22. Since the same thing as the binder 22a and the conductor particle 22b can be used, description is abbreviate | omitted.

  Further, the second conductor wiring 30 may be formed by a printing method using, for example, silver paste. Alternatively, it may be formed by vapor deposition and plating. However, in order to reduce the wiring resistance value, the film thickness is preferably about 10 μm to 50 μm.

  Thus, the electronic circuit device according to the present embodiment is obtained. In the electronic circuit device according to the present embodiment, the interlayer insulating layer, the interlayer connection, and the connection between the connection terminal of the conductor wiring and the electrode terminal of the electronic component can be formed of the same material and in the same process, Moreover, it can be formed thin as a whole.

  In addition, since an anisotropic conductive resin layer in which conductive particles having protrusions on the surface are dispersed is used, the distance between the electrode terminal of the electronic component and the connection terminal of the conductor wiring or the conductive interlayer connection member and the conductor Even if the distance between the connection terminals of the wiring varies when the electronic component or the conductive interlayer connection member is press-fitted, variation in connection resistance can be suppressed. Accordingly, since the wiring resistance can be reduced as a whole, a high-performance electronic circuit device can be manufactured by a simple method.

  Further, as the anisotropic conductive resin layer, the electronic circuit device can be manufactured by using either a paste-form formation method by applying or printing or a sheet-form attachment method. .

  Next, a method for manufacturing an electronic circuit device according to the second embodiment of the present invention will be described. 6, 7 and 8 are cross-sectional views of main steps for explaining the method of manufacturing the electronic circuit device according to the second embodiment of the present invention.

  Also in the manufacturing method shown in FIGS. 6 to 8, the electronic components 23, 27, and 28 are described as semiconductor chips and the electronic component 32 is described as a chip component in order to facilitate understanding of the process as in the first embodiment. To do. Therefore, in the following description, the first semiconductor chip 23 instead of the electronic component 23, the second semiconductor chip 27 instead of the electronic component 27, the third semiconductor chip 28 instead of the electronic component 28, and the chip component 32 instead of the electronic component 32. Will be described.

  First, as shown in FIG. 6A, a first resin substrate 21 is prepared. The first resin substrate 21 is formed by forming a first conductor wiring 21b on one main surface of the flexible base 21a and a surface conductor wiring 21c on the other main surface. Further, the first conductor wiring 21b and the surface conductor wiring 21c are formed. Are connected by a through-hole conductor 21d.

  Next, as shown in FIG. 6B, the first anisotropic conductive resin layer 22 is formed on one main surface of the first resin substrate 21.

  Next, as shown in FIG. 6C, the first semiconductor chip 23 is press-fitted into the first anisotropic conductive resin layer 22, and the electrode terminal 23a and the connection terminal of the first conductor wiring 21b are connected to the first. Connection is made by conductor particles 22 b in the anisotropic conductive resin layer 22. Similarly, the conductive interlayer connection member 24 is press-fitted into the first anisotropic conductive resin layer 22, and the connection terminals of the first conductor wiring 21b and the conductive interlayer connection member 24 are connected by the conductor particles 22b. To do. Also in this case, the same anisotropic conductive resin material as in the first embodiment can be used, and if it is cured by irradiation with ultraviolet rays locally, electrical connection and fixing by curing can be performed individually. it can. By performing such a method, in the region where the first semiconductor chip 23 and the conductive interlayer connection member 24 are press-fitted, the first anisotropic conductive resin layer 22 is extruded and photocured. The same anisotropic conductive resin material is applied to these regions so that an uncured anisotropic conductive resin is provided on the entire surface.

  Next, as shown in FIG. 6D, the second resin substrate 25 is bonded to the first anisotropic conductive resin layer 22 while being pressed. By the pressurization at the time of adhesion, the connection terminal of one conductor wiring 25c of the second resin substrate 25 and the conductive interlayer connection member 24 are connected through the conductor particles 22b. With the pressurization at this time, not only one of the conductor wirings 25c is embedded in the first anisotropic conductive resin layer 22, but also the second resin substrate until the thickness of the first anisotropic conductive resin layer 22 is reduced to some extent. 25 may be pressurized. By pressurizing in this way, the electrical connection between the connection terminal of one conductor wiring 25c and the conductive interlayer connection member 24 can be more reliably performed.

  Next, as shown in FIG. 7A, a second anisotropic conductive resin layer 26 is formed on the entire surface of the second resin substrate 25.

  Next, as shown in FIG. 7B, the second semiconductor chip 27 and the third semiconductor chip 28 are press-fitted into the second anisotropic conductive resin layer 26, and the respective electrode terminals and the other conductor wiring 25b are pressed. Are connected via the conductive particles 26b. Similarly, the conductive interlayer connection member 29 is press-fitted into the second anisotropic conductive resin layer 26, and the connection terminal of the other conductor wiring 25b and the conductive interlayer connection member 29 are connected.

  Next, as illustrated in FIG. 7C, the second conductor wiring 30 is formed on the second anisotropic conductive resin layer 26. The formation of the second conductor wiring 30 and the connection between the conductive interlayer connection members 29 can be performed by using the same material and manufacturing method as those in the first embodiment, and thus description thereof is omitted.

  Further, as shown in FIG. 8, a third anisotropic conductive resin layer 31 is formed on the entire surface. Thereafter, the chip component 32 is press-fitted into the third anisotropic conductive resin layer 31, and the electrode terminal and the connection terminal of the second conductor wiring 30 are connected through the conductor particles 31b.

  As described above, the electronic circuit device according to the present embodiment can be manufactured. In the case of the method of manufacturing the electronic circuit device according to the present embodiment, two flexible wiring boards, that is, a first resin board and a second resin board are used, and the conductive wiring is made of an anisotropic conductive resin layer. Since it does not need to be formed above, the degree of freedom in producing the conductor wiring can be increased. For example, a copper foil can be easily used.

  The electronic circuit device according to the present embodiment is not limited to the configuration shown in FIG. For example, it can be used in the state up to the step of FIG. That is, the configuration shown in FIG. 6D is a state in which up to the second resin substrate 25 is laminated, and an electronic circuit device having such a configuration may be used.

  Furthermore, it is good also as a structure shown in FIG.7 (c). That is, in the configuration shown in FIG. 7C, a second anisotropic conductive resin layer 26 is further formed with respect to the configuration in FIG. 6D, and this second anisotropic conductive resin layer 26 is interlayer-insulated. The second semiconductor chip 27 and the third semiconductor chip 28 are embedded in the second anisotropic conductive resin layer 26, and the other conductor wiring 25 b and the second conductor wiring 30 are connected by the conductive interlayer connection member 29. Consists of a multi-layer structure in which layers are connected. An electronic circuit device having such a configuration may be used.

  Further, the following configuration may be added based on the configuration shown in FIG. That is, a second anisotropic conductive resin layer is further formed on the second resin substrate 25 including the other conductor wiring 25b, and is press-fitted into the second anisotropic conductive resin layer. It is good also as an electronic circuit apparatus provided with the at least 1 or more electronic component by which the electrode terminal was electrically connected to the connection terminal in which the other conductor wiring 25b was set by the conductor particle in a resin layer.

  In the first embodiment and the second embodiment, one or two electronic components are embedded in each anisotropic conductive resin layer, but this is for convenience. Further, a plurality of electronic components may be used. Furthermore, the present invention is not limited to semiconductor chips and chip components, and various electronic components such as semiconductor chips, chip components, and sheet-like devices may be embedded in each anisotropic conductive resin layer.

  In the first embodiment, an anisotropic conductive resin layer and a wiring layer are formed on the resin substrate surface to form a multilayer wiring structure in which electronic components are built. In the second embodiment, a double-sided wiring board is used. Although it was set as the structure which incorporates an electronic component while sticking together by an anisotropic conductive resin layer using this, this invention is not limited to these. A combination of these may also be used. Furthermore, instead of the double-sided wiring, a configuration may be adopted in which a resin substrate containing an electronic component is arranged on the upper layer side.

  The electronic circuit device of the present invention is thin and small by using the anisotropic conductive resin layer for interlayer insulation and interlayer connection and connection between the electrode terminal of the electronic component and the connection terminal of the conductor wiring. An electronic circuit device having a simple manufacturing process can be realized, and is useful in the field of electronic equipment that requires high-density mounting, thinning, and cost reduction, particularly in the field of portable information equipment such as a mobile phone.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the electronic circuit apparatus concerning the 1st Embodiment of this invention, (a) is the principal part sectional drawing, (b) is an expanded sectional view which shows the state of a connection part. Sectional drawing of the main process for demonstrating the manufacturing method of the electronic circuit device of the embodiment Sectional drawing of the main process for demonstrating the manufacturing method of the electronic circuit device of the embodiment Sectional drawing of the main process for demonstrating the manufacturing method of the electronic circuit device of the embodiment Sectional drawing of the principal part of the electronic circuit apparatus concerning the 2nd Embodiment of this invention Sectional drawing of the main process for demonstrating the manufacturing method of the electronic circuit device concerning the embodiment Sectional drawing of the main process for demonstrating the manufacturing method of the electronic circuit device concerning the embodiment Sectional drawing of the main process for demonstrating the manufacturing method of the electronic circuit device concerning the embodiment Process sectional drawing for demonstrating the structure and manufacturing method about an example of the conventional electronic circuit device The figure which shows the electronic circuit apparatus which adhere | attaches and laminates | stacks the wiring films in which the conductor wiring and the connection protrusion which were other examples of the conventional electronic circuit were formed by the anisotropic conductive film, (a) Sectional drawing for demonstrating the manufacturing method, (b) is sectional drawing of the produced electronic circuit apparatus, (c) is principal part sectional drawing of an interlayer connection part.

Explanation of symbols

1,41,51 Resin substrate 2,23 Electronic component (first semiconductor chip)
2a, 23a, 42a Electrode terminal 3, 21b First conductor wiring 4, 25b Other conductor wiring 5, 21d, 25d, 41c Through-hole conductor 5a Through-hole 6, 22 First anisotropic conductive resin layer 6a, 11a, 14a , 22a, 26a, 31a Resin binder 6b, 11b, 14b, 22b, 26b, 31b, 53b, 56b Conductor particle 7, 27 Electronic component (second semiconductor chip)
8,28 Electronic components (third semiconductor chip)
9, 12, 24, 29 Conductive interlayer connection member 10, 30 Second conductor wiring 11, 26 Second anisotropic conductive resin layer 13 Third conductor wiring 14, 31 Third anisotropic conductive resin layer 15, 32 Electrons Parts (chip parts)
21 First resin substrate 21a, 25a Flexible base material 21c Surface layer conductor wiring 25 Second resin substrate 25c One conductor wiring 41a, 41b, 44, 48, 52, 55, 58 Conductor wiring 42 Semiconductor chip 43, 45 Interlayer insulating layer 49 Electronic parts 53, 56 Anisotropic conductive film 53a, 56a Insulating resin 54, 57 Wiring film 59 Press machine 60 Heater

Claims (6)

A resin substrate having a first conductor wiring formed on at least one main surface;
A first anisotropic conductive resin layer formed on the one main surface including the first conductor wiring;
The connection terminals set in the first conductor wiring and the electrode terminals are electrically connected by the conductor particles press-fitted into the first anisotropic conductive resin layer and in the first anisotropic conductive resin layer. Electronic components,
A second conductor wiring formed on the surface of the first anisotropic conductive resin layer;
The connection terminal set for the first conductor wiring is electrically connected via the conductive particles in the first anisotropic conductive resin layer, and the connection set for the second conductor wiring for the terminal, a sub-circuit device conductive with and electrically connected to conductive interlayer connection member by performing a direct contact with the connection terminal,
A second anisotropic conductive resin layer is further formed on the first anisotropic conductive resin layer including the second conductor wiring,
The connection terminal set to the second conductor wiring and the electrode terminal are electrically connected by the conductive particles in the second anisotropic conductive resin layer that are press-fitted into the second anisotropic conductive resin layer. Electronic components,
A third conductor wiring formed on the surface of the second anisotropic conductive resin layer;
The connection terminal set for the second conductor wiring is electrically connected via the conductive particles in the second anisotropic conductive resin layer, and the connection set for the third conductor wiring. An electronic circuit device comprising a conductive interlayer connection member electrically connected to the terminal by direct contact with the connection terminal. A resin substrate having a first conductor wiring formed on at least one main surface;
A first anisotropic conductive resin layer formed on the one main surface including the first conductor wiring;
The connection terminals set in the first conductor wiring and the electrode terminals are electrically connected by the conductor particles press-fitted into the first anisotropic conductive resin layer and in the first anisotropic conductive resin layer. Electronic components,
A second conductor wiring formed on the surface of the first anisotropic conductive resin layer;
The connection terminal set for the first conductor wiring is electrically connected via the conductive particles in the first anisotropic conductive resin layer, and the connection set for the second conductor wiring For a terminal, an electronic circuit device comprising a conductive interlayer connection member electrically connected by making direct contact with the connection terminal,
A second anisotropic conductive resin layer is further formed on the first anisotropic conductive resin layer including the second conductor wiring,
The connection terminal set to the second conductor wiring and the electrode terminal are electrically connected by the conductive particles in the second anisotropic conductive resin layer that are press-fitted into the second anisotropic conductive resin layer. An electronic circuit device comprising the electronic component. A third anisotropic conductive resin layer is further formed on the second anisotropic conductive resin layer including the third conductor wiring,
The connection terminals set in the third conductor wiring and the electrode terminals are electrically connected by the conductive particles press-fitted into the third anisotropic conductive resin layer and in the third anisotropic conductive resin layer. The electronic circuit device according to claim 1 , further comprising an electronic component. A first resin substrate having a first conductor wiring formed on at least one main surface;
A first anisotropic conductive resin layer formed on the one main surface including the first conductor wiring;
The connection terminals set in the first conductor wiring and the electrode terminals are electrically connected by the conductor particles press-fitted into the first anisotropic conductive resin layer and in the first anisotropic conductive resin layer. Electronic components,
A second resin substrate laminated on the surface of the first anisotropic conductive resin layer, and one of the conductor wires formed on both sides is press-fitted into the first anisotropic conductive resin layer;
An electrical connection is made between the connection terminal set with the first conductor wiring and the connection terminal set with the one conductor wiring of the second resin substrate via the conductive particles in the first anisotropic conductive resin layer. An electronic circuit device comprising a conductive interlayer connection member that is electrically connected,
A second anisotropic conductive resin layer is further formed on the second resin substrate surface including the other conductor wiring of the second resin substrate,
The connection terminal set on the other conductor wiring and the electrode terminal are electrically connected by the conductive particles in the second anisotropic conductive resin layer that are press-fitted into the second anisotropic conductive resin layer. Electronic components,
A second conductor wiring formed on the surface of the second anisotropic conductive resin layer;
The connection terminal set for the other conductor wiring is electrically connected via the conductive particles in the second anisotropic conductive resin layer, and the connection set for the second conductor wiring For the terminal, comprising a conductive interlayer connection member electrically connected by direct contact with the connection terminal,
A third anisotropic conductive resin layer is further formed on the second anisotropic conductive resin layer including the second conductor wiring,
The connection terminals and the electrode terminals set in the second conductor wiring are electrically connected by the conductive particles in the third anisotropic conductive resin layer that are press-fitted into the third anisotropic conductive resin layer. An electronic circuit device comprising the above-described electronic component. The resin board further includes an electronic component, and is connected to the first conductor wiring formed on the one main surface or the other conductor wiring formed on the other main surface. The electronic circuit device according to any one of claims 1 to 3 . The first anisotropic conductive resin layer, the second anisotropic conductive resin layer, and the third anisotropic conductive resin layer include coil-shaped conductor particles, fiber-ball-shaped conductor particles, and a plurality of conductive surfaces. 5. The electronic circuit device according to claim 3 , comprising at least one type of conductive particles selected from conductive particles having a plurality of protrusions and a resin binder. 6.

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