CN111556671A - Manufacturing method of 5G high-frequency mixed-voltage stepped circuit board - Google Patents
Manufacturing method of 5G high-frequency mixed-voltage stepped circuit board Download PDFInfo
- Publication number
- CN111556671A CN111556671A CN202010603543.8A CN202010603543A CN111556671A CN 111556671 A CN111556671 A CN 111556671A CN 202010603543 A CN202010603543 A CN 202010603543A CN 111556671 A CN111556671 A CN 111556671A
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- substrate
- circuit board
- prepreg
- frequency mixed
- finished
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 19
- 239000000758 substrate Substances 0.000 claims abstract description 98
- 238000007906 compression Methods 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 238000005530 etching Methods 0.000 claims abstract description 10
- 238000009713 electroplating Methods 0.000 claims abstract description 8
- 238000007731 hot pressing Methods 0.000 claims abstract description 5
- 238000003825 pressing Methods 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000010030 laminating Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
Abstract
The invention discloses a manufacturing method of a 5G high-frequency mixed-voltage stepped circuit board, which comprises the following steps: s1, selecting a first substrate (1), a second substrate (2) and a third substrate (3); s4, hot-pressing the first substrate (1) and the second substrate (2) into a whole by using a pressing machine, and after the two prepregs are pressed and heated, fixedly connecting the first substrate (1) and the second substrate (2) into a whole by using a first prepreg (4), and fixedly connecting the second substrate (2) and the third substrate (3) into a whole by using a second prepreg (5); s5, electroplating a layer of copper foil (6) on the top surfaces of the three substrates by adopting an electroplating process to obtain a semi-finished step circuit board; and S6, etching the copper foil (6) by adopting an etching process to etch the circuit layer (7), thereby preparing the finished product 5G high-frequency mixed-compression stepped circuit board. The invention has the beneficial effects that: simple process, long service life and high productivity.
Description
Technical Field
The invention relates to the technical field of 5G high-frequency mixed-compression stepped circuit board production, in particular to a manufacturing method of a 5G high-frequency mixed-compression stepped circuit board.
Background
With the development of small-sized and diversified electronic products, the traditional planar circuit board cannot meet the requirements of electronic products in many fields due to the restriction of space and safety, and more stepped boards are gradually developed. The traditional planar circuit board is difficult to meet the shape requirement of products, cannot utilize space to the maximum extent, and provides technical basis for the diversified development of electronic products. The 5G high-frequency mixed-voltage stepped circuit board comprises circuit boards sequentially compounded from bottom to top, wherein a circuit layer is arranged on the top surface of each circuit board, and each circuit layer is located on the step face of the stepped circuit board. The processing steps of the 5G high-frequency mixed-compression stepped circuit board are as follows: the method comprises the steps of selecting three substrates, plating a layer of copper foil on the top surface of each substrate, etching a circuit layer on the copper foil by adopting an etching process, stacking the substrates of the three circuit boards, placing a layer of prepreg between every two adjacent substrates, ensuring that the circuit layer of each circuit board is in stepped distribution in the stacking process, hot-pressing the circuit board on the topmost layer by adopting a press machine after stacking, and fixedly connecting all the substrates into a whole after the prepreg is pressed and heated, thereby finally manufacturing the high-frequency mixed-pressing stepped circuit board. However, although this manufacturing process can manufacture the finished high-frequency hybrid stepped circuit board, the following drawbacks still exist: 1. the prepreg connecting substrate is unstable and is easily separated from the substrate, so that the mechanical strength of the stepped circuit board is reduced, and the service life of the stepped circuit board is shortened. 2. In the process of stacking circuit boards by workers, the positions of the circuit boards need to be adjusted layer by layer to ensure that the circuit layers of the circuit boards are in the step distribution, which undoubtedly increases the time for adjusting the positions and further reduces the production efficiency of the step circuit boards.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides the manufacturing method of the 5G high-frequency mixed-compression stepped circuit board, which has the advantages of simple process, long service life and high production efficiency.
The purpose of the invention is realized by the following technical scheme: a manufacturing method of a 5G high-frequency mixed-compression stepped circuit board comprises the following steps:
s1, selecting a first substrate, a second substrate and a third substrate, and ensuring that the length of the first substrate is greater than that of the second substrate and the length of the second substrate is greater than that of the third substrate;
s2, selecting a first prepreg and a second prepreg, ensuring that the size of the first prepreg is equal to that of the second substrate and the size of the second prepreg is equal to that of the third substrate, operating a handheld grinding machine to enable grinding wheels to perform grinding treatment on two surfaces of the two prepregs, and stopping grinding after grinding for a period of time;
s3, horizontally placing the first substrate on the table top of the laminating machine, sequentially stacking a first prepreg, a second substrate, a second prepreg and a third substrate from bottom to top on the top surface of the first substrate, ensuring that the first prepreg is overlapped with the first substrate, the second prepreg is overlapped with the third substrate and ensuring that the right end faces of the first substrate, the second substrate and the third substrate are flush;
s4, hot-pressing the first substrate and the second substrate into a whole by using a pressing machine, and after the two prepregs are pressed and heated, fixedly connecting the first substrate and the second substrate into a whole by using the first prepreg and fixedly connecting the second substrate and the third substrate into a whole by using the second prepreg;
s5, electroplating a layer of copper foil on the top surfaces of the three substrates by adopting an electroplating process to obtain a semi-finished step circuit board;
and S6, etching the copper foil by adopting an etching process to etch the circuit layer, thereby preparing the finished product 5G high-frequency mixed-compression stepped circuit board.
After the circuit layer is etched in the step S6, the moisture attached to the surface of the semi-finished step circuit board is cleaned in a spray cleaning manner, and after cleaning, a worker puts the semi-finished step circuit board into an oven and bakes the semi-finished step circuit board through the oven, thereby preparing the finished 5G high-frequency mixed-compression step circuit board.
The invention has the following advantages: the invention has simple process, long service life and improved production efficiency.
Drawings
FIG. 1 is a schematic structural diagram of a 5G finished product high-frequency mixed-compression stepped circuit board;
FIG. 2 is a schematic view of a plurality of substrates after being combined;
FIG. 3 is a schematic structural diagram of a semi-finished step circuit board;
in the figure, 1-first substrate, 2-second substrate, 3-third substrate, 4-first prepreg, 5-second prepreg, 6-copper foil, 7-circuit layer.
Detailed Description
The invention will be further described with reference to the accompanying drawings, without limiting the scope of the invention to the following:
a manufacturing method of a 5G high-frequency mixed-compression stepped circuit board comprises the following steps:
s1, selecting the first substrate 1, the second substrate 2 and the third substrate 3 to ensure that the length of the first substrate 1 is greater than that of the second substrate 2 and the length of the second substrate 2 is greater than that of the third substrate 3;
s2, selecting a first prepreg 4 and a second prepreg 5, ensuring that the size of the first prepreg 4 is equal to that of the second substrate 2, and the size of the second prepreg 5 is equal to that of the third substrate 3, operating a handheld grinding machine to enable grinding wheels of the handheld grinding machine to perform grinding treatment on both sides of the two prepregs, and stopping grinding after grinding for a period of time;
s3, placing the first substrate 1 flat on the table of the laminating machine, stacking the first prepreg 4, the second substrate 2, the second prepreg 5 and the third substrate 3 on the top surface of the first substrate 1 from bottom to top in sequence, and ensuring that the first prepreg 4 is overlapped with the first substrate 1, the second prepreg 5 is overlapped with the third substrate 3, and simultaneously ensuring that the right end faces of the first substrate 1, the second substrate 2 and the third substrate 3 are flush;
s4, hot-pressing the third substrate 3 on the top surface by using a pressing machine, wherein after the two prepregs are pressed and heated, the first prepreg 4 fixedly connects the first substrate 1 and the second substrate 2 into a whole, and the second prepreg 5 fixedly connects the second substrate 2 and the third substrate 3 into a whole as shown in FIG. 2; because the lines are polished on the two sides of the first prepreg 4 and the second prepreg 5 through the grinding wheel, the lines increase the roughness of the whole prepreg, so that the two substrates of the prepreg are more firmly fixedly connected into a whole, the prepreg is effectively prevented from falling off from the substrate, and the two adjacent substrates are more firmly connected, so that the mechanical strength of the finished 5G high-frequency mixed-compression stepped circuit board is greatly improved, and the service life of the finished 5G high-frequency mixed-compression stepped circuit board is greatly prolonged.
S5, electroplating a layer of copper foil 6 on the top surfaces of the three substrates by adopting an electroplating process, thereby preparing a semi-finished step circuit board as shown in figure 3;
s6, etching the copper foil 6 by etching process to etch the circuit layer 7, thereby preparing the final product 5G high frequency mixed-compression stepped circuit board as shown in fig. 1. Therefore, in step S3, the step surface is formed in advance, and the step-distributed circuit layer can be formed only by directly plating the circuit layer on the step surface, so that compared with the conventional manufacturing process of the stepped board, the subsequent step of adjusting the circuit layer is omitted, and the production efficiency of the 5G high-frequency mixed-compression stepped circuit board is greatly improved.
After the circuit layer 7 is etched in the step S6, the moisture attached to the surface of the semi-finished step circuit board is cleaned in a spray cleaning manner, and after cleaning, a worker puts the semi-finished step circuit board into an oven and bakes the semi-finished step circuit board through the oven, thereby preparing the finished 5G high-frequency mixed-compression step circuit board.
The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the invention is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (2)
1. A manufacturing method of a 5G high-frequency mixed-compression stepped circuit board is characterized by comprising the following steps: it comprises the following steps:
s1, selecting a first substrate (1), a second substrate (2) and a third substrate (3), and ensuring that the length of the first substrate (1) is greater than that of the second substrate (2) and the length of the second substrate (2) is greater than that of the third substrate (3);
s2, selecting a first prepreg (4) and a second prepreg (5), ensuring that the size of the first prepreg (4) is equal to that of the second substrate (2), ensuring that the size of the second prepreg (5) is equal to that of the third substrate (3), operating a handheld grinding machine to enable grinding wheels of the handheld grinding machine to perform grinding treatment on two surfaces of the two prepregs, and stopping grinding after grinding for a period of time;
s3, horizontally placing the first substrate (1) on the table top of a laminating machine, sequentially stacking a first prepreg (4), a second substrate (2), a second prepreg (5) and a third substrate (3) on the top surface of the first substrate (1) from bottom to top, ensuring that the first prepreg (4) is overlapped with the first substrate (1), the second prepreg (5) is overlapped with the third substrate (3), and ensuring that the right end faces of the first substrate (1), the second substrate (2) and the third substrate (3) are flush;
s4, hot-pressing the first substrate (1) and the second substrate (2) into a whole by using a pressing machine, and after the two prepregs are pressed and heated, fixedly connecting the first substrate (1) and the second substrate (2) into a whole by using a first prepreg (4), and fixedly connecting the second substrate (2) and the third substrate (3) into a whole by using a second prepreg (5);
s5, electroplating a layer of copper foil (6) on the top surfaces of the three substrates by adopting an electroplating process to obtain a semi-finished step circuit board;
and S6, etching the copper foil (6) by adopting an etching process to etch the circuit layer (7), thereby preparing the finished product 5G high-frequency mixed-compression stepped circuit board.
2. The manufacturing method of the 5G high-frequency mixed-voltage stepped circuit board according to claim 1, wherein the manufacturing method comprises the following steps: and (3) after the circuit layer (7) is etched in the step (S6), cleaning moisture attached to the surface of the semi-finished step circuit board in a spray cleaning mode, putting the semi-finished step circuit board into an oven after cleaning, and baking the semi-finished step circuit board through the oven, thereby preparing the finished 5G high-frequency mixed-compression step circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010603543.8A CN111556671A (en) | 2020-06-29 | 2020-06-29 | Manufacturing method of 5G high-frequency mixed-voltage stepped circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010603543.8A CN111556671A (en) | 2020-06-29 | 2020-06-29 | Manufacturing method of 5G high-frequency mixed-voltage stepped circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111556671A true CN111556671A (en) | 2020-08-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010603543.8A Pending CN111556671A (en) | 2020-06-29 | 2020-06-29 | Manufacturing method of 5G high-frequency mixed-voltage stepped circuit board |
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| CN (1) | CN111556671A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI754493B (en) * | 2020-10-29 | 2022-02-01 | 大陸商鵬鼎控股（深圳）股份有限公司 | Printed circuit board to printed circuit board connection structure and manufacturing method |
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| JP2012059923A (en) * | 2010-09-09 | 2012-03-22 | Fujikura Ltd | Manufacturing method of wiring board and wiring board |
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Application publication date: 20200818 |