CN219577350U

CN219577350U - Novel FPC multiply wood

Info

Publication number: CN219577350U
Application number: CN202320165843.1U
Authority: CN
Inventors: 陈宝丞; 何本斌; 夏祥
Original assignee: Haishun Electronic Technology Zhuhai Co ltd
Current assignee: Haishun Electronic Technology Zhuhai Co ltd
Priority date: 2023-02-09
Filing date: 2023-02-09
Publication date: 2023-08-22
Anticipated expiration: 2033-02-09

Abstract

The utility model provides a novel FPC (flexible printed circuit) multilayer board, which comprises a first substrate, a second substrate, a third substrate and a fourth substrate, wherein the first substrate, the second substrate, the third substrate and the fourth substrate form a multilayer board; according to the utility model, the positioning clamping blocks enter the positioning clamping grooves to limit the third substrate and the fourth substrate, so that the third substrate and the fourth substrate correspond to each other, and no deviation occurs; the serial numbers are arranged inside the imprinting grooves in an etching mode, so that the imprinting grooves can be better arranged in a sequencing mode, the imprinting grooves are obliquely arranged, the mounting positions of the substrates can be judged through the positions of the imprinting grooves when the serial numbers are smaller, and the problem of lamination errors of the multilayer plates can be reduced.

Description

Novel FPC multiply wood

Technical Field

The utility model belongs to the field of FPC (Flexible printed Circuit) multilayer boards, and particularly relates to a novel FPC multilayer board.

Background

When the circuit is too complex, a single layer board cannot be wired, or copper foil is required for ground shielding, a double layer board or even a multi layer board is required, and the most typical difference between a multi layer board and a single layer board is that a via structure is added to connect the copper foil layers. When producing the multiply wood, use the pure glue to combine in the middle of every layer FPC to reach the product each layer and combine together, but general multiply wood is when the installation, does not have location structure, this just leads to when actual production, produces slight dislocation condition easily, thereby can reduce the holistic qualification rate of product, is unfavorable for improving holistic production quality.

In summary, the present utility model provides a novel FPC multilayer board to solve the above problems.

Disclosure of Invention

In order to solve the technical problems, the utility model provides a novel FPC (flexible printed circuit) multilayer board, which solves the problems that the prior art multilayer board has no positioning structure during installation, so that fine dislocation is easy to generate during actual production, and the like.

The utility model provides a novel FPC multiply wood, includes first base plate, second base plate, third base plate, fourth base plate, the multiply wood is constituteed to first base plate, second base plate, third base plate, fourth base plate, the location draw-in groove has been seted up to the lower surface of first base plate, second base plate, third base plate, fourth base plate upper portion is provided with the location fixture block, the position of location fixture block corresponds from top to bottom with the position of location draw-in groove, and size looks adaptation.

As a technical scheme of the utility model, the upper surfaces of the first substrate, the second substrate and the third substrate, which are provided with the positioning clamping grooves, are provided with the imprinting grooves.

As a technical scheme of the utility model, the number of the imprinting grooves is four, and the four imprinting grooves are sequentially and obliquely arranged from top to bottom.

As a technical scheme of the utility model, through holes are formed in four corners of the first substrate, the second substrate, the third substrate and the fourth substrate, and through holes are formed in the first substrate, the second substrate, the third substrate and the fourth substrate.

As a technical scheme of the utility model, the first substrate, the second substrate, the third substrate and the fourth substrate are connected through pure glue.

Compared with the prior art, the utility model has the following beneficial effects: 1. according to the utility model, the positioning clamping groove at the lower part of the third substrate corresponds to the positioning clamping block on the fourth substrate, the positioning clamping block enters the positioning clamping groove, and the third substrate and the fourth substrate are limited to correspond to each other, so that the deviation cannot occur.

2. According to the utility model, the serial numbers are arranged in the imprinting grooves in an etching mode, so that the ordering and the installation can be better performed, the plurality of imprinting grooves are obliquely arranged, and when the serial numbers are smaller, the installation position of the substrate can be judged through the positions of the imprinting grooves, and the problem of stacking errors of the multilayer plates can be reduced.

Drawings

FIG. 1 is a schematic view of the overall disassembly of the present utility model.

Fig. 2 is a schematic overall installation of the present utility model.

FIG. 3 is an enlarged schematic view of section A of the present utility model.

Fig. 4 is a schematic overall side view of the present utility model.

In the figure:

1. a first substrate; 2. a second substrate; 3. a third substrate; 4. a fourth substrate; 5. a through hole; 6. a via hole; 7. positioning clamping grooves; 8. positioning a clamping block; 9. and a imprinting groove.

Detailed Description

Embodiments of the present utility model are described in further detail below with reference to the accompanying drawings and examples. The following examples are illustrative of the utility model but are not intended to limit the scope of the utility model.

As shown in fig. 1-4, the utility model provides a novel FPC multilayer board, which comprises a first substrate 1, a second substrate 2, a third substrate 3 and a fourth substrate 4, wherein the first substrate 1, the second substrate 2, the third substrate 3 and the fourth substrate 4 form a multilayer board, positioning clamping grooves 7 are formed in the lower surfaces of the first substrate 1, the second substrate 2 and the third substrate 3, positioning clamping blocks 8 are formed in the upper parts of the second substrate 2, the third substrate 3 and the fourth substrate 4, the positions of the positioning clamping blocks 8 are vertically corresponding to the positions of the positioning clamping grooves 7, the positions of the positioning clamping blocks 8 are matched in size, the positioning clamping grooves 7 in the lower part of the third substrate 3 are corresponding to the positions of the positioning clamping blocks 8 in the fourth substrate 4, the positioning clamping blocks 8 enter the positioning clamping grooves 7, and the third substrate 3 and the fourth substrate 4 are limited, so that the positioning clamping blocks are mutually corresponding and do not deviate.

As an embodiment of the present utility model, the upper surfaces of the first substrate 1, the second substrate 2, and the third substrate 3, on which the positioning card grooves 7 are formed, are provided with the imprint grooves 9.

In one embodiment of the present utility model, the number of the plurality of stamping grooves 9 is four, the four stamping grooves 9 are arranged obliquely from top to bottom in sequence, when a plurality of substrates are arranged, the plurality of stamping grooves 9 are arranged obliquely, and when the serial number is smaller, the mounting positions of the substrates can be judged by the positions of the stamping grooves 9, so that the problem of stacking errors of the multilayer boards can be reduced.

As an embodiment of the present utility model, through holes 5 are formed at four corners of the first substrate 1, the second substrate 2, the third substrate 3, and the fourth substrate 4, and through holes 6 are formed in each of the first substrate 1, the second substrate 2, the third substrate 3, and the fourth substrate 4.

As an embodiment of the present utility model, the first substrate 1, the second substrate 2, the third substrate 3, and the fourth substrate 4 are connected by a pure glue.

The specific working principle is as follows:

in the actual production process, the fourth substrate 4 is firstly placed at the bottom, then the third substrate 3 is arranged at the upper part of the fourth substrate through pure glue, the positioning clamping groove 7 at the lower part of the third substrate 3 corresponds to the positioning clamping block 8 on the fourth substrate 4 in position, the positioning clamping block 8 enters the positioning clamping groove 7, the third substrate 3 and the fourth substrate 4 are limited to correspond to each other, no deviation occurs, and the second substrate 2 and the first substrate 1 can be arranged through the steps;

the imprinting groove 9 can be internally provided with a serial number in an etching mode, when a plurality of substrates are arranged, the substrates can be better arranged in sequence, the imprinting groove 9 is obliquely arranged, when the serial number is smaller, the mounting position of the substrates can be judged through the position of the imprinting groove 9, and the problem of multilayer board lamination errors can be reduced.

The embodiments of the present utility model have been shown and described for the purpose of illustration and description, it being understood that the above embodiments are illustrative and not to be construed as limiting the utility model, and that variations, modifications, alternatives and variations may be made therein by one of ordinary skill in the art without departing from the scope of the utility model.

Claims

1. The utility model provides a novel FPC multiply wood, includes first base plate (1), second base plate (2), third base plate (3), fourth base plate (4), multiply wood, its characterized in that are constituteed to first base plate (1), second base plate (2), third base plate (3), fourth base plate (4): the positioning clamping grooves (7) are formed in the lower surfaces of the first substrate (1), the second substrate (2) and the third substrate (3), positioning clamping blocks (8) are arranged on the upper portions of the second substrate (2), the third substrate (3) and the fourth substrate (4), and the positions of the positioning clamping blocks (8) and the positions of the positioning clamping grooves (7) are vertically corresponding and are matched in size.

2. The novel FPC multilayer board according to claim 1, wherein: the lower surfaces of the first substrate (1), the second substrate (2) and the third substrate (3) are provided with positioning clamping grooves (7), and the upper surfaces of the positioning clamping grooves are provided with imprinting grooves (9).

3. The novel FPC multilayer board according to claim 2, wherein: the number of the imprinting grooves (9) is four, and the four imprinting grooves (9) are sequentially and obliquely arranged from top to bottom.

4. The novel FPC multilayer board according to claim 1, wherein: through holes (5) are formed in four corners of the first substrate (1), the second substrate (2), the third substrate (3) and the fourth substrate (4), and through holes (6) are formed in the first substrate (1), the second substrate (2), the third substrate (3) and the fourth substrate (4).

5. The novel FPC multilayer board according to claim 1, wherein: the first substrate (1), the second substrate (2), the third substrate (3) and the fourth substrate (4) are connected through pure glue.