CN103260350B - Blind buried via hole plate compression method - Google Patents
Blind buried via hole plate compression method Download PDFInfo
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- CN103260350B CN103260350B CN201310165892.6A CN201310165892A CN103260350B CN 103260350 B CN103260350 B CN 103260350B CN 201310165892 A CN201310165892 A CN 201310165892A CN 103260350 B CN103260350 B CN 103260350B
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Abstract
The compression method of a kind of blind buried via hole plate of disclosure.This blind buried via hole plate compression method comprises the steps: to stack gradually after carrying out first time pressing the first Copper Foil, the first prepreg, first line plate, the second prepreg, the second wiring board, the 3rd prepreg, the second Copper Foil, carry out holing, hole metallization processes and carries out respectively on the first Copper Foil and the second Copper Foil circuit making, forms first substrate；The second substrate of tool single layer of conductive circuit is provided；First substrate, the 4th prepreg, second substrate, the 5th prepreg, the 3rd Copper Foil are stacked gradually and carry out second time pressing, obtains multi-layer sheet；Multi-layer sheet is holed, hole metallization processes and makes in the 3rd enterprising row line of Copper Foil, forms blind buried via hole plate.The compression method of the blind buried via hole plate of the present invention effectively improves blind buried via hole plate hot pressing and the problem that bigger angularity brings product bad occurs.
Description
Technical field
The present invention relates to multiple-plate process technology, be specifically related to blind buried via hole plate compression method.
Background technology
In printed circuit board industry, blind buried via hole plate utilizes metallized processing procedure in boring and hole to make to realize between each sandwich circuit being electrically connected, for conventional Multi-layer circuit board structure.When carrying out the pressing of the blind buried via hole plate of a kind of multilamellar, first time pressing is carried out firstly the need of two double-sided wiring boards, then carry out holing, hole metallization processes and Double-side line makes and forms first substrate, finally again first substrate and the 3rd double-sided wiring board is carried out pressing for the second time.During due to second time pressing, all there is certain difference in the thickness of two boards, copper content and conductive pattern, so in the bonding processes adding hot adhesion, two plates produced thermal stress difference of being heated is bigger, after hot pressing, thermal stress cannot discharge completely, cause that product occurs bigger angularity after hot-pressing, thus have impact on the accuracy of product attachment.
Summary of the invention
For solving above-mentioned technical problem, the invention provides the compression method of a kind of blind buried via hole plate being effectively improved the angularity after blind buried via hole plate hot pressing.
The compression method of a kind of blind buried via hole plate, it comprises the steps: to provide the first line plate having two-sided conducting wire and the second wiring board；First Copper Foil, the first prepreg, the second prepreg, the 3rd prepreg and the second Copper Foil are provided, and after described first Copper Foil, described first prepreg, described first line plate, described second prepreg, described second wiring board, described 3rd prepreg and described second Copper Foil stacked gradually carrying out first time pressing, carry out holing, hole metallization processes, on the first Copper Foil and the second Copper Foil, carry out circuit making simultaneously respectively, form first substrate；The second substrate of tool single layer of conductive circuit is provided；Described first substrate, the 4th prepreg, described second substrate, the 5th prepreg, the 3rd Copper Foil being stacked gradually and carry out second time pressing, obtain multi-layer sheet, described second substrate line layer is against described 4th prepreg；Described multi-layer sheet is holed, hole metallization processes and makes in the 3rd enterprising row line of Copper Foil, forms blind buried via hole plate.
Improvement as the compression method of above-mentioned blind buried via hole plate, it is provided that include the first central layer of two-sided layers of copper, carries out circuit making in the two-sided layers of copper of described first central layer respectively, forms described first line plate；The second central layer including two-sided layers of copper is provided, the two-sided layers of copper of described second central layer carries out circuit making respectively, forms described second wiring board.
Improvement as the compression method of above-mentioned blind buried via hole plate, it is provided that include the 3rd piece of central layer of two-sided layers of copper, and etch away the one side layers of copper of described 3rd piece of central layer, carry out circuit making in another side layers of copper, form the described second substrate of tool single layer of conductive circuit.
As the improvement of the compression method of above-mentioned blind buried via hole plate, described hole metallization processes and includes hole wall process, electroless copper plating and the thickening of electrodeposit copper.
As the improvement of the compression method of above-mentioned blind buried via hole plate, described circuit makes and includes exposure, development, etching.
The invention has the beneficial effects as follows: the 3rd double-sided wiring board used when the present invention is by carrying out second time pressing original method changes to the second substrate having single layer of conductive circuit and adds the structure of prepreg and Copper Foil, originally in the process of heating, thermal stress is there is in the prepreg owing to being newly added with Copper Foil, the thermal stress that both hot pressings are produced serves the effect of balance, angularity after product hot pressing is improved, thus improving the accuracy of product attachment.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in the embodiment of the present invention, below the accompanying drawing used required during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings, wherein:
Fig. 1 is the side sectional view of the present invention blind buried via hole a kind of preferred embodiment of plate.
Fig. 2 is the compression method schematic flow sheet of blind buried via hole plate shown in Fig. 1.
Fig. 3 is the side structure schematic diagram of the central layer in Fig. 2 compression method.
Fig. 4 is the side sectional view of method bonding processes shown in Fig. 2.
Detailed description of the invention
Technical scheme in the embodiment of the present invention will be clearly and completely described below, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
Refer to Fig. 1, for the side sectional view of the present invention blind buried via hole a kind of preferred embodiment of plate.Described blind buried via hole plate 1 includes the be superimposed with each other first substrate 11, second substrate 13 and the first line layer 15 that arrange.Described second substrate 13 is located between described first substrate 11 and described first line layer 15.Described first substrate 11 and described second substrate 13 are arranged by the first insulating barrier 12 interval.Arranged by described second insulating barrier 14 interval between described second substrate 13 and described first line layer 15.
What described first substrate 11 included being cascading the second line layer the 111, the 3rd insulating barrier 112, first line plate the 113, the 4th insulating barrier the 114, second wiring board the 115, the 5th insulating barrier 116 and tertiary circuit layer 117.In the present embodiment, described first insulating barrier the 12, second insulating barrier the 14, the 3rd insulating barrier 112, described 4th insulating barrier 114 and described 5th insulating barrier 14 are prepregs.Described first substrate 11 is formed the first via 16 and the second via 17, described first via 16 runs through the two-sided conducting wire (sign) of described second line layer 111 and described first line plate 113 surface penetrated to described second wiring board 115；Described second via 17 runs through described tertiary circuit layer 117 and the two-sided conducting wire (sign) of described second wiring board 115.Being also formed with the 3rd via 18 on described blind buried via hole plate 1, it runs through described second substrate 13, and penetrates to described first substrate 11 surface.Wherein, the first via 16 and the 3rd via 18 are blind hole, and the second via 17 is buried via hole.
Please also refer to Fig. 2 and Fig. 4, wherein, Fig. 2 is the compression method schematic flow sheet of blind buried via hole plate shown in Fig. 1, and Fig. 4 is the side sectional view of method bonding processes shown in Fig. 2.The compression method of the blind buried via hole plate of the present invention, comprises the following specific steps that:
Step S1, it is provided that have first line plate and second wiring board of two-sided conducting wire.
There is provided one piece of central layer, as it is shown on figure 3, described central layer includes layers of copper 21, insulating barrier 22 and following layers of copper 23 above.The enterprising row line of layers of copper 21 above is made, specifically by exposure, development, 3 processing steps of etching, layers of copper 21 forms the line pattern of needs herein above, in like manner, following layers of copper 23 is carried out circuit making, eventually forms the described first line plate 113 having two-sided conducting wire.
There is provided second piece of central layer, as it is shown on figure 3, described second piece of central layer includes layers of copper 21, insulating barrier 22 and following layers of copper 23 above equally.Same, respectively the above layers of copper 21 of described second piece of central layer and following layers of copper 23 are carried out circuit making, eventually form described second wiring board 115 having two-sided conducting wire.
Step S2, first Copper Foil, the first prepreg, the second prepreg, the 3rd prepreg and the second Copper Foil are provided, and after described first Copper Foil, described first prepreg, described first line plate, described second prepreg, described second wiring board, described 3rd prepreg and described second Copper Foil stacked gradually carrying out first time pressing, carry out holing, hole metallization processes, on the first Copper Foil and the second Copper Foil, carry out circuit making simultaneously respectively, form first substrate.
Refer to Fig. 4, a-quadrant includes first Copper Foil the 111, first prepreg 112, described first line plate the 113, second cured sheets 114, described second wiring board the 115, the 3rd prepreg 116 and the second Copper Foil 117, they are stacked gradually, and the mode again through hot pressing carries out pressing.First prepreg, the second prepreg, the 3rd prepreg are after the pressurized that is heated, and the line pattern in described first line plate 113 and described second wiring board 115 is filled with by the resin producing flowing, and plays the effect of insulation protection.After hot pressing, carrying out circuit making respectively on the first Copper Foil 111 and the second Copper Foil 117, Making programme, with reference to step S1, forms the second line layer 111 shown in Fig. 1 and tertiary circuit layer 117.For realizing in the described first substrate 11 that a-quadrant is formed the conducting between each layer, by the mode of machine drilling, described first substrate 11 need to be carried out Drilling operation and hole metallization processes, wherein hole metallization processes and includes: hole wall process, electroless copper plating and electrodeposit copper thicken, and eventually form first via the 16, second via 17 shown in Fig. 1.
Step S3, it is provided that the second substrate of tool single layer of conductive circuit.
There is provided the 3rd piece of central layer, as it is shown on figure 3, described 3rd piece of central layer includes layers of copper 21, insulating barrier 22 and following layers of copper 23 above equally.Layers of copper 23 below described 3rd piece of central layer is fully etched, with step 1 the difference is that the above layers of copper 21 of described 3rd piece of central layer is only carried out circuit making by, this step, finally has a described second substrate 13 of single layer of conductive circuit.
Step S4, stacks gradually carry out second time pressing by described first substrate, the 4th prepreg, described second substrate, the 5th prepreg, the 3rd Copper Foil, obtain multi-layer sheet, and described second substrate line layer is against described 4th prepreg.
Refer to Fig. 4, described first substrate the 11, the 4th prepreg 12, described second substrate the 13, the 5th prepreg the 14, the 3rd Copper Foil 15 that are formed through first time pressing a-quadrant stack gradually, and carry out second time pressing by the mode of hot pressing, obtain multi-layer sheet.Wherein, described second substrate 13 line layer is against described 4th prepreg 12.
Step S5, holes to described multi-layer sheet, hole metallization processes and makes in the 3rd enterprising row line of Copper Foil, forms blind buried via hole plate.
Specifically, according to designing requirement, by described multi-layer sheet is holed, hole metallization process, obtain the 3rd via 18 shown in Fig. 1 and make in the 3rd enterprising row line of Copper Foil 15, form the first line layer 15 shown in Fig. 1, thus the conducting realized in described multi-layer sheet between each layer, eventually form the described blind buried via hole plate 1 shown in Fig. 1.
The compression method of the blind buried via hole plate of the present embodiment, as shown in Figure 4, owing to the 3rd double-sided wiring board used when carrying out second time pressing in original method, changing the described second substrate 13 in present B region and the structure of the 5th prepreg the 14, the 3rd Copper Foil 15 into.Formed owing to the described second substrate 13 in B region is carried out the making of one side circuit by one side cupric central layer, although so being newly added the 5th prepreg 14 and the 3rd Copper Foil 15 during blind buried via hole plate pressing in this method, but last overall pressing thickness with former methodical compared with change little, the final thickness of blind buried via hole plate is affected little.Again owing to A, B region is served the effect of balance by the 5th prepreg 14 being newly added and the 3rd Copper Foil 15 in the thermal stress that hot pressing produces, this is because there is thermal stress in the process of heating in the 5th prepreg 14 and the 3rd Copper Foil 15, a-quadrant is served the effect that an opposite direction is pullled by it, reduce the interregional thermal stress difference of A, B, thus effectively improving blind buried via hole plate hot pressing the problem that bigger angularity brings product bad occurs.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every equivalent structure utilizing description of the present invention to make or equivalence flow process conversion; or directly or indirectly it is used in other relevant technical field, all in like manner include in the scope of patent protection of the present invention.
Claims (5)
1. a compression method for blind buried via hole plate, it comprises the steps:
The first line plate and the second wiring board that have two-sided conducting wire are provided；
First Copper Foil, the first prepreg, the second prepreg, the 3rd prepreg and the second Copper Foil are provided, and after described first Copper Foil, described first prepreg, described first line plate, described second prepreg, described second wiring board, described 3rd prepreg and described second Copper Foil stacked gradually carrying out first time pressing, carry out holing, hole metallization processes, on the first Copper Foil and the second Copper Foil, carry out circuit making simultaneously respectively, form first substrate；
The second substrate of tool single layer of conductive circuit is provided；
Described first substrate, the 4th prepreg, described second substrate, the 5th prepreg, the 3rd Copper Foil being stacked gradually and carry out second time pressing, obtain multi-layer sheet, described second substrate line layer is against described 4th prepreg；
Described multi-layer sheet is holed, hole metallization processes and makes in the 3rd enterprising row line of Copper Foil, forms blind buried via hole plate.
2. the compression method of blind buried via hole plate as claimed in claim 1, it is characterised in that the first central layer including two-sided layers of copper is provided, carries out circuit making in the two-sided layers of copper of described first central layer respectively, form described first line plate；The second central layer including two-sided layers of copper is provided, the two-sided layers of copper of described second central layer carries out circuit making respectively, forms described second wiring board.
3. the compression method of blind buried via hole plate as claimed in claim 1, it is characterized in that, it is provided that include the 3rd piece of central layer of two-sided layers of copper, and etch away the one side layers of copper of described 3rd piece of central layer, carry out circuit making in another side layers of copper, form the described second substrate of tool single layer of conductive circuit.
4. the compression method of blind buried via hole plate as claimed in claim 1, it is characterised in that described hole metallization processes and includes hole wall process, electroless copper plating and the thickening of electrodeposit copper.
5. the compression method of the blind buried via hole plate as described in claim 1 or 2 or 3, it is characterised in that described circuit makes and includes exposure, development, etching.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310165892.6A CN103260350B (en) | 2013-05-07 | 2013-05-07 | Blind buried via hole plate compression method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310165892.6A CN103260350B (en) | 2013-05-07 | 2013-05-07 | Blind buried via hole plate compression method |
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| CN103260350A CN103260350A (en) | 2013-08-21 |
| CN103260350B true CN103260350B (en) | 2016-07-06 |
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| CN201310165892.6A Active CN103260350B (en) | 2013-05-07 | 2013-05-07 | Blind buried via hole plate compression method |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104754870A (en) * | 2013-12-31 | 2015-07-01 | 昆山意力电路世界有限公司 | HDI high-density composite circuit board structure |
| CN104902697A (en) * | 2014-03-05 | 2015-09-09 | 深南电路有限公司 | A manufacturing method for metalized blind holes and a circuit board having the metalized blind holes |
| CN111785507B (en) * | 2020-08-03 | 2024-05-10 | 湖南维胜科技电路板有限公司 | Planar transformer coil plate and manufacturing method thereof |
| CN111901986A (en) * | 2020-08-17 | 2020-11-06 | 龙岩金时裕电子有限公司 | Manufacturing method of high-density interconnection PCB |
| CN112291951A (en) * | 2020-11-10 | 2021-01-29 | 深圳市昶东鑫线路板有限公司 | Blind buried hole circuit board processing technology |
| CN114980573A (en) * | 2021-02-25 | 2022-08-30 | 深南电路股份有限公司 | Manufacturing method of circuit board, circuit board and electronic device |
| CN113286452B (en) * | 2021-04-01 | 2023-05-23 | 珠海精路电子有限公司 | Manufacturing process of heat conducting circuit board |
| CN114430614A (en) * | 2022-01-28 | 2022-05-03 | 珠海方正科技多层电路板有限公司 | Circuit board and manufacturing method thereof |
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| CN103260350A (en) | 2013-08-21 |
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