CN211063845U - Mechanical blind hole HDI circuit board - Google Patents
Mechanical blind hole HDI circuit board Download PDFInfo
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- CN211063845U CN211063845U CN201921529722.0U CN201921529722U CN211063845U CN 211063845 U CN211063845 U CN 211063845U CN 201921529722 U CN201921529722 U CN 201921529722U CN 211063845 U CN211063845 U CN 211063845U
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Abstract
The utility model provides a machinery blind hole HDI circuit board, its includes from the top down last daughter board, contain resin dielectric layer and the daughter board down that sets gradually, goes up daughter board, dielectric layer and daughter board down and passes through high temperature high pressure pressfitting together to realize that the electrical property switches on through mechanical drilling and electroplating. The upper daughter board and the lower daughter board are respectively formed by pressing a plurality of copper-clad plates, dielectric layers and copper foils, each conducting layer of the upper daughter board and the lower daughter board is electrically conducted through mechanical drilling of through holes and electroplating, and solder-resisting insulating layers are arranged on the upper surface of the upper daughter board and the lower surface of the lower daughter board. The utility model discloses an go up the daughter board and recompress as an organic whole after respectively drilling, electroplating and the circuit processing, for pressfitting and laser drilling processing preparation many times of conventional lamination high density, when satisfying high density, heavy current requirement, reduced expensive laser drilling machine's use, reduced the pressfitting number of times, guaranteed product reliability, reduced manufacturing cost.
Description
Technical Field
The utility model relates to a circuit board especially relates to a mechanical blind hole HDI circuit board.
Background
With the continuous development of electronic technology, especially the wide and deep application of large-scale and super-large-scale integrated circuits, the multilayer printed circuit board is rapidly developing towards high precision, high reliability, high speed transmission, high layer count, light weight and thin type, and the technologies of micro-fine lines, small space, small aperture penetration, blind hole burying, high board thickness aperture ratio and the like are appeared to meet the market demand.
HDI is English abbreviation of High sensitivity interconnect, is a High-Density interconnection circuit board, and has the typical characteristics of blind holes, smaller line width and smaller aperture. HDI boards are generally manufactured by Build-up (Build-up) methods, and the more times a board is built up, the higher the technology level of the board. The common HDI board is basically laminated for 1 time, the high-order HDI board adopts the lamination technology for 2 times or more, and simultaneously adopts advanced PCB technologies such as hole stacking, electroplating hole filling, laser direct drilling and the like.
However, the lamination method requires the use of an expensive laser drilling machine, requires a higher hole filling technique by electroplating, increases the number of times of pressing, and makes it more difficult to ensure the reliability of the product. In addition, in the field of industrial control and automobiles, on one hand, the requirement of improving the wiring density is required, and on the other hand, the laser blind holes are difficult to meet the requirement due to the large conduction current. Therefore, an HDI circuit board capable of meeting the requirements of high density and large current at the same time is needed.
SUMMERY OF THE UTILITY MODEL
The utility model aims to solve the technical problem that overcome not enough in the prior art, provide a mechanical blind hole HDI circuit board, when realizing the high density interconnection, reduced expensive laser drilling machine's use, reduced the pressfitting number of times, guaranteed the reliability.
The utility model provides a mechanical blind hole HDI circuit board which characterized in that: the copper clad laminate comprises an upper insulating layer, an upper sub-board, a main medium layer, a lower sub-board and a lower insulating layer which are sequentially arranged from top to bottom, wherein the upper sub-board and the lower sub-board respectively comprise a copper clad laminate, medium layers arranged on two sides of the copper clad laminate and copper foils arranged on the outer sides of the two medium layers, and the main medium layer is arranged between the two copper foils of the upper sub-board and the lower sub-board; the copper-clad plate comprises a sub-dielectric layer and copper layers arranged on two sides of the sub-dielectric layer, through holes are formed in the upper sub-plate and the lower sub-plate, connecting copper layers are arranged on the inner side walls of the through holes, and the connecting copper layers are connected with two copper foils on the outer side of the dielectric layer and the copper layers on two sides of the sub-dielectric layer; in addition, the circuit board is also provided with a main hole, and the main hole sequentially penetrates through the upper sub-board, the main medium layer and the lower sub-board from top to bottom; and a side wall copper layer is also arranged on the inner side wall of the main hole, and the side wall copper layer is connected with the two copper foils and the two copper layers on the upper sub-board and the lower sub-board.
Furthermore, a filling core is arranged in each through hole of the upper sub-board and the lower sub-board, and the filling core fills more than 80% of the depth of the through holes.
Furthermore, the material of the filling core is resin.
To sum up, the utility model discloses a recompress as an organic whole after respectively carrying out drilling, electroplating, circuit processing on last daughter board and lower daughter board, send out pressfitting and laser drilling processing preparation many times for conventional lamination, when satisfying high density, heavy current requirement, reduced the use of expensive laser drilling machine, reduced the pressfitting number of times, guaranteed product reliability, reduced manufacturing cost; the practicability is strong, and the popularization significance is strong.
Drawings
Figure 1 is the utility model relates to a mechanical blind hole HDI circuit board's schematic structure.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments.
As shown in FIG. 1, the utility model provides a mechanical blind hole HDI circuit board, mechanical blind hole HDI circuit board includes from the top down last daughter board 10 that sets gradually, contains resin dielectric layer 20 and daughter board 30 down.
The upper sub-board 10 comprises an upper copper plate 14, a first dielectric layer 13, a second dielectric layer 15, a first copper foil 12 and a second copper foil 16, wherein the first dielectric layer 13 and the second dielectric layer 15 are respectively arranged on two sides of the copper-clad plate 14, and the first copper foil 12 and the second copper foil 16 are respectively arranged on the outer sides of the first dielectric layer 13 and the second dielectric layer. The copper-clad plate 14 comprises an upper dielectric layer 14b, and a first copper layer 14a and a second copper layer 14c which are arranged on two sides of the upper dielectric layer 14 b.
The upper sub-board 10 is drilled with a through hole 40 through a mechanical drilling machine, a first connecting copper layer 41 is attached to the surface of the through hole 40 after an electroplating process, and the first connecting copper layer 41 is connected with the first copper foil 12, the first copper layer 14a, the second copper layer 14c and the second copper foil 16 from top to bottom, so that electrical performance conduction is realized. In products with high current requirements, the special thickness requirements of the connecting copper layer 41 can be achieved by changing the electroplating solution composition and the processing parameters.
The lower sub-board 30 comprises a lower copper-clad plate 34, a third dielectric layer 33, a fourth dielectric layer 35, a third copper foil 32 and a fourth copper foil 36, wherein the third dielectric layer 33 and the fourth dielectric layer 35 are respectively arranged on the upper side and the lower side of the lower copper-clad plate 34, and the third copper foil 32 and the fourth copper foil 36 are respectively arranged on the outer sides of the third dielectric layer 33 and the fourth dielectric layer 35. The lower copper clad laminate 34 comprises a lower dielectric layer 34b, and a third copper layer 34a and a fourth copper layer 34c which are arranged on the upper side and the lower side of the lower dielectric layer 34 b.
The lower sub-board 30 is drilled with a through hole 50 which is arranged in a staggered manner with the through hole 40 on the upper sub-board 30 through a mechanical drilling machine, a second connecting copper layer 51 is attached to the surface of the through hole 50 after the electroplating process, and the second connecting copper layer 51 is connected with the third copper foil 32, the third copper layer 34a, the fourth copper layer 34c and the fourth copper foil 36 from top to bottom, so that electrical performance conduction is realized. In products with high current requirements, the special thickness requirement of the metal copper layer can be realized by changing the components of electroplating solution and processing parameters.
In a high-temperature and high-pressure press, the upper sub-board 10, the dielectric layer 20 and the lower sub-board 30 are tightly combined together, and after the upper sub-board and the lower sub-board are pressed, the through holes (40 and 50) on the upper sub-board and the lower sub-board are changed into mechanical blind holes. And the resin in the high-gel-content dielectric layer can flow and fill into the mechanical blind hole to realize hole plugging of the mechanical blind hole, and the hole plugging depth reaches more than 80%. And then, drilling a through hole 60 by a mechanical drilling machine, wherein a layer of copper is attached to the through hole 60 after the through hole 60 is processed by an electroplating process, so that the electrical conduction of each layer of circuit of the upper sub-board 10 and the lower sub-board 30 is realized. After the processes of pressing, drilling, electroplating and wiring are completed, a solder resist insulating layer 11 is coated on the upper surface of the upper sub-board 10, and a solder resist insulating layer 31 is coated on the lower surface of the lower sub-board 30. In this embodiment, the electroplating step includes two sub-steps, which are hole conduction and copper electroplating, respectively, in which the hole conduction sub-step attaches a layer of conductive material to the hole wall of the mechanically drilled through hole, and the copper electroplating sub-step attaches a layer of copper to the surface of the conductive material on the hole wall.
To sum up, the utility model respectively carries out the drilling, the electroplating and the line processing on the upper sub-board 10 and the lower sub-board 30, and then presses and combines into a whole, compared with the conventional lamination, the multi-time pressing and the laser drilling processing are carried out, thereby meeting the requirements of high density and heavy current, reducing the use of expensive laser drilling machines, reducing the pressing times, ensuring the product reliability and reducing the production cost; the practicability is strong, and the popularization significance is strong.
The above-mentioned embodiments only represent one embodiment of the present invention, and the description is more specific and detailed, but not understood as the limitation of the scope of the invention, it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several modifications and improvements can be made, which all belong to the protection scope of the present invention, therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (3)
1. The utility model provides a mechanical blind hole HDI circuit board which characterized in that: the copper clad laminate comprises an upper insulating layer, an upper sub-board, a main medium layer, a lower sub-board and a lower insulating layer which are sequentially arranged from top to bottom, wherein the upper sub-board and the lower sub-board respectively comprise a copper clad laminate, medium layers arranged on two sides of the copper clad laminate and copper foils arranged on the outer sides of the two medium layers, and the main medium layer is arranged between the two copper foils of the upper sub-board and the lower sub-board; the copper-clad plate comprises a sub-dielectric layer and copper layers arranged on two sides of the sub-dielectric layer, through holes are formed in the upper sub-plate and the lower sub-plate, connecting copper layers are arranged on the inner side walls of the through holes, and the connecting copper layers are connected with two copper foils on the outer side of the dielectric layer and the copper layers on two sides of the sub-dielectric layer; in addition, the circuit board is also provided with a main hole, and the main hole sequentially penetrates through the upper sub-board, the main medium layer and the lower sub-board from top to bottom; and a side wall copper layer is also arranged on the inner side wall of the main hole, and the side wall copper layer is connected with the two copper foils and the two copper layers on the upper sub-board and the lower sub-board.
2. The mechanical blind hole HDI circuit board of claim 1, wherein: and the through holes of the upper sub-board and the lower sub-board are internally provided with a filling core, and the filling core fills more than 80% of the depth of the through holes.
3. The mechanical blind hole HDI circuit board of claim 2, wherein: the material of the filling core is resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921529722.0U CN211063845U (en) | 2019-09-12 | 2019-09-12 | Mechanical blind hole HDI circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921529722.0U CN211063845U (en) | 2019-09-12 | 2019-09-12 | Mechanical blind hole HDI circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211063845U true CN211063845U (en) | 2020-07-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921529722.0U Active CN211063845U (en) | 2019-09-12 | 2019-09-12 | Mechanical blind hole HDI circuit board |
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| Country | Link |
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| CN (1) | CN211063845U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112291951A (en) * | 2020-11-10 | 2021-01-29 | 深圳市昶东鑫线路板有限公司 | Blind buried hole circuit board processing technology |
| CN114126221A (en) * | 2020-08-26 | 2022-03-01 | 深南电路股份有限公司 | Printed circuit board and rapid processing method and system for multi-layer board structure |
-
2019
- 2019-09-12 CN CN201921529722.0U patent/CN211063845U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114126221A (en) * | 2020-08-26 | 2022-03-01 | 深南电路股份有限公司 | Printed circuit board and rapid processing method and system for multi-layer board structure |
| CN112291951A (en) * | 2020-11-10 | 2021-01-29 | 深圳市昶东鑫线路板有限公司 | Blind buried hole circuit board processing technology |
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Address after: No. 281, Jingjiu Avenue, Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province 343100 Patentee after: Jiangxi hongban Technology Co.,Ltd. Address before: 343100 national Jinggangshan economic and Technological Development Zone, Ji'an City, Jiangxi Province Patentee before: RED BOARD (JIANGXI) Co.,Ltd. |