CN217691158U - Package substrate, integrated module, and electronic device - Google Patents

Abstract

The utility model discloses an encapsulation base plate, integrated module and electronic equipment, including metal substrate, viscidity filler material, first metal circuit and second metal circuit, metal substrate has relative first face and second face, metal substrate is provided with at least one first through-hole, the through-hole runs through in metal substrate's first face and second face, viscidity filler material cladding is at metal substrate's first face and second face, and pack in first through-hole, viscidity filler material forms the viscidity filling layer, the viscidity filling layer has relative first face and second face, first metal circuit covers the first face at the viscidity filling layer, second metal circuit covers the second face at the viscidity filling layer, connect through first via hole between second metal circuit and the first metal circuit, first via hole is located in the first through-hole and runs through in the viscidity filling layer. The metal base material is used as the core layer, so that the rigidity and the strength of the packaging substrate can be improved, and the rigidity and the strength can be improved without increasing the thickness of the core layer.

Description

Package substrate, integrated module, and electronic device

Technical Field

The utility model relates to a semiconductor package technical field, in particular to packaging substrate, integrated module and electronic equipment.

Background

Copper clad laminates are mainly used as core layers in semiconductor packages, and the core layers are usually processed using a Tenting process (masking method). As the copper-clad plate serving as the core layer is weak in rigidity and strength, the warping phenomenon can occur in the processing process, and the product yield is reduced. Along with the increase of the chip area, the thickness of the core layer needs to be increased to improve the rigidity strength of the core layer, the depth of the mechanical hole is increased due to the increase of the thickness of the core layer, and the mechanical hole needs to be subjected to hole filling processing in the processing process, and the hole filling processing has certain requirements on the aspect ratio of the mechanical hole, so that the increase of the depth of the mechanical hole can cause the increase of the aperture of the mechanical hole, and the density of circuit wiring is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a packaging substrate, integrated module and electronic equipment can improve rigidity intensity.

In one aspect, an embodiment of the present invention provides a package substrate, including a metal substrate having a first surface and a second surface opposite to each other, the metal substrate being provided with at least one first through hole, the through hole penetrating through the first surface and the second surface of the metal substrate; the adhesive filling material is coated on the first surface and the second surface of the metal base material and is filled in the first through hole, the adhesive filling material forms an adhesive filling layer, and the adhesive filling layer is provided with a first surface and a second surface which are opposite; the first metal circuit covers the first surface of the viscous filling layer; the second metal circuit covers the second surface of the viscous filling layer, the second metal circuit is connected with the first metal circuit through a first via hole, and the first via hole is located in the first via hole and penetrates through the viscous filling layer.

According to some embodiments of the present invention, the package substrate further includes an insulating dielectric material, the insulating dielectric material is wrapped in the first metal line and the second metal line, and is filled in the first via hole.

According to some embodiments of the present invention, the insulating dielectric material forms an insulating dielectric layer, the insulating dielectric layer has relative first face and second face, the first face of insulating dielectric layer is provided with the third metal wiring, the third metal wiring pass through the second via hole with first metal wiring is connected.

According to the utility model discloses a some embodiments, insulating medium layer's second face is provided with fourth metallic line, fourth metallic line pass through the third via with second metallic line connects.

According to some embodiments of the invention, the metal substrate is a copper substrate, an aluminum substrate or an iron substrate.

According to some embodiments of the invention, the viscous filling material is a PP resin material or a photosensitive PID material.

On the other hand, the embodiment of the present invention provides an integrated module, which includes the above-mentioned package substrate.

In another aspect, an embodiment of the present invention provides an electronic device, including the above-mentioned integrated module.

The embodiment of the utility model provides a following beneficial effect has at least:

the embodiment of the utility model provides a use metal substrate as the core layer, be favorable to improving packaging substrate's rigidity intensity, need not to improve rigidity intensity through the thickness that increases the core layer.

Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic structural diagram of a metal substrate according to an embodiment of the present invention;

fig. 2 is one of the intermediate structural diagrams of the package substrate processing process according to the embodiment of the present invention;

fig. 3 is a second schematic diagram of an intermediate structure of a package substrate processing process according to an embodiment of the present invention;

fig. 4 is a third schematic view of an intermediate structure of the package substrate processing process according to the embodiment of the present invention;

fig. 5 is a fourth schematic diagram of the middle structure of the package substrate processing process according to the embodiment of the present invention;

fig. 6 is a fifth schematic view of an intermediate structure of a package substrate processing procedure according to an embodiment of the present invention;

fig. 7 is a sixth schematic view of an intermediate structure of a package substrate processing process according to an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.

In the description of the present invention, "a plurality" means one or more, and "a plurality" means two or more, and the terms "more than, less than, more than, etc. are understood as excluding the number, and the terms" more than "," below "," within ", etc. are understood as including the number. If the description of "first", "second", etc. is used for the purpose of distinguishing technical features, it is not intended to indicate or imply relative importance or to implicitly indicate the number of indicated technical features or to implicitly indicate the precedence of the indicated technical features.

In the description of the present invention, unless explicitly defined otherwise, the terms "set", "install", "connect", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention by combining the specific contents of the technical solutions.

Referring to fig. 1 and 5, the present embodiment discloses a package substrate, including a metal base 100, an adhesive filling material 200, a first metal line 310 and a second metal line 410, where the metal base 100 has a first surface and a second surface opposite to each other, the metal base 100 is provided with at least one first through hole 110, the through hole penetrates through the first surface and the second surface of the metal base 100, the adhesive filling material 200 covers the first surface and the second surface of the metal base 100 and fills in the first through hole 110, the adhesive filling material 200 forms an adhesive filling layer, the adhesive filling layer has a first surface and a second surface opposite to each other, the first metal line 310 covers the first surface of the adhesive filling layer, the second metal line 410 covers the second surface of the adhesive filling layer, the second metal line 410 and the first metal line 310 are connected by a first via hole 112, and the first via hole 112 is located in the first through hole 110 and penetrates through the adhesive filling layer.

In order to better understand the package substrate of the present embodiment, the following describes the beneficial effects of the present embodiment from the processing process of the package substrate with reference to fig. 1 to 7. The processing process of the packaging substrate comprises the following steps:

s100, referring to fig. 1, a metal substrate 100 is provided, wherein the metal substrate 100 is any one of a copper substrate, an aluminum substrate, or an iron substrate. The metal substrate 100 has good rigidity and strength, and the metal substrate 100 is used as a core layer for subsequent processing, so that the problem that the yield is reduced due to warping in the processing process of semi-finished products or finished products can be avoided. It should be noted that, compared with the conventional copper clad laminate, the metal substrate 100 has good rigidity strength, so that the rigidity strength is improved without increasing the thickness additionally, that is, the thickness of the metal substrate 100 is less than or equal to that of the copper clad laminate. In order to facilitate communication between metal lines of different subsequent layers, the metal base material 100 is provided with first through holes 110, the number of the first through holes 110 may be one or more, the metal base material 100 has a first surface and a second surface opposite to each other, and the first through holes 110 may be processed by mechanical drilling or chemical etching, so that the first through holes 110 penetrate through the first surface and the second surface of the metal base material 100.

S200, referring to fig. 1 and 2, processing an adhesive filling material 200 and a metal layer on the first surface and the second surface of the metal substrate 100. Specifically, the adhesive filling material 200 may be processed in a press-fit or coating manner, depending on the adhesive filling material 200. Illustratively, the adhesive filling material 200 of the present embodiment is a PP (pre preg ) resin material or a photosensitive PID (photosensitive dielectric) material, and the PID material and a copper foil are laminated on both sides of the metal substrate 100, and the PID material and the metal layer are processed on the first side and the second side of the metal substrate 100 by pressing, wherein after the pressing, the PID material covers the first side and the second side of the metal substrate 100 and is filled in the first through hole 110, so that the adhesive filling material 200 forms an adhesive filling layer having a first side and a second side opposite to each other, and the copper foil covers the first side and the second side of the adhesive filling layer to form the first metal layer 300 and the second metal layer 400. It should be noted that the PID material has low viscosity at normal temperature, which can provide a viscous foundation for the subsequent processing of the metal line, and in addition, the PID material can be photo-etched in an exposure and development manner, which is beneficial to processing a better first through hole 110.

S300, please refer to fig. 2, fig. 3 and fig. 4, the first via hole 112 is processed. Specifically, in order to achieve communication between the first metal layer 300 and the second metal layer 400, the first via hole 112 needs to be formed within the first through hole 110. Wherein the first sub via hole 111 may be drilled in the first via hole 110 by means of mechanical drilling. However, the mechanical drilling method has problems of burr and limited aperture size. Therefore, the windowing site corresponding to the first sub-via 111 can be etched on the first metal layer 300 and the second metal layer 400 according to production data, and since the viscous filling layer is processed by PID material, the viscous filling layer can be photo-etched by exposure and development, so as to process the first sub-via 111. It should be noted that the first sub-via 111 can have a more upright inner wall by photolithography, and flash can be reduced. After the first sub-through hole 111 is obtained by machining, a conductive layer is formed on the inner wall of the first sub-through hole 111 by means of full-sheet plating to form a first via hole 112. It is contemplated that the first via hole 112 has a smaller diameter than the first through hole 110, that is, a first space is provided between the inner wall of the first via hole 112 and the inner wall of the first through hole 110, and the region of the first space is filled with the adhesive filling material 200. The metal base material 100 serving as the core layer mainly plays a role of increasing the rigidity strength, and therefore, the aperture size of the first via hole 110 has less influence on the density of the wiring.

S400, referring to fig. 4 and 5, a first metal line 310 is processed on the first metal layer 300, and a second metal line 410 is processed on the second metal layer 400. Specifically, according to the production data, a first metal line 310 is processed on the first metal layer 300 by pattern transfer and pattern plating, a second metal line 410 is processed on the second metal layer 400, and the first metal line 310 and the second metal line 410 are connected through the first via hole 112.

S500, referring to fig. 6 and fig. 7, a build-up layer is processed on the first metal layer 300 and the second metal layer 400. Specifically, an insulating dielectric material 500, such as a prepreg, is laminated on the surfaces of the first metal layer 300 and the second metal layer 400. The laminated insulating dielectric material 500 covers the first metal line 310 and the second metal line 410, and fills the first via hole 112. That is, the package substrate further includes an insulating dielectric material 500, and the insulating dielectric material 500 covers the first metal line 310 and the second metal line 410 and fills the first via hole 112.

S600, referring to fig. 6 and 7, a via hole and a build-up circuit are processed on the first surface of the insulating dielectric layer. Specifically, after lamination and lamination, the insulating dielectric material 500 forms an insulating dielectric layer, the insulating dielectric layer has a first surface and a second surface opposite to each other, blind holes are processed on the first surface and the second surface of the insulating dielectric layer, the blind holes are electroplated to form a second via hole 611 and a third via hole 711, a third metal line 610 is formed on the first surface of the insulating dielectric layer, and a fourth metal line 710 is formed on the second surface of the insulating dielectric layer, that is, the first surface of the insulating dielectric layer is provided with the third metal line 610, and the third metal line 610 is connected with the first metal line 310 through the second via hole 611. The second surface of the insulating dielectric layer is provided with a fourth metal line 710, and the fourth metal line 710 is connected with the second metal line 410 through a third via hole 711. Of course, when laminating the insulating dielectric materials, the copper foils may be simultaneously pressed to form the third metal layer and the fourth metal layer, and the third metal line 610 and the fourth metal line 710 are processed by pattern transfer and pattern electroplating.

The embodiment provides an integrated module, which comprises the packaging substrate. It is to be understood that the contents of the above-mentioned package substrate embodiments are all applicable to the present integrated module embodiment, the functions implemented by the present integrated module embodiment are the same as those of the above-mentioned package substrate embodiment, and the advantages achieved by the present integrated module embodiment are also the same as those achieved by the above-mentioned package substrate embodiment. For avoiding repeated descriptions, reference may be made to the above-mentioned embodiment of the package substrate for the content not referred to in this embodiment of the integrated module.

The embodiment provides an electronic device, which comprises the integrated module. It is to be understood that the contents in the foregoing integrated module embodiments are all applicable to the present electronic device embodiment, the functions specifically implemented by the present electronic device embodiment are the same as those in the foregoing integrated module embodiment, and the advantageous effects achieved by the present electronic device embodiment are also the same as those achieved by the foregoing integrated module embodiment. For avoiding repeated descriptions, reference may be made to the above-mentioned embodiment of the integration module for the content not referred to in this embodiment of the electronic device.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.

Claims (8)

1. A package substrate, comprising:

the metal substrate (100) is provided with a first surface and a second surface which are opposite to each other, and the metal substrate (100) is provided with at least one first through hole (110) which penetrates through the first surface and the second surface of the metal substrate (100);

the viscous filling material (200) is coated on the first surface and the second surface of the metal base material (100) and is filled in the first through hole (110), the viscous filling material (200) forms a viscous filling layer, and the viscous filling layer is provided with a first surface and a second surface which are opposite;

a first metal line (310) covering the first surface of the viscous filling layer;

and a second metal line (410) covering the second surface of the adhesive filling layer, wherein the second metal line (410) is connected with the first metal line (310) through a first via hole (112), and the first via hole (112) is located in the first through hole (110) and penetrates through the adhesive filling layer.

2. The package substrate of claim 1, further comprising an insulating dielectric material (500), wherein the insulating dielectric material (500) covers the first metal line (310) and the second metal line (410) and fills the first via hole (112).

3. The package substrate of claim 2, wherein the insulating dielectric material (500) forms an insulating dielectric layer having opposite first and second sides, the first side of the insulating dielectric layer being provided with a third metal line (610), the third metal line (610) being connected to the first metal line (310) through a second via (611).

4. The package substrate of claim 3, wherein a fourth metal line (710) is disposed on the second surface of the insulating dielectric layer, and the fourth metal line (710) is connected to the second metal line (410) through a third via hole (711).

5. The package substrate according to any one of claims 1 to 4, wherein the metal substrate (100) is a copper substrate, an aluminum substrate, or an iron substrate.

6. The package substrate according to any of claims 1 to 4, wherein the viscous filling material (200) is a PP resin material or a photosensitive PID material.

7. An integrated module comprising the package substrate of any one of claims 1 to 6.

8. An electronic device comprising the integrated module of claim 7.

Images