TWI578873B - Manufacturing method of high-density multilayer board - Google Patents

Description

Method for manufacturing high-density layered multilayer board

The present invention relates to a method of manufacturing a multilayer board, and more particularly to a method of manufacturing a high density layered multilayer board.

Printed circuit boards are one of the indispensable components of many electronic products (such as smart phones). Their function is to provide electronic signal transmission between different electronic components; along with printed circuit boards (PCBs) and electronics. Advances in component fabrication technology, the design of printed circuit boards and electronic components have also moved toward small dimensions to meet the current miniaturization of electronic products. However, while the volume or thickness of the printed circuit board is reduced, the attendant disadvantage is that the wiring area available on the printed circuit board is relatively reduced, and the layout design of the multilayer printed circuit board is correspondingly proposed so as not to increase the printing. Increase the area of the wiring under the premise of the board size.

In order to reduce the size or thickness of printed circuit boards, high density interconnection (HDI) technology is currently used in the industry in order to form denser line connections with the same or smaller volume or thickness. HDI technology mainly achieves high density of lines through laser micro-drilling blind holes, thin line widths and high-performance thin materials, thereby greatly improving the connection function per unit area. In addition, the design of any layer of high-density interconnector (any layer HDI) includes a micro-blind hole structure with a plated and filled-hole stack, so that more complicated interlayer interconnection can be achieved.

In general, HDI technology uses only a single core substrate. The build-up method is used to continuously add layers from one side or both sides of the core board, each of which involves pressing the prepreg and copper foil, laser drilling, hole metallization and wiring. The process (exposure, development, etching, etc.) is performed, and the foregoing steps are repeated several times in accordance with the required number of layers to complete the multilayer printed circuit board. Because of the high precision of HDI technology, it is necessary to avoid bending deformation of the board surface in all processes, and to ensure that the positional variation of the interlayer electrical connection structure such as buried holes and blind holes is within a controllable range. In other words, if the deformation of the board surface is too serious during the pressing process, the finished product will not be able to meet the required requirements and be scrapped, resulting in waste of cost.

In view of the absence of the prior art, the main object of the present invention is to provide a method for manufacturing a high-density multi-layered multi-layer board, which can break through the limitations in the conventional process (for example, the number of layers of the multi-layer board is limited by the process), and Multi-layer boards of technical layers (such as multi-layer boards with a single number of layers) can be made because of the large process margin.

According to a preferred embodiment of the present invention, the method for manufacturing the high-density multi-layered multi-layer board comprises the steps of: bonding a first core board to a second core board, wherein the outer side of the first core board Having a first core circuit layer, the outer side of the second core board has a second core circuit layer; according to the required number of layers, the layering process is simultaneously performed on the outer side of the first core board and the second core board, Forming at least one lined first buildup structure on the first core circuit layer, and forming at least one lined on the second core circuit layer in the same number as the at least one lined first buildup structure a second build-up structure; and separating the first core plate that is bonded together from the second core plate.

Further, in the step of bonding the first core board and the second core board, the first core board and the second core board are bonded together by a glue layer.

Further, in the step of performing the build-up process on the outer side of the first core board and the second core board, the method further includes: the first increase in the outermost line A first build-up structure is formed on the layer structure, and a second build-up structure is formed on the outermost routed second build-up structure.

Further, after the step of separating the first core board and the second core board that are bonded together, the method further includes the following steps: simultaneously linearizing the first build-up structure and the first core board to Obtaining a first multi-layer board; and performing a build-up process on both sides of the first multi-layer board in accordance with the required number of layers.

Further, after the step of performing the build-up process on both sides of the first multi-layer board, the method further includes the step of simultaneously linearizing the second build-up structure and the second core board to obtain a a second multilayer board; and a build-up process on both sides of the second multilayer board in accordance with the desired number of layers.

Further, after the step of performing the build-up process on both sides of the second multi-layered board, the method further comprises the steps of: forming a first increase on the outer side and the inner side of the first multi-layered board after the layering a layer structure; a second build-up structure is formed on the outer side and the inner side of the second multi-layer board after the layering; and the first multi-layer board after the layering and the second multi-layer board after the layering And bonding, wherein the first build-up structure on the inner side of the layered first multilayer board is connected to the second build-up structure on the inner side of the second layer board after the build-up.

Further, after the step of bonding the layered first multi-layer board to the layered second multi-layer board, the method further comprises the step of: simultaneously adding the layered first multi-layer board The first build-up structure on the outer side and the second build-up structure on the outer side of the second multi-layer board after the layering are lined; and the first build-up structure and the line are simultaneously lined according to the required number of layers The outer side of the second build-up structure is subjected to a build-up process.

Further, after the step of performing the build-up process on the outer side of the lined first build-up structure and the routed second build-up structure, the method further includes the step of: arranging the outermost line Forming a first build-up structure on a build-up structure, and simultaneously forming a second build-up structure on the outermost routed second build-up structure; adding the first multilayer board after the build-up Separating the second multilayer board after the layer; and two first increase of the outer side and the inner side of the first multilayer board after the layering The layer structure is lined to obtain a first high-density layered multi-layer board, and at the same time, the two outer layer structures of the outer layer and the inner side of the layered second multi-layer board are lined to obtain a first Two high-density layered multi-layer boards.

Further, after the step of obtaining the first high-density multi-layered multi-layer board and the second high-density multi-layer multi-layer board, the method further comprises: simultaneously, according to the required number of layers, simultaneously on the first high-density layer-added multi-layer board The build-up process is carried out on both sides.

Further, after the step of performing the build-up process on both sides of the first high-density multi-layered board, the method further comprises: simultaneously, according to the required number of layers, on both sides of the second high-density multi-layered board Carry out the layering process.

The invention has at least the following beneficial effects: the manufacturing method of the high-density multi-layered multi-layer board provided by the embodiment of the invention can break through the traditional process “only use a single core board, and form a line on one side or both sides of the core board The limitation of the build-up structure can effectively avoid the problem that the bottom end of the blind hole is broken down and the plate surface is bent and deformed, thereby improving the wiring density and reliability of the printed circuit board.

The detailed description of the present invention and the accompanying drawings are to be understood by the claims The scope is subject to any restrictions.

1‧‧‧First high-density multi-layer laminate

10‧‧‧First Multilayer Board

11‧‧‧First core board

111‧‧‧First core insulation

112‧‧‧First core conductive layer

2‧‧‧Second high-density multi-layer laminate

20‧‧‧Second multilayer board

21‧‧‧Second core board

211‧‧‧Second core insulation

212‧‧‧Second core conductive layer

112a‧‧‧First core circuit layer

113‧‧‧First conductive structure

12‧‧‧Lined first build-up structure

120‧‧‧First buildup structure

121‧‧‧First buildup insulation

122‧‧‧First conductive structure

123‧‧‧First build-up conductive layer

123a‧‧‧First build-up circuit layer

212a‧‧‧Second core circuit layer

213‧‧‧Second conductive structure

22‧‧‧Linear second build-up structure

220‧‧‧Second layered structure

221‧‧‧Second build-up insulation

222‧‧‧Second conductive structure

223‧‧‧Second build-up conductive layer

223a‧‧‧Second layered circuit layer

S101~S104‧‧‧Steps

S201~S207‧‧‧Steps

1 is a schematic flow chart showing a method of manufacturing a high-density build-up multilayer board according to a first embodiment of the present invention.

2 to 7 are schematic views showing the process of manufacturing a high-density build-up multilayer board according to a first embodiment of the present invention.

Fig. 8 is a flow chart showing a method of manufacturing a high-density build-up multilayer board according to a second embodiment of the present invention.

9 to 11 are schematic views showing the process of manufacturing a high-density build-up multilayer board according to a second embodiment of the present invention.

The disclosure of the present invention mainly relates to an innovative manufacturing method of an arbitrary layer HDI multilayer printed circuit board, which is different from the conventional method in that only a single core board is used, and a line-up layered structure is formed on one side or both sides of the core board. The innovative method is to "separate the two core plates first, and then carry out the layering process on the outer side of the two core plates according to the required number of layers" and "separate the two core plates that are attached together first, and then according to the The number of layers is required, and the process of layering is performed on both sides of one core board, and the process of adding layers on both sides of the core board is simultaneously performed, because a single core board or a multi-layer board including two core boards When the processes such as layering or pressing are performed, the forces applied to both sides of the multilayer board are balanced with each other, so that the problem of bending deformation of the board surface can be effectively avoided.

In addition, this innovative method is designed through the above process, and any layer can be formed by using Modified Semi Additive Process (MSAP) to improve the line level. Furthermore, due to the combination of the two core boards The timing of the separation and the timing can be adjusted according to the line level, so this innovative method can have a wide process margin.

Various illustrative embodiments are described more fully hereinafter with reference to the accompanying drawings. However, the inventive concept may be embodied in many different forms and should not be construed as being limited to the illustrative embodiments set forth herein. Rather, these exemplary embodiments are provided so that this invention will be in the In the drawings, the size and relative sizes of layers and regions may be exaggerated for clarity. Similar numbers always indicate similar components.

It will be understood that, although the terms first, second, third, etc. may be used herein to describe various elements or signals and the like, such elements or signals are not limited by the terms. These terms are used to distinguish one element from another, or a signal and another. In addition, as used herein, the term "or" may include all combinations of any one or more of the associated listed items.

[First Embodiment]

1 is a schematic flow chart of a method for manufacturing a high-density build-up multilayer board according to a first embodiment of the present invention. As shown in the figure, the manufacturing method of the high-density multi-layered multi-layer board comprises: step S101, bonding the first core board and the second core board; and step S102, simultaneously on the outer side of the first core board and the second core board; Performing a layering process; step S103, separating the first core plate and the second core plate that are bonded together; and step S104, simultaneously performing a layering process on both sides of the first core plate to obtain the first multilayer board And at the same time, a build-up process is performed on both sides of the second core board to obtain a second multi-layer board.

In the step S101, as shown in FIG. 2 and FIG. 3, the main body of the first core board 11 is a first core insulating layer 111, and each of the outer and inner sides has a first core conductive layer 112, and the main body of the second core board 21 The second core insulating layer 211 has a second core conductive layer 212 on the outer side and the inner side. In practice, the first core board 11 can be temporarily combined with the second core board 21 through a glue layer (not shown). For example, the first and second core boards 11 and 21 can be directly attached to the glue by hot pressing. On the opposite surfaces of the layer, the invention is not limited thereto; thereafter, the outer first and second core conductive layers 112, 212 may be patterned by exposure, lithography, etching, etc., that is, the circuit The patterns are respectively transferred to the outer sides of the first and second core boards 11, 21 to form a first core circuit layer 112a on the outer side of the first core board 11, and a second core line on the outer side of the second core board 21. Layer 212a.

In this embodiment, the material of the first and second core insulating layers 111, 21 may be a metal laminated core layer (such as a resin laminated copper foil), wherein the materials of the first and second core insulating layers 111, 211 may be Polypropylene (PP), epoxy resin, polyimide, etc., the first and second core conductive layers 112, 212 may be made of gold, silver, copper, aluminum, etc. The invention is not limited thereto.

In step S102, as shown in FIG. 4, the layer-adding process may be performed on both sides of the stacked structure including the first and second core plates 11, 21 in accordance with the required number of layers. Forming at least one lined first buildup structure 12 on the first core circuit layer 112a, and forming at least one lined second buildup structure 22 on the second core circuit layer 212a, wherein the first increase of the line The layer structure 12 has the same number of layers as the lined second build-up structure 22, that is, both sides of the first and second core sheets 11, 21 which are bonded together have a symmetrical wiring structure. It should be noted that although FIG. 4 only shows the laminated structure after performing one build-up process, step S102 does not limit the process of only one build-up process.

Furthermore, the lined first and second build-up structures 12, 22 can be fabricated by first forming a first build-up insulating layer 121 on the first core circuit layer 112a, and simultaneously at the second A second build-up insulating layer 221 is formed on the core circuit layer 212a. The first and second build-up insulating layers 221 may be organic materials. Then, the first core circuit layer 112a is formed in the first build-up insulating layer 121. The first conductive structure 122 is electrically connected, and the second conductive structure 222 electrically connected to the second core circuit layer 212a is formed in the second build-up insulating layer 221, wherein the first and second conductive structures 122, 222 are formed. The conductive via hole or the conductive pillar may be formed. Finally, the first build-up wiring layer 123a electrically connected to the first conductive structure 122 is formed on the first build-up insulating layer 121, and formed on the second build-up insulating layer 221 The second build-up wiring layer 223a electrically connected to the second conductive structure 222, wherein the first and second build-up wiring layers 123a, 223a may be made of a metal material.

In view of the above, those skilled in the art will appreciate that the formation of the first and second build-up insulating layers 121, 221, the first and second conductive structures 122, 222 are related to the first and second build-up wiring layers 123a, 223a. The process technology, for example, the first and second build-up insulating layers 121, 221 may be formed by a press-fit manner, and the first and second conductive structures 122, 222 are formed by: first using laser drilling, chemical etching, or A plasma etching technique or the like forms openings in the first and second build-up insulating layers 121, 221 (not shown), and then deposits metal in the openings by electroless plating or electroplating, first and second increases. The layer wiring layers 123a, 223a can be formed by processes such as general exposure, lithography, etching, and the like. It can be seen that the process variation and selectivity are extremely numerous, so it is not mentioned here.

In step S103, the glue layer may be dissolved using an organic solvent to separate the first core plate 11 from the second core plate 21. It should be noted that, as shown in FIG. 4, if the first core board 11 and the second core board 21 are directly separated, two asymmetric boards of the asymmetric structure are obtained, but the asymmetric structure of the multi-layer board is disadvantageous for simultaneous Processing on both sides may cause bending deformation of the board surface. Therefore, referring to FIG. 5 and FIG. 6A, in step S102, a first build-up structure 120 is further formed on the outermost lined first build-up structure 12, and simultaneously on the outermost line. A second build-up structure 220 is formed on the second build-up structure 22, wherein the first build-up structure 120 does not include a conductive structure and a line pattern, and includes only a first build-up insulating layer 121 and a first build-up insulating layer. The first build-up conductive layer 123 of the 121, the second build-up structure 220 also does not include the conductive structure and the wiring pattern, and includes only a second build-up insulating layer 221 and a second build-up layer covering the second build-up insulating layer 221 Conductive layer 223.

As shown in FIG. 6A and FIG. 6B, after the first core board 11 and the second core board 21 are separated (step S103), the first build-up structure 120 and the first core insulating layer 111 can be simultaneously The stacked structure composed of the first core conductive layer 112 is lined to obtain the first multi-layered board 10 of the symmetrical structure, and simultaneously the second build-up structure 220 and the second core insulating layer 211 and the second core conductive layer The laminate structure of 212 is routed to obtain a second multilayer board 20 of a symmetrical structure. As shown in FIG. 6B, the first and second multilayer boards 10, 20 may be four-layer boards, but are not limited thereto.

The term "lined" as used herein refers to simultaneously forming the first conductive structures 113, 122 in the first core insulating layer 111 and the first build-up insulating layer 121, and simultaneously bonding the first core conductive layer 112 and The first build-up conductive layer 123 is patterned, the first core conductive layer 112 is formed into the first core wiring layer 112a by the transfer line pattern, and the first build-up conductive layer 123 is formed into the first build-up wiring layer 123a. The first core circuit layer 112a, the first build-up circuit layer 123a and the first conductive structures 113, 122 are electrically connected to each other; and the second core insulating layer 211 and the second build-up insulating layer 221 are formed simultaneously. After the two conductive structures 213 and 222, the second core conductive layer 212 and the second build-up conductive layer 223 are simultaneously patterned to transfer the line pattern to make the second The core conductive layer 212 is formed into the second core circuit layer 212a, and the second build-up conductive layer 223 is formed into the second build-up circuit layer 223a, wherein the second core circuit layer 212a, the second build-up circuit layer 223a and the second The conductive structures 213, 222 are electrically connected to each other.

It should be noted that, as shown in FIG. 7, since the layers of the first and second multilayer boards 10, 20 are symmetrical, they can be further increased on both sides of the first multilayer board 10 according to the required number of layers. a layer process for forming at least one lined first build-up structure 12 on the first core circuit layer 112a and the first build-up line layer 123a, and simultaneously performing a build-up process on both sides of the second multilayer board 20 At least one lined second build-up structure 22 is formed on the second core circuit layer 212a and the second build-up circuit layer 223a, respectively. As shown in FIG. 7, the first and second multilayer boards 10, 20 after the layering may be a six-layer board, but are not limited thereto.

[Second embodiment]

FIG. 8 is a schematic flow chart of a method for manufacturing a high-density build-up multilayer board according to a second embodiment of the present invention. As shown in the figure, the manufacturing method of the high-density multi-layered multi-layer board includes: step S201, bonding the first core board and the second core board; and step S202, simultaneously on the outer side of the first core board and the second core board Performing a layering process; in step S203, separating the first core plate and the second core plate that are bonded together; and in step S204, simultaneously performing a build-up process on both sides of the first core plate to obtain the first multilayer board. And simultaneously performing a build-up process on both sides of the second core board to obtain a second multi-layer board; in step S205, the first multi-layer board is bonded to the second multi-layer board; in step S206, simultaneously on the first multi-layer The outer side of the board and the second multi-layer board is subjected to a build-up process; and in step S207, the first multi-layer board which is bonded together is separated from the second multi-layer board.

It should be noted that the relevant details of the steps S201 to S204 of the manufacturing method of the high-density multi-layered multi-layer board provided in this embodiment are substantially the same as the steps of the manufacturing method of the high-density multi-layered multi-layer board provided in the previous embodiment. S101~S104, there will be no more details here. The main difference between the two is: according to the required line level, this embodiment The manufacturing method of the high-density layered multi-layer board is provided, after the first multi-layer board 10 and the second multi-layer board 20 are completed, the two are further temporarily combined, and simultaneously from the first and second multi-layer boards 10 The two sides of the 20-layered laminated structure are layered outwardly, and are separated after being added to a certain number of layers.

Specifically, in step S205, as shown in FIG. 9, the first multilayer board 10 can also be temporarily combined with the second multilayer board 20 through a glue layer (not shown); similarly, in order to make the first and the first The layers of the two multi-layer boards 10, 20 are symmetrical, and are beneficial for subsequent processing on both sides. The outer side and the inner side of the first multi-layer board 10 are respectively formed with a first build-up structure 120, and the second multi-layer board 20 The outer side and the inner side are also respectively formed with a second build-up structure 220, wherein the first and second build-up structures 120, 220 do not include a conductive structure and a line pattern. For the manner of making the first and second build-up structures 120, 220 and other related details, reference may be made to the content of the previous embodiment, and no further details are provided herein.

In step S206, as shown in FIG. 10, after the first and second multi-layer boards 10, 20 are bonded together, the outer first layer-adding structure 120 and the outer second layer-up structure 220 must be lined together. Thereafter, the layers can be layered on both sides of the laminated structure composed of the first and second multilayer sheets 10, 20 in accordance with the desired number of layers. As shown in FIGS. 9 and 10, the number of layers of the laminated structure is increased from sixteen layers to eighteen layers, but is not limited thereto.

In step S207, referring to FIG. 11, in consideration of the subsequent double-sided processing demand for the first multilayer board 10 or the second multilayer board 20, it is necessary to be in the outermost line before the two are separated. A first build-up structure 120 is further formed on a build-up structure 12, and a second build-up structure 220 is further formed on the outermost routed second build-up structure 22 to make the layer of the laminated structure The number is increased from eighteen to twenty, but is not limited to this. Thereafter, the first build-up structure 120 on both sides of the first multilayer board 10 is simultaneously lined to obtain a first high-density build-up multilayer board 1 and simultaneously located on both sides of the second multi-layer board 20. The second build-up structure 220 is lined to obtain a second high-density build-up multilayer board 2; as shown in FIG. 11, the first and second high-density build-up multilayer boards 1 and 2 have ten layers. , but not limited to this.

It should be noted that the manufacture of the high-density build-up multilayer board provided by the embodiment After the first multi-layer board 10 and the second multi-layer board 20 are completed, the layering process can be further performed on both sides of the first high-density layer-up multi-layer board 1 as needed, and at the same time in the second high-density layer-adding layer. The both sides of the multilayer board 2 are subjected to a build-up process so that the number of layers of the first and second high-density build-up multilayer boards 1, 2 is accumulated to more than ten layers.

[Possible effects of the examples]

In summary, the manufacturing method of the high-density multi-layered multi-layer board provided by the embodiment of the present invention can break through the traditional process “only a single core board is used, and a line-up layered structure is formed on one side or both sides of the core board. The limitation of the method can effectively avoid the problem that the bottom end of the blind hole is broken down and the plate surface is bent and deformed, thereby improving the wiring density and reliability of the printed circuit board.

Furthermore, by using the manufacturing method of the high-density layered multi-layer board, a multi-layer board of a technical layer (for example, a multi-layer board having a single number of layers) can be produced, and a modified semi-additive method can be used for any layer ( The Modified Semi Additive Process (MSAP) is formed so that the line level can be improved.

According to the above, the timing of combining and separating the two core boards or the two multi-layer boards can be adjusted according to the line level, so that the manufacturing method of the high-density layer-added multi-layer board has a wide process margin.

The above is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention. Therefore, equivalent technical changes made by the present invention and the contents of the drawings are included in the scope of the present invention.

S101~S104‧‧‧Steps

Claims (10)

A method for manufacturing a high-density multi-layered multi-layer board includes the steps of: bonding a first core board to a second core board, wherein the outer side of the first core board has a first core circuit layer, and the second core The outer side of the board has a second core circuit layer; and an additional layering process is performed on the outer side of the first core board and the second core board according to the required number of layers to form at least one line on the first core circuit layer a first build-up structure, and forming at least one lined second build-up structure having the same number of at least one lined first build-up structure on the second core circuit layer; and bonding together The first core board is separated from the second core board. The manufacturing method of the high-density multi-layered multi-layer board according to claim 1, wherein in the step of bonding the first core board and the second core board, the first core board and the second core board are borrowed They are bonded together by a glue layer. The method for manufacturing a high-density layered multi-layer board according to claim 1, wherein in the step of performing a build-up process on the outer side of the first core board and the second core board, the method further comprises: an outermost line The first build-up structure forms a first build-up structure, and a second build-up structure is formed on the outermost routed second build-up structure. The manufacturing method of the high-density multi-layered multi-layer board according to claim 3, wherein after the step of separating the first core board and the second core board which are bonded together, the method further comprises the step of: simultaneously A build-up structure and the first core board are lined to obtain a first multi-layer board; and a build-up process is performed on both sides of the first multi-layer board according to the required number of layers. The method for manufacturing a high-density build-up multilayer board according to claim 4, wherein after the step of performing a build-up process on both sides of the first multilayer board, the method further comprises the steps of: Simultaneously, the second build-up structure and the second core plate are lined to obtain a second multi-layer board; and the layer-adding process is simultaneously performed on both sides of the second multi-layer board according to the required number of layers. The method for manufacturing a high-density build-up multilayer board according to claim 5, wherein after the step of performing a build-up process on both sides of the second multilayer board, the method further comprises the step of: adding the layer after the layering Forming a first build-up structure on the outer side and the inner side of the multi-layer board; forming a second build-up structure on the outer side and the inner side of the second multi-layer board after the layering; and the first layer after the layer is added The multi-layer board is adhered to the second multi-layer board after the layering, wherein the first layer-adding structure inside the layered first multi-layer board and the inner side of the second layer board after the layering The second build-up structure is connected. The method for manufacturing a high-density multi-layered multi-layer board according to claim 6, wherein after the step of bonding the layered first multi-layer board to the layered second multi-layer board, the following includes the following Step: simultaneously linearizing the first build-up structure on the outer side of the first multilayer board after the layering and the second build-up structure on the outer side of the second layer board after the layering; and according to the required number of layers At the same time, a layering process is performed on the outer side of the lined first buildup structure and the lined second buildup structure. The method of manufacturing a high-density build-up multilayer board according to claim 7, wherein after the step of performing a build-up process on the outer side of the first build-up structure and the line-up of the second build-up structure The method further includes the steps of: forming a first build-up structure on the outermost routed first build-up structure, and simultaneously forming a second build-up structure on the outermost routed second build-up structure; Separating the layered first multi-layer board from the layered second multi-layer board; and two of the first build-up structures on the outer side and the inner side of the layered first multi-layer board Aligning to obtain a first high-density layered multi-layer board, and simultaneously aligning the two outer layer structures of the outer layer and the inner side of the layered second multi-layer board to obtain a second high Density-added multilayer boards. The method for manufacturing a high-density build-up multilayer board according to claim 8, wherein after the step of obtaining the first high-density build-up multilayer board and the second high-density build-up multi-layer board, the method further comprises: according to the desired layer And, at the same time, a build-up process is performed on both sides of the first high-density build-up multilayer board. The method for manufacturing a high-density multi-layered multi-layer board according to claim 9, wherein after the step of performing a build-up process on both sides of the first high-density multi-layered board, the method further comprises: according to the required number of layers, At the same time, a build-up process is performed on both sides of the second high-density build-up multilayer board.